CN215453239U - Temperature control earmuff and temperature control earphone thereof - Google Patents

Abstract

The utility model relates to a temperature control earmuff, which comprises a cover body and an earmuff, wherein a thermal insulation horn seat is clamped in the cover body, and a horn heat conducting piece is arranged on the inner ring of the thermal insulation horn seat, and is characterized in that a sound production assembly and a semiconductor refrigeration piece are connected on one side surface of the horn heat conducting piece far away from the earmuff, the temperature control earmuff also comprises a heat dissipation assembly, the heat dissipation assembly comprises a first annular heat conducting piece, a heat conducting piece and a plurality of heat dissipation pieces, the plurality of heat dissipation pieces are arranged on the first annular heat conducting piece, one side surface of the heat conducting piece is used for being connected with the first annular heat conducting piece, the other side surface of the heat conducting piece is tightly attached to the heating surface of the semiconductor refrigeration piece, the heat dissipation assembly is not in contact with the horn heat conducting piece, the earmuff comprises a heat conducting structure, the refrigeration surface of the semiconductor refrigeration piece transfers a cold source to the horn heat conducting piece and the heat conducting structure to realize refrigeration of the inner side of the earmuff, the earphone has the advantages of no noise, high heat transfer rate, no in-ear heating and sweating function, and also provides a temperature control earphone.

Description

Temperature control earmuff and temperature control earphone thereof

Technical Field

The utility model relates to the technical field of headsets, in particular to a temperature control earmuff and a temperature control headset thereof.

Background

The headphone has the sponge as sealed syllable-dividing ear muff, and better isolated interference has better sound experience.

However, when the ear cap is worn for a long time or in hot weather, the auricle is easy to generate heat and sweat due to good sealing performance between the auricle and the ear cap, which affects the comfort of the user and may hurt the ears.

In cold winter, the ears are easily affected by low temperature, the earphones are not controlled by the temperature, and the experience feeling at the low temperature is poor.

At present, mainly set up the temperature that the ear muff was adjusted to the semiconductor refrigeration piece in the ear muff of earphone, when the electric current passes through the semiconductor refrigeration piece, can lead to the both ends of semiconductor refrigeration piece to produce the heat transfer, thereby form hot junction and cold junction, and the position of hot junction and cold junction can be changed to the direction that changes the electric current, therefore, the ear muff that adopts the semiconductor refrigeration piece has the function of adjusting the temperature, however, because in the semiconductor refrigeration piece, when the difference in temperature of hot junction and cold junction reachd a definite value, reach the equilibrium point of heat transfer, the temperature in cold and hot junction no longer changes, then need strengthen the heat dissipation of hot junction when needing to reduce the cold junction temperature.

At present, the radiating mode of hot junction is including natural heat dissipation, the heat dissipation of dashing liquid, vacuum latent heat dissipation and strong wind heat dissipation, wherein, natural heat dissipation needs the unsuitable application of great heat radiating area on the earmuff, dash the liquid heat dissipation and need use liquid and provide liquid circulation's power device, can have the risk of destroying the earmuff and use more troublesome, and adopt the radiating mode of strong wind, need set up the fan, the fan can produce great noise, influence the use and feel, and the radiating mode of vacuum latent heat needs more heat pipes, the radiating efficiency is unsatisfactory, therefore, it is necessary to provide a temperature control earphone with suitable heat radiation structure, it can lead to the interior sweat that generates heat of ear to cause the use to feel not good to solve temperature control earphone, produce the noise and the low technical problem of heat transfer efficiency, furthermore, a temperature control earphone including the control by temperature is provided.

SUMMERY OF THE UTILITY MODEL

The first purpose of the utility model is to provide a temperature-controlled earmuff to solve the disadvantages in the prior art.

