KR20180049898A - Wearable device - Google Patents

Abstract

The present invention relates to a wearable device which comprises: a substrate; a bonding part on which a conductive film is coated to be bonded; and a multi-channel sensor part formed on a plurality of flexible films symmetrical with respect to the bonding part to be parallel-bonded, wherein the multi-channel sensor part is bonded to the substrate through the bonding part and the flexible films. Therefore, mechanical stability for a part in which electrical bonding of the patch type wearable device occurs can be secured by using the bonding part and the flexible film.

Description

WEARABLE DEVICE

More particularly, the present invention relates to a wearable device, and more particularly, to a wearable device having a bonding portion coated with a conductive film, and a plurality of flexible films symmetrically bonded in parallel with each other on the basis of the bonding portion, To a wearable device capable of securing mechanical stability against a portion thereof.

Wearable devices refer to electronic devices that can always be used in case of emergency, since they can be worn on the human body. Recently, wearable devices are expected to play an important role in the future human life. Among these wearable devices, in order to realize a high-performance electronic device that can be attached to the skin thin and light, an extendable electronic device is manufactured using a very thin film and a meander-shaped electrode.

However, conventional wearable devices are mostly in the form of making electronic devices on a rigid board, and simply wearing / wearing these devices. These devices are actually wearable / wearable, but they have disadvantages in that they are bulky and heavy in weight, making them uncomfortable in everyday life.

In order to overcome the disadvantages of such conventional wearable devices, wearable electronic devices of a band type or flexible patch type have been studied and commercialized accordingly.

More specifically, the wearable devices may be formed in a band form or a patch form, and the patchable wearable electronic devices may be formed in a form including a sensor capable of measuring a biological signal on a flexible substrate that can be attached to the skin .

However, such a conventional patch type wearable electronic device has a problem in that it is easily damaged by a user's motion or mechanical bending due to use of the device by applying the existing method of bonding the sensor on the flexible substrate.

Hereinafter, an exemplary embodiment of a wearable device to which conventional ACF bonding is applied will be described in detail with reference to FIG.

FIG. 1 shows an example of a wearable device to which conventional ACF bonding is applied.

Referring to FIG. 1, a conventional wearable device includes an ACF bonder (an anisotropic conductive film bonder) on a substrate 10 for bonding a flexible substrate 10 to a sensor 20 for measuring biometric information of the body, ) Was used for bonding (30) by thermocompression bonding.

However, the conventional wearable device to which the ACF bonding 30 method is applied is easily detached or damaged as the mechanical joint portion is bent due to the movement or use of the user, so that the measurement stability of the biometric information using the resistance film type wearable device Accuracy was questioned.

Korean Registered Patent No. 10-1009976 (Jan. 14, 2011), "Plasma Display Device" Korean Patent Publication No. 10-2010-0030505 (Mar. 18, 2010), "Semiconductor Package"

An object of the present invention is to provide a method for manufacturing a flexible printed circuit board, which comprises applying a conductive film of ACF to a portion where electrical bonding occurs, And to provide a wearable device capable of securing stability.

It is still another object of the present invention to provide a wearable device capable of acquiring accurate temperature information on a contact area of a measurement object by manufacturing a multi-channel sensor in a patch shape.

Another object of the present invention is to provide a wearable device capable of sensing temperature information in a wide contact area or a different area of a measurement object and measuring an average value of sensed temperature information to acquire information on a more accurate measurement object .

A wearable device according to an embodiment of the present invention includes a substrate, a bonding portion coated with a conductive film coated on the substrate, and a multi-channel sensor portion formed on a plurality of flexible films bonded symmetrically with respect to the bonding portion And the multi-channel sensor unit is bonded to the substrate through the adhesive portion and the flexible film.

The bonding portion may include a connection member formed of heat and pressure coated with the conductive film of ACF (Anisotropic Conductive Film) on a portion where electrical bonding is formed on the substrate.

The flexible film is formed in parallel with the first flexible film and the second flexible film at predetermined intervals based on the adhesive portion, and can be adhered to the substrate by an adhesive.

The multi-channel sensor unit may be formed of a multi-channel platinum (Pt) resistive film, the multi-channel sensor unit may be formed by transferring the multi-channel patterned by a photolithography process, The multi-channel may be formed on a film formed of a polyimide solution.

In addition, the multi-channel sensor unit may include the multi-channel formed in a meander pattern.

The multi-channel sensor unit may be formed in a patch-like structure by being connected to an IC circuit formed on the substrate.

