CN112873585B - Nozzle of crystal bar band saw machine - Google Patents
Nozzle of crystal bar band saw machine Download PDFInfo
- Publication number
- CN112873585B CN112873585B CN202110035685.3A CN202110035685A CN112873585B CN 112873585 B CN112873585 B CN 112873585B CN 202110035685 A CN202110035685 A CN 202110035685A CN 112873585 B CN112873585 B CN 112873585B
- Authority
- CN
- China
- Prior art keywords
- liquid
- nozzle
- flow distribution
- cavity
- distribution plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention provides a nozzle of a crystal bar band sawing machine, which comprises a shell, a liquid inlet, a liquid outlet, a flow distribution plate and a layered plate, wherein the nozzle can change the shape of liquid discharged from the liquid outlet, can attach a layer of uniformly distributed banded liquid film on a band saw, and can avoid the phenomenon that nonuniform fluid is changed into irregular flow beams when the band saw runs at a high speed and cuts a crystal bar, so that a wafer with good flatness can be obtained, the probability of generating defects such as edge lines, cracks and the like on the surface of the wafer is reduced, the manpower and material resources are saved, the product quality is improved, and the cost is reduced.
Description
Technical Field
The invention belongs to the field of semiconductor equipment, and relates to a nozzle of a crystal bar band sawing machine.
Background
Semiconductor devices are manufactured by cutting a wafer from a crystal bar, and currently, a band saw is generally used in the market to cut the crystal bar to obtain the wafer. The band saw machine is generally composed of a machine body, a support frame, a band saw, a liquid supply nozzle, an adjusting wheel and the like. During operation, the crystal bar is fixed on the support frame, the band saw cuts the crystal bar under the action of high-speed operation, and the liquid supply nozzle sprays cooling liquid to continuously cool the blade of the band saw which operates at high speed so as to realize the effects of lubrication, temperature reduction and pollution discharge, thereby obtaining the wafer.
In a traditional band saw machine, the shape of a liquid supply nozzle is usually circular, when a crystal bar is cut, due to the shape of the liquid supply nozzle, the shape of cooling liquid sprayed out of the liquid supply nozzle is in a columnar shape, and when the cooling liquid in the columnar shape is sprayed onto a band saw, an annular water ring can be formed, and due to the fact that acting force on the surface of the band saw is uneven (a central area is larger than an edge area), the cooling liquid can run at an accelerated speed along with the high-speed running of the band saw to form a bundle of uneven water layer cutters and form an irregular flow wire bundle, so that when the band saw cuts the crystal bar, flatness is poor easily caused, and defects such as edge lines and cracks exist on the surface of a cut wafer.
Therefore, it is necessary to provide a nozzle for a crystal bar band saw.
Disclosure of Invention
In view of the above disadvantages of the prior art, an object of the present invention is to provide a nozzle of a crystal bar band saw machine, which is used to solve the problem that the nozzle of the crystal bar band saw machine in the prior art is difficult to form a liquid film with uniform thickness on the surface of a band saw, so that the surface of a cut wafer has defects such as ridge lines, cracks, etc.
To achieve the above and other related objects, the present invention provides a nozzle for a crystal bar band sawing machine, comprising:
the shell is provided with an accommodating cavity, the shell is in a plane symmetry pattern, and in an X-axis coordinate system, a Y-axis coordinate system and a Z-axis coordinate system with an origin O, the symmetry plane of the shell is an XOY plane and an XOZ plane;
the liquid inlet is communicated with the accommodating cavity;
the liquid outlet is communicated with the accommodating cavity and is arranged corresponding to the liquid inlet, and the central line of the liquid outlet and the central line of the liquid inlet are coincided to be used as the X axis;
the flow distribution plate is positioned in the accommodating cavity and comprises a first flow distribution plate and a second flow distribution plate which are symmetrically distributed along the X axis, the width of a flow distribution plate inlet close to the liquid inlet is smaller than that of a flow distribution plate outlet close to the liquid outlet, and a space is reserved between the flow distribution plate inlet and the liquid inlet;
and the layering plate is positioned in the containing cavity and arranged in parallel with the Y axis, and the layering plate is positioned between the outlet of the flow distribution plate and the liquid outlet.
