CN112822866B - Solder paste for surface mounting, driving circuit board and surface mounting method - Google Patents
Solder paste for surface mounting, driving circuit board and surface mounting method Download PDFInfo
- Publication number
- CN112822866B CN112822866B CN202110017412.6A CN202110017412A CN112822866B CN 112822866 B CN112822866 B CN 112822866B CN 202110017412 A CN202110017412 A CN 202110017412A CN 112822866 B CN112822866 B CN 112822866B
- Authority
- CN
- China
- Prior art keywords
- solder paste
- circuit board
- surface mounting
- composition
- adhesive polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The application provides a solder paste for surface mounting, a driving circuit board and a surface mounting method. The solder paste for surface mounting comprises a first composition and a second composition, wherein the first composition is dispersed in the second composition; wherein the first composition at least comprises first metal particles containing tin element, and the second composition at least comprises adhesive polymer with photosensitivity or monomer of adhesive polymer. This application uses the tin cream that the first composition that will have the tin element disperses in the second composition that has the photosensitivity, through exposure, development messenger's tin cream forms the tin cream layer on waiting to paste the terminal of binding of dress circuit board, has avoided the use of steel mesh in surface mounting, has avoided waiting to paste dress circuit board because the short circuit that the steel mesh caused or open circuit, has improved the tin cream layer and has bound the counterpoint precision of terminal, has promoted the product yield of waiting to paste dress circuit board.
Description
Technical Field
The application relates to the field of display, in particular to a solder paste for surface mounting, a driving circuit board and a surface mounting method.
Background
With the rapid development of display products, people have increasingly large demand on the display products and increasingly high quality requirements on the display products, and how to improve the yield of the display products is an important development direction in the display field.
The Surface Mount Technology is a common Technology in the manufacturing process of display products, such as the mounting of light emitting diodes in the manufacturing process of a backlight module, and the conventional Technology for Surface Mount Technology (SMT) requires a steel mesh for Surface mounting of solder paste materials, and due to the direct contact between the steel mesh and a circuit board to be mounted, the short circuit or open circuit of the circuit board to be mounted in the solder paste printing process is easily caused, and the product yield is affected.
Therefore, a new solder paste, a driving circuit board and a surface mounting method for surface mounting are needed to solve the above technical problems.
Disclosure of Invention
The application provides a tin cream, a drive circuit board and a surface mounting method for surface mounting for solving the problem that the current tin cream for surface mounting uses the steel mesh to carry out mounting, because the steel mesh easily leads to waiting to mount the circuit board and takes place the short circuit or open circuit when carrying out surface mounting with the direct contact who waits to mount the circuit board, influences the product yield.
In order to solve the technical problem, the technical scheme provided by the application is as follows:
the application provides a solder paste for surface mounting, which comprises a first composition and a second composition, wherein the first composition is dispersed in the second composition;
wherein the first composition comprises at least first metal particles containing tin element, and the second composition comprises at least adhesive polymer with photosensitivity or monomer of the adhesive polymer.
In the solder paste for surface mounting provided by the application, the first metal particles account for 40-60% of the mass of the solder paste.
In the solder paste for surface mounting provided by the application, the viscous polymer or the monomer of the viscous polymer accounts for 8-60% of the mass of the solder paste.
In the solder paste for surface mounting provided by the application, the second composition further comprises a photosensitizer, and the mass ratio of the photosensitizer to the viscous polymer or the monomers of the viscous polymer is less than or equal to 1: 1.
In the solder paste for surface mounting provided by the application, the second composition further comprises a dispersant, and the mass ratio of the dispersant to the viscous polymer or the monomer of the viscous polymer is less than or equal to 1: 1.
The application also provides a driving circuit board, which comprises a binding terminal, a light source and a tin paste layer positioned between the binding terminal and the light source;
the solder paste layer is formed by performing a first predetermined process on the solder paste for surface mounting according to any one of claims 1 to 5.
The application also provides a surface mounting method, which comprises the following steps:
forming a solder paste material layer on the surface of the circuit board to be mounted;
forming a solder paste layer on the solder paste material layer by a second preset process;
the circuit board to be mounted is subjected to surface mounting through a third preset process;
wherein the solder paste material layer comprises the solder paste for surface mounting as described above.
In the surface mounting method provided by the present application, the step of forming a solder paste material layer on the surface of the circuit board to be mounted includes:
dissolving the solder paste for surface mounting as described above in a first solvent to form a first mixture;
forming the solder paste material layer on the surface of the circuit board to be mounted by the first mixture through a fourth preset process;
wherein the mass fraction of the solder paste in the first mixture is 4-24%.
