CN111295039A - Circuit board and electronic equipment - Google Patents
Circuit board and electronic equipment Download PDFInfo
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- CN111295039A CN111295039A CN202010121148.6A CN202010121148A CN111295039A CN 111295039 A CN111295039 A CN 111295039A CN 202010121148 A CN202010121148 A CN 202010121148A CN 111295039 A CN111295039 A CN 111295039A
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- 230000005540 biological transmission Effects 0.000 abstract description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 12
- 229910052802 copper Inorganic materials 0.000 abstract description 8
- 239000010949 copper Substances 0.000 abstract description 8
- 239000011889 copper foil Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
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- 238000010586 diagram Methods 0.000 description 2
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- 230000008054 signal transmission Effects 0.000 description 2
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- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
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- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
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- 239000003822 epoxy resin Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0225—Single or multiple openings in a shielding, ground or power plane
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a circuit board and electronic equipment, wherein the circuit board comprises a signal circuit layer, a first grounding layer and a dielectric layer; the first grounding layer is arranged on at least one side of the signal circuit layer; the dielectric layer is arranged between the signal circuit layer and the first grounding layer; the first grounding layer comprises at least two grounding strips which are electrically connected with each other; the signal circuit layer comprises at least one signal line, and the signal line and the grounding strip are arranged in parallel. The first grounding layer is arranged to comprise at least two grounding strips which are electrically connected with each other, so that the copper content is reduced, and meanwhile, the flexibility of the circuit board is improved; through with signal line and ground strip parallel arrangement, reduced the transmission loss of signal, improved transmission efficiency.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a circuit board and electronic equipment.
Background
Printed Circuit Boards (PCBs) or Flexible Circuit boards (FPCs) are used in electronic devices to electrically couple various components in a Circuit.
In a communication system, interconnection of signals between a large number of devices requires that each device have a reference 'ground' as a reference ground for the signals. Furthermore, as electronic devices become more complex, the frequency of signals transmitted by signal lines on the circuit board becomes higher and higher, and the signals are more and more sensitive to interference of external electromagnetic fields.
In the prior art, to reduce the amount of copper, the ground plane is in a grid-like pattern. In addition, for the PCB, the grid-shaped pattern adopted by the grounding layer can ensure the flatness and the non-deformation of the PCB and control the copper balance; for the FPC, the grid-shaped pattern is adopted by the grounding layer, so that the flexibility of the FPC can be improved, and the FPC can be conveniently bent and assembled.
However, in the implementation process, the inventor finds that the transmission loss of the signal line in the prior art is large, and the transmission efficiency is low.
Disclosure of Invention
The embodiment of the invention provides a circuit board and electronic equipment, which can reduce the transmission loss of a signal line and improve the transmission efficiency.
In a first aspect, an embodiment of the present invention provides a circuit board, including: the signal circuit layer, the first grounding layer and the dielectric layer;
the first grounding layer is arranged on at least one side of the signal circuit layer;
the dielectric layer is arranged between the signal circuit layer and the first grounding layer;
the first grounding layer comprises at least two grounding strips which are electrically connected with each other;
the signal circuit layer comprises at least one signal line, and the signal line and the grounding strip are arranged in parallel.
Optionally, the first ground plane further includes a connection portion electrically connected to the ground strip, and the connection portion and the ground strip form a grid structure.
Optionally, a center line of the signal line in the extending direction coincides with a center line of one of the ground strips in the extending direction in a direction perpendicular to the circuit board.
Optionally, the line width of the signal line is greater than the line width of the ground strip.
Optionally, the line width range of the signal line is 250 μm to 300 μm, and the line width range of the ground strip is 80 μm to 120 μm.
Optionally, the length of the signal line is equal to the length of the ground strip.
Optionally, the first ground plane is disposed at one side of the signal line layer, a second ground plane is disposed at one side of the signal line layer away from the first ground plane, and a dielectric layer is disposed between the signal line layer and the second ground plane;
the second grounding layer is a metal foil.
Optionally, the circuit board further includes an insulating protection layer;
the insulating protection layer is arranged on one side of the dielectric layer close to the signal line layer and covers the signal line; and/or
The insulating protection layer is arranged on one side of the dielectric layer close to the first grounding layer and covers the grounding strip.
