CN112857605A - Temperature sensor, application thereof and method for preparing temperature sensing module - Google Patents
Temperature sensor, application thereof and method for preparing temperature sensing module Download PDFInfo
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- CN112857605A CN112857605A CN202110008587.0A CN202110008587A CN112857605A CN 112857605 A CN112857605 A CN 112857605A CN 202110008587 A CN202110008587 A CN 202110008587A CN 112857605 A CN112857605 A CN 112857605A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
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- G—PHYSICS
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- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
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Abstract
The invention discloses a temperature sensor, application thereof and a method for manufacturing a temperature sensing module, relates to the technical field of temperature sensors, and solves the problems of inaccurate measurement caused by the temperature hysteresis phenomenon of the temperature sensor and the lack of a flexible and small follow-up processing circuit of the conventional wearable temperature sensor. The temperature-sensitive layer is a temperature-sensitive layer which is prepared by spin coating and film forming of polyvinylidene fluoride, polyethylene oxide and conductive fillers, and the molecular weight of polyethylene oxide molecules of the first temperature-sensitive layer is smaller than or larger than that of polyethylene oxide molecules of the second layer. The invention adopts two temperature sensitive layers to realize high-precision detection, and the double sensitive layers can greatly reduce the probability of occurrence of data measurement contingency.
Description
Technical Field
The invention relates to the technical field of temperature sensors, in particular to a temperature sensor, application thereof and a method for preparing a temperature sensing module.
Background
The body temperature is one of five major factors of vital signs, and the real-time body temperature change and daily average body temperature reading of a patient can be monitored clinically, so that the body temperature plays an increasingly important role in disease diagnosis and subsequent treatment of the patient. In traditional medical care, body temperature is measured primarily by a nurse using a mercury thermometer. There are many deficiencies to measure by a nurse with a mercury thermodetector, and first, modern medical resources are scarce, patients to be cared for by a nurse and many matters to be handled, and measuring the body temperature of a patient with a mercury thermodetector aggravates the burden of the nurse. Second, today's hospital mercury temperature detectors do not detect patient temperature in real time, and thus may delay the patient's opportunity for optimal treatment.
Therefore, in the past decade, many efforts have been made to provide flexible, wearable and temperature sensors, and great development has been achieved. But there are many disadvantages to the practice. The high-precision temperature sensor has the temperature hysteresis phenomenon, namely the temperature is different in forward stroke and backward stroke, when a patient is fever from normal body temperature, the patient is detected by the forward stroke of the temperature sensor, after the patient has a fever, the temperature sensor enters the backward stroke, the patient with the fever is fever again, and the detection of the temperature sensor can be problematic. In addition, the wearable temperature sensors lack flexible and small follow-up processing circuits, and are integrally attached to the surface of a human body together with the temperature sensors, so that intelligent sensing is realized.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the invention provides a temperature sensor for solving the problems, application thereof and a method for preparing a temperature sensing module, wherein the problems are solved by the temperature sensor, and the temperature sensor is applied to the temperature sensor and the method for preparing the temperature sensing module.
The invention is realized by the following technical scheme:
a temperature sensor comprises a temperature sensing module with a laminated structure, wherein the temperature sensing module is connected with a flexible circuit board and is used for transmitting data to the flexible circuit board, and the flexible circuit board is used for processing the transmitted temperature data;
the laminated structure comprises two temperature sensitive layers, a plurality of electrodes are arranged between the two temperature sensitive layers and connected to a flexible circuit board through a lead, the flexible circuit board is used for processing electrode data, the temperature sensitive layers are made of polyvinylidene fluoride, polyethylene oxide and conductive fillers through spin coating, the molecular weight of polyethylene oxide molecules adjusts the sensitive temperature interval corresponding to the temperature sensitive layers, the conductive fillers are used for conducting the temperature sensitive layers, the polyvinylidene fluoride is used for stabilizing the physical form of the temperature sensitive layers, the two temperature sensitive layers comprise a first temperature sensitive layer and a second temperature sensitive layer, and the molecular weight of polyethylene oxide molecules of the first temperature sensitive layer is smaller than or larger than that of polyethylene oxide molecules of the second layer.
The conductive filler comprises graphite powder, the lead is a copper wire, and the electrode adopts a conductive silver paste electrode.
