CN112829319B

CN112829319B - Decoration chip assembling method, mobile terminal assembling method and mobile terminal

Info

Publication number: CN112829319B
Application number: CN201911157026.6A
Authority: CN
Inventors: 范连涛; 周金锋
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2019-11-22
Filing date: 2019-11-22
Publication date: 2022-09-20
Anticipated expiration: 2039-11-22
Also published as: CN112829319A

Abstract

The present disclosure relates to an assembly method of a decorative chip, an assembly method of a mobile terminal and a mobile terminal, wherein the decorative chip is used for being assembled on a support of the mobile terminal with a transparent rear cover, the support is positioned in the mobile terminal, and the decorative chip faces the transparent rear cover, and the assembly method comprises the following steps: a material preparation step of manufacturing the plastic sheet into the decorative chip; a feeding step of manufacturing the decorative chip into a coil material and supplying the coil material to a chip mounter, and a feeding step of assembling the decorative chip on a support through the chip mounter. Through above-mentioned technical scheme, paste on the support and establish the decoration chip in order to regard as decorative element and outward appearance piece, both can increase the aesthetic feeling, can not make mobile terminal seem in disorder on the whole again, promoted user's visual experience, and use automatic paster mode, can avoid because of decorating that the chip processing procedure is complicated, artifical subsides are pasted inaccurately and are caused badly, have reduced manufacturing cost.

Description

Decoration chip assembling method, mobile terminal assembling method and mobile terminal

Technical Field

The present disclosure relates to the field of mobile terminal technologies, and in particular, to an assembling method of a decorative chip, an assembling method of a mobile terminal, and a mobile terminal.

Background

With the widespread use of mobile terminals, users have not satisfied with functional innovation, and the requirements for appearance are also increasing. In order to meet the pursuit of users on the appearance of the mobile terminal, the concept of transparent appearance is introduced into the design of some terminals, namely, the shell of the mobile terminal is made of transparent materials, so that internal elements such as a bracket assembled with various chips become appearance pieces. However, since the internal structure of the mobile terminal is relatively complex, if all the explicit internal elements are assembled by using functional devices with real functions, the mobile terminal looks messy as a whole, and the visual experience of the user is affected.

Disclosure of Invention

To overcome the problems in the related art, the present disclosure provides an assembling method of a decorative chip, an assembling method of a mobile terminal, and a mobile terminal.

According to a first aspect of the embodiments of the present disclosure, there is provided an assembling method of a decorative chip for assembling on a cradle of a mobile terminal having a transparent rear cover, the cradle being located inside the mobile terminal and the decorative chip facing the transparent rear cover, the assembling method comprising:

preparing a plastic sheet into the decorative chip;

a material supply step, namely manufacturing the decorative chip into a coil material and supplying the coil material to a chip mounter;

and a feeding step, namely assembling the decorative chip on the support through the chip mounter.

Optionally, the stock preparation step includes:

printing a chip pattern on the surface of the plastic sheet;

sticking a back adhesive on one surface of the plastic sheet;

and cutting the plastic sheet into the decorative chip according to the outline of the chip pattern.

Optionally, the feeding step comprises:

sticking the surface of the decorative chip, which is stuck with the back adhesive, on a first release film;

and winding the first release film into the coil stock.

Optionally, the feeding step further comprises: the opposite side of the decorative chip, which is provided with the back adhesive, is provided with a second release film.

Optionally, the back adhesive is attached to one surface of the plastic sheet on which the chip pattern is printed.

Optionally, the plastic sheet has a thickness of 0.1mm to 0.3 mm.

Optionally, the plastic sheet is cut into the decorative chip according to the outline of the chip pattern by a die cutting method.

According to a second aspect of the embodiments of the present disclosure, there is provided an assembling method of a mobile terminal, the mobile terminal having a transparent rear cover, the mobile terminal being provided with a cradle inside, the assembling method including:

assembling a functional device to the support, an

And assembling the decorative chip on the bracket by using the assembling method of the decorative chip, wherein the decorative chip faces the transparent rear cover.

Optionally, the step of assembling the functional device to the bracket comprises:

soldering a functional device to the bracket;

and placing the bracket soldered with the functional device into a curing furnace for curing.

Optionally, after the step of placing the bracket soldered with the functional device into a curing oven for curing, the decorative chip is assembled to the bracket.

According to a third aspect of the embodiments of the present disclosure, there is provided a mobile terminal assembled by the above-mentioned method for assembling a mobile terminal.

