CN112857247A - Deformation monitoring method, device, equipment and medium for PCB - Google Patents
Deformation monitoring method, device, equipment and medium for PCB Download PDFInfo
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- CN112857247A CN112857247A CN202110189476.4A CN202110189476A CN112857247A CN 112857247 A CN112857247 A CN 112857247A CN 202110189476 A CN202110189476 A CN 202110189476A CN 112857247 A CN112857247 A CN 112857247A
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- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
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Abstract
The application discloses a system and a method for monitoring deformation of a PCB (printed circuit board), wherein the system comprises a control module, a laser generation module and a laser induction module which are installed at the edge of the PCB in pairs, and a receiving unit in the laser induction module is installed on an output light path of the laser generation module when the PCB is not deformed; the control module is used for acquiring a light intensity detection value received by the laser sensing module in real time and judging whether the light intensity detection value is lower than a preset threshold value or not; if yes, judging that the PCB is deformed; the preset threshold is set according to the light intensity output value of the laser generation module. This application utilizes light generation module and the laser-induced module of fixing on the PCB board, has not only avoided large-scale check out test set's use, has reduced system cost, has improved detection efficiency and degree of accuracy, is applicable to the PCB board deformation monitoring under the multiple scene moreover, has ensured real-time, the continuation of PCB board deformation monitoring, has strengthened the safety guarantee in utilization of equipment.
Description
Technical Field
The application relates to the technical field of electronics, in particular to a system and a method for monitoring deformation of a PCB.
Background
With the advent of cloud computing and 5G, data on the internet is increasing due to contents of audio, video, and the like. Servers responsible for handling large amounts of data face the challenges of high functional complexity and high integration. Therefore, the server needs to integrate more functions in a limited space, and thousands of electronic components and signal networks need to be arranged on the PCB in order. In practice, however, PCBs suffer more or less from deformation problems.
In the existing PCB deformation detection scheme, one method is to adopt a pressure sensor arranged in the vertical direction, and confirm the distance between each test point and a reference plane by monitoring the on-off condition of probes at different test points so as to judge whether the PCB is deformed.
The other method is a laser ranging method, wherein a laser beam in the vertical direction is applied to the PCB, the distance from each monitoring point of the PCB to the reference plane is checked through laser ranging, and the deformation degree of the PCB is known according to the distance from each monitoring point to the reference plane.
In addition, a method for identifying the deformation degree of the PCB by comparing with a normal PCB photo based on a picture identification technology is also provided; and a method for judging the deformation degree of the PCB by monitoring the frequency deviation or ripple variation of a specific signal sent by a special chip by utilizing the characteristic that the length and the impedance of the PCB are changed along with the shape.
However, the detection method based on the probe, the laser ranging method or the image recognition needs a huge external device, the detection efficiency is low, the cost is high, and the detection method using the impedance change of the PCB trace has high technical difficulty and is prone to be interfered with by a large error. Moreover, the methods are only suitable for detecting the deformation of the PCB without welding components, and cannot be used for the PCB with welded components; the PCB board assembled in the chassis cannot be detected. Therefore, when the internal board card deforms due to carrying, bumping and collision in the process of machine transportation, the method cannot be used.
In view of the above, it is an important need for those skilled in the art to provide a solution to the above technical problems.
Disclosure of Invention
The purpose of the application is to provide a deformation monitoring system and method for a PCB, so that the deformation of the PCB can be monitored in real time in the use process after the PCB is installed, the detection cost is effectively reduced, and the detection efficiency is improved.
In order to solve the technical problem, on one hand, the application discloses a deformation monitoring system of a PCB (printed circuit board), which comprises a control module, a laser generation module and a laser induction module, wherein the laser generation module and the laser induction module are installed at the edge of the PCB in pair;
the control module is used for acquiring a light intensity detection value received by the laser sensing module in real time and judging whether the light intensity detection value is lower than a preset threshold value or not; if yes, judging that the PCB is deformed; the preset threshold is set according to the light intensity output value of the laser generation module.
Optionally, the PCB board comprises four pairs of the laser generating modules and the laser sensing modules, and each pair of the laser generating modules and the laser sensing modules is respectively installed at two ends of one edge of the PCB board.
Optionally, the light emitting unit of each laser generation module and the receiving unit of the corresponding laser sensing module are elevated at the same level based on a structural member when being installed.
Optionally, the control module is further configured to:
and after the deformation of the PCB is judged, calculating the deformation amount of the PCB in the corresponding direction based on the light intensity detection value and the light intensity output value.
Optionally, the laser generation module includes a laser diode, an inductor, an MOS transistor, and an operational amplifier unit;
the anode of the laser diode is connected with a power supply through the inductor; the cathode of the laser diode is connected with the MOS tube; the output end of the control module is connected with the control end of the MOS tube through the operational amplifier unit and is used for controlling the on-off of the laser diode by controlling the on-off of the MOS tube.
Optionally, the operational amplifier unit includes:
the positive input end of the operational amplifier is connected with the output end of the control module;
the first resistor is connected between the output end of the operational amplifier and the control end of the MOS tube;
the second resistor is connected between the MOS tube and the ground wire;
and the third resistor is connected with the negative input end of the operational amplifier at one end and the common end of the MOS tube and the second resistor at the other end.
Optionally, the laser generation module further includes a diode connected in reverse parallel with the laser diode, and a ground capacitor connected to an anode of the laser diode.
Optionally, the laser sensing module includes a photodiode, a fourth resistor, a fifth resistor, a sixth resistor, and an ADC;
the cathode of the photodiode is connected with a power supply through the fourth resistor; the anode of the photodiode is grounded through the fifth resistor and is connected with the input end of the ADC;
the ADC is connected with the input end of the control module through the sixth resistor and is used for outputting the output voltage of the photodiode to the control module after AD conversion so that the control module can convert the output voltage to generate the light intensity detection value.
Optionally, the control module is a CPLD on the PCB board.
In another aspect, the present application discloses a method for monitoring deformation of a PCB, wherein a laser generation module and a laser sensing module are mounted at an edge of the PCB in pair, and a receiving unit in the laser sensing module is mounted on an output light path of the laser generation module when the PCB is not deformed; the method is applied to a control module and comprises the following steps:
acquiring a light intensity detection value received by the laser induction module in real time;
judging whether the light intensity detection value is lower than a preset threshold value or not; the preset threshold is set according to the light intensity output value of the laser generation module;
if yes, judging that the PCB is deformed.
The deformation monitoring system and method of the PCB provided by the application have the beneficial effects that: this application utilizes light generation module and the laser-induced module of fixing on the PCB board, based on the characteristic that light propagated along the straight line, judge the deformation degree of PCB board through the light intensity that detects laser-induced module received, large-scale check out test set's use has not only been avoided, thereby system cost has been reduced, detection efficiency and degree of accuracy have been improved, and be applicable to the PCB board deformation monitoring under the multiple scene, the real-time of PCB board deformation monitoring has been ensured, the continuation, the safety guarantee in utilization of equipment has been strengthened.
Drawings
In order to more clearly illustrate the technical solutions in the prior art and the embodiments of the present application, the drawings that are needed to be used in the description of the prior art and the embodiments of the present application will be briefly described below. Of course, the following description of the drawings related to the embodiments of the present application is only a part of the embodiments of the present application, and it will be obvious to those skilled in the art that other drawings can be obtained from the provided drawings without any creative effort, and the obtained other drawings also belong to the protection scope of the present application.
Fig. 1 is a schematic diagram illustrating a deformation of a PCB disclosed in an embodiment of the present application;
fig. 2 is a block diagram of a deformation monitoring system for a PCB board disclosed in an embodiment of the present application;
FIG. 3 is a side view of an undeformed PCB as disclosed in an embodiment of the present application;
FIG. 4 is a side view of a PCB board as deformed as disclosed in an embodiment of the present application;
fig. 5 is a schematic layout diagram of a deformation monitoring system for a PCB board disclosed in an embodiment of the present application;
fig. 6 is a circuit structure diagram of a laser generation module disclosed in an embodiment of the present application;
fig. 7 is a circuit structure diagram of a laser sensing module disclosed in an embodiment of the present application;
fig. 8 is a flowchart of a method for monitoring deformation of a PCB disclosed in an embodiment of the present application.
Detailed Description
The core of the application is to provide a system and a method for monitoring the deformation of the PCB, so that the deformation of the PCB can be monitored in real time in the use process after the PCB is installed, the detection cost is effectively reduced, and the detection efficiency is improved.
In order to more clearly and completely describe the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In actual use, a PCB (Printed Circuit Board) has more or less a problem of deformation.
Firstly, when the PCB is produced, part of the product has certain deformation; secondly, when the electronic components are welded on the PCB in a processing plant, the deformation of the original flat PCB after welding can be caused by the gravity action of the excessive electronic components and the high-temperature environment of welding; finally, when the board card is actually assembled in the chassis, the board card is influenced by factors such as a heavy CPU and a radiator, fixing screws with different moments, more expansion cards and the like, and the original flat PCB also has deformation to a certain degree.
The PCB is deformed, so that the impedance of the wiring is influenced, and the communication quality of high-speed signals is further influenced; the problems of insufficient solder joint, empty solder joint and the like caused by uneven welding plane can directly affect the function of the PCB, and the reference can be specifically made to FIG. 1; furthermore, damage to the PCB or components due to deformation of the PCB may directly result in damage to the product or even rejection of the product. However, the PCB deformation monitoring method in the prior art often has the following disadvantages: the efficiency is too low, the PCB after welding components and parts can not be monitored, the PCB assembled in the case can not be subjected to deformation detection, and the deformation monitoring can not be carried out after the PCB is electrified and operated.
Therefore, the application provides a deformation monitoring scheme of PCB board, can be under different scenes real-time supervision PCB's deformation, effectively solve above-mentioned problem.
Referring to fig. 2, an embodiment of the present application discloses a deformation monitoring system for a PCB, which mainly includes a control module 101, and a laser generation module 102 and a laser sensing module 103 installed at an edge of the PCB in pair, wherein a receiving unit in the laser sensing module 103 is installed on an output light path of the laser generation module 102 when the PCB is not deformed;
the control module 101 is configured to obtain a light intensity detection value received by the laser sensing module 103 in real time, and determine whether the light intensity detection value is lower than a preset threshold; if yes, judging that the PCB is deformed; the preset threshold is set according to the light intensity output value of the laser generation module 102.
It should be noted that the present application particularly implements the deformation detection of the PCB by using the principle of linear propagation of light. Specifically, the laser generation module 102 and the laser induction module 103 can be placed in pairs at the edge positions on the plane of the PCB board before the PCB leaves a factory (when the PCB is not deformed) and after the functional wiring of the PCB is completed. Since the PCB is not deformed, the laser sensing module 103 is installed on the output light path of the laser generating module 102, and thus the laser sensing module 103 can completely receive the light emitted from the laser generating module 102. Once the PCB is deformed, the laser sensing module 103 deviates from the original output light path, and the intensity of the received light is reduced, even the light emitted from the laser generating module 102 is not received completely.
It is easy to understand that, in order to install the laser sensing module 103 and the laser generating module 102, the PCB board may be regularly defined in advance, and fixing holes for installing the relevant components of the laser sensing module 103 and the laser generating module 102 are reserved. And can be designed and implemented by persons skilled in the art.
It will be readily appreciated that the present application specifically chooses to use a laser in order to avoid interference from light scattering. The laser emitted by the laser generating module 102 can be emitted out linearly through the optical fiber end cap, and the corresponding receiving unit of the laser sensing module 103 is installed at the other end of the edge of the PCB, and the optical fiber end cap and the receiving unit are in the same line.
It should be noted that the laser generating module 102 and the laser sensing module 103 are installed in calibration when the PCB is not deformed, and referring to fig. 3, when the PCB is flat and has no deformation, the light emitted from the fiber end cap can be directly and vertically incident on the receiving surface of the receiving unit, and is completely received by the laser sensing module 103.
And referring to fig. 4, when the PCB is deformed, the laser emitted from the optical fiber end cap cannot be vertically emitted into the receiving surface of the receiving unit, and the light intensity detection value received by the laser sensing module 103 is smaller than the detection value when the PCB is not deformed. When the deformation reaches a certain degree, for example, exceeds the angle θ in fig. 4, the light emitted from the optical fiber end cap cannot be received by the receiving unit at all.
Therefore, the skilled person can select the threshold value with a suitable size according to the actual requirement and the light intensity output value of the laser generation module 102. When the control module 101 monitors that the light intensity detection value received by the laser sensing module 103 is smaller than a preset threshold value, it can be determined that the PCB is deformed in the corresponding direction. Further, after judging that the PCB is deformed, the control module 101 may generate related warning information to notify a user in time, so as to help solve the problem of PCB deformation in time.
Because laser induction module 103 and laser generation module 102 all can be realized based on commonly used electronic components to fix on the PCB board, consequently this application need not additionally to use the great other auxiliary assembly of volume, and the testing process is simple easily to be realized, has effectively avoided the increase of system cost and human cost.
Moreover, the laser sensing module 103 and the laser generating module 102 can work independently of the functional circuit of the PCB and do not interfere with each other, so that the deformation monitoring of the PCB can be performed when no component is welded, after the component is welded, the deformation monitoring can be performed after the PCB is assembled into the chassis and in the normal working process.
It can be seen that the deformation monitoring system of PCB board that this application embodiment disclosed utilizes laser generation module and the laser induction module of fixing on the PCB board, based on the characteristic that light propagated along the straight line, judge the deformation degree of PCB board through the light intensity that detects laser induction module received, large-scale check out test set's use has not only been avoided, thereby system cost has been reduced, detection efficiency and degree of accuracy have been improved, and be applicable to the PCB board deformation monitoring under the multiple scene, PCB board deformation monitoring's real-time has been ensured, the continuation, the safety guarantee in utilization of equipment has been strengthened.
As a specific embodiment, on the basis of the above content, the system for monitoring deformation of a PCB disclosed in the embodiment of the present application may specifically include four pairs of laser generating modules 102 and laser sensing modules 103, where each pair of laser generating module 102 and laser sensing module 103 is respectively installed at two ends of one edge of the PCB.
Referring to fig. 5 in contrast, fig. 5 is a schematic diagram of a deformation monitoring system for a PCB board disclosed in an embodiment of the present application. In this embodiment, a pair of laser generating module 102 and laser sensing module 103 is respectively disposed at the edge positions parallel to the four sides on the PCB. Of course, other arrangements may be adopted by those skilled in the art, and the present application is not limited thereto.
As a specific embodiment, in the deformation monitoring system for a PCB disclosed in the embodiments of the present application, based on the above, when the light emitting unit of each laser generating module 102 and the receiving unit of the corresponding laser sensing module 103 are installed, they are elevated on the same horizontal level based on the structural member.
Specifically, if there is higher components and parts in PCB self function circuit, these higher components and parts can block the light path, therefore this embodiment adopts the structure to erect optic fibre end cap and receiving element to normal performance deformation monitoring function.
As a specific embodiment, in the deformation monitoring system of a PCB disclosed in the embodiment of the present application, on the basis of the foregoing, the control module 101 is further configured to:
and after the deformation of the PCB is judged, calculating the deformation amount of the PCB in the corresponding direction based on the light intensity detection value and the light intensity output value.
Specifically, since the degree of deformation of the PCB panel is related to the decrease in the detected value of the light intensity. The corresponding deformation amount can be further calculated by those skilled in the art.
Referring to fig. 6, fig. 6 is a circuit structure diagram of a laser generation module 102 disclosed in the embodiment of the present application.
As a specific embodiment, in the deformation monitoring system of a PCB disclosed in the embodiment of the present application, on the basis of the foregoing, the laser generating module 102 includes a laser diode LD, an inductor L, MOS tube Q, and an operational amplifier unit;
the anode of the laser diode LD is connected with a power supply through an inductor L; the cathode of the laser diode LD is connected with the MOS tube Q; the output end of the control module 101 is connected with the control end of the MOS transistor Q through the operational amplifier unit, and is used for controlling the on/off of the laser diode LD by controlling the on/off of the MOS transistor Q.
Specifically, during normal operation, the control module 101 sends the light emitting signal to Vin + of the operational amplifier a through the GPIO, and the operational amplifier a outputs a high level to turn on the MOS transistor Q, so that the laser diode LD is turned on to emit laser light. In an actual circuit, the number of the laser diodes LD may be increased or decreased according to the number of the light generation modules.
As a specific embodiment, the deformation monitoring system of a PCB disclosed in the embodiments of the present application, on the basis of the foregoing, the operational amplifier unit includes:
an operational amplifier A with a positive input end connected with the output end of the control module 101;
a first resistor R connected between the output end of the operational amplifier A and the control end of the MOS transistor Q1；
Second resistor R connected between MOS tube Q and ground wire2；
One end of the resistor is connected with the negative input end of the operational amplifier A, and the other end of the resistor is connected with the MOS tube Q and the second resistor R2Is connected to the common terminal of the first resistor R3。
Specifically, R2The current sampling resistor is a power resistor with large package and small resistance value; by R of large resistance3And feeding back the voltage information corresponding to the working current to Vin-of the operational amplifier A to form negative feedback for stabilizing the current of the LD.
As a specific embodiment, in the deformation monitoring system of a PCB disclosed in the embodiments of the present application, on the basis of the above contents, the laser generating module 102 further includes a diode D connected in reverse parallel with the laser diode LD, and a ground capacitor C connected to the anode of the laser diode LD.
Specifically, when Q is turned off, the LD will bear transient reverse voltage due to the inductive device in the line, so the present embodiment provides a reverse diode D to protect the LD from reverse breakdown. D can specifically select a diode with good transient response and low forward conduction voltage drop, when the LD bears reverse voltage, the reverse voltage is absorbed through D, and the reverse voltage borne by the LD is the forward conduction voltage of D.
Referring to fig. 7, fig. 7 is a circuit structure diagram of a laser sensing module 103 according to an embodiment of the present disclosure.
As a specific embodiment, in the deformation monitoring system of a PCB disclosed in the embodiment of the present application, on the basis of the above content, the laser sensing module 103 includes a photodiode PD and a fourth resistor R4A fifth resistor R5A sixth resistor R6、ADC；
The cathode of the photodiode PD passes through a fourth resistor R4Is connected with a power supply; the anode of the photodiode PD passes through a fifth resistor R5The ground is connected with the input end of the ADC;
ADC passes through a sixth resistor R6And the input end of the control module 101 is connected to output the output voltage of the photodiode PD to the control module 101 after AD conversion, so that the control module 101 converts the output voltage into a light intensity detection value.
Specifically, the photodiode PD is a photosensitive device, and during normal operation, the PD is turned on in the reverse direction to generate a reverse current Ir, and the detection voltage Vin of the ADC is Ir · R5. Vin is an analog signal, the voltage level can reflect the intensity of illumination, and after the analog signal is converted into a digital signal by the ADC, the control module 101 can obtain the intensity of light received by the laser sensing module 103.
As a specific example, based on the above, as shown in fig. 6 and fig. 7, the control module 101 may be a CPLD (Complex Programmable Logic Device) on a PCB board. Specifically, management chips such as CPLDs are placed on the server motherboard, so that the laser generation module 102 is controlled by using the existing management chip without an additional control chip.
In addition, the design can be made into a tooling fixture, the power supply parts in the laser generation module 102 and the laser induction module 103 and the CPLD are used as fixed modules, the PCB is defined regularly, and fixing holes for the optical fiber end cap and the photodiode PD are reserved on the PCB.
Referring to fig. 8, an embodiment of the present application discloses a method for monitoring deformation of a PCB, where a laser generation module and a laser sensing module are installed at an edge of the PCB in pair, and a receiving unit in the laser sensing module is installed on an output light path of the laser generation module when the PCB is not deformed; the method is applied to a control module and comprises the following steps:
s201: and acquiring the light intensity detection value received by the laser induction module in real time.
S202: judging whether the light intensity detection value is lower than a preset threshold value or not; if yes, the process proceeds to S203.
The preset threshold is set according to the light intensity output value of the laser generation module.
S203: and judging that the PCB is deformed.
As a specific embodiment, the method for monitoring deformation of a PCB provided in the embodiment of the present application, on the basis of the foregoing, after determining that the PCB is deformed, further includes:
and calculating the deformation amount of the PCB in the corresponding direction based on the light intensity detection value and the light intensity output value.
Therefore, according to the deformation monitoring method of the PCB, the light generation module and the laser induction module which are fixed on the PCB are utilized, the deformation degree of the PCB is judged by detecting the light intensity received by the laser induction module based on the characteristic that light is transmitted along a straight line, and the use of large-scale detection equipment is avoided, so that the system cost is reduced, the detection efficiency and the accuracy are improved, the method is suitable for PCB deformation monitoring under various scenes, the real-time performance and the continuity of PCB deformation monitoring are guaranteed, and the use safety guarantee of the equipment is enhanced.