The flexible circuit board is also provided with a Bluetooth module and a battery, a microprocessor, digital-to-analog conversion and Bluetooth are integrated in the Bluetooth module, the Bluetooth module is used for processing data of the temperature sensing module and then transmitting the data to the terminal in a wireless mode, and the processing operation comprises analog-to-digital conversion;
the battery supplies power for the flexible circuit board, and bluetooth module application bluetooth 4.0 technique.
The electrode also comprises polydimethylsiloxane covered on the plurality of electrodes, and the polydimethylsiloxane has good biocompatibility and is suitable for being attached to the surface of a human body.
An application method of a temperature sensor, which applies the temperature sensor, comprises the following steps:
A. leading out a copper wire of the temperature sensing module to the outside of the temperature sensing module and welding the copper wire to a flexible circuit board, wherein the flexible circuit board is welded with a Bluetooth module and a battery;
B. and adhering the flexible circuit board to the top of the temperature sensing module, and fixing the flexible circuit board and the temperature sensing module to the armpit of the human body.
A preparation method of a temperature sensing module comprises the following steps:
step 4, drawing a solution in the mixed solution prepared in the step 3 by using a rubber head dropper, dropping the solution on polyimide, placing the polyimide on a spin coater, rotating to form a film, drying the film at a constant temperature, cutting the film to prepare a first temperature sensitive layer, repeating the steps 1, 2, 3 and 4, wherein the molecular weight of the weighed polyethylene oxide is different from the relative molecular weight of the polyethylene oxide in the step 1, drawing the solution in the mixed solution prepared in the step 3, dropping the solution on polyimide, placing the polyimide on the spin coater, drying the film after the film is formed by rotation, and cutting the film to prepare a second temperature sensitive layer;
and 5, preparing polydimethylsiloxane as a substrate, sequentially placing the first temperature sensitive layer, the electrode and the second temperature sensitive layer on the substrate, connecting a copper wire to two ends of the first temperature sensitive layer and the second temperature sensitive layer by using conductive silver paste, leading out the electrode by using the copper wire, finally, casting liquid polydimethylsiloxane in a gap between the two temperature sensitive layers, and curing to obtain the temperature sensing module.
The wearable flexible intelligent temperature sensor solves the problem of inaccurate measurement caused by the temperature hysteresis phenomenon of the temperature sensor: the temperature sensor has the temperature hysteresis phenomenon, the heating curve is different from the cooling curve, when a patient with fever has fever, the patient has fever again, the temperature sensor respectively detects the fever value of the patient at one time in the heating curve and the cooling curve, and the two values are not equal, thereby bringing confusion. The invention adopts two temperature sensitive layers, one sensitive region is in the human body temperature range, and the other sensitive region is wider than the first sensitive region. The two sensitive regions determine whether the temperature sensor is in a heating curve or a cooling curve, and the narrow sensitive region brings the advantage of high precision.
The invention has the following advantages and beneficial effects:
1. the wearable temperature sensor adopts the two temperature sensitive layers, the problem of inaccurate measurement caused by temperature hysteresis of the wearable temperature sensor with the sensitive region near the temperature of the human body is solved, high-precision detection is realized, and meanwhile, the probability of accidental data measurement is greatly reduced by the double sensitive layers.
2. The invention is matched with a flexible and small follow-up processing circuit, is applied to the armpit of a human body, can replace the traditional medical personnel to use a mercury thermometer for detection, has the characteristics of unattended operation and real-time detection, and realizes intelligent sensing.
3. The temperature sensitive layer of the invention is wrapped by polydimethylsiloxane with excellent biocompatibility, the circuit part adopts a flexible circuit board, electronic elements adopted on the flexible circuit board are very small and exquisite, and finally the flexible circuit board is stuck to the armpit of a human body by a medical adhesive tape, so the temperature sensitive layer is very simple, convenient and safe in use.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:
FIG. 1 is a schematic diagram of the present invention.
Fig. 2 is a process flow chart of the temperature sensing preparation of the wearable flexible intelligent sensor for medical treatment according to the invention.
Fig. 3 is a graph illustrating temperature hysteresis of the temperature sensor.
FIG. 4 is a graph illustrating a solution to temperature hysteresis according to the present invention.