The technical scheme provided by the embodiment of the disclosure has the following beneficial effects: the decorative chip is attached to the support to serve as a decorative element and an appearance piece, so that the aesthetic feeling can be increased, the mobile terminal cannot be messy on the whole, the visual experience of a user is improved, an automatic patch mode is used, the defect caused by complex manufacturing process and inaccurate manual mounting of the decorative chip can be avoided, and the production cost is reduced.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.

FIG. 1 is a schematic diagram illustrating a mobile terminal with a transparent rear cover incorporating a decorative chip in accordance with an exemplary embodiment;

FIG. 2 is a flow diagram illustrating a decorative chip assembly method according to an exemplary embodiment;

FIG. 3 is a flow diagram illustrating stock preparation steps in a decorative chip assembly method in accordance with an exemplary embodiment;

FIG. 4 is another flow diagram illustrating stock preparation steps in a decorative chip assembly method according to an exemplary embodiment;

FIG. 5 is a flow chart illustrating a feeding step in a decorative chip assembly method according to one exemplary embodiment;

FIG. 6 is another flow chart illustrating a feeding step in a decorative chip assembly method according to one exemplary embodiment;

FIG. 7 is another flow chart illustrating a decorative chip assembly method according to an exemplary embodiment;

FIG. 8 is a flow chart illustrating a mobile terminal assembly method according to an exemplary embodiment;

fig. 9 is a flowchart illustrating an assembly of a functional device on a cradle in a mobile terminal assembly method according to an exemplary embodiment;

fig. 10 is another flow chart illustrating a mobile terminal assembly method according to an exemplary embodiment.

Description of the reference numerals

1 Mobile terminal with transparent rear cover

2 support

3 decorative chip

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the disclosure, as detailed in the appended claims.

First, it should be noted that the functional device mentioned in the present disclosure refers to an electronic device with real function, and in contrast, the decorative chip only plays a role of decoration.

In order to meet the pursuit of users on the appearance of the mobile terminal, the concept of transparent appearance is introduced in some terminal designs, that is, the housing of the mobile terminal is made of a transparent material, so that the inside of the mobile terminal, which is used for bearing various electronic devices (such as an antenna bracket, etc.), becomes an appearance part. In order to enable the mobile terminal to be capable of increasing aesthetic feeling and not to be messy on the whole, the technical scheme provided by the disclosure can add decorative elements such as decorative chips and small electronic devices on the support, small and thin functional devices can be directly welded on the support in an SMT (surface mounting technology) mode, thick and high-cost functional devices are not suitable for being assembled on the support, and plastic sheets can be printed to manufacture the decorative chips and then be pasted on the support.

Fig. 1 is a schematic diagram of the decoration chip 3 assembled on the mobile terminal 1 with a transparent rear cover, in which the decoration chip 3 is assembled on the support 2 of the mobile terminal 1 with a transparent rear cover, the support 2 is located inside the mobile terminal 1, and the decoration chip 3 faces the transparent rear cover, so that the decoration chip 3 can be observed through the transparent rear cover, and the aesthetic feeling and the cool effect are increased. In the present disclosure, the holder 2, as a carrier for carrying the decorative chip 3, may be configured in any shape, such as a flat plate shape, according to the internal structure of the mobile terminal. As shown in fig. 2, the assembling method of the decorative chip of the present disclosure may include: a material preparation step S21 of manufacturing plastic sheets into decorative chips, a material supply step S22 of manufacturing the decorative chips into rolls and supplying the rolls to a chip mounter, and a material loading step S23 of assembling the decorative chips on a support through the chip mounter. According to the chip mounter in the feeding step S23, the chip mounter in the related technology can be directly used, and the fully-automatic production of the chip mounter is higher in working efficiency and more accurate in mounting compared with a manual mounting mode.

Through the technical scheme, the decoration chip 3 is pasted on the support 2 as a decoration element and an appearance piece, so that the aesthetic feeling can be increased, the mobile terminal 1 cannot be messy on the whole, the visual experience of a user is improved, an automatic pasting mode is used, the defect caused by the complicated manufacture procedure and the inaccurate manual pasting of the decoration chip 3 can be avoided, and the production cost is reduced.

According to an embodiment of the present disclosure, as illustrated in fig. 3, the material preparing step S21 may include: step S211, printing a chip pattern on the surface of the plastic sheet; step S212, sticking a back adhesive on one surface of the plastic sheet; and step S213, cutting the plastic sheet into decorative chips S213 according to the outline of the chip pattern. In the present disclosure, features such as colors and fonts can be printed on the plastic sheet according to actual needs, and for example, patterns of components such as a CPU and a sensor can be printed. After the plastic sheet is cut into the decorative chip, the decorative chip can be further polished to form a finish-machined decorative chip.

