CN112864114A - 锂电池保护板及装配方法 - Google Patents
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Abstract
本发明涉及一种锂电池保护板及装配方法,锂电池保护板包括基板,基板上排布有若干MOSFET,基板的两面分别设置有金属导体片和散热器,金属导体片与MOSFET设置在同一面,金属导体片避让MOSFET设置,金属导体片上嵌设有若干接线端子,接线端子下方穿过金属导体片,接线端子下方与所述基板焊接在一起;装配方法包括:将MOSFET均匀呈矩阵摆布,在基板上预留金属导体片位置;在金属导体片上开设避让孔和避让槽,并在金属导体片上嵌入接线端子;对基板上的电路进行开天窗设计,将接线端子焊接在开天窗位置,在基板上开设有定位孔,通过定位孔将基板锁合在散热片上。本发明提供一种具有良好的散热能力及接线方式的锂电池保护板,提高锂电池保护板的稳定性。
Description
技术领域
本发明涉及电池管理系统技术领域,尤其是指一种锂电池保护板及装配方法。
背景技术
锂电池管理系统、锂电池保护板,简称为:BMS,锂电池保护板是对串联锂电池组的充放电保护;在充满电时能保证各单体电池之间的电压差异小于设定值(一般±20mV),实现电池组各单体电池的均充,有效地改善了串联充电方式下的充电效果;同时检测电池组中各个单体电池的过压、欠压、过流、短路、过温状态,保护并延长电池使用寿命;欠压保护使每一单节电池在放电使用时避免电池因过放电而损坏。
MOSFET(金属氧化物半导体场效应晶体管)广泛应用于BMS,而做成成品的BMS是紧密贴在电池的附近,而BMS在大电流工作时必然产生损耗,所产生的损耗必须通过热量散发出去,再加上电池本体对高温的要求不能超过70度,这样在BMS中散热显得尤为重要。
并且,现有的BMS在接线方面都是使用导线与PCB的焊接方式,这样造成流经BMS内部的各个MOSFET很不均匀,有的MOSFET电流大,有的MOSFET电流小,这样造成MOSFET所承受的负荷不一致,容易造成个别MOSFET发热量大,造成MOSFET容易损坏。所以良好的接线方式对BMS的MOSFET均匀电流工作、BMS安装和拆卸起到很大的作用。
发明内容
为此,本发明所要解决的技术问题在于克服现有技术中锂电池保护板的散热和接线问题,提供一种具有良好的散热能力及接线方式的锂电池保护板,使锂电池保护板工作时电流均匀,提高锂电池保护板的稳定性。
为解决上述技术问题,本发明提供了一种锂电池保护板,包括基板,所述基板上排布有若干MOSFET,所述基板的两面分别设置有金属导体片和散热器,所述金属导体片与所述MOSFET设置在同一面,所述金属导体片避让所述MOSFET设置,所述金属导体片上嵌设有若干接线端子,所述接线端子下方穿过金属导体片,所述接线端子下方与所述基板焊接在一起。
在本发明的一个实施例中,所述接线端子突出于所述基板,所述接线端子为带有内螺纹的螺纹柱。
在本发明的一个实施例中,所述金属导体片贴敷在所述基板上,所述金属导体片与所述基板之间没有缝隙。
在本发明的一个实施例中,所述金属导体片上开设有若干避让孔和避让槽。
在本发明的一个实施例中,若干所述MOSFET呈矩阵分布,任意相邻两个MOSFET之间的距离相同。
在本发明的一个实施例中,所述散热器和基板上的对应位置开设有定位孔,所述定位孔处设置有与之配合的定位销,所述散热器通过定位孔和定位销配合锁合在基板上。
在本发明的一个实施例中,所述散热器的尺寸大小与所述基板的尺寸大小相同。
在本发明的一个实施例中,所述基板为PCB板、铝基板或玻纤板。
为解决上述技术问题,本发明提供了一种锂电池保护板的装配方法,包括以下步骤:在基板上进行合理布局设计,将MOSFET均匀呈矩阵摆布,在基板上预留金属导体片位置;根据预留位置在金属导体片上开设避让孔和避让槽,并在金属导体片上嵌入接线端子;根据接线端子的位置对基板上的电路进行开天窗设计,将接线端子焊接在开天窗位置,同时将金属导体片贴敷在基板上;将基板按照SMT的贴片工艺进行加工;在加工后的基板上开设有定位孔,通过定位孔将基板锁合在散热片上。