Optionally, the dielectric layer is a flexible organic layer.
In a second aspect, an embodiment of the present invention further provides an electronic device, including the circuit board provided in the first aspect of the present invention.
The circuit board provided by the embodiment of the invention comprises a signal circuit layer, a first grounding layer and a dielectric layer, wherein the signal circuit layer comprises a signal line, the grounding layer comprises at least two grounding strips which are electrically connected with each other, and the first grounding layer is arranged to comprise at least two grounding strips which are electrically connected with each other, so that the copper content is reduced, and meanwhile, the flexibility of the circuit board is improved; through with signal line and ground strip parallel arrangement, reduced the transmission loss of signal, improved transmission efficiency.
Drawings
The invention is explained in more detail below with reference to the figures and examples.
FIG. 1 is a schematic structural diagram of a circuit board in the prior art;
fig. 2 is a cross-sectional view of a circuit board according to an embodiment of the present invention;
fig. 3 is a top view of a ground plane according to an embodiment of the invention;
fig. 4 is a top view of a circuit board according to an embodiment of the present invention;
fig. 5 is a top view of another ground plane according to an embodiment of the invention;
fig. 6 is a top view of another ground plane according to an embodiment of the invention;
fig. 7 is a top view of another ground plane according to an embodiment of the invention;
fig. 8 is a top view of another ground plane according to an embodiment of the invention;
FIG. 9 is a cross-sectional view of another circuit board provided in accordance with an embodiment of the present invention;
fig. 10 is a top view of another circuit board provided in accordance with an embodiment of the present invention;
FIG. 11 is a cross-sectional view of another circuit board provided in accordance with an embodiment of the present invention;
fig. 12 is a cross-sectional view of another circuit board provided in accordance with an embodiment of the present invention;
fig. 13 is a cross-sectional view of another circuit board provided in accordance with an embodiment of the present invention;
fig. 14 is a cross-sectional view of another wiring board provided in an embodiment of the present invention;
fig. 15 is a cross-sectional view of another circuit board according to an embodiment of the present invention.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature. Furthermore, the terms "first" and "second" are used merely for descriptive purposes and are not intended to have any special meaning.
Fig. 1 is a schematic structural diagram of a circuit board in the prior art, as shown in fig. 1, the circuit board includes a ground layer and a signal layer, a plurality of grids of a grid-shaped pattern of the ground layer are formed by intersecting a plurality of grid lines 11, the signal layer includes at least one signal line 12, the signal line 12 forms an angle of 45 ° with the grid lines 11, and the signal line 12 passes through an intersection point where the grid lines 11 intersect with each other. It will be appreciated that the ground and signal layers are not actually the same layer, with a dielectric layer (not shown) in between, and that the ground and signal layers are drawn in the same layer in fig. 1 for a better understanding of the prior art solution.
The inventor researches and finds that the loop of the signal line and the ground layer selects the path with the minimum impedance to form a reference ground loop, and the path with the minimum impedance is also the path with the minimum path length. As shown in fig. 1, in the conventional circuit board, a ground reference loop is formed by the signal line and the dashed line 13 in fig. 1. Due to the design, the reference ground loop is too long, so that the transmission loss of signals is large, and the transmission efficiency is low.
An embodiment of the present invention provides a circuit board, including: the signal circuit layer, the first grounding layer and the dielectric layer;
the first grounding layer is arranged on at least one side of the signal circuit layer;
the dielectric layer is arranged between the signal circuit layer and the first grounding layer;
the first grounding layer comprises at least two grounding strips which are electrically connected with each other;
the signal line layer comprises at least one signal line, and the signal line is arranged in parallel with the grounding strip.
The circuit board provided by the embodiment of the invention comprises a signal circuit layer, a first grounding layer and a dielectric layer, wherein the signal circuit layer comprises a signal line, the grounding layer comprises at least two grounding strips which are electrically connected with each other, and the first grounding layer is arranged to comprise at least two grounding strips which are electrically connected with each other, so that the copper content is reduced, and meanwhile, the flexibility of the circuit board is improved; through with signal line and ground strip parallel arrangement, reduced the transmission loss of signal, improved transmission efficiency.
