CN209767779U - head earphone - Google Patents

head earphone Download PDF

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Publication number
CN209767779U
CN209767779U CN201920409196.8U CN201920409196U CN209767779U CN 209767779 U CN209767779 U CN 209767779U CN 201920409196 U CN201920409196 U CN 201920409196U CN 209767779 U CN209767779 U CN 209767779U
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China
Prior art keywords
protective layer
heat
control device
temperature control
earmuff
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Active
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CN201920409196.8U
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Chinese (zh)
Inventor
刘伟
王勇
董波
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Anker Innovations Co Ltd
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Anker Innovations Co Ltd
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Priority to CN201920409196.8U priority Critical patent/CN209767779U/en
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Abstract

The utility model provides a headset, include: a headband; an earshell connected with the headband; the earmuff assembly is arranged on one side, away from the headband, of the earmuff and comprises an earmuff main body and a first protective layer, the earmuff main body protrudes out of the earmuff to form a protective cavity, and the first protective layer is arranged on the outer side of the earmuff main body; and the temperature control device is directly or indirectly contacted with the first protective layer so as to transfer heat to the first protective layer. Through the technical scheme provided by the utility model, can solve the lower technical problem of headphone comfort among the prior art.

Description

Head earphone
Technical Field
The utility model relates to a headphone technical field particularly, relates to a headphone.
Background
Currently, headphones generally include a headband, an earshell, a driver, a wire, and an earmuff assembly. The headband is in a U-shaped bracket structure, and the earshell is clamped on the head through the headband. The earmuff is an important part of the headset, the earmuff is equivalent to a box body of a sound box, and the earmuff is made of plastic materials. The earmuff is provided with a driver which is used for sounding. The earcap assembly can cushion headband pressure and is also the part that directly sticks to skin, and the earcap assembly can affect the comfort level of wearing. Earmuff components generally include the bolster and the inoxidizing coating of setting on the bolster, and the bolster is generally made by the sponge, and the inoxidizing coating is generally made by materials such as synthetic leather, cotton flannel or screen cloth.
However, the lack of a heat conduction system in the conventional headset results in inefficient heat exchange between the internal environment and the external environment. After the wearing time is long, people feel uncomfortable and sultry, so that the user experience is poor.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide a headset to solve the technical problem of the lower comfort of the headset in the prior art.
In order to achieve the above object, the present invention provides a headphone, including: a headband; an earshell connected with the headband; the earmuff assembly is arranged on one side, away from the headband, of the earmuff and comprises an earmuff main body and a first protective layer, the earmuff main body protrudes out of the earmuff to form a protective cavity, and the first protective layer is arranged on the outer side of the earmuff main body; and the temperature control device is directly or indirectly contacted with the first protective layer so as to transfer heat to the first protective layer.
Furthermore, a heat exchange channel is arranged on the earshell, the temperature control device is arranged in the heat exchange channel, the first protective layer is located at one end of the heat exchange channel, and the temperature control device exchanges heat with the first protective layer through the heat exchange channel.
Further, the headphone further includes: the first heat conducting piece is arranged at one end, close to the earmuff component, of the earmuff and located between the temperature control device and the first protective layer, so that the temperature control device transmits heat to the first protective layer through the first heat conducting piece.
Further, the earmuff main part is the resilience piece, and earmuff main part annular is around establishing at the edge of earmuff, and first heat-conducting member is cyclic annular structure, and first heat-conducting member setting is kept away from the one end of first inoxidizing coating at the earmuff main part.
Further, the headphone further includes: and the second heat conducting piece is positioned between the earcap main body and the first protective layer, so that the temperature control device transmits heat to the first protective layer through the second heat conducting piece.
furthermore, the second heat conducting piece is heat conducting cloth, and the heat conducting cloth is wrapped on the earmuff main body, so that the temperature control device transfers heat to the first protective layer through the heat conducting cloth.
Further, the headphone further includes: and the detection device is used for detecting the temperature of the earcap assembly.
Further, the headphone further includes: the control system, the detection device and the temperature control device are all connected with the control system, so that the control system controls the working state of the temperature control device according to the signals detected by the detection device.
further, the earcap body is made of a heat conductive material; and/or the first protective layer is made of a thermally conductive material.
Further, the headset further comprises a third heat-conducting piece, the third heat-conducting piece is arranged between the earmuff main body and the first protective layer, and the third heat-conducting piece is a heat-conducting glue layer.