Optionally, from the liquid inlet to the extending direction of the liquid outlet, the accommodating cavity comprises a first cavity, a second cavity and a third cavity which are sequentially communicated, the height of the first cavity is sequentially reduced, the height of the second cavity is sequentially increased, and the height of the third cavity is sequentially reduced.
Optionally, the width of the first cavity is gradually increased in the extending direction from the liquid inlet to the liquid outlet.
Optionally, the width of the flow distribution plate gradually increases in an extending direction from the liquid inlet to the liquid outlet.
Optionally, the drain port has the same width as the band saw; the shape of the liquid outlet comprises a rectangle or a square; the liquid discharged from the liquid discharge port has uniform fluidity.
Optionally, the splitter plate includes N ≧ 2 groups in the direction of extension along the X-axis.
Optionally, the diverter plate includes M ≧ 2 groups in the direction of extension along the Y-axis.
Optionally, in the accommodating cavity, the flow distribution plates are distributed in a tree shape.
Optionally, the layered plates include P ≧ 2 in the direction of extension along the Z-axis.
Optionally, the process of preparing the nozzle comprises one or a combination of molding, welding and bonding; the material of the nozzle comprises one or a combination of metal, organic and inorganic nonmetal.
As described above, the nozzle of the crystal bar band sawing machine comprises the shell, the liquid inlet, the liquid outlet, the flow distribution plate and the layered plate, the nozzle can change the shape of liquid discharged from the liquid outlet, a layer of uniformly distributed banded liquid film can be attached to the band saw, and when the band saw runs at a high speed and cuts a crystal bar, the phenomenon that uneven fluid becomes irregular flow line beams can be avoided, so that a wafer with good flatness can be obtained, the probability of generating defects such as edge lines, cracks and the like on the surface of the wafer is reduced, the manpower and material resources are saved, the product quality is improved, and the cost is reduced.
Drawings
FIG. 1 is a schematic three-dimensional structure of a nozzle of a band saw machine of an embodiment, which is cut along an XOY plane.
FIG. 2 is a schematic three-dimensional structure of a nozzle of a band saw machine of an embodiment cut along the XOZ plane.
Fig. 3 is a schematic structural view showing a case where the embodiment has 2 flow plates in the extending direction along the X axis.
Fig. 4 is a schematic structural view showing a case where the embodiment has 2 flow plates in the extending direction along the Y-axis.
Fig. 5 is a schematic structural diagram of the flow distribution plates in the accommodation chamber in a tree-shaped distribution in the embodiment.
FIG. 6 is a schematic view showing a structure of an embodiment having 3 layered plates in an extending direction along the Z-axis.
Description of the element reference numerals
100. Shell body
110. Containing cavity
120. Liquid inlet
130. Liquid outlet
140. Flow distribution plate
1401. 1411, 1421, 1431 first splitter plate
1402. 1412, 1422, 1432 second splitter plate
1403. 1413, 1423, 1433 manifold inlets
1404. 1414, 1424, 1434 splitter plate outlets
150. 151, 152, 153 laminate
A first chamber
B second Chamber
C third Chamber
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
As in the detailed description of the embodiments of the present invention, the cross-sectional views illustrating the device structures are not partially enlarged in general scale for convenience of illustration, and the schematic views are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
For convenience in description, spatial relational terms such as "below," "beneath," "below," "under," "over," "upper," and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that these terms of spatial relationship are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. Further, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present. As used herein, "between … …" is meant to include both endpoints.
In the context of this application, a structure described as a first feature being "on" a second feature may include embodiments where the first and second features are formed in direct contact, and may also include embodiments where additional features are formed in between the first and second features, such that the first and second features may not be in direct contact.
It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the drawings only show the components related to the present invention rather than being drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of each component in actual implementation may be changed freely, and the layout of the components may be more complicated.
