CN210405596U

CN210405596U - Headset with refrigeration function

Info

Publication number: CN210405596U
Application number: CN201921073811.9U
Authority: CN
Inventors: 杨志豪; 杨坤; 杨贇
Original assignee: Desheng Electronic Technology (shenzhen) Co Ltd
Current assignee: Desheng Electronic Technology (shenzhen) Co Ltd
Priority date: 2019-07-10
Filing date: 2019-07-10
Publication date: 2020-04-24
Anticipated expiration: 2029-07-10

Abstract

The utility model discloses a headphone with refrigeration function. The earphone comprises an earphone rear shell (1), a loudspeaker assembly (2), an earmuff (3), a circuit board (4) and a refrigeration assembly (5); the ear muffs (3) are connected to the rear shell (1) of the earphone; the earphone rear shell (1) forms an accommodating cavity, the loudspeaker component (2) and the circuit board (4) are arranged in the accommodating cavity formed by the earphone rear shell (1), and the sound emitting direction of the loudspeaker component (2) faces towards the earmuff (3); the loudspeaker component (2) is connected with the circuit board (4); the refrigerating assembly (5) is used for refrigerating the earmuffs (3). This headphone has the refrigeration function, can effectively solve and wear this headphone in-process and appear auricle heating or the problem of perspiring, has avoided the influence that the degree of concentration produced to the wearer, reduces the injury to human ear, and the length is prolonged when making this headphone wear, has hommization and individuality.

Description

Headset with refrigeration function

Technical Field

The utility model relates to a headphone technical field, concretely relates to headphone with refrigeration function.

Background

The headset is convenient to use and cannot affect other people. Moreover, the wearing of the headset does not need to go into the ear relative to the in-ear headset, thereby avoiding scratching the auditory canal; meanwhile, the sound field is good, the comfort level is high, the audible time is longer, and the sound quality effect of sound is achieved, so that the headset has wide application.

However, in the process of wearing the headset for a long time, friction is generated between the auricle and the earmuff, and meanwhile, the loudspeaker diaphragm vibrates mechanically to generate heat, or in a high-temperature environment, the auricle is easy to generate heat, and because of the closed space between the auricle and the earmuff, the auricle is easy to generate heat or even sweat, so that the experience of a wearer is influenced. Especially for game enthusiasts, music enthusiasts, professional computer athletes and student crowds who study and wear for a long time, the concentration degree can be seriously influenced, the effect brought by wearing the headset can not be achieved, and the wearable time of the headset is shortened. Moreover, heat is generated in the auricle and accumulated for a long time, which is easy to cause damage to the ears of the human body, further reducing the wearable time of the headset.

Disclosure of Invention

An object of the utility model is to provide a headphone with refrigeration function to the defect or not enough that exist among the prior art. The utility model discloses a headphone has the refrigeration function, can effectively solve and wear this headphone in-process auricle and generate heat or the problem of perspiring appear, has avoided because of wearing the influence that the degree of being absorbed in to the wearer produced that generates heat or perspire that headphone leads to reduce the injury to human ear, wear the comfort level height, make this headphone wear long extension when wearing simultaneously, have hommization and individuality.

The purpose of the utility model is realized through the following technical scheme.

A headset with a refrigeration function comprises a headset rear shell, a loudspeaker assembly, earmuffs, a circuit board and a refrigeration assembly;

the ear cap is connected to the rear shell of the earphone; the earphone rear shell forms an accommodating cavity, the loudspeaker assembly and the circuit board are both arranged in the accommodating cavity formed by the earphone rear shell, and the sound emitting direction of the loudspeaker assembly faces towards the earmuff; the loudspeaker assembly is connected with the circuit board; the refrigeration assembly is used for refrigerating the earmuff.

Preferably, the refrigeration assembly comprises a refrigeration chip and a cold conducting plate;

the refrigeration chip is used for generating a cold source and transmitting the cold source to the cold guide plate; the cold guide plate is used for transmitting a cold source from the refrigeration chip to the earmuff for refrigeration.

More preferably, the refrigeration chip is selected from the group consisting of semiconductor refrigeration chips.

More preferably, the circuit board is provided with a power supply circuit of the refrigeration chip; the refrigeration chip is connected with the circuit board.

More preferably, the refrigeration chip and the cold conducting plate are both arranged in an accommodating cavity formed by the earphone rear shell; the refrigeration chip is arranged on one side surface of the cold guide plate in a clinging manner; the edge of the cold conduction plate extends along the direction departing from one side of the refrigeration chip and is in contact with the ear cap.

Further preferably, a heat conducting paste is arranged between the refrigeration chip and the heat conducting plate for conducting heat.

