CN112886263A - Scattering film and electronic equipment - Google Patents

Abstract

The embodiment of the invention provides a scattering film and electronic equipment, wherein the scattering film comprises a conductive layer, a plurality of through holes penetrating through the conductive layer are formed in the conductive layer, electromagnetic waves can pass through the through holes, the aperture of each through hole is smaller than the wavelength of the electromagnetic waves passing through the through hole, when the electromagnetic waves pass through the through holes of the conductive layer, diffraction occurs, the electromagnetic waves generate transmission paths in multiple directions through diffraction, the space range of electromagnetic wave emission is enlarged, the function of scattering the electromagnetic waves is realized, and communication dead zones are avoided as far as possible; the number and/or the aperture of the through holes in at least one preset direction of the conductive layer are/is in a continuous change trend, the preset direction is any direction in the surface of the conductive layer, the diffraction of electromagnetic waves is enhanced, and the space range of the emission of the electromagnetic waves is further enlarged.

Description

Scattering film and electronic equipment

Technical Field

The invention relates to the technical field of communication, in particular to a scattering film and electronic equipment.

Background

Electromagnetic wave communication is communication using electromagnetic waves having a wavelength between 0.1 mm and 1 m. The frequency range corresponding to the electromagnetic wave of the wavelength band is 300MHz (0.3GHz) -3 THz. Unlike the transmission method of modern communication networks such as coaxial cable communication, optical fiber communication, and satellite communication, electromagnetic wave communication is communication using electromagnetic waves as a medium directly, does not require a solid medium, and can use electromagnetic wave transmission when there is no obstacle in a straight-line distance between two points.

Electromagnetic wave communication has directionality due to the characteristic of linear transmission of electromagnetic waves, and when a user is not in the specified directional area, signals cannot be received, thereby causing a communication blind area.

Disclosure of Invention

The invention aims to provide a scattering film, which can generate scattering after electromagnetic waves pass through a through hole on the scattering film, increase the space range of electromagnetic wave emission and avoid communication blind areas as far as possible.

Another object of the present invention is to provide an electronic apparatus having a wide range of electromagnetic wave signal emission.

In a first aspect, an embodiment of the present invention provides a scattering film, including a conductive layer, where the conductive layer is provided with a plurality of through holes penetrating through the conductive layer, the through holes are capable of passing electromagnetic waves, and an aperture of each through hole is smaller than a wavelength of the electromagnetic waves passing through the through hole;

and the number and/or the aperture of the through holes are in a continuous change trend in at least one preset direction of the conductive layer, wherein the preset direction is any direction in the surface of the conductive layer.

Optionally, the plurality of through holes are arranged in an array on the conductive layer, and the aperture of the through holes in the preset direction has a variation trend of being large in the middle and small on two sides, or being small in the middle and large on two sides.

Optionally, the plurality of through holes are arranged in an array on the conductive layer, and the aperture of the through hole shows a continuously increasing or continuously decreasing trend along the preset direction.

Optionally, the plurality of through holes are arranged in an array on the conductive layer, and the number of the through holes in the preset direction shows a variation trend of more in the middle, less on both sides, or less in the middle, more on both sides.

Optionally, the plurality of through holes are arranged in an array on the conductive layer, and the number of the through holes shows a continuously increasing or continuously decreasing trend along the preset direction.

Optionally, the through hole is filled with a dielectric material capable of transmitting electromagnetic waves.

Optionally, the refractive index of the dielectric material to the incident electromagnetic wave along the preset direction shows a trend of small middle and large two sides.

Optionally, the scattering film further includes a first protrusion structure disposed on the first surface of the conductive layer.

Optionally, the first protrusion structure includes a plurality of protrusions.

Optionally, an insulating layer is disposed on the first surface of the conductive layer, and the first protrusion structure extends into the insulating layer.

Optionally, the scattering film further includes a connection layer disposed on a second surface of the conductive layer, where the second surface is a surface opposite to the first surface.

Optionally, the second surface of the conductive layer is provided with a second protrusion structure extending into the connection layer.

In a second aspect, an embodiment of the present invention provides a scattering film, including a conductive layer, where the conductive layer is provided with a plurality of through holes penetrating through the conductive layer, the through holes are capable of passing electromagnetic waves, and an aperture of each through hole is smaller than a wavelength of the electromagnetic waves passing through the through hole;

the through hole is filled with a dielectric material capable of transmitting electromagnetic waves, the refractive index of the dielectric material to incident electromagnetic waves in at least one preset direction of the conductive layer is in a continuous change trend, and the preset direction is any direction in the surface of the conductive layer.

