CN112830447A

CN112830447A - MEMS sensor and electronic device

Info

Publication number: CN112830447A
Application number: CN202110072854.0A
Authority: CN
Inventors: 陈岭
Original assignee: Weifang Goertek Microelectronics Co Ltd
Current assignee: Weifang Goertek Microelectronics Co Ltd
Priority date: 2021-01-19
Filing date: 2021-01-19
Publication date: 2021-05-25
Anticipated expiration: 2041-01-19
Also published as: CN112830447B

Abstract

The invention discloses a MEMS sensor and an electronic device using the same. The MEMS sensor comprises an external packaging structure, an MEMS chip, a waterproof breathable film and a heating module, wherein a containing cavity is formed inside the external packaging structure, and the external packaging structure is provided with a breathable hole communicated with the containing cavity; the MEMS chip is arranged in the containing cavity and communicated with the air holes; the waterproof breathable film is arranged on the outer surface of the external packaging structure and covers the air holes; the heating module is arranged in the air holes and only occupies part of the air passages of the air holes. The technical scheme of the invention can enable the MEMS sensor to be quickly recovered to be used after the MEMS sensor is involved in water.

Description

MEMS sensor and electronic device

Technical Field

The invention relates to the technical field of sensors, in particular to an MEMS sensor and electronic equipment applying the MEMS sensor.

Background

In recent years, Micro-Electro-Mechanical systems (MEMS) have been developed with rapid development of technology. Among them, the MEMS sensor has been widely used as a detection device in electronic devices such as mobile phones, notebook computers, tablet computers, and wearable devices.

Currently, there is a class of MEMS sensors that rely on air vents on their external packaging structure to detect external parameters (e.g., sound, gas, pressure, etc.), such as MEMS microphones, MEMS gas sensors, MEMS pressure sensors, etc.; such MEMS sensors typically rely on waterproof membranes to waterproof their air vents to prevent water ingress.

Therefore, although the components in the MEMS sensor can be protected from being damaged, the MEMS sensor can normally operate; however, the entire MEMS sensor cannot be put into use at once because the waterproof and breathable film may still be covered by the water film. Therefore, how to quickly recover the use of such MEMS sensors after the sensors are involved in water has been a research topic of researchers and developers.

Disclosure of Invention

The invention mainly aims to provide an MEMS sensor and electronic equipment applying the MEMS sensor, and aims to enable the MEMS sensor to be quickly recovered to be used after wading.

An embodiment of the present invention provides a MEMS sensor including:

the outer packaging structure is internally provided with a containing cavity, and the outer packaging structure is provided with an air hole communicated with the containing cavity;

the MEMS chip is arranged in the accommodating cavity and communicated with the air holes;

the waterproof breathable film is arranged on the outer surface of the external packaging structure and covers the air holes; and

the heating module is arranged in the air holes and only occupies part of the air passages of the air holes.

In an embodiment of the invention, the heating module is a heat transfer element, the MEMS sensor further includes an internal heating element, the internal heating element is disposed in the receiving cavity, the external packaging structure is provided with a first heat conduction rail, one end of the first heat conduction rail is in contact with the internal heating element, and the other end of the first heat conduction rail is in contact with the heat transfer element.

In an embodiment of the invention, the external package structure includes a circuit board, the air holes are formed in the circuit board, and the first heat conducting track is formed in the circuit board.

In an embodiment of the invention, a heat conducting cylinder is disposed around an inner wall of the air vent, the heat transfer element is disposed in the heat conducting cylinder and contacts with the inner wall of the heat conducting cylinder, and one end of the first heat conducting rail, which is far away from the internal heating element, contacts with the heat conducting cylinder.

In an embodiment of the present invention, an outer edge of the heat transfer element is circumferentially disposed along a circumferential direction of the heat conduction cylinder and contacts with an inner wall of the heat conduction cylinder.

In an embodiment of the present invention, the heat transfer member is a plate-shaped structure, and the plate-shaped structure is provided with a plurality of through holes arranged at intervals.

