CN112822868A - SMT (surface mount technology) chip mounting method for reducing reliability failure of lithium battery control board - Google Patents
SMT (surface mount technology) chip mounting method for reducing reliability failure of lithium battery control board Download PDFInfo
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- CN112822868A CN112822868A CN202110063099.XA CN202110063099A CN112822868A CN 112822868 A CN112822868 A CN 112822868A CN 202110063099 A CN202110063099 A CN 202110063099A CN 112822868 A CN112822868 A CN 112822868A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1194—Thermal treatment leading to a different chemical state of a material, e.g. annealing for stress-relief, aging
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Abstract
The invention provides an SMT chip method for reducing reliability failure of a lithium battery control board, which comprises the following steps: A1. printing solder paste: printing solder paste on a preset printing position on the PCB through a steel mesh screen; A2. and (3) detecting the printing quality of the solder paste: detecting the printing quality of the solder paste by using an image analysis method; A3. mounting a device: mounting the component on a preset mounting position on the PCB by using a chip mounter; A4. and (3) reflow soldering: performing reflow soldering by using a reflow soldering furnace, wherein the air speed of an exhaust pipeline of the reflow soldering furnace is not less than 10 m/s; A5. and (3) detection after welding: carrying out optical image contrast detection on the assembled control panel; A6. baking and deionizing: baking the control board in an oven according to preset conditions to reduce organic weak acid radical ions among pins; the method can effectively reduce the content of organic weak acid radical ions among the pins of the device on the control board, thereby being beneficial to reducing the failure risk of the lithium battery control board in a 'double 85' reliability test.
Description
Technical Field
The invention relates to the technical field of lithium battery production, in particular to an SMT chip mounting method for reducing reliability failure of a lithium battery control board.
Background
The lithium battery control module generally needs to perform a "double 85" reliability test: the reliability cycle test was carried out for 168 hours in the energized state at a temperature of 85 ℃ and a humidity of 85% RH, and the test was only passed if the test specimen had good electrical properties after the test.
The control board in the lithium battery control module is generally assembled by using an SMT (Surface Mount Technology) process, and mainly includes the steps of solder paste printing, solder paste detection, device mounting, reflow soldering, post-soldering detection, and the like. Part of materials used by a control panel in the lithium battery control module in the manufacturing process contain organic and inorganic ions, and the ions remain among pins of a device after a reflow soldering process, particularly a large amount of organic weak acid radical ions remain among pins of a bottom packaging device. Under the conditions of power-on and high temperature and high humidity of a 'double 85' reliability test, electrochemical migration phenomenon occurs between adjacent pins of a device with voltage difference, and conductive dendrite is generated between the adjacent pins, so that electrical property failure is caused.
Disclosure of Invention
In order to solve the technical problems in the prior art, the invention aims to provide the SMT paster method for reducing the reliability failure of the lithium battery control board, which can effectively reduce the content of organic weak acid radical ions between pins of devices on the control board, thereby being beneficial to reducing the failure risk of the lithium battery control board in a 'double 85' reliability test.
In order to achieve the purpose, the invention adopts the following technical scheme:
an SMT chip mounting method for reducing reliability failure of a lithium battery control board comprises the following steps:
A1. printing solder paste: printing solder paste on a preset printing position on the PCB through a steel mesh screen;
A2. and (3) detecting the printing quality of the solder paste: detecting the printing quality of the solder paste by using an image analysis method;
A3. mounting a device: mounting the component on a preset mounting position on the PCB by using a chip mounter;
A4. and (3) reflow soldering: performing reflow soldering by using a reflow soldering furnace, wherein the air speed of an exhaust pipeline of the reflow soldering furnace is not less than 10 m/s;
A5. and (3) detection after welding: carrying out optical image contrast detection on the assembled control panel;
A6. baking and deionizing: and baking the control board in an oven according to preset conditions to reduce organic weak acid radical ions among the pins.
In the SMT sheet mounting method for reducing the reliability failure of the lithium battery control board, in step a6, the preset conditions are as follows: the baking temperature is 118-122 ℃, the baking time is 3h, and the air speed of an exhaust pipeline of the oven is not less than 10 m/s.