For the details of the deformation monitoring system for the PCB, reference may be made to the above detailed description of the deformation monitoring method for the PCB, and details thereof are not repeated herein.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. For the equipment disclosed by the embodiment, the description is relatively simple because the equipment corresponds to the method disclosed by the embodiment, and the relevant parts can be referred to the method part for description.
It is further noted that, throughout this document, relational terms such as "first" and "second" are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Furthermore, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The technical solutions provided by the present application are described in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, without departing from the principle of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall into the protection scope of the present application.
Claims (10)
1. A deformation monitoring system of a PCB is characterized by comprising a control module, a laser generation module and a laser induction module, wherein the laser generation module and the laser induction module are installed at the edge of the PCB in pair;
the control module is used for acquiring a light intensity detection value received by the laser sensing module in real time and judging whether the light intensity detection value is lower than a preset threshold value or not; if yes, judging that the PCB is deformed; the preset threshold is set according to the light intensity output value of the laser generation module.
2. The system for monitoring the deformation of the PCB according to claim 1, comprising four pairs of the laser generating modules and the laser sensing modules, wherein each pair of the laser generating modules and the laser sensing modules is respectively installed at two ends of one edge of the PCB.
3. The system for monitoring deformation of a PCB panel according to claim 1, wherein the light emitting unit of each laser generation module and the receiving unit of the corresponding laser sensing module are elevated at the same level based on a structure upon installation.
4. The system for monitoring deformation of a PCB board according to claim 1, wherein the control module is further configured to:
and after the deformation of the PCB is judged, calculating the deformation amount of the PCB in the corresponding direction based on the light intensity detection value and the light intensity output value.
5. The deformation monitoring system of the PCB board of claim 1, wherein the laser generation module comprises a laser diode, an inductor, an MOS (metal oxide semiconductor) tube and an operational amplifier unit;
the anode of the laser diode is connected with a power supply through the inductor; the cathode of the laser diode is connected with the MOS tube; the output end of the control module is connected with the control end of the MOS tube through the operational amplifier unit and is used for controlling the on-off of the laser diode by controlling the on-off of the MOS tube.
6. The system for monitoring deformation of the PCB board according to claim 5, wherein the operational amplifier unit comprises:
the positive input end of the operational amplifier is connected with the output end of the control module;
the first resistor is connected between the output end of the operational amplifier and the control end of the MOS tube;
the second resistor is connected between the MOS tube and the ground wire;
and the third resistor is connected with the negative input end of the operational amplifier at one end and the common end of the MOS tube and the second resistor at the other end.
7. The system for monitoring deformation of PCB board of claim 5, wherein said laser generating module further comprises a diode connected in reverse parallel with said laser diode, a grounding capacitor connected with the anode of said laser diode.
8. The system for monitoring deformation of the PCB board according to claim 5, wherein the laser sensing module comprises a photodiode, a fourth resistor, a fifth resistor, a sixth resistor and an ADC;
the cathode of the photodiode is connected with a power supply through the fourth resistor; the anode of the photodiode is grounded through the fifth resistor and is connected with the input end of the ADC;
the ADC is connected with the input end of the control module through the sixth resistor and is used for outputting the output voltage of the photodiode to the control module after AD conversion so that the control module can convert the output voltage to generate the light intensity detection value.
9. The system for monitoring deformation of PCB board according to any of claims 1 to 8, wherein the control module is CPLD on the PCB board.
10. The deformation monitoring method of the PCB is characterized in that the edge of the PCB is provided with a laser generating module and a laser sensing module which are paired, and a receiving unit in the laser sensing module is arranged on an output light path of the laser generating module when the PCB is not deformed; the method is applied to a control module and comprises the following steps:
acquiring a light intensity detection value received by the laser induction module in real time;
judging whether the light intensity detection value is lower than a preset threshold value or not; the preset threshold is set according to the light intensity output value of the laser generation module;
if yes, judging that the PCB is deformed.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2023184780A1 (en) * | 2022-03-30 | 2023-10-05 | 蔡戴朋 | Layout inspection system using cloud storage and corresponding terminal |
| CN117073567A (en) * | 2023-08-30 | 2023-11-17 | 索罗曼(广州)新材料有限公司 | Titanium flat bar deformation online monitoring system and method thereof |
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