In an embodiment of the invention, a second heat conducting track is further disposed in the external packaging structure, and one end of the second heat conducting track is in contact with the heat transfer element, and the other end of the second heat conducting track is exposed at an outer surface of the external packaging structure and is used for contacting with an external heating element.

In an embodiment of the invention, the heat-generating module is a self-heating element, and the external packaging structure includes a circuit board, and the self-heating element is electrically connected to the circuit board.

In an embodiment of the present invention, an adhesive layer is disposed between the waterproof breathable film and the external packaging structure, and the waterproof breathable film is adhered to the outer surface of the external packaging structure through the adhesive layer.

An embodiment of the present invention also provides an electronic device including a MEMS sensor, the MEMS sensor including:

According to the technical scheme, the waterproof breathable film covers the outer side of the breathable hole, and due to the special waterproof and breathable functions of the waterproof breathable film, the detection of external parameters (such as sound, gas, air pressure and the like) of the MEMS chip through the breathable hole cannot be influenced, and the effect of preventing external moisture from entering the breathable hole can be achieved, so that components in the MEMS sensor are protected from being damaged, and the MEMS sensor can normally operate. Furthermore, according to the technical scheme of the invention, the heating module is also arranged in the vent hole, and only occupies part of the vent channel of the vent hole; therefore, the detection of external parameters (such as sound, gas, air pressure and the like) by the MEMS chip through the vent hole is not influenced. Meanwhile, due to the heating function of the heating module, heat can be directly emitted to the waterproof breathable film, so that evaporation of a water film covering the waterproof breathable film is accelerated, and the MEMS sensor can be quickly recovered to be used after wading.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic structural diagram of an embodiment of a MEMS sensor according to the present invention;

FIG. 2 is a top view of one embodiment of the circuit board of FIG. 1;

fig. 3 is a top view of another embodiment of the circuit board of fig. 1.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				100	MEMS sensor	133	Heat conduction barrel
10	External packaging structure	135	Second heat conducting rail
				10a	Containing cavity		20	MEMS chip
10b	Air vent		30						Waterproof breathable film
				11	Housing shell	40	Heating module
13	Circuit board	50	Internal heating element
				131	First heat conducting rail	60	Adhesive layer

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In addition, the technical solutions in the embodiments of the present invention may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination of technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

MEMS sensors typically rely on waterproof breathable films to waterproof their vents to avoid water ingress.

Therefore, although the components in the MEMS sensor can be protected from being damaged, the MEMS sensor can normally operate; however, the entire MEMS sensor cannot be put into use at once because the waterproof and breathable film may still be covered by the water film.

In view of the above technical problems, the present invention provides a MEMS sensor 100, which is intended to enable the MEMS sensor 100 to be quickly recovered to use after wading.

It can be understood that the MEMS sensor 100 of the present invention can be applied to electronic devices, which can be, but not limited to, a mobile phone, a notebook computer, a tablet computer, a Personal Digital Assistant (PDA), an e-book reader, an MP3 (Moving Picture Experts Group Audio Layer III) player, an MP4 (Moving Picture Experts Group Audio Layer IV) player, a wearable device, a navigator, a handheld game console, etc.

The specific structure of the MEMS sensor 100 of the present invention will be described in the following embodiments, and the MEMS sensor 100 is taken as an example of a horizontal position:

as shown in fig. 1, in an embodiment of the MEMS sensor 100 of the present invention, the MEMS sensor 100 includes an external packaging structure 10, a MEMS chip 20, a waterproof gas-permeable membrane 30, and a heat generating module 40.

A receiving cavity 10a is formed inside the external packaging structure 10, and the external packaging structure 10 is provided with an air hole 10b communicated with the receiving cavity 10 a; the MEMS chip 20 is arranged in the accommodating cavity 10a and is communicated with the air holes 10 b; the waterproof breathable film 30 is arranged on the outer surface of the external packaging structure 10 and covers the air holes 10 b; the heating module 40 is disposed in the ventilation hole 10b and occupies only a part of the ventilation channel of the ventilation hole 10 b.