As shown in fig. 1 and 2, the present embodiment provides a nozzle for a band saw machine, which includes a housing 100, a liquid inlet 120, a liquid outlet 130, a flow distribution plate 140, and a layered plate 150. The housing 100 has an accommodating cavity 110, the housing 100 is a plane-symmetric figure, and in an X-axis coordinate system, a Y-axis coordinate system and a Z-axis coordinate system having an origin O, the symmetric plane of the housing 100 is an XOY plane and an XOZ plane; the liquid inlet 120 is communicated with the accommodating cavity 110; the liquid outlet 130 is communicated with the accommodating cavity 110, the liquid outlet 130 is arranged corresponding to the liquid inlet 120, and the central line of the liquid outlet 130 and the central line of the liquid inlet 120 are coincided to be used as the X axis; the flow distribution plate 140 is located in the accommodating cavity 110, the flow distribution plate 140 comprises a first flow distribution plate 1401 and a second flow distribution plate 1402, the first flow distribution plate 1401 and the second flow distribution plate 1402 are symmetrically distributed along the X-axis, a width of a flow distribution plate inlet 1403 adjacent to the liquid inlet 120 is smaller than a width of a flow distribution plate outlet 1404 adjacent to the liquid outlet 130, and a distance is provided between the flow distribution plate inlet 1403 and the liquid inlet 120; the layered plate 150 is located in the accommodating chamber 110 and is parallel to the Y-axis, and the layered plate 150 is located between the diversion plate outlet 1404 and the drain port 130.
Here, the height in the present embodiment refers to a distance in the Z-axis direction, the width refers to a distance in the Y-axis direction, and the pitch refers to a distance in the X-axis direction.
In the embodiment, a layer of uniformly distributed banded liquid film can be attached to the band saw through the nozzle, and when the band saw runs at a high speed and cuts a crystal bar, the phenomenon that nonuniform fluid becomes irregular flow line bundles can be avoided, so that a wafer with good flatness can be obtained, the probability of generating defects such as ridges, cracks and the like on the surface of the wafer is reduced, manpower and material resources are saved, the product quality is improved, and the cost is reduced. When the nozzle is applied to the cutting process of the experimental sample wafer, the quality of the experimental wafer can be thoroughly improved, the rejection rate of the wafer is reduced, and the experimental data can be timely and accurately acquired through the nozzle, so that the efficiency and the accuracy are improved.
Specifically, the nozzle of the existing band saw machine is circular, the nozzle area is small, based on the nozzle shape, the sprayed liquid forms an annular water ring when encountering a band saw, the annular water ring has different liquidity including flow velocity, flow rate, pressure and the like when encountering the surface of the band saw rotating at high speed, the edge of the annular water ring is different from the liquidity of the liquid in the central area, and uneven acting force can be generated when the liquid acts on the surface of the band saw, so that the liquid can form a liquid film with uneven thickness on the surface of the band saw, and when the band saw cuts a crystal bar, the flatness difference of 1.2 mm-1.5 mm can be easily caused, and the defects of edge lines, cracks and the like exist on the surface of the cut wafer. Therefore, in the nozzle of the present application, after the liquid enters the accommodating cavity 110 through the liquid inlet 120, the fluid flow of the liquid at the central region of the accommodating cavity 110 is greater than that of the liquid at the edge region of the accommodating cavity 110, and therefore, the liquid can be divided by the dividing plate 140 to reduce the liquid flow at the central region, so that the liquid can have uniform flow after flowing through the dividing plate 140, and the viscosity and flow rate of the liquid can be reduced by the layering plate 150, thereby avoiding the transient flow phenomenon of the liquid, and finally forming a uniform liquid band at the liquid outlet 130.
The nozzle may further include a flow meter, a pressure controller, and the like connected thereto to control the flow rate, the pressure, the speed, and the like of the liquid flowing into the liquid inlet 120, so as to meet different requirements of the liquid discharged from the liquid outlet 130 in an actual process, which is not limited herein.