According to the embodiment of the present invention, a conductive film of ACF is coated on a portion where electrical bonding occurs, and a connection member formed by heat and pressure, and a plurality of flexible films which are symmetrically and parallel- The mechanical stability according to the present invention can be secured.

According to another embodiment of the present invention, accurate temperature information on the contact area of the measurement object can be obtained by manufacturing a multi-channel sensor in a patch shape.

According to another embodiment of the present invention, temperature information in a wide contact area or different areas of a measurement object is sensed, and an average value of sensed temperature information is measured to obtain information on a more accurate measurement object .

FIG. 1 shows an example of a wearable device to which conventional ACF bonding is applied.
FIG. 2 illustrates an example of implementing a wearable device according to an embodiment of the present invention.
3 is a view for explaining an embodiment of a multi-channel sensor unit according to an embodiment of the present invention.
4A and 4B show results of resistance values according to temperature changes of a measurement object using a temperature sensor constituted by a single channel.
5 shows a result of a resistance value according to a temperature change of a measurement object using a temperature sensor including a single channel.
6 is a graph showing a result of a resistance value with respect to temperature change of a measurement object using a multi-channel sensor unit according to an embodiment of the present invention.
7 is a graph showing a result of a deviation value according to a temperature change of a measurement object using a multi-channel sensor unit according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings and accompanying drawings, but the present invention is not limited to or limited by the embodiments.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. It is noted that the terms "comprises" and / or "comprising" used in the specification are intended to be inclusive in a manner similar to the components, steps, operations, and / Or additions.

As used herein, the terms "embodiment," "example," "side," "example," and the like should be construed as advantageous or advantageous over any other aspect or design It does not.

Also, the term 'or' implies an inclusive or 'inclusive' rather than an exclusive or 'exclusive'. That is, unless expressly stated otherwise or clear from the context, the expression 'x uses a or b' means any of the natural inclusive permutations.

Also, the phrase "a" or "an ", as used in the specification and claims, unless the context clearly dictates otherwise, or to the singular form, .

Furthermore, the terms first, second, etc. used in the specification and claims may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. The terminology used herein is a term used for appropriately expressing an embodiment of the present invention, which may vary depending on the user, the intent of the operator, or the practice of the field to which the present invention belongs. Therefore, the definitions of these terms should be based on the contents throughout this specification.

FIG. 2 illustrates an example of implementing a wearable device according to an embodiment of the present invention.

Referring to FIG. 2, the wearable device 200 according to the embodiment of the present invention includes a substrate 210, a connection member formed by coating a conductive film on the substrate 210, Lt; / RTI >

To this end, the wearable device 200 according to the embodiment of the present invention includes a substrate 210, a bonding portion 220, and a multi-channel sensor portion 230.

The substrate 210 may be formed of any one of paper, polymer, woven fabric, and insulated metal foil.

According to an embodiment, the substrate 210 can be made of a material that can be attached to the skin, such as polyimide, polycarbonate, polyacylate, polyether imide, polyether sulfone, And may be made of at least one material selected from the group consisting of polyethyleneterephthalate and polyethylene naphthalate.

The bonding portion 220 is coated with a conductive film on the substrate 210 to be bonded.

The bonding portion 220 may be formed of heat and pressure by coating the conductive film of ACF (Anisotropic Conductive Film) on a portion where electrical bonding on the substrate 210 occurs.

More specifically, the bonding portion 220 may include a connection member 221 coated with a conductive film of ACF to form heat and pressure, and the connection member 221 may be formed with a small electrode pattern. The electrode pattern may be formed of at least one of gold (Au), platinum (Pt), titanium (Ti), chrome (Cr), and aluminum (Al).

According to the embodiment, since the connection member 221 of the bonding portion 220 is a portion requiring electrical connection with the multi-channel sensor portion 230 having multi-channels by ACF bonding, the metal layer is exposed It is not necessary to perform an insulation process.

The multi-channel sensor unit 230 is formed on the flexible film 231 symmetrically joined in parallel with the adhesive 220. More specifically, the multi-channel sensor unit 230 is bonded to the substrate 210 through the bonding portion 220 and the flexible film 231.

For example, the multi-channel sensor unit 230 is formed on the bonding portion 220 including the flexible film 231 and the connection member 221, and includes a connection member 221 coated with a conductive film (ACF) (not shown).

The flexible film 231 is formed in parallel with the first flexible film 231a and the second flexible film 231b at predetermined intervals based on the bonding portion 220 and can be adhered onto the substrate 210 by an adhesive have.