In order to make the technical solution of the present invention more clearly understood by those skilled in the art, the scattering film provided in the present embodiment is specifically described below with reference to the specific drawings:
fig. 2 is a cross-sectional view of a circuit board according to an embodiment of the present invention, fig. 3 is a top view of a ground layer according to an embodiment of the present invention, and fig. 4 is a top view of a circuit board according to an embodiment of the present invention, as shown in fig. 2 to fig. 4, the circuit board includes a signal circuit layer 110, a first ground layer 120, and a dielectric layer 130.
Illustratively, the first ground layer 120 is disposed on one side of the signal circuit layer 110, and the dielectric layer 130 is disposed between the signal circuit layer 110 and the first ground layer 120. That is, it can also be interpreted that the first ground layer 120 and the signal line layer 110 are respectively disposed at opposite sides of the dielectric layer 130.
The first ground layer 120 is used for grounding or receiving a reference voltage as a reference ground. The material of the first ground layer 120 is usually copper, the first ground layer 120 includes at least two ground strips 121 electrically connected to each other, and the exemplary multiple ground strips 121 are disposed in parallel. By arranging the first ground plane to include at least two ground strips electrically connected to each other, the amount of copper is reduced, and at the same time, the flexibility of the circuit board is improved.
The signal line layer 110 includes at least one signal line 111, and the signal line 111 is disposed in parallel with the ground stripe 121. As shown in fig. 4, since the signal line 111 and the ground strip 121 are arranged in parallel, the length of the ground reference loop formed by the signal line 111 and the ground strip 121 (the loop formed by the signal line 111 and the dashed line 124 in the figure) is greatly shortened relative to the length of the ground reference loop of the circuit board in the prior art, so that the transmission loss of signals is reduced, and the transmission efficiency is improved. It is understood that, in fig. 4, the first ground layer 120 and the signal line layer 110 are not actually the same layer, and a dielectric layer is disposed between the two layers, and for better understanding of the position relationship between the signal line 111 and the ground strip 121, the first ground layer 120 and the signal line layer 110 are drawn in the same layer in fig. 4.
It should be noted that, in the embodiment of the present invention, the signal line layer 110 includes one signal line 111 as an example to describe the present invention, in other embodiments of the present invention, the signal line layer 110 may include a plurality of signal lines 111, and the embodiment of the present invention is not limited herein. In addition, in the embodiment of the present invention, the signal line 111 and the ground bar are both straight line segments for example, and the present invention is described, in other embodiments of the present invention, the signal line 111 may also be a curved line segment instead of the straight line segment, and the corresponding ground bar 121 may be a curved line segment parallel to the signal line 111, so as to ensure impedance consistency of the signal line 111, which is not limited herein.
The first ground layer 120 further includes a connection portion 122 electrically connected to the ground stripe 121, and the connection portion 122 and the ground stripe 121 form a mesh structure. In the embodiment of the present invention, the first ground layer 120 of the grid structure may be formed by etching a copper foil, and the through holes 123 arranged in an array are formed by etching away a portion of the copper foil, so as to form the grid structure including the ground strips 121 and the connection portions 122.
The via 123 can have various forms, as described in more detail below:
fig. 5 is a top view of another ground layer according to an embodiment of the present invention, fig. 6 is a top view of another ground layer according to an embodiment of the present invention, fig. 7 is a top view of another ground layer according to an embodiment of the present invention, and fig. 8 is a top view of another ground layer according to an embodiment of the present invention.
As shown in fig. 3, the via 123 is shaped as a waist, and the long axis of the waist is parallel to the ground strip 121.
As shown in fig. 5, the via 123 has an elliptical shape with the major axis of the elliptical hole parallel to the ground strip 121.
As shown in fig. 6-8, the through-hole 123 is prismatic or other polygonal shape.
It should be noted that, in the above embodiments, the shape of the through hole is an exemplary illustration of the present invention, and is not a specific limitation of the present invention, and only the first ground layer of the grid structure needs to be formed, and the present invention is not limited herein.