Still further preferably, the extension part of the cold conducting plate is filled with a first cold storage body.

Still further preferably, a radiator is arranged on one side of the refrigeration chip, which is away from the cold conducting plate.

Further preferably, the radiator and the refrigeration chip are arranged in a close fit manner, and a heat conducting paste is arranged between the refrigeration chip and the radiator for conducting heat.

Still further preferably, a heat dissipation fan is disposed on a side of the heat sink facing away from the refrigeration chip.

Still further preferably, a heat dissipation net is arranged on the rear shell of the earphone and corresponding to the heat dissipation fan.

Preferably, the horn assembly comprises a horn rear cavity, a horn front cavity and a horn;

the horn is accommodated in a cavity formed by the matched die of the horn rear cavity and the horn front cavity; the loudspeaker is connected with the circuit board; the sound emitting direction of the horn faces to the horn front cavity; and the front cavity of the horn is provided with a sound transmission hole.

Preferably, the second cold accumulation body is filled in the ear sleeve.

Compared with the prior art, the utility model has the advantages of as follows and beneficial effect:

(1) the utility model discloses a headphone has the refrigeration function, can effectively solve and wear this headphone in-process auricle and generate heat or the problem of perspiring appear, has avoided because of wearing the influence that the degree of being absorbed in to the wearer produced that generates heat or perspire that headphone leads to reduce the injury to human ear, make this headphone wear prolong when wearing simultaneously, have hommization and individuality.

(2) The utility model discloses an among the headphone, it has the cold-storage body all to fill in cold drawing and the earmuff, can carry out effective storage and keep in the transmission process to refrigerated cold source to the low temperature after making the refrigeration process slowly changeable and refrigeration can keep lasting, has avoided the transient change of cold and hot in the refrigeration process and produces injury or influence wearer's comfort level to human ear easily, and further be favorable to making this headphone can wear long extension.

(3) The utility model discloses an among the headphone, radiator and radiator fan can in time take away the heat that produces in the refrigeration chip refrigeration process and discharge outside the earphone, have avoided gathering of heat in the earphone and influence the normal work of earphone and refrigeration chip, have ensured the life of whole earphone and refrigeration chip.

Drawings

Fig. 1 is a schematic view of an overall structure of a headphone with a cooling function according to embodiment 1 of the present invention;

fig. 2 is a schematic view of an overall assembly structure of a headphone with a cooling function according to embodiment 1 of the present invention;

fig. 3 is a schematic cross-sectional view of the whole of the headphone with a cooling function according to embodiment 1 of the present invention;

fig. 4 is a schematic cross-sectional view of the whole of the headphone with a cooling function according to embodiment 2 of the present invention;

fig. 5 is a schematic view of an overall structure of a headphone with a cooling function according to embodiment 3 of the present invention;

fig. 6 is a schematic view of an overall assembly structure of a headphone with a cooling function according to embodiment 3 of the present invention;

fig. 7 is a schematic cross-sectional view of a headphone with a cooling function according to embodiment 3;

fig. 8 is a schematic cross-sectional view of the whole of the headphone with a cooling function according to embodiment 4 of the present invention;

the attached drawings are marked as follows: 1-earphone rear shell, 101-audio output port, 102-head-wearing combined hole, 11-radiator mesh, 2-loudspeaker component, 21-loudspeaker rear cavity, 22-loudspeaker front cavity, 23-loudspeaker, 3-earmuff, 31-second cold accumulation body, 4-circuit board, 5-refrigeration component, 51-refrigeration chip, 52-cold guide plate, 5201-cold guide plate body, 5202-cold guide plate extension part, 521-first cold accumulation body, 53-radiator, 54-radiator fan, 55-heat conduction paste and 6-refrigeration switch.

Detailed Description

The technical solution of the present invention will be described in further detail with reference to the following specific embodiments and accompanying drawings, but the scope of protection and the implementation of the present invention are not limited thereto. In the description of the embodiments of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", and the like refer to the orientation or position relationship shown in the drawings, or the orientation or position relationship that the product of the present invention is usually placed when in use, or are only used for distinguishing the description, and are only used for convenience of description and simplification of the description, but do not indicate or imply that the device or element that is referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore, should not be interpreted as limiting the present invention, nor indicating or implying relative importance.

Example 1

Referring to fig. 1 to 3, the present embodiment is a headset with a cooling function. The headset comprises a headset rear shell 1, a speaker assembly 2, an earmuff 3, a circuit board 4 and a refrigeration assembly 5.