Further, step a6 includes:
raising the temperature in the oven to the baking temperature at a temperature rise rate of not more than 10 ℃/s;
preserving heat according to the baking time;
cooling at a temperature reduction rate of not more than 10 ℃/s.
In the SMT patch method for reducing the reliability failure of the lithium battery control board, step a2 includes the steps executed in the image analysis device:
acquiring standard points of solder paste printing points in the standard image;
acquiring a PCB image to be detected;
acquiring the actual number of solder paste printing points in the PCB image to be detected;
judging whether the actual points are the same as the standard points or not;
if the two signals are the same, determining that no missing printing or multiple printing exists, and if the two signals are not the same, determining that the missing printing or multiple printing exists and sending a first alarm signal.
Further, if there is no missing print or multiple prints, step a2 further includes:
acquiring a first proportional distance between each solder paste printing point in the standard image and two reference points; the first proportional distance is a ratio obtained by dividing the distance between a solder paste printing point and a reference point in a standard image by the distance between the two reference points;
acquiring a second proportional distance between each solder paste printing point and two reference points in the PCB image to be detected; the second proportional distance is a ratio obtained by dividing the distance between the solder paste printing point in the PCB image to be detected and the reference point by the distance between the two reference points;
calculating the absolute value of the difference between the two second proportional distances of each solder paste printing point and the two corresponding first proportional distances;
judging whether at least one of the absolute difference values is larger than a preset tolerance threshold value;
if not, judging that the printing position of the solder paste is qualified; otherwise, the printing position of the solder paste is judged to be unqualified, and a second alarm signal is sent out.
In the SMT patch method for reducing the reliability failure of the lithium battery control board, the step A4 includes:
carrying out step-type temperature rise at a preset step temperature until the temperature rises to the welding temperature;
keeping the welding thermometer according to the preset welding time, and controlling the air pressure of the reflow oven to circularly lift in the process;
cooling at a cooling rate of not more than 10 ℃/s.
Further, the step temperature is 20% of the welding temperature, and the temperature rise speed of the temperature rise section between the step temperatures is not more than 15 ℃/s.
Further, when the air pressure of the reflow oven is controlled to circularly lift, the lowest pressure is 1kPa-1.5kPa, the highest pressure is 3kPa-3.5kPa, and the cycle of the circular lifting is 10s-15 s.
Further, before the step of raising the temperature in a stepwise manner to the welding temperature by a preset step temperature, the method further includes: reducing the air pressure of the reflow oven;
before the step of keeping the welding thermometer according to the preset welding time and controlling the air pressure of the reflow oven to circularly lift in the process, the method further comprises the following steps: when the temperature rises to a preset percentage of the soldering temperature, the gas pressure in the reflow oven is restored.
Further, step a4 was performed in a nitrogen atmosphere.
Has the advantages that:
according to the SMT chip method for reducing the reliability failure of the lithium battery control board, provided by the invention, after the procedures of solder paste printing, solder paste printing quality detection, device mounting, reflow soldering and detection after soldering are completed, the control board is baked in an oven according to preset conditions, so that the content of organic weak acid radical ions among pins of devices on the control board can be effectively reduced, and the risk of failure of the lithium battery control board in a 'double 85' reliability test is favorably reduced.
Drawings
Fig. 1 is a flowchart of an SMT sheet mounting method for reducing reliability failure of a lithium battery control board according to the present invention.
Fig. 2 is a temperature change curve diagram in the reflow soldering process in the SMT sheet mounting method for reducing the reliability failure of the lithium battery control board provided by the present invention.
Fig. 3 is a pressure change curve diagram in the reflow soldering process in the SMT sheet mounting method for reducing the reliability failure of the lithium battery control board according to the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features.