In the surface mounting method provided by the application, the thickness of the solder paste material layer is 4-36 micrometers.
In the surface mounting method provided by the present application, the step of forming the solder paste layer on the solder paste material layer by the second preset process includes:
the solder paste material layer is subjected to desolvation treatment to form a second mixture layer;
exposing the second mixture layer by using a first mask;
the second mixture layer is developed to form the tin paste layer;
the first mask comprises a first penetrating region and a second penetrating region, the light transmittance of the first penetrating region is 0%, and the light transmittance of the second penetrating region is 100%;
the orthographic projection of the first penetrating area on the circuit board to be mounted is positioned in a binding terminal of the circuit board to be mounted; alternatively, the first and second electrodes may be,
the orthographic projection of the second penetrating area on the circuit board to be mounted is positioned in the binding terminal.
Has the advantages that: this application uses the tin cream that the first composition that will have the tin element disperses in the second composition that has the photosensitivity, through exposure, development messenger's tin cream forms the tin cream layer on waiting to paste the terminal of binding of dress circuit board, has avoided the use of steel mesh in surface mounting, has avoided waiting to paste dress circuit board because the short circuit that the steel mesh caused or open circuit, has improved the tin cream layer and has bound the counterpoint precision of terminal, has promoted the product yield of waiting to paste dress circuit board.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a flowchart of a surface mounting method of the present application.
Fig. 2a to 2c are process flow diagrams of the surface mounting method of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The existing solder paste for surface mounting technology needs to be mounted by using a steel mesh, and the steel mesh for surface mounting easily causes short circuit or open circuit of a to-be-mounted circuit board due to direct contact with the to-be-mounted circuit board in the surface mounting process, so that the problem of influencing the yield of products exists. Based on the above, the application provides a solder paste for surface mounting, a driving circuit board and a surface mounting method.
The solder paste for surface mounting comprises a first composition and a second composition, wherein the first composition is dispersed in the second composition;
wherein the first composition comprises at least first metal particles containing tin element, the second composition comprises at least adhesive polymer or monomer of the adhesive polymer, and the second composition has photosensitivity.
The application provides a tin cream for surface mounting, through the first composition dispersion that will have the tin element in the second composition that has the photosensitivity, through the exposure, develop and make the tin cream be formed at the terminal that binds that waits to paste the dress circuit board, avoided the use of steel mesh in surface mounting, avoided treating to paste the dress circuit board because the short circuit that the steel mesh caused or open circuit, improved the tin cream layer and bound the counterpoint precision of terminal, promoted the product yield of waiting to paste the dress circuit board.
The technical solution of the present application will now be described with reference to specific embodiments.
Example one
In this embodiment, the first metal particles account for 40% to 60% of the mass of the solder paste.
In this embodiment, the material of the first metal particles may be a simple tin metal, a tin-containing alloy, or a mixture of the tin metal or the tin-containing alloy and other conductive materials.
For example, when the material of the first metal particles is an alloy containing tin, the material of the first metal layer particles is a tin-copper alloy or a tin-silver alloy or other alloy material containing tin element.
When the material of the first metal particles is a mixture of tin metal or a tin-containing alloy and other conductive materials, the other conductive materials may be conductive metal and/or non-metal materials, such as graphite with good conductivity, graphene, or other materials with conductivity, or polymers.
In this embodiment, the shape of the first metal particles may be spherical, ellipsoidal, flaky, or other regular or irregular shapes, and is not particularly limited herein.
In this embodiment, the first metal particles are used for electrically connecting the solder paste and the circuit board to be mounted. The mass fraction of the first metal particles in the solder paste is preferably 48% to 52%, more preferably 50%. When the mass fraction of the first metal particles in the solder paste is less than 40%, the mass fraction of the first metal particles in the solder paste is too small, so that the electrical connection between a solder paste layer formed by the solder paste and the circuit board to be mounted is not facilitated; when the mass fraction of the first metal particles in the solder paste is greater than 60%, other components in the solder paste, such as the content of the second composition, are too small, which is not favorable for the solder paste to form a solder paste layer on the binding terminal of the circuit board to be mounted in an exposure and development manner; when the mass fraction of the first metal particles in the solder paste is 48-52%, particularly 50%, the content of the first metal particles can ensure that the solder paste layer is electrically connected with the circuit board to be mounted, and the content of the second composition is proper, so that the solder paste can form the solder paste layer on the binding terminal in an exposure and development manner, and the product yield of the circuit board to be mounted is prevented from being influenced by the use of a steel mesh.