In this embodiment, the external package structure 10 includes a housing 11 and a circuit board 13, wherein the housing 11 is disposed on the circuit board 13 and encloses with the circuit board 13 to form a receiving cavity 10 a. The MEMS chip 20 is disposed in the receiving cavity 10a and fixed on the surface of the circuit board 13 facing the receiving cavity 10a, and the fixing manner may be glue bonding, soldering, or the like. It is understood that the MEMS chip 20 may be configured in a corresponding manner depending on the particular type of MEMS sensor 100, such as a MEMS microphone, a MEMS gas sensor, a MEMS gas pressure sensor, and the like.

In this embodiment, the MEMS sensor 100 is a MEMS microphone. Therefore, the MEMS chip 20 includes a substrate having a substantially cylindrical structure with openings at both ends, and a diaphragm, and an axis of the substrate is perpendicular to the circuit board 13. Further, one end (lower end) of the substrate facing the circuit board 13 is fixed to a surface of the circuit board 13 facing the receiving cavity 10a, and a diaphragm is provided in one end (upper end) of the substrate facing away from the circuit board 13. At this time, the ventilation holes 10b of the external packaging structure 10 are opened on the circuit board 13, and the tubular structure of the MEMS chip 20 surrounds the ventilation holes 10 b. In this way, the communication between the MEMS chip 20 and the vent 10b is realized, so that the MEMS chip 20 can detect external parameters (e.g., sound, gas, pressure, etc.) through the vent 10 b.

In this embodiment, the outer side of the air hole 10b is covered with the waterproof breathable film 30, and due to the unique waterproof and breathable functions of the waterproof breathable film 30, the detection of external parameters (such as sound, gas, air pressure and the like) by the MEMS chip 20 through the air hole 10b is not affected, and the function of preventing external moisture from entering the air hole 10b is also achieved, so that the components inside the MEMS sensor 100 are protected from being damaged, and the normal operation is realized.

Further, in the present embodiment, the heating module 40 is further installed in the ventilation hole 10b, and the heating module 40 only occupies a part of the ventilation channel of the ventilation hole 10 b; therefore, the detection of the external parameters (e.g., sound, gas, pressure, etc.) by the MEMS chip 20 through the vent 10b is not affected. Meanwhile, due to the heating function of the heating module 40, heat can be directly dissipated to the waterproof breathable film 30, so that evaporation of a water film covering the waterproof breathable film 30 is accelerated, and the MEMS sensor 100 can be quickly recovered to be used after wading.

Moreover, it can be understood that the arrangement of the heating module 40 can also support the waterproof breathable film 30, thereby enhancing the waterproof pressure rating of the waterproof breathable film 30. Here, there are two cases:

first, the situation where the heat generating module 40 is in contact with the waterproof breathable film 30; at this time, the heat generating module 40 directly plays a supporting role;

secondly, the heating module 40 is spaced from the waterproof breathable film 30 by a certain distance; at this time, the heating module 40 plays a supporting role when the waterproof breathable film 30 is deformed to a certain extent; in practical application, the distance between the heating module 40 and the waterproof breathable film 30 is determined by the deformation capability of the waterproof breathable film 30, so long as the support is provided within the maximum elastic deformation range of the waterproof breathable film 30, for example: the spacing distance between the heating module 40 and the waterproof breathable film 30 can be 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm and 1 mm.

In addition, it should be noted that, in this embodiment, the MEMS sensor 100 further includes an ASIC chip, and the ASIC chip is also disposed in the receiving cavity 10a and is also fixed on the surface of the circuit board 13 facing the receiving cavity 10a, and the fixing manner may be glue connection, soldering, and the like. The ASIC chip and the MEMS chip 20 are spaced apart and electrically connected to each other through a wire or through a circuit layer in the circuit board 13. Those skilled in the art can make reasonable selection according to the needs of the actual application scenario, and is not limited herein. It is understood that after the ASIC chip is mounted, the electrical signal converted by the MEMS chip 20 can be transmitted to the ASIC chip, processed by the ASIC chip, and finally transmitted to the outside.