Referring to fig. 1, the SMT sheet mounting method for reducing the reliability failure of the lithium battery control board provided by the invention comprises the following steps:
A1. printing solder paste: printing solder paste on a preset printing position on the PCB through a steel mesh screen;
A2. and (3) detecting the printing quality of the solder paste: detecting the printing quality of the solder paste by using an image analysis method;
A3. mounting a device: mounting the component on a preset mounting position on the PCB by using a chip mounter;
A4. and (3) reflow soldering: performing reflow soldering by using a reflow soldering furnace, wherein the air speed of an exhaust pipeline of the reflow soldering furnace is not less than 10 m/s;
A5. and (3) detection after welding: carrying out optical image contrast detection on the assembled control panel;
A6. baking and deionizing: and baking the control board in an oven according to preset conditions to reduce organic weak acid radical ions among the pins.
According to the method, after the procedures of solder paste printing, solder paste printing quality detection, device mounting, reflow soldering and detection after soldering are completed, the control board is baked in the oven according to the preset conditions, so that the content of organic weak acid radical ions between the pins of the device on the control board can be effectively reduced, and the risk of failure of the lithium battery control board in a 'double 85' reliability test is favorably reduced.
The steps a1, A3, and a5 are all prior art, and the detailed implementation process thereof is not described in detail here.
In some preferred embodiments, in step a6, the preset conditions are: the baking temperature is 118-122 ℃, the baking time is 3h, and the air speed of an exhaust pipeline of the oven is not less than 10 m/s. The control board is baked for 3 hours at the temperature of 118-122 ℃ in the oven, the air speed of an exhaust pipeline of the oven is not less than 10m/s in the baking process, actually, the flow speed of the exhaust pipeline of the oven is not less than 10m/s, the baked residual ion gas can be timely exhausted out of the oven to avoid falling back on the control board again, a large number of DOE tests verify that the residual data of the organic acid radical ions in unit area before and after baking are obtained by using a chromatographic extraction method for the local area of the control board, and it can be known that the effect of removing the organic acid radical ions is better by adopting the condition for baking (the residual data of the organic acid radical ions in unit area after baking is as low as 80% of that before baking).
In practical applications, if the temperature is raised or lowered too fast during baking, the solder is likely to fall off, and therefore the temperature raising rate or the temperature lowering rate needs to be limited within a certain range, so that, in some embodiments, step a6 includes:
raising the temperature in the oven to the baking temperature at a temperature rise rate of not more than 10 ℃/s;
keeping the temperature according to the baking time (namely 3 h);
cooling at a temperature reduction rate of not more than 10 ℃/s.
When the temperature rising speed and the temperature reducing speed are not more than 10 ℃/s, the soldering tin can be reliably ensured not to fall off due to too fast temperature change, and preferably, the temperature rising speed and the temperature reducing speed are both 6 ℃/s.
The specific method for detecting the printing quality of the solder paste by using the image analysis method in the step a2 can adopt an analysis method in the prior art, and can also adopt the following method: step a2 includes steps performed in the image analysis apparatus:
A201. acquiring standard points of solder paste printing points in the standard image;
A202. acquiring a PCB image to be detected;
A203. acquiring actual points of solder paste printing points in a PCB image to be detected;
A204. judging whether the actual points are the same as the standard points or not;
A205. if the two signals are the same, determining that no missing printing or multiple printing exists, and if the two signals are not the same, determining that the missing printing or multiple printing exists and sending a first alarm signal.
The solder paste printing points refer to the center of gravity points of each solder paste printing area, and the center of gravity points of each solder paste printing area can be extracted from an image (a standard image or a PCB image to be detected) by adopting the prior art, or extracted from the image by the following method:
converting the image into a black and white picture;
setting the gray scale of the pixel point with the gray scale smaller than the preset gray scale threshold value in the black-and-white picture as 0, and setting the gray scale of the pixel point with the gray scale larger than the preset gray scale threshold value in the black-and-white picture as 255;
extracting a region with the gray value of 255 as a solder paste printing region;
the gravity center point coordinates of each solder paste printing area are calculated by the following formula:
Xi=（Xi1+Xi2+…+Xij+…+Xini）/ni
Yi=（Yi1+Yi2+…+Yij+…+Yini）/ni
wherein Xi is an abscissa value of a gravity center point of the ith solder paste printing area, Yi is an ordinate value of the gravity center point of the ith solder paste printing area, Xij is an abscissa value of a jth pixel point of the ith solder paste printing area, Yi is an ordinate value of a jth pixel point of the ith solder paste printing area, and ni is the total number of the pixel points of the ith solder paste printing area.