In this embodiment, the first composition may further include a flux, and the flux is used to remove metal oxides on the surface of the circuit board to be mounted, reduce the surface tension of the surface of the circuit board to be mounted, which is in contact with the solder paste, enhance the adhesion and the conductive effect between the solder paste layer formed by the solder paste and the circuit board to be mounted, and facilitate improvement of the product quality of the circuit board to be mounted.
In this embodiment, the soldering flux may include rosin resin, surfactant, activator, corrosion inhibitor, and the like. The rosin resin is used for enhancing the adhesive force between a solder paste layer formed by the solder paste and the circuit board to be mounted. The surface active agent is used for reducing the surface tension of the surface of the circuit board to be mounted, which is in contact with the tin paste layer formed by the tin paste, enhancing the surface wetting force between the circuit board to be mounted and the tin paste layer and enhancing the penetrating power of the activating agent, and the surface active agent in the soldering flux mainly comprises an ionic surface active agent, such as a fatty acid group surface active agent, or a non-ionic surface active agent, such as an aromatic non-ionic surface active agent. The activator is used for removing oxides between a solder paste layer formed by the solder paste and the circuit board to be mounted, and the activator in the soldering flux comprises one or more organic acids, such as one or more of succinic acid, glutaric acid, itaconic acid, o-hydroxybenzoic acid, sebacic acid, pimelic acid, malic acid, succinic acid and the like. The corrosion inhibitor is used for inhibiting corrosion of a solder paste layer formed by the solder paste, is beneficial to prolonging the service life of the circuit board to be mounted and improving the product quality of the circuit board to be mounted, and comprises benzotriazole.
In this embodiment, the adhesive polymer or the monomer of the adhesive polymer accounts for 8% to 60% by mass of the solder paste.
In this embodiment, the adhesive polymer is used to enhance the adhesion between the solder paste layer formed by the solder paste and the circuit board to be mounted. Also, the monomer of the adhesive polymer is used for forming the adhesive polymer after the solder paste is exposed, so that the adhesion between a solder paste layer formed by the solder paste and the circuit board to be mounted is enhanced.
In this embodiment, the adhesive polymer may include one or more of phenolic resin, polyacrylic resin (e.g., polymethyl methacrylate), and other adhesive resins. Also, the monomer of the adhesive polymer may include one or more of a monomer of a phenol resin, a monomer of a polyacrylic resin, and the like, which have adhesive properties.
When the monomer of the adhesive polymer is a monomer of a polyacrylate polymer, the monomer of the adhesive polymer may include an acrylate-based compound, for example, when the monomer of the adhesive polymer is a monomer of a polyacrylate aliphatic ester polymer, such as a monomer of a polyacrylic isobornyl ester-based polymer, the monomer of the adhesive polymer may include an isobornyl acrylate-based compound; when the monomer of the adhesive polymer is the monomer of other polyacrylic aliphatic ester polymers, the monomer of the adhesive polymer can comprise one or more of methyl acrylate, ethyl acrylate and propyl acrylate compounds; when the monomer of the adhesive polymer is a monomer of a polyacrylic aromatic ester polymer, such as polymethyl acrylate, the monomer of the adhesive polymer may include a benzyl acrylate compound.
In this embodiment, when the mass fraction of the sticky polymer or the monomer of the sticky polymer in the solder paste is less than 8%, the content of the sticky polymer or the monomer of the sticky polymer is too small to enhance the adhesion between the solder paste layer formed by the solder paste and the circuit board to be mounted, and in this application, the solder paste needs to be aligned and a solder paste layer is formed on the binding terminal of the circuit board to be mounted without using a steel mesh for surface mounting through exposure and development of the sticky polymer or the sticky polymer, so that when the content of the sticky polymer or the monomer of the sticky polymer is too small, the solder paste is not favorable to form the solder paste layer on the circuit board to be mounted through exposure and development; when the mass fraction of the viscous polymer or the monomer of the viscous polymer in the solder paste is more than 60%, the content of the viscous polymer or the monomer of the viscous polymer is too large, so that the content of other components in the solder paste, such as the content of the first metal particles, is too small, and the electrical connection between a solder paste layer formed by the solder paste and the circuit board to be mounted is not facilitated; when the mass fraction of the viscous polymer or the monomer of the viscous polymer in the solder paste is 8-60%, the solder paste can form a solder paste layer on the circuit board to be mounted in an exposure and development manner, and the formed solder paste layer can be electrically connected with the circuit board to be mounted.