In step S211, in order to improve the working efficiency and save the cost, a plurality of chip patterns can be printed on a whole plastic sheet, and these patterns can be the same to adapt to continuous production, or all the chip patterns required by one terminal can be printed at one time. In step S212, the back adhesive may be, for example, a double-sided adhesive tape, so that the decorative chip can be assembled to the bracket.

In the embodiment shown in fig. 3, step S212 may be performed before step S213. The plastic sheet with the back adhesive is cut according to the outline of the chip pattern, so that the step that the back adhesive is cut into small pieces and then attached to the decorative chip can be omitted, and the working efficiency is improved. It should be understood that the present disclosure does not limit the sequence of the steps of attaching the back adhesive and cutting the plastic sheet into the decorative chips, as shown in fig. 4, the step S212 may be placed after the step S213, so as to achieve the step S21 of preparing the material in the present disclosure, and have no influence on the quality of the decorative chips.

According to an embodiment of the present disclosure, as shown in fig. 5, the feeding step S22 may include: step S221, sticking the surface of the decorative chip, which is stuck with the gum, on a first release film; and step S223, winding the first release film into a roll material. Here, the release film refers to a film having a differentiated surface energy, and a specific material of the release film (e.g., a back adhesive contacting the first release film in the present disclosure and a plastic sheet contacting the second release film described below) has no tackiness, or a slight tackiness, after being exposed to a limited condition.

In step S221, in order to prevent the decorative chip from adhering to the surface of the adhesive tape after being wound, in this disclosure, the surface of the decorative chip adhered to the adhesive tape may be adhered to the first release film. Because the position of each decorative chip is required when the chip mounting equipment carries out chip mounting production, the positions of the decorative chips attached to the first release film can be distributed according to the actual production condition. In step S223, since the sheet mounting device needs to receive the coil material, the decorative chip is manufactured into a coil material, and since the decorative chip is attached to the first release film, after the first release film is wound into the coil material, the decorative chip can be supplied to the sheet mounting machine through a supply device (e.g., a work roll), and the work roll can be driven by a motor, so as to realize the automatic supply of the coil material.

Further, as shown in fig. 6, the feeding step S22 may further include a step S222 of attaching a second release film S222 on the side of the decorative chip opposite to the side to which the back adhesive is attached before the decorative chip is wound into a roll, so as to increase the protection of the front side of the decorative chip. Here, the centrifugal force between the first release film and the decorative chip and the centrifugal force between the second release film and the decorative chip can be controlled by the amount of the silicone oil coated, and it is ensured that the first release film and the second release film can be smoothly uncovered without affecting other parts.

In the present disclosure, the back adhesive may be attached to a surface of the plastic sheet on which the chip pattern is printed. Because the gum pastes the one side that has the chip pattern of printing of locating the plastic sheet, and the one side that has the chip pattern of printing promptly pastes towards the support and establishes, can observe the decoration chip for guaranteeing to see through mobile terminal's transparent shell, and the plastic sheet needs adopt transparent material. When the surface of the plastic sheet printed with the chip pattern is attached to the support, the chip pattern cannot be damaged due to contact with the chip pattern when the operation inside the mobile terminal is carried out. It should be understood that the adhesive may also be attached to the opposite side of the plastic sheet printed with the chip pattern, so that the plastic sheet may be transparent or opaque, and the decorative chip may also be observed through the transparent housing of the mobile terminal.

Because the coil stock has certain requirement to the thickness of decorating the chip, for will decorate the chip and make into the coil stock, need to carry out the attenuate to the thickness of the plastic sheet of the chip is decorated in the preparation, in this disclosure, the thickness of plastic sheet can be 0.1mm-0.3mm, and in this thickness scope, can adopt digit control machine tool CNC or radium carving's mode to cut into the plastic sheet according to the profile of chip pattern and decorate the chip. Further, the thickness of the plastic sheet may be, for example, 0.188mm, and the plastic sheet with the thickness may be cut into the decorative chips according to the outline of the chip pattern by using a die cutting method. Compared with a CNC or laser carving cutting mode, the die cutting mode is lower in cost and higher in efficiency.

A fully practical method for assembling a decorative chip to a support according to the present disclosure is described below with reference to fig. 7, which may include the following steps in sequence: step S211, printing a chip pattern on the surface of the plastic sheet; step S212, sticking a back adhesive on one surface of the plastic sheet; step S213, cutting the plastic sheet into decorative chips according to the outline of the chip pattern; step S221, sticking the surface, which is stuck with the back adhesive, of the cut decorative chip on a first release film; step S222, a second release film is pasted on the opposite side of the decorative chip, which is pasted with the back adhesive; in step S223, the first release film is wound into a roll S223, the roll is capable of being fed to a mounter, and the decoration chip is mounted on a support using the mounter S22. The above process is only one of various embodiments for completely implementing the assembling method of the decorative chip of the present disclosure, and other embodiments can be adjusted according to actual needs and the foregoing content of the present disclosure.

According to a second aspect of the embodiments of the present disclosure, there is provided an assembling method of a mobile terminal, as shown in fig. 1, the mobile terminal 1 has a transparent rear cover, and a cradle 2 is provided inside the mobile terminal 1, and referring to fig. 8, the assembling method of the mobile terminal may include: step S1, assembling the functional device on the bracket, and step S2, assembling the decorative chip on the bracket by using the above-mentioned assembling method of the decorative chip, the decorative chip facing the transparent back cover. The mobile terminal assembled by the method has the function device and the decorative chip, so that the realization of the function is not influenced while the aesthetic feeling is achieved.

According to an embodiment of the present disclosure, as shown in fig. 9, the step of assembling the functional device to the bracket may include: step S11, soldering the functional device on the bracket S11; and step S12, placing the bracket with the soldered functional device into a curing furnace for curing. The curing step may melt the solder paste so that the surface mount component is securely soldered to the carrier. The step of assembling the functional device on the bracket can be carried out in the existing SMT (surface mount technology) equipment process, so that the existing equipment can be fully utilized, the improvement of the existing SMT equipment process is reduced to the greatest extent, and the cost is saved.

Because the decoration chip that this disclosure provided adopts the surface printing pattern of using the plastic sheet to make, therefore decorate the chip and do not resist high temperature. In order to ensure that the decorative chip can be smoothly assembled on the support and no thermal deformation occurs after assembly, in the present disclosure, as shown in fig. 10, after a step of placing the support to which the functional device is soldered in a curing furnace for curing, the decorative chip is assembled on the support. Therefore, as the assembly of the functional device is already subjected to the curing process, the temperature on the surface of the bracket is reduced, and the decorative chip can be prevented from generating thermal deformation when being assembled. It should be understood that the step of soldering the functional device to the support may be performed simultaneously with the step of preparing the decorative chip from the plastic sheet, so that the time for assembling the mobile terminal may be saved, and the support to which the functional device is assembled may be cooled to a suitable temperature for directly assembling the decorative chip. The assembling method of the decorative chip may adopt the steps shown in fig. 7, or may be adjusted according to actual needs and the foregoing content of the present disclosure.

According to a third aspect of embodiments of the present disclosure, there is provided a mobile terminal assembled by the above-described method of assembling a mobile terminal. The mobile terminal referred to in the present disclosure includes, but is not limited to, a mobile phone, a notebook computer, a tablet computer, and the like.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice in the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. An assembling method of a decorative chip, wherein the decorative chip is used for being assembled on a support of a mobile terminal with a transparent back cover, the support is positioned inside the mobile terminal, and the decorative chip faces the transparent back cover, the assembling method comprises the following steps:

a material preparation step, namely manufacturing a transparent plastic sheet into the decorative chip; the material preparation steps comprise:

printing a chip pattern on the surface of the plastic sheet;

sticking a back adhesive on one surface of the plastic sheet printed with the chip pattern, wherein the back adhesive is used for sticking the plastic sheet on the support;

cutting the plastic sheet into the decorative chips according to the outline of the chip pattern;

2. The method of assembling a decorative chip of claim 1, wherein said feeding step comprises:

and winding the first release film into the coil stock.

3. The method of assembling a decorative chip of claim 2, wherein said feeding step further comprises:

the opposite side of the decorative chip, which is provided with the back adhesive, is provided with a second release film.

4. The method of claim 1, wherein the plastic sheet has a thickness of 0.1mm to 0.3 mm.

5. The method of claim 4, wherein the plastic sheet is cut into the decorative chips according to the outline of the chip pattern by die cutting.

6. An assembling method of a mobile terminal, wherein the mobile terminal is provided with a transparent rear cover, a support is arranged in the mobile terminal, and the assembling method comprises the following steps:

assembling a functional device to the holder, and

assembling a decorative chip onto the support using the method according to any one of claims 1-5, the decorative chip facing the transparent back cover.

7. The method for assembling a mobile terminal according to claim 6, wherein said step of assembling a functional device on said cradle comprises:

soldering a functional device to the bracket;

8. The method for assembling a mobile terminal according to claim 7, wherein the decorative chip is assembled to the cradle after the step of placing the cradle having the functional device soldered thereto in a curing oven for curing.

9. A mobile terminal characterized in that it is a mobile terminal assembled with the method of assembling a mobile terminal according to any of claims 6-8.