CN112886266A

CN112886266A - Scattering film and electronic equipment

Info

Publication number: CN112886266A
Application number: CN201911200914.1A
Authority: CN
Inventors: 苏陟; 高强
Original assignee: Guangzhou Fangbang Electronics Co Ltd
Current assignee: Guangzhou Fangbang Electronics Co Ltd
Priority date: 2019-11-29
Filing date: 2019-11-29
Publication date: 2021-06-01

Abstract

The invention discloses a scattering film and electronic equipment, wherein the scattering film comprises a conductive layer and a divergence layer, a plurality of first through holes penetrating through the conductive layer are formed in the conductive layer, and the aperture of each first through hole is smaller than the wavelength of electromagnetic waves, so that the electromagnetic waves are diffracted after passing through the first through holes, and the space range of electromagnetic wave emission is enlarged; the conductive layer is provided with a divergent layer, the divergent layer at least comprises a structure which can transmit electromagnetic waves, and the divergent layer further diverges the electromagnetic waves which penetrate through the conductive layer, so that the space range of the electromagnetic wave emission is further enlarged; thereby realizing the function of diverging the electromagnetic wave, avoiding the communication blind area as far as possible.

Description

Scattering film and electronic equipment

Technical Field

The invention relates to the technical field of communication equipment, in particular to a scattering film and electronic equipment.

Background

Electromagnetic wave communication is communication using electromagnetic waves having a wavelength between 0.1 mm and 1 m. The frequency range corresponding to the electromagnetic wave of the wavelength band is 300MHz (0.3GHz) -3 THz. Unlike the transmission method of modern communication networks such as coaxial cable communication, optical fiber communication, and satellite communication, electromagnetic wave communication is communication using electromagnetic waves as a medium directly, does not require a solid medium, and can use electromagnetic wave transmission when there is no obstacle in a straight-line distance between two points.

Electromagnetic wave communication has directionality due to the characteristic of linear transmission of electromagnetic waves, and when a user is not in the specified directional area, signals cannot be received, thereby causing a communication blind area.

Disclosure of Invention

An object of the present invention is to provide a scattering film through which electromagnetic waves can be scattered, thereby increasing the spatial range of the emitted electromagnetic waves and avoiding communication blind areas as much as possible.

Another object of an embodiment of the present invention is to provide an electronic device having a wide range of electromagnetic wave signal emission.

In a first aspect, an embodiment of the present invention provides a scattering film, including:

the conductive layer is provided with a first through hole penetrating through the conductive layer, the first through hole can be used for passing electromagnetic waves, and the aperture of the first through hole is smaller than the wavelength of the electromagnetic waves;

and the divergent layer is arranged on the first surface of the conductive layer and at least comprises a structure which can transmit the electromagnetic wave.

Optionally, the divergent layer includes a substrate, a plurality of second through holes penetrating through the substrate are formed in the substrate, the second through holes are capable of allowing electromagnetic waves to pass through, and the aperture of each second through hole is smaller than the wavelength of the electromagnetic waves.

Optionally, the number and/or the aperture of the second through holes in at least one preset direction is in a trend of continuous change, and the preset direction is any direction in the surface of the divergent layer.

Optionally, each first through hole corresponds to one second through hole, and the first through hole and the second through hole corresponding to the first through hole at least partially overlap in a direction perpendicular to the conductive layer.

Optionally, the plurality of second through holes are arranged in an array, and the aperture of the second through hole along the preset direction shows a variation trend of large middle, small two sides, or small middle, and large two sides, or,

the plurality of second through holes are arranged in an array, and the aperture of the second through holes is in a continuously increasing or continuously decreasing change trend along the preset direction.

Optionally, the plurality of second through holes are arranged in an array, and the number of the second through holes along the preset direction shows a variation trend of more middle, less two sides, or less middle, more two sides, or,

the plurality of second through holes are arranged in an array, and the number of the second through holes in the preset direction shows a continuously increasing or continuously decreasing change trend.

Optionally, the second through hole is filled with a dielectric material capable of transmitting electromagnetic waves.

Optionally, the refractive index of the dielectric material to the incident electromagnetic wave along the preset direction shows a trend of small middle and large two sides.

Optionally, the diverging layer includes a base material, a plurality of second through holes penetrating through the base material are formed in the base material, a dielectric material capable of transmitting electromagnetic waves is filled in the second through holes, a refractive index of the incident electromagnetic waves by the dielectric material in at least one preset direction shows a variation trend of a small middle and large two sides, and the preset direction is any direction in the surface of the diverging layer.

Optionally, the scattering film further includes a first protruding structure, the first protruding structure is disposed on a side of the divergent layer away from the conductive layer, and the electromagnetic wave is reflected when passing through the first protruding structure.

Optionally, the first protrusion structure includes a plurality of protrusions, and a distance between adjacent protrusions is smaller than a wavelength of the electromagnetic wave.

Optionally, the scattering film further includes a protective layer, the protective layer is disposed on a side of the divergent layer away from the conductive layer, and the first protrusion structure extends into the protective layer.

