CN110837154A - Optical module and optical transmission device - Google Patents
Optical module and optical transmission device Download PDFInfo
- Publication number
- CN110837154A CN110837154A CN201911289302.4A CN201911289302A CN110837154A CN 110837154 A CN110837154 A CN 110837154A CN 201911289302 A CN201911289302 A CN 201911289302A CN 110837154 A CN110837154 A CN 110837154A
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- China
- Prior art keywords
- optical
- vcsel laser
- temperature
- module
- optical module
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention discloses an optical module and an optical transmission device, wherein the optical module comprises a substrate, a transmitting driving chip, a VCSEL laser, a receiving chip, a photodiode, a master control device, a host end electrical interface and an optical fiber interface, wherein the transmitting driving chip, the VCSEL laser, the receiving chip, the photodiode, the master control device, the host end electrical interface and the optical fiber interface are arranged on the substrate. The invention avoids the VCSEL laser working in a low-temperature environment which influences the performance of the VCSEL laser, namely, the working environment of the VCSEL laser is still kept at a proper temperature in a low-temperature external environment, and the degradation phenomenon caused by the working environment is avoided, so that the use environment of the invention is expanded, and the invention can be suitable for the outdoor industrial temperature environment.
Description
Technical Field
The present invention relates to the field of optical communications technologies, and in particular, to an optical module and an optical transmission apparatus.
Background
With the continuous improvement of the 5G standard, the interface rate in the forward direction is confirmed to adopt 25G and part of the N × 25G modules at the present stage. Generally, the height of the signal tower does not exceed 100m, and the industrial grade module of the SFP28-SR is also required for the signal interconnection above and below the tower.
SFP28-SR modules on the market are all applied to data centers and are business-level modules. The current 25G optical chip cannot support direct upgrading and replacement to an industrial level on the current module scheme; the performance of a VCSEL chip at an emitting end is limited, the VCSEL chip is sensitive to temperature, the VCSEL chip is degraded due to temperature rise and drop, and the VCSEL chip can support application at the temperature of-20 ℃ to 90 ℃ in the current industry; for the application in the industrial grade range of-40 ℃ to 85 ℃, the application temperature gap in the low temperature direction is large, and the degradation of the VCSEL chip cannot be compensated by directly optimizing the Rf performance, so that the use environment of the SFP28-SR module is limited.
Disclosure of Invention
The invention aims to provide an optical module, which can improve the degradation phenomenon of a VCSEL chip caused by a low-temperature environment and further expand the use environment of the optical module.
It is still another object of the present invention to provide an optical transmission device that can improve a deterioration phenomenon of a VCSEL chip of an optical module due to a low temperature environment, and further expand a use environment of the optical transmission device.
In order to achieve the above object, the present invention provides an optical module, which includes a substrate, and an emission driving chip, a VCSEL laser, a receiving chip, a photodiode, a main control device, a host-side electrical interface, and an optical fiber interface that are disposed on the substrate, and the optical module further includes a heating device for heating the VCSEL laser and a temperature detection device for detecting an ambient temperature, where when the temperature detection device detects that the ambient temperature is lower than a preset threshold, the main control device controls the heating device to heat.
Preferably, the heating device comprises a power resistor, the power resistor is arranged in a heating circuit, and the main control device controls the power resistor to heat through controlling the heating circuit.
Preferably, the power resistor is a thin film resistor.
Preferably, the power resistor is a TAN material thin film resistor.
Preferably, the power resistor is attached to the copper sheet of the substrate.
Preferably, the power resistor is attached to the copper sheet of the substrate through conductive silver paste.
Preferably, the emission driving chip, the VCSEL laser, the receiving chip and the photodiode are all bare packaged chips and packaged on the substrate by a COB process.
Preferably, the optical module further includes an emitting end optical lens and a receiving end optical lens, the emitting end optical lens integrates a function of bending the optical path by 90 degrees and focusing the optical path of the lens, and is configured to guide the optical signal emitted by the VCSEL laser to the optical fiber interface, and the receiving end optical lens integrates a function of bending the optical path by 90 degrees and focusing the optical path of the lens, and is configured to guide the optical signal input by the optical fiber interface to the photodiode.
To achieve another object, the present invention provides an optical transmission apparatus including the optical module as described above.
Compared with the prior art, when the VCSEL laser device works in a low-temperature environment, the temperature detection device can be used for detecting the ambient temperature, and when the ambient temperature is lower than a preset threshold value, the main control device can control the heating device to heat, so that the ambient temperature of the VCSEL laser device is increased, and therefore the VCSEL laser device is prevented from working in a low-temperature environment influencing the performance of the VCSEL laser device, namely, the working environment of the VCSEL laser device is still kept at a proper temperature in a low-temperature external environment, the degradation phenomenon caused by the working environment is avoided, the use environment of the VCSEL laser device is expanded, and the VCSEL laser device can be suitable for the outdoor industrial temperature environment.
Drawings
Fig. 1 is a schematic structural diagram of an optical module according to an embodiment of the present invention.
Fig. 2 is a schematic block diagram of heating control of a light module according to an embodiment of the present invention.
Detailed Description
In order to explain technical contents and structural features of the present invention in detail, the following description is made with reference to the embodiments and the accompanying drawings.
Referring to fig. 1, the present invention discloses an optical module, which includes a substrate 10, and a transmitting driving chip 2, a VCSEL laser 4, a receiving chip 3, a photodiode 5, a main control device 6, a host-side electrical interface 1, and an optical fiber interface 7, which are disposed on the substrate 10, wherein the transmitting driving chip 2 integrates Clock Data Recovery (CDR) and VCSEL driving functions, and the receiving chip 3 integrates clock data recovery and trans-impedance amplifier (TIA) functions. When the device works, an electric signal input by the host end electric interface 1 is input to the emission driving chip 2, the emission driving chip 2 recovers the data of the electric signal and converts the electric signal into a driving current signal and inputs the driving current signal to the VCSEL laser 4, the VCSEL laser 4 emits an optical signal, and the optical signal is output by the optical fiber interface 7; the optical signal input by the optical fiber interface 7 is input to the photodiode 5, the photodiode 5 converts the optical signal into a current signal and inputs the current signal to the receiving chip 3, and the receiving chip 3 amplifies the current signal and recovers data and then inputs the current signal to the host end through the host end electrical interface 1. In the embodiment of the present invention, the main control device 6 performs low-speed information exchange and control with the host end through the host-end electrical interface 1, and is also configured to configure the transmitting driving chip 2 and the receiving chip 3 and input monitoring information inside the module to the host end through the host-end electrical interface 1. Specifically, the optical module further includes a transmitting end optical lens 8 and a receiving end optical lens 9, where the transmitting end optical lens 8 integrates a function of bending the optical path by 90 degrees and a function of focusing the optical path of the lens, and is configured to guide the optical signal emitted by the VCSEL laser 4 to the optical fiber interface 7, and the receiving end optical lens 9 integrates a function of bending the optical path by 90 degrees and a function of focusing the optical path of the lens, and is configured to guide the optical signal input by the optical fiber interface 7 to the photodiode 5.
Referring to fig. 1 and 2, in order to improve the degradation phenomenon of the VCSEL chip caused by the low temperature environment, the optical module of the present invention further includes a heating device for heating the VCSEL laser 4 and a temperature detection device 12 for detecting an ambient temperature, when the temperature detection device 12 detects that the ambient temperature is lower than a preset threshold, the main control device 6 controls the heating device to heat, so as to raise the ambient temperature of the VCSEL laser 4, thereby preventing the VCSEL laser 4 from working in a low temperature environment that affects the performance of the VCSEL laser, that is, in a low temperature external environment, the working environment of the VCSEL laser 4 is still kept at a suitable temperature, so as to expand the usage environment of the optical module of the present invention, and enable the optical module of the present invention to be suitable for an outdoor industrial temperature environment. In a specific embodiment of the present invention, the preset threshold of the temperature for triggering the heating device to heat is-10 ℃, and of course, other temperature values may be used, and may be specifically set according to specific situations. Typically, the heating means is arranged close to the VCSEL laser 4 for heating.
In some embodiments, the temperature detection device 12 is a sensor built in the main control device 6 itself, but in other embodiments, the temperature detection device 12 may be specially configured; in addition, when comparing the ambient temperature detected by the temperature detecting device 12 with the preset threshold, the comparison is usually performed by using a software module of the main control device 6, and of course, the case of using a hardware module for comparison is not excluded, for example, the main control device 6 may further include a comparator.
In some embodiments, the heating device includes a power resistor 11, the power resistor 11 is disposed in a heating circuit 13, the main control device 6 controls the power resistor 11 to heat through controlling the heating circuit 13, and the technical solution of implementing the heating circuit 13 can be implemented by using known technology, and will not be described in detail herein. In a specific embodiment, the main control device 6 can control the magnitude of the current flowing through the power resistor 11 by controlling the voltage of the MOS transistor disposed in the heating circuit 13, thereby controlling the heating temperature. The heating mode by the power resistor 11 is simple and effective, low in cost and low in power consumption.
In a preferred embodiment, the power resistor 11 is a thin film resistor; preferably, a TAN material film resistor is selected, so that the volume is small, the reliability is high, and the packaging is convenient.
In a preferred embodiment, the power resistor 11 is bonded to the copper sheet of the substrate 10, so that the power resistor 11 is effectively prevented from being failed due to excessive temperature concentration. Specifically, the power resistor 11 is bonded to the copper sheet of the substrate 10 by conductive silver paste.
In some embodiments, the heating device may be packaged together with the emission driving chip 2 and the VCSEL laser 4 as a module, which may be prevented from being directly exposed to some extent, further enhancing reliability.
In some embodiments, the emission driving chip 2, the VCSEL laser 4, the receiving chip 3, and the photodiode 5 are all bare packaged chips and are packaged on the substrate 10 by a COB process, so that the production process and difficulty are simplified, the mass production is suitable, and the material and process costs can be significantly reduced.
Referring to fig. 1 and fig. 2, the present invention further discloses an optical transmission apparatus including the optical module according to the above embodiment.
In summary, when the present invention operates in a low temperature environment, the temperature detection device 12 may be used to detect the ambient temperature, and when the ambient temperature is lower than the preset threshold, the main control device 6 may control the heating device to heat, so as to raise the ambient temperature of the VCSEL laser 4, thereby preventing the VCSEL laser 4 from operating in a low temperature environment that affects the performance of the VCSEL laser, that is, in a low temperature external environment, the operating environment of the VCSEL laser 4 is still kept at a suitable temperature, and the degradation phenomenon caused thereby is avoided, thereby expanding the operating environment of the present invention, so that the present invention may be suitable for an outdoor industrial temperature environment.
The above disclosure is only a preferred embodiment of the present invention, and should not be taken as limiting the scope of the invention, so that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the invention.
Claims (9)
1. The utility model provides an optical module, includes the base plate and sets up emission drive chip, VCSEL laser, receiving chip, photodiode, master control unit, host computer end electrical interface and optical fiber interface on the base plate, its characterized in that, optical module is still including being used for right the heating device that VCSEL laser carries out the heating and the temperature-detecting device who is used for detecting ambient temperature, works as when temperature-detecting device detects ambient temperature and is less than preset threshold value, master control unit control heating device heats.
2. The light module of claim 1, wherein the heating device comprises a power resistor disposed in a heating circuit, the master control device controlling the power resistor heating through control of the heating circuit.
3. A light module as claimed in claim 2, characterized in that the power resistance is a thin film resistor.
4. A light module as claimed in claim 3, characterized in that said power resistor is a TAN material thin film resistor.
5. The optical module of claim 3, wherein the power resistor is attached to a copper sheet of the substrate.
6. The optical module of claim 5, wherein the power resistor is attached to the copper sheet of the substrate by a conductive silver paste.
7. The optical module of claim 1, wherein the emission driving chip, the VCSEL laser, the receiving chip, and the photodiode are all bare packaged chips and are packaged on the substrate by a COB process.
8. The optical module of claim 1, further comprising a transmitting end optical lens and a receiving end optical lens, wherein the transmitting end optical lens integrates a 90-degree bending and focusing lens optical path function for guiding the optical signal emitted from the VCSEL laser to the optical fiber interface, and the receiving end optical lens integrates a 90-degree bending and focusing lens optical path function for guiding the optical signal input from the optical fiber interface to the photodiode.
9. An optical transmission apparatus, characterized by comprising the optical module according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911289302.4A CN110837154A (en) | 2019-12-13 | 2019-12-13 | Optical module and optical transmission device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911289302.4A CN110837154A (en) | 2019-12-13 | 2019-12-13 | Optical module and optical transmission device |
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| Publication Number | Publication Date |
|---|---|
| CN110837154A true CN110837154A (en) | 2020-02-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911289302.4A Pending CN110837154A (en) | 2019-12-13 | 2019-12-13 | Optical module and optical transmission device |
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| Country | Link |
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| CN (1) | CN110837154A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113671467A (en) * | 2021-07-06 | 2021-11-19 | 华芯半导体研究院(北京)有限公司 | Test system and method |
-
2019
- 2019-12-13 CN CN201911289302.4A patent/CN110837154A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113671467A (en) * | 2021-07-06 | 2021-11-19 | 华芯半导体研究院(北京)有限公司 | Test system and method |
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