Wherein, the earmuff 3 is connected on the earphone rear shell 1, and when the earphone is worn, the earmuff 3 is directly contacted with the periphery of the auricle of the human body. The edge of the back shell 1 of the headset extends perpendicularly towards the ear muffs 3, so that the back shell 1 of the headset forms an unclosed accommodating cavity. Loudspeaker subassembly 2 with circuit board 4 all sets up the intracavity that holds that earphone backshell 1 formed, just loudspeaker subassembly 2's the direction orientation of making a sound earmuff 3. Also, the horn assembly 2 is connected to the circuit board 4.

The earphone rear case 1 is further provided with an audio output port 101 and a headphone coupling hole 102. Through the audio output port 101, the earphone can be connected with an external earphone line to be connected with external equipment including a tablet, a computer or a mobile phone, so that audio transmission is realized. And the head-wearing combination hole 102 is used for combining with the head-wearing of the head-wearing part to form an integral headphone device including the head-wearing part.

Specifically, in this embodiment, the horn assembly 2 includes a rear horn cavity 21, a front horn cavity 22, and a horn 23. The horn 23 is accommodated in a cavity formed by the matched mold of the horn rear cavity 21 and the horn front cavity 22; in addition, specifically, the speaker 23 is connected to the circuit board 4, and the circuit board 4 has a sound signal transmission circuit and a power supply circuit including the speaker 23, so as to transmit and supply a sound signal to the speaker 23. The sound emitting direction of the horn 23 faces the horn front cavity 22; the front cavity 22 of the horn is provided with a sound transmitting hole for transmitting the sound of the horn 23.

The refrigerating assembly 5 is used for refrigerating the earmuffs 3, and particularly generates a cold source for the refrigerating assembly 5 and transmits the cold source to the earmuffs 3, so that the earmuffs 3 are refrigerated. The ear muffs 3 are refrigerated through the refrigerating assembly 5, so that the ear muffs 3 can keep a lower temperature, and the lower temperature of the ear muffs 3 can cool the closed space between the auricle and the ear muffs 3. Thereby can effectively solve the problem that the auricle generates heat or perspires that appears wearing this headphone in-process, avoid because of wearing the influence that the generating heat or perspire that headphone leads to and concentrate on the degree production to the wearer to reduce the injury to human ear, the comfortable degree of experience of in-process is higher to the cooling effect messenger of auricle to ear cover 3 simultaneously, and the length of time extension is worn to make this headphone, makes this headphone have hommization and individuality.

The ear muffs 3 are filled with a second regenerator 31. The outer layer of the ear cap 3 is an ear cap outer cover, and the second cold storage body 31 is filled in the ear cap outer cover. In an optional embodiment, the second cold storage body 31 is selected from a thermal insulation material body including silicone grease or sponge, the second cold storage body 31 can absorb and store the cold source transferred to the earmuff 3, so that the cold source on the earmuff 3 is not transferred immediately, the refrigeration process of the earmuff 3 can be changed slowly, the low temperature of the earmuff 3 after refrigeration can be kept lasting, the damage to the ears of the human body or the comfort of a wearer caused by the transient change of cold and heat in the refrigeration process is avoided, and the wearable duration of the headset is further prolonged.

Referring to fig. 2 and 3, the cooling module 5 includes a cooling chip 51 and a cooling guide plate 52. In an alternative embodiment, the refrigeration chip 51 is selected from the group consisting of semiconductor refrigeration chips. The refrigeration chip 51 is used for generating a cold source, generating the cold source through a thermoelectric effect, and transmitting the cold source to the cold conducting plate 52; and the cold conducting plate 52 is used for transferring the cold source from the refrigeration chip 51 to the ear cap 3, so as to refrigerate the ear cap 3.

Further, the circuit board 4 is provided with a power supply circuit of the refrigeration chip 51, the refrigeration chip 51 is connected with the circuit board 4, and the refrigeration chip 51 supplies power through the circuit board 4. And, the refrigeration switch 6 is arranged on the connection line of the refrigeration chip 51 and the circuit board 4, and is used for directly controlling the on-off of the refrigeration chip 51, so that the refrigeration process of the earmuff 3 can be conveniently and rapidly controlled. In an alternative embodiment, the cooling switch 6 is arranged on the outer surface of the earphone rear housing 1, further improving the control convenience of the cooling process.

In this embodiment, the refrigeration chip 51 and the cold conducting plate 52 are both disposed in an accommodating cavity formed in the rear shell 1 of the earphone; the refrigeration chip 51 is arranged on one side surface of the cold conducting plate 52 in a clinging manner; the edge of the cold conducting plate 52 extends in a direction away from the side of the refrigeration chip 51 and contacts the ear loops 3. And the circuit board 4 is arranged on one side of the horn rear cavity 21, which is far away from the horn 23, and the refrigeration chip 51 is connected with the circuit board 4 through a wiring which penetrates through the cold guide plate 52.