Optionally, the scattering film further includes a connection layer disposed on a second surface of the conductive layer, where the second surface is a surface opposite to the first surface.

Optionally, the scattering film further includes a second protruding structure, the second protruding structure is disposed on the second surface of the conductive layer, and the second protruding structure extends into the connection layer.

In a second aspect, an embodiment of the present invention further provides an electronic device, where the electronic device includes the scattering film provided in the first aspect of the present invention, and further includes an antenna device, and one surface of the antenna device is connected to the scattering film.

According to the scattering film provided by the embodiment of the invention, the conductive layer is provided with the plurality of first through holes penetrating through the conductive layer, and the aperture of each first through hole is smaller than the wavelength of electromagnetic waves, so that the electromagnetic waves are diffracted after passing through the first through holes, and the space range of electromagnetic wave emission is enlarged; the conductive layer is provided with a divergent layer, the divergent layer at least comprises a structure which can transmit electromagnetic waves, and the divergent layer further diverges the electromagnetic waves which penetrate through the conductive layer, so that the space range of the electromagnetic wave emission is further enlarged; thereby realizing the function of diverging the electromagnetic wave, avoiding the communication blind area as far as possible.

Drawings

The invention is explained in more detail below with reference to the figures and examples.

Fig. 1 is a cross-sectional view of a diffuser film according to an embodiment of the present invention;

FIG. 2 is a cross-sectional view of another diffuser film provided in accordance with an embodiment of the present invention;

FIG. 3 is a cross-sectional view of another diffuser film provided in accordance with embodiments of the present invention;

FIG. 4 is a cross-sectional view of another diffuser film provided in accordance with embodiments of the present invention;

FIG. 5 is a top view of a diffuser film according to an embodiment of the present invention;

FIG. 6 is a top view of another diffuser film provided in accordance with embodiments of the present invention;

FIG. 7 is a top view of another diffuser film provided in accordance with embodiments of the present invention;

FIG. 8 is a top view of another diffuser film provided in accordance with embodiments of the present invention;

FIG. 9 is a top view of another diffuser film provided in accordance with embodiments of the present invention;

FIG. 10 is a cross-sectional view of another diffuser film provided in accordance with embodiments of the present invention;

FIG. 11 is a cross-sectional view of another diffuser film provided in accordance with embodiments of the present invention;

fig. 12 is a cross-sectional view of an electronic device provided in an embodiment of the invention;

fig. 13 is a cross-sectional view of another electronic device provided in accordance with an embodiment of the present invention;

fig. 14 is a cross-sectional view of another electronic device provided by an embodiment of the invention;

fig. 15 is a cross-sectional view of another electronic device provided in an embodiment of the invention.

Description of the drawings:

110. a conductive layer; 120. a divergent layer; 111. a first through hole; 121. a second through hole; 122. a dielectric material; 130. a protective layer; 140. a first bump structure; 141. a convex portion; 150. a connecting layer; 160. a second bump structure; 10. a scattering film; 20. an antenna device; 21. an antenna line; 22. a substrate.

Detailed Description

In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The embodiment of the invention provides a scattering film, which comprises a conducting layer and a divergence layer;

the conducting layer is provided with a first through hole penetrating through the conducting layer, and the conducting layer is made of any one metal material or two or more alloy materials of copper, aluminum, titanium, zinc, iron, nickel, chromium, cobalt, silver or gold. The first through hole can be used for passing electromagnetic waves, and the aperture of the first through hole is smaller than the wavelength of the electromagnetic waves, so that the electromagnetic waves are diffracted after passing through the first through hole, and the space range of the electromagnetic wave emission is enlarged.

The diffusion layer is arranged on the first surface of the conducting layer and comprises a base material, and the diffusion layer at least comprises a structure capable of transmitting electromagnetic waves. The electromagnetic wave penetrating through the conducting layer is further diffused through the diffusing layer, so that the space range of the electromagnetic wave emission is further enlarged; thereby realizing the function of diverging the electromagnetic wave, avoiding the communication blind area as far as possible.

Exemplarily, the divergent layer comprises a substrate, wherein a plurality of second through holes penetrating through the substrate are formed in the substrate, the second through holes are used for allowing electromagnetic waves to pass through, and the aperture of each second through hole is smaller than the wavelength of the electromagnetic waves, so that the electromagnetic waves are diffracted after passing through the second through holes, and the emission space range of the electromagnetic waves is further enlarged.

Illustratively, the number and/or the aperture of the second through holes in at least one preset direction is in a continuously changing trend, and the preset direction is any direction in the surface of the divergent layer. By the arrangement, disorder of diffraction of the electromagnetic wave on the divergent layer can be strengthened, and the emission space range of the electromagnetic wave is further enlarged.