Fig. 5 is a graph of temperature characteristics of the temperature sensor experiment of the present invention.
Reference numbers and corresponding part names in the drawings:
1. a flexible circuit board; 2. a laminated structure; 3. a wire; 4. and an electrode.
Detailed Description
Hereinafter, the term "comprising" or "may include" used in various embodiments of the present invention indicates the presence of the invented function, operation or element, and does not limit the addition of one or more functions, operations or elements. Furthermore, as used in various embodiments of the present invention, the terms "comprises," "comprising," "includes," "including," "has," "having" and their derivatives are intended to mean that the specified features, numbers, steps, operations, elements, components, or combinations of the foregoing, are only meant to indicate that a particular feature, number, step, operation, element, component, or combination of the foregoing, and should not be construed as first excluding the existence of, or adding to the possibility of, one or more other features, numbers, steps, operations, elements, components, or combinations of the foregoing.
In various embodiments of the invention, the expression "or" at least one of a or/and B "includes any or all combinations of the words listed simultaneously. For example, the expression "a or B" or "at least one of a or/and B" may include a, may include B, or may include both a and B.
Expressions (such as "first", "second", and the like) used in various embodiments of the present invention may modify various constituent elements in various embodiments, but may not limit the respective constituent elements. For example, the above description does not limit the order and/or importance of the elements described. The foregoing description is for the purpose of distinguishing one element from another. For example, the first user device and the second user device indicate different user devices, although both are user devices. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of various embodiments of the present invention.
It should be noted that: if it is described that one constituent element is "connected" to another constituent element, the first constituent element may be directly connected to the second constituent element, and a third constituent element may be "connected" between the first constituent element and the second constituent element. In contrast, when one constituent element is "directly connected" to another constituent element, it is understood that there is no third constituent element between the first constituent element and the second constituent element.
The terminology used in the various embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the various embodiments of the invention. As used herein, the singular forms are intended to include the plural forms as well, unless the context clearly indicates otherwise. Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which various embodiments of the present invention belong. The terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning that is consistent with their contextual meaning in the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein in various embodiments of the present invention.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to examples and accompanying drawings, and the exemplary embodiments and descriptions thereof are only used for explaining the present invention and are not meant to limit the present invention.
Example 1:
a temperature sensor comprises a temperature sensing module with a laminated structure 2, wherein the temperature sensing module is connected with a flexible circuit board 1 and transmits data to the flexible circuit board 1, and the flexible circuit board 1 processes the transmitted temperature data;
the laminated structure 2 comprises two temperature sensitive layers, a plurality of electrodes 4 are arranged between the two temperature sensitive layers, the electrodes 4 are connected to a flexible circuit board 1 through leads 3, the flexible circuit board 1 is used for processing data of the electrodes 4, the temperature sensitive layers are made of polyvinylidene fluoride, polyethylene oxide and conductive fillers through spin coating, the molecular weight of the polyethylene oxide molecules is adjusted to correspond to the sensitive temperature range of the temperature sensitive layers, the conductive fillers are used for conducting electricity of the temperature sensitive layers, the polyvinylidene fluoride is used for stabilizing the physical form of the temperature sensitive layers, and the molecular weights of the polyethylene oxide molecules of the two temperature sensitive layers are different.
The conductive filler comprises graphite powder, the lead 3 is a copper wire, and the electrode 4 is a conductive silver paste electrode 4.
The flexible circuit board 1 is also provided with a Bluetooth module and a battery, a microprocessor, digital-to-analog conversion and Bluetooth are integrated in the Bluetooth module, the Bluetooth module is used for processing data of the temperature sensing module and then transmitting the data to a terminal in a wireless mode, and the processing operation comprises analog-to-digital conversion;
the battery supplies power for flexible circuit board 1, and bluetooth module application bluetooth 4.0 technique.
Also included is polydimethylsiloxane coated on the plurality of electrodes 4.
An application method of a temperature sensor, which applies the temperature sensor, comprises the following steps:
A. leading out a copper wire of the temperature sensing module to the outside of the temperature sensing module and welding the copper wire to a flexible circuit board 1, wherein the flexible circuit board 1 is welded with a Bluetooth module and a battery;
B. and adhering the flexible circuit board 1 to the top of the temperature sensing module, and fixing the flexible circuit board 1 and the temperature sensing module to the armpit of a human body.
A method for manufacturing a temperature sensing module, as shown in fig. 2, includes the following steps:
step 4, drawing 1-3 ml of solution in the mixed solution prepared in the step 3 by using a rubber head dropper, dropping the solution on polyimide, placing the polyimide on a spin coater, rotating at 1000rpm for 15 seconds to form a film, drying at 60 ℃ for 120min, cutting the film into a shape of 1cm x 2cm to prepare a first temperature sensitive layer, repeating the steps 1, 2, 3 and 4, wherein the relative molecular weight of the weighed polyoxyethylene is 4000k, drawing 1-3 ml of solution in the mixed solution prepared in the step 3 at this time by using the rubber head dropper, dropping the solution on the polyimide, placing the polyimide on the spin coater, rotating at 1000rpm for 15 seconds to form a film, drying at 60 ℃ for 120min, cutting the solution into a shape of 1cm x 2cm to prepare a second temperature sensitive layer;
and 5, preparing polydimethylsiloxane with the thickness of 1-10 mm as a substrate, sequentially placing a first temperature sensitive layer, an electrode 4 and a second temperature sensitive layer on the substrate, connecting a copper wire to two ends of the first temperature sensitive layer and the second temperature sensitive layer by conductive silver paste, leading out the electrode 4 by the copper wire, finally, casting liquid polydimethylsiloxane in a gap between the two temperature sensitive layers, and curing at a constant temperature of 70 ℃ for 120min to obtain the temperature sensing module.
Example 2, on the basis of example 1, the flexible circuit board 1 is designed to have a size of 20mm x 30mm, and the bluetooth module and the battery are soldered on the flexible circuit board 1. The size of the Bluetooth module is 11.2mm 15.2mm, a microprocessor, digital-to-analog conversion and Bluetooth are integrated in the Bluetooth module, the Bluetooth adopts the latest Bluetooth 4.0 technology, the average current of data sent once is 0.6mA, and the duration is 3.2 ms. The battery size is 3mm 9mm 13mm, and the capacity is 40mA, can support bluetooth to send data 7000 ten thousand. Copper line welding to flexible circuit board 1 that the temperature perception module was drawn forth, and flexible circuit part and temperature perception module pass through the glue adhesion, paste in the armpit of human body through medical sticky tape at last, realize unmanned on duty, real-time detection's characteristics.
Example 3 on the basis of example 1 or 2, as shown in figures 3, 4, 5,
fig. 3(a) shows a temperature hysteresis curve of the temperature sensor, i.e., a temperature characteristic curve of temperature rise and a temperature curve of temperature cooling are not consistent, which causes a problem that the measurement is incorrect.
Fig. 4(a) illustrates the narrow range of temperature profile variation, and the H-segment curve illustrates the process of a normothermic person reaching the body temperature b from the normothermic point a due to fever, which has a large resistance variation and is therefore easily detected. The J-section curve describes the process of a fever person's body temperature from the fever body temperature b point, continuing to achieve a high fever, and then bringing back to the normal body temperature c point. The curve at segment k describes the process by which a person with fever reaches the temperature point d from the normothermic temperature c. The resistance values of the points a and d measured by the temperature sensors are equal, the point a corresponds to the normal body temperature, and the point d corresponds to the fever body temperature, so that the health state of the patient cannot be judged by measuring the data of the point d when the patient has a fever for the second time.
Fig. 4(b) illustrates a wide range of temperature characteristic curve variation, and the wide range of temperature characteristic curve has a wide range of detected temperatures, so that only the temperature rise curve is analyzed. Also analyzed by the narrow range temperature profile method just analyzed, the curve at segment H1 describes the process of resistance change of a normothermic person from normothermic point a to fever point b, which is relatively small and not easily detected. The curve of section J1 describes the process of a fever patient's body temperature from the b point of fever body temperature, with a sustained high fever, followed by a return of the fever to the c point of normal body temperature. The curve at K1 describes the process by which a person with fever reaches the temperature point d from the normothermic temperature c. As is clear from fig. 4(b), the points a and d are different as detected by a wide range of temperature characteristics.
In summary, in the process from the point a of the normal body temperature to the point b of the body temperature of the patient, the narrow-range temperature characteristic curve detects a larger resistance value change, and the wide-range temperature characteristic curve detects a smaller resistance value change, so that the first fever condition of the patient can be easily detected by adopting the narrow-range rising temperature characteristic curve. When the patient has a second fever and reaches the body temperature d point again from the fever-reducing body temperature c point, the narrow-range temperature characteristic curve detects that the value of the d point is approximate to the point a, so that the health condition of the patient cannot be judged by only depending on the narrow-range temperature characteristic curve, the wide-range temperature characteristic curve detects a larger resistance value change, and the narrow-range temperature characteristic curve can be judged to be in a cooling curve at the moment and judge the second fever of the patient. The double temperature sensitive layers are adopted, the problem that the temperature sensor is inaccurate in measurement in the temperature range of a human body due to the temperature hysteresis phenomenon is solved, meanwhile, the double temperature sensitive layers collect two kinds of data, and the probability of accidental data measurement can be greatly reduced through comparison of the two sets of data.
FIG. 5 is a temperature characteristic curve diagram of the temperature sensing module at 1500K and 4000K for polyethylene oxide molecular weight, and it can be seen that the temperature characteristic curve diagram measured by experiment is different for polyethylene oxide with different molecular weights. As shown in FIG. 5(a), when polyethylene oxide having a molecular weight of 1500 is used, the temperature range in which the resistance change is significant is 41 ℃ to 46 ℃. As shown in FIG. 5(b), when polyethylene oxide having a molecular weight of 4000K is used, the temperature range in which the resistance change is significant is 60 ℃ to 67 ℃. Therefore, the temperature range with obvious resistance change can be shifted to the temperature range of the human body by adjusting the molecular weight of the polyoxyethylene.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (7)
1. The temperature sensor is characterized by comprising a temperature sensing module of a laminated structure (2), wherein the temperature sensing module is connected with a flexible circuit board (1), the temperature sensing module transmits data to the flexible circuit board (1), and the flexible circuit board (1) processes the transmitted temperature data;
the laminated structure (2) comprises two temperature sensitive layers, a plurality of electrodes (4) are arranged between the two temperature sensitive layers, the electrodes (4) are connected to the flexible circuit board (1) through leads (3), the flexible circuit board (1) is used for processing data of the electrodes (4), the temperature sensitive layers are made of polyvinylidene fluoride, polyethylene oxide and conductive filler through spin coating and film forming, the two temperature sensitive layers comprise a first temperature sensitive layer and a second temperature sensitive layer, and the molecular weight of polyethylene oxide molecules of the first temperature sensitive layer is smaller than or larger than that of polyethylene oxide molecules of the second temperature sensitive layer.
2. A temperature sensor according to claim 1, wherein the conductive filler comprises graphite powder, the wire (3) is copper wire, and the electrode (4) is conductive silver paste electrode (4).
3. The temperature sensor according to claim 1, wherein the flexible circuit board (1) is further provided with a Bluetooth module and a battery, the Bluetooth module is internally integrated with a microprocessor, digital-to-analog conversion and Bluetooth, the Bluetooth module is used for processing data of the temperature sensing module and then transmitting the data to a terminal in a wireless manner, and the processing operation comprises analog-to-digital conversion;
the battery supplies power for the flexible circuit board (1), and the bluetooth module uses bluetooth 4.0 technique.
4. A temperature sensor according to claim 1, further comprising polydimethylsiloxane overlying the plurality of electrodes (4).
5. A method for using a temperature sensor, characterized in that a temperature sensor according to any one of claims 1-4 is used, and the steps are as follows:
A. leading out a copper wire of the temperature sensing module to the outside of the temperature sensing module and welding the copper wire to a flexible circuit board (1), wherein the flexible circuit board (1) is welded with a Bluetooth module and a battery;
B. and adhering the flexible circuit board (1) to the top of the temperature sensing module, and fixing the flexible circuit board (1) and the temperature sensing module to the armpit of a human body.
6. A preparation method of a temperature sensing module is characterized by comprising the following steps:
step 1, taking purified water, putting the purified water into a magnetic rotor, putting a beaker on a constant-temperature magnetic stirrer, taking polyoxyethylene powder, adding the polyoxyethylene powder into the purified water, and uniformly stirring the solution;
step 2, taking graphite powder, adding the graphite powder into the stirred solution prepared in the step 1, performing ultrasonic treatment and stirring twice, cooling and placing the solution between the two times, and performing secondary treatment to obtain a mixed solution;
step 3, adding polyvinylidene fluoride into the mixed solution prepared in the step 2, adding a dispersing agent, and uniformly stirring and dissolving;
step 4, drawing a solution in the mixed solution prepared in the step 3 by using a rubber head dropper, dropping the solution on polyimide, placing the polyimide on a spin coater, rotating to form a film, drying the film at a constant temperature, cutting the film to prepare a first temperature sensitive layer, and repeating the steps 1, 2, 3 and 4, wherein the molecular weight of the weighed polyethylene oxide is different from the relative molecular weight of the polyethylene oxide in the step 1, the two temperature sensitive layers comprise a first temperature sensitive layer and a second temperature sensitive layer, and the molecular weight of polyethylene oxide molecules in the first temperature sensitive layer is smaller than or larger than that of polyethylene oxide molecules in the second temperature sensitive layer; drawing a solution in the mixed solution prepared in the step 3 by using a rubber head dropper, dropping the solution on polyimide, placing the polyimide on a spin coater, drying after rotating to form a film, and cutting to obtain a second temperature sensitive layer;
and 5, preparing polydimethylsiloxane as a substrate, sequentially placing the first temperature sensitive layer, the electrode (4) and the second temperature sensitive layer on the substrate, connecting a copper wire to two ends of the first temperature sensitive layer and the second temperature sensitive layer by using conductive silver paste, leading out the electrode (4) by using the copper wire, finally, casting liquid polydimethylsiloxane in a gap between the two temperature sensitive layers, and curing to obtain the temperature sensing module.
7. The method for manufacturing a temperature sensing module according to claim 6, comprising the following detailed steps:
step 1, measuring 20ml of purified water by using a beaker, then placing the beaker into a magnetic rotor, placing the beaker on a constant-temperature magnetic stirrer, weighing 0.6g of polyoxyethylene powder with the relative molecular weight of 1000-1500, adding the polyoxyethylene powder into the beaker, and uniformly stirring the solution for 60min at the rotating speed of 500 rpm;
step 2, weighing 0.8g of graphite powder, adding the weighed 0.8g of graphite powder into the stirred solution prepared in the step 1, carrying out ultrasonic treatment for 30min, raising the temperature of the solution in the beaker after ultrasonic stirring, cooling for 5min, continuing the ultrasonic treatment for 30min, and uniformly stirring the solution at the rotating speed of 500rpm for 60min to obtain a mixed solution;
step 3, weighing 0.6g of polyvinylidene fluoride, adding the weighed 0.6g of polyvinylidene fluoride into the mixed solution prepared in the step 2, adding 10ml of dispersing agent, and uniformly stirring the solution for 240min at the temperature of 150 ℃ and the rotating speed of 500 rpm;
step 4, drawing 1-3 ml of solution in the mixed solution prepared in the step 3 by using a rubber head dropper, dropping the solution on polyimide, placing the polyimide on a spin coater, rotating at 1000rpm for 15 seconds to form a film, drying at 60 ℃ for 120min, cutting the film into a shape of 1cm x 2cm to prepare a first temperature sensitive layer, repeating the steps 1, 2, 3 and 4, wherein the relative molecular weight of the weighed polyoxyethylene is 4000k, drawing 1-3 ml of solution in the mixed solution prepared in the step 3 at this time by using the rubber head dropper, dropping the solution on the polyimide, placing the polyimide on the spin coater, rotating at 1000rpm for 15 seconds to form a film, drying at 60 ℃ for 120min, cutting the solution into a shape of 1cm x 2cm to prepare a second temperature sensitive layer;
and 5, preparing polydimethylsiloxane with the thickness of 1-10 mm as a substrate, sequentially placing a first temperature sensitive layer, an electrode (4) and a second temperature sensitive layer on the substrate, connecting copper wires to two ends of the first temperature sensitive layer and the second temperature sensitive layer by conductive silver paste, leading out the electrode (4) by using the copper wires, finally, casting liquid polydimethylsiloxane in a gap between the two temperature sensitive layers, and curing for 120min at a constant temperature of 70 ℃ to obtain the temperature sensing module.
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