Specifically, in the present embodiment, the cold conducting plate 52 and the refrigeration chip 51 are both disposed in the accommodating cavity formed by the earphone rear shell 1 and located on the side of the speaker assembly 2 away from the ear muff 3. Further, specifically, the cold guide plate 52 includes a cold guide plate body 5201 and a cold guide plate extension 5202. The refrigeration chip 51 is closely arranged on the surface of the cold conducting plate 52 on the side away from the earmuff 3, and the heat conducting paste 55 is arranged on the surface of the refrigeration chip 51 closely contacted with the cold conducting plate 52, so that high-efficiency heat conduction efficiency is realized. The edge of the cold guide plate body 5201 extends along the direction away from the side where the refrigeration chip 51 is located (i.e. the direction toward the ear cap 3) to form a cold guide plate extension 5202, and the end of the cold guide plate extension 5202 contacts with the ear cap 3, and the speaker assembly 2 is enclosed in a non-closed cavity formed by the cold guide plate body 5201 of the cold guide plate 52 and the cold guide plate extension 5202 together.

When refrigeration subassembly 5 refrigerates the work to earmuff 3, refrigeration chip 51 is refrigerated by circuit board 4 transmission circuit and through thermoelectric effect and is produced the cold source, the cold source that refrigeration chip 51 refrigerates and produces is transmitted to leading cold plate 52 through heat-conduction on, and lead cold plate 52 and pass through heat-conduction transmission to earmuff 3 with the cold source of receiving again, earmuff 3 receives the cold source, and absorb and save the save to the cold source of transmitting to earmuff 3 through its inside second cold-storage body 3.

Further, a heat sink 53 is disposed on a side of the cooling chip 51 away from the cold conducting plate 52. Specifically, the cold end of the refrigeration chip 51 is in contact with the cold guide plate 52 to conduct heat conduction for refrigeration, the heat end of the refrigeration chip 51 is provided with the radiator 53, and a heat source generated by the refrigeration chip 51 in the working process is conducted to the radiator 53 to dissipate heat, so that the problem that the working efficiency is affected due to overhigh temperature accumulation of the heat end of the refrigeration chip 51 in the working process is avoided.

In this embodiment, the heat sink 53 is fixedly mounted on the cold conducting plate 52 by the cooperation of screws and heat insulating spacers, and the cold conducting plate 52 and the heat sink 53 cooperate with each other to tightly fix the refrigeration chip 51 therebetween.

Further, a thermal conductive paste 55 is provided between the surfaces of the cooling chip 51 and the heat sink 53, so as to achieve high thermal conduction efficiency.

Example 2

The present embodiment is the same as embodiment 1, except that, further, as shown in fig. 4, the extension portion of the cold conducting plate 52 is filled with a first cold storage body 521.

The first cold accumulation body 521 is filled in the cold guiding plate extension portion 5202, and in the process that the cold guiding plate 52 conducts the cold source from the refrigeration chip 51, the cold source is conducted from the refrigeration chip 51 to the cold guiding plate body 5201, and then conducted from the cold guiding plate body 5201 to the cold guiding plate extension portion 5202. And when cold source conduction arrived at leading cold drawing extension 5202, lead the cold storage body 521 in the cold drawing extension 5202 can absorb and save the cold source of conduction to leading cold drawing extension 5202, and can not conduct the cold source to earmuff 3 rapidly, make the refrigeration process to earmuff 3 slowly changeable, can not make and cool down earmuff 3 rapidly, avoided the transient change of cold and hot in the refrigeration process and produced injury or influence wearer's comfort level to human ear easily, and further be favorable to making this headphone can wear the time length extension.

In an alternative embodiment, the first cool storage body 521 is selected from a thermal insulation material body including silica gel or sponge.

Example 3

In this embodiment, the same as embodiment 1 or embodiment 2, and further, as shown in fig. 5 to fig. 7, a heat dissipation fan 54 is disposed on a side of the heat sink 53 facing away from the cooling chip 51. The heat dissipation fan 54 is a micro heat dissipation fan, and can be conveniently accommodated and installed in the earphone. The heat dissipation fan 54 can suck and exhaust the air rich in heat around the heat sink 53, so as to avoid the influence of the over-high ambient temperature of the heat sink 53 on the working efficiency of the heat sink 53, thereby indirectly ensuring the working efficiency of the cooling chip 51.