In order to enable those skilled in the art to better understand the technical solution of the present invention, the mask assembly provided in this embodiment is specifically described below with reference to the specific drawings:

fig. 1 is a cross-sectional view of a scattering film according to an embodiment of the present invention, and fig. 2 is a cross-sectional view of another scattering film according to an embodiment of the present invention, which includes a conductive layer 110 and a divergence layer 120, as shown in fig. 1 and 2.

The conductive layer 110 may be made of copper, and the conductive layer 110 is formed with a plurality of first through holes 111 penetrating the conductive layer 110 for passing electromagnetic waves. The aperture of each first through hole 111 is smaller than the wavelength of the electromagnetic wave, so that the electromagnetic wave is incident to the first through hole 111 and then is diffracted, the propagation path of the electromagnetic wave which is originally transmitted only in a directional manner is changed, propagation paths in multiple directions are generated through diffraction, and the emission space range of the electromagnetic wave is expanded.

The divergent layer 120 covers the first surface of the conductive layer 110, the divergent layer 120 includes a substrate, and a plurality of second through holes 121 penetrating through the substrate are formed in the substrate for passing electromagnetic waves. The aperture of each second through hole 121 is smaller than the wavelength of the electromagnetic wave, so that the electromagnetic wave is incident to the second through hole 121 and then is diffracted, and the spatial range of the electromagnetic wave emission is further expanded. The substrate may be made of a metal material having a shielding effect against electromagnetic waves or an organic material through which electromagnetic waves can penetrate. For example, fig. 1 and 2 illustrate an example in which the base material is a metal material. In order to enable the electromagnetic wave signal passing through the conductive layer 110 to pass through the diverging layer 120 of the metal substrate, it is necessary to provide a second through hole 121 corresponding to each first through hole 111, and the first through hole 111 and the second through hole 121 corresponding to the first through hole 111 at least partially overlap in a direction (Z direction) perpendicular to the conductive layer 110. For example, as shown in fig. 1, the embodiment of the present invention is described by taking an example in which the cross-sectional shapes of the first through-hole 111 and the second through-hole 121 are circular and the diameters of the circular shapes cut by an arbitrary section perpendicular to the Z-direction are the same, that is, the first through-hole 111 and the second through-hole 121 are cylindrical through-holes, and the first through-hole 111 and the second through-hole 121 have the same diameter and are completely overlapped in the Z-direction.

The base material of the diffusion layer may be a material through which electromagnetic waves can penetrate, for example, the base material may be an organic material such as polyethyleneimine or epoxy, in which case, the first through hole and the second through hole may not overlap in the Z direction. Fig. 3 is a cross-sectional view of another scattering film provided in an embodiment of the present invention, and fig. 4 is a cross-sectional view of another scattering film provided in an embodiment of the present invention, which includes a conductive layer 110 and a divergence layer 120, as shown in fig. 3 and 4. The conductive layer 110 is formed with a first via 111 penetrating the conductive layer 110, and the conductive layer 110 may be made of copper. The aperture of the first through hole 111 is smaller than the wavelength of the electromagnetic wave, so that the electromagnetic wave is diffracted after passing through the first through hole 111, the movement path of the electromagnetic wave which is originally transmitted only in a directional manner is changed, transmission paths in multiple directions are generated through diffraction, and the emission space range of the electromagnetic wave is expanded.

The divergent layer 120 covers the first surface of the conductive layer 110, the divergent layer 120 includes a substrate, and a plurality of second through holes 121 penetrating through the substrate are formed in the substrate. The aperture of each second through hole 121 is smaller than the wavelength of the electromagnetic wave, so that the electromagnetic wave is incident to the second through hole 121 and then is diffracted, and the spatial range of the electromagnetic wave emission is further expanded. The substrate may be made of organic material such as polyethyleneimine or epoxy resin that can penetrate electromagnetic waves, and since the substrate is made of material that can penetrate electromagnetic waves, the first through hole 111 and the second through hole 121 may not overlap in the Z direction. Illustratively, as shown in fig. 3 and 4, the cross-sectional shapes of the first through hole 111 and the second through hole 121 are circular, and the diameters of the circular shapes cut by any cross section perpendicular to the Z direction are the same, i.e., the first through hole 111 and the second through hole 121 are cylindrical through holes.

Fig. 5 is a top view of a scattering film according to an embodiment of the present invention, as shown in fig. 5, a plurality of through holes 121 penetrating through the scattering layer 120 are formed in the scattering layer 120, and a plurality of second through holes 121 are arranged in an array. Specifically, the plurality of second through holes 121 are arranged in an array along an X direction and a Y direction of the surface of the divergent layer 120, where the X direction may be a length direction of the divergent layer 120, and the Y direction may be a width direction of the divergent layer 120. The apertures of the second through holes 121 exhibit a tendency of variation in the X direction with a large center and small sides. Illustratively, as shown in fig. 5, the cross-sectional shape of the second through-hole 121 is a circle, and the diameter of the circle cut by an arbitrary section perpendicular to the Z-direction (the direction perpendicular to the conductive layer 110) is the same, that is, the second through-hole 121 is a cylindrical through-hole, and the hole diameters of the plurality of second through-holes 121 have a tendency to change in the X-direction with a large center and small sides. The aperture of the second through hole 121 shows a trend of large in the middle and small in the two sides along the X direction, so that the disorder of the diffraction of the electromagnetic waves is enhanced, and the spatial range of the emission of the electromagnetic waves is further enlarged. In another embodiment, the apertures of the second through holes 121 may also exhibit a variation trend of small middle and large two sides along the X direction, which can also achieve the technical effect of the present invention, and the embodiments of the present invention are not described herein again.

