CN112822603A - Temperature-adjusting earmuff applied to headset and temperature-adjusting method thereof - Google Patents

Abstract

The invention discloses a temperature-adjusting earmuff applied to a headset and a temperature-adjusting method thereof, wherein the temperature-adjusting earmuff comprises a fitting sleeve, a TEC electronic constant temperature part and a PCB (printed Circuit Board), wherein a matching space is arranged on the fitting sleeve, and a connecting mechanism used for being connected with the headset is arranged on one side of the fitting sleeve; the TEC electronic constant temperature part is arranged on the attaching sleeve and corresponds to the matching space, and a through hole which is convenient for sound to pass through and emit hot air or cold air is arranged on the TEC electronic constant temperature part; the PCB is arranged in the fitting sleeve, and is provided with a control module which is electrically connected with the TEC electronic constant temperature part to control the direction and the magnitude of current flowing through the TEC electronic constant temperature part so as to heat or refrigerate the TEC electronic constant temperature part. Therefore, the temperature-adjusting earmuff capable of being combined with the headset is designed, the electronic constant temperature element of the TEC can be finely adjusted to heat or refrigerate according to the preset temperature value or the preset temperature range, the temperature of the earmuff is fluctuated within the set temperature range, the purpose of keeping the earmuff constant in temperature is achieved, and the use experience of the headset is improved.

Description

Temperature-adjusting earmuff applied to headset and temperature-adjusting method thereof

Technical Field

The invention relates to the technical field of earphones, in particular to a temperature-adjusting earmuff applied to a headset and a temperature-adjusting method thereof.

Background

With the rapid development of electronic technology, various types of electronic devices have emerged, which meet the needs of people in many aspects such as work, study, and entertainment. Among them, many types of electronic devices, such as mobile phones, tablet computers, notebook computers, navigators, wearable devices, etc., have functions of conversation, etc., and can be used to meet the interaction requirements of users, so that the earphones become one of the indispensable tools for the electronic devices to be used in a matching manner.

Current headphone is the indispensable singleness to recreation fan and IT staff, however, in summer, because weather is hotter, the headset wraps up the ear the back, can make the user feel dry and hot, has reduced the use of headset and has experienced, the heat dissipation function of current headset is relatively poor, can not provide good use experience for the user in hot weather, and in addition, the continuous accumulation of heat makes the headset be in high temperature state for a long time, can reduce the life of earphone. In winter, the headset can relieve cold feeling when being worn, but cannot keep temperature and adapt to low-temperature environment, so that the ears are easily frostbitten by people at low temperature. Therefore, should design a section earmuff to current headphone to make headphone possess the function that adjusts the temperature, improve the wearing comfort level of earphone.

Disclosure of Invention

In view of the above, the present invention is directed to the defects in the prior art, and a main object of the present invention is to provide a temperature adjustment earmuff applied to a headset and a temperature adjustment method thereof, in which by designing a temperature adjustment earmuff capable of being combined with a headset, the earmuff can finely adjust the TEC electronic thermostat to heat or cool according to a preset temperature value or a preset temperature range, so that the temperature of the earmuff fluctuates within the preset temperature range, thereby achieving the purpose of keeping the temperature of the earmuff constant, and improving the experience of the headset.

In order to achieve the purpose, the invention adopts the following technical scheme:

a temperature-adjusting earmuff applied to a headset comprises a fitting sleeve for fitting human ears, a TEC electronic constant temperature part and a PCB, wherein a matching space corresponding to the human ears is arranged on the fitting sleeve, and a connecting mechanism for connecting with the headset is arranged on one side of the fitting sleeve; the TEC electronic constant temperature part is arranged on the attaching sleeve and corresponds to the matching space, and a through hole which is convenient for sound to pass through and emit hot air or cold air is arranged on the TEC electronic constant temperature part; the PCB is arranged in the fitting sleeve, and is provided with a control module which is electrically connected with the TEC electronic constant temperature part to control the direction and the magnitude of current flowing through the TEC electronic constant temperature part so as to heat or refrigerate the TEC electronic constant temperature part.