Use the technical scheme of the utility model, through add temperature control device on headphone, temperature control device directly or indirectly contacts with first inoxidizing coating, and like this, temperature control device can be to first inoxidizing coating transmission heat. Because first inoxidizing coating is direct and user contact, behind temperature control device's heat transfer to first inoxidizing coating, first inoxidizing coating will be through heat-conducting mode with heat transfer to user, for the user provides suitable temperature, has avoided wearing the long back of time can make the people feel uncomfortable, the phenomenon of vexation, has improved the comfort level, has promoted user experience. Therefore, adopt the utility model provides a technical scheme can solve the lower technical problem of headphone's comfort among the prior art.
drawings
the accompanying drawings, which form a part of the present application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 shows a schematic structural view of a headset provided with a first heat conducting member and a second heat conducting member according to an embodiment of the present invention;
Fig. 2 shows a schematic structural view of a headset provided with no first and second thermal conductive members according to an embodiment of the present invention;
Fig. 3 shows a schematic structural diagram of a headset provided with only a first heat-conducting member according to an embodiment of the present invention;
Fig. 4 shows a schematic structural diagram of a headset according to an embodiment of the present invention;
fig. 5 is a schematic diagram illustrating an operation principle of a headset according to an embodiment of the present invention.
Wherein the figures include the following reference numerals:
10. A headband; 20. an earshell; 30. an ear muff assembly; 31. an earcap body; 32. a first protective layer; 33. a second protective layer; 40. a heat exchange channel; 50. a first heat-conducting member; 60. a second heat-conducting member; 70. a temperature control device; 80. a detection device; 90. a control system; 100. a power source.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
As shown in fig. 1 to 4, an embodiment of the present invention provides a headset, including: a headband 10, an earshell 20, an earmuff assembly 30, and a temperature control device 70. Wherein the earshell 20 is connected to the headband 10. The ear muff assembly 30 is disposed on the side of the earmuff 20 away from the headband 10, the ear muff assembly 30 comprises an ear muff body 31 and a first protective layer 32, the ear muff body 31 protrudes beyond the earmuff 20 to form a protective cavity, and the first protective layer 32 is disposed on the outside of the ear muff body 31. The temperature control device 70 is in direct or indirect contact with the first protective layer 32 such that the temperature control device transfers heat to the first protective layer 32. The first protection layer 32 in this embodiment may be made of an elastic material, and specifically, the first protection layer 32 may be made of a low thermal resistance leather or cloth material. The first protective layer 32 in this embodiment is in direct contact with the skin. The earcap body 31 can be made of a flexible material.
With the headset provided in this embodiment, heat can be conveniently transferred to the first protection layer 32 by adding the temperature control device 70 to the headset. As shown in fig. 2, in the present embodiment, the heat refers to heat in a broad sense, and may be either conventional "heat" for heating or "cold" for cooling. The temperature of the first protective layer 32 is adjusted by a temperature control device 70 according to the requirement of the customer or the ambient temperature, and the temperature control device 70 can be a low temperature source or a high temperature source. Specifically, when the first protection layer 32 needs to be heated, the temperature control device 70 serves as a high temperature source; when the temperature of the first protection layer 32 needs to be lowered, the temperature control device 70 can be used as a low temperature source.
Because first inoxidizing coating 32 in this embodiment is direct and user contact, first inoxidizing coating 32 will carry out the temperature transfer through heat-conduction mode to the realization heaies up or cools down, thereby provides suitable temperature for the user, has avoided wearing the phenomenon that can make the people feel uncomfortable, sultry after the time is long, has improved use comfort, has promoted user experience. Specifically, the heat exchange channel 40 in this embodiment may be a cylindrical channel disposed opposite the ear muff assembly 30.
In this embodiment, a heat exchanging channel 40 is disposed on the earmuff 20, a temperature control device 70 is disposed in the heat exchanging channel 40, the first protection layer 32 is located at one end of the heat exchanging channel, and the temperature control device 70 exchanges heat with the first protection layer 32 through the heat exchanging channel 40.
In order to improve the heat exchange effect between the first protective layer 32 and the temperature control device 70, the headset in this embodiment further includes a first heat conduction member 50. The first thermal conductive element 50 is disposed at an end of the ear shell 20 close to the ear cap assembly 30, and the first thermal conductive element 50 is located between the temperature control device 70 and the first protective layer 32, so that the temperature control device 70 transfers heat to the first protective layer 32 through the first thermal conductive element 50. The first heat conduction member 50 in this embodiment may be a low heat diffusion resistance member, and may be made of a metal material.