It should be noted that, in the foregoing embodiment, the cross-sectional shapes of the first through hole and the second through hole are not limited, and the cross-sectional areas of the cut through holes may be the same or different in any cross section perpendicular to the Z direction. In some embodiments of the present invention, in order to facilitate the formation of the through holes, the cross-sectional shapes of the first through holes and the second through holes may be regular shapes such as circles, squares, and the like, and the cross-sectional areas of the through holes are the same in any cross-section perpendicular to the Z-direction. The aperture in the present embodiment refers to the maximum value among the distances of any two points on the profile of any cross section of the through-hole.

Fig. 6 is a top view of another scattering film according to an embodiment of the present invention, as shown in fig. 6, a plurality of through holes 121 penetrating through the scattering layer 120 are formed in the scattering layer 120, and a plurality of second through holes 121 are arranged in an array. Specifically, the plurality of second through holes 121 are arranged in an array along an X direction and a Y direction of the surface of the divergent layer 120, where the X direction may be a length direction of the divergent layer 120, and the Y direction may be a width direction of the divergent layer 120. For example, as shown in fig. 6, the second through hole 121 is a cylindrical through hole as an example, and the embodiment of the present invention is explained. In the positive direction of X, the pore diameters of the plurality of second through holes 121 exhibit a continuously increasing trend. The aperture of the second through hole 121 is continuously increased along the positive direction X, so that the disorder of the diffraction of the electromagnetic waves is enhanced, and the emission space range of the electromagnetic waves is further enlarged. In other embodiments of the present invention, along the positive direction of X, the apertures of the through holes 111 may also exhibit a continuously decreasing trend, which can also achieve the technical effect of the present invention, and the embodiments of the present invention are not described herein again.

Fig. 7 is a top view of another scattering film according to an embodiment of the present invention, as shown in fig. 7, a plurality of second through holes 121 penetrating through the scattering layer 120 are formed in the scattering layer 120, and the second through holes 121 are arranged in an array. Specifically, the plurality of second through holes 121 are arranged in an array along an X direction and a Y direction of the surface of the divergent layer 120, where the X direction may be a length direction of the divergent layer 120, and the Y direction may be a width direction of the divergent layer 120. For example, as shown in fig. 7, the through hole 111 is a cylindrical through hole for example, and the embodiment of the present invention is explained. The plurality of second through holes 121 have the same aperture, and the number of the second through holes 121 shows a trend of a larger middle and smaller two sides along the X direction. That is, along the X direction, the second through holes 121 in the middle are arranged more densely, and the second through holes 121 on both sides are arranged sparsely. The number of the second through holes 121 is changed along the X direction, so that the disorder of the diffraction of the electromagnetic waves is enhanced, and the emission space range of the electromagnetic waves is further enlarged. It should be noted that, in other embodiments of the present invention, along the X direction, the number of the second through holes 121 shows a variation trend with a small middle and a large number of two sides, and along the X direction, the apertures of the second through holes 121 may also be unequal, for example, show a variation trend with a large middle, small two sides, or small middle, and large two sides, or show a variation trend with a continuously increasing or continuously decreasing, which can also achieve the technical effect of the present invention, and the embodiments of the present invention are not described herein again.

It should be noted that, in the foregoing embodiment, the cross-sectional shapes of the first through hole and the second through hole are not limited, and the cross-sectional areas of the cut through holes may be the same or different at any cross section perpendicular to the Z direction. In some embodiments of the present invention, in order to facilitate the formation of the through holes, the cross-sectional shapes of the first through holes and the second through holes may be regular shapes such as circles, squares, and the like, and the cross-sectional areas of the through holes are the same in any cross-section perpendicular to the Z-direction. The aperture in the present embodiment refers to the maximum value among the distances of any two points on the profile of any cross section of the through-hole.