For example, in the extending direction from the liquid inlet 120 to the liquid outlet 130, the accommodating chamber 110 includes a first chamber a, a second chamber B, and a third chamber C that sequentially communicate with each other, and the height of the first chamber a sequentially decreases, the height of the second chamber B sequentially increases, and the height of the third chamber C sequentially decreases.
Specifically, the pressure, flow rate, etc. of the liquid flowing through the accommodating cavity 110 can be further slowly released through the first chamber a, the second chamber B, and the third chamber C with gradually changing heights, wherein the specific sizes of the first chamber a, the second chamber B, and the third chamber C are not limited herein, and can be set as required.
As an example, the width of the first chamber a gradually increases in the extending direction from the liquid inlet 120 to the liquid outlet 130 to further perform slow release of the liquid entering into the first chamber a, wherein the width of the first chamber a may gradually increase linearly or gradually increase in a stepwise manner, and the size and the specific shape of the first chamber a are not limited herein.
As an example, the diversion plate 140 may be gradually increased in size from the liquid inlet 120 to the liquid outlet 130, and may be gradually increased linearly or gradually increased in a step-wise manner, and the size and specific shape of the diversion plate 140 are not limited herein.
As an example, the drain port 130 has the same width as the band saw; the shape of the liquid outlet 130 can comprise a rectangle or a square; the liquid discharged from the liquid discharge port 130 has uniform fluidity.
Specifically, the liquid discharge port 130 and the band saw preferably have the same width, so that the distance between the liquid discharge port 130 and the band saw is controlled, and the nozzle is structurally arranged, so that the liquid has uniform fluidity when being sprayed out from the liquid discharge port 130, and a uniform liquid film can be formed on the surface of the band saw. Of course, the width of the liquid discharge port 130 may also be greater than the width of the band saw, or smaller than the width of the band saw, and through cooperation of a plurality of nozzles, a uniform liquid film is finally formed on the surface of the band saw by the liquid, and the number, structure and position arrangement of the nozzles and the band saw may be set as required, and are not limited herein. The shape of the liquid outlet 130 may include a rectangle, a square, etc., and may be selected according to the needs, and the shape and the size of the liquid outlet 130 are not limited herein. The liquid discharged from the liquid discharge port 130 is finally realized to have uniform fluidity, including liquid flow rate, pressure, etc., wherein the liquid may include, but is not limited to, cooling water.
As an example, in the direction of extension along the X-axis, the diverter plate 140 includes N ≧ 2 groups.
Specifically, referring to fig. 3, in the extending direction along the X axis, the flow distribution plate 140 may include 2 sets, that is, a first set of flow distribution plates including a first flow distribution plate 1411 and a second flow distribution plate 1412, and a second set of flow distribution plates including a first flow distribution plate 1421 and a second flow distribution plate 1422, wherein in the extending direction along the X axis, the flow distribution plate inlet far from the origin O is larger than the flow distribution plate inlet near the origin O, that is, the flow distribution plate inlet 1423 formed by the second set of flow distribution plate is larger than the flow distribution plate inlet 1413 formed by the first set of flow distribution plate, and the flow distribution plate outlet 1424 formed by the second set of flow distribution plate is larger than the flow distribution plate outlet 1414 formed by the first set of flow distribution plate, so that the liquid discharged from the flow distribution plate outlet 1414 formed by the first set of flow distribution plate can enter the second set of flow distribution plate through the flow distribution plate inlet 1423 to further slowly release the liquid in the central area, so that the liquid has uniform fluidity, such as liquid pressure, flow rate, and the like. In the extending direction along the X axis, the values of the N groups in the splitter plate 140 are not limited to 2 groups, and may also be 3 groups, 4 groups, 5 groups, and the like, which may be specifically selected as needed, and are not limited herein.
As an example, in the direction of extension along the Y axis, the diverter plate includes M ≧ 2 groups.
