CN109275324B - Array type spray cooling surface based on polyhedron - Google Patents
Array type spray cooling surface based on polyhedron Download PDFInfo
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- CN109275324B CN109275324B CN201811423801.3A CN201811423801A CN109275324B CN 109275324 B CN109275324 B CN 109275324B CN 201811423801 A CN201811423801 A CN 201811423801A CN 109275324 B CN109275324 B CN 109275324B
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- heat dissipation
- liquid discharge
- discharge port
- array type
- polyhedral
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20345—Sprayers; Atomizers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Nozzles (AREA)
Abstract
The invention discloses an array type spray heat dissipation surface based on a polyhedron, which comprises a plurality of heat dissipation units, wherein each heat dissipation unit is a three-dimensional structure surface formed by splicing a plurality of planes and is arranged in an array manner to form a complete heat dissipation surface; the heat dissipation surface is provided with a nozzle above and a liquid discharge pipeline below, a liquid discharge port is arranged at the concave part of the heat dissipation surface, the liquid discharge port is connected with the liquid discharge pipeline, and liquid which is not gasified on the heat dissipation surface is discharged through the liquid discharge port and the liquid discharge pipeline. Compared with a smooth flat plate surface, the invention increases the heat exchange area, improves the heat exchange effect, has simpler surface processing compared with a micro-structure flat plate, saves the cost, can inhibit the spray cooling surface from forming accumulated water, is beneficial to reducing the thickness of a liquid film and improving the heat exchange coefficient of the spray cooling surface.
Description
Technical Field
The invention relates to a spray cooling technology, in particular to an array type spray cooling surface based on polyhedrons.
Background
A large amount of heat can be generated in the using process of an electronic product, if the part of heat can not be dissipated in time, the temperature of an electronic device can be increased rapidly, the stability and the service life of the electronic product are greatly reduced, and even the electronic product is damaged. With the miniaturization and integration of semiconductor electronic products, the local heat flux density of electric appliances is higher and higher, and the thermal safety problem of the electronic products is more and more prominent. Therefore, it is important to solve the heat dissipation problem of high power and high heat flux electronic devices.
Many researches prove that spray cooling has the advantages of high heat exchange coefficient, low flow, uniform cooling and the like, and is an effective way for solving the heat dissipation problem of the electronic equipment, but the existing spray cooling technology has the following defects: (1) at present, the surface of a smooth flat plate or a flat plate with a microstructure is mainly adopted for the spray cooling surface, the smooth flat plate surface is processed simply, but the heat exchange area is limited, the microstructure surface can effectively increase the heat exchange area and improve the spray cooling performance, but the processing is more complex; (2) the liquid drainage effect of the flat plate and the microstructure spraying surface is poor, so that part of liquid drops can not be completely evaporated and remain on the surface of a heat source to generate a water film, and the heat exchange effect is reduced; (3) the larger the plate structure area is, the more easily a water film is generated, resulting in insufficient heat dissipation, and the applicable heat source area is limited.
Disclosure of Invention
The invention aims to provide an array type spray cooling surface based on polyhedrons, which effectively increases the spray cooling heat exchange area.
The technical solution for realizing the purpose of the invention is as follows: a polyhedron-based array type spray radiating surface comprises a plurality of radiating units, wherein each radiating unit is a three-dimensional structure surface formed by splicing a plurality of planes and is arranged in an array to form a complete radiating surface; the heat dissipation surface is provided with a nozzle above and a liquid discharge pipeline below, a liquid discharge port is arranged at the concave part of the heat dissipation surface, the liquid discharge port is connected with the liquid discharge pipeline, and liquid which is not gasified on the heat dissipation surface is discharged through the liquid discharge port and the liquid discharge pipeline.
And a nozzle is arranged above each heat dissipation unit, and the liquid spraying area of the nozzle covers the whole heat dissipation unit.
The liquid discharge ports correspond to the heat dissipation units one by one and are arranged at the lowest point of each heat dissipation unit.
The radiating unit is formed by splicing three triangles or rhombuses to form a triangular pyramid-like structure.
The radiating unit is formed by splicing four triangles or diamonds to form a rectangular pyramid-like structure.
The heat dissipation unit is formed by splicing six triangles or diamonds to form a hexagonal pyramid-like structure.
The surfaces constituting the heat dissipation unit are the same.
The nozzle is located on the central axis of the heat dissipation unit.
Compared with the prior art, the invention has the following remarkable advantages: 1) the invention adopts the heat dissipation unit in the form of the folded surface, increases the heat exchange area compared with the smooth flat plate surface, improves the heat exchange effect, and simultaneously has simpler surface processing compared with the micro-structure flat plate, thereby saving the cost; 2) the liquid discharge hole is formed in the heat dissipation surface, so that accumulated water on the spray cooling surface can be inhibited, the thickness of a liquid film is reduced, and the heat exchange coefficient of the spray cooling surface is improved; 3) the invention generates a larger spray cooling surface through array combination and arrangement of a plurality of rows of liquid ports, the heat exchange effect is not influenced, the applicable heat source area is not limited, and the invention is suitable for the condition of larger heat sources.
Drawings
Fig. 1 is a plan view of an array 2 × 3 spray cooling surface of the present invention.
Fig. 2 is a perspective view of an array 2 × 3 spray cooling surface according to the present invention.
FIG. 3 is a schematic view of a nozzle arrangement for the spray cooling surface of the present invention.
Fig. 4 is a schematic view of another nozzle arrangement for the spray cooling surface of the present invention.
Detailed Description
The invention is further illustrated by the following examples in conjunction with the accompanying drawings.