Optionally, the refractive index of the dielectric material to the incident electromagnetic wave along the preset direction shows a trend of small middle and large two sides.

Optionally, the scattering film further includes a first protrusion structure disposed on the first surface of the conductive layer.

Optionally, the first protrusion structure includes a plurality of protrusions.

Optionally, an insulating layer is disposed on the first surface of the conductive layer, and the first protrusion structure extends into the insulating layer.

Optionally, the scattering film further includes a connection layer disposed on a second surface of the conductive layer, where the second surface is a surface opposite to the first surface.

Optionally, the second surface of the conductive layer is provided with a second protrusion structure extending into the connection layer.

In a third aspect, an embodiment of the present invention provides an electronic device, including the scattering film provided in the first aspect or the second aspect of the present invention, and further including an antenna device, where a surface of the antenna device is connected to the scattering film.

The scattering film provided by the embodiment of the invention comprises a conductive layer, wherein a plurality of through holes penetrating through the conductive layer are formed in the conductive layer, electromagnetic waves can pass through the through holes, the aperture of each through hole is smaller than the wavelength of the electromagnetic waves passing through the through hole, when the electromagnetic waves pass through the through holes of the conductive layer, diffraction occurs, the electromagnetic waves generate transmission paths in multiple directions through diffraction, the space range of electromagnetic wave emission is enlarged, the function of scattering the electromagnetic waves is realized, and communication blind areas are avoided as far as possible; the number and/or the aperture of the through holes in at least one preset direction of the conductive layer are/is in a continuous change trend, the preset direction is any direction in the surface of the conductive layer, diffraction of electromagnetic waves is enhanced, and the space range of electromagnetic wave emission is further enlarged.

Drawings

The invention is explained in more detail below with reference to the figures and examples.

Fig. 1 is a top view of a scattering film according to an embodiment of the present invention;

FIG. 2 is a top view of another diffuser film provided in accordance with embodiments of the present invention;

FIG. 3 is a top view of another diffuser film provided in accordance with embodiments of the present invention;

FIG. 4 is a top view of another diffuser film provided in accordance with embodiments of the present invention;

FIG. 5 is a top view of another diffuser film provided in accordance with embodiments of the present invention;

FIG. 6 is a top view of another diffuser film provided in accordance with embodiments of the present invention;

FIG. 7 is a cross-sectional view of a diffuser film according to an embodiment of the present invention;

FIG. 8 is a cross-sectional view of a diffuser film according to an embodiment of the present invention;

fig. 9 is a cross-sectional view of an electronic device according to an embodiment of the invention;

fig. 10 is a cross-sectional view of another electronic device provided in an embodiment of the invention.

Reference numerals:

110. a conductive layer; 111. a through hole; 112. a dielectric material; 120. a first bump structure; 121. a convex portion; 130. an insulating layer; 140. a connecting layer; 150. a second bump structure; 10. a scattering film; 20. an antenna device; 21. an antenna line; 22. a substrate.

Detailed Description

In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The embodiment of the invention provides a scattering film which comprises a conducting layer, wherein the conducting layer is made of any one metal material or two or more alloy materials of copper, aluminum, titanium, zinc, iron, nickel, chromium, cobalt, silver or gold. The conducting layer is provided with a plurality of through holes penetrating through the conducting layer, the through holes can be used for passing through electromagnetic waves, and the aperture of each through hole is smaller than the wavelength of the electromagnetic waves passing through the through hole. The number and/or the aperture of the through holes in at least one preset direction of the conductive layer are/is in a continuous change trend, and the preset direction is any direction in the surface of the conductive layer.

The scattering film provided by the embodiment of the invention comprises a conductive layer, wherein a plurality of through holes penetrating through the conductive layer are formed in the conductive layer, electromagnetic waves can pass through the through holes, the aperture of each through hole is smaller than the wavelength of the electromagnetic waves passing through the through hole, when the electromagnetic waves pass through the through holes of the conductive layer, diffraction occurs, the electromagnetic waves generate transmission paths in multiple directions through diffraction, the space range of electromagnetic wave emission is enlarged, the function of scattering the electromagnetic waves is realized, and communication blind areas are avoided as far as possible; the number and/or the aperture of the through holes in at least one preset direction of the conductive layer are/is in a continuous change trend, the preset direction is any direction in the surface of the conductive layer, the diffraction of electromagnetic waves is enhanced, and the space range of the emission of the electromagnetic waves is further enlarged.