Specifically, referring to fig. 4, in the extending direction along the Y-axis, the flow dividing plate 140 may include 2 sets, that is, a first set of flow dividing plates including a first flow dividing plate 1411 and a second flow dividing plate 1412, and a second set of flow dividing plates including a first flow dividing plate 1421 and a second flow dividing plate 1422, wherein the second set of flow dividing plates is located at the periphery of the first set of flow dividing plates, that is, the width of the flow dividing plate inlet 1423 formed by the second set of flow dividing plates is greater than the width of the flow dividing plate inlet 1413 formed by the first set of flow dividing plates, and the width of the flow dividing plate outlet 1424 is greater than the width of the flow dividing plate outlet 1414, so that the liquid flowing from the liquid inlet 120 can be divided into 5 regions by the flow dividing plates, thereby further slowly releasing the liquid in the central region, and enabling the liquid to have uniform fluidity, such as liquid pressure, flow rate, and the like. In the extending direction along the Y axis, the values of the M groups in the splitter plate 140 are not limited to 2 groups, and may also be 3 groups, 5 groups, and the like, and may be specifically selected as needed, and are not limited herein.
As an example, in the accommodating chamber 110, the diversion plates 140 are distributed in a tree shape.
Specifically, as shown in fig. 5, the flow dividing plate 140 may include 3 sets, that is, a first set of flow dividing plate composed of a first flow dividing plate 1411 and a second flow dividing plate 1412, a second set of flow dividing plate composed of a first flow dividing plate 1421 and a second flow dividing plate 1422, and a third set of flow dividing plate composed of a first flow dividing plate 1431 and a second flow dividing plate 1432, wherein the flow dividing plate inlet 1423 of the second set of flow dividing plate and the flow dividing plate inlet 1433 of the third set of flow dividing plate are respectively located at the ends of the first flow dividing plate 1411 and the second flow dividing plate 1412, that is, the liquid entering from the flow dividing plate inlet 1413 enters the flow dividing plate inlet 1423 and the flow dividing plate inlet 1433 after flowing out from the flow dividing plate outlet 1414 and then is led out from the corresponding flow dividing plate outlet 1424 and flow dividing plate outlet 1434, so that the liquid in the central area can be further slowly released and the liquid has uniform fluidity, such as liquid pressure, flow rate, and the like. The values of N groups of the splitter plates 140 in the extending direction along the X axis and the extending direction along the Y axis are not limited to these values, and may be selected as needed, and are not limited to these values, for example, a plurality of splitter plate groups may be included in both the extending direction along the X axis and the extending direction along the Y axis, for example, 1, 2, 3, 4, 5, 6, etc. splitter plate groups may be included in the extending direction along the X axis, and 1, 2, 3, 4, 5, 6, etc. splitter plate groups may be included in the extending direction along the Y axis, so as to form a tree-shaped distribution topography, and specific structures and dimensions are not limited herein.
As an example, in the extending direction along the Z-axis, the layered plate 150 includes P ≧ 2.
Specifically, as shown in fig. 1 and fig. 2, the number of the layered plate 150 may include 1, but the value of the P value is not limited thereto, and as shown in fig. 6, the layered plate 150 may include 3, that is, a layered plate 151, a layered plate 152, and a layered plate 153, although P may also be 2, 4, 5, 6, and the like, and may be specifically selected according to needs.
As an example, the process for preparing the nozzle may adopt one or a combination of molding, welding and bonding; the material of the nozzle can adopt one or the combination of metal, organic or inorganic nonmetal.
In particular, the nozzle is preferably made of an organic material having good stability, such as PVC, PET, etc., but is not limited thereto. The specific manufacturing process, material, structure, size, etc. of the nozzle can be selected according to the requirement, and are not limited herein.
For example, the liquid inlet 120 and the external liquid pipe may be connected by a screw connection, a snap connection, or the like, without being limited thereto.