The positions and the quantity of the solder paste printing points of the standard image and the PCB image to be detected can be obtained by adopting the above modes respectively. When the positions and the number of the solder paste printing points of the PCB image to be detected are obtained in the above manner, the PCB image to be detected is further selected to be cut first, so as to cut off the background part, namely before the step A203, the method further comprises the following steps: and cutting the PCB image to be detected to cut off the background part.
The standard image is an image of the PCB printed with the solder paste, the standard image is stored in the image analysis equipment in advance, and the image of the PCB to be detected can be collected in real time through the camera and sent to the image analysis equipment.
The missing printing and the multiple printing both indicate that the printing quality is unqualified, if the actual number of points is less than the standard number of points, the missing printing is indicated, and if the actual number of points is more than the standard number of points, the multiple printing is indicated.
Further, if there is no missing print or multiple prints, step a2 further includes:
A206. acquiring a first proportional distance between each solder paste printing point in the standard image and two reference points; the first proportional distance is a ratio obtained by dividing the distance between a solder paste printing point and a reference point in a standard image by the distance between the two reference points;
A207. acquiring a second proportional distance between each solder paste printing point and two reference points in the PCB image to be detected; the second proportional distance is a ratio obtained by dividing the distance between a solder paste printing point and a reference point in the PCB image to be detected by the distance between the two reference points;
A208. calculating the absolute value of the difference between the two second proportional distances of each solder paste printing point and the two corresponding first proportional distances;
A209. judging whether at least one of the absolute difference values is larger than a preset tolerance threshold value;
A210. if not, judging that the printing position of the solder paste is qualified; otherwise, the printing position of the solder paste is judged to be unqualified, and a second alarm signal is sent out.
The two reference points can be selected according to actual needs, and the reference points in the standard image are the same as the reference points in the to-be-detected PCB image, for example, if the two reference points in the standard image are the lower left corner point and the upper right corner point of the PCB respectively, the reference points in the to-be-detected PCB image are the lower left corner point and the upper right corner point of the PCB.
Compared with the mode of directly comparing with the actual distance value, the method has the advantages that the scaling processing of the PCB image to be detected is not needed, the method is simpler, the position of each pixel point in the image cannot be changed, and the calculation is more accurate. And for the same solder paste printing point, if one of the absolute values of the difference between the same solder paste printing point and the two reference points exceeds the standard, the printing position of the solder paste printing point is unqualified, and if the printing position of one solder paste printing point is unqualified, an alarm is given, so that the accuracy of the judgment result is higher compared with the mode of only setting one reference point. Thus, step a2 may also include: according to the absolute value of the difference value of each solder paste printing point, giving out the position information of the solder paste printing point with unqualified printing position; the solder paste printing points with unqualified printing positions refer to solder paste printing points with at least one of two difference absolute values larger than a preset tolerance threshold.
In fact, in the reflow soldering process of the step a4, because the temperature is high, part of the organic weak acid radical ions can leave the control board in the form of ion gas, and when the flow rate of the exhaust duct of the reflow oven is not less than 10m/s, the ion gas can be discharged in time, and the ion gas is prevented from falling back on the control board again.
The specific method for performing reflow soldering in the reflow soldering furnace in step a4 may be a method in the prior art, or the following method may be used: referring to fig. 2, step a4 includes:
A401. carrying out step-type temperature rise at a preset step temperature until the temperature rises to the welding temperature;
A402. keeping the welding thermometer according to the preset welding time, and controlling the air pressure of the reflow oven to circularly lift in the process;
A403. cooling at a cooling rate of not more than 10 ℃/s.