In order to make the technical solution of the present invention more clearly understood by those skilled in the art, the scattering film provided in the present embodiment is specifically described below with reference to the specific drawings:

fig. 1 is a top view of a scattering film according to an embodiment of the present invention, as shown in fig. 1, the scattering film includes a conductive layer 110, and the conductive layer 110 is made of copper, for example. The conductive layer 110 has a plurality of through holes 111 penetrating the conductive layer 110 for passing electromagnetic waves. The aperture of each through hole 111 is smaller than the wavelength of the electromagnetic wave, so that the electromagnetic wave is incident to the through holes 111 and then is diffracted, the propagation path of the electromagnetic wave which is originally only directionally transmitted is changed, propagation paths in multiple directions are generated through diffraction, and the emission space range of the electromagnetic wave is expanded. Here, the aperture in the present embodiment refers to the maximum value among distances of any two points on the profile of any cross section of the through-hole 111.

The plurality of through holes 111 are arranged in an array, and specifically, the plurality of through holes 111 are arranged in an array along an X direction and a Y direction of the surface of the conductive layer 110, where the X direction may be a length direction of the conductive layer 110, and the Y direction may be a width direction of the conductive layer 110. The apertures of the plurality of through holes 111 exhibit a tendency of large in the middle and small on both sides in a predetermined direction (X direction in fig. 1). Illustratively, as shown in fig. 1, the cross-sectional shape of the through-hole 111 is a circle, and the diameter of the circle cut by an arbitrary section perpendicular to the Z-direction (direction perpendicular to the conductive layer 110) is the same, that is, the through-hole 111 is a cylindrical through-hole, and the hole diameters of the through-holes 111 have a tendency to change in the X-direction with a large center and small sides. By setting the aperture of the through hole 111 to exhibit a trend of large middle and small two sides along the preset direction (X direction in fig. 1), the diffraction of the electromagnetic wave is enhanced, and the spatial range of the electromagnetic wave emission is further increased. In another embodiment, the apertures of the through holes 111 may also exhibit a variation trend of small middle and large two sides along the X direction, which can also achieve the technical effect of the present invention, and the embodiments of the present invention are not described herein again.

It should be noted that, in the above embodiments, the cross-sectional shape of the through hole is not limited, and may be a regular shape such as a circle, a square, or an irregular polygon; in any cross section perpendicular to the Z direction, the cross sections of the same through hole may have the same or different areas, that is, along the Z direction, the aperture of the same through hole may be unchanged or may be changed. In some embodiments of the present invention, in order to facilitate the formation of the through hole, the cross-sectional shape of the through hole may be a regular shape such as a circle, a square, or the like, and the cross-sectional area of the through hole, which is taken perpendicular to the Z-direction, is the same.

Fig. 2 is a top view of another scattering film according to an embodiment of the present invention, and as shown in fig. 2, the scattering film includes a conductive layer 110, and the conductive layer 110 is made of copper, for example. The conductive layer 110 has a plurality of through holes 111 penetrating the conductive layer 110 for passing electromagnetic waves. The aperture of each through hole 111 is smaller than the wavelength of the electromagnetic wave, so that the electromagnetic wave is incident to the through holes 111 and then is diffracted, the propagation path of the electromagnetic wave which is originally only directionally transmitted is changed, propagation paths in multiple directions are generated through diffraction, and the emission space range of the electromagnetic wave is expanded. Here, the aperture in the present embodiment refers to the maximum value among distances of any two points on the profile of any cross section of the through-hole 111.

The plurality of through holes 111 may be arranged in an array, and specifically, the plurality of through holes 111 are arranged in an array along an X direction and a Y direction of the surface of the conductive layer 110, where the X direction may be a length direction of the conductive layer 110, and the Y direction may be a width direction of the conductive layer 110. For example, as shown in fig. 2, the through hole 111 is a cylindrical through hole for example, and the embodiment of the present invention is explained. In the positive direction of X, the hole diameters of the plurality of through holes 111 exhibit a continuously increasing trend. The aperture of the through hole 111 is arranged to show a continuously increasing variation trend along the X direction, so that the diffraction of the electromagnetic wave is enhanced, and the emission space range of the electromagnetic wave is further enlarged. In other embodiments of the present invention, along the positive direction of X, the apertures of the through holes 111 may also exhibit a continuously decreasing trend, which can also achieve the technical effect of the present invention, and the embodiments of the present invention are not described herein again.

It should be noted that, in the above embodiments, the cross-sectional shape of the through hole is not limited, and may be a regular shape such as a circle, a square, or an irregular polygon; in any cross section perpendicular to the Z direction, the cross sections of the same through hole may have the same or different areas, that is, along the Z direction, the aperture of the same through hole may be unchanged or may be changed. In some embodiments of the present invention, in order to facilitate the formation of the through hole, the cross-sectional shape of the through hole may be a regular shape such as a circle, a square, or the like, and the cross-sectional area of the through hole, which is taken perpendicular to the Z-direction, is the same.