In this embodiment, the heat dissipation fan 54 is connected to the circuit board 4, the circuit board 4 has a power supply circuit of the heat dissipation fan 54, and the heat dissipation fan 54 supplies power through the circuit board 4.

Specifically, the cooling fan 54 is fixed to the cold guide plate 52 together with the heat sink 53 by screws and heat insulating spacers.

Further, a heat dissipation net 11 is disposed on the earphone rear housing 1 corresponding to the heat dissipation fan 54, specifically, in this embodiment, the heat dissipation net 11 is disposed on the back of the earphone rear housing 1. When the refrigeration chip 51 performs refrigeration, the heat dissipation fan 54 sucks the air rich in heat around the heat sink 53 and discharges the air to the outside of the earphone through the heat dissipation net 11, so that the normal operation of the earphone and the refrigeration chip 51 is prevented from being influenced by the accumulation of heat in the earphone, and the service life of the whole earphone and the refrigeration chip is ensured.

Example 4

The present embodiment is the same as embodiment 3, and further, as shown in fig. 8, the extension portion of the cold conducting plate 52 is filled with the first cold storage body 521, so that the refrigeration process of the earmuff 3 can be changed slowly, rapid cooling of the earmuff 3 cannot be caused, damage to the ears of the human body or influence on the comfort level of the wearer due to transient changes of cold and heat in the refrigeration process is avoided, and the wearable duration of the headphone is further prolonged.

The above embodiments are merely preferred embodiments of the present invention, and only lie in further detailed description of the technical solutions of the present invention, but the protection scope and the implementation manner of the present invention are not limited thereto, and any changes, combinations, deletions, replacements, or modifications that do not depart from the spirit and principles of the present invention will be included in the protection scope of the present invention.

Claims

1. A headset with a refrigeration function is characterized by comprising a headset rear shell (1), a loudspeaker assembly (2), an earmuff (3), a circuit board (4) and a refrigeration assembly (5);

the earmuffs (3) are connected to the earphone rear shell (1); the earphone rear shell (1) forms an accommodating cavity, the loudspeaker component (2) and the circuit board (4) are arranged in the accommodating cavity formed by the earphone rear shell (1), and the sound emitting direction of the loudspeaker component (2) faces towards the earmuff (3); the loudspeaker component (2) is connected with the circuit board (4); the refrigerating assembly (5) is used for refrigerating the earmuffs (3).

2. A headset with a cooling function according to claim 1, characterized in that the cooling assembly (5) comprises a cooling chip (51) and a cold conducting plate (52);

the refrigeration chip (51) is used for generating a cold source and transferring the cold source to the cold guide plate (52); the cold guide plate (52) is used for transferring a cold source from the refrigeration chip (51) to the earmuff (3) for refrigeration.

3. A headset with a cooling function according to claim 2, characterized in that the circuit board (4) has a power supply circuit for the cooling chip (51); the refrigeration chip (51) is connected with the circuit board (4).

4. A headset with a cooling function according to claim 2 or 3, characterized in that the cooling chip (51) and the cooling plate (52) are both arranged in a receiving cavity formed by the headset back shell (1); the refrigeration chip (51) is arranged on one side surface of the cold guide plate (52) in a clinging manner; the edge of the cold guide plate (52) extends along the direction of the side opposite to the refrigeration chip (51) and is in contact with the ear cap (3).

5. The headset with a refrigerating function as claimed in claim 4, wherein the extension part of the cold conducting plate (52) is filled with a first cold accumulating body (521).

6. Headset with refrigeration function according to claim 4, characterized in that the side of the refrigeration chip (51) facing away from the cold conducting plate (52) is provided with a heat sink (53).

7. Headset with refrigeration function according to claim 6, characterized in that the side of the heat sink (53) facing away from the refrigeration chip (51) is provided with a heat dissipation fan (54).

8. Headset with cooling function according to claim 7, characterized in that a heat sink net (11) is arranged on the earphone rear housing (1) in correspondence with the heat sink fan (54).

9. A headset with a cooling function according to claim 1, characterized in that the speaker assembly (2) comprises a speaker rear cavity (21), a speaker front cavity (22) and a speaker (23);

the horn (23) is accommodated in a cavity formed by the matched die of the horn rear cavity (21) and the horn front cavity (22); the loudspeaker (23) is connected with the circuit board (4); the sound emitting direction of the horn (23) faces the horn front cavity (22); and the front cavity (22) of the horn is provided with a sound transmission hole.

10. A headphone with a cooling function according to claim 1, characterized in that the ear muffs (3) are filled with a second cool storage body (31).