In this embodiment, the second composition further includes a photosensitizer, and a mass ratio of the photosensitizer to the adhesive polymer or the monomers of the adhesive polymer is less than or equal to 1: 1.
When the adhesive polymer is included in the second composition, the sensitizer is used for decomposition of the adhesive polymer under light conditions; when the second composition includes monomers of the adhesive polymer, the photosensitizer polymerizes the monomers of the adhesive polymer under light conditions to form the adhesive polymer.
In this embodiment, when the photosensitizer is used for the decomposition of the viscous polymer under the illumination condition, the photosensitizer may include one or more of diazo compounds, metals, metal oxides, metal complexes, aromatic carbocyclic derivatives, aromatic heterocyclic derivatives, and the like. The kind of the photosensitizer is selected according to the type of the adhesive polymer, and is not particularly limited herein.
In this embodiment, when the photosensitizer is used in the monomers of the adhesive polymer to form the adhesive polymer, the photosensitizer may include one or more of 2-hydroxy-methylphenylpropane-1-one, 2-methyl-1- (4-methylthio) phenyl-2-morpholino-1-propanone, 2, 2-dimethyl-2-phenylacetophenone, or other compounds that can initiate polymerization of the monomers of the adhesive polymer under the illumination condition. The specific choice of the sensitizer is determined by the kind of the monomer of the adhesive polymer, and is not particularly limited herein.
In this embodiment, the addition of the photosensitizer is helpful for accelerating the decomposition of the viscous polymer under the light irradiation or the polymerization of the viscous polymer under the light irradiation, when the mass ratio of the photosensitizer to the viscous polymer or the monomer of the viscous polymer is greater than 1:1, the content of the photosensitizer is too large, which results in too small content of other components in the solder paste, and the photosensitizer is only used for initiating the decomposition of the viscous polymer under the light irradiation or the polymerization of the monomer of the viscous polymer under the light irradiation, and the mass ratio of the photosensitizer to the viscous polymer or the monomer of the viscous polymer is less than or equal to 1:1, which is sufficient for initiating the photosensitive agent.
In this embodiment, the second composition further includes a dispersant, and a mass ratio of the dispersant to the viscous polymer or the monomer of the viscous polymer is less than or equal to 1: 1.
In this embodiment, the dispersant is used to assist in uniformly dispersing the first composition with the second composition.
In this embodiment, the dispersant may be polyoxyethylene ether or other substances that can be used to assist the first composition in dispersing in the second composition.
In this embodiment, the addition of the dispersant helps the first composition to be uniformly dispersed in the second composition, when the mass ratio of the dispersant to the viscous polymer or the monomer of the viscous polymer is greater than 1:1, the content of the dispersant is excessively large, resulting in an excessively small content of other components in the solder paste, and the dispersant is used only as a uniform dispersion of the first composition in the second composition, and the dispersion effect is sufficiently achieved when the mass ratio of the dispersant to the viscous polymer or the monomer of the viscous polymer is less than or equal to 1: 1.
In this embodiment, the second composition further includes an adhesion promoter, and the adhesion promoter is used to assist in enhancing the adhesion between the solder paste and the circuit board to be mounted. The mass ratio of the adhesion promoter to the adhesive polymer or the monomers of the adhesive polymer is less than or equal to 1: 1.
In the embodiment, the adhesion promoter is added to help enhance the adhesion between the solder paste and the circuit board to be mounted, when the mass ratio of the adhesion promoter to the viscous polymer or the monomer of the viscous polymer is greater than 1:1, the content of the adhesion promoter is too large, so that the content of other components in the solder paste is too small, the adhesion promoter is only used for assisting in enhancing the adhesion between the solder paste and the circuit board to be mounted, and the mass ratio of the adhesion promoter to the viscous polymer or the monomer of the viscous polymer is less than or equal to 1:1, which is enough to assist in enhancing the adhesion.
In this embodiment, the second composition further includes an additive, and the additive may be used to increase leveling property of the solder paste, improve adhesion, viscosity, and the like of the solder paste, and reduce contamination of the solder paste to other components on the circuit board to be mounted, except for the bonding terminal.
In this embodiment, the additive may be a polyorganosiloxane or other substance that can be used to improve the leveling of the solder paste.