Fig. 3 is a top view of another scattering film according to an embodiment of the present invention, and as shown in fig. 3, the scattering film includes a conductive layer 110, and the conductive layer 110 is made of copper, for example. The conductive layer 110 has a plurality of through holes 111 penetrating the conductive layer 110 for passing electromagnetic waves. The aperture of each through hole 111 is smaller than the wavelength of the electromagnetic wave, so that the electromagnetic wave is incident to the through holes 111 and then is diffracted, the propagation path of the electromagnetic wave which is originally only directionally transmitted is changed, propagation paths in multiple directions are generated through diffraction, and the emission space range of the electromagnetic wave is expanded. Here, the aperture in the present embodiment refers to the maximum value among distances of any two points on the profile of any cross section of the through-hole 111.

The plurality of through holes 111 may be arranged in an array, and specifically, the plurality of through holes 111 are arranged in an array along an X direction and a Y direction of the surface of the conductive layer 110, where the X direction may be a length direction of the conductive layer 110, and the Y direction may be a width direction of the conductive layer 110. For example, as shown in fig. 3, the through hole 111 is a cylindrical through hole for example, and the embodiment of the present invention is explained. The plurality of through holes 111 have the same aperture, and the number of the through holes 111 shows a trend of more middle and less two sides along the X direction. That is, the through holes 111 in the middle are arranged more densely along the X direction, and the through holes 111 on both sides are arranged sparsely. The number of the through holes 111 is changed along the X direction, so that the diffraction of electromagnetic waves is enhanced, and the space range of electromagnetic wave emission is further enlarged. It should be noted that, in other embodiments of the present invention, along the X direction, the number of the through holes 111 may also exhibit a variation trend of less middle and more two sides, which can also achieve the technical effect of the present invention, and no further description is given here in the embodiments of the present invention. In addition, along the X direction, the apertures of the through holes 111 may also be unequal, for example, a variation trend of large middle and small two sides, or a variation trend of continuously increasing or continuously decreasing is presented, and the technical effect of the present invention can also be achieved, and the embodiment of the present invention is not described herein again.

It should be noted that, in the above embodiments, the cross-sectional shape of the through hole is not limited, and may be a regular shape such as a circle, a square, or an irregular polygon; in any cross section perpendicular to the Z direction, the cross sections of the same through hole may have the same or different areas, that is, along the Z direction, the aperture of the same through hole may be unchanged or may be changed. In some embodiments of the present invention, in order to facilitate the formation of the through hole, the cross-sectional shape of the through hole may be a regular shape such as a circle, a square, or the like, and the cross-sectional area of the through hole, which is taken perpendicular to the Z-direction, is the same.

Fig. 4 is a top view of another scattering film according to an embodiment of the present invention, and as shown in fig. 4, the scattering film includes a conductive layer 110, and the conductive layer 110 is made of copper, for example. The conductive layer 110 has a plurality of through holes 111 penetrating the conductive layer 110 for passing electromagnetic waves. The aperture of each through hole 111 is smaller than the wavelength of the electromagnetic wave, so that the electromagnetic wave is incident to the through holes 111 and then is diffracted, the propagation path of the electromagnetic wave which is originally only directionally transmitted is changed, propagation paths in multiple directions are generated through diffraction, and the emission space range of the electromagnetic wave is expanded. Here, the aperture in the present embodiment refers to the maximum value among distances of any two points on the profile of any cross section of the through-hole 111.

The plurality of through holes 111 may be arranged in an array, and specifically, the plurality of through holes 111 are arranged in an array along an X direction and a Y direction of the surface of the conductive layer 110, where the X direction may be a length direction of the conductive layer 110, and the Y direction may be a width direction of the conductive layer 110. For example, as shown in fig. 4, the through hole 111 is a cylindrical through hole for example, and the embodiment of the present invention is explained. In the positive direction of X, the apertures of the plurality of through holes 111 exhibit a continuously increasing trend of change, and the number of through holes 111 in the X direction exhibits a continuously decreasing trend of change. By the design, the diffraction of the electromagnetic wave is enhanced, and the space range of the electromagnetic wave emission is further enlarged. It should be noted that, in other embodiments of the present invention, along the X direction, the aperture of the through hole 111 may also be equal, or exhibit a variation trend that the middle is large, the two sides are small, or the middle is small, the two sides are large, or exhibit a continuously decreasing variation trend, which can also achieve the technical effect of the present invention, and no further description is given here in the embodiments of the present invention.