In order to achieve the purpose, the temperature control earmuff provided by the utility model comprises a cover body and an earmuff, wherein a thermal insulation horn seat is clamped in the cover body, a horn heat conducting piece is arranged on the inner ring of the thermal insulation horn seat, it is characterized in that one side surface of the horn heat conducting piece far away from the ear cap is connected with a sound production assembly and a semiconductor refrigeration piece, and the horn heat conducting piece also comprises a heat dissipation assembly, the heat dissipation assembly comprises a first annular heat conduction member, a heat conduction fin and a plurality of heat dissipation fins, the heat dissipation fins are arranged on the first annular heat conduction member, one side surface of the heat conducting sheet is used for connecting the first annular heat conducting piece, the other side surface of the heat conducting sheet is tightly attached to the heating surface of the semiconductor refrigerating sheet, the heat dissipation component is arranged without contacting with the horn heat conducting piece, the ear cap comprises a heat conducting structure, the refrigeration face of the semiconductor refrigeration piece transmits a cold source to the horn heat conducting piece and the heat conducting structure to realize refrigeration of the inner side of the earmuff.

Preferably, a function control circuit board is arranged in the cover body and used for controlling logic selection of a refrigerating or heating process, one end of the function control circuit board is connected with a power supply, and the other end of the function control circuit board is connected with the semiconductor refrigerating sheet.

Preferably, still include the heat conduction subassembly, the heat conduction subassembly includes second annular heat-conducting piece and heat-conducting piece, the one end of heat-conducting piece is used for connecting second annular heat-conducting piece, the other end is hugged closely the refrigeration face, second annular heat-conducting piece inlays to be established in the earmuff, and with heat conduction structure hugs closely, the refrigeration face is through transmitting the cold source for heat conduction subassembly and loudspeaker heat-conducting piece realize the inboard refrigeration of earmuff.

Preferably, the first annular heat-conducting member and the second annular heat-conducting member are heat pipes.

Preferably, each of the plurality of fins includes one of a U-shaped fin, a V-shaped fin, or a combination of both, and the opening of each fin faces the inside and/or the outside of the first annular heat-conducting member.

Preferably, a heat conduction layer is adhered to one side surface, away from the sound production assembly, of the horn heat conduction piece, and the heat conduction layer avoids the sound outlet hole in the horn heat conduction piece.

Preferably, the cover body is provided with a heat dissipation through hole.

Preferably, the cover body is made of heat conducting materials, and one end of each of the plurality of radiating fins is abutted to the inner side of the cover body.

Preferably, the cover body is close to the one end of earmuff is provided with magnet or magnetism and inhales the piece, the earmuff is close to the one end of the cover body is provided with magnetism and inhales piece or magnet, the cover body and earmuff realize dismantling the connection through magnetism.

The second purpose of the utility model is to provide a temperature control earphone, which is characterized by comprising a head band and any one of the temperature control earmuffs, wherein two ends of the head band are used for connecting the temperature control earmuffs, and the cover body and the head band are made of heat conducting materials.

The above-mentioned heat conductive materials include, but are not limited to, metal materials and heat conductive plastics, for example, aluminum materials.

The above-mentioned heat conducting structure includes, but is not limited to, heat conducting silicone.

The thermally conductive layer includes, but is not limited to, thermally conductive silicone.

Compared with the prior art, the utility model has the beneficial effects that:

the temperature control earphone adopts the mode of passive heat dissipation, and almost no noise, simultaneously, through the setting to the heat dissipation system improved heat transfer efficiency, solved the problem of noise, solved the not good problem of use sense that the sweat that generates heat caused in the ear simultaneously, still provided a temperature control earphone in addition, the temperature control earphone has noiselessness, and heat transfer efficiency is high, does not have the function of the sweat that generates heat in the ear.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a temperature control earphone according to an embodiment of the present invention;

fig. 2 is an exploded view of a temperature controlled earphone according to an embodiment of the present invention;

fig. 3 is a cross-sectional view of a temperature-controlled earphone according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a first heat dissipation assembly of a temperature control earphone according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a speaker base of a temperature control earphone according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of a heat pipe support of a temperature control earphone according to an embodiment of the present invention.

The reference numbers illustrate:

the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.