Step a401 corresponds to the temperature rise process in fig. 2, and includes a plurality of temperature rise sections and a plurality of heat preservation sections, and the solvent in the solder paste can be sufficiently volatilized through the temperature rise process; wherein, the temperature difference between the adjacent heat preservation sections is the step temperature dT, the specific value of the step temperature dT can be set according to actual needs, and can be set as a specific temperature difference value or a percentage of the welding temperature T (for example, the step temperature dT is 20% of the welding temperature T); wherein the welding temperature T is generally 200-230 ℃; in order to avoid the dropping of the solder paste printing point due to the excessively fast temperature rise, the temperature rise speed of the temperature rise section between the temperature of each step is not more than 15 ℃/s (generally, if the whole temperature rise process is continuous, the temperature rise speed should not be more than 10 ℃/s, but because the step-type temperature rise is adopted, the duration of each temperature rise section is shorter, and therefore, the temperature rise speed of the temperature rise section can be increased).
The pressure change curve in the reflow furnace is as shown by a solid line in fig. 3 (a dotted line in fig. 3 corresponds to the temperature change curve in fig. 2), in the heat preservation process, the pressure is gradually reduced to a first preset pressure (generally 1kPa-1.5 kPa), then the circulating lifting is started, the pressure is reduced to be beneficial to separating out bubbles from molten tin paste, the bubbles can be effectively ensured to be stably separated out in a small bubble mode through the circulating lifting, and the phenomenon that molten tin splashes due to the fact that the process of separating out bubbles is too violent is avoided. In a preferred embodiment, when the pressure of the reflow furnace is controlled to cyclically increase and decrease (i.e., during the cyclic pressure increase and decrease), the minimum pressure is 1kPa to 1.5kPa, the maximum pressure is 3kPa to 3.5kPa, and the cycle of the cyclic pressure increase and decrease is 10s to 15s, the bubble precipitation effect and the spatter prevention effect are preferable. In fig. 3, the process pressure curve of the cyclic buck-boost is a sinusoidal curve, but is not limited thereto.
Further, in some embodiments, step a401, performing a stepwise temperature increase at a preset step temperature until the welding temperature is raised, further includes: A404. reducing the air pressure of the reflow oven;
and step A402, before the soldering thermometer is kept according to the preset soldering time and the air pressure of the reflow oven is controlled to circularly lift in the process, the method further comprises the following steps: A405. when the temperature rises to a predetermined percentage of the soldering temperature, the reflow oven is allowed to return to atmospheric pressure (as shown in fig. 3, the atmospheric pressure returns to the original atmospheric pressure P0, P0 is typically one atmosphere).
The process is shown in the first half of the pressure profile of fig. 3, and the solvent in the solder paste is preferably fully evaporated by reducing the pressure, wherein the pressure is reduced to a second predetermined pressure P1 in step a404, and the second predetermined pressure P1 is typically 40kPa to 50 kPa.
In order to prevent the tin from being oxidized during the reflow soldering, it is preferable that step a4 is performed in a nitrogen atmosphere, i.e., a reflow furnace is filled with nitrogen gas during the reflow soldering.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, which are substantially the same as the present invention.
Claims (10)
1. An SMT chip method for reducing reliability failure of a lithium battery control board is characterized by comprising the following steps:
A1. printing solder paste: printing solder paste on a preset printing position on the PCB through a steel mesh screen;
A2. and (3) detecting the printing quality of the solder paste: detecting the printing quality of the solder paste by using an image analysis method;
A3. mounting a device: mounting the component on a preset mounting position on the PCB by using a chip mounter;
A4. and (3) reflow soldering: performing reflow soldering by using a reflow soldering furnace, wherein the air speed of an exhaust pipeline of the reflow soldering furnace is not less than 10 m/s;
A5. and (3) detection after welding: carrying out optical image contrast detection on the assembled control panel;
A6. baking and deionizing: and baking the control board in an oven according to preset conditions to reduce organic weak acid radical ions among the pins.
2. An SMT patch method for reducing reliability failure of a lithium battery control board according to claim 1, wherein in step A6, the preset conditions are: the baking temperature is 118-122 ℃, the baking time is 3h, and the air speed of an exhaust pipeline of the oven is not less than 10 m/s.
3. An SMT patch method for reducing reliability failures of control boards of lithium batteries according to claim 2, wherein step A6 includes:
raising the temperature in the oven to the baking temperature at a temperature rise rate of not more than 10 ℃/s;
preserving heat according to the baking time;
cooling at a temperature reduction rate of not more than 10 ℃/s.