It should be noted that, in the above embodiments, the cross-sectional shape of the through hole is not limited, and may be a regular shape such as a circle, a square, or an irregular polygon; in any cross section perpendicular to the Z direction, the cross sections of the same through hole may have the same or different areas, that is, along the Z direction, the aperture of the same through hole may be unchanged or may be changed. In some embodiments of the present invention, in order to facilitate the formation of the through hole, the cross-sectional shape of the through hole may be a regular shape such as a circle, a square, or the like, and the cross-sectional area of the through hole, which is taken perpendicular to the Z-direction, is the same.

In some embodiments of the present invention, as shown in fig. 1 to 4, on the basis of the above embodiments, the through hole 111 is filled with a dielectric material that can transmit electromagnetic waves. Illustratively, each through hole can be filled with the same dielectric material.

Fig. 5 is a top view of another scattering film according to an embodiment of the present invention, and as shown in fig. 5, the scattering film includes a conductive layer 110, and the conductive layer 110 is made of copper, for example. The conductive layer 110 has a plurality of through holes 111 penetrating the conductive layer 110 for passing electromagnetic waves. The aperture of each through hole 111 is smaller than the wavelength of the electromagnetic wave, so that the electromagnetic wave is incident to the through holes 111 and then is diffracted, the propagation path of the electromagnetic wave which is originally only directionally transmitted is changed, propagation paths in multiple directions are generated through diffraction, and the emission space range of the electromagnetic wave is expanded. Here, the aperture in the present embodiment refers to the maximum value among distances of any two points on the profile of any cross section of the through-hole 111.

The plurality of through holes 111 may be arranged in an array, and specifically, the plurality of through holes 111 are arranged in an array along an X direction and a Y direction of the surface of the conductive layer 110, where the X direction may be a length direction of the conductive layer 110, and the Y direction may be a width direction of the conductive layer 110. For example, as shown in fig. 5, the through hole 111 is a cylindrical through hole for example, and the embodiment of the present invention is explained. The plurality of through holes 111 have the same aperture and are arranged equidistantly in the X direction.

Each through hole 111 is filled with a different dielectric material 112, and for example, the refractive index of the dielectric material 112 filled in each through hole 111 has a tendency of changing from a small middle to a large two sides along the X direction.

In the embodiment of the present invention, along the X direction, the refractive index of the dielectric material 112 filled in each through hole 111 shows a variation trend of being small in the middle and large on both sides, so that the whole conductive layer 110 shows a variation trend of being low in the middle and high on both sides of the refractive index of the electromagnetic wave in the X direction, and the electromagnetic wave is deflected to both sides, thereby realizing the divergence of the electromagnetic wave. Illustratively, iodine crystals, copper oxide, crystal, quartz, polystyrene, sodium chloride, glass, air, glass, sodium chloride, polystyrene, quartz, crystal, copper oxide, iodine crystals are filled in sequence along the X direction. As shown in fig. 5, the filled dielectric material 112 is shaded in the through hole 111, and the higher the shading density is, the higher the refractive index of the dielectric material 112 is.

It should be noted that, in the above embodiments, the cross-sectional shape of the through hole is not limited, and may be a regular shape such as a circle, a square, or an irregular polygon; in any cross section perpendicular to the Z direction, the cross sections of the through holes may have the same or different areas, that is, along the Z direction, the aperture of the same through hole may be unchanged or may be changed. In some embodiments of the present invention, in order to facilitate the formation of the through hole, the cross-sectional shape of the through hole may be a regular shape such as a circle, a square, or the like, and the cross-sectional area of the through hole, which is taken perpendicular to the Z-direction, is the same.

In the above embodiment, the through holes 111 have the same aperture and are equidistantly arranged in the X direction, and the refractive index of the dielectric material filled in each through hole 111 has a tendency of changing with a small middle and large two sides, which is taken as an example, the technical solution of the present invention is described. In other embodiments of the present invention, along the X direction, the apertures of the through holes 111 may also be unequal, for example, exhibiting a variation trend of large middle and small two sides, or exhibiting a variation trend of continuously increasing or continuously decreasing; in the X direction, the through holes 111 may also be arranged in a non-equidistant manner, for example, the number of the through holes 111 shows a trend of changing more in the middle and less on both sides, or a trend of continuously increasing or decreasing the number of the through holes 111, which is not limited herein. Fig. 6 is a cross-sectional view of another scattering film provided in an embodiment of the present invention, as shown in fig. 6, in this embodiment, along the X direction, the apertures of the plurality of through holes 111 have a tendency of changing from small in the middle to large on both sides. The refractive index of the dielectric material filled in each through hole 111 shows a tendency of small change in the middle and large change in the two sides.

