WO2020095786A1 - Substrate - Google Patents

Substrate Download PDF

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Publication number
WO2020095786A1
WO2020095786A1 PCT/JP2019/042538 JP2019042538W WO2020095786A1 WO 2020095786 A1 WO2020095786 A1 WO 2020095786A1 JP 2019042538 W JP2019042538 W JP 2019042538W WO 2020095786 A1 WO2020095786 A1 WO 2020095786A1
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WO
WIPO (PCT)
Prior art keywords
conductor
mesh
signal wiring
dielectric layer
linear
Prior art date
Application number
PCT/JP2019/042538
Other languages
French (fr)
Japanese (ja)
Inventor
良行 生熊
Original Assignee
Ａｇｃ株式会社
エージーシー グラス ユーロップ
エージーシー フラット グラス ノース アメリカ，インコーポレイテッド
エージーシー ヴィドロ ド ブラジル リミターダ
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Application filed by Ａｇｃ株式会社, エージーシー グラス ユーロップ, エージーシー フラット グラス ノース アメリカ，インコーポレイテッド, エージーシー ヴィドロ ド ブラジル リミターダ filed Critical Ａｇｃ株式会社
Priority to JP2020556001A priority Critical patent/JPWO2020095786A1/en
Publication of WO2020095786A1 publication Critical patent/WO2020095786A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/08—Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines

Definitions

  • the present disclosure provides a substrate capable of suppressing a decrease in visible light transmittance.
  • a dielectric layer having a first surface and a second surface opposite to the first surface, the dielectric layer transmitting visible light;
  • a mesh-shaped antenna conductor provided on the first surface side;
  • a substrate is provided that includes a mesh-shaped ground conductor provided on the second surface side.
  • a deviation such as a parallel, a right angle, a right angle, a horizontal direction, a vertical direction, a vertical direction, a horizontal direction, and the like is allowed to the extent that the effect of the present invention is not impaired.
  • the X-axis direction, the Y-axis direction, and the Z-axis direction respectively represent a direction parallel to the X-axis, a direction parallel to the Y-axis, and a direction parallel to the Z-axis.
  • the X-axis direction, the Y-axis direction, and the Z-axis direction are orthogonal to each other.
  • the substrate in the present embodiment is used to propagate a signal in a high frequency band (for example, 0.3 GHz to 300 GHz) such as a microwave or a millimeter wave.
  • a high frequency band for example, 0.3 GHz to 300 GHz
  • Such high frequency bands include the UHF band of 0.3 to 3 GHz, the SHF band of 3 to 30 GHz, and the EHF band of 30 to 300 GHz.
  • Specific examples of the high frequency device formed on the substrate in the present embodiment include a planar antenna and a planar waveguide (planar transmission line).
  • FIG. 1 is a plan view of a substrate according to the first embodiment.
  • a planar antenna 101 is formed on the substrate 1 shown in FIG.
  • the substrate 1 includes a dielectric layer 40 that transmits visible light, an antenna conductor 10 provided on one surface of the dielectric layer 40, a ground conductor 20 that faces the antenna conductor 10 with the dielectric layer 40 in between, and an antenna conductor 10. And a power supply line 30 for supplying power to the.
  • the planar antenna 101 is called a patch antenna or a microstrip antenna.
  • FIG. 2 is a plan view showing the transmission line, the antenna conductor, and the ground conductor formed on the substrate according to the first embodiment.
  • the transmission line 60 formed on the substrate 1 includes the dielectric layer 40, the feeding line 30 formed on the first surface of the dielectric layer 40, and the ground conductor 20 formed on the second surface of the dielectric layer 40. It is a microstrip line having a structure including.
  • the dielectric layer 40 has a first main surface 41 and a second main surface 42 opposite to the first main surface 41.
  • the upper part of FIG. 2 shows the antenna conductor 10 and the feed line 30 provided on the side of the first main surface 41 of the dielectric layer 40.
  • the lower part of FIG. 2 shows the ground conductor 20 provided on the second main surface 42 side of the dielectric layer 40.
  • the first major surface 41 is an example of the first surface of the dielectric layer.
  • the second main surface 42 is an example of a second surface of the dielectric layer opposite to the first surface.
  • the dielectric layer 40 is a plate-shaped or sheet-shaped base material containing a dielectric material as a main component. Both the first main surface 41 and the second main surface 42 are parallel to the XY plane.
  • the dielectric layer 40 may be, for example, a dielectric substrate or a dielectric sheet.
  • the material of the dielectric layer 40 is, for example, quartz glass, soda lime glass, non-alkali glass, aluminosilicate glass, borosilicate glass, glass such as alkali borosilicate glass, ceramics, fluorine resin such as polytetrafluoroethylene, liquid crystal. Polymers, cycloolefin polymers, polycarbonates and the like, but the materials are not limited to these.
  • the material of the dielectric layer 40 may be any transparent dielectric member that transmits visible light, and the transparency includes translucent.
  • the visible light transmittance of the dielectric layer 40 is, for example, preferably 30% or more, more preferably 50% or more, further preferably 70% or more, particularly preferably 80% or more, and particularly preferably 90% from the viewpoint of suppressing blocking of visible light. The above is the most preferable.
  • the antenna conductor 10 is a planar conductor pattern whose surface is parallel to the XY plane.
  • the antenna conductor 10 is a conductor pattern formed on the first main surface 41 side, and may be formed by a conductor sheet or a conductor substrate arranged on the first main surface 41 side.
  • Examples of the material of the conductor used for the antenna conductor 10 include, but are not limited to, gold, silver, copper, platinum, aluminum and chromium.
  • the conductor used for the antenna conductor 10 may be plated with these materials.
  • the plated antenna conductor 10 is resistant to corrosion and has good design.
  • the antenna conductor 10 may be formed on the side of the first main surface 41 via an intermediate film such as polyvinyl butyral or ethylene vinyl acetate, or an adhesive layer such as an optical transparent adhesive (OCA).
  • the antenna conductor 10 is obtained by forming a conductor on a resin layer such as polyethylene terephthalate and etching the conductor pattern on the first main surface 41 side through an adhesive layer such as an optical transparent adhesive (OCA). It may be formed.
  • the antenna conductor 10 has, for example, at least one patch conductor.
  • the first embodiment shows an example in which the antenna conductor 10 constitutes an array antenna having four patch conductors 11, 12, 13, and 14.
  • the antenna conductor 10 is a solid pattern composed of a region in which the degree of transmission of visible light is lower than that of the dielectric layer 40.
  • the entire antenna conductor 10 is composed of an opaque planar conductor including the plurality of patch conductors 11 to 14.
  • the power supply line 30 is a planar conductor pattern whose surface is parallel to the XY plane.
  • the power supply line 30 is a conductor pattern formed on the first main surface 41 side, and may be formed of a conductor sheet or a conductor substrate arranged on the first main surface 41 side. Examples of the material of the conductor used for the power supply line 30 include, but are not limited to, gold, silver, copper, platinum, aluminum and chromium.
  • the feeding line 30 is formed integrally with the antenna conductor 10.
  • the power supply line 30 is an example of a signal wiring provided on the dielectric layer 40.
  • the power supply line 30 may be formed on the side of the first main surface 41 via an intermediate film of polyvinyl butyral or ethylene vinyl acetate, or an adhesive layer of an optical transparent adhesive (OCA) or the like. Further, the power supply line 30 is obtained by forming a conductor on a resin layer such as polyethylene terephthalate and etching the conductor pattern on the first main surface 41 side through an adhesive layer such as an optical transparent adhesive (OCA). It may be formed.
  • the power supply line 30 may be formed by forming a conductor on polyvinyl butyral, ethylene vinyl acetate, polyethylene terephthalate, or the like by sputtering or vapor deposition, and etching the conductor pattern on the first main surface 41 side.
  • the power supply line 30 includes one end portion 32 connected to a branch point 36 to which a branch path to the patch conductors 11 and 12 and a branch path to the patch conductors 13 and 14 are connected, and a wireless device such as a transmitter.
  • the other end 33 is a power supply end connected to an external device (not shown).
  • the power supply line 30 is a strip conductor extending in the Y-axis direction, and the end portion 32 is connected to the antenna conductor 10.
  • the power supply line 30 is a solid pattern composed of a region in which the degree of transmission of visible light is lower than that of the dielectric layer 40.
  • the entire feeding line 30 is made of an opaque planar conductor.
  • the ground conductor 20 is a conductor pattern whose surface is parallel to the XY plane.
  • the ground conductor 20 is a conductor pattern formed on the second main surface 42 side, and may be formed by a conductor sheet or a conductor substrate arranged on the second main surface 42 side.
  • Examples of the material of the conductor used for the ground conductor 20 include, but are not limited to, gold, silver, copper, platinum, aluminum and chromium.
  • the conductor used for the ground conductor 20 may be plated with these materials.
  • the plated ground conductor 20 is resistant to corrosion and has good design.
  • the ground conductor 20 is in contact with the dielectric layer 40.
  • the ground conductor 20 may be in direct contact with the second major surface 42.
  • a paste-like conductor such as silver or copper is formed on the second main surface 42 by screen printing to form a conductor pattern and then sintered.
  • the ground conductor 20 has a linear ground conductor 27 formed so as to form a gap and a planar ground conductor 26 connected to the linear ground conductor 27.
  • the planar ground conductor 26 is a ground portion provided in a strip shape on one end side of the second main surface 42.
  • the planar ground conductor 26 is a ground electrode corresponding to the end portion 33 which is a power feeding end.
  • the planar ground conductor 26 is provided on the entire one end side, but it may be provided on a part of the one end side.
  • the planar ground conductor 26 may have a part formed in a solid pattern and the remaining part formed in a mesh pattern.
  • the planar ground conductor 26 may have a solid pattern in a portion overlapping the end 33 and a mesh pattern in a portion not overlapping the end 33 in a plan view.
  • the linear ground conductor 27 is formed in a mesh shape so that a gap is created, and the gap can ensure a visual field (transparency).
  • lattice-shaped gaps are formed.
  • the mesh angle A of the linear ground conductor 27 is approximately 90 °, and the meshes are formed orthogonally, but the mesh angle A may be formed as an acute angle or an obtuse angle. May be. If the mesh angle A of the linear ground conductor 27 is formed to be an obtuse angle, an etching residue is less likely to occur when the linear ground conductor 27 is formed by etching, and the aperture ratio can be increased.
  • the mesh angle A is an obtuse angle
  • the mesh may be a regular hexagon as shown in FIG.
  • the mesh of the linear ground conductor 27 may be square or rhombic.
  • the mesh is preferably square. If the mesh is square, the design is good.
  • the mesh may have a random shape by the self-assembly method. Moiré can be prevented by using a random shape.
  • the mesh of the linear ground conductor 27 is formed of a plurality of linear conductors, but the plurality of linear conductors are different from the extending direction of the power supply line 30 or the direction orthogonal to the extending direction. Is preferably formed. If the plurality of linear conductors are formed in a direction different from the extending direction of the power feeding line 30 or the direction orthogonal to the extending direction, a desired characteristic impedance can be easily obtained and good antenna characteristics can be secured.
  • the ground conductor 20 includes an outer edge linear conductor 28 that is in contact with the linear ground conductor 27 and forms an outer edge of the ground conductor 20.
  • the outer edge linear conductor 28 surrounds the linear ground conductor 27.
  • the outer edge linear conductor 28 may be arranged so as to surround a part of the linear ground conductor 27, but the outer edge linear conductor 28 itself may not be arranged. Whether or not the outer edge linear conductor 28 is arranged is the same in the following embodiments.
  • the substrate 1 according to the present embodiment has at least the ground conductor 20 formed in a mesh shape, and thus has excellent light transmissivity for transmitting visible light. Therefore, it is possible to suppress a decrease in the transmittance of visible light.
  • the substrate 1 is directly or indirectly installed on the surface of the window glass 200, at least the ground conductor 20 is formed in a mesh shape, so that the substrate 1 (especially the ground conductor 20) has a field of view through the window glass 200. It is possible to suppress the obstruction.
  • the antenna conductor 10 includes an internal linear conductor 17 formed so that a gap is formed inside the antenna conductor 10.
  • the internal linear conductors 17 are formed in a mesh shape so that lattice-shaped gaps are formed. At least a part of the internal linear conductor 17 overlaps with the linear ground conductor 27 of the ground conductor 20 in a plan view, but when all of the internal linear conductor 17 overlaps with the linear ground conductor 27. More preferable. As described above, since both the antenna conductor 10 and the ground conductor 20 are formed by the linear conductors so as to form the gap, it is easier to secure the visual field.
  • the mesh angle A of the inner linear conductor 17 is approximately 90 °, and the meshes are formed orthogonally, but the mesh angle A may be formed to be an acute angle or an obtuse angle. May be. If the mesh angle A of the internal linear conductor 17 is formed to be an obtuse angle, an etching residue is less likely to occur when the internal linear conductor 17 is formed by etching, and the aperture ratio can be increased. As an example of the case where the mesh angle A is an obtuse angle, as shown in FIG. 6, the mesh may be a regular hexagon.
  • the mesh of the inner linear conductor 17 may be square or rhombic. When the mesh is formed in a square shape, the mesh is preferably square. If the mesh is square, the design is good. The mesh may have a random shape by the self-assembly method. Moiré can be prevented by using a random shape.
  • the mesh of the internal linear conductor 17 is formed of a plurality of linear conductors, but the plurality of linear conductors are different from the extending direction of the power supply line 30 or the direction orthogonal to the extending direction. Is preferably formed. If the plurality of linear conductors are formed in a direction different from the extending direction of the power feeding line 30 or the direction orthogonal to the extending direction, a desired characteristic impedance can be easily obtained and good antenna characteristics can be secured.
  • the antenna conductor 10 includes an outer edge linear conductor 18 that is in contact with the inner linear conductor 17 and forms an outer edge of the antenna conductor 10.
  • the outer edge linear conductor 18 surrounds the inner linear conductor 17 and is in a closed state.
  • the line width of the two sides of the outer edge linear conductor 18 facing in the H-plane direction may be formed thicker than the line widths of the other sides. Since the line width of the two sides of the outer edge linear conductor 18 facing in the H-plane direction (X-axis direction in FIG. 7) is thicker than the line widths of the other two sides, conductor loss is reduced and good antenna characteristics are secured. it can.
  • the power supply line 30 includes an internal linear conductor 37 formed so that a gap is formed inside the power supply line 30.
  • the internal linear conductors 37 are formed in a mesh shape so that lattice-shaped gaps are formed.
  • the inner linear conductor 37 does not have to overlap the linear ground conductor 27 of the ground conductor 20 in a plan view, but at least a part of the inner linear conductor 37 has a linear shape of the ground conductor 20 in a plan view. It is preferable that it overlaps with the ground conductor 27, and it is more preferable that all of the internal linear conductors 37 overlap with the linear ground conductor 27.
  • both the power supply line 30 and the ground conductor 20 are formed of linear conductors so that a gap is formed, it is easier to secure the field of view.
  • the mesh angle A of the inner linear conductor 37 is approximately 90 °, and the meshes are formed orthogonally, but the mesh angle A may be formed as an acute angle or an obtuse angle. May be. If the mesh angle A of the inner linear conductor 37 is formed to be an obtuse angle, an etching residue is less likely to occur when the inner linear conductor 37 is formed by etching, and the aperture ratio can be increased. As an example of the case where the mesh angle A is an obtuse angle, as shown in FIG. 6, the mesh may be a regular hexagon.
  • the mesh of the inner linear conductor 37 may be square or rhombic. When the mesh is formed in a square shape, the mesh is preferably square. If the mesh is square, the design is good. The mesh may have a random shape by the self-assembly method. Moiré can be prevented by using a random shape.
  • the power feeding line 30 includes an outer edge linear conductor 38 that is in contact with the inner linear conductor 37 and forms an outer edge of the power feeding line 30.
  • the outer edge linear conductor 38 surrounds the inner linear conductor 37 and is in a closed state.
  • the outer edge linear conductor 38 surrounds the inner linear conductor 37, so that the difference from the current distribution in the case of the planar conductor as in the first embodiment can be suppressed. , Good antenna characteristics can be secured.
  • the ground conductor 20 is provided in the first region 21 that overlaps with the antenna conductor 10 and the second region 22 that does not overlap with the antenna conductor 10 in plan view.
  • the linear ground conductor 27 is formed in both the first region 21 and the second region 22.
  • the ground conductor 20 may be formed on a part of the second main surface 42, but is preferably formed on the entire second main surface 42.
  • FIG. 8 is a perspective view showing a transmission line, an antenna conductor, and a ground conductor formed on the substrate according to the third embodiment.
  • a planar antenna 104 is formed on the substrate 4 shown in FIG. Descriptions of configurations and effects similar to those of the first and second embodiments will be omitted by using the description of the above-described embodiments.
  • the substrate 4 includes a dielectric layer 40 that transmits visible light, an antenna conductor 10 provided on one surface of the dielectric layer 40, a ground conductor 20 that faces the antenna conductor 10 with the dielectric layer 40 in between, and an antenna conductor 10. And a power feed line 30 for feeding power through the slot 31.
  • the transmission line 60 formed on the substrate 4 includes the dielectric layer 40, the feeding line 30 formed on the second surface of the dielectric layer 40, and the ground conductor 20 formed on the second surface of the dielectric layer 40. It is a coplanar line having a structure including.
  • the power feed line 30 and the ground conductor 20 are formed on the second main surface (the surface opposite to the first main surface 41 on which the antenna conductor 10 is formed) of the dielectric layer 40.
  • the feed line 30 has a pair of gaps running in parallel and a center conductor (center conductor of the coplanar line) sandwiched between the pair of gaps.
  • the slot 31 formed at one end of the power supply line 30 and the antenna conductor 10 formed on the first main surface 41 side are coupled with each other in terms of high frequency.
  • the ground conductor 20 has a linear ground conductor 27 formed so as to form a gap, and the linear ground conductor 27 is formed in a mesh shape so as to form a gap, and is formed by the gap.
  • the field of view can be secured.
  • at least one of the center conductor of the power feeding line 30 and the antenna conductor 10 may have a linear conductor formed in a mesh shape so as to form a gap. Thereby, further transparency can be secured.
  • the power supply line 30 includes an internal linear conductor 37 formed in a mesh shape so that a gap is formed inside the power supply line 30.
  • FIG. 9 is a plan view of a mesh conductor including a plurality of linear conductors intersecting with each other.
  • the thickness of the conductor is preferably not less than skin depth ⁇ in order to suppress the propagation loss that occurs in the conductor such as the inner linear conductor 37 through which the high frequency signal propagates.
  • a skin effect is a phenomenon in which when an alternating current flows through a conductor, the current density is relatively high on the surface of the conductor and decreases with increasing distance from the surface.
  • the skin depth ⁇ is the length at which the current decays to 1 / e (about 0.37) of the surface current.
  • the skin depth ⁇ 1 / ⁇ ( ⁇ ⁇ f ⁇ ⁇ r ⁇ ⁇ 0 ⁇ ⁇ ) It is represented by.
  • the surface resistance of the power supply line 30 decreases. It is assumed that the decrease in the surface resistance of the power feeding line 30 due to the meshing of the power feeding line 30 is that the conductivity ⁇ is reduced to 1/10, and the skin depth in this case is ⁇ ′.
  • the line width W and the thickness t of the inner linear conductor 37 are determined by the skin depth ⁇ . It is preferable that it is more than twice.
  • the thickness t is the length in the Z-axis direction.
  • the line width W and the thickness t of the inner linear conductor 37 are more preferably three times or more the skin depth ⁇ ′.
  • the line width of the inner linear conductor 37 is W
  • the frequency is f
  • the skin depth at the frequency f is ⁇ ′
  • the relative magnetic permeability of the inner linear conductor 37 is ⁇ r
  • the magnetic permeability of the vacuum is ⁇ 0
  • the inner line is
  • the electric conductivity of the conductor 37 is ⁇
  • ⁇ 0.1 0.1 ⁇ ⁇
  • the thickness of the inner linear conductor 37 is t
  • the frequency is f
  • the skin depth at the frequency f is ⁇ ′
  • the relative magnetic permeability of the inner linear conductor 37 is ⁇ r
  • the magnetic permeability of the vacuum is ⁇ 0
  • the inner line is
  • the electric conductivity of the conductor 37 is ⁇
  • ⁇ 0.1 0.1 ⁇ ⁇
  • the skin depth ⁇ of the power supply line 30 when the material is copper at a frequency of 3 GHz is about 1.2 ⁇ m.
  • the skin depth ⁇ ′ in this case is about 3.78 ⁇ m. Therefore, at least one of the line width W and the thickness t is preferably 7 ⁇ m or more, which is approximately twice ⁇ ′, in order to suppress the propagation loss in the power supply line 30. Further, at least one of the line width W and the thickness t is more preferably 10 ⁇ m or more.
  • the mesh spacing G of the mesh-like conductor is required to be sufficiently smaller than the effective wavelength ⁇ g of the used frequency in order to suppress the propagation loss in the conductor and maintain the signal quality.
  • FIG. 10 is a diagram for explaining the relationship between the amplitude change amount and the phase change amount in a sine wave simulating a high frequency signal.
  • the amplitude variation ⁇ of the high frequency propagating through the mesh spacing G which is sufficiently smaller than the effective wavelength ⁇ g is preferably 5% of the peak value. It is preferable that the amount of phase change ⁇ at that time be equal to or less than ⁇ .
  • the mesh spacing of the internal linear conductors 37 is G
  • the following formula is satisfied.
  • the mesh spacing G is the pitch between adjacent meshes or the distance between the centers of gravity of adjacent meshes.
  • the mesh spacing G shown in FIG. 9 represents the pitch between adjacent meshes.
  • ⁇ eff is an effective relative permittivity and is approximately represented by the following equation.
  • L w represents the line width of the strip conductor of the microstrip line.
  • the propagation loss generated in the power supply line 30 is In order to suppress it, it is preferable to set the mesh interval G to 444 ⁇ m or less. Further, the mesh spacing G is more preferably 400 ⁇ m or less, further preferably 350 ⁇ m or less.

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Abstract

This substrate is provided with: a dielectric layer that transmits visible light and that has a first surface and a second surface on the opposite side from the first surface; a mesh-like antenna conductor provided on the first surface side; and a mesh-like ground conductor provided on the second surface side. For example, mesh-like signal wiring is provided on the dielectric layer, and the signal wiring supplies electrical power to the antenna conductor. Also provided is a substrate having a transmission line formed thereon, said substrate being provided with a dielectric layer that transmits visible light and a mesh-like ground conductor provided on the dielectric layer. The transmission line has a structure that includes the dielectric layer and the ground conductor.