In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

In the embodiment of the present invention, referring to fig. 1 to 6, a temperature control earmuff 3 is disclosed, which includes a cover 32 and an earmuff 310, a thermal insulation speaker holder 36 is clamped in the cover 32, a speaker heat conducting member 361 is disposed in an inner ring of the thermal insulation speaker holder 36, a sound generating component 34 and a semiconductor cooling fin 35 are connected to a side surface of the speaker heat conducting member 361 away from the earmuff 310, a sound generating direction of the sound generating component 34 faces the earmuff 310, in addition, the temperature control earmuff further includes a heat dissipating component 33 and a heat conducting component 37, the heat dissipating component 33 includes a first annular heat conducting member 332, a first heat conducting fin 331 and a plurality of heat dissipating fins 333, the plurality of heat dissipating fins 333 are disposed on the first annular heat conducting member 332, a side surface of the first heat conducting fin 331 is used for connecting the first annular heat conducting member 332, another side surface of the first heat conducting fin is tightly attached to a heating surface of the semiconductor cooling fin 35, the heat dissipating component 33 is not in contact with the speaker heat conducting member 361, the earmuff 310 comprises a heat conducting structure 3101, and the refrigerating surface of the semiconductor refrigerating sheet 35 transfers a cold source to the horn heat conducting piece 361 and the heat conducting structure 3101 to realize the refrigeration of the inner side of the earmuff 310.

It should be noted that the semiconductor chilling plate 35 is prior art, and the temperature adjustment and structure are not described in detail here.

Through heat dissipation assembly 33's structure sets up the realization heat dissipation in order to realize earmuff 310's refrigeration need not adopt the fan as the radiator, noise abatement, in addition, heat dissipation assembly 33's setting has improved the refrigeration of the airtight space that control by temperature change ear muff 3 and ear formed to make the no heat of production sweat phenomenon take place in the ear, promote consumer's comfort.

In some embodiments of the present invention, the size of the first heat conducting plate 331 is matched with the size of the semiconductor chilling plate 35, and the heat conducting plate is used to conduct heat between the semiconductor chilling plate 35 and the first annular heat conducting member 332, so as to increase the heat conducting area, reduce the number of heat pipes, and facilitate to reduce the cost and improve the heat conducting efficiency. It should be noted that, in some embodiments of the present invention, the first heat conduction plate 331 and the first annular heat conduction member 332 are fixedly connected, and in other embodiments of the present invention, the first heat conduction plate 331 and the first annular heat conduction member 332 are detachably connected.

In some embodiments of the present invention, mounting columns are disposed on two sides of the second mounting groove 363, and the first heat conduction sheet 331 is connected to the mounting columns, so that the heating surface and the first heat conduction sheet 331 are attached to each other, thereby achieving heat transfer.

In some embodiments of the present invention, a function control circuit board (not shown in the figure) is disposed in the cover body 32, and is used for controlling logic selection of a refrigeration or heating process, one end of the function control circuit board is connected to a power supply, and the other end of the function control circuit board is connected to the semiconductor refrigeration sheet 35.

In some embodiments of the present invention, the heat conducting assembly 37 further includes a second annular heat conducting member 371 and a heat conducting member 372, one end of the heat conducting member 372 is used for connecting the second annular heat conducting member 371, and the other end is tightly attached to the cooling surface, the second annular heat conducting member 371 is embedded in the ear cap 310 and tightly attached to the heat conducting structure 3101 to realize cooling inside the ear cap 310, and the cooling surface realizes cooling inside the ear cap 310 by transferring a cold source to the heat conducting member 37 and the horn heat conducting member 361.

In some embodiments of the present invention, the heat conducting structure 3101 includes a heat conducting silica gel, the heat conducting structure 3101 is disposed inside the ear cap 310 on a side close to the inner cavity of the ear cap 310, the heat conducting structure 3101 is not in contact with the cover 32, and in addition, the ear cap 310, the thermally insulated speaker holder 36, the speaker heat conducting member 361 and the human body form a closed space, which can be cooled.

