CN110640922A - Cooling flow guide device and silicon wafer cutting system - Google Patents
Cooling flow guide device and silicon wafer cutting system Download PDFInfo
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- CN110640922A CN110640922A CN201910861936.6A CN201910861936A CN110640922A CN 110640922 A CN110640922 A CN 110640922A CN 201910861936 A CN201910861936 A CN 201910861936A CN 110640922 A CN110640922 A CN 110640922A
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- 238000001816 cooling Methods 0.000 title claims abstract description 61
- 238000005520 cutting process Methods 0.000 title claims abstract description 30
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 26
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 26
- 239000010703 silicon Substances 0.000 title claims abstract description 26
- 239000007788 liquid Substances 0.000 claims abstract description 155
- 239000000110 cooling liquid Substances 0.000 claims description 19
- 238000009792 diffusion process Methods 0.000 claims description 18
- 238000001914 filtration Methods 0.000 claims description 17
- 239000002173 cutting fluid Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 7
- 239000012530 fluid Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000004308 accommodation Effects 0.000 description 4
- 230000006837 decompression Effects 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 230000009466 transformation Effects 0.000 description 4
- 239000002826 coolant Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000005574 cross-species transmission Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D19/00—Degasification of liquids
- B01D19/0031—Degasification of liquids by filtration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D29/00—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
- B01D29/01—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with flat filtering elements
- B01D29/03—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with flat filtering elements self-supporting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D29/00—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
- B01D29/50—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with multiple filtering elements, characterised by their mutual disposition
- B01D29/56—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with multiple filtering elements, characterised by their mutual disposition in series connection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The application provides a cooling guiding device and silicon chip cutting system includes: a liquid containing tank with a liquid outlet; the guide plate comprises a guide main plate and a connecting plate, and the guide main plate is obliquely connected with the liquid outlet of the liquid containing groove through the connecting plate; the overflow plate is arranged on one side, deviating from the bottom of the liquid containing groove, of the connecting plate, and the overflow plate is provided with a bulge far away from the connecting plate, so that the flowing state of cutting liquid can be controlled, the generation of ripples in the flow guide process of the cutting liquid is reduced, the flowing liquid flow is a straight line, the liquid flow impact of the cutting liquid on the wire mesh and the silicon square included angle is reduced, and the purpose of reducing the TTV of the silicon wafer entering the cutter is achieved.
Description
Technical Field
The invention relates to the technical field of silicon wafer slicing, in particular to a cooling flow guide device and a silicon wafer cutting system.
Background
The silicon slice industry develops to the present, and especially since the gold steel wire cutting technology is adopted, the requirements on the processing precision and efficiency of the slice equipment are increasingly raised.
At present, domestic silicon chip cutting equipment mainly comprises two types of routes, namely a Japanese NTC (negative temperature coefficient) route and a Meyebo grid route, and other domestic slicing equipment basically refers to one of the two routes. The guiding device of the cutting chamber of the silicon wafer slicing machine comprises a liquid inlet device, a main liquid groove and a guiding plate, and the existing guiding device mainly has the following three defects in the use process:
(1) the positioning of the flow guide device is not accurate enough, and the flow guide device cannot be adjusted, so that the unified operation standard cannot be standardized;
(2) because the organic matter of the cutting fluid is easy to generate bubbles due to high temperature, in addition, the cutting fluid is output by a pump pressure and is jetted to the included angle between the wire mesh and the silicon wafer through the guide plate, and the impact pressure of the bubbles and the fluid flow of the cutting fluid is comprehensively influenced, so that the TTV (TTV is the difference value between the maximum thickness and the minimum thickness of the silicon single wafer in the thickness measurement value, and is called the total thickness change of the silicon wafer) of the cutting knife is bad, and the cutting yield of the silicon wafer is influenced;
(3) the whole length of the flow guide device is not enough, the flow guide device cannot meet the process requirement of the lengthened guide wheel, and the defect that the flow guide device cannot be suitable for cutting the lengthened crystal bar exists.
