TW201540080A - Heat conductive structure for an earphone - Google Patents

Abstract

The present invention relates to a heat conductive structure for an earphone, which includes connecting parts for the earphone and wrapping components. The wrapping components are used to conduct the heat and are connected to outer edges of the connecting parts. The connecting parts are used to contact with the user's ears. When the user wears the earphone for a long time, the wrapping components with the excellent heat conductivity conduct the heat that accumulated between the user's ears and the connecting parts to another part where exposed to the atmosphere. It eases the weak heat dissipation of the conventional earphone, which causes the user unpleasant by accumulating lots heat to ears.

Description

Heat dissipation structure of earphone

The invention is a heat dissipation structure, in particular to a heat dissipation structure applied to an earmuff type earphone or an earphone type earphone.

Headphones, which are common audio-visual entertainment equipment in daily life, can still satisfy personal entertainment without being affected by the noise of the place and without disturbing the surrounding environment, and are designed according to consumer preferences or usage requirements. There are different styles of earphones, such as earmuffs, earhooks or earbuds.

In the case of an earmuff type earphone, the two-seat system for sounding is connected by a hanger so that the speaker portion of the seat body abuts and is oppositely disposed, and the earmuff type is made due to the elasticity of the hanger frame. When the earphone is mounted on the user's head, the sounding portion of the seat body can be tightened inwardly and adhered to the ears; and the ear portion of the seat body is still equipped with the ear cotton, the ear The cotton can not only serve as a cushioning material for the user's ear to contact with the seat body, but also can cover the user's ear through a wide range of ear cotton, so as to fully isolate the external noise, and form a better hearing effect, and at the same time borrow Acoustic vibration is absorbed by the ear cotton to avoid affecting other people during use. However, in the prior art, the covering material of the ear cotton is made of plastic artificial leather or leather, and the earphone type earphone is loaded for a long time. Under the contact, the heat accumulated in the contact between the user's ear and the ear cotton is not easily transmitted to the outside air by such a covering material, thereby causing the user to feel the discomfort of the temperature rise of the ear under long-term use.

In the earphone type, the two bodies for sounding are respectively provided with wires for transmitting signals at the connection portions thereof, and each of the sets of the body is provided with a plug body on the speaker portion of the seat body, and only the earphone type earphone is used. The plug body is inserted into the ear canal, and the seat body is exposed; although the earphone type earphone does not cover the user's ear in a wide range, the part of the plug body that is in contact with the ear canal is still used for a long time. For the accumulation of heat in the ear block, because the plug body closely adheres to the inner edge of the ear canal, and the heat transfer between the ear and the outside air is isolated, so that the user feels the discomfort of the temperature rise of the ear; another implementation of the earphone type earphone In the aspect, the plug body is not assembled on the speaker end of the seat body, and the seat body is directly inserted into the ear canal of the user when used. However, the earphone type earphone still causes the ear canal and the outside air. Isolation, which causes the temperature of the ear to rise, causing discomfort to the user.

Therefore, the object of the present invention is to improve the discomfort caused by the high temperature of the ear or the head of the user when the earphone of the prior art is attached to the head or stuffed into the ear for a long time, so that the user wears the earphone. Get more comfort with headphones.

In order to achieve the above object, the technical means adopted by the present invention is a heat dissipating structure of an earphone, which comprises a joint portion of an earphone and a covering material, and the covering material is disposed at an outer edge of the joint portion of the earphone. The covering material comprises a metal having a heat conducting effect, wherein the engaging portion of the earphone is a portion where the earphone contacts the human body when the earphone is used.

The heat dissipation structure of the earphone, wherein the cladding material is composed of a conductor and a structure; the structure is interlaced and connected to the periphery of the conductor; and one side of the cladding material is provided with a backing The backing is attached to the outer edge of the joint of the earphone.

The heat dissipation structure of the earphone, wherein the conductor comprises gold, silver, copper, iron, nickel or aluminum, and the structure comprises plastic, rubber, cloth material or skin material.

The heat dissipation structure of the earphone, wherein the covering material comprises a substrate and a conductive layer, the conductive layer is bonded to one side of the substrate; the conductive layer and the substrate are coated, deposited, pasted, woven The fusion or plating is combined with each other; the backing is provided on the other side of the substrate, and the adhesive is attached to the outer edge of the joint of the earphone.

The heat dissipation structure of the earphone, wherein the substrate is a natural cloth material, a artificial cloth material, a natural leather material or an artificial leather material, and the conductive layer material is: gold, silver, copper or aluminum.