Fig. 7 is a cross-sectional view of a scattering film according to an embodiment of the present invention, and fig. 8 is a cross-sectional view of another scattering film according to an embodiment of the present invention, as shown in fig. 7 and fig. 8, in some embodiments of the present invention, the scattering film further includes a first protrusion structure 120, and when an electromagnetic wave is emitted through the first protrusion structure 120, the electromagnetic wave is diffusely reflected, so that a movement path of the electromagnetic wave which is originally transmitted only directionally is changed, and a transmission path in multiple directions is generated through the diffuse reflection, so as to further expand a divergence range of the electromagnetic wave.

For the material for realizing the electromagnetic wave reflection function, the first bump structure 120 made of metal is preferably used in the present invention, but the present invention is not limited thereto, and any material capable of realizing the electromagnetic wave reflection function may be applied to the present invention, and for example, the first bump structure 120 made of alloy may be used. In one embodiment of the present invention, the first bump structure 120 may be a metal bump disposed on the conductive layer 110. The conductive layer 110 and the first protrusion structure 120 are made of the same material, so that the bonding force between the conductive layer and the first protrusion structure 120 can be improved, the first protrusion structure 120 is not easy to fall off, and the service life and the stability of the scattering film are ensured.

Illustratively, the first protrusion structure 120 includes a plurality of protrusions 121 to improve the diffuse reflection effect. The adjacent protrusions 121 may be connected to each other or may be spaced apart from each other. The size of the convex portion 121 is not particularly limited in the present invention, and the plurality of convex portions 121 may be the same size or different sizes.

In the embodiment of the present invention, the shape of the first protrusion structure 120 may have a variety according to actual needs, and may be a regular or irregular solid geometry, which is not limited herein. In some examples, the first protrusion structures 120 are one or more of pointed, inverted conical, granular, dendritic, columnar, and massive in shape. For example, in the example of fig. 7 and 8, the first projection structure 120 is an irregular curved shape.

As shown in fig. 7 and 8, the first surface of the conductive layer 110 is further provided with an insulating layer 130, and the insulating layer 130 has insulating and protecting functions, so that the problem of short circuit caused by contact between the conductive layer 110 and other external electronic components during the use of the scattering film is prevented, and the conductive layer 110 can be protected from being damaged during the use. For example, the insulating layer 130 may be any one of a PPS (Polyphenylene sulfide) film layer, a PEN (Polyethylene terephthalate) film layer, a polyester film layer, a polyimide film layer, a film layer formed after curing an epoxy resin ink, a film layer formed after curing a polyurethane ink, a film layer formed after curing a modified acrylic resin, or a film layer formed after curing a polyimide resin.

In the embodiment of the invention, the first protrusion structure 120 extends into the insulating layer 130, so that the connection reliability between the conductive layer 110 and the insulating layer 130 is improved, and the occurrence of peeling-off between the insulating layer 130 and the conductive layer 110 is prevented. The height of the first bump structure 120 is smaller than the thickness of the insulating layer 130, and the design ensures that the first bump structure 120 extends into the insulating layer 130 but does not extend out of the insulating layer 130, so as to prevent the insulating layer 130 from failing. It should be noted that, when the first protruding structure 120 includes a plurality of protruding portions 121 with different heights, the height of the first protruding structure 120 at this time refers to the highest height of all the protruding portions 121. Illustratively, the thickness of the insulating layer 130 is 1 μm to 25 μm, and the height of the first bump structure 120 is 0.1 μm to 15 μm.

In order to facilitate connection of the diffusion film of the present invention with other components, as shown in fig. 7 and 8, the diffusion film further includes a connection layer 140, and the connection layer 140 is disposed on a second surface of the conductive layer 110, the second surface being a surface opposite to the first surface. Illustratively, the connecting layer 140 is a glue film layer. Through setting up the glued membrane layer, can make the scattering film of this embodiment realize being connected with other parts easily. Illustratively, the material used for the adhesive film layer is selected from any one of the following materials: epoxy resin, modified epoxy resin, acrylic acid, modified rubber, thermoplastic polyimide, modified thermoplastic polyimide, polyurethane, polyacrylate, and silicone.