Disclosure of Invention
According to the technical problem, on one hand, the application aims to provide a cooling flow guide device, and the specific scheme is as follows:
a cooling flow guide device is used for guiding cooling liquid in a silicon wafer cutting process and comprises the following components:
a liquid containing tank with a liquid outlet;
the guide plate comprises a guide main plate and a connecting plate, and the guide main plate is obliquely connected with the liquid outlet of the liquid containing groove through the connecting plate;
the liquid diffusing plate is arranged on one surface of the connecting plate, which is deviated from the bottom of the liquid containing groove, and the liquid diffusing plate is provided with a bulge which is far away from the connecting plate.
Optionally, the height from the liquid outlet of the liquid containing groove to the bottom of the liquid containing groove is lower than the height from the side wall of the liquid containing groove to the bottom of the liquid containing groove.
Optionally, the length of a side connected with the flow guide main board and the connecting board is the same as the length of a side connected with the connecting board and the liquid outlet of the liquid containing tank.
Optionally, the inclination direction of the diversion main plate is the inclination of the free end of the diversion main plate to the bottom of the liquid containing groove.
Optionally, the bottom of the liquid diffusion plate is straight, and the height from the protrusion of the liquid diffusion plate to the bottom of the liquid diffusion plate is consistent.
Optionally, the cross section of the liquid diffusion plate is an isosceles triangle.
Optionally, the cooling flow guide device further comprises a liquid baffle, two opposite ends of the liquid baffle are respectively connected with the side wall of the liquid containing tank to form a first accommodating space and a second accommodating space which are formed by the liquid baffle in a separated manner, and the first accommodating space and the second accommodating space are communicated with each other near the bottom of the liquid containing tank; can make cutting fluid bypass the fender liquid board after getting into first accommodation space and spill over from second accommodation space, then flow out through the guide plate.
Optionally, the cooling flow guide device further comprises a filter box, the filter box comprises a cavity with a liquid inlet and a filter bottom plate, and the filter bottom plate of the filter box is accommodated in the first accommodating space of the liquid storage tank.
Optionally, a filtering decompression plate is arranged inside the cavity of the filter box, and divides the cavity of the filter box into an upper cavity and a lower cavity.
Optionally, the filtering pressure reduction plate is provided with a first-stage pressure reduction hole; the filtering bottom plate is provided with a secondary pressure reducing hole.
Optionally, the number of the first-stage pressure reducing holes is four, the first-stage pressure reducing holes are arranged in pairs side by side, and the width of each first-stage pressure reducing hole is 2-6 mm.
Optionally, the number of the secondary pressure reducing holes is three, the secondary pressure reducing holes are arranged in a straight line shape, and the width of each secondary pressure reducing hole is 2-8 mm.
Optionally, a first arc-shaped groove is formed in one side, connected with the flow guide main board, of the connecting plate, and the opening of the first arc-shaped groove is in the same direction as the opening of the liquid containing groove in the cross section of the cooling flow guide device.
Optionally, one side of the diversion main board, which is far away from the connecting board, is connected with a bottom straight board, the bottom straight board is provided with a second arc-shaped groove, and the opening of the second arc-shaped groove is in the same direction as the opening of the liquid containing groove on the cross section of the cooling diversion device.
Optionally, the arc radius r of the first arc-shaped groove and the arc radius r of the second arc-shaped groove are 1-8 mm.
The cooling flow guide device can control the flowing state of cutting fluid, reduces the generation of ripples in the flow guide process of the cutting fluid, enables the flowing fluid to be a straight line, reduces the impact of the cutting fluid on the fluid at the wire mesh and the silicon square included angle, achieves the purpose of reducing TTV of the silicon wafer entering the cutter, achieves standardized operation, is low in cost, simple and feasible in transformation and installation, simple and convenient in operation of transformed personnel and high in safety.
On the other hand, the present application further provides a silicon wafer cutting system, including the above-mentioned cooling guiding device, further including:
the adjusting and positioning device comprises V-shaped positioning blocks and a plane positioning plate which are arranged on the fixing device at intervals,
the two opposite side surfaces of the flow guide device are respectively provided with a lap post and a lap plate; the lap joint column is detachably connected to the V-shaped positioning block, the lap joint plate is provided with an upper panel, and the lap joint plate is in plane positioning contact with the plane positioning plate through the upper panel and is fixedly connected through a connecting piece.