The housing 11 is generally made of metal to play a role of electromagnetic shielding, so as to reduce the possibility that the operation performance of the components (e.g., the MEMS chip 20, the ASIC chip, etc.) in the external packaging structure 10 is affected by the outside.

As shown in fig. 1, in an embodiment of the MEMS sensor 100 of the present invention, the heating module 40 is a heat transfer element, the MEMS sensor 100 further includes an internal heating element 50, the internal heating element 50 is disposed in the receiving cavity 10a, a first heat conduction rail 131 is disposed in the external packaging structure 10, one end of the first heat conduction rail 131 is in contact with the internal heating element 50, and the other end is in contact with the heat transfer element.

It is to be understood that the heat transfer member may be a structural member made of a metal material (e.g., copper or aluminum), an alloy material (e.g., copper alloy or aluminum alloy), or a structural member formed by curing a heat conductive adhesive (e.g., heat conductive silicone). The first heat conducting rail 131 may be made of a metal material (e.g., copper or aluminum), an alloy material (e.g., copper alloy or aluminum alloy), or a solidified material of a heat conducting adhesive.

The end of the first heat conduction rail 131 contacting the internal heating element 50 may be fixed to the surface of the internal heating element 50 by thermal adhesive to contact the internal heating element 50, or may be fixed to the surface of the internal heating element 50 by welding to contact the internal heating element 50. Similarly, the end of the first heat conduction rail 131 contacting the heat transfer element may be fixed to the surface of the heat transfer element by means of a heat conduction adhesive to contact the heat transfer element, or may be fixed to the surface of the heat transfer element by means of welding to contact the heat transfer element. Therefore, the thermal contact resistance is greatly reduced, thereby being beneficial to improving the heat transfer efficiency and reducing the heat loss; moreover, the stability of connection is improved, and the heat transfer process is more stable. Of course, the term "contact" may also be used in the form of direct abutment or in other effective and rational forms.

At this time, the heat generated when the internal heating element 50 of the MEMS sensor 100 operates can be transferred to the heat transfer member through the first heat conduction rail 131, and then the heat is dissipated to the waterproof breathable film 30 through the heat transfer member, so that the evaporation of the water film covering the waterproof breathable film 30 is accelerated.

In addition, in the present embodiment, the internal heating element 50 is an ASIC chip. Of course, in other embodiments, the internal heating element 50 may also be other auxiliary devices encapsulated in the external packaging structure 10, such as a capacitor, a resistor, other functional chips, and the like.

In addition, as shown in fig. 2, in one embodiment, the heat transfer member may have a cross-shaped structure, and four ends of the cross-shaped structure are supported on the inner walls of the airing holes 10b to fix the heat transfer member.

As shown in fig. 1, in an embodiment of the MEMS sensor 100 of the present invention, the external packaging structure 10 includes a circuit board 13, the air hole 10b is opened in the circuit board 13, and the first heat conducting track 131 is disposed in the circuit board 13.

In this embodiment, the air holes 10b, the waterproof air-permeable membrane 30, the heat transfer element, and the first heat conduction rail 131 are all integrated on the circuit board 13 of the external packaging structure 10.

In this way, the circuit board 13 is used as a carrier to realize an integration mode, so that the number of independent parts in the subsequent packaging process can be effectively reduced, the packaging process is simplified, the packaging process is convenient to carry out, and the production efficiency of packaging and preparing the MEMS sensor 100 is improved; and the probability of errors in the packaging process can be effectively reduced, and the product yield is improved.

Moreover, since the internal heating element 50 of the MEMS sensor 100 is generally fixed on the circuit board 13, the technical solution of this embodiment can also greatly reduce the difficulty of contacting the first heat conducting track 131 with the internal heating element 50, thereby greatly reducing the difficulty of manufacturing the MEMS sensor 100 and improving the reliability and yield of the MEMS sensor 100.