in this embodiment, the earcap body 31 is a resilient member, and the earcap body 31 is disposed around the earmuff 20 to form a protection chamber. Accordingly, the first heat conduction member 50 in this embodiment is also of an annular structure, and the annular structure may be specifically an elliptical ring structure. The first thermal conduction member 50 in this embodiment is disposed at an end of the ear cap body 31 away from the first protective layer 32. With this arrangement, the heat in the heat exchange channel 40 can be better transferred to the first protective layer 32 through the first heat-conducting member 50.
In order to further improve the heat transfer effect, the headset in this embodiment further comprises a second heat conducting member 60. The second thermal conductor 60 is located between the earcap body 31 and the first protective layer 32, so that the temperature control device 70 transfers heat to the first protective layer 32 through the second thermal conductor 60. In the present embodiment, the second heat conductive member 60 may be made of a flexible material having low thermal resistance.
Specifically, the second heat conduction member 60 in this embodiment is a heat conduction cloth, and the heat conduction cloth is wrapped on the ear cap body 31, so that the heat exchange channel 40 exchanges heat with the first protective layer 32 through the heat conduction cloth. The earmuff body 31 in this embodiment may be a sponge, which may be made of a heat conductive material, and the heat conductive cloth is wrapped on the sponge. The heat in the temperature control device 70 is transferred to the first protective layer 32 through the second heat conducting member 60, and the temperature of the first protective layer 32 is changed through heat conduction, so as to improve the comfort level of the user.
Specifically, the temperature control device 70 may be directly contacted with the earcap body 31, the heat or the cold of the temperature control device 70 is transmitted to the first protective layer 32 through the earcap body 31, and the heat or the cold on the first protective layer 32 is transmitted to the human body through heat conduction.
As shown in fig. 3, a first heat conduction element 50 can be disposed between the temperature control device 70 and the earcap body 31, and the heat of the temperature control device 70 can be transmitted to the first protective layer 32 through the first heat conduction element 50 and the earcap body 31 in sequence, so that the heat or cold on the first protective layer 32 can be transmitted to the human body through heat conduction.
In this embodiment, the headset further comprises a detection means 80, the detection means 80 being adapted to detect the temperature of the ear muff assembly 30. In particular, the detecting device 80 may be a temperature detecting member, which may be used for detecting the temperature of the first protection layer 32.
Specifically, as shown in fig. 5, the headset in this embodiment further includes a control system 90, and the detection device 80 and the temperature control device 70 are both connected to the control system 90, so that the control system 90 controls the operating state of the temperature control device 70 according to the signal detected by the detection device 80. In this embodiment, when the temperature detected by the detecting device 80 is higher, the control system 90 controls the temperature control device 70 as a low temperature source, so as to lower the temperature of the first protection layer 32; when the temperature detected by the detecting device 80 is low, the control system 90 controls the temperature control device 70 as a high temperature source to increase the temperature of the first protection layer 32. By adopting the arrangement, the temperature of the first protective layer 32 can be adaptively adjusted according to the requirement of a user, so that the experience comfort level of the user can be better improved.
The working principle of the headset is as follows: the temperature control device 70, the detection device 80 and the control system 90 are all connected with a power supply 100, the detection device 80 transmits a detected temperature signal to the control system 90, and the control system 90 controls the temperature control device 70 to work according to the detected temperature signal so as to provide a proper temperature for a user through the temperature control device 70. The temperature control device 70 works and transfers heat to the first protective layer 32 through the first heat conduction member 50 and the second heat conduction member 60, and the first protective layer 32 is directly contacted with the skin of the user, so that the temperature of the part contacted with the human body is improved in a heat conduction manner, and the use comfort of the user is improved.
Specifically, the earcap body 31 may be made of a thermally conductive material; alternatively, the first protective layer 32 may be made of a thermally conductive material; alternatively, both the ear muff body 31 and the first protective layer 32 are made of a heat conductive material. For better heat transfer, both the ear muff body 31 and the first protective layer 32 in this embodiment are made of a heat conductive material.
In order to better improve the heat transfer effect, the headset in this embodiment further includes a third heat-conducting member, which is disposed between the earmuff body 31 and the first protective layer 32. Specifically, the third heat conduction member is a heat conduction adhesive layer, and the heat conduction adhesive layer can firmly bond the earcap main body 31 and the first protective layer 32. In order to better improve the heat conduction effect, a heat conductive adhesive layer may be further disposed between the temperature control device 70 and the first heat conduction member 50 to improve the connection reliability between the temperature control device 70 and the first heat conduction member 50.
Specifically, when the second thermal conductive element 60 is not disposed between the earmuff main body 31 and the first protective layer 32, the thermal conductive adhesive layer can be directly disposed between the earmuff main body 31 and the first protective layer 32, so that the first protective layer 32 and the earmuff main body 31 are reliably connected, and meanwhile, the second thermal conductive element 60 can better transmit heat on the earmuff main body 31 to the first protective layer 32.
When the second heat-conducting member 60 is disposed between the earcap body 31 and the first protective layer 32, a heat-conducting adhesive layer may be disposed between the second heat-conducting member 60 and the earcap body 31; a thermal conductive adhesive layer may be further provided between the second thermal conductive member 60 and the first protective layer 32; alternatively, a heat conductive adhesive layer may be provided between the second heat conductive member 60 and the ear cap body 31, and a heat conductive adhesive layer may be provided between the second heat conductive member 60 and the first protective layer. This improves the reliability of the connection and enables better heat transfer.
In this embodiment, the ear muff assembly 30 further comprises a second protective layer 33, the second protective layer 33 is connected to the first protective layer 32, and the second protective layer 33 is located in the protective cavity. In particular, the second protective layer 33 may be made of a leather material.
From the above description, it can be seen that the above-mentioned embodiments of the present invention achieve the following technical effects: the temperature of the first protective layer 32 is changed by arranging the heat exchange channel 40, and a special heat conduction system design is carried out on the contact part of the headset and the skin of a human body. The extra heat conduction path is created by using the low-thermal-resistance material, so that the heat conduction efficiency of the skin contact part in contact with the outside is greatly increased, the heat exchange efficiency between the inside and the outside of the headset is enhanced by using a special heat conduction material and a low-loss heat conduction structure design, the defect of discomfort caused by the fact that the traditional headset is worn due to sultry is overcome, and the user experience is improved.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A headset, comprising:
A headband (10);
An earshell (20) connected to the headband (10);
An ear cap assembly (30) disposed on a side of the earshell (20) away from the headband (10), the ear cap assembly (30) including an ear cap body (31) and a first protective layer (32), the ear cap body (31) protruding the earshell (20) to form a protective cavity, the first protective layer (32) being disposed outside the ear cap body (31);
a temperature control device (70), the temperature control device (70) in direct or indirect contact with the first protective layer (32) to transfer heat to the first protective layer (32).
2. The headphone as claimed in claim 1, wherein the earmuff (20) is provided with a heat exchange channel (40), the temperature control device (70) is arranged in the heat exchange channel (40), the first protective layer (32) is located at one end of the heat exchange channel (40), and the temperature control device (70) exchanges heat with the first protective layer (32) through the heat exchange channel (40).
3. The headset of claim 1, further comprising:
A first thermally conductive member (50) disposed at an end of the ear shell (20) proximate the ear cap assembly (30), the first thermally conductive member (50) being positioned between the temperature control device (70) and the first protective layer (32) such that the temperature control device (70) transfers heat to the first protective layer (32) via the first thermally conductive member (50).
4. the headphone as claimed in claim 3, wherein the earmuff body (31) is a resilient member, the earmuff body (31) is annularly arranged around the edge of the earmuff (20), the first heat-conducting member (50) is of an annular structure, and the first heat-conducting member (50) is arranged at an end of the earmuff body (31) away from the first protective layer (32).
5. the headset of claim 3, further comprising:
A second thermally conductive member (60), the second thermally conductive member (60) being positioned between the earcap body (31) and the first protective layer (32) such that the temperature control device (70) transfers heat to the first protective layer (32) through the second thermally conductive member (60).
6. The headset according to claim 5, wherein the second heat conducting member (60) is a heat conducting cloth, which is wrapped around the earcap body (31) such that the temperature control device (70) transfers heat to the first protective layer (32) through the heat conducting cloth.
7. The headset of claim 6, further comprising:
A detection device (80), the detection device (80) being configured to detect a temperature of the ear muff assembly (30).
8. The headset of claim 7, further comprising:
the control system (90), the detection device (80) and the temperature control device (70) are connected with the control system (90), so that the control system (90) controls the working state of the temperature control device (70) according to the signal detected by the detection device (80).
9. The headphone of claim 1,
The earcap body (31) is made of a heat conductive material; and/or the presence of a gas in the gas,
the first protective layer (32) is made of a thermally conductive material.
10. The headphone as claimed in claim 1, characterized in that it further comprises a third thermal conductor arranged between the earmuff body (31) and the first protective layer (32), the third thermal conductor being a layer of thermally conductive glue.
CN201920409196.8U 2019-03-28 2019-03-28 head earphone Active CN209767779U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920409196.8U CN209767779U (en) 2019-03-28 2019-03-28 head earphone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920409196.8U CN209767779U (en) 2019-03-28 2019-03-28 head earphone

Publications (1)

Publication Number Publication Date
CN209767779U true CN209767779U (en) 2019-12-10

Family

ID=68756881

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920409196.8U Active CN209767779U (en) 2019-03-28 2019-03-28 head earphone

Country Status (1)

Country Link
CN (1) CN209767779U (en)

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