As shown in fig. 7 and 8, the second surface of the conductive layer 110 is further provided with a second protrusion 150 extending into the connection layer 140, so as to improve the connection reliability between the conductive layer 110 and the connection layer 140 and prevent the connection layer 140 and the conductive layer 110 from peeling off. The connection layer 140 covers all the second bump structures 150, and therefore, the height of the second bump structures 150 of the present embodiment is less than or equal to the thickness of the connection layer 140. By the design it is ensured that the second bump structures 150 extend into the connection layer 140, but not out of the connection layer 140. It should be noted that the shapes of the second protrusion structures 150 in fig. 7 and 8 are merely exemplary, and due to differences in process means and parameters, the shapes of the second protrusion structures 150 are regular or irregular solid geometries, for example, the shapes of the second protrusion structures 150 may be one or more of sharp-angled, inverted-tapered, granular, dendritic, columnar, and massive. The second bump structure 150 in the embodiment of the invention is not limited by the shape shown in the drawings and described above, and any second bump structure 150 that is beneficial to improving the connection stability between the connection layer 140 and the conductive layer 110 is within the protection scope of the invention. The shapes of the plurality of second protrusion structures 150 may be the same or different, and the sizes of the second protrusion structures 150 may also be the same or different, that is, the shapes of the plurality of second protrusion structures 150 may be one or more of pointed, inverted conical, granular, dendritic, columnar, and blocky, and the sizes of the plurality of second protrusion structures 150 of the same shape may not be completely the same. In addition, the plurality of second bump structures 150 are continuously or discontinuously distributed on the side of the conductive layer 110 close to the connection layer 140, for example, when the plurality of second bump structures 150 are in a sharp corner shape and are continuously distributed, a regular and periodic three-dimensional indented pattern or an irregular and disordered three-dimensional indented pattern may be formed.

It should be noted that the heights of the plurality of second protruding structures 150 may be different, and in this case, the height of the second protruding structure 150 refers to the highest height of all the second protruding structures 150. The outer surface of the connection layer 140 and the surface of the conductive layer 110 may be a flat surface without undulation or a non-flat surface with gentle undulation, which is not limited in the embodiment of the present invention.

In some embodiments of the present invention, the second bump structure 150 is made of a conductive material, so as to lead out the interference charges accumulated in the conductive layer 110 when the scattering film is used, thereby preventing the accumulation of the interference charges from forming an interference source. Illustratively, the conductive layer 110 and the second bump structure 150 are integrally formed of the same material. When connecting with other components, the second bump structures 150 are pressed to pierce the connection layer 140 and to be grounded, so as to conduct out the interference charges accumulated in the conductive layer 110.

In the embodiment of the present invention, the height of the second bump structures 150 is preferably 0.1 μm to 30 μm, and the thickness of the connection layer 140 is preferably 0.1 μm to 45 μm, so as to ensure that the second bump structures 150 can pierce the connection layer 140 when the diffuser film is used, thereby ensuring that the diffuser film can be grounded.

In order to adapt to more application scenes, the scattering film disclosed by the invention is of a flexible, foldable and bendable structure. Specifically, the conductive layer 110 may be a flexible structure, for example, an FPC board, and the connection layer 140 for connection provided on one surface of the conductive layer 110 may have bendability, and the insulation layer 130 for protection provided on the other surface of the conductive layer 110 may also have bendability, so that the diffusion film of the present invention may have foldable and bendable performance. In actual use, the scattering film may be bent or folded into any shape such as a ring structure or a semi-closed structure, for example, an arc structure, an oval structure, or a stacked structure, as required.

An electronic device is further provided in an embodiment of the present invention, fig. 9 is a cross-sectional view of an electronic device provided in an embodiment of the present invention, fig. 10 is a cross-sectional view of another electronic device provided in an embodiment of the present invention, and as shown in fig. 9 and fig. 10, the electronic device includes a scattering film 10 and an antenna apparatus 20. The antenna device 20 includes an antenna line 21 and a substrate 22 on which the antenna line 21 is disposed. The scattering film 10 includes a conductive layer 110, and a plurality of through holes 111 penetrating the conductive layer 110 are formed on the conductive layer 110 to allow electromagnetic waves to pass therethrough. The aperture of each through hole 111 is smaller than the wavelength of the electromagnetic wave, so that the electromagnetic wave is incident to the through holes 111 and then is diffracted, the propagation path of the electromagnetic wave which is originally only directionally transmitted is changed, propagation paths in multiple directions are generated through diffraction, and the emission space range of the electromagnetic wave is expanded.

The number and/or aperture of the through holes 111 on the conductive layer 110 tends to change continuously along the X direction, which is any direction in the surface of the conductive layer, to enhance the diffraction of electromagnetic waves and further increase the spatial range of the electromagnetic wave emission.

In some embodiments, as shown in FIG. 10, the through-holes are filled with a dielectric material 112 that is transparent to electromagnetic waves. Illustratively, along the X direction, the refractive index of the dielectric material for the incident electromagnetic wave tends to change in a small middle and large two sides, so that the electromagnetic wave is deflected to the two sides, thereby realizing the divergence of the electromagnetic wave.

