CN112882684A - Packaging structure of quantum random number chip and quantum random number generation method thereof - Google Patents
Packaging structure of quantum random number chip and quantum random number generation method thereof Download PDFInfo
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Abstract
The invention discloses a packaging structure of a quantum random number chip and a quantum random number generation method thereof, wherein the packaging structure comprises: the chip packaging substrate is provided with a first surface and a second surface which are oppositely arranged; a housing secured to the first surface; a quantum entropy source chip, the quantum entropy source chip comprising: the system comprises a spontaneous emission light source module, a first photoelectric detector module and a second photoelectric detector module; the light intensity of the spontaneous radiation beam generated by the spontaneous radiation light source module at a preset divergence angle meets random Poisson distribution; the first photoelectric detector module and the second photoelectric detector module can respectively detect the spontaneous radiation beams reflected by the shell to form two paths of analog signals meeting random Poisson distribution; the analog signal is used to generate quantum random numbers. The technical scheme provided by the invention can utilize the mixed packaging technology of SIP, and can realize the quantum random number chip with low cost, small volume and high stability.
Description
Technical Field
The invention relates to the technical field of quantum random numbers, in particular to a packaging structure of a quantum random number chip and a quantum random number generation method thereof.
Background
Random numbers are one of the important resources of cryptography, and in both classical cryptography and quantum cryptography, their randomness requirements on random numbers are very strict, and even directly determine the security of most cryptosystems. In addition, random numbers are also used extensively outside of cryptography, and play a very important role in gambling, sample statistics, Monte-Carlo simulations, and in some computing sciences.
At present, the generation methods of random numbers can be divided into two main categories based on the characteristics of the generation method and the output sequence: pseudo-random number generators and physical random number generators. The randomness of the physical random-like numbers is based on the randomness of some non-deterministic objective physical phenomena, including atmospheric noise, electronic noise, circuit jitter, and the like, and the random number generators generate random numbers by detecting the results of the physical phenomena. Meanwhile, if the physical phenomena are quantum phenomena, the physical random number generator is changed into a quantum random number generator, and the physical phenomena comprise vacuum fluctuation, phase noise, radiative decay and other equivalent physical processes. Due to quantum mechanical intrinsic randomness of quantum physical process, quantum random numbers are generally considered to have true randomness and cannot be predicted, and the quantum random numbers are an ideal random number generator.
However, the existing quantum random number generator is generally based on a separation optical device system, still has the problems of large volume, high power consumption, high price and the like, and is not widely applied so far.
Disclosure of Invention
In view of this, the present invention provides a Package structure of a quantum random number chip and a quantum random number generating method thereof, where the Package structure can utilize a hybrid Package technology of SIP (System In a Package), and can implement a quantum random number chip with low cost, small volume, and high stability.
In order to achieve the above purpose, the invention provides the following technical scheme:
a packaging structure of a quantum random number chip, the packaging structure comprising:
the chip packaging substrate is provided with a first surface and a second surface which are oppositely arranged;
a housing secured to the first surface;
a quantum entropy source chip disposed on the first surface and located within the housing, the quantum entropy source chip comprising: the system comprises a spontaneous emission light source module, a first photoelectric detector module and a second photoelectric detector module; the first photoelectric detector module and the second photoelectric detector module are symmetrically arranged on two sides of the spontaneous radiation light source module; the spontaneous radiation light source module generates a spontaneous radiation beam, and the light intensity of the spontaneous radiation beam at a preset divergence angle meets random Poisson distribution; the first photoelectric detector module and the second photoelectric detector module can respectively detect the spontaneous radiation beams reflected by the shell to form two paths of analog signals meeting random Poisson distribution; the analog signal is used to generate quantum random numbers.
Preferably, in the above package structure, the spontaneous emission light source module is an LED electro-optic diode chip, or a VCSEL laser chip, or a SLED superradiation electro-optic diode chip;
the first and second photodetector modules are any one of photodiode chips, photo-triode chips and CMOS image sensor chips;
the chip packaging substrate is a multilayer PCB (printed Circuit Board) or a multilayer ceramic substrate;
the casing is the metal tube shell, the internal surface of metal tube shell is dull polish surface.