In this example, the mass ratio of the additive to the adhesive polymer or the monomers of the adhesive polymer is less than or equal to 1: 1. The addition of the additive helps to enhance the leveling property of the solder paste, when the mass ratio of the additive to the viscous polymer or the monomer of the viscous polymer is greater than 1:1, the content of the additive is too large, so that the content of other components in the solder paste is too small, the additive is only used for enhancing the leveling property of the solder paste, and the leveling effect is sufficiently achieved when the mass ratio of the additive to the viscous polymer or the monomer of the viscous polymer is less than or equal to 1: 1.
This embodiment is through using the tin cream that will have the first composition dispersion of tin element in the second composition that has the photosensitivity, through the exposure, develop and make the tin cream form the tin cream layer on waiting to paste the terminal that binds of dress circuit board, avoided the use of steel mesh in surface mounting, avoided waiting to paste dress circuit board because the short circuit that the steel mesh caused or open circuit, improved the counterpoint precision of tin cream layer with binding the terminal, promoted the product yield of waiting to paste dress circuit board and waited to paste the product yield of dress circuit board.
The application also provides a drive circuit board, include drive circuit board is including binding terminal, light source and being located bind the terminal with tin cream layer between the light source.
The solder paste layer is formed by performing a first predetermined process on the solder paste.
In this embodiment, when the second composition in the solder paste includes an adhesive polymer, the first predetermined process includes decomposition of the adhesive polymer under a light condition.
In this embodiment, when the second composition in the solder paste includes a monomer of an adhesive polymer, the first predetermined process includes polymerization of the monomer of the adhesive polymer under a lighting condition.
In this embodiment, the driving circuit board may be a back plate for controlling a light source in a backlight module of a display device.
In this embodiment, the light source may be a photodiode, and the photodiode may include one or more of a micro photodiode, a mini photodiode, or other types of photodiodes.
The application provides a drive circuit board, through the tin cream that the first composition that will have the tin element disperses in the second composition that has the photosensitivity, through the exposure, develop and make the tin cream form the tin cream layer on waiting to paste the terminal of binding of dress circuit board, the use of steel mesh has been avoided in surface mounting, avoided waiting to paste dress circuit board because the short circuit that the steel mesh caused or open circuit, improved the counterpoint precision of tin cream layer and binding terminal, the product yield of waiting to paste the dress circuit board has been promoted.
Referring to fig. 1 and fig. 2a to 2c, the present application further provides a surface mounting method, including:
referring to fig. 2a, S100, a solder paste material layer 102 is formed on a surface of a circuit board 101 to be mounted.
Wherein the solder paste material layer 102 comprises solder paste for surface mounting as described above.
In this embodiment, step S100 includes:
s110, dissolving the solder paste for surface mounting in a first solvent to form a first mixture.
Wherein the mass fraction of the solder paste in the first mixture is 4-24%.
In this embodiment, the mass fraction of the solder paste in the first mixture is preferably 5% to 20%. When the mass fraction of the solder paste in the first mixture is less than 4%, the content of the solder paste is too small, the thickness of the formed solder paste material layer 102 is too small, or the time for removing the first solvent is too long, so that the final thickness of the formed solder paste layer 104 is too small, which affects the product quality of the circuit board 101 to be mounted, or the process time is too long, and the first solvent is wasted; when the mass fraction of the solder paste in the first mixture is greater than 24%, the content of the solder paste in the first mixture is too large, so that the viscosity of the first mixture is too large, and the uniform distribution of the thickness of the formed solder paste material layer 102 is not facilitated; when the mass fraction of the solder paste in the first mixture is 5% to 20%, the quality of the circuit board 101 to be mounted is not affected or the processing time is too long, the first solvent is not wasted because the content of the solder paste in the first mixture is too small, and the uniform distribution of the thickness of the solder paste material layer 102 is not affected because the content of the solder paste in the first mixture is too large.
In this embodiment, the mass fraction of the adhesive polymer or the monomer of the adhesive polymer in the second composition in the first mixture is 4% to 24%, preferably 5% to 20%, and the reason for selecting this range is the same as or similar to the reason for selecting the mass fraction of the adhesive polymer or the monomer of the adhesive polymer in the solder paste in the first embodiment, and is not repeated herein.
In this embodiment, the mass fractions of the sensitizer, the dispersant, the adhesion promoter, and the additive in the first mixture in the second composition are each less than 5%. The reason for selecting this range is the same as or similar to the reason for selecting the ranges of the mass ratio of the sensitizer, the dispersant, the adhesion promoter, and the additive to the adhesive polymer or the monomer of the adhesive polymer in example one, and will not be described again.