4. An SMT patch method for reducing reliability failures of a lithium battery control board according to claim 1, wherein step A2 includes steps performed in an image analysis device:
acquiring standard points of solder paste printing points in the standard image;
acquiring a PCB image to be detected;
acquiring the actual number of solder paste printing points in the PCB image to be detected;
judging whether the actual points are the same as the standard points or not;
if the two signals are the same, determining that no missing printing or multiple printing exists, and if the two signals are not the same, determining that the missing printing or multiple printing exists and sending a first alarm signal.
5. An SMT patch method for reducing reliability failures of a lithium battery control board according to claim 4, wherein if there are no missing prints or multiple prints, step A2 further comprises:
acquiring a first proportional distance between each solder paste printing point in the standard image and two reference points; the first proportional distance is a ratio obtained by dividing the distance between a solder paste printing point and a reference point in a standard image by the distance between the two reference points;
acquiring a second proportional distance between each solder paste printing point and two reference points in the PCB image to be detected; the second proportional distance is a ratio obtained by dividing the distance between the solder paste printing point in the PCB image to be detected and the reference point by the distance between the two reference points;
calculating the absolute value of the difference between the two second proportional distances of each solder paste printing point and the two corresponding first proportional distances;
judging whether at least one of the absolute difference values is larger than a preset tolerance threshold value;
if not, judging that the printing position of the solder paste is qualified; otherwise, the printing position of the solder paste is judged to be unqualified, and a second alarm signal is sent out.
6. An SMT patch method for reducing reliability failures of control boards of lithium batteries according to claim 1, wherein step A4 includes:
carrying out step-type temperature rise at a preset step temperature until the temperature rises to the welding temperature;
keeping the welding thermometer according to the preset welding time, and controlling the air pressure of the reflow oven to circularly lift in the process;
cooling at a cooling rate of not more than 10 ℃/s.
7. An SMT patch method for reducing reliability failure of a lithium battery control board according to claim 6, wherein the step temperatures are 20% of the welding temperatures, and a temperature rise rate of a temperature rise section between the step temperatures is no greater than 15 ℃/s.
8. An SMT patch method for reducing reliability failure of a lithium battery control board according to claim 6, wherein when the air pressure of the reflow oven is controlled to cyclically rise and fall, the lowest pressure is 1kPa-1.5kPa, the highest pressure is 3kPa-3.5kPa, and the cycle of the cyclic rising and falling is 10s-15 s.
9. An SMT patch method for reducing reliability failure of a lithium battery control board according to claim 6, wherein the step of increasing the temperature in a stepwise manner at a predetermined step temperature until the welding temperature is reached further comprises: reducing the air pressure of the reflow oven;
before the step of keeping the welding thermometer according to the preset welding time and controlling the air pressure of the reflow oven to circularly lift in the process, the method further comprises the following steps: when the temperature rises to a preset percentage of the soldering temperature, the gas pressure in the reflow oven is restored.
10. An SMT patch method for reducing reliability failures of a lithium battery control board according to claim 6, wherein step A4 is performed in a nitrogen environment.
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| CN115484753A (en) * | 2022-11-04 | 2022-12-16 | 四川易景智能终端有限公司 | Electronic component detection method used in SMT (surface mount technology) chip mounting process |
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| CN115484753A (en) * | 2022-11-04 | 2022-12-16 | 四川易景智能终端有限公司 | Electronic component detection method used in SMT (surface mount technology) chip mounting process |
| CN115484753B (en) * | 2022-11-04 | 2023-03-10 | 四川易景智能终端有限公司 | Electronic component detection method used in SMT (surface mount technology) chip mounting process |
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Application publication date: 20210518 Assignee: Shenzhen tianbangda New Energy Technology Co.,Ltd. Assignor: SHENZHEN TIANBANGDA TECHNOLOGY Co.,Ltd. Contract record no.: X2023980037765 Denomination of invention: A SMT SMT mounting method for reducing reliability failure of lithium battery control boards Granted publication date: 20210921 License type: Common License Record date: 20230707 |