Preferably, in the above package structure, the first surface is further provided with a control chip connected to the quantum entropy source chip, and the control chip is configured to generate the quantum random number by using the two paths of analog signals.
Preferably, in the above package structure, the control chip includes:
the analog front-end module is respectively connected with the first photoelectric detector module and the second photoelectric detector module and is used for carrying out front-end analog processing on the analog signals;
the comparator module is connected with the analog front-end module and is used for converting the two paths of analog signals subjected to front-end analog processing into digital random signals;
and the post-processing module is connected with the comparator module and is used for post-processing the digital random signal so as to optimize the generation result of the digital random signal and output the quantum random number.
Preferably, in the above package structure, the analog front end module includes:
a first analog front terminal module comprising: the first transimpedance amplifier is connected with the first photoelectric detector module and is used for performing transimpedance amplification on the analog signal generated by the first photoelectric detector module; the first filter is connected with the first transimpedance amplifier and is used for filtering a signal output by the first transimpedance amplifier;
a second analog front terminal module comprising: the second transimpedance amplifier is connected with the second photoelectric detector module and is used for performing transimpedance amplification on the analog signal generated by the second photoelectric detector module; and the second filter is connected with the second transimpedance amplifier and is used for filtering the signal output by the second transimpedance amplifier.
Preferably, in the above package structure, the control chip further includes:
the health monitoring module is connected with the comparator module and is used for performing statistical analysis on the digital random signals to determine whether the working state of the quantum entropy source chip meets the requirement or not and sending the analysis result to an upper computer;
the optical chip driving module is respectively connected with the spontaneous radiation light source module, the first photoelectric detector module and the second photoelectric detector module;
and the upper computer is used for adjusting a driving signal of the optical chip driving module according to the analysis result.
Preferably, in the above package structure, the post-processing module is a field programmable gate array module, and is capable of operating a preset compression algorithm and outputting the quantum random number according to a set data format based on the digital random signal.
The invention also provides a quantum random number generation method based on any one of the packaging structures, which comprises the following steps:
generating a spontaneous radiation beam by a spontaneous radiation source module;
the spontaneous radiation beams reflected by the shell are respectively collected through a first photoelectric detector module and a second photoelectric detector module so as to form two paths of analog signals meeting random Poisson distribution;
wherein the light intensity of the spontaneous radiation beam at a preset divergence angle satisfies a random Poisson distribution; the analog signal is used to generate quantum random numbers.
Preferably, the method for generating quantum random numbers further includes:
carrying out front-end simulation processing on the analog signal, and then sending the analog signal to a comparator module;
converting into a digital random signal by the comparator module;
and post-processing the digital random signal through a post-processing module to optimize the generation result of the digital random signal and output the quantum random number.
Preferably, in the above method for generating a quantum random number, the method for performing front-end analog processing on the analog signal includes:
performing trans-impedance amplification and filtering processing on an analog signal which is connected and output by the first photoelectric detector module through a first analog front terminal module;
and performing trans-impedance amplification and filtering processing on the analog signal which is connected and output by the second photoelectric detector module through a second analog front terminal module.
As can be seen from the above description, in the quantum random number chip packaging structure and the quantum random number generation method thereof provided by the technical scheme of the present invention, the SIP hybrid packaging technology is utilized to package the quantum entropy source chip in the chip housing, the spontaneous radiation source module generates the spontaneous radiation beam, the light intensity of the spontaneous radiation beam at the preset divergence angle satisfies the random poisson distribution, the two independent photodetector modules can respectively detect the spontaneous radiation beam reflected by the chip housing, two paths of analog signals satisfying the random poisson distribution are formed, and the quantum random number is generated. By applying the technical scheme provided by the invention, a plurality of relatively independent photoelectric chips can be mixed and packaged by utilizing the mixed packaging technology of the SIP to complete the function of quantum random number generation, so that the quantum random number chip with low cost, small volume and high stability can be realized, and the large-scale application and development of the quantum random number technology are facilitated.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
The structures, proportions, and dimensions shown in the drawings and described in the specification are for illustrative purposes only and are not intended to limit the scope of the present disclosure, which is defined by the claims, but rather by the claims, it is understood that these drawings and their equivalents are merely illustrative and not intended to limit the scope of the present disclosure.
Fig. 1 is a top view of a packaging structure of a quantum random number chip according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view of a quantum random number chip package structure according to an embodiment of the present invention;
fig. 3 is a top view of another quantum random number chip package structure provided in an embodiment of the present invention;
fig. 4 is a cross-sectional view of another quantum random number chip package structure according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a control chip according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of an analog front end module according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of another control chip according to an embodiment of the present invention;
FIG. 8 is a schematic diagram illustrating the principle of noise in the light intensity of an amplified spontaneous emission light source provided in an embodiment of the present invention;
fig. 9 is a flowchart of a quantum random number generation method of a quantum random number chip-based package structure according to an embodiment of the present invention;
fig. 10 is a flowchart of a quantum random number generation method of another quantum random number chip-based package structure according to an embodiment of the present invention;
fig. 11 is a flowchart of a method for performing front-end analog processing on an analog signal according to an embodiment of the present invention.
Detailed Description
Embodiments of the present application will now be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the application are shown, and in which it is to be understood that the embodiments described are merely illustrative of some, but not all, of the embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Random numbers are one of the important resources of cryptography, and in both classical cryptography and quantum cryptography, their randomness requirements on random numbers are very strict, and even directly determine the security of most cryptosystems. In addition, random numbers are also used in a wide variety of applications outside of cryptography, including gambling, sample statistics, Monte-Carlo simulations, and in some computing sciences, all playing a very important role.
At present, the generation methods of random numbers can be divided into two main categories based on the characteristics of the generation method and the output sequence: pseudo-random number generators and physical random number generators. The random number generator can stably output a pseudo-random number sequence at a very fast speed, and the algorithm ensures that the output sequence has certain statistical characteristics. However, since the pseudo random number is generated based on a deterministic algorithm, the source of randomness is only the randomness of the input seed, so that it can be predicted theoretically by performing statistical analysis on the generated random number when it is frequently used.
The physical random numbers are different from each other, and the randomness of the physical random numbers is based on non-deterministic objective physical phenomena, such as atmospheric noise, electronic noise, circuit jitter and the like, and the random number generators generate random numbers by detecting the physical phenomena. Meanwhile, if the physical phenomena are quantum phenomena, the physical random number generator is changed into a quantum random number generator, and the physical phenomena comprise vacuum fluctuation, phase noise, radiative decay and other equivalent physical processes. Due to quantum mechanical intrinsic randomness of quantum physical process, quantum random numbers are generally considered to have true randomness and cannot be predicted, and the quantum random numbers are an ideal random number generator.
With the introduction of this concept, theoretical and experimental work on quantum random number generators has been greatly developed. However, the existing quantum random number generator is generally based on a separation optical device system, still has the problems of large volume, high power consumption, high price and the like, and is not widely applied so far.
SIP is a packaging scheme that integrates multiple functional wafers, including possible processor chips, optical chips, etc., into one package according to application scenarios, in combination with factors such as unique package substrate design, etc., thereby achieving a substantially complete function. By utilizing the mixed packaging technology of SIP, a plurality of relatively independent photoelectric chips can be mixed and packaged to complete the function of quantum random number generation.
Therefore, the present invention provides a packaging structure of a quantum random number chip and a quantum random number generation method thereof, wherein the packaging structure comprises:
the chip packaging substrate is provided with a first surface and a second surface which are oppositely arranged;
a housing secured to the first surface;
a quantum entropy source chip disposed on the first surface and located within the housing, the quantum entropy source chip comprising: the system comprises a spontaneous emission light source module, a first photoelectric detector module and a second photoelectric detector module; the first photoelectric detector module and the second photoelectric detector module are symmetrically arranged on two sides of the spontaneous radiation light source module; the spontaneous radiation light source module generates a spontaneous radiation beam, and the light intensity of the spontaneous radiation beam at a preset divergence angle meets random Poisson distribution; the first photoelectric detector module and the second photoelectric detector module can respectively detect the spontaneous radiation beams reflected by the shell to form two paths of analog signals meeting random Poisson distribution; the analog signal is used to generate quantum random numbers. The predetermined divergence angle is typically 60 degrees to 90 degrees centered on the photosurface of the vertical photodetector module.
As can be seen from the above description, in the quantum random number chip packaging structure and the quantum random number generation method thereof provided by the technical scheme of the present invention, the SIP hybrid packaging technology is utilized to package the quantum entropy source chip in the chip housing, the spontaneous radiation source module generates the spontaneous radiation beam, the light intensity of the spontaneous radiation beam at the preset divergence angle satisfies the random poisson distribution, the two independent photodetector modules can respectively detect the spontaneous radiation beam reflected by the chip housing, two paths of analog signals satisfying the random poisson distribution are formed, and the quantum random number is generated. By applying the technical scheme provided by the invention, a plurality of relatively independent photoelectric chips can be mixed and packaged by utilizing the mixed packaging technology of the SIP to complete the function of quantum random number generation, so that the quantum random number chip with low cost, small volume and high stability can be realized, and the large-scale application and development of the quantum random number technology are facilitated.
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description.
Referring to fig. 1 and 2, fig. 1 is a top view of a packaging structure of a quantum random number chip according to an embodiment of the present invention, and fig. 2 is a cross-sectional view of the packaging structure of the quantum random number chip according to the embodiment of the present invention.
As shown in fig. 1 and 2, the package structure includes:
a chip package substrate 11 having a first surface and a second surface oppositely disposed;
a housing 15 fixed to the first surface; the housing 15 may be a metal tube shell, and the inner surface of the metal tube shell is a frosted surface, which provides a good diffuse reflection effect for the light beam generated by the spontaneous emission light source module 13.
A quantum entropy source chip disposed on the first surface and located within the housing 15, the quantum entropy source chip comprising: a spontaneous emission light source module 13, a first photodetector module 12, and a second photodetector module 14; the first photo-detector module 12 and the second photo-detector module 14 are symmetrically arranged at two sides of the spontaneous emission light source module 13; the spontaneous radiation light source module 13 generates a spontaneous radiation beam, and the light intensity of the spontaneous radiation beam at a preset divergence angle satisfies a random poisson distribution; the first photo-detector module 12 and the second photo-detector module 14 can respectively detect the spontaneous radiation beam reflected by the housing 15, so as to form two paths of analog signals satisfying random poisson distribution; the analog signal is used to generate quantum random numbers.
In the embodiment of the present invention, the spontaneous emission light source module 13 may be an LED electro-optic diode chip, a VCSEL laser chip, or a SLED superradiation electro-optic diode chip.
The first photo-detector module 12 and the second photo-detector module 14 may be any one of a photodiode chip, a photo-triode chip, and a CMOS image sensor chip; wherein the size parameters of the first and second photo- detector modules 12 and 14 satisfy the same condition, i.e. they are the same or substantially the same size.
The chip packaging substrate 11 can be a multilayer PCB (printed circuit board) or a multilayer ceramic substrate; wherein, the first surface of the chip packaging substrate 11 has a pad structure, including a first pad for binding the spontaneous emission light source module 13, and a second pad for binding the first photodetector module 12 and the second photodetector module 14; the second surface has pins 21 for connection to an external circuit. The quantum entropy source chip in combination with external circuitry can be used to generate quantum random numbers.
The spontaneous emission light source module 13 can be connected with the first pad through the wire 10, and in other modes, the spontaneous emission light source module 13 can also be directly welded with the first pad through a pin on the back side. The first photo-detector module 12 and the second photo-detector module 14 may be connected to the corresponding second pads through the conductors 10, and in other manners, the first photo-detector module 12 and the second photo-detector module 14 may also be directly connected to the corresponding second pads through the pins on the back surface.
In the embodiment of the invention, the mixed packaging technology of the SIP is utilized, the mixed packaging of a plurality of relatively independent photoelectric chips can be realized, and the function of generating the quantum random number is completed.
Meanwhile, a complete quantum random number chip can be prepared by using the SIP hybrid package technology, and compared with the quantum random number chip in the above, the quantum random number chip scheme can integrate one or more electronic IC chips and a package structure of a hybrid integrated quantum random number chip in the chip, as shown in fig. 3 and 4.
Referring to fig. 3 and 4, fig. 3 is a top view of another quantum random number chip package structure provided in an embodiment of the present invention, and fig. 4 is a cross-sectional view of another quantum random number chip package structure provided in an embodiment of the present invention. Based on the package structure shown in fig. 1 and fig. 2, a control chip 16 connected to the quantum entropy source chip is further disposed on the first surface of the chip package substrate 11, and the control chip 16 is configured to form two paths of analog signals to generate the quantum random number.
The pad structure further comprises a third pad for binding the control chip 16, and the back of the control chip 16 is provided with a pin for welding with the third pad. The first surface of the chip package substrate 11 has a printed circuit 17, and the pads of the first surface are connected to the printed circuit 17.
Further, as shown in fig. 5, fig. 5 is a schematic structural diagram of a control chip according to an embodiment of the present invention, where the control chip 16 includes:
the analog front-end module 31, where the analog front-end module 31 is connected to the first photodetector module 12 and the second photodetector module 14, respectively, and is configured to perform front-end analog processing on the analog signal;
the comparator module 32, the comparator module 32 is connected to the analog front end module 31, and is configured to convert the two analog signals subjected to front end analog processing into digital random signals; the comparator module 32 may be an analog-to-digital conversion device structure such as a comparator device, a flip-flop device, and the like.
And the post-processing module 33, where the post-processing module 33 is connected to the comparator module 32, and is configured to perform post-processing on the digital random signal to optimize a generation result of the digital random signal and output the quantum random number.
The post-processing module 33 may be a Field Programmable Gate Array (FPGA) module, and may run a hash type preset compression algorithm such as an m-LSB algorithm and a Toeplitz matrix algorithm, and output the quantum random number according to a set data format based on the digital random signal. Such as via I2C or SPI interface protocol outputs.
In the scheme of the invention, because two identical photoelectric detector modules are integrated in a chip, and analog signals generated by the two photoelectric detector modules are independently and identically distributed, a comparator module 32 in a PCB circuit can differentiate common-mode classical noise signals in a detection result, so that the influence of other noises except quantum noise in a random number sequence is reduced.
As shown in fig. 6, fig. 6 is a schematic structural diagram of an analog front end module according to an embodiment of the present invention, where the analog front end module 31 includes:
a first analog front terminal module comprising: a first transimpedance amplifier 41 connected to the first photodetector module 12, configured to perform transimpedance amplification on the analog signal generated by the first photodetector module 12; a first filter 42 connected to the first transimpedance amplifier 41 for filtering a signal output from the first transimpedance amplifier 41;
a second analog front terminal module comprising: a second transimpedance amplifier 43 connected to the second photodetector module 14, configured to perform transimpedance amplification on the analog signal generated by the second photodetector module 14; and a second filter 44 connected to the second transimpedance amplifier 43, and configured to filter the signal output by the second transimpedance amplifier 43.
Based on the control chips shown in fig. 5 and fig. 6, further, as shown in fig. 7, fig. 7 is a schematic structural diagram of another control chip provided in the embodiment of the present invention, and the control chip 16 further includes:
the health monitoring module 51 is connected with the comparator module 32 and is used for performing statistical analysis on the digital random signals to determine whether the working state of the quantum entropy source chip 30 meets the requirement or not and sending the analysis result to an upper computer;
a photo chip driving module 52, wherein the photo chip driving module 52 is connected to the spontaneous emission light source module 13, the first photo detector module 12, and the second photo detector module 14 respectively;
the upper computer is used for adjusting a driving signal of the optical chip driving module 35 according to the analysis result.
It should be noted that, the modules in the control chip 16 may be integrated on the same control chip, or integrated on different chips respectively.
In the embodiment of the invention, the optical chip driving module 52 drives the light source chip to emit light or drives the detection chip to detect, the spontaneous emission light source module generates spontaneous emission beams, the spontaneous emission beams generate light beams with different divergence angles through diffuse reflection of a chip tube shell, the light beams respectively enter two independent photoelectric detector modules to be converted into analog signals, two analog signals respectively meet random poisson distribution, the two analog signals enter the analog front end module 31 to be subjected to trans-impedance amplification, filtering, comparison and other processing to generate digital random signals, the health monitoring module 51 performs processes of entropy estimation and the like on the generated digital random signals and transmits monitoring results to the upper computer, the upper computer adjusts chip driving conditions according to the health monitoring results and judges whether to discard the current random number generation results, if not, the digital random signals enter the comparator module 32 and operate a post-processing algorithm on the digital random signals, so as to optimize the statistical property of the random number and output the quantum random number according to a specific communication protocol.
For the working method of the quantum entropy source chip, the purpose of the quantum entropy source chip is to generate a group of differentiable quantum random noise signals, which contain entropy, i.e. uncertainty, because the signals are random. The reason why the quantum entropy source chip can generate the random analog signal is that when a spontaneous radiation beam is generated by a spontaneous radiation source module such as an LED, the generation of the beam is based on quantum spontaneous radiation, a spontaneous radiation phenomenon can cause that the light intensity of the generated beam to a specific divergence angle is randomly distributed according to poisson distribution, and the principle that the light intensity is randomly jittered due to the spontaneous radiation can be shown in fig. 8, where fig. 8 is a schematic diagram of the principle of amplified spontaneous radiation source light intensity noise provided in the embodiment of the present invention. The ground-state electrons of the semiconductor material in the LED optical chip reach a high-energy level state under the action of an electric pump, and the electrons can fall to a low-energy level in the future due to instability of the high-energy level state, so that photons are emitted, and the time for the electrons to jump from the high-energy level state to the low-energy level state is uncertain, so that the light intensity of the photons emitted by the LED is randomly fluctuated.
In the embodiment of the invention, the packaging structure of the quantum random number chip based on the micro-assembly SIP hybrid integration can reduce the classical noise part in the final quantum random number sequence, and compared with the prior quantum random number generator, the volume, the cost and the power consumption of the prior quantum random number generator can be greatly reduced, thereby being beneficial to greatly widening the use scene of the quantum random number generator and the application market of entropy industry.
As can be seen from the above description, in the packaging structure of the quantum random number chip provided in the technical scheme of the present invention, the SIP hybrid packaging technology is utilized to package the quantum entropy source chip in the chip housing, the spontaneous radiation beam is generated by the spontaneous radiation light source module, the light intensity of the spontaneous radiation beam at the preset divergence angle satisfies the random poisson distribution, the spontaneous radiation beam reflected by the chip housing can be respectively detected by the two independent photodetector modules, two paths of analog signals satisfying the random poisson distribution are formed, and the quantum random number is generated. By applying the technical scheme provided by the invention, a plurality of relatively independent photoelectric chips can be mixed and packaged by utilizing the mixed packaging technology of the SIP to complete the function of quantum random number generation, so that the quantum random number chip with low cost, small volume and high stability can be realized, and the large-scale application and development of the quantum random number technology are facilitated.
Based on the foregoing embodiment, another embodiment of the present invention further provides a quantum random number generating method based on the foregoing package structure, as shown in fig. 9, where fig. 9 is a flowchart of the quantum random number generating method of the package structure based on the quantum random number chip according to the embodiment of the present invention.
The quantum random number generation method comprises the following steps:
step S11: generating a spontaneous radiation beam by a spontaneous radiation source module;
step S12: the spontaneous radiation beams reflected by the shell are respectively collected through a first photoelectric detector module and a second photoelectric detector module so as to form two paths of analog signals meeting random Poisson distribution; wherein the light intensity of the spontaneous radiation beam at a preset divergence angle satisfies a random Poisson distribution; the analog signal is used to generate quantum random numbers.
Based on the above method for generating quantum random number, as shown in fig. 10, fig. 10 is a flowchart of another method for generating quantum random number based on a packaging structure of a quantum random number chip according to an embodiment of the present invention, where the method for generating quantum random number further includes:
step S13: carrying out front-end simulation processing on the analog signal, and then sending the analog signal to a comparator module;
step S14: converting into a digital random signal by the comparator module;
step S15: and post-processing the digital random signal through a post-processing module to optimize the generation result of the digital random signal and output the quantum random number.
As shown in fig. 11, fig. 11 is a flowchart of a method for performing front-end analog processing on an analog signal according to an embodiment of the present invention, where the method for performing front-end analog processing on the analog signal includes:
step S21: performing trans-impedance amplification and filtering processing on an analog signal which is connected and output by the first photoelectric detector module through a first analog front terminal module;
step S22: and performing trans-impedance amplification and filtering processing on the analog signal which is connected and output by the second photoelectric detector module through a second analog front terminal module.
As can be seen from the above description, in the quantum random number generation method of the packaging structure of the quantum random number chip according to the technical scheme of the present invention, the SIP hybrid packaging technology is used to package the quantum entropy source chip in the chip housing, the spontaneous radiation source module generates the spontaneous radiation beam, the light intensity of the spontaneous radiation beam at the preset divergence angle satisfies the random poisson distribution, the two independent photodetector modules can respectively detect the spontaneous radiation beam reflected by the chip housing, two paths of analog signals satisfying the random poisson distribution are formed, and the quantum random number is generated. By applying the technical scheme provided by the invention, a plurality of relatively independent photoelectric chips can be mixed and packaged by utilizing the mixed packaging technology of the SIP to complete the function of quantum random number generation, so that the quantum random number chip with low cost, small volume and high stability can be realized, and the large-scale application and development of the quantum random number technology are facilitated.
The embodiments in the present description are described in a progressive manner, or in a parallel manner, or in a combination of a progressive manner and a parallel manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments can be referred to each other. For the quantum random number generation method disclosed in the embodiment, since it corresponds to the package structure disclosed in the embodiment, the description is relatively simple, and the relevant points can be referred to the package structure part for description.
It should be noted that in the description of the present application, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only used for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be configured and operated in a specific orientation, and thus, should not be construed as limiting the present application. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present.
It is further noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in an article or device that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A packaging structure of a quantum random number chip is characterized in that the packaging structure comprises:
the chip packaging substrate is provided with a first surface and a second surface which are oppositely arranged;
a housing secured to the first surface;
a quantum entropy source chip disposed on the first surface and located within the housing, the quantum entropy source chip comprising: the system comprises a spontaneous emission light source module, a first photoelectric detector module and a second photoelectric detector module; the first photoelectric detector module and the second photoelectric detector module are symmetrically arranged on two sides of the spontaneous radiation light source module; the spontaneous radiation light source module generates a spontaneous radiation beam, and the light intensity of the spontaneous radiation beam at a preset divergence angle meets random Poisson distribution; the first photoelectric detector module and the second photoelectric detector module can respectively detect the spontaneous radiation beams reflected by the shell to form two paths of analog signals meeting random Poisson distribution; the analog signal is used to generate quantum random numbers.
2. The package structure of claim 1, wherein the spontaneous emission light source module is an LED electro-optic diode chip, or a VCSEL laser chip, or a SLED superluminescent electro-optic diode chip;
the first and second photodetector modules are any one of photodiode chips, photo-triode chips and CMOS image sensor chips;
the chip packaging substrate is a multilayer PCB (printed Circuit Board) or a multilayer ceramic substrate;
the casing is the metal tube shell, the internal surface of metal tube shell is dull polish surface.
3. The package structure according to claim 1, wherein the first surface is further provided with a control chip connected to the quantum entropy source chip, and the control chip is configured to generate the quantum random number by using two paths of the analog signals.
4. The package structure of claim 3, wherein the control chip comprises:
the analog front-end module is respectively connected with the first photoelectric detector module and the second photoelectric detector module and is used for carrying out front-end analog processing on the analog signals;
the comparator module is connected with the analog front-end module and is used for converting the two paths of analog signals subjected to front-end analog processing into digital random signals;
and the post-processing module is connected with the comparator module and is used for post-processing the digital random signal so as to optimize the generation result of the digital random signal and output the quantum random number.
5. The package structure of claim 4, wherein the analog front end module comprises:
a first analog front terminal module comprising: the first transimpedance amplifier is connected with the first photoelectric detector module and is used for performing transimpedance amplification on the analog signal generated by the first photoelectric detector module; the first filter is connected with the first transimpedance amplifier and is used for filtering a signal output by the first transimpedance amplifier;
a second analog front terminal module comprising: the second transimpedance amplifier is connected with the second photoelectric detector module and is used for performing transimpedance amplification on the analog signal generated by the second photoelectric detector module; and the second filter is connected with the second transimpedance amplifier and is used for filtering the signal output by the second transimpedance amplifier.
6. The package structure of claim 4, wherein the control chip further comprises:
the health monitoring module is connected with the comparator module and is used for performing statistical analysis on the digital random signals to determine whether the working state of the quantum entropy source chip meets the requirement or not and sending the analysis result to an upper computer;
the optical chip driving module is respectively connected with the spontaneous radiation light source module, the first photoelectric detector module and the second photoelectric detector module;
and the upper computer is used for adjusting a driving signal of the optical chip driving module according to the analysis result.
7. The package structure according to claim 4, wherein the post-processing module is a field programmable gate array module capable of running a predetermined compression algorithm and outputting the quantum random number according to a predetermined data format based on the digital random signal.
8. A quantum random number generation method based on the package structure of any one of claims 1 to 7, wherein the quantum random number generation method comprises:
generating a spontaneous radiation beam by a spontaneous radiation source module;
the spontaneous radiation beams reflected by the shell are respectively collected through a first photoelectric detector module and a second photoelectric detector module so as to form two paths of analog signals meeting random Poisson distribution;
wherein the light intensity of the spontaneous radiation beam at a preset divergence angle satisfies a random Poisson distribution; the analog signal is used to generate quantum random numbers.
9. The quantum random number generation method of claim 8, further comprising:
carrying out front-end simulation processing on the analog signal, and then sending the analog signal to a comparator module;
converting into a digital random signal by the comparator module;
and post-processing the digital random signal through a post-processing module to optimize the generation result of the digital random signal and output the quantum random number.
10. The method of claim 9, wherein the method of front-end analog processing of the analog signal comprises:
performing trans-impedance amplification and filtering processing on an analog signal which is connected and output by the first photoelectric detector module through a first analog front terminal module;
and performing trans-impedance amplification and filtering processing on the analog signal which is connected and output by the second photoelectric detector module through a second analog front terminal module.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114281303A (en) * | 2021-11-30 | 2022-04-05 | 宁波普瑞均胜汽车电子有限公司 | Method and device for generating true random number |
| CN115498498A (en) * | 2022-11-16 | 2022-12-20 | 合肥硅臻芯片技术有限公司 | Packaging structure of quantum random number chip and generation method of quantum random number |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000305753A (en) * | 1999-04-16 | 2000-11-02 | Takeshi Saito | Physical random number generating device |
| CN105975248A (en) * | 2016-05-24 | 2016-09-28 | 富尧 | Quantum random number generator based on amplified spontaneous emission and generation method |
| KR20180102472A (en) * | 2017-03-07 | 2018-09-17 | 에스케이텔레콤 주식회사 | Apparatus for generating random number based on quantum shot noise |
| US20190205100A1 (en) * | 2016-10-21 | 2019-07-04 | Trentino Sviluppo Spa | Improved Random Number Generator, in Particular Improved True Random Number Generator |
-
2021
- 2021-02-20 CN CN202110192389.4A patent/CN112882684A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000305753A (en) * | 1999-04-16 | 2000-11-02 | Takeshi Saito | Physical random number generating device |
| CN105975248A (en) * | 2016-05-24 | 2016-09-28 | 富尧 | Quantum random number generator based on amplified spontaneous emission and generation method |
| US20190205100A1 (en) * | 2016-10-21 | 2019-07-04 | Trentino Sviluppo Spa | Improved Random Number Generator, in Particular Improved True Random Number Generator |
| KR20180102472A (en) * | 2017-03-07 | 2018-09-17 | 에스케이텔레콤 주식회사 | Apparatus for generating random number based on quantum shot noise |
Non-Patent Citations (1)
| Title |
|---|
| 聂友奇;张军;: "实用化量子随机数发生器研究进展", 信息安全研究, no. 01 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114281303A (en) * | 2021-11-30 | 2022-04-05 | 宁波普瑞均胜汽车电子有限公司 | Method and device for generating true random number |
| CN114281303B (en) * | 2021-11-30 | 2024-05-17 | 宁波普瑞均胜汽车电子有限公司 | Method and device for generating true random number |
| CN115498498A (en) * | 2022-11-16 | 2022-12-20 | 合肥硅臻芯片技术有限公司 | Packaging structure of quantum random number chip and generation method of quantum random number |
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