在本发明的一个实施例中,所述接线端子突出于所述基板,所述接线端子为带有内螺纹的螺纹柱,在接线时,通过螺栓与螺纹柱配合接线。
本发明的上述技术方案相比现有技术具有以下优点:
本发明所述的一种锂电池保护板,在基板的两侧分别设置金属导体片和散热器,将散热器集成设置在基板上,提高了基板的散热效果,保证基板上的MOSFET正常工作,保证电流均匀的从每个MOSFET中流过,并且,在金属导体片上设置接线端子,通过接线端子更方便拆卸接线。
本发明所述的一种锂电池保护板的装配方法,采用组合式的结构将基板、金属导体片和散热器装配在一起形成了一个完整的整体,使锂电池保护板工作时电流均匀,提高锂电池保护板的稳定性,同时也方便锂电池保护板与锂电池的接线。
附图说明
为了使本发明的内容更容易被清楚的理解,下面根据本发明的具体实施例并结合附图,对本发明作进一步详细的说明,其中
图1是本发明的锂电池保护板的侧面结构示意图;
图2是本发明的锂电池保护板的正面结构示意图;
图3是本发明的锂电池保护板的装配方法的步骤流程图。
说明书附图标记说明:1、基板;2、MOSFET;3、金属导体片;4、散热器;5、接线端子;6、定位孔。
具体实施方式
下面结合附图和具体实施例对本发明作进一步说明,以使本领域的技术人员可以更好地理解本发明并能予以实施,但所举实施例不作为对本发明的限定。
参照图1所示,本发明的锂电池保护板,包括基板1,所述基板1上排布有若干MOSFET2(Metal-Oxide-Semiconductor Field-Effect Transistor)是金属-氧化物半导体场效应晶体管的英文缩写,简称金氧半场效晶体管,MOSFET2是一种可以广泛使用在模拟电路与数字电路的场效晶体管;所述基板的两面分别设置有金属导体片3和散热器4,所述金属导体片3与所述MOSFET2设置在同一面,所述金属导体片3避让所述MOSFET2设置,所述金属导体片3上嵌设有若干接线端子5,所述接线端子5突出于所述基板1,所述接线端子5为带有内螺纹的螺纹柱,本实施例中,通过螺纹连接进行接线,一方面保证接线更加的稳固,另一方面,也方便对接线进行拆卸,所述接线端子5下方穿过金属导体片3,所述接线端子5下方与所述基板1焊接在一起,将散热器4集成设置在基板1上,提高了基板1的散热效果,保证基板1上的MOSFET2正常工作,保证电流均匀的从每个MOSFET2中流过,并且,在金属导体片3上设置接线端子5,通过接线端子5更方便拆卸接线。
具体地,所述金属导体片3贴敷在所述基板1上,所述金属导体片3与所述基板1之间没有缝隙,保证金属导体片3与基板1完全贴合,一方面设置金属导体片3有利于基板1的散热,另一方面完全贴合后,保证接线端子5接线处的稳定。
参照图2所示,在基板1既要设置满足工作需求的MOSFET2,又要设置金属导体片3,所以要对基板1上的位置进行合理分布,尽量将MOSFET2集成布置在一侧,因此,本实施例中所述MOSFET2呈矩阵分布,尽量减少MOSFET2所沿用的体积和范围,并且为了保证每个MOSFET能够正常工作,互不影响,任意相邻两个MOSFET2之间的距离相同,所述金属导体片3根据MOSFET2的位置,在金属导体片3上开设有若干避让孔和避让槽,通过避让孔和避让槽避开MOSFET2的位置。
具体地,所述散热器4和基板1上的对应位置开设有定位孔6,所述定位孔6处设置有与之配合的定位销,所述散热器4通过定位孔6和定位销配合锁合在基板1上,所述定位孔6尽量开设在基板1的边缘位置,不影响基板1上正常的电路工作。
具体地,所述散热器4的尺寸大小与所述基板1的尺寸大小相同,保证散热器4覆盖整个基板1,对整个基板1进行整体散热处理,同时也能防止散热器4的散热资源浪费。
具体地,根据实际使用需求,本实施例中的所述基板1可以为PCB板、铝基板或玻纤板。
参照图3所示,本发明的锂电池保护板的装配方法,包括以下步骤:
在基板1上进行合理布局设计,将MOSFET2均匀呈矩阵摆布,在基板1上预留金属导体片3位置;
根据预留位置在金属导体片3上开设避让孔和避让槽,并在金属导体片3上嵌入接线端子5;
根据接线端子5的位置对基板1上的电路进行开天窗设计,将接线端子5焊接在开天窗位置,同时将金属导体片3贴敷在基板1上;
将基板按照SMT的贴片工艺进行加工;SMT是表面组装技术(表面贴装技术),英文全称为Surface Mount Technology,是一种将无引脚或短引线表面组装元器件安装在PCB板的表面或其它基板的表面上的,通过回流焊或浸焊等方法加以焊接组装的电路装连技术。
在加工后的基板1上开设有定位孔6,通过定位孔6将基板1锁合在散热片4上。
具体地,本方法中的所述接线端子5突出于所述基板,所述接线端子5为带有内螺纹的螺纹柱,在接线时,通过螺栓与螺纹柱配合接线。
显然,上述实施例仅仅是为清楚地说明所作的举例,并非对实施方式的限定。对于所属领域的普通技术人员来说,在上述说明的基础上还可以做出其它不同形式变化或变动。这里无需也无法对所有的实施方式予以穷举。而由此所引伸出的显而易见的变化或变动仍处于本发明创造的保护范围之中。
Claims (10)
1.一种锂电池保护板,包括基板,所述基板上排布有若干MOSFET,其特征在于:所述基板的两面分别设置有金属导体片和散热器,所述金属导体片与所述MOSFET设置在同一面,所述金属导体片避让所述MOSFET设置,所述金属导体片上嵌设有若干接线端子,所述接线端子下方穿过金属导体片,所述接线端子下方与所述基板焊接在一起。
2.根据权利要求1所述的锂电池保护板,其特征在于:所述接线端子突出于所述基板,所述接线端子为带有内螺纹的螺纹柱。
3.根据权利要求1所述的锂电池保护板,其特征在于:所述金属导体片贴敷在所述基板上,所述金属导体片与所述基板之间没有缝隙。
4.根据权利要求1所述的锂电池保护板,其特征在于:所述金属导体片上开设有若干避让孔和避让槽。
5.根据权利要求1所述的锂电池保护板,其特征在于:若干所述MOSFET呈矩阵分布,任意相邻两个MOSFET之间的距离相同。
6.根据权利要求1所述的锂电池保护板,其特征在于:所述散热器和基板上的对应位置开设有定位孔,所述定位孔处设置有与之配合的定位销,所述散热器通过定位孔和定位销配合锁合在基板上。
7.根据权利要求1所述的锂电池保护板,其特征在于:所述散热器的尺寸大小与所述基板的尺寸大小相同。
8.根据权利要求1所述的锂电池保护板,其特征在于:所述基板为PCB板、铝基板或玻纤板。
9.一种锂电池保护板的装配方法,其特征在于:包括以下步骤:在基板上进行合理布局设计,将MOSFET均匀呈矩阵摆布,在基板上预留金属导体片位置;根据预留位置在金属导体片上开设避让孔和避让槽,并在金属导体片上嵌入接线端子;根据接线端子的位置对基板上的电路进行开天窗设计,将接线端子焊接在开天窗位置,同时将金属导体片贴敷在基板上;将基板按照SMT的贴片工艺进行加工;在加工后的基板上开设有定位孔,通过定位孔将基板锁合在散热片上。
10.根据权利要求9所述的锂电池保护板的装配方法,其特征在于:所述接线端子突出于所述基板,所述接线端子为带有内螺纹的螺纹柱,在接线时,通过螺栓与螺纹柱配合接线。
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CN211406678U (zh) * | 2019-12-06 | 2020-09-01 | 华润微电子(重庆)有限公司 | 锂电池保护装置及锂电池组件 |
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CN211406678U (zh) * | 2019-12-06 | 2020-09-01 | 华润微电子(重庆)有限公司 | 锂电池保护装置及锂电池组件 |
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