Fig. 8 is a top view of another scattering film according to an embodiment of the present invention, as shown in fig. 8, a plurality of second through holes 121 penetrating through the divergent layer 120 are formed in the divergent layer 120, the plurality of second through holes 121 may be arranged in an array, specifically, the plurality of second through holes 121 are arranged in an array along an X direction and a Y direction of the surface of the divergent layer 120, where the X direction may be a length direction of the divergent layer 120, and the Y direction may be a width direction of the divergent layer 120. For example, as shown in fig. 8, the second through hole 121 is a cylindrical through hole, and the embodiment of the present invention is explained. In the positive direction of X, the aperture diameters of the plurality of second through holes 121 exhibit a continuously increasing trend of change, and the number of second through holes 121 in the positive direction of X exhibits a continuously decreasing trend of change. The number of the second through holes 121 is continuously increased along the positive X direction, so that the disorder of the diffraction of the electromagnetic waves is enhanced, and the emission space range of the electromagnetic waves is further enlarged. It should be noted that, in other embodiments of the present invention, along the X direction, the number of the second through holes 121 may also exhibit a continuously increasing trend, and the aperture of the second through holes 121 may also be equal, or exhibit a trend of changing with a middle being large, two sides being small, or a middle being small, two sides being large, or exhibit a continuously decreasing trend, which can also achieve the technical effect of the present invention, and the embodiments of the present invention are not described herein again.

In some embodiments of the present invention, on the basis of the above embodiments, as shown in fig. 2 and fig. 4, the second through hole 121 is filled with a dielectric material 122 capable of transmitting electromagnetic waves. Illustratively, the second through holes can be filled with the same dielectric material or different dielectric materials.

Fig. 9 is a top view of another scattering film according to an embodiment of the present invention, as shown in fig. 9, a plurality of second through holes 121 penetrating through the scattering layer 120 are formed in the scattering layer 120, and the second through holes 121 may be arranged in an array. Specifically, the plurality of second through holes 121 are arranged in an array along an X direction and a Y direction of the surface of the divergent layer 120, where the X direction may be a length direction of the divergent layer 120, and the Y direction may be a width direction of the divergent layer 120. For example, as shown in fig. 9, the second through hole 121 is a cylindrical through hole as an example, and the embodiment of the present invention is explained. The plurality of second through holes 121 have the same hole diameter. Illustratively, the distance between any two adjacent second through holes 121 in the X direction is equal, that is, the second through holes 121 are arranged equidistantly in the X direction.

Different dielectric materials 122 are filled in the second through holes 121, and the refractive index of the dielectric materials 122 in the second through holes 121 to the electromagnetic wave tends to change in the X direction with a small middle and large sides. Illustratively, along the X direction, each second through hole 121 is filled with a different dielectric material 122, and along the X direction, the refractive index of the dielectric material 122 filled in each second through hole 121 shows a trend of change with a small middle and large two sides, so that the refractive index of the entire scattering layer 120 for the electromagnetic wave in the X direction shows a trend of change with a low middle and high two sides, thereby achieving scattering of the electromagnetic wave. Illustratively, iodine crystals, copper oxide, crystal, quartz, polystyrene, sodium chloride, glass, air, glass, sodium chloride, polystyrene, quartz, crystal, copper oxide, iodine crystals are filled in sequence along the X direction. As shown in fig. 9, the filled dielectric material 122 is shaded in the second through hole 121, and the higher the shading density is, the higher the refractive index of the dielectric material 122 is.

It should be noted that, in the foregoing embodiment, the cross-sectional shapes of the first through hole and the second through hole are not limited, and the cross-sectional areas of the cut through holes of any cross section perpendicular to the Z direction may be the same or different. In some embodiments of the present invention, in order to facilitate the formation of the through holes, the cross-sectional shapes of the first through holes and the second through holes may be regular shapes such as circles, squares, and the like, and the cross-sectional areas of the through holes are the same in any cross-section perpendicular to the Z-direction. The aperture in the present embodiment refers to the maximum value among the distances of any two points on the profile of any cross section of the through-hole.

In the above embodiment, the technical solution of the present invention is described by taking as an example that the second through holes 121 have the same aperture and are equidistantly arranged in the X direction, and the refractive index of the dielectric material filled in each second through hole 121 has a tendency of changing from a small middle to a large two sides. In other embodiments of the present invention, along the X direction, the apertures of the second through holes 121 may also be unequal, for example, exhibiting a variation trend of large middle, small two sides, or small middle, large two sides, or exhibiting a variation trend of continuously increasing or continuously decreasing; in the X direction, the second through holes 121 may also be arranged in a non-equidistant manner, for example, the number of the second through holes 121 shows a trend of changing more in the middle, less in the two sides, or less in the middle, and more in the two sides, or a trend of changing the number of the second through holes 121 continuously increasing or decreasing, which is not limited herein. Fig. 10 is a cross-sectional view of another scattering film provided in an embodiment of the present invention, as shown in fig. 10, in this embodiment, the apertures of the second through holes 121 have a tendency of changing from small in the middle to large on both sides along the X direction. In the X direction, the refractive index of the dielectric material 122 filled in each second through hole 121 tends to change from small at the middle to large at both sides.