In this embodiment, the first solvent may be one or more of propylene glycol methyl ether acetate, propylene glycol methyl ether, methyl 3-methoxypropionate, diethylene glycol methyl ethyl ether, or other solvents that can dissolve the solder paste.
And S120, forming the solder paste material layer 102 on the surface of the circuit board 101 to be mounted by the first mixture through a fourth preset process.
In this embodiment, step S120 includes:
s121, spin coating or drop coating the first mixture on the surface of the circuit board 101 to be mounted to form the solder paste material layer 102.
In this embodiment, the thickness of the solder paste material layer 102 is 4 to 36 μm. The thickness of the solder paste material layer 102 is preferably 5 to 30 microns.
When the thickness of the solder paste material layer 102 is smaller than 4 micrometers, the thickness of the solder paste material layer 102 is too small, so that the thickness of the finally formed solder paste layer 104 is too small, and the subsequent power supply is not favorably fixed on the circuit board 101 to be mounted through the solder paste layer 104; when the thickness of the solder paste material layer 102 is 4 to 36 micrometers, the formed solder paste layer 104 can meet the requirement of fixing the power supply on the circuit board 101 to be mounted and making the electrical connectivity of the power supply and the circuit board 101 good, so that the mounting cost is not increased due to excessive use of the solder paste caused by the fact that the thickness of the solder paste material layer 102 exceeds 36 micrometers; when the thickness of the solder paste material layer 102 is 5 micrometers to 30 micrometers, the power supply can be fixed on the circuit board 101 to be mounted through the solder paste layer 104, and the cost increase caused by excessive use of the solder paste can be avoided.
Referring to fig. 2b, in S200, the solder paste material layer 102 is processed by a second predetermined process to form a solder paste layer 104.
In this embodiment, step S200 includes:
s210, the solder paste material layer 102 is desolvated to form the second mixture layer.
The desolvation treatment temperature is 56 to 132 degrees celsius, preferably 70 to 110 degrees celsius, and the total heating amount when the second mixture layer is formed on each of the boards 101 to be mounted is less than 400 megajoules.
In this embodiment, when the temperature of the desolvation treatment is less than 56 ℃, the temperature for removing the first solvent is too low, which results in too long time for removing the first solvent, and increases the time for the process, which results in the decrease of the process efficiency; when the temperature of the desolvation treatment is more than 132 ℃, the temperature for removing the first solvent is too high, which is easy to cause the cracking of the second mixture layer or the denaturation of the components in the solder paste; when the desolvation treatment temperature is 70 to 110 ℃, the desolvation treatment temperature is not too low to cause reduction in process efficiency, nor is the temperature too high to cause cracking of the second mixture layer or denaturation of components of the solder paste.
By controlling the total heating amount to be less than 400 megajoules, the problems of cracking of the second mixture layer, denaturation of components of the solder paste, reduction of process efficiency due to too long supporting time and the like caused by too large total heating amount of the desolvation treatment can also be avoided.
And S220, exposing the second mixture layer by using a first mask.
And S230, developing the second mixture layer to form the solder paste layer 104.
The first mask comprises a first penetrating region and a second penetrating region, the light transmittance of the first penetrating region is 0%, and the light transmittance of the second penetrating region is 100%.
In this embodiment, when the second composition in the solder paste includes an adhesive polymer, an orthogonal projection of the first penetration region on the circuit board 101 to be mounted is located within the binding terminal 103 of the circuit board 101 to be mounted.
At this time, since the light transmittance of the first penetration region is 0%, the solder paste material corresponding to the region of the second mixture layer on the first mask where the orthographic projection is located in the first penetration region does not undergo decomposition reaction because it is not irradiated by light, and thus the solder paste layer 104 remains and is finally formed.
In this embodiment, when the second composition in the solder paste includes a monomer of an adhesive polymer, an orthogonal projection of the second penetration region on the circuit board 101 to be mounted is located within the binding terminal 103.
At this time, since the light transmittance of the second penetration region is 100%, the solder paste material corresponding to the region of the second mixture layer on the first mask where the orthographic projection is located in the second penetration region undergoes a polymerization reaction due to receiving light, and thus the solder paste layer 104 is retained and finally formed.
Referring to fig. 2c, in step S300, the circuit board 101 to be mounted is subjected to a third predetermined process to complete surface mounting.
In this embodiment, step S300 includes:
and S310, carrying out surface mounting on the circuit board 101 to be mounted.
In this embodiment, the circuit board 101 to be mounted may be a back plate for controlling a light source in a backlight module of a display device.