For example, the flexible film 231 may be a transparent flexible substrate, and examples of the transparent flexible substrate include polydimethylsiloxane (PDMS), polyethersulfone (PES), poly (3,4-ethylenedioxy Poly (3,4-ethylenedioxythiophene), poly (styrenesulfonate), polyimide, polyurethane, polyester, perfluoropolyether ( Perfluoropolyether (PFPE), polycarbonate, or a combination of the above polymers.

The flexible film 231 may be any one of conductive carbon, a semiconductor substrate, an oxide substrate, and a polymer substrate, but is not limited thereto.

According to an embodiment, the substrate 210 may include structural features such that a plurality of the flexible films 231 may be formed, and the flexible film 231 may be bonded to the substrate 210 with a bond or an instant adhesive .

Hereinafter, the multi-channel sensor unit 230 included in the wearable device 200 according to the embodiment of the present invention will be described in detail with reference to FIG.

3 is a view for explaining an embodiment of a multi-channel sensor unit according to an embodiment of the present invention.

3, the multi-channel sensor unit 230 includes a plurality of temperature sensors 231, and the plurality of temperature sensors 231 includes a plurality of temperature sensors 231, .

Each of the plurality of temperature sensors 231 is formed by transferring a multi-channel 232 patterned by a photolithography process to a sensor part substrate, and the multi-channel 232 is formed by a film formed of a polyimide solution (Pt) resist film method on a film.

The multichannel 232 may be formed in a meander pattern that is meandering to cover a relatively large area.

According to an embodiment, the multichannel 232 may be a meander pattern with a helical, rectangular loop, a pair of intermeshed meander patterns, a pair of separate discrete source patterns in the inner helix A meander pattern with a small rectangular loop formed in a large loop, a meander pattern with a small circular or an elliptical loop formed in a large loop, and a series of spiral patterns with a common central axis And may be formed in at least one of the patterns, and the patterns of the above-described types may be arranged in a matrix of a series or a parallel.

Also, the multi-channel 232 may be a negative temperature coefficient thermistor.

Depending on the embodiment, multi-channel 232 may use a printed NTC (Negative Temperature Coefficient) thermistor, but is not limited to printed NTC thermistors. For example, the multichannel 232 is equally applicable to any flexible temperature sensor in which the resistance varies with temperature and can be implemented using a PTC (Positive Temperature Coefficient) thermistor, an RTD (Resistance Temperature Device) Or any device manufactured on the material.

The sensor part substrate may be formed of at least one of a paper, a polymer, a woven fabric, and an insulated metal foil.

According to an embodiment, the sensor part substrate may be made of a polymeric material such as polyimide, polycarbonate, polyacylate, polyether imide, polyether sulfone, polyethylene terephthalate (polyethylene terephthalate) and polyethylene naphthalate (polyethylene naphthalate).

Referring again to FIG. 3, the plurality of temperature sensors 231 according to the embodiment of the present invention may include a terminal 233 for measuring a resistance value with respect to a temperature of a measurement object.

The measurement object may be at least one of a skin surface of a human being, a surface of a plant leaf, a food requiring temperature regulation, and a medical article, but the present invention is not limited thereto, and any material can be used if temperature measurement is required.

The terminal 233 may be connected to both ends of the multi-channel 232, and the resistance value of the measurement object may be measured.

The terminal 233 may be formed in each of the plurality of temperature sensors 231 and may measure the resistance value by the multi-channel sensor unit 230 constituted by the plurality of temperature sensors 231 have.

The multi-channel sensor unit 230 according to the embodiment of the present invention can calculate the average temperature by measuring the temperature at a plurality of points of the measurement object according to the positions where the plurality of temperature sensors 231 are disposed.

According to the embodiment, the multi-channel sensor unit 230 may be implemented in a patch shape to measure an accurate temperature of the contact surface of the measurement object. More specifically, the multi-channel sensor unit 230 may be implemented in a patch shape to be in close contact with the measurement object, and may be formed in various shapes (shapes) according to the area or characteristics of the measurement object, Can be attached to the object. That is, the multi-channel sensor unit 230 can measure a resistance value according to an average temperature of a plurality of points of a measurement object having a large area.

Referring again to FIG. 2, the multi-channel sensor unit 230 may be formed in a patch-like structure connected to an IC circuit formed on the substrate 210.

The IC circuit may process the filtering, amplifying, digitizing and processing functions of the signal by using an integration technique, and the IC circuit may include an integrated and multi-functional IC sensor circuit sensor.