The array type spray heat dissipation surface based on the polyhedron comprises a plurality of heat dissipation units, wherein each heat dissipation unit is a three-dimensional structure surface formed by splicing a plurality of planes and is arranged in an array to form a complete heat dissipation surface; the heat dissipation surface is provided with a nozzle above and a liquid discharge pipeline below, and the heat dissipation surface is provided with a liquid discharge port at the concave part, wherein the liquid discharge port is connected with the liquid discharge pipeline. The invention makes the heat dissipation surface into a three-dimensional structure surface, and then forms the heat dissipation surface with the required size through array combination. In the heat dissipation process, liquid drops are sprayed to the heat dissipation surface through the nozzle to be quickly gasified and absorb heat, and the unvaporized liquid flows to the liquid discharge port along the working surface and is discharged through the liquid discharge pipeline.
In some embodiments, a nozzle is arranged above each heat dissipation unit, the nozzles correspond to the heat dissipation units one by one, and the liquid spraying area of each nozzle covers the whole heat dissipation unit.
In some embodiments, the liquid discharge ports correspond to the heat dissipation units one to one, and may be disposed in the middle of the heat dissipation units or at the connection between adjacent heat dissipation units, as long as the liquid discharge ports are disposed at the lowest point of each heat dissipation unit.
In some embodiments, the cubic structure surface of the rectangular pyramid-like structure is formed by splicing four triangles or diamonds, as shown in fig. 1 and 2. In some embodiments, the three triangular pyramid-like three-dimensional structure surface is formed by splicing three triangles or diamonds. In some embodiments, the cubic structure surface of the hexagonal pyramid-like structure is formed by splicing six triangles or diamonds. The planar shape or the number of each radiating unit can be changed according to the requirement, as long as the radiating surface can be spliced to form a complete radiating surface in a matrix form or other forms.
Optimally, planes forming the three-dimensional structure surface are designed into the same shape and size, and after splicing, included angles between the surfaces and the central shaft and distances from the central shaft are equal. More preferably, the nozzle is arranged on the central axis of the heat dissipation unit, so that the liquid spraying area is ensured, and the liquid spraying cost is reduced. As shown in fig. 3 and 4, the nozzle is installed directly above the apex when the heat dissipating unit is convex upward, and the nozzle is installed above the liquid discharge port when the heat dissipating unit is concave upward.
In the specific implementation process, the area of each heat dissipation unit and the height of each nozzle can be reasonably arranged according to the required area, and the diameters of the liquid discharge port and the liquid discharge pipeline can be adjusted according to actual conditions.
Claims (8)
1. The array type spray heat dissipation surface based on the polyhedron is characterized by comprising a plurality of heat dissipation units, wherein each heat dissipation unit is a three-dimensional structure surface formed by splicing a plurality of planes and is arranged in an array manner to form a complete heat dissipation surface; the heat dissipation surface is provided with a nozzle above, a liquid discharge pipeline below, and a liquid discharge port at the concave part of the heat dissipation surface, wherein the liquid discharge port is connected with the liquid discharge pipeline, the liquid discharge port is in one-to-one correspondence with the heat dissipation unit, and unvaporized liquid on the heat dissipation surface is discharged through the liquid discharge port and the liquid discharge pipeline.
2. The polyhedral based array type spray cooling surface of claim 1, wherein a nozzle is arranged above each cooling unit, and the area of the nozzle sprayed liquid covers the whole cooling unit.
3. The polyhedral-based array spray heatsink surface of claim 1, wherein the liquid discharge port is provided at a lowest point of each heatsink unit.
4. The polyhedral-based array type spray cooling surface of claim 1, wherein the cooling units are spliced by three triangles or diamonds to form a triangular pyramid-like structure.
5. The polyhedral-based array type spray cooling surface of claim 1, wherein the cooling units are spliced by four triangles or diamonds to form a rectangular pyramid-like structure.
6. The polyhedral-based array type spray cooling surface of claim 1, wherein the cooling units are spliced by six triangles or diamonds to form a hexagonal pyramid-like structure.
7. The polyhedral based array type spray radiating surface of claim 4, 5 or 6, wherein the surfaces constituting the heat radiating unit are the same.
8. The polyhedral-based array spray heat dissipation surface of claim 7, wherein the spray nozzles are positioned on a central axis of the heat dissipation unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811423801.3A CN109275324B (en) | 2018-11-27 | 2018-11-27 | Array type spray cooling surface based on polyhedron |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811423801.3A CN109275324B (en) | 2018-11-27 | 2018-11-27 | Array type spray cooling surface based on polyhedron |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109275324A CN109275324A (en) | 2019-01-25 |
| CN109275324B true CN109275324B (en) | 2020-08-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811423801.3A Active CN109275324B (en) | 2018-11-27 | 2018-11-27 | Array type spray cooling surface based on polyhedron |
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Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2708495B2 (en) * | 1988-09-19 | 1998-02-04 | 株式会社日立製作所 | Semiconductor cooling device |
| US5592363A (en) * | 1992-09-30 | 1997-01-07 | Hitachi, Ltd. | Electronic apparatus |
| US7836706B2 (en) * | 2002-09-27 | 2010-11-23 | Parker Intangibles Llc | Thermal management system for evaporative spray cooling |
| CN201286062Y (en) * | 2008-10-24 | 2009-08-05 | 上海新时达电气股份有限公司 | Heat radiator in transducer |
| CN204665997U (en) * | 2015-05-29 | 2015-09-23 | 厦门大学 | A kind of flat-plate heat pipe liquid-sucking core with fin-Nei caulking groove |
| CN106871520B (en) * | 2017-02-13 | 2017-11-17 | 中国科学院合肥物质科学研究院 | A kind of efficient radiating apparatus based on array spraying |
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2018
- 2018-11-27 CN CN201811423801.3A patent/CN109275324B/en active Active
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| CN109275324A (en) | 2019-01-25 |
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