In summary, the nozzle of the band saw machine for crystal bars of the present invention comprises a housing, a liquid inlet, a liquid outlet, a splitter plate and a layered plate, and can change the shape of the liquid discharged from the liquid outlet, and can attach a layer of uniformly distributed band-shaped liquid film to the band saw, so that when the band saw is operated at a high speed and a crystal bar is cut, the phenomenon that non-uniform fluid becomes irregular stream beams can be avoided, thereby obtaining a wafer with good flatness, reducing the probability of generating defects such as edge lines and cracks on the surface of the wafer, saving manpower and material resources, improving the product quality, and reducing the cost.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (9)
1. A crystal bar band saw machine nozzle, characterized in that, the nozzle includes:
the shell is provided with an accommodating cavity, the shell is in a plane symmetry pattern, and in an X-axis coordinate system, a Y-axis coordinate system and a Z-axis coordinate system with an origin O, the symmetry plane of the shell is an XOY plane and an XOZ plane;
the liquid inlet is communicated with the accommodating cavity;
the liquid outlet is communicated with the accommodating cavity and is arranged corresponding to the liquid inlet, and the central line of the liquid outlet and the central line of the liquid inlet are coincided to be used as the X axis;
in the extending direction from the liquid inlet to the liquid outlet, the accommodating cavity comprises a first cavity, a second cavity and a third cavity which are sequentially communicated, the height of the first cavity is sequentially reduced, the height of the second cavity is sequentially increased, and the height of the third cavity is sequentially reduced;
the flow distribution plate is positioned in the accommodating cavity and comprises a first flow distribution plate and a second flow distribution plate which are symmetrically distributed along the X axis, the width of a flow distribution plate inlet close to the liquid inlet is smaller than that of a flow distribution plate outlet close to the liquid outlet, and a space is reserved between the flow distribution plate inlet and the liquid inlet;
and the layering plate is positioned in the containing cavity and arranged in parallel with the Y axis, and the layering plate is positioned between the outlet of the flow distribution plate and the liquid outlet.
2. The nozzle of claim 1, wherein: and the width of the first cavity is gradually increased in the extending direction from the liquid inlet to the liquid outlet.
3. The nozzle of claim 1, wherein: and the width of the flow distribution plate is gradually increased from the liquid inlet to the liquid outlet in the extending direction.
4. The nozzle of claim 1, wherein: the liquid discharge port and the band saw have the same width; the shape of the liquid outlet comprises a rectangle or a square; the liquid discharged from the liquid discharge port has uniform fluidity.
5. The nozzle of claim 1, wherein: in the extending direction along the X axis, the splitter plate comprises N groups which are more than or equal to 2.
6. The nozzle of claim 1, wherein: in the extending direction along the Y axis, the splitter plate comprises M groups which are more than or equal to 2.
7. The nozzle of claim 1, wherein: in the containing cavity, the splitter plates are distributed in a tree shape.
8. The nozzle of claim 1, wherein: in the extending direction along the Z axis, the number of the layered plates is P ≧ 2.
9. The nozzle of claim 1, wherein: the process for preparing the nozzle comprises one or a combination of molding, welding and bonding; the material of the nozzle comprises one or a combination of metal, organic and inorganic nonmetal.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110035685.3A CN112873585B (en) | 2021-01-12 | 2021-01-12 | Nozzle of crystal bar band saw machine |
TW110111274A TWI763399B (en) | 2021-01-12 | 2021-03-29 | Nuzzle for a band sawing an ingot |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110035685.3A CN112873585B (en) | 2021-01-12 | 2021-01-12 | Nozzle of crystal bar band saw machine |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112873585A CN112873585A (en) | 2021-06-01 |
CN112873585B true CN112873585B (en) | 2023-01-20 |