For example, the multi-channel sensor unit 230 is formed on the first flexible film 231a and the second flexible film 231b bonded on the substrate 210 to cover the flexible film 231 However, the structure and the form in which the multi-channel sensor unit 230 is formed on the flexible film 231 and the adhesive portion 220 on the substrate 210 are not limited thereto, and the wearable device according to the embodiment of the present invention It can be applied variously based on the applied examples.

The multi-channel of the multi-channel sensor unit 230 may be in contact with the connecting member 221 of the bonding portion 220. [

The wearable device 200 according to an embodiment of the present invention includes a communication unit (not shown) for transmitting a resistance value measured from the multi-channel sensor unit 230 to the outside, a power supply unit (not shown) for supplying driving power, And an average calculating unit (not shown) for calculating an average temperature value for the measurement object based on the resistance value measured from the channel.

The communication unit may transmit any one of the resistance value and the average temperature value measured by the multi-channel sensor unit 230 to the outside.

For example, the communication unit can transmit and receive measured values at different transmission bandwidths, and at least one of ZigBee, Bluetooth, GeWave, and WiFi can be applied according to coverage.

Here, the external may be a terminal of a user or an administrator, or an external server. According to an embodiment, the outside may include an application processor for data transmission / reception, control command generation, and data display.

According to the embodiment, any one of the resistance value and the average temperature value measured from the multi-channel sensor unit 230 may be stored in an external database and provided at the request of the terminal or the external server.

Here, the terminal may be at least one of a terminal, a smart phone, a tablet PC, and a PC owned by a user or an administrator, but the terminal is not limited thereto.

The power supply unit may supply the driving power of at least one of the multi-channel sensor unit 230, the communication unit, and the average calculation unit.

For example, the power supply unit may be composed of an active element using an ultra-small charge / discharge battery or a super-capacitor.

Depending on the embodiment, the power supply may be a secondary battery such as a coin battery or a secondary battery such as a lithium-polymer battery. When the power supply unit is a secondary battery, it may be charged by an external power source, and may be replaced when it is a primary battery such as a coin battery.

According to another embodiment, the power supply unit may be formed on the substrate 210 of the wearable device 200 and may supply the driving power of the multi-channel sensor unit 230.

The average calculator may calculate an average value of the temperatures of the measurement object based on the resistance value of each of the multi-channels measured by the multi-channel sensor unit 230.

For example, the average calculator may calculate an average temperature of a plurality of temperature sensors by excluding a specific one of the plurality of temperature sensors based on the resistance value sensed from each of the multi-channels.

As another example, the average calculator may calculate the resistance value of the temperature sensor from the remaining temperature sensors, except for the temperature sensor that indicates the highest or lowest temperature among the plurality of temperature sensors based on the resistance value sensed from each of the multi- The average value may be calculated.

As another example, the average calculating unit may calculate an average value of the temperature by excluding a temperature sensor that detects a sudden temperature change exceeding a predetermined reference among a plurality of temperature sensors.

The above-described configuration of the average calculating unit may be implemented by a control unit (not shown) included in the wearable device according to an embodiment of the present invention. In another embodiment, a control command Or may be driven on the basis of.

4A and 4B show results of resistance values according to temperature changes of a measurement object using a temperature sensor constituted by a single channel.

More specifically, FIG. 4A is a graph illustrating a resistance value of a measurement object measured at intervals of 10 DEG C from 30 DEG C to 80 DEG C using a temperature sensor including a single channel, FIG. 4B is a graph showing a temperature And the resistance value of the object to be measured is measured at intervals of 1 占 폚 from 30 占 폚 to 40 占 폚 using a sensor and at intervals of 0.5 占 폚 from 36 占 폚 to 38 占 폚.

4A and 4B, it can be seen that the temperature sensor composed of a single channel has a limit to objectively and precisely measure the temperature of a measurement object to be measured, because the temperature accuracy varies with the attachment position or area of the measurement object .

FIG. 5 shows the results of resistance values according to temperature changes of a measurement object using a temperature sensor including a single channel and a multi-channel.

More specifically, FIG. 5 illustrates a temperature sensor for measuring a temperature using a single channel and a temperature sensor for measuring an average value of 4 channels using multi-channels according to an embodiment of the present invention. FIG. 5 is a graph showing a resistance value versus a temperature change of a measurement object according to each of the multi-channel sensor units. FIG.

Referring to FIG. 5, it can be seen that the multi-channel sensor unit according to the embodiment of the present invention formed with multi-channels exhibits a higher resistance value than a temperature sensor formed with a single channel.