Description

基板substrate
　本発明は、基板に関する。 The present invention relates to a substrate.
　従来、意匠上、光透過性を有するように、メッシュ状に形成されたアンテナエレメントを備える透明なフレキシブル回路基板が知られている（例えば、特許文献１参照）。 Conventionally, there is known a transparent flexible circuit board including an antenna element formed in a mesh shape so as to have a light-transmitting property in design (for example, refer to Patent Document 1).
特開２０１１－２０５６３５号公報JP, 2011-205635, A
　しかしながら、従来の技術では、グランド以外の領域はメッシュ状とし、グランドはソリッドとするため、グランドの大きさによっては、可視光の透過がグランドによって遮られ、可視光の透過性が低下する場合がある。 However, in the conventional technique, the region other than the ground is formed in a mesh shape, and the ground is solid. Therefore, depending on the size of the ground, the transmission of visible light may be blocked by the ground, and the transparency of visible light may be reduced. is there.
　そこで、本開示は、可視光の透過性の低下を抑制可能な基板を提供する。 Therefore, the present disclosure provides a substrate capable of suppressing a decrease in visible light transmittance.
　本開示は、
　第１面と、前記第１面とは反対側の第２面とを有し、可視光が透過する誘電体層と、
　前記第１面の側に設けられる網目状のアンテナ導体と、
　前記第２面の側に設けられる網目状の接地導体とを備える、基板を提供する。 This disclosure is
A dielectric layer having a first surface and a second surface opposite to the first surface, the dielectric layer transmitting visible light;
A mesh-shaped antenna conductor provided on the first surface side;
A substrate is provided that includes a mesh-shaped ground conductor provided on the second surface side.
　また、本開示は、
　伝送線路が形成される基板であって、
　可視光が透過する誘電体層と、
　前記誘電体層の上に設けられる網目状の接地導体とを備え、
　前記伝送線路は、前記誘電体層と前記接地導体とを含む構造を有する、基板を提供する。 In addition, the present disclosure
A substrate on which a transmission line is formed,
A dielectric layer that transmits visible light,
A grounded conductor in a mesh shape provided on the dielectric layer,
The transmission line provides a substrate having a structure including the dielectric layer and the ground conductor.
　本開示の技術によれば、可視光の透過性の低下を抑制可能な基板を提供できる。 According to the technology of the present disclosure, it is possible to provide a substrate capable of suppressing a decrease in visible light transmittance.
第１の実施形態における基板の平面図である。It is a top view of the substrate in a 1st embodiment. 第１の実施形態における基板に形成される伝送線路、アンテナ導体及び接地導体を平面視で示す図である。It is a figure which shows the transmission line, the antenna conductor, and the grounding conductor formed in the board | substrate in 1st Embodiment by planar view. 接地導体の網目が正六角形である場合の、伝送線路、アンテナ導体及び接地導体を平面視で示す図である。It is a figure which shows a transmission line, an antenna conductor, and a grounding conductor in planar view when the mesh of a grounding conductor is a regular hexagon. 第２の実施形態における基板の平面図である。It is a top view of the substrate in a 2nd embodiment. 第２の実施形態における基板に形成される伝送線路、アンテナ導体及び接地導体を平面視で示す図である。It is a figure which shows the transmission line, the antenna conductor, and the grounding conductor formed in the board | substrate in 2nd Embodiment by planar view. 接地導体及び接地導体の網目が正六角形である場合の、伝送線路、アンテナ導体及び接地導体を平面視で示す図である。It is a figure which shows a transmission line, an antenna conductor, and a grounding conductor in planar view when a grounding conductor and the mesh of a grounding conductor are regular hexagons. 外縁線状導体のＨ面方向（Ｘ軸方向）に対向する２辺の線幅が、他の２辺の線幅よりも太く形成されている場合の、伝送線路、アンテナ導体及び接地導体を平面視で示す図である。When the line width of two sides of the outer edge linear conductor facing in the H-plane direction (X-axis direction) is formed to be thicker than the line width of the other two sides, the transmission line, the antenna conductor, and the ground conductor are flat. FIG. 第３の実施形態における基板に形成される伝送線路、アンテナ導体及び接地導体を斜視で示す図である。It is a figure which shows the transmission line, the antenna conductor, and the grounding conductor formed in the board | substrate in 3rd Embodiment by a perspective. 相互に交差する複数の線状導体を含む網目状の導体の平面図である。FIG. 6 is a plan view of a mesh-shaped conductor including a plurality of linear conductors that intersect each other. 正弦波の振幅変化量と位相変化量との関係を説明するための図である。It is a figure for demonstrating the relationship between the amount of amplitude changes of a sine wave, and the amount of phase changes.
　以下、図面を参照して、本開示に係る実施形態の説明を行う。なお、各形態において、平行、直角、直交、水平、垂直、上下、左右などの方向には、本発明の効果を損なわない程度のずれが許容される。また、Ｘ軸方向、Ｙ軸方向、Ｚ軸方向は、それぞれ、Ｘ軸に平行な方向、Ｙ軸に平行な方向、Ｚ軸に平行な方向を表す。Ｘ軸方向とＹ軸方向とＺ軸方向は、互いに直交する。ＸＹ平面、ＹＺ平面、ＺＸ平面は、それぞれ、Ｘ軸方向及びＹ軸方向に平行な仮想平面、Ｙ軸方向及びＺ軸方向に平行な仮想平面、Ｚ軸方向及びＸ軸方向に平行な仮想平面を表す。 Hereinafter, embodiments according to the present disclosure will be described with reference to the drawings. In addition, in each of the embodiments, a deviation such as a parallel, a right angle, a right angle, a horizontal direction, a vertical direction, a vertical direction, a horizontal direction, and the like is allowed to the extent that the effect of the present invention is not impaired. Further, the X-axis direction, the Y-axis direction, and the Z-axis direction respectively represent a direction parallel to the X-axis, a direction parallel to the Y-axis, and a direction parallel to the Z-axis. The X-axis direction, the Y-axis direction, and the Z-axis direction are orthogonal to each other. An XY plane, a YZ plane, and a ZX plane are a virtual plane parallel to the X-axis direction and the Y-axis direction, a virtual plane parallel to the Y-axis direction and the Z-axis direction, and a virtual plane parallel to the Z-axis direction and the X-axis direction, respectively. Represents.
　本実施形態における基板は、例えば、マイクロ波やミリ波等の高周波帯（例えば、０．３ＧＨｚ～３００ＧＨｚ）の信号の伝播に使用される。そのような高周波帯には、０．３～３ＧＨｚのＵＨＦ帯、３～３０ＧＨｚのＳＨＦ帯、３０～３００ＧＨｚのＥＨＦ帯が含まれる。本実施形態における基板に形成される高周波デバイスの具体例として、平面アンテナ、平面導波路（平面伝送線路）などが挙げられる。 The substrate in the present embodiment is used to propagate a signal in a high frequency band (for example, 0.3 GHz to 300 GHz) such as a microwave or a millimeter wave. Such high frequency bands include the UHF band of 0.3 to 3 GHz, the SHF band of 3 to 30 GHz, and the EHF band of 30 to 300 GHz. Specific examples of the high frequency device formed on the substrate in the present embodiment include a planar antenna and a planar waveguide (planar transmission line).
　本実施形態における基板は、例えば、第５世代移動通信システム（いわゆる、５Ｇ）、ブルートゥース（登録商標）等の無線通信規格、ＩＥＥＥ８０２．１１ａｃ等の無線ＬＡＮ（Local Area Network）規格で使用されてもよい。また、本実施形態における基板は、車両で使用される場合、レーダーを照射する車載レーダーシステムや車車間通信や路車間通信等のＶ２Ｘ通信システムで使用されてもよい。 The board according to the present embodiment may be used in a wireless communication standard such as a fifth generation mobile communication system (so-called 5G), Bluetooth (registered trademark), or a wireless LAN (Local Area Network) standard such as IEEE802.11ac. Good. When used in a vehicle, the substrate according to the present embodiment may be used in a vehicle-mounted radar system that radiates radar or a V2X communication system such as vehicle-to-vehicle communication or road-to-vehicle communication.
　図１は、第１の実施形態における基板の平面図である。図１に示す基板１には、平面アンテナ１０１が形成されている。基板１は、可視光が透過する誘電体層４０と、誘電体層４０の片面に設けられるアンテナ導体１０と、誘電体層４０を介してアンテナ導体１０と対向する接地導体２０と、アンテナ導体１０に給電する給電ライン３０とを備える。平面アンテナ１０１は、パッチアンテナ又はマイクロストリップアンテナと称される。 FIG. 1 is a plan view of a substrate according to the first embodiment. A planar antenna 101 is formed on the substrate 1 shown in FIG. The substrate 1 includes a dielectric layer 40 that transmits visible light, an antenna conductor 10 provided on one surface of the dielectric layer 40, a ground conductor 20 that faces the antenna conductor 10 with the dielectric layer 40 in between, and an antenna conductor 10. And a power supply line 30 for supplying power to the. The planar antenna 101 is called a patch antenna or a microstrip antenna.
　図２は、第１の実施形態における基板に形成される伝送線路、アンテナ導体及び接地導体を平面視で示す図である。基板１に形成される伝送線路６０は、誘電体層４０と、誘電体層４０の第１面に形成される給電ライン３０と、誘電体層４０の第２面に形成される接地導体２０とを含む構造を有するマイクロストリップ線路である。 FIG. 2 is a plan view showing the transmission line, the antenna conductor, and the ground conductor formed on the substrate according to the first embodiment. The transmission line 60 formed on the substrate 1 includes the dielectric layer 40, the feeding line 30 formed on the first surface of the dielectric layer 40, and the ground conductor 20 formed on the second surface of the dielectric layer 40. It is a microstrip line having a structure including.
　誘電体層４０は、第１主面４１と、第１主面４１とは反対側の第２主面４２とを有する。図２の上段は、誘電体層４０の第１主面４１の側に設けられるアンテナ導体１０及び給電ライン３０を示す。図２の下段は、誘電体層４０の第２主面４２の側に設けられる接地導体２０を示す。第１主面４１は、誘電体層の第１面の一例である。第２主面４２は、誘電体層の第１面とは反対側の第２面の一例である。 The dielectric layer 40 has a first main surface 41 and a second main surface 42 opposite to the first main surface 41. The upper part of FIG. 2 shows the antenna conductor 10 and the feed line 30 provided on the side of the first main surface 41 of the dielectric layer 40. The lower part of FIG. 2 shows the ground conductor 20 provided on the second main surface 42 side of the dielectric layer 40. The first major surface 41 is an example of the first surface of the dielectric layer. The second main surface 42 is an example of a second surface of the dielectric layer opposite to the first surface.
　誘電体層４０は、誘電体を主成分とする板状又はシート状の基材である。第１主面４１及び第２主面４２は、いずれも、ＸＹ平面に平行である。誘電体層４０は、例えば、誘電体基板でもよいし、誘電体シートでもよい。誘電体層４０の材料は、例えば、石英ガラス、ソーダライムガラス、無アルカリガラス、アルミノシリケートガラス、ホウケイ酸ガラス、アルカリホウケイ酸ガラス等のガラス、セラミックス、ポリテトラフルオロエチレン等のフッ素系樹脂、液晶ポリマー、シクロオレフィンポリマー、ポリカーボネートなどが挙げられるが、その材料は、これらに限られない。 The dielectric layer 40 is a plate-shaped or sheet-shaped base material containing a dielectric material as a main component. Both the first main surface 41 and the second main surface 42 are parallel to the XY plane. The dielectric layer 40 may be, for example, a dielectric substrate or a dielectric sheet. The material of the dielectric layer 40 is, for example, quartz glass, soda lime glass, non-alkali glass, aluminosilicate glass, borosilicate glass, glass such as alkali borosilicate glass, ceramics, fluorine resin such as polytetrafluoroethylene, liquid crystal. Polymers, cycloolefin polymers, polycarbonates and the like, but the materials are not limited to these.
　また、誘電体層４０の材料は、可視光が透過する透明な誘電体部材であればよく、透明には、半透明が含まれる。誘電体層４０の可視光線透過率は、可視光の遮りを抑える点で、例えば３０％以上が好ましく、５０％以上がより好ましく、７０％以上がさらに好ましく、８０％以上が特に好ましく、９０％以上が最も好ましい。 Further, the material of the dielectric layer 40 may be any transparent dielectric member that transmits visible light, and the transparency includes translucent. The visible light transmittance of the dielectric layer 40 is, for example, preferably 30% or more, more preferably 50% or more, further preferably 70% or more, particularly preferably 80% or more, and particularly preferably 90% from the viewpoint of suppressing blocking of visible light. The above is the most preferable.