The silicon wafer cutting system can realize the adjustment of the upper, lower, left and right two-dimensional coordinate axes of the cooling and flow guiding device by arranging the adjusting and positioning device, is simple and convenient to operate, is accurate in positioning, and is easy to standardize and unify the operation standards.
Drawings
The following detailed description and the accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the example serve to explain the principles of the invention and not to limit the invention.
FIG. 1 is a schematic view of the overall structure of the cooling deflector of the present application;
FIG. 2 is an exploded view of FIG. 1;
FIG. 3 is a block diagram of a baffle in the cooling air guiding device of the present application;
FIG. 4 is a side view of FIG. 3;
FIG. 5 is a partial structural view of the cooling guiding device of the present application, showing the connection relationship between the overlapping column and the V-shaped positioning block;
FIG. 6 is a schematic view of a partial structure of the cooling deflector of the present application, showing the connection relationship between the lapping plate and the planar positioning plate;
FIG. 7 is a schematic diagram of an inlet means in the cooling diversion apparatus of the present application;
FIG. 8 is a partial schematic view of a liquid inlet device of the present application, showing the structure and location of a primary pressure reduction orifice;
FIG. 9 is a schematic diagram of a portion of an inlet means of the present application showing the configuration and location of a secondary pressure relief vent;
FIG. 10 is a block diagram of a primary fluid sump in the cooling manifold of the present application;
FIG. 11 is a block diagram of a baffle in the cooling baffle of the present application;
fig. 12 is a partial structural schematic view of the cooling deflector of the present application.
Reference numerals:
1-a filter box; 11-a liquid inlet; 12-an end cap; 13-an upper chamber; 131-first stage pressure relief vent; 14-a lower chamber; 141-secondary pressure relief vent; 2-a plane positioning plate; 3-a drain valve; 4-liquid baffle; 5-liquid diffusion plate; 6-V-shaped positioning blocks; 7-liquid containing tank; 71-a liquid outlet; 72-a first accommodation space; 73-a second accommodation space; 8-a flow guide plate; 81-connecting plate; 82-a flow guiding main board; 83-bottom end straight plate; 84-transition arc; 85-lap joint posts; 86-a lap plate; 87-butterfly nuts; 88-a first arc-shaped groove; 89-a second arc-shaped groove.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
In some embodiments, a cooling guide device for guiding cooling liquid in a silicon wafer cutting process is provided, which includes: the liquid container is generally of a groove-shaped structure with one side open and a sealed bottom, for example, the liquid container is a cube with one side open, and is provided with four side walls and one bottom; or similarly a rectangular parallelepiped configuration with four sides, a bottom with one side, or other configurations with a groove. The liquid outlet is on the lateral wall of liquid containing groove, including the opening on the lateral wall, or the through-hole on the lateral wall, can make the liquid in the liquid containing groove flow out from the liquid outlet of liquid containing groove. As can be understood, the height from the liquid outlet to the bottom of the liquid containing groove is lower than the height from the side wall of the liquid containing groove to the bottom of the liquid containing groove. The guide plate comprises a guide main plate and a connecting plate, and the guide main plate is obliquely connected with the liquid outlet of the liquid containing groove through the connecting plate; the flow guide main board can be a rectangular plane board or a trapezoidal plane board; the connecting plate is a rectangular plane plate; the liquid diffusing plate is arranged on one surface of the connecting plate, which is deviated from the bottom of the liquid containing groove, and the liquid diffusing plate is provided with a bulge which is far away from the connecting plate. The cooling diversion device overflows the cooling liquid in the liquid containing groove through the liquid outlet of the liquid containing groove, the overflowing cooling liquid bypasses the liquid overflowing plate and then flows through the diversion main plate to complete diversion of the cooling liquid.
Specifically, the cooling air guiding device shown in fig. 1, 2 and 3 includes: the liquid container comprises a cuboid open liquid containing groove 7, a liquid outlet 71 formed by a side wall notch on the liquid containing groove and a guide plate 8, wherein the guide plate 8 comprises a guide main plate 82 and a connecting plate 81 which are of rectangular plane structures, and the guide main plate 82 is obliquely connected with the liquid outlet 71 of the liquid containing groove 7 through the connecting plate 81; the diffusion plate 5 is arranged on one surface of the connecting plate 81, which is far away from the bottom of the liquid containing groove 7, of the diffusion plate 5, and the diffusion plate 5 is provided with a triangular prism which is convex towards the direction far away from the connecting plate 81. The cooling diversion device overflows the cooling liquid in the liquid containing groove 7 through the liquid outlet 71 of the liquid containing groove 7, the overflowed cooling liquid bypasses the liquid overflowing plate 5 and then flows through the diversion plate 8 to complete the diversion of the cooling liquid.
In the embodiment, the cooling flow guide device can control the flowing state of the cutting fluid, the generation of ripples in the flow guide process of the cutting fluid is reduced, the flowing fluid is a straight line, the impact of the cutting fluid on the fluid at the wire mesh and the silicon square included angle is reduced, the purpose of reducing the TTV of the silicon wafer entering the cutter is achieved, the standardized operation is realized, the cost is low, the transformation and installation are simple and easy, the operation of personnel is simple and convenient after the transformation, and the safety is high.
In some embodiments, as shown in fig. 2 and 3, the length of the side where the flow guiding main plate 82 of the cooling flow guiding device is connected with the connecting plate 81 is the same as the length of the side where the connecting plate 81 is connected with the liquid outlet 71 of the liquid containing tank 7. The inclination direction of the diversion main plate 82 is the direction of the free end of the diversion main plate 82 inclining towards the bottom of the liquid containing groove. It can be understood that the flow guiding main plate 82 and the connecting plate 81 have the same width of the side length connected with the liquid outlet 71, the connecting plate 81 is vertically connected with the side wall of the liquid outlet 71, and the flow guiding main plate 82 is connected with the connecting plate 81 in an inclined manner, so that the flow guiding main plate 82 extends obliquely downward. The bottom of the liquid diffusion plate 5 is straight, and the height from the protrusion of the liquid diffusion plate 5 to the bottom of the liquid diffusion plate 6 is consistent. Specifically, the liquid diffusion plate 5 is connected with the upper surface of the connecting plate 81, and the convex upper surface of the liquid diffusion plate 5 is straight left and right.
In this embodiment, the width of the liquid outlet 71 is consistent with the width of the connecting plate 81 and the width of the diversion main plate 82, so that the flow of the cooling liquid in the flowing process is kept uniform, the cooling liquid passes through the liquid diffusion plate 5, the cooling liquid is buffered, and the cooling liquid guided out by the cooling diversion device is a straight line.
In some embodiments, as shown in fig. 2, 11 and 12, the cooling diversion device further includes a liquid baffle plate 4, opposite ends of the liquid baffle plate 4 are respectively connected with left and right side walls of the liquid containing tank 7 to form a first accommodating space 72 and a second accommodating space 73 partitioned by the liquid baffle plate 4, and the first accommodating space 72 and the second accommodating space 73 are communicated with each other near the bottom of the liquid containing tank 7; the cooling liquid can enter the first accommodating space 72, bypass the liquid baffle plate 4, overflow from the second accommodating space 73 and then flow out through the flow guide plate 8. The flow rate of the cooling liquid in the cooling flow guide device can be reduced by arranging the liquid baffle plate 4, so that the flow rate of the cooling liquid is more stable, the uniformity of the cooling liquid flowing out of the follow-up flow guide plate is facilitated, and the working performance of the cooling flow guide device is improved.
In some embodiments, as shown in fig. 1, 7, 8, 9, and 12, the cooling and guiding device further includes a filtering tank 1, the filtering tank 1 includes a cavity having a liquid inlet 11 and a filtering bottom plate, and the filtering bottom plate of the filtering tank 1 is accommodated in the first groove body of the liquid containing tank 1. Further, a filtering decompression plate is arranged inside the cavity of the filter box 1 to divide the cavity of the filter box 1 into an upper cavity 13 and a lower cavity 14. The filter box 1 of this application adopts the two-stage decompression to filter, has the filtration function that steps down, subducts the bubble, reduces the undulant frequency of liquid stream. Further, the filter box 1 is installed in the first accommodating space 72 on one side of the liquid containing groove 7 far away from the guide plate 8 through screws; the liquid baffle plates 4 are hung at the left end and the right end of the liquid containing groove 7 through screws.
Further, the filtering pressure reducing plate is provided with a first-stage pressure reducing hole 131; the filtering bottom plate is provided with a secondary pressure reducing hole 141. The number of the first-stage pressure reducing holes 131 is four, every two of the first-stage pressure reducing holes are arranged side by side, and the width of each first-stage pressure reducing hole 131 is 2-6 mm. The secondary pressure reducing holes 141 are three and arranged in a straight line, and the width of the secondary pressure reducing holes 141 is 2-8 mm. When cooling liquid containing bubbles and carrying a certain pressure flows into the upper chamber 13 from the liquid inlet 11 and flows into the lower chamber 14 through the four sections of first-stage pressure reducing holes 131 on the bottom plate of the upper chamber 13, the sectional area of the liquid flow is increased for the first time, the flow rate is increased, the pressure is reduced, and simultaneously the liquid bubbles are reduced and separated out for the first time by changing the direction of the liquid flow. When the cooling liquid in the lower chamber 14 flows into the liquid containing tank 7 through the three sections of two-stage pressure reducing holes 141 on the filtering bottom plate, the sectional area of the liquid flow is increased for the second time, the flow rate is increased, the pressure is reduced, and meanwhile, the liquid bubbles are reduced and separated out for the second time by changing the direction of the liquid flow. Through the two-stage pressure reduction filtration, the hydraulic pressure in the liquid containing tank 7 is gradually reduced to be nearly zero from 150mbar entering the upper chamber 13, and the liquid level in the liquid containing tank 7 is ensured to be stable and free from fluctuation.
In some embodiments, as shown in fig. 1 and 3, a cooling flow guide device is provided, wherein a first arc-shaped groove 88 is arranged on the connecting plate 81 at the side connected with the flow guide main plate 82, and the opening of the first arc-shaped groove 88 is in the same direction as the opening of the liquid containing tank 7 on the cross section of the connecting plate 81; one side of the flow guide main plate 82, which is far away from the connecting plate 81, is connected with a bottom end straight plate 83, a second arc-shaped groove 89 is arranged on the bottom end straight plate 83, and the opening of the second arc-shaped groove 89 on the cross section of the cooling flow guide device is the same as the opening of the liquid containing groove 7 in direction; further, the arc radius r of the first arc-shaped groove and the second arc-shaped groove is 1-8 mm. Wherein, the liquid containing groove 7 is connected with the guide plate 8 through screws.
In some embodiments, as shown in fig. 4, the connecting plate 81 and the bottom end straight plate 83 of the cooling flow guiding device are stainless steel bent plates with two curved portions, the flow guiding plate 8 is composed of a connecting plate 81 at the upper end, a flow guiding main plate 82 at the middle part, and a bottom end straight plate 83 at the lower end, the two bent portions of the flow guiding plate 8 are provided with the same transition circular arc 84, the radius r of the transition circular arc 84 is 5mm, and the top end straight plate 81 is installed in the cutting chamber. In order to meet the process requirement of the lengthened guide wheel, the guide plate 8 can be correspondingly lengthened by 10mm so as to ensure the supply of cutting fluid for lengthening the crystal bar. In this embodiment, as shown in fig. 1, the coolant liquid flowing out of the liquid outlet 71 of the cooling diversion device passes through the structure of the first arc-shaped groove 88 of the connecting plate 81 and the straight diversion main plate 82, so that the coolant liquid flows into the buffer of the first arc-shaped groove 88 after passing through the liquid diffusion plate, the flow rate of the coolant liquid is slowed down and made uniform, the cutting liquid passing through the diversion main plate 82 continues to keep a linear type, and the cutting liquid freely slides down under the action of gravity, the straight plate with the second arc-shaped groove 89 is adopted at the bottom end to ensure that the cutting liquid continues to keep the linear type, and the performance of the cooling diversion device is improved.
In some embodiments, as shown in fig. 1, fig. 2, fig. 5, fig. 6 and fig. 10, there is provided a silicon wafer cutting system having the cooling and guiding device, including: the adjusting and positioning device comprises V-shaped positioning blocks 6 and a plane positioning plate 2 which are arranged on the fixing device at intervals; the two opposite side surfaces of the cooling flow guide device are respectively provided with a lapping column 85 and a lapping plate 86; the lapping column 85 is detachably connected on the V-shaped positioning block 6, the lapping plate 86 is provided with an upper panel, and the lapping plate 86 is in plane positioning contact with the plane positioning plate 2 through the upper panel and is fixedly connected through a connecting piece. In the embodiment, the cooling and flow guiding device is arranged on a fixing device of the cutting system through an adjusting and positioning device, the adjusting and positioning device comprises a V-shaped positioning block 6 and a plane positioning plate 2, and the V-shaped positioning block 6 and the plane positioning plate 2 are both arranged in the cutting chamber and are positioned at the left side and the right side; the ear parts at the two sides of the top straight plate 81 on the left and right sides of the guide plate 8 are respectively provided with a lapping column 85 and a lapping plate 86; the lapping column 85 is supported in the V-shaped positioning block 6, the lapping plate 86 is provided with an upper panel, the lapping plate 86 is in planar positioning contact with the planar positioning plate 2 through the upper panel and is fixedly connected through a connecting piece, and the connecting piece is a butterfly nut 87; the adjusting and positioning device can realize the adjustment of the two-dimensional coordinate axes of up-down and left-right.
Compared with the prior art, the cooling guiding device and silicon chip cutting system of this application, redesign transformation is carried out to current equipment guide plate, increase the liquid overflow board, the structure of guide plate has been improved, inlet means adopts two-stage decompression filter equipment, adjust positioner and adopt V type locating piece and add the adjustable positioner of length about the plane locating plate, thereby reduce the production of cutting liquid stream through in-process ripple, the purpose of the approximate straight line of liquid stream that finally realizes flowing, it is bad to reduce the cutting that the human factor leads to, improve operating personnel's work efficiency, be convenient for realize the standard standardization of operation, reduce the purpose of entering sword TTV defective rate, in addition, technological promotion for the increase cutting crystal bar length who advances provides abundant necessary condition.
The above-described embodiments of the present invention are not intended to limit the scope of the present invention, and the embodiments of the present invention are not limited thereto, and various other modifications, substitutions and alterations can be made to the above-described structure of the present invention without departing from the basic technical concept of the present invention as described above, according to the common technical knowledge and conventional means in the field of the present invention.
Claims (16)
1. A cooling flow guide device is used for guiding cooling liquid in a silicon wafer cutting process and is characterized by comprising:
a liquid containing tank (7) with a liquid outlet (71);
the flow guide plate (8) comprises a flow guide main plate (82) and a connecting plate (81), and the flow guide main plate (82) is obliquely connected with the liquid outlet of the liquid containing groove (7) through the connecting plate (81);
the liquid diffusing plate (5) is arranged on one surface, deviating from the bottom of the liquid containing groove (7), of the connecting plate (81), and the liquid diffusing plate (5) is provided with a protrusion in the direction far away from the connecting plate (82).
2. The cooling and flow guiding device as claimed in claim 1, wherein the height from the liquid outlet (71) of the liquid containing groove (7) to the bottom of the liquid containing groove (7) is lower than the height from the side wall of the liquid containing groove (7) to the bottom of the liquid containing groove (7).
3. The cooling and flow guiding device as claimed in claim 1, wherein the length of the side where the flow guiding main plate (82) and the connecting plate (81) are connected is the same as the length of the side where the connecting plate (81) and the liquid outlet (71) of the liquid containing tank (7) are connected.
4. The cooling and flow guiding device as claimed in claim 1, wherein the flow guiding main plate (82) is inclined in a direction that the free end of the flow guiding main plate (82) is inclined towards the bottom of the liquid containing groove (7).
5. The cooling and flow guiding device as claimed in claim 1, wherein the bottom of the liquid diffusion plate (5) is straight, and the height of the liquid diffusion plate (5) protruding to the bottom of the liquid diffusion plate (5) is uniform.
6. A cooling deflector according to claim 5, characterised in that the cross-section of the flood plate (5) is isosceles triangle.
7. The cooling and flow guiding device as claimed in claim 1, further comprising a liquid baffle plate (4), wherein two opposite ends of the liquid baffle plate (4) are respectively connected with the side wall of the liquid containing groove (7) to form a first accommodating space (72) and a second accommodating space (73) which are formed by the liquid baffle plate (4) in a separating way, and the first accommodating space (72) and the second accommodating space (73) are communicated with each other near the bottom of the liquid containing groove (7); the cutting fluid can enter the first containing space (72), then bypasses the liquid baffle plate (4), overflows from the second containing space (73), and then flows out through the guide plate (8).
8. The cooling air guiding device according to claim 7, characterized in that the cooling air guiding device further comprises a filter box (1), the filter box (1) is a cavity comprising an inlet (71) and a filter bottom plate, and the filter bottom plate of the filter box (1) is accommodated in the first accommodating space (72) of the reservoir (7).
9. The cooling and flow guiding device as claimed in claim 8, wherein a filtering and pressure reducing plate is arranged inside the cavity of the filter box (1) to divide the cavity of the filter box (1) into an upper chamber and a lower chamber.
10. The cooling and flow guiding device as claimed in claim 9, wherein the filtering and pressure reducing plate is provided with a primary pressure reducing hole (131); the filtering bottom plate is provided with a secondary pressure reducing hole (141).
11. The cooling and flow guiding device as claimed in claim 10, wherein the number of the primary pressure reducing holes (131) is four, two primary pressure reducing holes are arranged side by side, and the width of the primary pressure reducing holes (131) is 2-6 mm.
12. The cooling flow guide device according to claim 11, wherein the number of the secondary pressure reducing holes (141) is three, and the secondary pressure reducing holes are arranged in a straight line, and the width of the secondary pressure reducing holes (141) is 2-8 mm.
13. A cooling deflector according to claim 1, characterized in that a first arc-shaped groove (88) is provided on the connecting plate (81) at the side connected with the deflector main plate (82), and the opening of the first arc-shaped groove (88) is in the same direction as the opening of the liquid tank (7) in the cross section of the cooling deflector.
14. The cooling baffle device of claim 1, wherein; one side of the diversion main board (82) far away from the connecting board (81) is connected with a bottom straight board (83), the bottom straight board (83) is provided with a second arc-shaped groove (89), and the opening of the second arc-shaped groove (89) is the same as the opening of the liquid containing groove (7) in the direction of the cross section of the cooling diversion device.
15. A cooling deflector according to claim 13 or 14, wherein the arc radii r of the first and second arcuate grooves (88, 89) are 1-8 mm.
16. A silicon wafer cutting system comprising the cooling deflector of any one of claims 1-5, comprising:
the adjusting and positioning device comprises V-shaped positioning blocks (6) and a plane positioning plate (2) which are arranged on the fixing device at intervals,
two opposite side surfaces of the cooling flow guide device are respectively provided with a lapping column (85) and a lapping plate (86); the lap post (85) is detachably connected to the V-shaped positioning block (6), the lap plate (86) is provided with an upper panel, and the lap plate (86) is in plane positioning contact with the plane positioning plate (2) through the upper panel and is fixedly connected through a connecting piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910861936.6A CN110640922A (en) | 2019-09-12 | 2019-09-12 | Cooling flow guide device and silicon wafer cutting system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910861936.6A CN110640922A (en) | 2019-09-12 | 2019-09-12 | Cooling flow guide device and silicon wafer cutting system |
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| Publication Number | Publication Date |
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| CN110640922A true CN110640922A (en) | 2020-01-03 |
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| CN201910861936.6A Pending CN110640922A (en) | 2019-09-12 | 2019-09-12 | Cooling flow guide device and silicon wafer cutting system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114800900A (en) * | 2022-05-23 | 2022-07-29 | 宇晶机器（长沙）有限公司 | Multi-stage buffering nozzle device and multi-wire cutting machine |
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2019
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114800900A (en) * | 2022-05-23 | 2022-07-29 | 宇晶机器（长沙）有限公司 | Multi-stage buffering nozzle device and multi-wire cutting machine |
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