That is, it can be seen that the difference between the resistance value measured from the multi-channel sensor unit according to the embodiment of the present invention and the resistance value measured from the temperature sensor formed with a single channel is large.

Since the temperature sensor formed with a single channel relies on a single channel and detects the resistance value according to the temperature change of the measurement object, the accuracy of the sensor for sensing the temperature is likely to be low. On the other hand, the multi-channel sensor unit according to the embodiment of the present invention can calculate the average value based on the resistance value measured from the multi-channel and calculate the average temperature value, thereby increasing the temperature accuracy compared to the single channel.

6 is a graph showing a result of a resistance value with respect to temperature change of a measurement object using a multi-channel sensor unit according to an embodiment of the present invention.

More specifically, FIG. 6 shows a resistance value according to a temperature change of a measurement object using a plurality of sensors (Sensor 1, Sensor 2, Sensor 3, Sensor 4) formed in a single channel, 4 is a graph illustrating a result of an average value (averaging value of 4 channels) according to a temperature change of a measurement object using a multi-channel sensor unit according to an embodiment of the present invention.

Referring to FIG. 6, it can be seen that a plurality of sensors formed with a single channel exhibit different resistance values even at the same temperature. This is because some errors may occur due to the location and characteristics of the measurement object to which a plurality of sensors are attached, and environmental factors such as weather.

Accordingly, the multi-channel sensor unit according to the embodiment of the present invention can calculate a more accurate temperature by calculating the average value of the resistance values measured from the multi-channel (4 channels), and provide a result of highly reliable calculation .

7 is a graph showing a result of a deviation value according to a temperature change of a measurement object using a multi-channel sensor unit according to an embodiment of the present invention.

More specifically, FIG. 7 is a flow chart illustrating a method of measuring a temperature of a single channel using a multi-channel sensor unit according to an embodiment of the present invention for measuring an average temperature value (Averaging of 4 channels) Fig. 5 is a graph showing a deviation result according to a temperature change from 0 deg. C to 50 deg.

Referring to FIG. 7, in the case of measuring the average value of the temperature of the measurement object based on the resistance value measured from the multi-channel sensor unit according to the embodiment of the present invention including multi-channels, And the deviation is smaller than that when the temperature is measured.

For example, a temperature sensor including a single channel can detect the accuracy of temperature sensing by a factor of at least one of a position of an object to be measured, a characteristic of the object to be measured, a malfunction of the channel, It is more likely to be lower than the average temperature value measured from the multi-channel sensor unit according to the embodiment of the present invention.

Accordingly, the multi-channel sensor unit according to the embodiment of the present invention formed of a plurality of multi-channels can reduce the error due to the above-described factors by calculating the average value of the temperature of the measurement object, .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. For example, it is to be understood that the techniques described may be performed in a different order than the described methods, and / or that components of the described systems, structures, devices, circuits, Lt; / RTI > or equivalents, even if it is replaced or replaced.

Therefore, other implementations, other embodiments, and equivalents to the claims are also within the scope of the following claims.

10, 210: substrate
20: Sensor
30: ACF bonding
200: Wearable device
220:
221:
230: Multi-channel sensor unit
231: Temperature sensor
232: Multichannel
233: terminal

Claims (7)

Board;
A bonding portion on which a conductive film is coated and bonded to the substrate; And
Channel sensor part formed on a plurality of flexible films symmetrically and glued on the basis of the adhesive part,
Lt; / RTI >
The multi-channel sensor unit
And the flexible film is bonded to the substrate through the adhesive portion and the flexible film.
The method according to claim 1,
The adhesive
And a connection member formed of heat and pressure coated with the conductive film of ACF (Anisotropic Conductive Film) on a portion where electrical bonding is formed on the substrate.
3. The method of claim 2,
The flexible film
Wherein the first flexible film and the second flexible film are formed in parallel with each other at predetermined intervals based on the adhesive portion, and are bonded to the substrate by an adhesive.
The method according to claim 1,
The multi-channel sensor unit
And is formed of a platinum (Pt) resistive membrane type multi-channel.
5. The method of claim 4,
The multi-channel sensor unit
Channel photoresist is formed by transferring the multi-channel patterned by a photolithography process,
The multi-
A wearable device formed on a film formed of a polyimide solution.
6. The method of claim 5,
The multi-channel sensor unit
Wherein the wearable device comprises the multi-channel formed in a meander pattern.
The method according to claim 1,
The multi-channel sensor unit
And is connected to an IC circuit formed on the substrate to be formed into a patch-like structure.

Images