Family
ID=76044109
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110035685.3A Active CN112873585B (en) | 2021-01-12 | 2021-01-12 | Nozzle of crystal bar band saw machine |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN112873585B (en) |
TW (1) | TWI763399B (en) |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2619415C2 (en) * | 1976-05-03 | 1986-01-02 | Dietz-Armaturen Gmbh, 5060 Bergisch Gladbach | Dousing shower for generating a free-falling flat jet of liquid |
JPH078844A (en) * | 1993-06-22 | 1995-01-13 | Chichibu Sekkai Kogyo Kk | Scattering nozzle |
JPH11290746A (en) * | 1998-04-07 | 1999-10-26 | Musashi Eng Co Ltd | Discharge passage structure of fluid |
KR100708037B1 (en) * | 2003-12-24 | 2007-04-16 | 마츠시타 덴끼 산교 가부시키가이샤 | Fluid supply nozzle, substrate processing apparatus and substrate processing method |
JP2011067876A (en) * | 2009-09-24 | 2011-04-07 | Toshiba Corp | Machining device |
CN202088111U (en) * | 2011-05-15 | 2011-12-28 | 常州贝斯塔德机械科技有限公司 | Mortar nozzle device for silicon wafer slicing machine |
JP5702223B2 (en) * | 2011-05-16 | 2015-04-15 | 武蔵エンジニアリング株式会社 | Film coating nozzle, coating apparatus and coating method |
CN203973792U (en) * | 2014-06-13 | 2014-12-03 | 开封恒锐新金刚石制品有限公司 | Diamond wire saw machine cooling sprayer |
CN204658898U (en) * | 2015-05-08 | 2015-09-23 | 慈溪市精诚模具有限公司 | A kind of extrusion molding machine head mould |
CN205310564U (en) * | 2015-11-30 | 2016-06-15 | 邢台晶龙电子材料有限公司 | Spray nozzle device for cutting off machine |
CN206415733U (en) * | 2017-01-12 | 2017-08-18 | 唐山联能科技有限公司 | A kind of multi-line cutting machine pressure spray equipment |
CN209207800U (en) * | 2018-12-19 | 2019-08-06 | 万丰飞机工业有限公司 | A kind of nozzle of the automatic prepreg equipment of composite material |
CN210908345U (en) * | 2019-11-27 | 2020-07-03 | 西安德宝隆机电科技有限公司 | Cooling and purifying system of horizontal sawing machine |
-
2021
- 2021-01-12 CN CN202110035685.3A patent/CN112873585B/en active Active
- 2021-03-29 TW TW110111274A patent/TWI763399B/en active
Also Published As
Publication number | Publication date |
---|---|
TWI763399B (en) | 2022-05-01 |
CN112873585A (en) | 2021-06-01 |
TW202227248A (en) | 2022-07-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20080060792A1 (en) | High performance integrated mlc cooling device for high power density ics and method for manufacturing | |
BR0107842B1 (en) | fluid processing system. | |
CN112873585B (en) | Nozzle of crystal bar band saw machine | |
CN104916556A (en) | Chip arranging method | |
CN105652591A (en) | Imprint apparatus and method of manufacturing article | |
CN110202707A (en) | A kind of Multi-wire cutting device and its cutting fluid liquid supply assembly | |
CN103219232A (en) | Wet etching machine table device | |
CN110802443A (en) | Cutting gas-oil-liquid three-phase atomizing nozzle device based on low-temperature micro-lubrication | |
CN102873640B (en) | Grinding mat trimmer | |
CN205904465U (en) | Multi -functional press cutter device | |
CN110534490B (en) | Enhanced boiling heat exchange microstructure with gradient in vertical direction and manufacturing method thereof | |
CN208250418U (en) | A kind of pin type coaxial powder feeding head | |
CN210646431U (en) | Inclined plate type liquid collecting redistributor | |
CN213212652U (en) | High-power semiconductor laser with macro-channel water mist spraying and radiating device | |
CN214923591U (en) | Preparation facilities of grinding apparatus is optimized to grit system of arranging | |
CN207206862U (en) | A kind of equipment for cooling die | |
CN109526188B (en) | Array type spray cooling surface based on three-dimensional curved surface | |
CN107283818B (en) | Secondary positioning method and structure for 3D printing and feeding | |
CN109275324B (en) | Array type spray cooling surface based on polyhedron | |
CN219381122U (en) | Guiding device for cutting silicon rod cooling liquid | |
CN220804976U (en) | High temperature resistant diamond wire drawing mould and die sleeve | |
CN108527665A (en) | Jade cutting diamond wire saw cutting device | |
CN212096988U (en) | Lubricating and cooling device for cutting silicon wafer | |
CN110640922A (en) | Cooling flow guide device and silicon wafer cutting system | |
CN1214707C (en) | Method for integrated fast developing of water saving water irrigator |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |