CN112838038A - Alignment method and alignment system - Google Patents
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- CN112838038A CN112838038A CN202110140288.2A CN202110140288A CN112838038A CN 112838038 A CN112838038 A CN 112838038A CN 202110140288 A CN202110140288 A CN 202110140288A CN 112838038 A CN112838038 A CN 112838038A
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- 238000000034 method Methods 0.000 title claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 81
- 238000004364 calculation method Methods 0.000 claims abstract description 16
- 230000033001 locomotion Effects 0.000 claims description 22
- 238000004891 communication Methods 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 description 16
- 235000012431 wafers Nutrition 0.000 description 15
- 230000001360 synchronised effect Effects 0.000 description 13
- 238000003384 imaging method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000010521 absorption reaction Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
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- 238000006243 chemical reaction Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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Abstract
The invention provides an alignment method, which comprises the following steps: the method comprises the steps of adjusting an image acquisition part to enable two substrates to be opposite, simultaneously acquiring initial edge position information and initial feature mark position information of the two substrates through the image acquisition part, sending calibration information obtained through checking calculation to a guide part of a calibration device through a main control part, and performing compensation adjustment according to the calibration information through the guide part. According to the alignment method, the initial edge position information and the initial feature mark position information of the two substrates are simultaneously acquired by the image acquisition part before bonding and then are sent to the main control part for checking calculation, so that the accuracy of the acquired corresponding position information is ensured, the calibration information obtained through the checking calculation is sent to the guide part of the calibration device by combining the main control part, and the guide part performs compensation adjustment according to the calibration information to realize alignment adjustment before bonding. The invention also provides an alignment system for implementing the alignment method.
Description
Technical Field
The present invention relates to the field of semiconductor device technologies, and in particular, to an alignment method and an alignment system.
Background
The wafer alignment system is one of the indispensable key components of the wafer bonding equipment, and is a necessary condition for ensuring that the bonding pad group accurately performs the subsequent process steps.
Patent application publication No. CN109920751A discloses a system for correcting wafer bonding alignment deviation by using lithography exposure compensation, which introduces lithography exposure compensation in the formation process of interlayer pattern layer to correct the alignment deviation of the bonding pattern layer during wafer bonding. However, the registration deviation correction of this application, which is performed during the formation of the interlayer pattern layer, affects the bonding efficiency.
Therefore, it is necessary to develop a new alignment method to solve the above problems in the prior art.
Disclosure of Invention
The invention aims to provide an alignment method for assisting in aligning two substrates and an alignment system for implementing the alignment method, so as to realize the alignment of different substrates before bonding.
Both substrates of the present invention have a feature mark structure.
To achieve the above object, the alignment method of the present invention comprises the steps of:
s1: adjusting the image acquisition part to enable the edge image acquisition part and the feature mark image acquisition part of the image acquisition part to be arranged opposite to two sides of the calibration device and far away from the calibration device;
s2: placing two substrates to be aligned on a supporting part of the calibration device, and enabling the two substrates to be opposite;
s3: the image acquisition part is used for simultaneously acquiring initial edge position information and initial feature mark position information of the two substrates and then sending the initial edge position information and the initial feature mark position information to the main control part for checking calculation;
s4: and the main control part sends the calibration information obtained through the checking calculation to a guide part of the calibration device, and the guide part carries out compensation adjustment according to the calibration information.
The alignment method of the invention has the advantages that: different from the prior art that alignment is carried out in the forming process of an interlayer graph layer, the alignment method of the invention simultaneously collects the initial edge position information and the initial characteristic mark position information of the two substrates through the image collecting part before bonding and then sends the information to the main control part for checking calculation, so that the accuracy of the collected corresponding position information is ensured, the main control part is combined to send the calibration information obtained through the checking calculation to the guide part of the calibration device, and the guide part carries out compensation adjustment according to the calibration information to realize alignment adjustment before bonding.
Preferably, the calibration device further includes a rotation driving portion and a motion converting portion disposed on the guiding portion, and step S4 further includes that, in the process of compensation adjustment performed by the guiding portion, the motion converting portion converts the rotation motion of the rotation driving portion into a linear motion, so as to facilitate adjustment of the relative position between the two substrates.
Further preferably, the edge image capturing unit includes two edge image capturing structures arranged in parallel, the feature mark image capturing unit includes a feature mark image capturing structure, and the step S1 further includes adjusting the feature mark image capturing structure to face the middle position of the two edge image capturing structures, and making the two edge image capturing structures and the feature mark image capturing structure three face the axis of the calibrating device on the same plane. The beneficial effects are that: the quick and accurate compensation adjustment is ensured.
Further preferably, the step S1 further includes making the guide portion be at a vertical distance from the proximal end of either of the edge image-capturing structures along an axis perpendicular to the plane direction equal to the vertical distance from the proximal end of the feature mark image-capturing structure.
Preferably, the support part includes an adsorption structure, and a support plate structure and a corresponding support plate structure which are oppositely disposed, and in step S2, a transfer structure is provided, and any one of the two substrates is received by the transfer structure
After the adsorption structure, the two substrates are respectively arranged on the corresponding supporting disc structure and the supporting disc structure through the adsorption structure, so that the two substrates are opposite. The beneficial effects are that: the subsequent compensation adjustment is convenient to be fast and accurate.
Further preferably, the main control unit controls the distance between the suction structure carrying one substrate and the corresponding support plate structure carrying the other substrate, so that the vertical distance between the two substrates is equal to the focal distance used by the image capturing unit to perform step S3.
Further preferably, the edge image capturing unit and the feature label image capturing unit are controlled to use the same focal length.
Further preferably, the focal length is 0.5 to 1 mm.
Further preferably, the focal depth of the edge image acquisition part and the focal depth of the feature mark image acquisition part are both not less than 200 micrometers, and the resolution is both not more than 5 micrometers.
Preferably, in step S3, the edge image capturing unit and the feature label image capturing unit each acquire the initial edge position information and the initial feature label position information by dividing the field of view equally.
Further preferably, the initial edge position information includes position information of respective edges of the two substrates, and the initial feature mark position information includes position information of respective feature marks of the two substrates.
More preferably, the main control unit stores reference edge position information, and in step S4, the main control unit performs the verification calculation with reference to the reference edge position information with reference to the edge position information of one of the two substrates to obtain target edge position information of the other of the two substrates as the calibration information.
More preferably, the main control unit stores reference feature mark position information, and in step S4, the main control unit performs the matching calculation with reference to the reference feature mark position information with reference to the feature mark position information of one of the two substrates to obtain target feature mark position information of the other of the two substrates as the calibration information.
Further preferably, the feature mark is an arc-shaped notch, and the reference feature mark position information is reference position information of a circle center corresponding to an arc-shaped surface of the arc-shaped notch.
The alignment system comprises a main control part, an edge image acquisition part, a feature mark image acquisition part and a calibration device, wherein the main control part is in communication connection with the edge image acquisition part, the feature mark image acquisition part and the calibration device.
Drawings
FIG. 1 is a flow chart of an alignment method according to some embodiments of the present invention;
FIG. 2 is a schematic structural diagram of an alignment system according to some embodiments of the present invention;
FIG. 3 is a schematic view of a portion of the guide driving part shown in FIG. 2;
FIG. 4 is a schematic structural diagram of the driving part shown in FIG. 3;
FIG. 5 is a schematic view of the adsorption structure shown in FIG. 3;
FIG. 6 is a schematic view of the use of a support disk structure and corresponding support disk structure according to some embodiments of the present invention;
FIG. 7 is a top view of the edge image capture portion shown in FIG. 2;
FIG. 8 is a schematic structural diagram of the first edge imaging structure shown in FIG. 7;
FIG. 9 is a schematic structural diagram of a feature marker image capture portion according to some embodiments of the present invention;
fig. 10 is a schematic view of an operating state of the alignment system shown in fig. 2.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are a part of the embodiments of the present invention, but not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. As used herein, the word "comprising" and similar words are intended to mean that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items.
In view of the problems in the prior art, embodiments of the present invention provide a calibration apparatus for assisting an alignment process of two substrates, an alignment system including the calibration apparatus, and an alignment method, so as to achieve alignment of different substrates before bonding.
In the embodiment of the invention, the two substrates are both provided with the characteristic mark structures.
In the embodiment of the invention, the two substrates have the same structure and the same size.
In some embodiments of the present invention, one of the two substrates is a wafer, the other substrate is a carrier, and one surface of the carrier is covered with a bonding adhesive to temporarily adhere the two substrates together after calibration by the calibration device. The characteristic mark structures of the wafer and the substrate are notches (Notch) positioned at the edges
In some embodiments of the present invention, the two substrates are both wafers having a notch.
The calibration device of the embodiment of the invention comprises a guide part, a driving part and a supporting part; the alignment system comprises a main control part, an image acquisition part and the calibration device.
Referring to fig. 1, the alignment method of the alignment system according to the embodiment of the present invention includes:
s1: adjusting the image acquisition part to enable the image acquisition part to be in a first position state relative to the calibration device;
s2: placing two substrates to be aligned on a supporting part of the calibration device, and enabling the two substrates to be opposite;
s3: acquiring initial edge position information and initial feature mark position information of the two substrates through the image acquisition part and sending the initial edge position information and the initial feature mark position information to the main control part for checking calculation;
s4: and the main control part sends the calibration information obtained through the checking calculation to the guide part, and the guide part carries out compensation adjustment according to the calibration information.
Fig. 2 is a schematic structural diagram of an alignment system according to some embodiments of the present invention.
Referring to fig. 2, in the alignment system 2, the alignment device is composed of a guide driving portion 21 and a supporting portion 22, the image capturing portion is composed of an edge image capturing portion 23 and a feature mark image capturing portion 24, and the edge image capturing portion 23 and the feature mark image capturing portion 24 are respectively and oppositely disposed on two sides of the alignment device (not shown).
In some embodiments of the present invention, the alignment system further includes a main control unit, and the main control unit is in communication connection with the image acquisition unit and the calibration device to receive the image information transmitted by the image acquisition unit, and transmit the obtained calibration information to the calibration device after performing a check calculation on the image information, so as to assist the calibration device to align the centers of the two substrates and the feature mark structures, respectively.
In some specific embodiments of the present invention, the main control unit is a computer. The main control part is respectively connected with the guide part, the driving part, the edge image acquisition part 23 and the feature mark image acquisition part 24 in a communication way.
In some embodiments of the present invention, the guide driving part 21 includes the guide part and the driving part. Specifically, the centers of the two substrates and the feature mark structures are respectively aligned through the guide parts.
Fig. 3 is a partial structural view of the guide driving part shown in fig. 2. Fig. 4 is a schematic structural diagram of the driving part shown in fig. 3.
In some embodiments of the present invention, the driving part is disposed at the guide part to convert the rotational motion of the rotational driving part into a linear motion by the motion converting part. Specifically, referring to fig. 3, in the guide driving unit 21, a driving unit 33 is provided on the fixed table 32 of the guide unit 31.
Specifically, the guide portion 31 includes a planar guide structure, which is driven to move in two directions perpendicular to each other along a plane on which the guide portion 31 is placed. In some embodiments of the present invention, the planar guiding structure is driven to move along any one of an X-axis direction in a horizontal direction, a reverse direction of the X-axis direction, a Y-axis direction, and a reverse direction of the Y-axis direction.
Specifically, the guide portion 31 further includes a rotation guide structure that is driven to rotate around a direction perpendicular to the plane with a center point of two directions perpendicular to each other as a rotation center. In some embodiments of the invention, the rotary guiding structure rotates around a Z-axis perpendicular to the X-axis and the Y-axis.
In some embodiments of the present invention, the main control unit controls the planar guide structure to align centers of the two substrates, and controls the rotational guide structure to align feature mark structures of the two substrates.
In some specific embodiments of the present invention, the main control part is communicatively connected to the planar guiding structure and the rotary guiding structure.
In some specific embodiments of the present invention, the planar guiding structure of the guiding portion 3 has a linear motor as an internal drive, and a linear grating ruler is used as a closed-loop feedback to enable the positioning accuracy within the planar range to be within 3 micrometers in cooperation with a precise cross roller guide rail; the rotary guide structure of the rotary guide device is provided with a high-precision circular grating, and can realize accurate positioning within 0.005 degree.
In some embodiments of the invention, the drive portion comprises a rotary drive portion. Specifically, referring to fig. 4, in the driving portion 33, a servo motor 41, a driving synchronous toothed pulley 42, a synchronous toothed belt 43 and a driven synchronous pulley 44 constitute the rotation driving portion, and the operation of the servo motor 41 drives the driving synchronous toothed pulley 42 to rotate, and further drives the driven synchronous pulley 44 to rotate through the synchronous toothed belt 43.
Further, the rotation driving portion is disposed on the fixed stage 32, and can be driven by the guiding portion 31 to move.
In some embodiments of the present invention, the driving part further includes a motion converting part to convert the rotational motion into the linear motion. Specifically, the motion conversion part comprises a guide rod structure and a sleeve structure.
Referring to fig. 4, the guide rod structure 46 is disposed on the rotation driving portion (not labeled), specifically, the driven synchronous pulley 44 of the rotation driving portion (not labeled), the sleeve structure 45 is movably sleeved on the guide rod structure 46, and the guide rod structure 46 moves relative to the sleeve structure 45 under the driving of the rotation movement of the driven synchronous pulley 44, so as to drive the sleeve structure 45 to move along the axial direction of the guide rod structure 46. The axial direction of the guide bar structure 46 is a direction pointing toward the center axis of the driven timing pulley 44 or a direction opposite thereto.
In some embodiments of the present invention, the guide bar structure 46 includes a channel structure, and the sleeve structure 45 includes a corresponding channel structure and a rolling structure movably embedded in the corresponding channel structure.
Specifically, after the sleeve structure 45 is movably sleeved on the guide rod structure 46, the groove structure and the corresponding groove structure form a raceway structure which surrounds the axis of the guide rod structure 46 and extends along the axial direction of the guide rod structure 46, and the rolling structure moves along the raceway structure in the process of the relative movement.
More specifically, after the driven synchronous pulley 44 transmits the rotational motion to the guide rod structure 45, the guide rod structure 46 is guided in the radial direction, so as to move relative to the sleeve structure 45, and since the rolling structure of the sleeve structure 45 is movably embedded in the raceway structure and moves along the raceway structure under the driving of the guide rod structure 46, the sleeve structure 45 can move linearly in the linear direction, i.e., the axial direction of the guide rod structure or the direction opposite to the axial direction. For each revolution of the guide rod arrangement 46, the sleeve arrangement 45 moves in a linear direction by one lead.
In some embodiments of the present invention, the sleeve structure 45 is a ball nut, the guide rod structure 46 is a lead screw, and the sleeve structure 45 and the guide rod structure 46 together form a ball screw.
In some embodiments of the present invention, the driving portion further includes a disc structure disposed on the sleeve structure to perform a linear motion under the driving of the sleeve structure.
Specifically, referring to fig. 3 and 4, the tray body 34 and the rail structure composed of the rail 36 and the rail sleeve 35 together constitute the tray structure. The sleeve structure 45 is arranged on the tray body 34, and the sleeve structure 45 drives the tray body 34 to perform linear motion, so that the distance between the two substrates can be adjusted.
In some specific embodiments of the present invention, the guide rail structure is a ball screw, and the specific movement manner is described in the foregoing, which is not described herein again.
In some embodiments of the invention, the number of rail structures is at least 1.
In some embodiments of the present invention, a plurality of rail structures are arranged in an annular array about the center of the tray 34.
Fig. 5 is a schematic view of the adsorption structure shown in fig. 3.
In some embodiments of the present invention, the supporting portion includes an object placing portion, and the object placing portion includes an adsorption structure. Referring to fig. 3 and 5, a suction structure 37 is provided to the tray body 34, and a receiving structure 51 and a fixing structure 52 connected to each other, and an interface structure 53 provided at one end of the fixing structure 52 constitute the suction structure 37. The receiving structure 51 is used for receiving any one of the two substrates.
Referring to fig. 3 to 5, the sleeve structure 45 drives the disc 34 to perform a linear motion, and further drives the absorption structure 37 to perform a linear motion.
Further, the absorption structure 37 is a hollow structure, the interface structure 53 is used for communicating with a vacuum pipeline, and the receiving structure 51 receives the substrate through a vacuum absorption effect.
In some embodiments of the present invention, the receiving structure 51 is a PIN cap directly contacting the wafer and is made of a non-metal heat-resistant material to withstand the high bonding process temperature and avoid damaging the wafer. The securing structure 52 is a PIN that secures the PIN cap.
In some embodiments of the present invention, the number of the absorption structures 37 is at least 1, and a plurality of the absorption structures 37 are disposed in a circular array relative to the center of the disc body 34.
Fig. 6 is a schematic view of a support disk structure and the use of a corresponding support disk structure according to some embodiments of the present invention.
In some embodiments of the present invention, the placement portion further includes a supporting plate structure and a corresponding supporting plate structure, which are oppositely disposed. Referring to fig. 3 and 6, the supporting disc structure 62 is provided with a plurality of supporting disc suction groove structures 67 corresponding to the surface of the supporting disc structure 61, and the corresponding supporting disc structure 61 is provided with a plurality of corresponding supporting disc suction groove structures 65 corresponding to the surface of the supporting disc 62, so as to respectively communicate with an external vacuum device and provide suction force. The plurality of supporting disk adsorption groove structures 67 and the plurality of corresponding supporting disk adsorption groove structures 65 form a plurality of adsorption groove structures of the object placing part. The plurality of adsorption structures 37 are disposed through the plurality of through holes 66 disposed on the support plate structure 62.
Specifically, the suction groove structures 65 of the corresponding support discs provide suction force for the first substrate 63 placed on the corresponding support disc 61.
The plurality of support disc suction groove structures 67 together with the suction structure 37 provide suction force for the second substrate 64.
Fig. 7 is a plan view of the edge image capturing unit shown in fig. 2.
Referring to fig. 7, the edge image capturing unit 23 includes a first fixing base 71, and a first edge image capturing structure 72, a second edge image capturing structure 73 and an edge image capturing driving unit 74 disposed on the first fixing base 71. The first edge imaging structure 72 and the second edge imaging structure 73 are disposed opposite to each other, and the edge imaging driving unit 74 drives the first edge imaging structure 72 and the second edge imaging structure 73 to synchronously operate, so as to simultaneously acquire images of the two substrate edges.
In some embodiments of the present invention, the first edge imaging structure 72 and the second edge imaging structure 73 are used to simultaneously acquire images of the two substrates at different edge positions, respectively, that is, the image acquired by each edge imaging structure includes the edge position images of the two substrates.
Further, the first edge image capturing structure 72 and the second edge image capturing structure 73 perform image capturing synchronously.
In some embodiments of the present invention, the edge capture driving unit 74 includes a motor driving component and an edge capture driving component.
More specifically, the motor driving assembly comprises a servo motor, a driving pulley, a synchronous toothed belt and a synchronous toothed belt, the edge image capture driving assembly comprises a driven pulley, the servo motor rotates to drive the driving pulley to rotate synchronously, and the synchronous toothed belt is further driven to be transmitted to the driven pulley of the edge image capture driving assembly. For a detailed structure and an assembling manner of the motor driving assembly, please refer to the above description of the driving portion 33, which is not described herein again.
Fig. 8 is a schematic structural diagram of the first edge image capturing structure shown in fig. 7.
Referring to fig. 8, the first edge image capturing structure 72 includes an image reflecting element 81, an image transmitting element 82, an edge image capturing element 83, an illuminating element 84 disposed on the image transmitting element 82, and a fixing base 85, which are coaxially disposed. The fixing base 85 is fixedly connected to the image reflector 81, the image transmitter 82 and the edge imager 83, and ensures that the image reflector 81, the image transmitter 82 and the edge imager 83 are coaxial in the horizontal direction.
When the two substrates are parallel to each other in the horizontal direction, the image is reflected by the image reflection element 81 and transmitted to the edge image capturing element 83 through the image transmission element 82, so as to complete the synchronous acquisition of the upper and lower edge images of the two different substrates. The illuminating member 84 provides sufficient illumination conditions and has a dimming function so as to obtain an optimum image effect.
In some embodiments of the present invention, the image reflector 81 is a beam splitter prism, the image transmitter 82 is a lens barrel, the illuminator 84 is a light source, and the edge imager 83 is a vision camera.
More specifically, the beam splitter prism is a dual-view prism, the focal depth of the vision camera exceeds 200 micrometers, and the resolution is not less than 5 micrometers, so that after the first edge image capturing structure 72 is moved in place, focusing is not needed, and image acquisition can be performed on the upper wafer and the lower wafer at the same time.
In some embodiments of the present invention, the first edge image-capturing structure 72 and the second edge image-capturing structure 73 have the same structure, and the image reflectors are disposed oppositely.
Fig. 9 is a schematic structural diagram of a feature label image acquisition part according to some embodiments of the invention.
Referring to fig. 9, the feature mark image capturing unit 24 includes a feature mark image capturing structure 92 disposed on the second fixing base 91, and a feature mark image capturing driving unit 93 for driving the feature mark image capturing structure 92.
In some embodiments, the feature mark image capturing structure 92 has the same structure as the first edge image capturing structure 72 and the second edge image capturing structure 73.