In some embodiments, as shown in fig. 9 and 10, the scattering film 10 may further include a first protrusion structure 120 and an insulating layer 130 disposed on the first surface of the conductive layer 110, wherein the first protrusion structure 120 protrudes into the insulating layer 130. The diffusion film 10 further includes a second protrusion structure 150 and a connection layer 140 disposed on a second surface of the conductive layer 110, wherein the second protrusion structure 150 protrudes into the connection layer 140, and the second surface is a surface opposite to the first surface.

The connection between the antenna device 20 and the diffusion film 10 is achieved by bonding and connecting one surface of the substrate 22 to the connection layer 140 of the diffusion film 10. By connecting the scattering film 10 to the antenna device 20, the electromagnetic wave signal emitted by the antenna line 21 is diffracted after passing through the through hole 111 of the scattering film, and the electromagnetic wave is deflected to two sides with larger refractive index in the X direction, so that the function of scattering the electromagnetic wave is realized, and the space range of the electromagnetic wave emission is enlarged; in addition, after the diffused electromagnetic wave meets the first protrusion structure 120, diffuse reflection is generated, so that the motion path of the original electromagnetic wave which is only directionally transmitted is changed, transmission paths in multiple directions are generated through diffuse reflection, and the diffusion range of the electromagnetic wave is further expanded.

In the description herein, it is to be understood that the terms "upper", "lower", "right", and the like are based on the orientations and positional relationships shown in the drawings and are used for convenience in description and simplicity in operation, but do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be constructed in a particular operation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used merely for descriptive purposes and are not intended to have any special meaning.

In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be appropriately combined to form other embodiments as will be appreciated by those skilled in the art.

The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.

Claims (15)

1. A scattering film is characterized by comprising a conductive layer, wherein a plurality of through holes penetrating through the conductive layer are formed in the conductive layer, electromagnetic waves can pass through the through holes, and the aperture of each through hole is smaller than the wavelength of the electromagnetic waves passing through the through hole;

and the number and/or the aperture of the through holes are in a continuous change trend in at least one preset direction of the conductive layer, wherein the preset direction is any direction in the surface of the conductive layer.

2. The scattering film as claimed in claim 1, wherein the through holes are arranged in an array on the conductive layer, and the aperture of the through holes along the predetermined direction has a trend of changing from large in the middle to small in the two sides, or from small in the middle to large in the two sides.

3. The scattering film as claimed in claim 1, wherein the through holes are arranged in an array on the conductive layer, and the aperture of the through holes along the predetermined direction has a continuously increasing or decreasing trend.

4. The diffuser film of claim 1, wherein a plurality of the through holes are arranged in an array on the conductive layer, and the number of the through holes along the predetermined direction has a trend of more middle, less two sides, or less middle, more two sides.

5. The diffuser film of claim 1, wherein the plurality of through holes are arranged in an array on the conductive layer, and the number of through holes along the predetermined direction has a continuously increasing or decreasing trend.

6. The scattering film of claim 1, wherein the through holes are filled with a dielectric material that can transmit electromagnetic waves.

7. The scattering film of claim 6, wherein the refractive index of the dielectric material for incident electromagnetic waves along the predetermined direction has a tendency of small in the middle and large on both sides.

8. A scattering film is characterized by comprising a conductive layer, wherein a plurality of through holes penetrating through the conductive layer are formed in the conductive layer, electromagnetic waves can pass through the through holes, and the aperture of each through hole is smaller than the wavelength of the electromagnetic waves passing through the through hole;

the through hole is filled with a dielectric material capable of transmitting electromagnetic waves, the refractive index of the dielectric material to incident electromagnetic waves in at least one preset direction of the conductive layer is in a continuous change trend, and the preset direction is any direction in the surface of the conductive layer.

9. The scattering film of claim 8, wherein the refractive index of the dielectric material for incident electromagnetic waves along the predetermined direction has a tendency of small in the middle and large on both sides.

10. The diffuser film of claim 1 or 8, further comprising a first raised structure disposed on the first surface of the conductive layer.

11. The diffuser film of claim 10, wherein the first raised structure comprises a plurality of raised portions.

12. The diffuser film of claim 10, wherein the first surface of the conductive layer is provided with an insulating layer, and the first raised structures extend into the insulating layer.

13. The diffuser film of claim 10, further comprising a tie layer disposed on a second surface of the conductive layer, the second surface being opposite the first surface.

14. The diffuser film of claim 13, wherein the second surface of the conductive layer is provided with second raised structures extending into the connecting layer.

15. An electronic device comprising the diffuser film of any of claims 1-14, and further comprising an antenna assembly, a surface of the antenna assembly being coupled to the diffuser film.

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