In the above embodiments, the technical solution of the present invention is described by taking an example that the aperture of the second through hole is smaller than the wavelength of the electromagnetic wave, and in some other embodiments of the present invention, the aperture of the second through hole may be larger than the wavelength of the electromagnetic wave. In this case, the second through hole is filled with a dielectric material capable of transmitting electromagnetic waves, and in a preset direction, the refractive index of the dielectric material to incident electromagnetic waves tends to change from a middle to a middle and from two sides to a large, and the preset direction is any direction in the surface of the conductive layer, specifically, refer to fig. 9. In this case, the second through holes 121 no longer have a diffraction effect on the electromagnetic wave, and along the X direction, each second through hole 121 is filled with a different dielectric material 122, and along the X direction, the refractive index of the dielectric material 122 filled in each second through hole 121 shows a trend of changing from a small middle to a large two sides, so that the whole divergent layer 120 shows a trend of changing from a low middle to a high two sides on the refractive index of the electromagnetic wave in the X direction, thereby realizing divergence of the electromagnetic wave.

On the basis of the above embodiments, as shown in fig. 1 to 4, the scattering film may further include a protection layer 130, and the protection layer 130 covers a side of the divergent layer 120 away from the conductive layer 110. The protection layer 130 has insulating and protecting functions, so as to prevent the diffusion layer 120 from being in contact with other external electronic elements to cause short circuit in the using process of the scattering film, and also protect the diffusion layer 120 from being damaged in the using process. Illustratively, the protective layer 130 may be any one of a PPS (Polyphenylene sulfide) film layer, a PEN (Polyethylene terephthalate) film layer, a polyester film layer, a polyimide film layer, a film layer formed after curing epoxy resin ink, a film layer formed after curing polyurethane ink, a film layer formed after curing modified acrylic resin, or a film layer formed after curing polyimide resin.

In some embodiments of the present invention, as shown in fig. 1-4, the scattering film may further include a first protrusion structure 140, and the first protrusion structure 140 is disposed on a side of the divergent layer 120 away from the conductive layer 110. When the electromagnetic wave is emitted through the first protrusion structure 140, the electromagnetic wave is diffusely reflected, so that the motion path of the original electromagnetic wave which is only directionally transmitted is changed, and a transmission path in multiple directions is generated through the diffuse reflection, thereby further expanding the diffusion range of the electromagnetic wave.

For the material for realizing the electromagnetic wave reflection function, the first bump structure 140 made of metal is preferably used in the present invention, but the present invention is not limited thereto, and any material capable of realizing the electromagnetic wave reflection function may be applied to the present invention, and for example, the first bump structure 140 made of alloy may be used. In some embodiments of the present invention, as shown in fig. 1 and 2, the first protrusion structure 140 may be a metal protrusion disposed on the divergence layer 120. The divergent layer 120 and the first protruding structure 140 are made of the same material, so that the bonding force between the divergent layer 120 and the first protruding structure 140 can be improved, the first protruding structure 140 is not easy to fall off, and the service life and the stability of the scattering film are ensured. In the embodiments shown in fig. 3 and 4, the base material of the diverging layer 120 is an organic material such as polyethyleneimine or epoxy resin through which electromagnetic waves can penetrate, so that the first protrusion structures 140 and the diverging layer 120 are different materials.

For example, the first protrusion structure 140 may include a plurality of protrusions 141 to improve a diffuse reflection effect. The distance between adjacent protrusions 141 is smaller than the wavelength of the electromagnetic wave, and illustratively, the distance between adjacent protrusions 141 is 0 μm to 500 μm. The adjacent protrusions 141 may be arranged in series or spaced apart from each other. The size of the convex portion 141 is not particularly limited in the present invention, and the plurality of convex portions 141 may be the same size or different sizes.

In the embodiment of the present invention, the shape of the first protrusion structure 140 may have a variety according to actual needs, and may be a regular or irregular solid geometry, which is not limited herein. In some examples, the first protrusion structures 140 are one or more of pointed, inverted conical, granular, dendritic, columnar, and massive in shape. For example, in the example of fig. 1-4, the first projection structure 140 is an irregular curved shape.

As shown in fig. 1 to 4, the first protrusion structures 140 extend into the protection layer 130, so as to improve the connection reliability between the diffusion layer 120 and the protection layer 130, and prevent the protection layer 130 and the diffusion layer 120 from peeling off. The height of the first bump structures 140 is smaller than the thickness of the protection layer 130, and the design ensures that the first bump structures 140 extend into the protection layer 130 but do not extend out of the protection layer 130, so as to prevent the protection layer 130 from failing. It should be noted that, when the first protruding structure 140 includes a plurality of protruding portions 141 with different heights, the height of the first protruding structure 140 at this time refers to the highest height of all the protruding portions 141. Illustratively, the thickness of the protective layer 130 is 1 μm to 25 μm, and the height of the first bump structure 140 is 0.1 μm to 15 μm.

In order to facilitate the connection of the scattering film of the present invention with other components, as shown in fig. 1 to 4, the scattering film may further include a connection layer 150, and the connection layer 150 is disposed on a second surface of the conductive layer 110, where the second surface is a surface of the conductive layer 110 far away from the diffusion layer 120. Illustratively, the connecting layer 150 is a glue film layer. Through setting up the glued membrane layer, can make the scattering film of this embodiment realize being connected with other parts easily. Illustratively, the material used for the adhesive film layer is selected from any one of the following materials: epoxy resin, modified epoxy resin, acrylic acid, modified rubber, thermoplastic polyimide, modified thermoplastic polyimide, polyurethane, polyacrylate, and silicone.

In some embodiments of the present invention, as shown in fig. 1 to 4, the scattering film may further include a second protrusion structure 160, and the second protrusion structure 160 is disposed on the second surface of the conductive layer 110. The second bump structure 160 extends into the connection layer 150, so that the connection reliability between the conductive layer 110 and the connection layer 150 is improved, and the connection layer 150 and the conductive layer 110 are prevented from being peeled off. The connection layer 150 covers all of the second bump structures 160, and therefore, the height of the second bump structures 160 of the present embodiment is less than or equal to the thickness of the connection layer 150. By the design, it is ensured that the second bump structures 160 extend into the connection layer 150, but not out of the connection layer 150. It should be noted that the shapes of the second protrusion structures 160 in fig. 1-4 are merely exemplary, and due to differences in process means and parameters, the shapes of the second protrusion structures 160 are regular or irregular solid geometries, for example, the shapes of the second protrusion structures 160 may be one or more of sharp-angled, inverted-tapered, granular, dendritic, columnar, and massive. The second bump structures 160 in the embodiments of the invention are not limited to the shapes shown in the drawings and described above, and any second bump structures 160 that are beneficial to improving the connection stability between the connection layer 150 and the conductive layer 110 are within the scope of the invention. The shape of the plurality of second protrusion structures 160 may be the same or different, and the size of the second protrusion structures 160 may also be the same or different, that is, the shape of the plurality of second protrusion structures 160 may be one or more of a pointed shape, an inverted cone shape, a granular shape, a dendritic shape, a columnar shape, and a block shape, and the size of the plurality of second protrusion structures 160 of the same shape may not be completely the same. In addition, the plurality of second bump structures 160 are continuously or discontinuously distributed on the side of the conductive layer 110 close to the connection layer 150, for example, when the plurality of second bump structures 160 are in a sharp corner shape and are continuously distributed, a regular and periodic three-dimensional indented pattern or an irregular and disordered three-dimensional indented pattern may be formed.

It should be noted that the heights of the plurality of second protrusion structures 160 may be different, and in this case, the height of the second protrusion structure 160 refers to the highest height of all the second protrusion structures 160. The outer surface of the connection layer 150 and the surface of the conductive layer 110 may be a flat surface without undulation or a non-flat surface with gentle undulation, which is not limited in the embodiment of the present invention.

In some embodiments of the present invention, the second bump structures 160 are made of a conductive material, so as to lead out the interference charges accumulated in the conductive layer 110 during the use of the scattering film, thereby avoiding the accumulation of the interference charges to form an interference source. Illustratively, the conductive layer 110 and the second bump structure 160 are integrally formed of the same material. When connecting with other components, the second bump structures 160 are pressed to pierce the connection layer 150 and to be grounded, so as to conduct out the interference charges accumulated in the conductive layer 110.

In the embodiment of the present invention, the height of the second bump structures 160 is preferably 0.1 μm to 30 μm, and the thickness of the connection layer 150 is preferably 0.1 μm to 45 μm, so as to ensure that the second bump structures 160 can pierce the connection layer 150 when the diffuser film is used, thereby ensuring that the diffuser film can be grounded.

In the above embodiment, the positions of the conductive layer and the diverging layer may also be interchanged, that is, the electromagnetic wave may pass through the conductive layer first and then the scattering layer; the technical effect of the present invention can also be achieved by passing through the scattering layer first and then passing through the conductive layer, and the embodiment of the present invention is not limited herein. Fig. 11 is a cross-sectional view of another scattering film according to an embodiment of the present invention, as shown in fig. 11, which is substantially the same as the embodiment shown in fig. 2 except that the positions of the conductive layer 110 and the scattering layer 120 are interchanged.

In order to adapt to more application scenes, the scattering film disclosed by the invention is of a flexible, foldable and bendable structure. Specifically, the conductive layer 110 and the diffusion layer 120 may be flexible, for example, an FPC board, and the connection layer 150 for connection provided on one surface of the conductive layer 110 may be flexible, and the protection layer 130 for protection provided on one surface of the diffusion layer 120 may also be flexible, so that the diffusion film of the present invention may have foldable and flexible properties. In actual use, the scattering film may be bent or folded into any shape such as a ring structure or a semi-closed structure, for example, an arc structure, an oval structure, or a stacked structure, as required.

Fig. 12 is a cross-sectional view of an electronic device according to an embodiment of the present invention, fig. 13 is a cross-sectional view of another electronic device according to an embodiment of the present invention, fig. 14 is a cross-sectional view of another electronic device according to an embodiment of the present invention, and fig. 15 is a cross-sectional view of another electronic device according to an embodiment of the present invention, and as shown in fig. 12 to fig. 15, the electronic device includes a scattering film 10 and an antenna apparatus 20. The antenna device 20 includes an antenna line 21 and a substrate 22 on which the antenna line 21 is disposed. The scattering film 10 includes a conductive layer 110, and the conductive layer 110 is provided with a plurality of through holes penetrating through the conductive layer 110, so that the scattering film 10 shows a variation trend of low middle and high two sides of the refractive index of the electromagnetic wave at least in the X direction. The diffusion film 10 further includes a first protrusion structure 140 disposed on the first surface of the conductive layer 110 and the protection layer 130, wherein the first protrusion structure 140 protrudes into the insulation layer 130. The diffusion film 10 further includes a second protrusion structure 160 and a connection layer 150 disposed on a second surface of the conductive layer 110, wherein the second protrusion structure 160 extends into the connection layer 150, and the second surface is a surface opposite to the first surface.

In some embodiments of the present invention, as shown in fig. 13 and 15, the second through hole 121 is filled with a dielectric material 122 for transmitting electromagnetic waves. Illustratively, the second through holes can be filled with the same dielectric material or different dielectric materials.

The antenna device 20 and the diffusion film 10 are connected by bonding the one surface of the substrate 22 to the connection layer 150 of the diffusion film 10. By connecting the scattering film 10 to the antenna device 20, after the electromagnetic wave signal transmitted by the antenna line 21 passes through the scattering film 10, the electromagnetic wave deflects to two sides with larger refractive index in the X direction, thereby realizing the function of diverging the electromagnetic wave and enlarging the space range of the electromagnetic wave transmission; in addition, after the diffused electromagnetic wave meets the first convex structure 140, diffuse reflection is generated, so that the motion path of the original electromagnetic wave which is only directionally transmitted is changed, transmission paths in multiple directions are generated through diffuse reflection, and the diffusion range of the electromagnetic wave is further expanded.

In the description herein, it is to be understood that the terms "upper", "lower", "right", and the like are based on the orientations and positional relationships shown in the drawings and are used for convenience in description and simplicity in operation, but do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be constructed in a particular operation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used merely for descriptive purposes and are not intended to have any special meaning.

In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be appropriately combined to form other embodiments as will be appreciated by those skilled in the art.

The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.

Claims

1. A diffuser film, comprising:

2. The scattering film of claim 1, wherein the scattering layer comprises a substrate, and a plurality of second through holes are formed in the substrate, the second through holes penetrating through the substrate, the second through holes allowing electromagnetic waves to pass through, and the aperture of each second through hole being smaller than the wavelength of the electromagnetic waves.

3. The diffuser film of claim 2, wherein the number and/or aperture of the second through holes has a continuously varying trend in at least one predetermined direction, the predetermined direction being any direction within the surface of the diffuser layer.

4. The diffuser film of claim 3, wherein each of the first vias corresponds to one of the second vias, and the first vias and the corresponding second vias of the first vias at least partially overlap in a direction perpendicular to the conductive layer.

5. The diffuser film of claim 3,

the plurality of second through holes are arranged in an array, the aperture of the second through holes presents a variation trend of large middle, small two sides or small middle and large two sides along the preset direction, or,

6. The diffuser film of claim 3,

the second through holes are arranged in an array, the number of the second through holes along the preset direction shows a change trend of more middle, less two sides or less middle and more two sides, or,

7. The scattering film of any of claims 2-6, wherein the second through holes are filled with a dielectric material that is transparent to electromagnetic waves.

8. The scattering film of claim 7, wherein the refractive index of the dielectric material for incident electromagnetic waves along the predetermined direction has a small middle variation trend and large two sides variation trend.

9. The scattering film of claim 1, wherein the scattering layer comprises a substrate, the substrate is provided with a plurality of second through holes penetrating through the substrate, the second through holes are filled with a dielectric material capable of transmitting electromagnetic waves, the refractive index of the dielectric material to incident electromagnetic waves in at least one preset direction shows a variation trend of small middle and large two sides, and the preset direction is any direction in the surface of the scattering layer.

10. The scattering film of claim 1, further comprising a first raised structure disposed on a side of the diffuser layer away from the conductive layer, wherein the electromagnetic wave is reflected when passing through the first raised structure.

11. The diffuser film of claim 10, wherein the first raised structure comprises a plurality of raised portions, and wherein a distance between adjacent raised portions is less than a wavelength of the electromagnetic wave.

12. The diffuser film of claim 10, further comprising a protective layer disposed on a side of the diffuser layer away from the conductive layer, wherein the first protrusion extends into the protective layer.

13. The diffuser film of claim 1, further comprising a tie layer disposed on a second surface of the conductive layer, the second surface being opposite the first surface.

14. The diffuser film of claim 13, further comprising a second raised structure disposed on the second surface of the conductive layer, the second raised structure extending into the connecting layer.

15. An electronic device comprising the diffuser film of any of claims 1-14, and further comprising an antenna assembly, a surface of the antenna assembly being coupled to the diffuser film.