In some embodiments of the present invention, the feature mark image capturing driving unit 93 and the edge image capturing driving unit 74 have the same structure.
Fig. 10 is a schematic view of an operating state of the alignment system shown in fig. 2.
The alignment method according to the embodiment of the present invention will be described in detail with reference to fig. 2 to 10.
In the initial state, the edge image capturing part 23 and the feature mark image capturing part 24 are both away from the supporting disc structure 62 and the corresponding supporting disc structure 61.
In step S1, the main control unit (not shown) adjusts the axes of the first edge capturing structure 72, the second edge capturing structure 73 and the feature mark capturing structure 92 in the horizontal direction to be on the same horizontal plane, and the feature mark capturing structure 92 is disposed toward the middle position between the first edge capturing structure 72 and the second edge capturing structure 73, so that the image capturing unit is in the first position state.
Further, the vertical distance from the axis of the guiding portion 31 along the vertical direction to the proximal end of any one of the first edge image capturing structure 72 and the second edge image capturing structure 73 is equal to the vertical distance from the proximal end of the feature mark image capturing structure 92, which is close to one end of the guiding portion 31. The suction structure 37 is located at the lower limit of the stroke, so that the receiving structure 51 supporting the wafer is located below the lower end surface of the support disc structure 62.
In step S2, the following plate placing process is performed first:
lifting the adsorption structure 37 to a designated sheet taking position, conveying a substrate to the adsorption structure 37 by a conveying manipulator, enabling the adsorption structure 37 to realize adsorption of the substrate due to vacuum connection, then lifting the adsorption structure 37 to the corresponding support plate structure 61, and enabling the corresponding support plate structure 61 to realize vacuum connection of the substrate; the vacuum supply to the suction structure 37 is then disconnected, allowing the suction structure 37 to move down to the designated pick-up position. After the other substrate is transferred in by the transfer robot, the adsorption structure 37 moves down to the alignment position.
In some embodiments of the invention, the vertical distance between the alignment position and the support disc structure 62 is no greater than 5 mm.
After the board placing process of step S2 is completed, an alignment process is performed, where the alignment process specifically includes:
the edge image capturing part 23 and the feature mark image capturing part 24 are driven to move towards the supporting disc structure 62 and the corresponding supporting disc structure 61 simultaneously until reaching the respective image capturing positions. The image acquisition position is located between the support disc structure 62 and the corresponding support disc structure 61.
In step S3, the wafer is simultaneously imaged by the image capturing structures of the edge image capturing unit 23 and the feature mark image capturing unit 24 to generate position image information, and the position image information is transmitted to the main control unit for position analysis, so as to obtain position compensation information.
Specifically, the position image information returned by the different image capturing units of the edge image capturing unit 23 includes image information of edge positions of the different substrates; the position image information returned by the feature mark image acquisition part 24 comprises feature mark position information of different substrates.
In step S4, the main control unit calls pre-stored reference edge position information and reference feature mark position information to generate edge position compensation information and feature mark position compensation information as the calibration information and transmits the calibration information to the calibration device, based on any one of the two substrates.
Further, after the position compensation processing is performed by the guiding unit 31, the calibration device performs image capturing by each image capturing structure of the edge image capturing unit 23 and the feature mark image capturing unit 24, and the main control unit performs position analysis until the main control unit determines that the image information of the edge positions of the different substrates is consistent with the reference edge position information, and the feature mark position information of the different substrates is consistent with the reference feature mark position information.
In some embodiments of the invention, the feature mark is a wafer notch, and the reference feature mark position information includes arc center position information of different wafer notches.
In some embodiments of the present invention, in the alignment process, referring to fig. 2 and 6, the second substrate 64 located at the lower portion is lifted by the suction structure 37 which is turned on by vacuum to be separated from the support disk structure 62. Controlling a vertical distance between a surface of the second substrate 64 facing the first substrate 63 and a surface of the first substrate 63 facing the second substrate 64 to be equal to a focal length of a vision camera of the first edge image capturing structure 72.
In some embodiments of the invention, the vertical distance is 0.5mm to 1 mm.
After the alignment process is completed, the absorption structure 37 drives the second substrate 64 to vertically descend until the second substrate is absorbed to the supporting disc structure 62 to be fixed.
Further, the edge image capturing part 23 and the feature mark image capturing part 24 are driven away from the space between the supporting disk structure 62 and the corresponding supporting disk structure 61, and then a bonding process is performed.
Although the embodiments of the present invention have been described in detail hereinabove, it is apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it is to be understood that such modifications and variations are within the scope and spirit of the present invention as set forth in the following claims. Moreover, the invention as described herein is capable of other embodiments and of being practiced or of being carried out in various ways.
Claims (15)
1. An alignment method, comprising the steps of:
s1: adjusting the image acquisition part to enable the edge image acquisition part and the feature mark image acquisition part of the image acquisition part to be arranged opposite to two sides of the calibration device and far away from the calibration device;
s2: placing two substrates to be aligned on a supporting part of the calibration device, and enabling the two substrates to be opposite;
s3: the image acquisition part is used for simultaneously acquiring initial edge position information and initial feature mark position information of the two substrates and then sending the initial edge position information and the initial feature mark position information to the main control part for checking calculation;
s4: and the main control part sends the calibration information obtained through the checking calculation to a guide part of the calibration device, and the guide part carries out compensation adjustment according to the calibration information.
2. The alignment method according to claim 1, wherein the alignment device further comprises a rotation driving part and a motion converting part provided to the guide part, and the step S4 further comprises converting the rotation motion of the rotation driving part into a linear motion during the compensation adjustment of the guide part, so as to adjust the relative position between the two substrates.
3. The alignment method as claimed in claim 1, wherein the edge image capturing unit includes two edge image capturing structures disposed in parallel, the feature mark image capturing unit includes a feature mark image capturing structure, and the step S1 further includes adjusting the feature mark image capturing structure toward a middle position of the two edge image capturing structures, and making the two edge image capturing structures and the feature mark image capturing structure toward an axis of the calibration device in a same plane.
4. The method according to claim 3, wherein the step S1 further comprises making the guide portion a vertical distance from the proximal end of either of the edge image capture structures along an axis perpendicular to the planar direction equal to the vertical distance from the proximal end of the feature mark image capture structure.
5. The method according to claim 1, wherein the supporting portion comprises an absorbing structure and a supporting plate structure and a corresponding supporting plate structure which are oppositely arranged, and in step S2, a transferring structure is provided, after any one of the two substrates is received by the absorbing structure through the transferring structure, the two substrates are respectively placed on the corresponding supporting plate structure and the supporting plate structure through the absorbing structure, so that the two substrates are opposite to each other.
6. The method according to claim 5, wherein in step S2, the main control unit controls the distance between the suction structure carrying one substrate and the corresponding support plate structure carrying the other substrate, so that the vertical distance between the two substrates is equal to the focal length used by the image capturing unit to perform step S3.
7. The method according to claim 6, wherein in step S3, the edge image capturing part and the feature mark image capturing part are controlled to use the same focal length.
8. The alignment method of claim 7, wherein the focal length is 0.5-1 mm.
9. The alignment method according to claim 8, wherein the depth of focus of the edge image capturing part and the feature mark image capturing part is not less than 200 μm, and the resolution is not more than 5 μm.
10. The alignment method according to claim 1, wherein in step S3, the edge image capturing part and the feature mark image capturing part each acquire the initial edge position information and the initial feature mark position information, respectively, by means of a field of view average separation.
11. The alignment method according to claim 10, wherein the initial edge position information includes position information of respective edges of the two substrates, and the initial feature mark position information includes position information of respective feature marks of the two substrates.
12. The alignment method according to claim 11, wherein the main control part stores reference edge position information, and in step S4, the main control part performs the collation calculation with reference to the reference edge position information with reference to the edge position information of one of the two substrates to obtain target edge position information of the other of the two substrates as the calibration information.
13. The alignment method according to claim 11, wherein the main control unit stores reference feature mark position information, and in step S4, the main control unit performs the collation calculation with reference to the reference feature mark position information with reference to the feature mark position information of one of the two substrates to obtain target feature mark position information of the other of the two substrates as the calibration information.
14. The alignment method according to claim 13, wherein the feature mark is an arc-shaped notch, and the reference feature mark position information is reference position information of a center of a circle corresponding to an arc-shaped surface of the arc-shaped notch.
15. An alignment system applied to implement the alignment method according to any one of claims 1 to 14, the alignment system comprising a main control part, an edge image acquisition part, a feature mark image acquisition part and a calibration device, wherein the main control part is in communication connection with the edge image acquisition part, the feature mark image acquisition part and the calibration device.
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