　アンテナ導体１０は、その表面がＸＹ平面に平行な平面状の導体パターンである。アンテナ導体１０は、第１主面４１の側に形成される導体パターンであり、第１主面４１の側に配置される導体シート又は導体基板により形成されてもよい。アンテナ導体１０に使用される導体の材料として、例えば、金、銀、銅、白金、アルミニウム、クロムなどが挙げられるが、これらに限られない。アンテナ導体１０に使用される導体は、これらの材料をメッキしてもよい。メッキされたアンテナ導体１０は、腐食しにくく、意匠性がよい。 The antenna conductor 10 is a planar conductor pattern whose surface is parallel to the XY plane. The antenna conductor 10 is a conductor pattern formed on the first main surface 41 side, and may be formed by a conductor sheet or a conductor substrate arranged on the first main surface 41 side. Examples of the material of the conductor used for the antenna conductor 10 include, but are not limited to, gold, silver, copper, platinum, aluminum and chromium. The conductor used for the antenna conductor 10 may be plated with these materials. The plated antenna conductor 10 is resistant to corrosion and has good design.
　なお、アンテナ導体１０は、第１主面４１の側に、ポリビニルブチラールもしくはエチレン酢酸ビニル等の中間膜、または光学透明粘着剤（OCA）等の接着層を介して形成されてもよい。また、アンテナ導体１０は、ポリエチレンテレフタレート等の樹脂層に導体を形成し、導体パターンにエッチングしたものを、第１主面４１の側に、光学透明粘着剤（OCA）等の接着層を介して形成されてもよい。アンテナ導体１０は、ポリビニルブチラール、エチレン酢酸ビニル、もしくはポリエチレンテレフタレート等にスパッタ、蒸着などにより導体を形成し、導体パターンにエッチングしたものを、第１主面４１の側に形成されてもよい。アンテナ導体１０は、第１主面４１に直接接してもよい。アンテナ導体１０を第１主面４１に直接形成する方法としては、ペースト状の銀、銅などの導体を第１主面４１にスクリーン印刷により導体パターンを形成し、焼結することが挙げられる。 Note that the antenna conductor 10 may be formed on the side of the first main surface 41 via an intermediate film such as polyvinyl butyral or ethylene vinyl acetate, or an adhesive layer such as an optical transparent adhesive (OCA). In addition, the antenna conductor 10 is obtained by forming a conductor on a resin layer such as polyethylene terephthalate and etching the conductor pattern on the first main surface 41 side through an adhesive layer such as an optical transparent adhesive (OCA). It may be formed. The antenna conductor 10 may be formed by forming a conductor on polyvinyl butyral, ethylene vinyl acetate, polyethylene terephthalate, or the like by sputtering, vapor deposition, or the like, and etching the conductor pattern on the first main surface 41 side. The antenna conductor 10 may be in direct contact with the first major surface 41. As a method of directly forming the antenna conductor 10 on the first main surface 41, paste-like conductors such as silver and copper are formed on the first main surface 41 by screen printing to form a conductor pattern and then sintered.
　アンテナ導体１０は、例えば、少なくとも一つのパッチ導体を有する。第１の実施形態では、アンテナ導体１０は、４つのパッチ導体１１，１２，１３，１４を有するアレイアンテナを構成する例を示す。 The antenna conductor 10 has, for example, at least one patch conductor. The first embodiment shows an example in which the antenna conductor 10 constitutes an array antenna having four patch conductors 11, 12, 13, and 14.
　第１の実施形態では、アンテナ導体１０は、可視光の透過度合いが誘電体層４０よりも低い領域から構成されたソリッドなパターンである。例えば、アンテナ導体１０の全体は、複数のパッチ導体１１～１４を含め、不透明な面状導体から構成されている。 In the first embodiment, the antenna conductor 10 is a solid pattern composed of a region in which the degree of transmission of visible light is lower than that of the dielectric layer 40. For example, the entire antenna conductor 10 is composed of an opaque planar conductor including the plurality of patch conductors 11 to 14.
　給電ライン３０は、その表面がＸＹ平面に平行な平面状の導体パターンである。給電ライン３０は、第１主面４１の側に形成される導体パターンであり、第１主面４１の側に配置される導体シート又は導体基板により形成されてもよい。給電ライン３０に使用される導体の材料として、例えば、金、銀、銅、白金、アルミニウム、クロムなどが挙げられるが、これらに限られない。第１の実施形態では、給電ライン３０は、アンテナ導体１０と一体的に形成されている。給電ライン３０は、誘電体層４０の上に設けられる信号配線の一例である。 The power supply line 30 is a planar conductor pattern whose surface is parallel to the XY plane. The power supply line 30 is a conductor pattern formed on the first main surface 41 side, and may be formed of a conductor sheet or a conductor substrate arranged on the first main surface 41 side. Examples of the material of the conductor used for the power supply line 30 include, but are not limited to, gold, silver, copper, platinum, aluminum and chromium. In the first embodiment, the feeding line 30 is formed integrally with the antenna conductor 10. The power supply line 30 is an example of a signal wiring provided on the dielectric layer 40.
　なお、給電ライン３０は、第１主面４１の側に、ポリビニルブチラールもしくはエチレン酢酸ビニル等の中間膜、または光学透明粘着剤（OCA）等の接着層を介して形成されてもよい。また、給電ライン３０は、ポリエチレンテレフタレート等の樹脂層に導体を形成し、導体パターンにエッチングしたものを、第１主面４１の側に、光学透明粘着剤（OCA）等の接着層を介して形成されてもよい。給電ライン３０は、ポリビニルブチラール、エチレン酢酸ビニル、もしくはポリエチレンテレフタレート等にスパッタ、蒸着などにより導体を形成し、導体パターンにエッチングしたものを、第１主面４１の側に形成されてもよい。給電ライン３０は、第１主面４１に直接接してもよい。給電ライン３０を第１主面４１に直接形成する方法としては、ペースト状の銀、銅などの導体を第１主面４１にスクリーン印刷により導体パターンを形成し、焼結することが挙げられる。 The power supply line 30 may be formed on the side of the first main surface 41 via an intermediate film of polyvinyl butyral or ethylene vinyl acetate, or an adhesive layer of an optical transparent adhesive (OCA) or the like. Further, the power supply line 30 is obtained by forming a conductor on a resin layer such as polyethylene terephthalate and etching the conductor pattern on the first main surface 41 side through an adhesive layer such as an optical transparent adhesive (OCA). It may be formed. The power supply line 30 may be formed by forming a conductor on polyvinyl butyral, ethylene vinyl acetate, polyethylene terephthalate, or the like by sputtering or vapor deposition, and etching the conductor pattern on the first main surface 41 side. The power supply line 30 may be in direct contact with the first main surface 41. As a method of directly forming the power supply line 30 on the first main surface 41, a conductor such as paste-like silver or copper is formed on the first main surface 41 by screen printing to form a conductor pattern and then sintered.
　給電ライン３０は、パッチ導体１１，１２への分岐路とパッチ導体１３，１４への分岐路とが接続される分岐箇所３６に接続される一方の端部３２と、送信機など無線装置等の不図示の外部装置に接続される給電端である他方の端部３３とを有する。第１の実施形態では、給電ライン３０は、Ｙ軸方向に延伸するストリップ導体であり、端部３２がアンテナ導体１０に接続されている。 The power supply line 30 includes one end portion 32 connected to a branch point 36 to which a branch path to the patch conductors 11 and 12 and a branch path to the patch conductors 13 and 14 are connected, and a wireless device such as a transmitter. The other end 33 is a power supply end connected to an external device (not shown). In the first embodiment, the power supply line 30 is a strip conductor extending in the Y-axis direction, and the end portion 32 is connected to the antenna conductor 10.
　第１の実施形態では、給電ライン３０は、可視光の透過度合いが誘電体層４０よりも低い領域から構成されたソリッドなパターンである。例えば、給電ライン３０の全体は、不透明な面状導体から構成されている。 In the first embodiment, the power supply line 30 is a solid pattern composed of a region in which the degree of transmission of visible light is lower than that of the dielectric layer 40. For example, the entire feeding line 30 is made of an opaque planar conductor.
　接地導体２０は、その表面がＸＹ平面に平行な導体パターンである。接地導体２０は、第２主面４２の側に形成される導体パターンであり、第２主面４２の側に配置される導体シート又は導体基板により形成されてもよい。接地導体２０に使用される導体の材料として、例えば、金、銀、銅、白金、アルミニウム、クロムなどが挙げられるが、これらに限られない。接地導体２０に使用される導体は、これらの材料をメッキしてもよい。メッキされた接地導体２０は、腐食しにくく、意匠性がよい。接地導体２０は、誘電体層４０に接している。 The ground conductor 20 is a conductor pattern whose surface is parallel to the XY plane. The ground conductor 20 is a conductor pattern formed on the second main surface 42 side, and may be formed by a conductor sheet or a conductor substrate arranged on the second main surface 42 side. Examples of the material of the conductor used for the ground conductor 20 include, but are not limited to, gold, silver, copper, platinum, aluminum and chromium. The conductor used for the ground conductor 20 may be plated with these materials. The plated ground conductor 20 is resistant to corrosion and has good design. The ground conductor 20 is in contact with the dielectric layer 40.
　なお、接地導体２０は、第２主面４２の側に、ポリビニルブチラールもしくはエチレン酢酸ビニル等の中間膜、または光学透明粘着剤（OCA）等の接着層を介して形成されてもよい。また、接地導体２０は、ポリエチレンテレフタレート等の樹脂層に導体を形成し、導体パターンにエッチングしたものを、第２主面４２の側に、光学透明粘着剤（OCA）等の接着層を介して形成されてもよい。接地導体２０は、ポリビニルブチラール、エチレン酢酸ビニル、もしくはポリエチレンテレフタレート等にスパッタ、蒸着などにより導体を形成し、導体パターンにエッチングしたものを、第２主面４２の側に形成されてもよい。接地導体２０は、第２主面４２に直接接してもよい。接地導体２０を第２主面４２に直接形成する方法としては、ペースト状の銀、銅などの導体を第２主面４２にスクリーン印刷により導体パターンを形成し、焼結することが挙げられる。 The ground conductor 20 may be formed on the second main surface 42 side with an intermediate film such as polyvinyl butyral or ethylene vinyl acetate or an adhesive layer such as an optical transparent adhesive (OCA) interposed therebetween. Further, the ground conductor 20 is obtained by forming a conductor on a resin layer such as polyethylene terephthalate and etching the conductor pattern on the second main surface 42 side through an adhesive layer such as an optical transparent adhesive (OCA). It may be formed. The ground conductor 20 may be formed by forming a conductor on polyvinyl butyral, ethylene vinyl acetate, polyethylene terephthalate, or the like by sputtering or vapor deposition, and etching the conductor pattern on the second main surface 42 side. The ground conductor 20 may be in direct contact with the second major surface 42. As a method of directly forming the ground conductor 20 on the second main surface 42, a paste-like conductor such as silver or copper is formed on the second main surface 42 by screen printing to form a conductor pattern and then sintered.
　接地導体２０は、隙間が生じるように形成される線状接地導体２７と、線状接地導体２７に接続される面状接地導体２６とを有する。面状接地導体２６は、第２主面４２の一端辺に帯状に設けられたグランド部である。面状接地導体２６は、給電端である端部３３に対応するグランド電極である。本実施形態では面状接地導体２６は一端辺の全体に設けられているが、一端辺の一部に設けられてもよい。 The ground conductor 20 has a linear ground conductor 27 formed so as to form a gap and a planar ground conductor 26 connected to the linear ground conductor 27. The planar ground conductor 26 is a ground portion provided in a strip shape on one end side of the second main surface 42. The planar ground conductor 26 is a ground electrode corresponding to the end portion 33 which is a power feeding end. In the present embodiment, the planar ground conductor 26 is provided on the entire one end side, but it may be provided on a part of the one end side.
　面状接地導体２６は、その一部がソリッドなパターンで形成され、残りの部分が網目状のパターンで形成されてもよい。例えば、面状接地導体２６は、平面視において、端部３３に重複する部分をソリッドなパターンで形成され、端部３３に重複しない部分を網目状のパターンで形成されてもよい。 The planar ground conductor 26 may have a part formed in a solid pattern and the remaining part formed in a mesh pattern. For example, the planar ground conductor 26 may have a solid pattern in a portion overlapping the end 33 and a mesh pattern in a portion not overlapping the end 33 in a plan view.