In some embodiments of the present invention, a first mounting groove 362 and a second mounting groove 363 are disposed on a side surface of the horn heat conducting member 361, the second mounting groove 363 partially extends to the thermally insulated horn base 36, the semiconductor cooling plate 35 is adapted to the second mounting groove 363 and disposed in the second mounting groove 363, the sound generating component 34 is disposed in the first mounting groove 362, and a sound outlet 3621 is disposed at a bottom of the first mounting groove 362 for sound transmission of the sound generating component 34.

In some embodiments of the present invention, a connecting through hole 3631 is disposed at a bottom of the second mounting groove 363, the connecting through hole 3631 is disposed on the thermally insulating horn base 36, one end of the heat conducting member 372 passes through the connecting through hole 3631 to be closely attached to the cooling surface, one end of the heat conducting member 372 is a second heat conducting plate 3721, the second heat conducting plate 3721 is adapted to the semiconductor cooling plate 35, one surface of the second heat conducting plate 3721 is closely attached to the cooling surface, and the other surface of the second heat conducting plate 3721 is closely attached to the horn heat conducting member 361, so that the cooling surface transfers a cold source to the second heat conducting plate 3721, the second heat conducting plate 3721 transfers the cold source to the second annular heat conducting member 371 on one hand, transfers the cold source to the horn heat conducting member 361 on the other hand to achieve cooling, and the second annular heat conducting member 371 and the horn heat conducting member 361 transfer to the heat conducting structure 3101 on the other hand.

It should be noted that the first annular heat conducting member 332 and the second annular heat conducting member 371 include, but are not limited to, a heat pipe and a metal heat conducting pipe, such as a copper pipe.

In some embodiments of the present invention, the first annular heat conducting member 332 and the second annular heat conducting member 371 are heat pipes, the heat pipes are arranged to accelerate the heat conduction effect, in some embodiments of the present invention, in order to enhance the protection of the heat pipes, an ear cap bracket 39 is arranged in the ear cap 310, a clamping groove 391 is arranged on one side of the ear cap bracket 39 close to the semiconductor refrigeration sheet 35, a part of the structure of one end of the heat conducting member 372 is connected to the second annular heat conducting member 371, another part of the structure is clamped in the clamping groove 391, the second annular heat conducting member 371 is arranged inside the ear cap bracket 39, the ear cap bracket 39 is clamped into the ear cap 310 after the heat conducting member 37 is clamped, and a support member 373 is connected to the second annular heat conducting member 371 for the stability of the assembled second annular heat conducting member 371. In some embodiments of the present invention, the number of the supporting members 373 is 3, and the supporting members 373 are uniformly distributed on the second annular heat-conducting member 371, in other embodiments of the present invention, the number of the supporting members 373 can be other numbers, for example, 1, 2, 3, and the supporting members 373 can be non-uniformly distributed.

It should be noted that the plurality of fins 333 includes a plurality of parallel fins, a plurality of non-parallel fins, and a plurality of intersecting fins, the cross section of the plurality of intersecting fins includes a V shape, and a plurality of parallel or non-parallel fins connected by fins, such as U-shaped fins, the U-shaped fins include U-shaped fins having parallel opposite sides and also include U-shaped fins having non-parallel opposite sides, such as U-shaped fins having a trapezoidal cross section, and the arrangement of the plurality of fins 333 affects the heat dissipation efficiency.

In some embodiments of the present invention, each of the plurality of fins 333 is one of a U-shaped fin, a V-shaped fin, or a combination of both, and the opening of each fin faces the inner side and/or the outer side of the first annular heat conducting member 332, which provides better heat dissipation and can reduce the weight of the temperature-controlled earmuff 3.

It should be noted that, in the embodiment of the present invention, the openings of the U-shaped fins are sequentially and oppositely formed into the plurality of fins 333 integrally, and in other embodiments of the present invention, the U-shaped fins are not connected to each other, and the directions of the openings are the same or opposite.

In some embodiments of the present invention, a heat conducting layer (not labeled) is adhered to a side of the horn heat conducting member 361 away from the sound generating assembly 34, and the heat conducting layer avoids the sound outlet holes 3621 of the horn heat conducting member 361, and in some embodiments, the heat conducting layer is a heat conducting silicone.

The heat dissipation speed is related to the air flow, in some embodiments of the present invention, the cover 32 is provided with a heat dissipation through hole 321, the position of the heat dissipation through hole 321 is matched with the heat dissipation assembly 33, in some embodiments of the present invention, the heat dissipation through hole 321 is disposed on the side of one end of the cover 32 away from the earmuff 310, mainly in the present invention, a metal decoration 31 is disposed on the top end of one end of the cover 32 away from the earmuff 310, the metal decoration 31 is used for decorating the earmuff and can promote to improve the heat transfer efficiency by matching with the cover 32, and the installation manner of the metal decoration 31 includes, but is not limited to, gluing and integral molding.

In some embodiments of the present invention, the cover 32 is made of a heat conductive material, including but not limited to metal and heat conductive plastic, and one end of the plurality of fins 333 abuts against the inner side of the cover 32, which further increases the heat dissipation efficiency.

Since the earmuffs are consumable items, it is necessary to provide the mask body 32 and the earmuffs 310 to be detachably connected as a further optimization.

In the embodiment of the present invention, a magnetic suction manner is selected to detachably connect the cover body 32 and the earmuff 310, a magnet 38 or a magnetic suction member is disposed at one end of the cover body 32 close to the earmuff 310, a magnetic suction member or a magnet 38 is disposed at one end of the earmuff 310 close to the cover body 32, the cover body 32 and the earmuff 310 are detachably connected by magnetic suction, the magnet 38 includes but is not limited to a magnet, the magnetic suction member includes but is not limited to a metal and a magnet having a magnetic polarity opposite to that of the magnet 38, in some embodiments of the present invention, the magnet 38 is disposed inside the cover body 32, the magnetic suction member is disposed inside the earmuff 310, the number of the magnets 38 is 6, the magnets are uniformly distributed on the cover body 32, and the number of the magnetic suction members is also 6 (the magnetic suction members are not labeled in the drawing).

In some embodiments of the present invention, a third mounting groove 364 is disposed on the heat conducting speaker holder 36, a fourth mounting groove 392 is disposed on a side of the earcap holder 39 away from the cover body 32, and the third mounting groove 364 and the fourth mounting groove 392 are used for mounting the magnet 38 or a magnetic element, so that the magnetic element is selected to avoid the damage of the snap form to the structure of the temperature-controlling earmuff 3, which affects the service life and the cooling effect or the heating effect.

In some embodiments of the present invention, the heat conducting member 372 includes a connecting arm and a second heat conducting plate 3721, the connecting arm includes a first connecting arm 3722 and a second connecting arm 3723, the first connecting arm 3722 is fixedly connected to the second heat conducting plate 3721, the second connecting arm 3723 is fixedly connected to the second annular heat conducting member 371, the first connecting arm 3722 is not connected to the second connecting arm 3723, the first connecting arm 3722 and the second connecting arm 3723 are spliced in the connecting through hole 3631 for conducting heat, the second heat conducting plate 3721 is adapted to the size of the semiconductor cooling plate 35, the connecting through hole 3631 is adapted to the first connecting arm 3722, when assembling, the second heat conducting plate 3721 is placed in the second mounting groove 363, one side surface is attached to the cooling surface, the other side surface is attached to the horn heat conducting member 361, the cold source of the cooling surface is transferred to the second heat conducting plate 3721, on the one hand, the cold source is transmitted to the second annular heat conducting member 371 through the connecting arm, on the other hand, the cold source is transmitted to the horn heat conducting member 361, and the above arrangement is used to embed the second annular heat conducting member 371 in the ear cap 310, and to set the cover 32 and the ear cap 310 to be detachable, so that when the ear cap 310 is replaced, only the ear cap support 39, the second annular heat conducting member 371 and the second connecting arm 3723 are discarded, and the loss is low.

The utility model also provides a temperature control earphone, which comprises a head band 1 and any one of the temperature control earmuffs 3, wherein two ends of the head band 1 are used for connecting the temperature control earmuffs 3, in some embodiments of the utility model, the head band 1 comprises a temperature control earphone connecting piece 2, the connection between the head band 1 and the temperature control earphone 3 is realized through the temperature control earphone connecting piece 2, the cover body 32 and the head band 1 are made of heat conducting materials, and the heat conducting materials include but are not limited to metal materials and heat conducting plastics.

It should be noted that, through tests on the temperature-controlled earphone and the temperature-controlled earphone obtained in the embodiment of the present invention, the surface temperature of the cold end of the semiconductor refrigeration sheet 35 may be lower by about 20 degrees than the room temperature when no load is applied, after the refrigeration effect is turned on for 30 seconds, the internal temperature of the earmuff has a significant cooling effect, and compared with the case without a cooling system, the covering portion of the freezing earmuff has no sweating or stuffiness sensation.

The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the technical solutions of the present invention, which are made by using the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (10)

1. A temperature control earmuff comprises a cover body and an earmuff, wherein a thermal insulation horn seat is clamped in the cover body, a horn heat conducting piece is arranged on the inner ring of the thermal insulation horn seat, it is characterized in that one side surface of the horn heat conducting piece far away from the ear cap is connected with a sound production assembly and a semiconductor refrigeration piece, and the horn heat conducting piece also comprises a heat dissipation assembly, the heat dissipation assembly comprises a first annular heat conduction member, a heat conduction fin and a plurality of heat dissipation fins, the heat dissipation fins are arranged on the first annular heat conduction member, one side surface of the heat conducting sheet is used for connecting the first annular heat conducting piece, the other side surface of the heat conducting sheet is tightly attached to the heating surface of the semiconductor refrigerating sheet, the heat dissipation component is arranged without contacting with the horn heat conducting piece, the ear cap comprises a heat conducting structure, the refrigeration face of the semiconductor refrigeration piece transmits a cold source to the horn heat conducting piece and the heat conducting structure to realize refrigeration of the inner side of the earmuff.

2. The ear muff of claim 1, wherein a function control circuit board is provided in the body for controlling logic selection of cooling or heating process, one end of the function control circuit board is connected to a power supply, and the other end of the function control circuit board is connected to the semiconductor cooling plate.

3. The temperature-control earmuff of claim 1, further comprising a heat conducting assembly, wherein the heat conducting assembly comprises a second annular heat conducting member and a heat conducting member, one end of the heat conducting member is used for being connected with the second annular heat conducting member, the other end of the heat conducting member is tightly attached to the refrigerating surface, the second annular heat conducting member is embedded in the earmuff and is tightly attached to the heat conducting structure, and the refrigerating surface realizes refrigeration inside the earmuff by transferring a cold source to the heat conducting assembly and the horn heat conducting member.

4. The temperature-controlling earmuff of claim 3, wherein the first and second annular heat-conducting members are heat pipes.

5. The temperature-controlling ear muff of claim 1, wherein each fin of the plurality of fins comprises one or a combination of U-shaped fins, V-shaped fins, and wherein each fin is open to the inside and/or outside of the first annular heat-conducting member.

6. The temperature-controlled earmuff of claim 1, wherein a heat conducting layer is adhered to a side of the horn heat conducting member remote from the sound generating assembly, the heat conducting layer avoiding the sound outlet of the horn heat conducting member.

7. The temperature-control earmuff of claim 1, wherein the cover body is provided with heat dissipating through holes.

8. The temperature-controlled earmuff of claim 1, wherein the cover is a thermally conductive material, and one end of the plurality of fins abuts against an inner side of the cover.

9. The temperature-control earmuff according to any one of claims 1-8, wherein the earmuff has a magnet or magnetic attraction member at the end of the earmuff close to the earmuff, the magnetic attraction member or magnet at the end of the earmuff close to the earmuff, and the earmuff are detachably connected by magnetic attraction.

10. A temperature-controlled earphone, comprising a head band and the temperature-controlled earmuffs of any one of claims 1-9, wherein the two ends of the head band are used for connecting the temperature-controlled earmuffs, and the cover body and the head band are made of heat-conducting materials.

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