In this embodiment, the light source 105 may be a photodiode through step S310, and the photodiode may include one or more of a micro photodiode, a mini photodiode, or other types of photodiodes.
And S320, performing reflow soldering on the circuit board 101 to be mounted after the chip is mounted.
In this embodiment, the light source 105 may be fixed on the circuit board 101 to be mounted through the step S320.
In this embodiment, the surface mounting method further includes quality inspection of the circuit board subjected to surface mounting, and the circuit board subjected to surface mounting can be used for a product, such as a backlight module of a display device, after the quality inspection is qualified; and when the quality of the circuit board subjected to surface mounting is unqualified, the circuit board is eliminated or repaired.
The application provides a surface mounting method, use the tin cream that first composition that will have the tin element disperses in the second composition that has the photosensitivity, through the exposure, develop and make the tin cream form the tin cream layer on waiting to paste the terminal that binds of dress circuit board, the use of steel mesh has been avoided in surface mounting, avoided waiting to paste dress circuit board because the short circuit that the steel mesh caused or open circuit, improved the counterpoint precision of tin cream layer and binding terminal, the product yield of waiting to paste the dress circuit board has been promoted.
The application provides a solder paste for surface mounting, a driving circuit board and a surface mounting method. The solder paste for surface mounting comprises a first composition and a second composition, wherein the first composition is dispersed in the second composition; wherein the first composition at least comprises first metal particles containing tin element, and the second composition at least comprises adhesive polymer with photosensitivity or monomer of adhesive polymer. This application uses the tin cream that the first composition that will have the tin element disperses in the second composition that has the photosensitivity, through exposure, development messenger's tin cream forms the tin cream layer on waiting to paste the terminal of binding of dress circuit board, has avoided the use of steel mesh in surface mounting, has avoided waiting to paste dress circuit board because the short circuit that the steel mesh caused or open circuit, has improved the tin cream layer and has bound the counterpoint precision of terminal, has promoted the product yield of waiting to paste dress circuit board.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The solder paste, the driving circuit board and the surface mounting method for surface mounting provided by the embodiments of the present application are introduced in detail, and specific examples are applied to illustrate the principle and the implementation manner of the present application, and the description of the embodiments is only used to help understanding the technical scheme and the core idea of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (7)
1. A solder paste for surface mounting, comprising a first composition and a second composition, wherein the first composition is dispersed in the second composition;
wherein the first composition comprises at least first metal particles containing tin element, the second composition comprises at least adhesive polymer or monomer of the adhesive polymer, and photosensitizer; wherein the ratio of the mass of the sensitizer to the mass of the adhesive polymer or the monomer of the adhesive polymer is less than or equal to 1:1, the first metal particles account for 40% to 60% of the mass of the solder paste, and the adhesive polymer or the monomer of the adhesive polymer accounts for 8% to 60% of the mass of the solder paste;
the adhesive polymer comprises phenolic resin or polyacrylic resin; the monomers of the adhesive polymer comprise monomers of phenolic resin or monomers of polyacrylic resin;
when the adhesive polymer is included in the second composition, the adhesive polymer decomposes under light conditions; when the second composition includes monomers of the adhesive polymer, the monomers of the adhesive polymer polymerize under light conditions to form the adhesive polymer.
2. The solder paste for surface mounting according to claim 1, wherein the second composition further comprises a dispersant, and a mass ratio of the dispersant to the viscous polymer or a monomer of the viscous polymer is less than or equal to 1: 1.
3. A driving circuit board is characterized by comprising a binding terminal, a light source and a tin paste layer positioned between the binding terminal and the light source;
the solder paste layer is formed by performing a first predetermined process on the solder paste for surface mounting according to any one of claims 1 to 2.
4. A surface mounting method, comprising:
forming a solder paste material layer on the surface of the circuit board to be mounted;
forming a solder paste layer on the solder paste material layer by a second preset process;
the circuit board to be mounted is subjected to surface mounting through a third preset process;
wherein the solder paste material layer includes the solder paste for surface mounting according to any one of claims 1 to 2.
5. A surface mounting method according to claim 4, wherein said step of forming a solder paste material layer on the surface of the circuit board to be mounted comprises:
dissolving the solder paste for surface mounting according to any one of claims 1 to 2 in a first solvent to form a first mixture;
forming the solder paste material layer on the surface of the circuit board to be mounted by the first mixture through a fourth preset process;
wherein the mass fraction of the solder paste in the first mixture is 4-24%.