Of course, in other embodiments, the ventilation hole 10b, the waterproof breathable film 30, the heat transfer element, and the first heat conduction rail 131 may be integrated on the cover 11 of the external packaging structure 10.

As shown in fig. 1, in an embodiment of the MEMS sensor 100 according to the present invention, a heat conducting cylinder 133 is disposed around an inner wall of the air hole 10b, the heat conducting element is disposed in the heat conducting cylinder 133 and contacts with the inner wall of the heat conducting cylinder 133, and an end of the first heat conducting rail 131 away from the internal heat generating element 50 contacts with the heat conducting cylinder 133.

It is to be understood that the heat-conducting cylinder 133 may be a cylinder made of a metal material (e.g., copper or aluminum), an alloy material (e.g., copper alloy or aluminum alloy), or a cylinder formed by solidifying a heat-conducting glue (e.g., heat-conducting silicone).

The end of the first heat conducting rail 131 away from the internal heat generating element 50 may be fixed to the outer sidewall of the heat conducting cylinder 133 by means of heat conducting glue to contact the heat conducting cylinder 133, or may be fixed to the outer sidewall of the heat conducting cylinder 133 by means of welding to contact the heat conducting cylinder 133. Meanwhile, the heat transfer member may be in contact with the inner wall of the heat conductive barrel 133 by bonding with a heat conductive adhesive or by welding. Therefore, the thermal contact resistance is greatly reduced, thereby being beneficial to improving the heat transfer efficiency and reducing the heat loss; moreover, the stability of connection is improved, and the heat transfer process is more stable. Of course, the term "contact" may also be used in the form of direct abutment or in other effective and rational forms.

At this time, the end of the first heat conduction rail 131, which is far from the internal heating element 50, is brought into contact with the heat transfer member through the heat conduction cylinder 133. Thus, the heat transferred from the first heat conduction rail 131 can be uniformly distributed in the heat conduction barrel 133, which is equivalent to forming a "baking space" around the heat transfer element; at this time, the heat transfer member is located in the "baking space", and heat absorption is faster, and heat dissipation to the waterproof breathable film 30 is more efficient. Furthermore, the formation of the "baking space" also means that the heat-conducting cylinder 133 can directly heat the air inside the heat-conducting cylinder, so that the heat is transferred to the waterproof breathable film 30 through the air, thereby further accelerating the evaporation of the water film covering the waterproof breathable film 30.

In an embodiment of the MEMS sensor 100 of the present invention, in order to further improve the efficiency of the heat transfer element absorbing heat by the heat conductive cylinder 133 and the efficiency of the heat transfer element dissipating heat to the waterproof breathable film 30, so as to further accelerate the evaporation of the water film covering the waterproof breathable film 30, the heat transfer element is further optimized as follows:

the outer edge of the heat transfer member is circumferentially disposed along the circumference of the heat conductive cylinder 133 and contacts the inner wall of the heat conductive cylinder 133.

Specifically, as shown in fig. 3, in an embodiment, the heat transfer member may be a plate structure having a plurality of hollow portions, and an outer contour shape of the plate structure matches an inner contour shape of a cross section of the heat conduction cylinder 133; thus, the outer edge of the plate-shaped structure is disposed around the inner wall of the heat-conducting cylinder 133 and contacts the inner wall of the heat-conducting cylinder 133. Also, as shown in fig. 2, in an embodiment, the heat transfer member may also have a cross-shaped structure, and four ends of the cross-shaped structure are supported on the inner wall of the heat conductive cylinder 133 and are in contact with the inner wall of the heat conductive cylinder 133.

As shown in fig. 1, in an embodiment of the MEMS sensor 100 of the present invention, a second heat conducting track 135 is further disposed in the external packaging structure 10, and one end of the second heat conducting track 135 is in contact with the heat transfer element, and the other end is exposed at an outer surface of the external packaging structure 10 for contacting with an external heat generating component.

It is understood that the second heat conducting rail 135 may be made of a metal material (e.g., copper or aluminum), an alloy material (e.g., copper alloy or aluminum alloy), or a direct solidification of the heat conducting glue. The end of the second heat conduction rail 135, which is in contact with the heat transfer element, may be fixed to the surface of the heat transfer element by means of a heat conduction adhesive to achieve contact with the heat transfer element, or may be fixed to the surface of the heat transfer element by means of welding to achieve contact with the heat transfer element. Therefore, the thermal contact resistance is greatly reduced, thereby being beneficial to improving the heat transfer efficiency and reducing the heat loss; moreover, the stability of connection is improved, and the heat transfer process is more stable. Of course, the term "contact" may also be used in the form of direct abutment or in other effective and rational forms.

At this time, after the MEMS sensor 100 is mounted to the corresponding position inside the electronic device, the heat generated when the external heating element independent of the MEMS sensor 100 operates is transferred to the heat transfer member through the second heat conduction rail 135, and then the heat is dissipated to the waterproof breathable film 30 through the heat transfer member, so that the evaporation of the water film covering the waterproof breathable film 30 is further accelerated.

Further, it is understood that the external heat generating element may be other elements within the electronic device independent of the MEMS sensor 100, such as a central processing unit, a graphics processor, a display screen, a battery, other sensors, capacitors, resistors, etc. In addition, when the heat conductive cylinder 133 is disposed in the ventilation hole 10b, the end of the second heat conductive rail 135 that contacts the heat transfer member may also contact the heat transfer member through the heat conductive cylinder 133, specifically: one end of the second heat conduction rail 135, which is in contact with the heat transfer member, is fixed to the outer sidewall of the heat conduction cylinder 133 by means of heat conduction glue to be in contact with the heat conduction cylinder 133, or is fixed to the outer sidewall of the heat conduction cylinder 133 by means of welding to be in contact with the heat conduction cylinder 133, so that the heat conduction cylinder 133 is in contact with the heat transfer member.

As shown in fig. 1, in an embodiment of the MEMS sensor 100 of the present invention, in order to facilitate the contact between the external heating element and the end of the second heat conducting trace 135 away from the heat conducting element and to avoid the encroachment of the end of the second heat conducting trace 135 away from the heat conducting element on the front and back surfaces of the circuit board 13, so as to facilitate the miniaturization of the MEMS sensor 100, the exposed position of the end of the second heat conducting trace 135 away from the heat conducting element on the outer surface of the external packaging structure 10 is further optimized as follows:

the external packaging structure 10 includes a circuit board 13, and an end of the second heat conduction rail 135 away from the heat transfer element is exposed to a side wall of the circuit board 13.

In practical applications, the external heat generating element may transfer heat to an end of the second heat conduction rail 135 away from the heat transfer member through an external heat conduction member (e.g., a metal member, an alloy member, etc.), so as to transfer heat to the heat transfer member through the second heat conduction rail 135.

Furthermore, it is understood that, besides the aforementioned embodiment in which the heat generating module 40 takes the form of a heat transfer element to concentrate heat elsewhere at the air holes 10b to heat the waterproof air permeable membrane 30, in an embodiment of the MEMS sensor 100 of the present invention, the heat generating module 40 can be configured in other forms: the heat generating module 40 is a self-heating element, and the external packaging structure 10 includes a circuit board 13, and the self-heating element is electrically connected to the circuit board 13.

Specifically, the self-heating element may be a resistor with a specially-tailored shape (so as not to occupy all the ventilation channels of the ventilation holes 10 b), a structural form in which a lower support is covered with a conductive film, or a structural form in which heating wires are arranged.

At this time, only the self-heating element is connected to the circuit layer of the circuit board 13, so that the self-heating element is also connected to generate heat when the circuit board 13 is powered on, thereby dissipating heat to the waterproof breathable film 30, accelerating evaporation of the water film covering the waterproof breathable film 30, and further enabling the MEMS sensor 100 to be quickly recovered to use after wading.

As shown in fig. 1, in an embodiment of the MEMS sensor 100 according to the present invention, an adhesive layer 60 is disposed between the waterproof breathable film 30 and the external packaging structure 10, and the waterproof breathable film 30 is adhered to the outer surface of the external packaging structure 10 through the adhesive layer 60.

In this embodiment, the air holes 10b are provided on the circuit board 13; therefore, the waterproof breathable film 30 is adhered to the surface of the circuit board 13 facing away from the cover case 11 through the adhesive layer 60 and covers the breathable holes 10 b. Of course, in other embodiments, if the ventilation holes 10b are disposed on the cover 11, the waterproof breathable film 30 may be adhered to the surface of the cover 11 opposite to the receiving cavity 10a through the adhesive layer 60 and cover the ventilation holes 10 b.

Understandably, the waterproof breathable film 30 is bonded and fixed by the bonding layer 60, so that the operation is simple and the stability is good; moreover, depending on the thickness of the adhesive layer 60, the waterproof breathable film 30 and the heating module 40 can be spaced apart by a certain distance, so as to meet the requirement of the MEMS microphone on the vibration of the waterproof breathable film 30; meanwhile, since the thickness of the adhesive layer 60 is not too large, it is ensured that the waterproof breathable film 30 is not pulled to a position too far away from the heating module 40, thereby ensuring the supporting function of the heating module 40 in the air holes 10b on the waterproof breathable film 30.

In addition, in one embodiment, the adhesive layer 60 may be a pressure sensitive adhesive.

The present invention also proposes an electronic device comprising the MEMS sensor 100 as described above, and the specific structure of the MEMS sensor 100 refers to the foregoing embodiments. Since the electronic device adopts all the technical solutions of all the embodiments, at least all the beneficial effects brought by all the technical solutions of all the embodiments are achieved, and no further description is given here.

It is understood that the electronic device may be a mobile phone, a notebook computer, a tablet computer, a Personal Digital Assistant (PDA), an e-book reader, an MP3 (motion Picture Experts Group Audio Layer III) player, an MP4 (motion Picture Experts Group Audio Layer IV) player, a wearable device, a navigator, a handheld game console, etc.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A MEMS sensor, comprising:

2. The MEMS sensor of claim 1, wherein the heat generating module is a heat transfer element, the MEMS sensor further comprises an internal heat generating element disposed in the receiving cavity, and the external packaging structure has a first heat conducting track therein, one end of the first heat conducting track is in contact with the internal heat generating element, and the other end of the first heat conducting track is in contact with the heat transfer element.

3. The MEMS sensor of claim 2, wherein the outer package structure comprises a circuit board, the vent opening is in the circuit board, and the first thermally conductive track is in the circuit board.

4. The MEMS sensor as claimed in claim 2, wherein the inner wall of the vent hole is provided with a heat conductive cylinder surrounding the vent hole, the heat transfer member is disposed in the heat conductive cylinder and contacts with the inner wall of the heat conductive cylinder, and an end of the first heat conductive rail away from the internal heating element contacts with the heat conductive cylinder.

5. The MEMS sensor of claim 4, wherein an outer edge of the heat transfer element is circumferentially disposed along the circumference of the heat conductive cylinder and contacts an inner wall of the heat conductive cylinder.

6. The MEMS sensor of claim 2, wherein the heat transfer element is a plate-like structure defining a plurality of spaced-apart through-holes.

7. The MEMS sensor of claim 2, wherein a second heat conducting trace is further disposed in the outer package structure, one end of the second heat conducting trace is in contact with the heat transfer element, and the other end of the second heat conducting trace is exposed at an outer surface of the outer package structure for contacting with an external heat generating component.

8. The MEMS sensor of claim 1, wherein the heat generating module is a self-heating element, and the external packaging structure comprises a circuit board to which the self-heating element is electrically connected.

9. The MEMS sensor according to any one of claims 1 to 8, wherein an adhesive layer is disposed between the waterproof breathable film and the external packaging structure, and the waterproof breathable film is adhered to an outer surface of the external packaging structure through the adhesive layer.

10. An electronic device comprising a MEMS sensor as claimed in any one of claims 1 to 9.