An earphone provided with the heat dissipation structure, wherein the earphone is an earmuff type earphone, which has two seats, two ear cottons, one hanger and two wires; the two seats are oppositely arranged and respectively connected The two ends of the hanger; the base has a speaker portion, the speaker portion is formed on one side of the seat body, and the speaker portions are disposed opposite to each other; the two ear cottons are respectively disposed on the two seats, and the ear cotton is respectively The joint portion of the earmuff type earphone has a coupling hole on one side of the ear cotton, and the joint hole of the ear cotton corresponds to the speaker portion of the seat body, and the ear cotton group is disposed on the speaker portion of the seat body; the wire is installed in the seat The circumference of the body.

An earphone provided with the heat dissipation structure, wherein the earphone is an earbud type earphone, and the earphone type earphone comprises a two-body body, a two-plug body and a two-wire body; the plug system is a joint portion of the earphone type earphone; The seat body has a speaker part and a wiring part, the speaker part is located on one side of the seat body, the connection part is an end formed by the extension of the seat body, the wire is installed at the connection part, and one end of the plug body is set on the seat body Yangsheng Department.

An earphone provided with the heat dissipation structure, wherein the earphone is an earphone type, the earphone type comprises two bodies and two wires; the seat system is a joint portion of the earphone; the seat body has a sound And a wiring portion, the wire is installed at the wiring portion.

The invention has the advantages that the covering material connected to the outer edge of the earphone joint has good heat conduction performance, and the heat accumulated at the contact of the covering material with the user's ear is transmitted to the bag in the case of wearing the earphone for a long time. The cover material is not in contact with the ear portion, and heat is removed by heat conduction between the cover material and the air to improve the discomfort of the temperature rise of the user's ear caused by the prior art earphone for a long time.

Referring to FIG. 1 and FIG. 2 , the heat dissipation structure of the earphone of the present invention is implemented on the earphone 10 , and includes a joint portion 100 of the earphone 10 and a covering material 20 , wherein the covering material 20 is An element having a better heat conducting effect is disposed at the joint portion 100, and the earphone 10 is an earphone type earphone 11 or an earphone type machine 12, as shown in FIG. The earmuff headphones 11 can be further classified as an over the ear, a rear-band, an on-ear or a head-band, and an earphone 12 The earphone 10 can also be divided into an earbud or an ear, and the earphone 10 can also be a hook ear earphone; in one embodiment, the earphone 10 is in contact with the human head or the ear, that is, the earphone. The portion 100, and the portion not in contact with the head or the ear, may be provided with a covering material 20, on the one hand, the covering member 20 and the head or ear contact portion absorb heat energy from the human body, and on the other hand, the covering member 20 and the head portion Or the uncontacted portion of the ear may release thermal energy; in another embodiment, only the portion of the earphone 10 that is in contact with the head or ear of the human body, ie, the joint portion 100, is provided with a covering material 20, the covering material 20 and the head or The ear contact portion absorbs heat from the human body, and the release of heat energy is carried out through other parts.

Referring to FIG. 1 , the earphone 10 is an earmuff type earphone 11 , which has two bases 111 , two ear cottons 112 , one hanger 113 , and two wires 114 . The joint portion 100 of the eleventh embodiment is located on the ear cotton 112. Please refer to FIG. 2, because the earphone type earphone 11 has a symmetrical structure, and FIGS. 1 and 2 only show a half-side embodiment; the seat body 111 One side has a speaker portion 1111, and the two seats 111 are oppositely disposed with the two speaker portions 1111, and are connected to the periphery of the seat body 111 via the hanger 113, the ear cotton 112 One side has a coupling hole 1121, and the coupling hole 1121 of the ear cotton 112 corresponds to the speaker portion 1111 of the base body 111. The ear cotton 112 is assembled on the speaker portion 1111 of the seat body 111, and the wire rod 114 is mounted on the periphery of the base 111, and the wire 114 is used to transmit signals.

Referring to FIG. 2, a side surface of the covering material 20 is connected to the outer edge of the earphone 112 without the earphone 112, and the covering material 20 follows the shape of the ear cotton 112. The other side of the covering material 20 is attached to the user's head or ear, for example, by a fitting connection or a covering or the like on the outer edge of the ear cotton 112.

Referring to FIG. 3 and FIG. 4 , in another embodiment of the earphone heat dissipation structure of the present invention, the earphone 10A is an earphone 12 , and the earphone 12 includes two seats 121 , two plugs 122 and two wires 123 . The joint portion 100 of the embodiment of the earphone 12 is located on the plug body 122. Since the earphone type 12 is of a symmetrical configuration, FIGS. 3 and 4 only show the embodiment of the half side; the seat body 121 There is a speaker portion 1211 and a wiring portion 1212. The speaker portion 1211 is located at one side of the seat body 121, and the terminal portion 1212 is an end formed by the extension of the seat body 121. The wire 123 is mounted on the wire portion 123. The connecting portion 1212 has one end of the plug body 122 disposed on the speaker portion 1211 of the base body 121.

Referring to FIG. 4 , the covering material 20 includes two sides, one side of which follows the shape of the seat body 121 and the plug body 122, and is connected to the seat by, for example, a fitting connection or a covering. The body 121 and the outer edge of the plug body 122 are attached to the ear canal of the user on the other side of the cover member 20 that is not connected to the seat body 121 and the plug body 122. In another embodiment, the covering material 20 may only follow the shape of the plug body 122, and may be attached to the outer edge of the plug body 122 by, for example, a bonding connection or a covering.

The earphone has another embodiment, wherein the seat body has a speaker portion and a wiring portion, and the plug portion shown in FIG. 4 is not disposed in the speaker portion, and the joint portion of the embodiment is on the seat body. The covering material comprises two sides, one side of which follows the shape of the seat body, and the outer edge of the seat body is adhered, for example, by a fitting connection or a covering, and the covering material is not associated with the seat body. The other side of the connection is attached to the ear canal of the user.

Referring to FIG. 5, the covering material 20 is a composite material made of, for example, a metal material, a rubber, a plastic, and/or a cloth material, or any combination thereof, wherein the metal material in the composite material has better properties. The heat conduction effect, wherein the embodiment of the cladding material 20 is composed of a conductor 21 and a structure 22 which is a checkerboard interwoven and connected to the periphery of the conductor 21, for example, A metal body of a good conductor such as gold, silver, copper, iron, nickel or aluminum which is easy to conduct heat, or an alloy of any combination thereof, but not limited thereto, the material of the structure 22 is, for example, a plastic (for example, polyterephthalic acid) a polyethylene terephthalate (PET) or a polyurethane (PU) or the like, a rubber, a cloth material or a sheath material; in different embodiments, a backing is provided on one side of the covering material 20, the back The rubber surface may be connected to the outer edge of the ear cotton 112, the outer edge of the seat body 121 and the plug body 122, the outer edge of the plug body 122 or the outer edge of the seat body 121.

Referring to FIG. 6 , another embodiment of the covering material 20A includes a substrate 23 and a conductive layer 24 , and the conductive layer 24 is bonded to one side of the substrate 23 . The bonding layer 24 and the substrate 23 are, for example, coated, deposited, pasted, woven, fused, fused, or plated, etc., but not limited thereto, the substrate 23 is, for example, a natural cloth. The material, the artificial cloth material (such as polyester fiber cloth), the natural leather material, the artificial leather material or any combination thereof, the conductive layer 24 material is, for example, gold, silver, copper, iron having a better heat conduction effect. a material made of nickel or aluminum, or an alloy of any combination thereof, but not limited to the above; the other side of the substrate 23 is back-coated, and in various embodiments, the adhesive surface is attached to the The outer edge of the ear cotton 112, the outer edge of the seat body 121 and the plug body 122, the outer edge of the plug body 122 or the outer edge of the seat body 121.

The conductive layer 24 can be a plurality of layers, for example, a nickel layer is plated on the surface of the substrate 23, and a layer of high thermal conductivity copper is electroplated on the layer of nickel to prevent oxidation and corrosion on the copper layer. A layer of nickel is electroplated to obtain a conductive layer 24 having good thermal and corrosion resistance.

The earphone heat dissipating structure of the present invention has excellent heat conduction properties such as gold, silver, copper, iron, nickel by the covering material 20 or the covering material 20A connected to the outer edge of the joint portion 100 of the earphone 10 or the earphone 10A. Or a material such as aluminum, where the user's ear or head is in contact with the covering material, and the heat accumulated by wearing for a long time is transmitted through the covering material to the covering material, which is different from the attached material. Where the ear or head, in turn, conducts heat energy out of the air or discharges it into the air to improve the temperature of the ear or head of the user caused by the accumulation of thermal energy under the long-term wear of the prior art earphone. High discomfort.

The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and A person skilled in the art can make some modifications or modifications to equivalent embodiments by using the above-disclosed technical contents without departing from the technical scope of the present invention. The present invention is not limited to any simple modifications, equivalent changes and modifications of the above embodiments.

10, 10A‧‧‧ headphones
100‧‧‧ joints
11‧‧‧ Earmuff headphones
111‧‧‧ body
1111‧‧‧Speaking Department
112‧‧‧ ear cotton
1121‧‧‧bond hole
113‧‧‧ hanging rack
114‧‧‧Wire
12‧‧ Earphones
121‧‧‧ body
1211‧‧‧Speaking Department
1212‧‧‧Wiring
122‧‧‧ body
123‧‧‧Wire
20, 20A‧‧‧ cladding material
21‧‧‧ Conductor
22‧‧‧ Structure
23‧‧‧Substrate
24‧‧‧Transmission layer

1 is an embodiment of the use of an earmuff type earphone of the present invention. 2 is a cross-sectional view showing the ear covering of the earmuff type earphone of the present invention. 3 is an embodiment of the use of the earphone of the present invention. 4 is a cross-sectional view showing the mounting material of the earphone of the present invention. Figure 5 is a partial view of a cladding material of the present invention. Figure 6 is a partial view of another embodiment of the cladding material of the present invention.

100‧‧‧Combination Department

11‧‧‧ Earmuff headphones

111‧‧‧ body

1111‧‧‧Speaking Department

112‧‧‧ ear cotton

1121‧‧‧bond hole

113‧‧‧ hanging rack

114‧‧‧Wire

20‧‧‧Covering materials

Claims (8)

The heat dissipating structure of the earphone comprises a joint portion of a headphone and a covering material, the covering material is disposed at an outer edge of the joint portion of the earphone, the covering material comprises metal, and has a heat conducting effect, wherein the earphone is engaged The part where the earphone is in contact with the human body when using the earphone. The heat dissipation structure of the earphone according to claim 1, wherein the cladding material is composed of a conductor and a structure; the structure is interlaced and connected to a periphery of the conductor; one side of the cladding material A backing is provided, and the backing is attached to the outer edge of the joint of the earphone. The heat dissipation structure of the earphone of claim 2, wherein the conductor comprises gold, silver, copper, iron, nickel or aluminum, and the structure comprises plastic, rubber, cloth material or sheath material. The heat dissipation structure of the earphone of claim 1, wherein the cladding material comprises a substrate and a conductive layer, the conductive layer is bonded to a side of the substrate; the conductive layer and the substrate are coated and deposited. Adhesive, woven, fused, or plated in combination with each other; a backing is provided on the other side of the substrate, and the backing is attached to the outer edge of the joint of the earphone. The heat dissipation structure of the earphone of claim 4, wherein the substrate comprises a natural cloth material, a artificial cloth material, a natural leather material or an artificial leather material, and the conductive layer comprises gold, silver, copper, iron, nickel or aluminum. An earphone provided with the heat dissipation structure according to any one of claims 1 to 5, wherein the earphone is an earmuff type earphone, which has two seats, two ear cottons, one hanger and two wires; For the opposite arrangement, and respectively connected to the two ends of the pylon; the seat body has a speaker portion, the speaker portion is formed on one side of the seat body, and the two speaker portions of the two seats are opposite to each other The two ear cottons are respectively disposed on the two body, the ear cotton is a joint portion of the earphone, and the ear cotton has a coupling hole on one side thereof, the coupling hole of the ear cotton and the sound of the seat body Correspondingly, the ear cotton is disposed on the speaker portion of the seat body; the wire is mounted on the periphery of the seat body. An earphone provided with the heat dissipation structure according to any one of claims 1 to 5, wherein the earphone is an earbud type earphone, and the earphone type earphone comprises two bodies, two plug bodies and two wires; The joint body has a speaker portion and a connection portion, the speaker portion is located at one side of the seat body, and the connection portion is an end portion formed by the extension of the seat body, and the wire is installed at the connection portion One end of the plug body is disposed on the speaker portion of the seat body. An earphone provided with the heat dissipation structure according to any one of claims 1 to 5, wherein the earphone is an earbud type earphone, and the earphone type earphone comprises two body and two wires; the base system of the earphone type earphone The seat body has a speaker portion and a wiring portion, and the wire is installed at the wiring portion.