Fig. 9 is a cross-sectional view of another circuit board according to an embodiment of the present invention, and fig. 10 is a top view of another circuit board according to an embodiment of the present invention, as shown in fig. 9 and fig. 10, on the basis of the above embodiments, a center line of a signal line 111 along an extending direction coincides with a center line of one of the ground bars 121 along the extending direction in a direction perpendicular to the circuit board. The center line of the signal line 111 along the extending direction and the center line of the grounding strip 121 along the extending direction are overlapped in the direction perpendicular to the circuit board, so that the length of a reference ground loop is further shortened, the transmission loss of signals is reduced, and the transmission efficiency is improved.
It should be noted that, in the embodiment shown in fig. 10, the first ground layer 120 is taken as an example of the grid structure shown in fig. 3 for description, it is to be understood that, in this embodiment, the first ground layer 120 may also be the grid structure shown in fig. 5 to 8, and details of the embodiment of the present invention are not repeated herein.
As shown in fig. 9, the line width d1 of the signal line 111 is greater than the line width d2 of the ground bar 121, and the transmission loss of the signal is further reduced by increasing the line width of the signal line 111 to reduce the impedance of the signal line 111.
Illustratively, the line width of the signal line 111 ranges from 250 μm to 300 μm, and the line width of the ground stripe 121 ranges from 80 μm to 120 μm. In one embodiment, the line width of the signal line 111 is 280 μm, and the line width of the ground bar 121 is 100 μm. The line width of the ground bar 121 refers to the width of the narrowest portion of the ground bar 121.
On the basis of the above embodiment, the length of the signal line 111 is equal to the length of the ground stripe 121. So that the signal line 111 has a complete reference ground, the radiation of the signal line 111 is reduced, and the transmission loss of the signal is reduced.
In the above embodiment, the signal line 111 may be a single-ended microstrip line, the single-ended microstrip line is used for transmitting a single-ended signal, and the single-ended signal is a level difference between a ground and a ground transmitted on a lead. As shown in fig. 2 and 9, in this embodiment, the single-ended microstrip is a printed conductor, which is a strip conductor (signal line 110), located on the first ground layer 120 and separated by a dielectric layer 130.
On the basis of the above embodiment, the signal line layer may also include a differential microstrip line, where the differential microstrip line includes two parallel, equal-length, equal-width and closely-adjacent conducting wires located on the ground layer and separated from the ground layer by an electrolyte, and is used to transmit differential signals, and the amplitudes of signals transmitted on the two conducting wires are the same, and the phases are opposite. Fig. 11 is a cross-sectional view of another circuit board according to an embodiment of the present invention, as shown in fig. 11, in this embodiment, the circuit board includes a signal circuit layer 110, a first ground layer 120, and a dielectric layer 130. The signal line layer 110 includes at least two signal lines 111 that are parallel to each other, have the same length and width, and are disposed in close proximity to each other, and are used for transmitting differential signals. The two signal lines 111 are located on the first ground layer 120 and separated from the first ground layer 120 by a dielectric layer 130.
On the basis of the above embodiment, the signal line layer may include a single-ended stripline, which is a high-frequency transmission conductive line disposed between two parallel ground layers, with a dielectric disposed between the ground layers and the signal line layer. Fig. 12 is a cross-sectional view of another circuit board according to an embodiment of the present invention, as shown in fig. 12, in this embodiment, the circuit board includes a signal circuit layer 110, two first ground layers 120, and a dielectric layer 130. The two first ground layers 120 are respectively disposed on two opposite sides of the signal circuit layer 110, and the dielectric layer 130 is disposed between the signal circuit layer 120 and the first ground layer 110. The single-ended stripline is used for transmitting a single-ended signal, and the single-ended signal is the level difference between the single-ended signal and the ground transmitted on one conductor.