As a preferred embodiment: the temperature sensing device is characterized by further comprising a temperature sensing element and a temperature reading module, wherein the temperature sensing element is arranged on the PCB and used for sensing the temperature of the earmuff, the temperature reading module is used for converting signals collected by the temperature sensing element into temperature values, the temperature sensing element is electrically connected with the temperature reading module, and the temperature reading module is electrically connected with the control module.

As a preferred embodiment: the PCB is provided with a preset module for presetting temperature, and the preset module is electrically connected with the control module.

As a preferred embodiment: the PCB is provided with a power interface which extends out of the attaching sleeve.

As a preferred embodiment: the laminating cover is internally provided with a battery which is electrically connected with the PCB.

As a preferred embodiment: the TEC electronic thermostatic element and the PCB are combined into a disc shape or a square shape.

As a preferred embodiment: the bottom of the fitting sleeve is provided with a supporting plate for supporting the TEC electronic constant temperature part and the PCB; the connecting mechanism comprises a plurality of magnets which can be adsorbed on the outer side of the headset, and the magnets are fixed on the lower surface of the supporting plate.

As a preferred embodiment: the fit sleeve comprises a flexible sleeve body and a tower-shaped bracket, the fit space is arranged in the middle of the flexible sleeve body, and an annular embedding groove is formed in the lower surface of the flexible sleeve body; the tower-shaped support comprises an annular attaching portion and an annular extending portion integrally connected to the annular attaching portion, the annular attaching portion is installed in an annular embedding groove, a plurality of hollow grooves are formed in the wall surface of the annular extending portion, an annular step is arranged at the top of the annular extending portion, and the TEC electronic constant temperature part is installed on the annular step and is right opposite to a matching space.

As a preferred embodiment: the connecting mechanism comprises a plurality of magnets which can be adsorbed on the outer side of the headset, and the magnets are fixed on the outer side wall of the annular attaching part.

A method for adjusting the temperature of an earcap as described above, comprising the steps of:

the preset module can preset a temperature value or a temperature range;

the temperature sensing element senses the temperature of the earphone in real time and transmits a signal to the temperature reading module;

the temperature reading module converts the read temperature signal into a temperature value and transmits the temperature value to the control module;

the control module compares the received temperature value with a preset temperature value or temperature range, and judges that heating is needed when the received temperature value is lower than the preset temperature value or temperature range; when the received temperature value is higher than a preset temperature value or temperature range, judging that refrigeration is needed; the heating or the cooling is realized by changing the direction of current flowing through the TEC electronic constant temperature part by the control module; the control module realizes the adjustment of heating or refrigerating efficiency by controlling the current flowing through the TEC electronic constant temperature part;

the TEC electronic constant temperature part adjusts the heating end or the refrigerating end of the TEC electronic constant temperature part according to the direction and the size of current flowing through the TEC electronic constant temperature part to realize self temperature rise or temperature drop, and transmits the temperature to the temperature sensing element in real time to form a temperature regulation closed-loop control circuit, and the integral temperature of the earphone is controlled within a preset temperature value or a preset temperature range to realize a constant temperature state.

Compared with the prior art, the temperature-adjusting earmuff has obvious advantages and beneficial effects, and particularly, according to the technical scheme, the temperature-adjusting earmuff is designed for the headset, so that the earmuff is combined with the headset; the temperature sensing element monitors the temperature of the earmuff in real time, and the TEC electronic constant temperature part is finely adjusted to heat or refrigerate according to a preset temperature value or a temperature range, so that the temperature of the earmuff fluctuates within a set temperature range. Through such a closed loop control by temperature change circuit design, realize the homothermal purpose of earmuff, make the user more comfortable wearing earphone in hot summer and chilly winter, improve the use experience nature of earphone.

To more clearly illustrate the structural features and effects of the present invention, the following detailed description is given with reference to the accompanying drawings and specific embodiments.

Drawings

FIG. 1 is a schematic perspective view of a circular earcap according to the present invention;

FIG. 2 is a schematic perspective view of another perspective view of the circular earcap of the present invention;

FIG. 3 is an exploded perspective view of the ear cap of the present invention;

FIG. 4 is an exploded perspective view of another embodiment of the earcap of the present invention;

FIG. 5 is a schematic perspective view of a square ear cap according to the present invention;

FIG. 6 is a schematic perspective view of another perspective structure of the square earcap of the present invention;

FIG. 7 is a schematic perspective view of a tower-shaped earcap according to the present invention;

FIG. 8 is a schematic perspective view of another embodiment of a tower-shaped earmuff according to the present invention;

FIG. 9 is an exploded perspective view of a tower-shaped earcap according to the present invention;

FIG. 10 is a schematic perspective view of another exploded view of a tower earcap according to the present invention;

FIG. 11 is a schematic view of the earmuff and headset assembly of the present invention;

FIG. 12 is a perspective view of the earcap and the headphone of the present invention;

FIG. 13 is a schematic diagram of the temperature control principle of the present invention;

FIG. 14 is a diagram illustrating a predetermined temperature and time variation curve and a temperature and power variation curve according to the present invention.

The attached drawings indicate the following:

11. fitting sleeve 11 and fitting space

12. Connection mechanism 121 and magnet

13. Supporting plate 14 and flexible sleeve body

141. Annular embedding groove 15 and tower-shaped support

151. Annular attaching part 152 and annular extending part

153. Hollow groove 154, annular step

20. TEC electronic constant temperature part 21 and through hole

30. PCB (printed Circuit Board) 31 and temperature sensing piece

32. Temperature reading module 33 and control module

34. Presetting module 35 and power interface

40. Battery 50 and headphone

Detailed Description

The invention is shown in fig. 1 to 14, a temperature adjusting earmuff applied to a headset and a temperature adjusting method thereof, comprising a fitting sleeve 10 for fitting human ear, a TEC electronic thermostat 20 and a PCB 30, wherein:

the fit space 11 corresponding to the ear of the user is provided on the fit sleeve 10, and the connection mechanism 12 for connecting with the headphone is provided on one side of the fit sleeve 10. This laminating cover 10 adopts the sponge material with people's ear contact part, can play on the one hand and wear comfortable effect, and the porosity of on the other hand sponge can reduce the hindrance that the sound propagated.

The TEC electronic thermostatic element 20 is arranged on the fitting sleeve 10 and corresponds to the fitting space 11, a plurality of through holes 21 which are convenient for sound to pass through and emit hot air or cold air are arranged on the TEC electronic thermostatic element 20, and sound emitted by the earphone passes through the through holes 21 and enters human ears; meanwhile, the plurality of through holes 21 can ensure that the air in the earmuff can flow more smoothly, hot air or cold air can be diffused more quickly, and the temperature adjusting efficiency is higher.

The TEC electronic constant temperature part 20 is made of semiconductor materials and has heating and refrigerating functions after being electrified. The working principle is as follows: when the thermoelectric cooler is powered on, under the action of an external electric field, the TEC electronic constant temperature part 20 can carry heat from one end to the other end by electron current, so that refrigeration and heating are realized. The different directions of the current can cause the cold and hot surfaces of the TEC electronic constant temperature part 20 to be switched, and the magnitude of the current determines the strength of the refrigerating or heating capacity, so that the constant temperature control is realized by utilizing the characteristic.

This PCB board 30 is installed inside laminating cover 10, because TEC electron constant temperature component 20 and PCB board 30 all install on laminating cover 10, one of them compound mode is: the TEC electronic constant temperature part 20 and the PCB 30 are spliced to be disc-shaped, and the whole earmuff is also disc-shaped; the other combination mode is as follows: the TEC electronic thermostatic element 20, the PCB 30 and the battery 40 are spliced into a square block shape, and the whole ear cap is also in a square block shape.

In addition, a supporting plate 13 for supporting the TEC electronic thermostatic element 20 and the PCB 30 is disposed at the bottom of the attaching sleeve 10, and the supporting plate 13 is used as a plastic supporting plate when the ear cap is used only in a heating mode, so as to support the TEC electronic thermostatic element 20 and the PCB 30; when the earmuff is used as a constant temperature mode, it is used as a heat dissipation aluminum plate to dissipate heat of the PCB 30. The connecting mechanism 12 includes a plurality of magnets 121 that can be attached to the outer side of the headphone, and the plurality of magnets 121 are embedded and fixed on the lower surface of the supporting plate 13 (the lower surface of the supporting plate 13 is provided with embedding grooves corresponding to the magnets); when in use, the magnet 121 is used for fixing the earmuff on the headset in an adsorption manner; the connection mechanism 12 may be a snap or other sleeve connection method besides the magnet 121.

The fit sleeve 10 may also adopt the following structure: the fitting sleeve 10 comprises a flexible sleeve body 14 (made of sponge material) and a tower-shaped support 15, the fitting space 11 is arranged in the middle of the flexible sleeve body 14, and an annular embedding groove 141 is arranged on the lower surface of the flexible sleeve body 14; the tower-shaped bracket 15 includes an annular attaching portion 151 and an annular extending portion 152 integrally connected to the annular attaching portion 151, the annular attaching portion 151 is installed in the annular embedding groove 141, a plurality of hollow-out grooves 153 (facilitating heat or cold air dissipation and sound transmission) are formed on a wall surface of the annular extending portion 152, an annular step 154 is formed at a top of the annular extending portion 152, and the TEC electronic thermostat 20 is installed on the annular step 154 and faces the fitting space 11.

The PCB 30 is provided with a temperature sensing element 31, a temperature reading module 32, a control module 33 and a presetting module 34. A battery 40 is arranged in the fit sleeve 10, and the battery 40 is electrically connected with the PCB 30 so as to supply power to the PCB 30; the PCB 30 is provided with a power interface 35, the power interface 35 extends out of the adhesive sleeve 10, and the power interface 35 can be used for connecting an external power source to supply power to the PCB 30 and simultaneously charge the battery 40. The TEC electronic thermostat 20 is electrically connected to the control module 33, and the temperature sensing element 31 is electrically connected to the temperature reading module 32 and the TEC electronic thermostat 20, respectively; the presetting module 34 is electrically connected with the control module 33.

The temperature sensing element 31 adopts a thermocouple or a thermistor; the thermocouple is a commonly used temperature sensing element in a temperature measuring instrument, directly measures temperature and converts a temperature signal into a thermoelectromotive force signal; the thermistor is sensitive to temperature, shows different resistance values at different temperatures, and has a certain functional relation between electromotive force or the resistance value and the temperature. A positive temperature coefficient thermistor (PTC) has a higher resistance value at a higher temperature, and a negative temperature coefficient thermistor (NTC) has a lower resistance value at a higher temperature, which are semiconductor devices. The temperature sensing element 31 can also be separately disposed at a certain position in the adhesive sleeve 10 to collect local temperature parameters, and then electrically connected to the PCB 30 to transmit the temperature parameters to the temperature reading module 32.

The temperature reading module 32 (using an IC chip) is configured to convert the electromotive force or the resistance value output by the temperature sensing element 31 into a temperature value, specifically, decode the electromotive force or the resistance value output by the temperature sensing element 31 into a temperature value according to a functional relationship corresponding to the temperature. The presetting module 34 can be set to different temperature values or temperature ranges according to personal preference before the earphone is used; can adopt manual mode setting or set up with cell-phone APP through the bluetooth (adopt cell-phone APP to set up need design earlier with earphone temperature control assorted APP, then control command input earphone carries out the control by temperature change through the bluetooth transmission).

The control module 33 (using an IC chip) is configured to compare and determine the temperature value read by the temperature reading module 32 with a preset temperature value or a preset temperature range, and a temperature and power curve in real time to determine the voltage positive and negative and the power of the output TEC electronic thermostat 20 (as shown in fig. 14, when the temperature sensing element 31 detects that the earmuff temperature reaches the trigger temperature, the temperature sensing element will trigger the TEC electronic thermostat 20 to heat or cool, so that the earphone temperature is always kept within the range of the preset temperature curve). The relationship between the temperature and the power curve can be set according to actual needs, and can be controlled by a square wave, a sine wave, a slope line, a PWM signal, or the like. The power curve relationship may be set according to actual needs, and may be controlled by a square wave, a sine wave, a slope line, or a PWM signal.

The presetting module 34 can be set to different temperature values or temperature ranges according to personal preference before the earphone is used; can adopt manual mode setting or set up with cell-phone APP through the bluetooth (adopt cell-phone APP to set up need design earlier with earphone temperature control assorted APP, then control command input earphone carries out the control by temperature change through the bluetooth transmission).

It should be noted that, when the earmuff is used only for heating, the temperature sensing element 31, the temperature reading module 32 and the presetting module 34 are not needed, and only the control module 33 is used for controlling the current flowing through the TEC electronic thermostatic element 20; and, other heat generating devices than the TEC electronic thermostat 20 may be used instead.

The using method of the earcap comprises the following steps: the fitting sleeve 10 is attached to the headset 50 by the connecting mechanism 12 (as shown in fig. 11 and 12), and then worn on the head like wearing a headset. The earmuff can be designed to be universal and detachable, so that the earmuff can be applied to various headsets on the market.

The temperature adjusting method of the earmuff comprises the following steps of:

the presetting module 34 can preset a temperature value or a temperature range;

the temperature sensing element 31 senses the temperature of the earphone in real time and transmits a signal to the temperature reading module 32;

the temperature reading module 32 converts the read temperature signal into a temperature value, and transmits the temperature value to the control module 33;

the control module 33 compares the received temperature value with a preset temperature value or temperature range, and when the received temperature value is lower than the preset temperature value or temperature range, the control module judges that heating is needed; when the received temperature value is higher than a preset temperature value or temperature range, judging that refrigeration is needed; the heating or the cooling is realized by changing the current direction flowing through the TEC electronic thermostatic element 20 by the control module 33; the control module 33 realizes the adjustment of the heating or cooling efficiency by controlling the current flowing through the TEC electronic thermostatic element 20;

the TEC electronic thermostat 20 adjusts its heating end or cooling end according to the direction and magnitude of the current flowing through it to realize its own temperature rise or drop, and transmits the temperature to the temperature sensing element 31 in real time to form a temperature regulation closed-loop control circuit, and the whole temperature of the earphone is controlled within a preset temperature value or temperature range to realize a constant temperature state.

The design of the invention is characterized in that the temperature-adjusting earmuffs are designed aiming at the headset, and the earmuffs are combined with the headset; the temperature sensing element monitors the temperature of the earmuff in real time, and the TEC electronic constant temperature part is finely adjusted to heat or refrigerate according to a preset temperature value or a temperature range, so that the temperature of the earmuff fluctuates within a set temperature range. Through such a closed loop control by temperature change circuit design, realize the homothermal purpose of earmuff, make the user more comfortable wearing earphone in hot summer and chilly winter, improve the use experience nature of earphone.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiments according to the technical spirit of the present invention are within the technical scope of the present invention.

Claims (10)

1. The utility model provides a be applied to headphone's earmuff that adjusts temperature which characterized in that: the electronic constant temperature device comprises a fitting sleeve for fitting human ears, a TEC electronic constant temperature part and a PCB, wherein a matching space corresponding to the human ears is arranged on the fitting sleeve, and a connecting mechanism for connecting with a headset is arranged on one side of the fitting sleeve; the TEC electronic constant temperature part is arranged on the attaching sleeve and corresponds to the matching space, and a through hole which is convenient for sound to pass through and emit hot air or cold air is arranged on the TEC electronic constant temperature part; the PCB is arranged in the fitting sleeve, and is provided with a control module which is electrically connected with the TEC electronic constant temperature part to control the direction and the magnitude of current flowing through the TEC electronic constant temperature part so as to heat or refrigerate the TEC electronic constant temperature part.

2. The temperature-regulating earmuff for a headphone as defined in claim 1, wherein: the temperature sensing device is characterized by further comprising a temperature sensing element and a temperature reading module, wherein the temperature sensing element is arranged on the PCB and used for sensing the temperature of the earmuff, the temperature reading module is used for converting signals collected by the temperature sensing element into temperature values, the temperature sensing element is electrically connected with the temperature reading module, and the temperature reading module is electrically connected with the control module.

3. The temperature-regulating earmuff for a headphone as defined in claim 2, wherein: the PCB is provided with a preset module for presetting temperature, and the preset module is electrically connected with the control module.

4. The temperature-adjustable ear muff for a headphone according to claim 3, wherein: the PCB is provided with a power interface which extends out of the attaching sleeve.

5. The temperature-regulating earmuff for a headphone according to claim 4, wherein: the laminating cover is internally provided with a battery which is electrically connected with the PCB.

6. The temperature-adjustable ear muff for a headphone according to claim 3, wherein: the TEC electronic thermostatic element and the PCB are combined into a disc shape or a square shape.

7. The temperature-adjustable ear muff for a headphone according to claim 3, wherein: the bottom of the fitting sleeve is provided with a supporting plate for supporting the TEC electronic constant temperature part and the PCB; the connecting mechanism comprises a plurality of magnets which can be adsorbed on the outer side of the headset, and the magnets are fixed on the lower surface of the supporting plate.

8. The temperature-adjustable ear muff for a headphone according to claim 3, wherein: the fit sleeve comprises a flexible sleeve body and a tower-shaped bracket, the fit space is arranged in the middle of the flexible sleeve body, and an annular embedding groove is formed in the lower surface of the flexible sleeve body; the tower-shaped support comprises an annular attaching portion and an annular extending portion integrally connected to the annular attaching portion, the annular attaching portion is installed in an annular embedding groove, a plurality of hollow grooves are formed in the wall surface of the annular extending portion, an annular step is arranged at the top of the annular extending portion, and the TEC electronic constant temperature part is installed on the annular step and is right opposite to a matching space.

9. The temperature-regulating earmuff for a headphone according to claim 8, wherein: the connecting mechanism comprises a plurality of magnets which can be adsorbed on the outer side of the headset, and the magnets are fixed on the outer side wall of the annular attaching part.

10. A method of tempering an ear cap according to any of claims 3-9, characterized in that: the method comprises the following steps:

the preset module can preset a temperature value or a temperature range;

the temperature sensing element senses the temperature of the earphone in real time and transmits a signal to the temperature reading module;

the temperature reading module converts the read temperature signal into a temperature value and transmits the temperature value to the control module;

the control module compares the received temperature value with a preset temperature value or temperature range, and judges that heating is needed when the received temperature value is lower than the preset temperature value or temperature range; when the received temperature value is higher than a preset temperature value or temperature range, judging that refrigeration is needed; the heating or the cooling is realized by changing the direction of current flowing through the TEC electronic constant temperature part by the control module; the control module realizes the adjustment of heating or refrigerating efficiency by controlling the current flowing through the TEC electronic constant temperature part;

the TEC electronic constant temperature part adjusts the heating end or the refrigerating end of the TEC electronic constant temperature part according to the direction and the size of current flowing through the TEC electronic constant temperature part to realize self temperature rise or temperature drop, and transmits the temperature to the temperature sensing element in real time to form a temperature regulation closed-loop control circuit, and the integral temperature of the earphone is controlled within a preset temperature value or a preset temperature range to realize a constant temperature state.

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