　第１の実施形態では、線状接地導体２７は、隙間が生じるように網目状に形成され、当該隙間によって視野（透明性）を確保できる。第１の実施形態では、格子状の隙間が形成されている。本実施形態では、線状接地導体２７の網目の角度Ａが略９０°であり、網目が直交して形成されているが、網目の角度Ａは鋭角に形成されてもよく、鈍角に形成されてもよい。線状接地導体２７の網目の角度Ａが鈍角に形成されていれば、線状接地導体２７をエッチングにより形成した場合のエッチング残りが生じにくく、開口率を大きくすることができる。網目の角度Ａが鈍角である場合の一例として、図３に示すように、網目を正六角形とすることが挙げられる。 In the first embodiment, the linear ground conductor 27 is formed in a mesh shape so that a gap is created, and the gap can ensure a visual field (transparency). In the first embodiment, lattice-shaped gaps are formed. In the present embodiment, the mesh angle A of the linear ground conductor 27 is approximately 90 °, and the meshes are formed orthogonally, but the mesh angle A may be formed as an acute angle or an obtuse angle. May be. If the mesh angle A of the linear ground conductor 27 is formed to be an obtuse angle, an etching residue is less likely to occur when the linear ground conductor 27 is formed by etching, and the aperture ratio can be increased. As an example of the case where the mesh angle A is an obtuse angle, the mesh may be a regular hexagon as shown in FIG.
　また、線状接地導体２７の網目は方形でもよく、菱形でもよい。網目を方形に形成する場合、網目は正方形であることが好ましい。網目が正方形であれば、意匠性が良い。また、網目は自己組織化法によるランダム形状でもよい。ランダム形状にすることでモアレを防ぐことができる。 Also, the mesh of the linear ground conductor 27 may be square or rhombic. When the mesh is formed in a square shape, the mesh is preferably square. If the mesh is square, the design is good. The mesh may have a random shape by the self-assembly method. Moiré can be prevented by using a random shape.
　本実施形態では、線状接地導体２７の網目は複数の線状導体により形成されているが、複数の線状導体は、給電ライン３０の延伸方向または延伸方向に直交する方向とは、異なる方向に形成されることが好ましい。複数の線状導体が、給電ライン３０の延伸方向または延伸方向に直交する方向とは、異なる方向に形成されていれば、所望の特性インピーダンスが得やすく、良好なアンテナ特性を確保できる。 In the present embodiment, the mesh of the linear ground conductor 27 is formed of a plurality of linear conductors, but the plurality of linear conductors are different from the extending direction of the power supply line 30 or the direction orthogonal to the extending direction. Is preferably formed. If the plurality of linear conductors are formed in a direction different from the extending direction of the power feeding line 30 or the direction orthogonal to the extending direction, a desired characteristic impedance can be easily obtained and good antenna characteristics can be secured.
　第１の実施形態では、接地導体２０は、線状接地導体２７と接し、接地導体２０の外縁を形成する外縁線状導体２８を含む。外縁線状導体２８は、線状接地導体２７を囲んでいる。なお、外縁線状導体２８は、線状接地導体２７の一部を囲むように配置されてもよいが、外縁線状導体２８自体を配置しなくてもよい。外縁線状導体２８配置の有無については、以下の実施形態も同様である。 In the first embodiment, the ground conductor 20 includes an outer edge linear conductor 28 that is in contact with the linear ground conductor 27 and forms an outer edge of the ground conductor 20. The outer edge linear conductor 28 surrounds the linear ground conductor 27. The outer edge linear conductor 28 may be arranged so as to surround a part of the linear ground conductor 27, but the outer edge linear conductor 28 itself may not be arranged. Whether or not the outer edge linear conductor 28 is arranged is the same in the following embodiments.
　第１の実施形態では、図１に示されるように、平面視において、アンテナ導体１０と重複する第１領域２１と、アンテナ導体１０と重複しない第２領域２２に接地導体２０を有する。より具体的に、第１の実施形態では、線状接地導体２７が第１領域２１と第２領域２２の両方に形成されている。なお、接地導体２０は、第２主面４２の一部に形成されてもよいが、第２主面４２の全体に形成されることが好ましい。 In the first embodiment, as shown in FIG. 1, the ground conductor 20 is provided in a first region 21 that overlaps with the antenna conductor 10 and a second region 22 that does not overlap with the antenna conductor 10 in plan view. More specifically, in the first embodiment, the linear ground conductor 27 is formed in both the first region 21 and the second region 22. The ground conductor 20 may be formed on a part of the second main surface 42, but is preferably formed on the entire second main surface 42.
　したがって、本実施形態における基板１は、少なくとも接地導体２０が網目状に形成されているので、可視光を透過する光透過性に優れている。よって、可視光の透過性の低下を抑制できる。例えば、基板１を窓ガラス２００の表面に直接又は間接的に設置した場合、少なくとも接地導体２０が網目状に形成されているので、基板１（特に、接地導体２０）が窓ガラス２００越しの視野を遮ることを抑制できる。 Therefore, the substrate 1 according to the present embodiment has at least the ground conductor 20 formed in a mesh shape, and thus has excellent light transmissivity for transmitting visible light. Therefore, it is possible to suppress a decrease in the transmittance of visible light. For example, when the substrate 1 is directly or indirectly installed on the surface of the window glass 200, at least the ground conductor 20 is formed in a mesh shape, so that the substrate 1 (especially the ground conductor 20) has a field of view through the window glass 200. It is possible to suppress the obstruction.
　なお、本実施形態における基板は、窓ガラスの表面に直接又は間接的に設置される部材でもよいし、窓ガラス自体でもよい。 The substrate in this embodiment may be a member directly or indirectly installed on the surface of the window glass, or the window glass itself.
　図４は、第２の実施形態における基板の平面図である。図４に示す基板２には、平面アンテナ１０２が形成されている。基板２は、可視光が透過する誘電体層４０と、誘電体層４０の片面に設けられるアンテナ導体１０と、誘電体層４０を介してアンテナ導体１０と対向する接地導体２０と、アンテナ導体１０に給電する給電ライン３０とを備える。 FIG. 4 is a plan view of the substrate according to the second embodiment. A planar antenna 102 is formed on the substrate 2 shown in FIG. The substrate 2 includes a dielectric layer 40 that transmits visible light, an antenna conductor 10 provided on one surface of the dielectric layer 40, a ground conductor 20 facing the antenna conductor 10 with the dielectric layer 40 in between, and an antenna conductor 10. And a power supply line 30 for supplying power to the.
　第１の実施形態と同様の構成及び効果についての説明は、上述の実施形態の説明を援用することで省略する。図４に示す第２の実施形態では、アンテナ導体１０及び給電ライン３０の形態が、図１に示す第１の実施形態と異なる。 Description of configurations and effects similar to those of the first embodiment will be omitted by using the description of the above embodiment. In the second embodiment shown in FIG. 4, the configurations of the antenna conductor 10 and the feed line 30 are different from those of the first embodiment shown in FIG.
　図５は、第２の実施形態における基板に形成される伝送線路、アンテナ導体及び接地導体を平面視で示す図である。第２の実施形態では、アンテナ導体１０及び給電ライン３０は、いずれも、可視光の透過度合いが誘電体層４０よりも低い領域を有するパターンを含む。 FIG. 5 is a plan view showing a transmission line, an antenna conductor, and a ground conductor formed on the substrate according to the second embodiment. In the second embodiment, both the antenna conductor 10 and the feed line 30 include a pattern having a region in which the degree of transmission of visible light is lower than that of the dielectric layer 40.
　アンテナ導体１０は、隙間がアンテナ導体１０の内部に生じるように形成される内部線状導体１７を含む。第２の実施形態では、内部線状導体１７は、格子状の隙間が生じるように網目状に形成されている。内部線状導体１７の少なくとも一部は、平面視において、接地導体２０の線状接地導体２７と重複しているが、内部線状導体１７の全てが線状接地導体２７と重複しているとより好ましい。このように、アンテナ導体１０と接地導体２０の両方が、隙間が生じるように線状導体によって形成されているので、視野の確保が更に容易になる。 The antenna conductor 10 includes an internal linear conductor 17 formed so that a gap is formed inside the antenna conductor 10. In the second embodiment, the internal linear conductors 17 are formed in a mesh shape so that lattice-shaped gaps are formed. At least a part of the internal linear conductor 17 overlaps with the linear ground conductor 27 of the ground conductor 20 in a plan view, but when all of the internal linear conductor 17 overlaps with the linear ground conductor 27. More preferable. As described above, since both the antenna conductor 10 and the ground conductor 20 are formed by the linear conductors so as to form the gap, it is easier to secure the visual field.
　本実施形態では、内部線状導体１７の網目の角度Ａが略９０°であり、網目が直交して形成されているが、網目の角度Ａは鋭角に形成されてもよく、鈍角に形成されてもよい。内部線状導体１７の網目の角度Ａが鈍角に形成されていれば、内部線状導体１７をエッチングにより形成した場合のエッチング残りが生じにくく、開口率を大きくすることができる。網目の角度Ａが鈍角である場合の一例として、図６に示すように、網目を正六角形とすることが挙げられる。 In this embodiment, the mesh angle A of the inner linear conductor 17 is approximately 90 °, and the meshes are formed orthogonally, but the mesh angle A may be formed to be an acute angle or an obtuse angle. May be. If the mesh angle A of the internal linear conductor 17 is formed to be an obtuse angle, an etching residue is less likely to occur when the internal linear conductor 17 is formed by etching, and the aperture ratio can be increased. As an example of the case where the mesh angle A is an obtuse angle, as shown in FIG. 6, the mesh may be a regular hexagon.
　また、内部線状導体１７の網目は方形でもよく、菱形でもよい。網目を方形に形成する場合、網目は正方形であることが好ましい。網目が正方形であれば、意匠性が良い。また、網目は自己組織化法によるランダム形状でもよい。ランダム形状にすることでモアレを防ぐことができる。 The mesh of the inner linear conductor 17 may be square or rhombic. When the mesh is formed in a square shape, the mesh is preferably square. If the mesh is square, the design is good. The mesh may have a random shape by the self-assembly method. Moiré can be prevented by using a random shape.
　本実施形態では、内部線状導体１７の網目は複数の線状導体により形成されているが、複数の線状導体は、給電ライン３０の延伸方向または延伸方向に直交する方向とは、異なる方向に形成されることが好ましい。複数の線状導体が、給電ライン３０の延伸方向または延伸方向に直交する方向とは、異なる方向に形成されていれば、所望の特性インピーダンスが得やすく、良好なアンテナ特性を確保できる。 In the present embodiment, the mesh of the internal linear conductor 17 is formed of a plurality of linear conductors, but the plurality of linear conductors are different from the extending direction of the power supply line 30 or the direction orthogonal to the extending direction. Is preferably formed. If the plurality of linear conductors are formed in a direction different from the extending direction of the power feeding line 30 or the direction orthogonal to the extending direction, a desired characteristic impedance can be easily obtained and good antenna characteristics can be secured.
　第２の実施形態では、アンテナ導体１０は、内部線状導体１７と接し、アンテナ導体１０の外縁を形成する外縁線状導体１８を含む。外縁線状導体１８は、内部線状導体１７を囲んで閉じた状態になっている。このように、アンテナ導体１０について、外縁線状導体１８が内部線状導体１７を囲む構成とすることで、第１の実施形態のような面状導体の場合の電流分布との相違を抑制でき、良好なアンテナ特性を確保できる。 In the second embodiment, the antenna conductor 10 includes an outer edge linear conductor 18 that is in contact with the inner linear conductor 17 and forms an outer edge of the antenna conductor 10. The outer edge linear conductor 18 surrounds the inner linear conductor 17 and is in a closed state. As described above, by configuring the antenna conductor 10 so that the outer edge linear conductor 18 surrounds the inner linear conductor 17, it is possible to suppress a difference from the current distribution in the case of the planar conductor as in the first embodiment. , Good antenna characteristics can be secured.
　図７に示すように、外縁線状導体１８のＨ面方向（図７のＸ軸方向）に対向する２辺の線幅は、他の辺の線幅よりも太く形成されてもよい。外縁線状導体１８のＨ面方向（図７のＸ軸方向）に対向する２辺の線幅が他の２辺の線幅よりも太いことにより、導体損が減り、良好なアンテナ特性を確保できる。 As shown in FIG. 7, the line width of the two sides of the outer edge linear conductor 18 facing in the H-plane direction (X-axis direction of FIG. 7) may be formed thicker than the line widths of the other sides. Since the line width of the two sides of the outer edge linear conductor 18 facing in the H-plane direction (X-axis direction in FIG. 7) is thicker than the line widths of the other two sides, conductor loss is reduced and good antenna characteristics are secured. it can.
　給電ライン３０は、隙間が給電ライン３０の内部に生じるように形成される内部線状導体３７を含む。第２の実施形態では、内部線状導体３７は、格子状の隙間が生じるように網目状に形成されている。内部線状導体３７は、平面視において、接地導体２０の線状接地導体２７と重複しなくてもよいが、内部線状導体３７の少なくとも一部は、平面視において、接地導体２０の線状接地導体２７と重複していると好ましく、内部線状導体３７の全てが線状接地導体２７と重複しているとより好ましい。このように、給電ライン３０と接地導体２０の両方が、隙間が生じるように線状導体によって形成されているので、視野の確保が更に容易になる。 The power supply line 30 includes an internal linear conductor 37 formed so that a gap is formed inside the power supply line 30. In the second embodiment, the internal linear conductors 37 are formed in a mesh shape so that lattice-shaped gaps are formed. The inner linear conductor 37 does not have to overlap the linear ground conductor 27 of the ground conductor 20 in a plan view, but at least a part of the inner linear conductor 37 has a linear shape of the ground conductor 20 in a plan view. It is preferable that it overlaps with the ground conductor 27, and it is more preferable that all of the internal linear conductors 37 overlap with the linear ground conductor 27. As described above, since both the power supply line 30 and the ground conductor 20 are formed of linear conductors so that a gap is formed, it is easier to secure the field of view.
　本実施形態では、内部線状導体３７の網目の角度Ａが略９０°であり、網目が直交して形成されているが、網目の角度Ａは鋭角に形成されてもよく、鈍角に形成されてもよい。内部線状導体３７の網目の角度Ａが鈍角に形成されていれば、内部線状導体３７をエッチングにより形成した場合のエッチング残りが生じにくく、開口率を大きくすることができる。網目の角度Ａが鈍角である場合の一例として、図６に示すように、網目を正六角形とすることが挙げられる。 In the present embodiment, the mesh angle A of the inner linear conductor 37 is approximately 90 °, and the meshes are formed orthogonally, but the mesh angle A may be formed as an acute angle or an obtuse angle. May be. If the mesh angle A of the inner linear conductor 37 is formed to be an obtuse angle, an etching residue is less likely to occur when the inner linear conductor 37 is formed by etching, and the aperture ratio can be increased. As an example of the case where the mesh angle A is an obtuse angle, as shown in FIG. 6, the mesh may be a regular hexagon.
　また、内部線状導体３７の網目は方形でもよく、菱形でもよい。網目を方形に形成する場合、網目は正方形であることが好ましい。網目が正方形であれば、意匠性が良い。また、網目は自己組織化法によるランダム形状でもよい。ランダム形状にすることでモアレを防ぐことができる。 The mesh of the inner linear conductor 37 may be square or rhombic. When the mesh is formed in a square shape, the mesh is preferably square. If the mesh is square, the design is good. The mesh may have a random shape by the self-assembly method. Moiré can be prevented by using a random shape.
　本実施形態では、内部線状導体３７の網目は複数の線状導体により形成されているが、複数の線状導体は、給電ライン３０の延伸方向または延伸方向に直交する方向とは、異なる方向に形成されることが好ましい。複数の線状導体が、給電ライン３０の延伸方向または延伸方向に直交する方向とは、異なる方向に形成されていれば、所望の特性インピーダンスが得やすく、良好なアンテナ特性を確保できる。 In the present embodiment, the mesh of the internal linear conductor 37 is formed by a plurality of linear conductors, but the plurality of linear conductors are different from the extending direction of the power supply line 30 or the direction orthogonal to the extending direction. Is preferably formed. If the plurality of linear conductors are formed in a direction different from the extending direction of the power feeding line 30 or the direction orthogonal to the extending direction, a desired characteristic impedance can be easily obtained and good antenna characteristics can be secured.
　第２の実施形態では、給電ライン３０は、内部線状導体３７と接し、給電ライン３０の外縁を形成する外縁線状導体３８を含む。外縁線状導体３８は、内部線状導体３７を囲んで閉じた状態になっている。このように、給電ライン３０について、外縁線状導体３８が内部線状導体３７を囲む構成とすることで、第１の実施形態のような面状導体の場合の電流分布との相違を抑制でき、良好なアンテナ特性を確保できる。 In the second embodiment, the power feeding line 30 includes an outer edge linear conductor 38 that is in contact with the inner linear conductor 37 and forms an outer edge of the power feeding line 30. The outer edge linear conductor 38 surrounds the inner linear conductor 37 and is in a closed state. As described above, in the power supply line 30, the outer edge linear conductor 38 surrounds the inner linear conductor 37, so that the difference from the current distribution in the case of the planar conductor as in the first embodiment can be suppressed. , Good antenna characteristics can be secured.
　第２の実施形態でも、図４に示されるように、平面視において、アンテナ導体１０と重複する第１領域２１と、アンテナ導体１０と重複しない第２領域２２に接地導体２０を有する。第２の実施形態では、線状接地導体２７が第１領域２１と第２領域２２の両方に形成されている。なお、接地導体２０は、第２主面４２の一部に形成されてもよいが、第２主面４２の全体に形成されることが好ましい。 Also in the second embodiment, as shown in FIG. 4, the ground conductor 20 is provided in the first region 21 that overlaps with the antenna conductor 10 and the second region 22 that does not overlap with the antenna conductor 10 in plan view. In the second embodiment, the linear ground conductor 27 is formed in both the first region 21 and the second region 22. The ground conductor 20 may be formed on a part of the second main surface 42, but is preferably formed on the entire second main surface 42.
　図８は、第３の実施形態における基板に形成される伝送線路、アンテナ導体及び接地導体を斜視で示す図である。図８に示す基板４には、平面アンテナ１０４が形成されている。第１および第２の実施形態と同様の構成及び効果についての説明は、上述の実施形態の説明を援用することで省略する。基板４は、可視光が透過する誘電体層４０と、誘電体層４０の片面に設けられるアンテナ導体１０と、誘電体層４０を介してアンテナ導体１０と対向する接地導体２０と、アンテナ導体１０にスロット３１を介して給電する給電ライン３０とを備える。 FIG. 8 is a perspective view showing a transmission line, an antenna conductor, and a ground conductor formed on the substrate according to the third embodiment. A planar antenna 104 is formed on the substrate 4 shown in FIG. Descriptions of configurations and effects similar to those of the first and second embodiments will be omitted by using the description of the above-described embodiments. The substrate 4 includes a dielectric layer 40 that transmits visible light, an antenna conductor 10 provided on one surface of the dielectric layer 40, a ground conductor 20 that faces the antenna conductor 10 with the dielectric layer 40 in between, and an antenna conductor 10. And a power feed line 30 for feeding power through the slot 31.
　基板４に形成される伝送線路６０は、誘電体層４０と、誘電体層４０の第２面に形成される給電ライン３０と、誘電体層４０の第２面に形成される接地導体２０とを含む構造を有するコプレーナ線路である。 The transmission line 60 formed on the substrate 4 includes the dielectric layer 40, the feeding line 30 formed on the second surface of the dielectric layer 40, and the ground conductor 20 formed on the second surface of the dielectric layer 40. It is a coplanar line having a structure including.
　図８において、給電ライン３０及び接地導体２０は、誘電体層４０の第２主面（アンテナ導体１０が形成される第１主面４１の反対側の面）の側に形成されている。給電ライン３０は、並走する一対のギャップと、それらの一対のギャップに挟まれた中心導体（コプレーナ線路の中心導体）とを有する。給電ライン３０の一方の端部に形成されるスロット３１と、第１主面４１の側に形成されるアンテナ導体１０とが高周波的に結合する。 In FIG. 8, the power feed line 30 and the ground conductor 20 are formed on the second main surface (the surface opposite to the first main surface 41 on which the antenna conductor 10 is formed) of the dielectric layer 40. The feed line 30 has a pair of gaps running in parallel and a center conductor (center conductor of the coplanar line) sandwiched between the pair of gaps. The slot 31 formed at one end of the power supply line 30 and the antenna conductor 10 formed on the first main surface 41 side are coupled with each other in terms of high frequency.
　図８に示す形態では、接地導体２０は、隙間が生じるように形成される線状接地導体２７を有し、線状接地導体２７は、隙間が生じるように網目状に形成され、当該隙間によって視野（透明性）を確保できる。なお、給電ライン３０の中心導体とアンテナ導体１０との少なくとも一方が、隙間が生じるように網目状に形成される線状導体を有してもよい。これにより、更なる透明性を確保できる。 In the form shown in FIG. 8, the ground conductor 20 has a linear ground conductor 27 formed so as to form a gap, and the linear ground conductor 27 is formed in a mesh shape so as to form a gap, and is formed by the gap. The field of view (transparency) can be secured. Note that at least one of the center conductor of the power feeding line 30 and the antenna conductor 10 may have a linear conductor formed in a mesh shape so as to form a gap. Thereby, further transparency can be secured.
　ところで、図４等に示す実施形態では、給電ライン３０は、隙間が給電ライン３０の内部に生じるように網目状に形成される内部線状導体３７を含む。図９は、相互に交差する複数の線状導体を含む網目状の導体の平面図である。 By the way, in the embodiment shown in FIG. 4 etc., the power supply line 30 includes an internal linear conductor 37 formed in a mesh shape so that a gap is formed inside the power supply line 30. FIG. 9 is a plan view of a mesh conductor including a plurality of linear conductors intersecting with each other.
　高周波信号が伝搬する内部線状導体３７等の導体で生ずる伝搬損失を抑える点で、当該導体の厚さは、表皮深さ（skin depth）δ以上あることが好ましい。交流電流が導体を流れるとき、電流密度が、導体の表面で比較的高く、表面から離れるほど低くなる現象を表皮効果という。表皮深さδは、電流が表面電流の１／ｅ（約０．３７）に減衰する長さである。導体を伝搬する高周波信号の周波数をｆ、導体の比透磁率をμｒ、真空の透磁率をμ０、導体の導電率をσとするとき、表皮深さδは、
　　δ＝１／√（π・ｆ・μｒ・μ０・σ）
で表される。 The thickness of the conductor is preferably not less than skin depth δ in order to suppress the propagation loss that occurs in the conductor such as the inner linear conductor 37 through which the high frequency signal propagates. A skin effect is a phenomenon in which when an alternating current flows through a conductor, the current density is relatively high on the surface of the conductor and decreases with increasing distance from the surface. The skin depth δ is the length at which the current decays to 1 / e (about 0.37) of the surface current. When the frequency of the high-frequency signal propagating through the conductor is f, the relative permeability of the conductor is μ r , the permeability of the vacuum is μ 0 , and the conductivity of the conductor is σ, the skin depth δ is
δ = 1 / √ (π ・ f ・ μ r・ μ 0・ σ)
It is represented by.
　給電ライン３０を網目状とした場合、給電ライン３０の表面抵抗が低下する。給電ライン３０を網目状にすることによる給電ライン３０の表面抵抗の低下を、導電率σが１／１０に低下したと擬似的に仮定し、この場合の表皮深さをδ'とする。高周波電流が網目状の導体の抵抗性を強く感じることなく効率的に流れる（つまり、伝搬損失を抑える）ためには、内部線状導体３７の線路幅Ｗ及び厚さｔは、表皮深さδ'の２倍以上であることが好ましい。厚さｔは、Ｚ軸方向の長さである。内部線状導体３７の線路幅Ｗ及び厚さｔは、表皮深さδ'の３倍以上であることがより好ましい。 When the power supply line 30 has a mesh shape, the surface resistance of the power supply line 30 decreases. It is assumed that the decrease in the surface resistance of the power feeding line 30 due to the meshing of the power feeding line 30 is that the conductivity σ is reduced to 1/10, and the skin depth in this case is δ ′. In order for the high-frequency current to flow efficiently (that is, to suppress the propagation loss) without strongly feeling the resistance of the mesh-shaped conductor, the line width W and the thickness t of the inner linear conductor 37 are determined by the skin depth δ. It is preferable that it is more than twice. The thickness t is the length in the Z-axis direction. The line width W and the thickness t of the inner linear conductor 37 are more preferably three times or more the skin depth δ ′.
　つまり、内部線状導体３７の線路幅をＷ、周波数をｆ、周波数ｆにおける表皮深さをδ'、内部線状導体３７の比透磁率をμｒ、真空の透磁率をμ０、内部線状導体３７の導電率をσ、σ０．１＝０．１×σとするとき、以下の式が成立することが好ましい。以下の式が成立することで、給電ライン３０で生ずる伝搬損失を抑制できる。 That is, the line width of the inner linear conductor 37 is W, the frequency is f, the skin depth at the frequency f is δ ′, the relative magnetic permeability of the inner linear conductor 37 is μ r , the magnetic permeability of the vacuum is μ 0 , the inner line is When the electric conductivity of the conductor 37 is σ, σ 0.1 = 0.1 × σ, it is preferable that the following formula is satisfied. By satisfying the following equation, it is possible to suppress the propagation loss generated in the power feeding line 30.
Figure JPOXMLDOC01-appb-M000005
  
Figure JPOXMLDOC01-appb-M000005
  
　また、内部線状導体３７の厚さをｔ、周波数をｆ、周波数ｆにおける表皮深さをδ'、内部線状導体３７の比透磁率をμｒ、真空の透磁率をμ０、内部線状導体３７の導電率をσ、σ０．１＝０．１×σとするとき、以下の式が成立することが好ましい。以下の式が成立することで、給電ライン３０で生ずる伝搬損失を抑制できる。 Further, the thickness of the inner linear conductor 37 is t, the frequency is f, the skin depth at the frequency f is δ ′, the relative magnetic permeability of the inner linear conductor 37 is μ r , the magnetic permeability of the vacuum is μ 0 , the inner line is When the electric conductivity of the conductor 37 is σ, σ 0.1 = 0.1 × σ, it is preferable that the following formula is satisfied. By satisfying the following equation, it is possible to suppress the propagation loss generated in the power feeding line 30.
Figure JPOXMLDOC01-appb-M000006
  
Figure JPOXMLDOC01-appb-M000006
  
　一例として、周波数３ＧＨｚにおいて材質が銅の場合の給電ライン３０の表皮深さδは、約１．２μｍである。この場合の表皮深さδ'は、約３．７８μｍである。したがって、線路幅Ｗと厚さｔの少なくとも一方は、給電ライン３０での伝搬損失を抑える点で、δ'の約２倍の７μｍ以上であることが好ましい。また、線路幅Ｗと厚さｔの少なくとも一方は、１０μｍ以上であることがより好ましい。 As an example, the skin depth δ of the power supply line 30 when the material is copper at a frequency of 3 GHz is about 1.2 μm. The skin depth δ ′ in this case is about 3.78 μm. Therefore, at least one of the line width W and the thickness t is preferably 7 μm or more, which is approximately twice δ ′, in order to suppress the propagation loss in the power supply line 30. Further, at least one of the line width W and the thickness t is more preferably 10 μm or more.
　また、網目状の導体の網目間隔Ｇは、その導体での伝搬損失を抑え、また信号品質を維持するため、使用周波数の実効波長λｇに対して、十分に小さいことが要求される。 Further, the mesh spacing G of the mesh-like conductor is required to be sufficiently smaller than the effective wavelength λ g of the used frequency in order to suppress the propagation loss in the conductor and maintain the signal quality.
　図１０は、高周波信号を模擬した正弦波において、振幅変化量と位相変化量との関係を説明するための図である。例えば、信号の挙動を安定させ信号品質を維持するためには、実効波長λｇに対して十分に小さい網目間隔Ｇを、伝搬する高周波の振幅変化量Δが波高値の好ましくは５％であるときにおける位相変化量θ以下にすることが好ましい。 FIG. 10 is a diagram for explaining the relationship between the amplitude change amount and the phase change amount in a sine wave simulating a high frequency signal. For example, in order to stabilize the signal behavior and maintain the signal quality, the amplitude variation Δ of the high frequency propagating through the mesh spacing G which is sufficiently smaller than the effective wavelength λ g is preferably 5% of the peak value. It is preferable that the amount of phase change θ at that time be equal to or less than θ.
　つまり、内部線状導体３７の網目間隔をＧ、伝搬する高周波の実効波長をλｇ、ｘ＝０．０５とするとき、以下の式が成立することが好ましい。以下の式が成立することで、給電ライン３０および平面アンテナ１０２で生ずる信号の挙動の乱れを抑制できる。網目間隔Ｇは、隣り合う網目間のピッチ、又は、隣り合う網目の重心間の距離である。図９に示す網目間隔Ｇは、隣り合う網目間のピッチを表す。 That is, when the mesh spacing of the internal linear conductors 37 is G, the effective wavelength of the propagating high frequency is λ g , and x = 0.05, it is preferable that the following formula is satisfied. By satisfying the following equation, it is possible to suppress the disturbance of the behavior of the signal generated in the feed line 30 and the planar antenna 102. The mesh spacing G is the pitch between adjacent meshes or the distance between the centers of gravity of adjacent meshes. The mesh spacing G shown in FIG. 9 represents the pitch between adjacent meshes.
Figure JPOXMLDOC01-appb-M000007
  
Figure JPOXMLDOC01-appb-M000007
  
　一例として、使用する周波数ｆが３ＧＨｚの場合を考える。 As an example, consider the case where the frequency f used is 3 GHz.
　伝搬媒体が真空の場合の波長λ０は、真空中の光速をＣ０（＝３．０×１０８［ｍ／ｓ］）とすると、
　　　λ０＝Ｃ０／ｆ＝１００ｍｍ
である。 The wavelength λ 0 in the case where the propagation medium is a vacuum is C 0 (= 3.0 × 10 8 [m / s]), where C 0 is the speed of light in a vacuum.
λ 0 = C 0 / f = 100 mm
Is.
　伝搬媒体を誘電体基板とする場合、厚さｈが３ｍｍで比誘電率εｒが４の誘電体基板を利用するマイクロストリップ線路では、実効波長λｇは、
　　　λｇ＝λ０／√εｅｆｆ＝５５．８ｍｍ
である。ここで、εｅｆｆは実効比誘電率であり、近似的に下式で表される。下式において、Ｌｗは、マイクロストリップ線路のストリップ導体の線路幅を表す。 When the propagation medium is a dielectric substrate, in a microstrip line that uses a dielectric substrate having a thickness h of 3 mm and a relative permittivity ε r of 4, the effective wavelength λ g is
λ g = λ 0 / √ε eff = 55.8 mm
Is. Here, ε eff is an effective relative permittivity and is approximately represented by the following equation. In the following equation, L w represents the line width of the strip conductor of the microstrip line.
Figure JPOXMLDOC01-appb-M000008
  
Figure JPOXMLDOC01-appb-M000008
  
　したがって、上記式によれば、使用する周波数ｆが３ＧＨｚにおいて、厚さが３ｍｍで比誘電率εｒが４の誘電体層４０を利用する伝送線路６０の場合、給電ライン３０で生ずる伝搬損失を抑制するには、網目間隔Ｇを４４４μｍ以下にすることが好ましい。また、網目間隔Ｇは、４００μｍ以下がより好ましく、３５０μｍ以下がさらに好ましい。 Therefore, according to the above formula, in the case where the frequency f to be used is 3 GHz, in the case of the transmission line 60 utilizing the dielectric layer 40 having a thickness of 3 mm and a relative permittivity ε r of 4, the propagation loss generated in the power supply line 30 is In order to suppress it, it is preferable to set the mesh interval G to 444 μm or less. Further, the mesh spacing G is more preferably 400 μm or less, further preferably 350 μm or less.
　また、可視光の透過性（透明性）を確保するためには、網目状の導体の線路幅Ｗは、狭く、網目間隔Ｇは広いことが望ましい。透明性を確保するためには、開口率が光透過率に近似する指標であると仮定すると、網目状の導体の開口率は、好ましくは８０％、より好ましくは９０％であることが望ましい。 Also, in order to ensure the transparency (transparency) of visible light, it is desirable that the line width W of the mesh-shaped conductor be narrow and the mesh interval G be wide. In order to ensure transparency, assuming that the aperture ratio is an index close to the light transmittance, the aperture ratio of the mesh conductor is preferably 80%, more preferably 90%.
　つまり、内部線状導体３７の線路幅をＷ、内部線状導体３７の網目間隔をＧとするとき、開口率（＝（Ｇ－Ｗ）２／Ｇ２）は、以下の式を満たすことが好ましい。 That is, when the line width of the inner linear conductor 37 is W and the mesh spacing of the inner linear conductor 37 is G, the aperture ratio (= (GW) 2 / G 2 ) may satisfy the following equation. preferable.
Figure JPOXMLDOC01-appb-M000009
  
 
Figure JPOXMLDOC01-appb-M000009
  
 
　一例として、「Ｗが７μｍ以上、Ｇが４４４μｍ以下」という条件を満たす開口率を計算すると、以下の表に記載の数値が得られる。 As an example, when calculating the aperture ratio that satisfies the condition of "W is 7 μm or more and G is 444 μm or less", the numerical values shown in the table below are obtained.
Figure JPOXMLDOC01-appb-T000010
Figure JPOXMLDOC01-appb-T000010
　表１から、可視光の透過性（透明性）を確保するためには、Ｗは４０μｍ以下、網目間隔Ｇは１００μｍ以上であることが好ましい。Ｗは２０μｍ以下がより好ましく、１５μｍ以下がさらに好ましい。Ｇは２００μｍ以上がより好ましく、２５０μｍ以上がさらに好ましい。 From Table 1, in order to secure the transparency (transparency) of visible light, it is preferable that W is 40 μm or less and the mesh spacing G is 100 μm or more. W is more preferably 20 μm or less, further preferably 15 μm or less. G is more preferably 200 μm or more, further preferably 250 μm or more.
　以上、基板を実施形態により説明したが、本発明は上記の実施形態に限定されるものではない。他の実施形態の一部又は全部との組み合わせや置換などの種々の変形及び改良が、本発明の範囲内で可能である。 The substrate has been described above by the embodiment, but the present invention is not limited to the above embodiment. Various modifications and improvements, such as combination with some or all of the other embodiments and substitution, are possible within the scope of the present invention.
　例えば、信号配線、アンテナ導体及び接地導体のうちの少なくとも一つは、可視光の透過度合いが、誘電体層に比べて低く又は高くてもよく、誘電体層と同じでもよい。 For example, at least one of the signal wiring, the antenna conductor, and the ground conductor may have a lower or higher degree of visible light transmission than the dielectric layer, or may be the same as the dielectric layer.
　また、アンテナ導体の外形は、円形等の他の外形でもよい。また、アンテナ導体は、給電ピンやスルーホール等の他の給電ラインによって給電されてもよい。 Also, the outer shape of the antenna conductor may be another outer shape such as a circle. Further, the antenna conductor may be fed by another feeding line such as a feeding pin or a through hole.
　本国際出願は、２０１８年１１月６日に出願した日本国特許出願第２０１８－２０８７６５号及び２０１９年６月５日に出願した日本国特許出願第２０１９－１０５６２７号に基づく優先権を主張するものであり、両出願の全内容を本国際出願に援用する。 This international application claims priority based on Japanese Patent Application No. 2018-208765 filed on November 6, 2018 and Japanese Patent Application No. 2019-105627 filed on June 5, 2019. The entire contents of both applications are incorporated into this international application.
１～５　基板
１０　アンテナ導体
１１～１４　パッチ導体
１７　内部線状導体
１８　外縁線状導体
２０　接地導体
２１　第１領域
２２　第２領域
２７　線状接地導体
２８　外縁線状導体
３０　給電ライン
３１　スロット
３２，３３　端部
３６　分岐箇所
３７　内部線状導体
３８　外縁線状導体
４０　誘電体層
４１　第１主面
４２　第２主面
６０　伝送線路
１０１，１０２，１０４　平面アンテナ
２００　窓ガラス 1 to 5 substrate 10 antenna conductors 11 to 14 patch conductor 17 inner linear conductor 18 outer edge linear conductor 20 ground conductor 21 first region 22 second region 27 linear ground conductor 28 outer edge linear conductor 30 feeding line 31 slot 32, 33 end part 36 branch point 37 inner linear conductor 38 outer edge linear conductor 40 dielectric layer 41 first main surface 42 second main surface 60 transmission lines 101, 102, 104 planar antenna 200 window glass

Claims (17)

  1. 　第１面と、前記第１面とは反対側の第２面とを有し、可視光が透過する誘電体層と、
    　前記第１面の側に設けられる網目状のアンテナ導体と、
    　前記第２面の側に設けられる網目状の接地導体とを備える、基板。     A dielectric layer having a first surface and a second surface opposite to the first surface, the dielectric layer transmitting visible light;
    A mesh-shaped antenna conductor provided on the first surface side;
    A substrate, comprising: a mesh-shaped ground conductor provided on the second surface side.
  2. 　前記接地導体は、平面視において、前記アンテナ導体と重複する第１領域と、前記アンテナ導体と重複しない第２領域に配置される、請求項１に記載の基板。 The substrate according to claim 1, wherein the ground conductor is arranged in a first region that overlaps with the antenna conductor and a second region that does not overlap with the antenna conductor in plan view.
  3. 　前記誘電体層の上に設けられる網目状の信号配線を備え、
    　前記信号配線は、前記アンテナ導体に給電する、請求項１又は２に記載の基板。     A mesh-shaped signal wiring provided on the dielectric layer,
    The substrate according to claim 1, wherein the signal wiring feeds the antenna conductor.
  4. 　前記信号配線は、前記第１面の側に形成される、請求項３に記載の基板。 The board according to claim 3, wherein the signal wiring is formed on the side of the first surface.
  5. 　前記信号配線は、マイクロストリップ線路のストリップ導体である、請求項３または４に記載の基板。 The board according to claim 3 or 4, wherein the signal wiring is a strip conductor of a microstrip line.
  6. 　前記信号配線は、前記第２面の側に形成される、請求項３に記載の基板。 The board according to claim 3, wherein the signal wiring is formed on the second surface side.
  7. 　前記信号配線は、コプレーナ線路の中心導体である、請求項３又は６に記載の基板。 The board according to claim 3 or 6, wherein the signal wiring is a central conductor of a coplanar line.
  8. 　前記信号配線は、前記信号配線の外縁を形成する外縁線状導体を含む、請求項３から７のいずれか一項に記載の基板。 The board according to any one of claims 3 to 7, wherein the signal wiring includes an outer edge linear conductor that forms an outer edge of the signal wiring.
  9. 　前記アンテナ導体は、前記アンテナ導体の外縁を形成する外縁線状導体を含む、請求項３から８のいずれか一項に記載の基板。 The board according to any one of claims 3 to 8, wherein the antenna conductor includes an outer edge linear conductor that forms an outer edge of the antenna conductor.
  10. 　伝送線路が形成される基板であって、
    　可視光が透過する誘電体層と、
    　前記誘電体層の上に設けられる網目状の接地導体とを備え、
    　前記伝送線路は、前記誘電体層と前記接地導体とを含む構造を有する、基板。     A substrate on which a transmission line is formed,
    A dielectric layer that transmits visible light,
    A grounded conductor in a mesh shape provided on the dielectric layer,
    The substrate, wherein the transmission line has a structure including the dielectric layer and the ground conductor.
  11. 　前記誘電体層の上に設けられる網目状の信号配線を備え、
    　前記伝送線路は、前記信号配線をさらに含む構造を有する、請求項１０に記載の基板。     A mesh-shaped signal wiring provided on the dielectric layer,
    The substrate according to claim 10, wherein the transmission line has a structure further including the signal wiring.
  12. 　前記伝送線路は、マイクロストリップ線路である、請求項１１に記載の基板。 The board according to claim 11, wherein the transmission line is a microstrip line.
  13. 　前記伝送線路は、コプレーナ線路である、請求項１１に記載の基板。 The board according to claim 11, wherein the transmission line is a coplanar line.
  14. 　前記信号配線は、網目を形成する線状導体を含み、
    　前記線状導体の線路幅をＷ、周波数をｆ、周波数ｆにおける表皮深さをδ'、前記線状導体の比透磁率をμｒ、真空の透磁率をμ０、前記線状導体の導電率をσ、σ０．１＝０．１×σとするとき、以下の式が成立する、請求項３から８，１１から１３のいずれか一項に記載の基板。
    Figure JPOXMLDOC01-appb-M000001
         The signal wiring includes a linear conductor forming a mesh,
    The line width of the linear conductor is W, the frequency is f, the skin depth at the frequency f is δ ′, the relative permeability of the linear conductor is μ r , the magnetic permeability of vacuum is μ 0 , and the conductivity of the linear conductor is The substrate according to any one of claims 3 to 8 and 11 to 13, wherein the following expressions hold when the ratio is σ, σ 0.1 = 0.1 × σ.
    Figure JPOXMLDOC01-appb-M000001
  15. 　前記信号配線は、網目を形成する線状導体を含み、
    　前記線状導体の厚さをｔ、周波数をｆ、周波数ｆにおける表皮深さをδ'、前記線状導体の比透磁率をμｒ、真空の透磁率をμ０、前記線状導体の導電率をσ、σ０．１＝０．１×σとするとき、以下の式が成立する、請求項３から８，１１から１４のいずれか一項に記載の基板。
    Figure JPOXMLDOC01-appb-M000002
         The signal wiring includes a linear conductor forming a mesh,
    The thickness of the linear conductor is t, the frequency is f, the skin depth at the frequency f is δ ′, the relative permeability of the linear conductor is μ r , the magnetic permeability of the vacuum is μ 0 , and the conductivity of the linear conductor is The substrate according to any one of claims 3 to 8 and 11 to 14, wherein the following expressions hold when the ratio is σ, σ 0.1 = 0.1 × σ.
    Figure JPOXMLDOC01-appb-M000002
  16. 　前記信号配線は、網目を形成する線状導体を含み、
    　前記線状導体の網目間隔をＧ、伝搬する波の実効波長をλｇ、ｘ＝０．０５とするとき、以下の式が成立する、請求項３から８，１１から１５のいずれか一項に記載の基板。
    Figure JPOXMLDOC01-appb-M000003
         The signal wiring includes a linear conductor forming a mesh,
    16. When the mesh spacing of the linear conductor is G, the effective wavelength of the propagating wave is λ g , and x = 0.05, the following formulas are satisfied: The substrate according to.
    Figure JPOXMLDOC01-appb-M000003
  17. 　前記信号配線は、網目を形成する線状導体を含み、
    　前記線状導体の線路幅をＷ、前記線状導体の網目間隔をＧとするとき、以下の式が成立する、請求項３から８，１１から１６のいずれか一項に記載の基板。
    Figure JPOXMLDOC01-appb-M000004
         The signal wiring includes a linear conductor forming a mesh,
    The substrate according to any one of claims 3 to 8 and 11 to 16, wherein when the line width of the linear conductor is W and the mesh spacing of the linear conductor is G, the following expressions are established.
    Figure JPOXMLDOC01-appb-M000004
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JP2002511691A (en) * 1998-04-15 2002-04-16 ハラダ・インダストリーズ（ヨーロッパ）リミテッド Patch antenna
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EP4002579A3 (en) * 2020-11-20 2022-08-10 u-blox AG Gnss antenna
US11929541B2 (en) 2020-11-20 2024-03-12 U-Blox Ag GNSS antenna

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