On the basis of the above embodiment, one of the two ground layers of the single-ended stripline may be the first ground layer provided in the embodiment of the present invention, and the other ground layer may be a ground metal foil. Fig. 13 is a cross-sectional view of another circuit board according to an embodiment of the present invention, as shown in fig. 13, the circuit board includes a signal circuit layer 110, a first ground layer 120, a second ground layer 140, and a dielectric layer 130. The first ground layer 120 and the second ground layer 140 are respectively disposed on two opposite sides of the signal circuit layer 110, and the dielectric layer 130 is disposed between the signal circuit layer 120 and the first ground layer 110, and between the signal circuit layer 120 and the second ground layer 140. The second ground layer 140 is a metal foil, specifically, a copper foil, and the second ground layer 140 is a solid area having a complete surface (without an opening). The signal line layer 110 includes a signal line 111 for transmitting a single-ended signal.
On the basis of the above embodiment, the signal line layer may include a differential stripline, which is two signal transmission conductive lines disposed between two parallel ground layers with a dielectric disposed therebetween. The two signal transmission wires are parallel to each other, have the same length and the same width, are closely close to the wires and are used for transmitting differential signals, and the signals transmitted on the two wires have the same amplitude and opposite phases. Fig. 14 is a cross-sectional view of another circuit board according to an embodiment of the present invention, as shown in fig. 14, in this embodiment, the circuit board includes a signal circuit layer 110, two first ground layers 120, and a dielectric layer 130. The two first ground layers 120 are respectively disposed on two opposite sides of the signal circuit layer 110, and the dielectric layer 130 is disposed between the signal circuit layer 120 and the first ground layer 110. Two parallel, equal-length, equal-width and closely-adjacent signal lines 111 are used for transmitting differential signals.
On the basis of the above embodiment, one of the two ground layers of the differential stripline may be the first ground layer provided in the embodiment of the present invention, and the other ground layer may be a ground metal foil. Fig. 15 is a cross-sectional view of another circuit board according to an embodiment of the present invention, as shown in fig. 15, in this embodiment, the circuit board includes a signal circuit layer 110, a first ground layer 120, a second ground layer 140, and a dielectric layer 130. The first ground layer 120 and the second ground layer 140 are respectively disposed on two opposite sides of the signal circuit layer 110, and the dielectric layer 130 is disposed between the signal circuit layer 120 and the first ground layer 110, and between the signal circuit layer 120 and the second ground layer 140. Two parallel, equal-length, equal-width and closely-adjacent signal lines 111 are used for transmitting differential signals. The second ground layer 140 is a metal foil, specifically, a copper foil, and the second ground layer 140 is a solid area having a complete surface (without an opening).
On the basis of the above embodiments, as shown in fig. 2, 9, 11-15, the wiring board further includes an insulating protective layer 150.
Specifically, as shown in fig. 2, 9 and 11, the insulating protection layer 150 is disposed on one side of the dielectric layer 130 close to the signal line layer 110, and covers the signal line 111; and the insulating protection layer 150 is disposed on one side of the dielectric layer 130 close to the first ground layer 120 and covers the ground strip 121. For example, the insulating protection layer 150 may be an organic layer having a buffer protection function, so as to prevent the signal circuit layer 110 and the first ground layer 120 of the circuit board from being damaged by external impact during use.
As shown in fig. 12-15, the insulating protection layer 150 is disposed on one side of the dielectric layer 130 close to the first ground layer 120 and covers the ground strip 121; and the insulating protection layer 150 is disposed on one side of the dielectric layer 130 close to the second ground layer 140 and covers the second ground layer 140. For example, the insulating protection layer 150 may be an organic layer having a buffer protection function, so as to prevent the first ground layer 120 and the second ground layer 140 of the circuit board from being damaged by external impact during use.
On the basis of the above embodiment, the dielectric layer 130 may be a rigid material, such as phenolic resin, glass fiber, or epoxy resin, etc., for forming a rigid circuit board. Dielectric layer 130 may also be a flexible organic material, such as polyimide or mylar, used to form a flexible wiring board.
An embodiment of the present invention further provides an electronic device, including: a wiring board as provided in any of the embodiments of the present invention. The electronic device can be, for example, a smart sound, a smart watch, a smart headset, a smart phone, a tablet computer, or the like, and the circuit board can be a rigid circuit board or a flexible circuit board in the electronic device.
The circuit board in the electronic equipment comprises a signal circuit layer, a first grounding layer and a dielectric layer, wherein the signal circuit layer comprises a signal line, the grounding layer comprises at least two grounding strips which are electrically connected with each other, the copper amount is reduced by arranging the first grounding layer to comprise the at least two grounding strips which are electrically connected with each other, and meanwhile, the flexibility of the circuit board is improved; through with signal line and ground strip parallel arrangement, reduced the transmission loss of signal, improved transmission efficiency.
In the description herein, it is to be understood that the terms "upper", "lower", "left", "right", and the like are used in a descriptive sense or positional relationship based on the orientation or positional relationship shown in the drawings for convenience in description and simplicity of operation, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the present invention.
In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be appropriately combined to form other embodiments as will be appreciated by those skilled in the art.
The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.
Claims (10)
1. A circuit board, comprising: the signal circuit layer, the first grounding layer and the dielectric layer;
the first grounding layer is arranged on at least one side of the signal circuit layer;
the dielectric layer is arranged between the signal circuit layer and the first grounding layer;
the first grounding layer comprises at least two grounding strips which are electrically connected with each other;
the signal circuit layer comprises at least one signal line, and the signal line and the grounding strip are arranged in parallel.
2. The wiring board of claim 1, wherein the first ground plane further comprises a connection portion electrically connecting the ground strip, the connection portion and the ground strip forming a grid structure.
3. The wiring board of claim 1, wherein a center line of the signal line in the extending direction coincides with a center line of one of the ground bars in the extending direction in a direction perpendicular to the wiring board.
4. The wiring board of claim 1, wherein the signal line has a line width greater than a line width of the ground access stripe.
5. The wiring board of claim 4, wherein the signal line has a line width in the range of 250 μm to 300 μm, and the ground strip has a line width in the range of 80 μm to 120 μm.
6. The wiring board of claim 1, wherein the signal line has a length equal to a length of the ground strip.
7. The circuit board according to claim 1, wherein the first ground layer is disposed on one side of the signal circuit layer, a second ground layer is disposed on one side of the signal circuit layer away from the first ground layer, and a dielectric layer is disposed between the signal circuit layer and the second ground layer;
the second grounding layer is a metal foil.
8. The wiring board of claim 1, further comprising an insulating protective layer;
the insulating protection layer is arranged on one side of the dielectric layer close to the signal line layer and covers the signal line; and/or
The insulating protection layer is arranged on one side of the dielectric layer close to the first grounding layer and covers the grounding strip.
9. The wiring board of claim 1, wherein the dielectric layer is a flexible organic layer.
10. An electronic device characterized by comprising the wiring board according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010121148.6A CN111295039A (en) | 2020-02-26 | 2020-02-26 | Circuit board and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010121148.6A CN111295039A (en) | 2020-02-26 | 2020-02-26 | Circuit board and electronic equipment |
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| CN111295039A true CN111295039A (en) | 2020-06-16 |
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| CN202010121148.6A Pending CN111295039A (en) | 2020-02-26 | 2020-02-26 | Circuit board and electronic equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022012007A1 (en) * | 2020-07-17 | 2022-01-20 | 苏州浪潮智能科技有限公司 | Circuit board and server |
| CN117895203A (en) * | 2024-01-11 | 2024-04-16 | 之江实验室 | Low parasitic parameter serdes differential pair structure and equipment based on semiconductor technology |
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|---|---|---|---|---|
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| JP2003133659A (en) * | 2001-10-19 | 2003-05-09 | Kazunori Aoki | Flexible printed wiring board for high frequency having bending performance |
| KR20080043581A (en) * | 2006-11-14 | 2008-05-19 | 삼성전자주식회사 | Flexible printed circuit board and electric apparatus having the same |
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| WO2022012007A1 (en) * | 2020-07-17 | 2022-01-20 | 苏州浪潮智能科技有限公司 | Circuit board and server |
| CN117895203A (en) * | 2024-01-11 | 2024-04-16 | 之江实验室 | Low parasitic parameter serdes differential pair structure and equipment based on semiconductor technology |
| CN117895203B (en) * | 2024-01-11 | 2024-07-19 | 之江实验室 | Low parasitic parameter serdes differential pair structure and equipment based on semiconductor technology |
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