6. A surface mounting method according to claim 5, wherein said solder paste material layer has a thickness of 4 to 36 μm.
7. A surface mounting method according to claim 4, wherein the step of forming the solder paste layer by the second predetermined process includes:
the solder paste material layer is subjected to desolvation treatment to form a second mixture layer;
exposing the second mixture layer by using a first mask;
the second mixture layer is developed to form the tin paste layer;
the first mask comprises a first penetrating region and a second penetrating region, the light transmittance of the first penetrating region is 0%, and the light transmittance of the second penetrating region is 100%;
the orthographic projection of the first penetrating area on the circuit board to be mounted is positioned in a binding terminal of the circuit board to be mounted; alternatively, the first and second electrodes may be,
the orthographic projection of the second penetrating area on the circuit board to be mounted is positioned in the binding terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110017412.6A CN112822866B (en) | 2021-01-07 | 2021-01-07 | Solder paste for surface mounting, driving circuit board and surface mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110017412.6A CN112822866B (en) | 2021-01-07 | 2021-01-07 | Solder paste for surface mounting, driving circuit board and surface mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112822866A CN112822866A (en) | 2021-05-18 |
| CN112822866B true CN112822866B (en) | 2022-05-27 |
Family
ID=75868611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110017412.6A Active CN112822866B (en) | 2021-01-07 | 2021-01-07 | Solder paste for surface mounting, driving circuit board and surface mounting method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112822866B (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0787200B2 (en) * | 1987-04-07 | 1995-09-20 | 松下電器産業株式会社 | Mounting method of semiconductor chip |
| JP3549017B2 (en) * | 2000-07-21 | 2004-08-04 | 松下電器産業株式会社 | Flip chip mounting method |
| JP5989370B2 (en) * | 2012-03-23 | 2016-09-07 | 日東電工株式会社 | Printed circuit board |
| CN102775363B (en) * | 2012-08-06 | 2014-10-29 | 恒昌涂料（惠阳）有限公司 | Polyurethane acrylic ester photosensitive resin oligomer and preparation method thereof |
-
2021
- 2021-01-07 CN CN202110017412.6A patent/CN112822866B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN112822866A (en) | 2021-05-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6580169B2 (en) | Method for forming bumps, semiconductor device, and solder paste | |
| TW518918B (en) | Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made thereby | |
| CN1926675B (en) | Method for establishing anisotropic conductive connection and anisotropic conductive adhesive film | |
| JPWO2002028574A1 (en) | Functional alloy particles | |
| JP6600167B2 (en) | Resin composition and conductive adhesive containing resin composition | |
| JP2013119089A (en) | Conductive bonding material, electronic component, and electronic device | |
| KR20140024935A (en) | Connection method, connected-body production method and connected body | |
| CN112822866B (en) | Solder paste for surface mounting, driving circuit board and surface mounting method | |
| JPWO2007099965A1 (en) | Circuit connection material, circuit member connection structure using the same, and manufacturing method thereof | |
| JP2008252098A (en) | Method of manufacturing circuit board apparatus | |
| US9415469B2 (en) | Resin composition for solder bump formation, solder bump formation method, and member having solder bumps | |
| JPH11306861A (en) | Conductive adhesive composition, anisortropic adhesive film provied with the same, and connecting method using the film | |
| WO2017179704A1 (en) | Method for forming solder bump | |
| JP2002289652A (en) | Semiconductor device tape carrier and its manufacturing method | |
| JP2017135065A (en) | Anisotropic conductive film, connection method and conjugate | |
| KR20140056668A (en) | Method for manufacturing solder on pad and flip chip bonding method used the same | |
| JP3119385B2 (en) | Surface treatment method, surface treatment device and surface treatment liquid for electronic components and their electrode terminals | |
| JPH11284024A (en) | Manufacture of circuit board device | |
| JP2009290231A (en) | Method of manufacturing circuit board apparatus | |
| JP2011066015A (en) | Conductive particle, anisotropic conductive material, and connection structure | |
| WO2001095343A1 (en) | Conductive composition, method for manufacturing electrode or printed board comprising the same, method for connecting electrode comprising the same, and electrode or printed board using the same | |
| CN117467318A (en) | Antioxidant, backlight module and manufacturing method thereof | |
| JP2022027735A (en) | Repair method for electronic element mounting board, repair material, cured product and wiring board | |
| JP4367630B2 (en) | Bump formation method | |
| JP2024007804A (en) | Method for producing circuit device and resin composition for sealing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |