CN112803898B - High-integration-level frequency conversion channel assembly - Google Patents
High-integration-level frequency conversion channel assembly Download PDFInfo
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- CN112803898B CN112803898B CN202110285906.2A CN202110285906A CN112803898B CN 112803898 B CN112803898 B CN 112803898B CN 202110285906 A CN202110285906 A CN 202110285906A CN 112803898 B CN112803898 B CN 112803898B
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03D—DEMODULATION OR TRANSFERENCE OF MODULATION FROM ONE CARRIER TO ANOTHER
- H03D7/00—Transference of modulation from one carrier to another, e.g. frequency-changing
- H03D7/16—Multiple-frequency-changing
Abstract
The invention discloses a high-integration frequency conversion channel component, which belongs to the technical field of radio frequency transceiving and is characterized in that: the microwave multilayer PCB comprises a radio frequency chip, a support cavity and a microwave multilayer PCB, wherein the microwave multilayer PCB comprises a frequency conversion receiving channel and a frequency conversion transmitting channel, a high local oscillation power distribution network and a low local oscillation power distribution network are arranged in the microwave multilayer PCB, signals are divided by the high local oscillation power distribution network and the low local oscillation power distribution network in sequence and then provide local oscillation signals for the frequency conversion transmitting channel, vertical transition holes are formed in the microwave multilayer PCB, the vertical transition holes penetrate through the microwave multilayer PCB and transmit excitation signals to the frequency conversion transmitting channel, the excitation signals are subjected to up-conversion, filtering and amplification and then pass through the vertical transition holes, and the excitation signals are output after power distribution. The invention has the characteristics of high integration level, small size, low profile, easy processing and assembly and strong applicability.
Description
Technical Field
The invention relates to the technical field of radio frequency transceiving, in particular to a high-integration frequency conversion channel assembly.
Background
In recent years, the weight reduction and miniaturization of radar, communication, and electronic countermeasure electronic devices have been advanced, and new demands have been made for high integration and miniaturization of internal devices or modules. As the core part of the electronic equipment, the multi-channel frequency conversion channel has very important significance in high integration, miniaturization and light weight design. At present, the technology is continuously developed in the aspects of microwave integrated circuit technology, microwave multilayer board design and processing and micro-assembly technology, and the forward development of the integration, miniaturization and lightweight research and design of a multi-channel frequency conversion channel is promoted.
At present, the frequency conversion channel is designed mostly based on a micro-assembly technology, and is realized by adopting a mode of installing an integrated microwave chip and a microwave double-sided board or a low-temperature co-fired ceramic substrate on a metal cavity to form a communication link, and the mode enables the area of a multi-channel frequency conversion channel module to be enlarged and the thickness to be thickened, so that the requirements of integration, miniaturization and light weight cannot be met.
Chinese patent publication No. CN 206673954U, published as 2017, 11, month and 24, discloses a multi-chip radio frequency transceiver device based on microwave digital composite substrate technology, which is characterized by comprising: a microwave digital composite substrate, a frequency conversion module, a low noise amplification module and a filtering module,
wherein, frequency conversion module, low noise amplification module and filtering module dress weld to on the surface of microwave digital composite substrate, wherein, frequency conversion module includes: change over switch, up converter and down converter, change over switch inserts local oscillator signal all the way to the selectivity is sent to up converter or down converter, wherein low noise amplification module with filtering module connects, filtering module with down converter connects and constitutes the receiving branch road, down converter with filtering module connects, filtering module with low noise amplification module connects and constitutes the transmission branch road.
The multi-chip rf transceiver device based on the microwave digital composite substrate technology disclosed in the patent document has the advantages of light weight, small size, high reliability, flexibility and expandability. However, the integration level is not good enough, and the features of low profile, easy processing and assembling are not provided.
Disclosure of Invention
The invention provides a high-integration frequency conversion channel assembly for overcoming the defects of the prior art, and the high-integration frequency conversion channel assembly has the characteristics of high integration level, small size, low profile, easiness in processing and assembly and strong applicability.
The invention is realized by the following technical scheme:
the utility model provides a high integration frequency conversion passageway subassembly which characterized in that: including radio frequency chip, support cavity and microwave multilayer PCB board, the top layer and the bottom of microwave multilayer PCB board all have the table through conductive adhesive to paste high frequency connector, the radio frequency chip passes through conductive adhesive and connects in the top layer of microwave multilayer PCB board, the bottom of microwave multilayer PCB board passes through conductive adhesive and connects on supporting the cavity, installs the apron on the top layer of microwave multilayer PCB board, microwave multilayer PCB board includes frequency conversion receiving channel and frequency conversion transmission passageway, it divides the network to embed high originally power of shaking in the microwave multilayer PCB board and divides the network to divide with low local oscillator merit, and the signal divides the network merit to divide in proper order to provide local oscillator signal for frequency conversion transmission passageway, is provided with the vertical transition hole on the microwave multilayer PCB board, and the vertical transition hole runs through multilayer microwave PCB board, to frequency conversion transmission passageway transmission excitation signal, excitation signal is through up-conversion, After filtering and amplifying, the signal passes through a vertical transition hole and is output after power distribution.
The microwave multilayer PCB sequentially comprises a radio frequency signal layer, a power supply control line layer, a high local oscillation signal layer, a low local oscillation signal layer and an excitation signal layer which are connected together from top to bottom.
The frequency conversion transmitting channel comprises a common branch and four branch links connected with the common branch, the common branch is used for finishing up-conversion, filtering and amplification of an excitation signal, and the branch links are used for distributing transmitting signal power to a radio frequency quadrant I output, a radio frequency quadrant II output, a radio frequency quadrant III output and a radio frequency quadrant IV output.
The common branch comprises a first intermediate frequency amplifier, a first band-pass filter, a second intermediate frequency amplifier, a mixer, a first radio frequency amplifier, a first radio frequency band-pass filter, a second radio frequency band-pass filter, a first two-way power divider, a second two-way power divider and a third two-way power divider, wherein the first intermediate frequency amplifier, the first band-pass filter, the second intermediate frequency amplifier, the mixer, the first radio frequency amplifier, the first radio frequency band-pass filter, the second radio frequency amplifier, the second radio frequency band-pass filter and the first two-way power divider are sequentially connected in series, and the first two-way power divider is respectively connected with the second two-way power divider and the third two-way power divider.
The four branch links respectively comprise a radio frequency TR chip and a radio frequency digital step attenuator connected with the radio frequency TR chip, the second two power dividers are respectively connected with the radio frequency TR chips output by the radio frequency quadrant I and the radio frequency quadrant II, and the third two power dividers are respectively connected with the radio frequency TR chips output by the radio frequency quadrant III and the radio frequency quadrant IV.
The common branch is arranged at the center of the microwave multilayer PCB, and the common branch completes up-conversion, filtering and amplification of an excitation signal, then reaches the back of the microwave multilayer PCB through the vertical transition hole, and is output to the transmitting port after power distribution.
The frequency conversion receiving channel comprises a radio frequency digital step attenuator, a radio frequency TR chip, a radio frequency filter, a first mixer, a band-pass filter, a second mixer, a first intermediate frequency low-pass filter, a first intermediate frequency amplifier, an intermediate frequency temperature compensation attenuator, a second intermediate frequency amplifier, a second intermediate frequency low-pass filter and a radio frequency doubler, the radio frequency digital step attenuator, the radio frequency TR chip, the radio frequency filter, the first mixer, the band-pass filter, the second mixer, the first intermediate frequency low-pass filter, the first intermediate frequency amplifier, the intermediate frequency temperature compensation attenuator, the second intermediate frequency amplifier and the second intermediate frequency low-pass filter are connected in sequence, and the radio frequency doubler is connected with the first mixer.
The frequency conversion receiving channels are rotationally and symmetrically arranged on the microwave multilayer PCB.
The radio frequency TR chip comprises a receiving low-noise amplifier, a radio frequency switch and a transmitting driving amplifier, wherein one end of the radio frequency switch is connected with the receiving low-noise amplifier, and the other end of the radio frequency switch is connected with the transmitting driving amplifier.
The PCB board is a printed circuit board.
The beneficial effects of the invention are mainly shown in the following aspects:
1. in the invention, a surface-mounted high-frequency connector is connected with the top layer and the bottom layer of a microwave multilayer PCB through conductive glue, a radio frequency chip is connected with the top layer of the microwave multilayer PCB through the conductive glue, the bottom layer of the microwave multilayer PCB is connected with a supporting cavity through the conductive glue, a cover plate is arranged on the top layer of the microwave multilayer PCB, the microwave multilayer PCB comprises a frequency conversion receiving channel and a frequency conversion transmitting channel, a high local oscillation power division network and a low local oscillation power division network are arranged in the microwave multilayer PCB, signals are divided by the high local oscillation power division network and the low local oscillation power division network in sequence and then provide local oscillation signals for the frequency conversion transmitting channel, a vertical transition hole is arranged on the microwave multilayer PCB, the vertical transition hole penetrates through the microwave multilayer PCB and transmits excitation signals to the frequency conversion transmitting channel, the excitation signals pass through the vertical transition hole after being subjected to up-conversion, filtering and amplification and then are output after being subjected to power, because the frequency conversion receiving channel and the frequency conversion transmitting channel have higher requirements on amplitude-phase consistency and channel isolation at the same time, the miniaturization and integration difficulty of the frequency conversion channel are increased, the invention adopts a microwave multilayer PCB to carry out layered isolation design on a power supply line, a control signal line, a frequency hopping high local oscillator signal, a fixed low local oscillator signal, a radio frequency receiving signal and a radio frequency transmitting signal, all signals are concentrated on one microwave multilayer PCB to be wired, the integration level of the frequency conversion channel is improved, and the radio frequency signal, the frequency hopping high local oscillator signal and the fixed low local oscillator signal are transmitted through a vertical transition hole, so that the continuity of radio frequency signal transmission is ensured, and the problem of volume increase caused by using a radio frequency glass insulator in the traditional design is avoided; compared with the prior art, the method has the characteristics of high integration level, small size, low profile, easiness in processing and assembling and strong applicability.
2. The invention benefits from the development of microwave integrated chips, and devices used in the frequency conversion channel are all bare chips, thereby avoiding the problem of overlarge occupied area of the packaged device and improving the space utilization rate.
3. According to the invention, based on a micro-assembly process, the bare chip is adhered to the top layer of the microwave multilayer PCB by using the conductive adhesive, and the substrate of the microwave multilayer PCB is made of a material with a thermal expansion coefficient similar to that of silicon, so that the problem of chip pulling crack caused by too large difference of the thermal expansion coefficients of the two materials can be effectively avoided.
4. According to the invention, the total thickness of the whole high-integration frequency conversion channel assembly is less than 8mm, the height of an air cavity between the top layer and the bottom layer of the microwave multilayer PCB is 4mm, and the thickness of the supporting cavity is 1.8mm, so that the section is small in thickness and light in weight.
5. According to the microwave multi-layer PCB, the frequency conversion receiving channels are rotationally and symmetrically arranged on the microwave multi-layer PCB, and the specific layout mode is adopted, so that the layout consistency among the frequency conversion receiving channels can be ensured, and the amplitude consistency is further ensured.
6. The invention organically combines the bare chip micro-assembly and the microwave multilayer PCB together, and lays a foundation for the miniaturization and integration design of the multi-channel frequency conversion channel.
Drawings
The invention will be further described in detail with reference to the drawings and the detailed description, in which:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural diagram of a microwave multilayer PCB board according to the present invention;
FIG. 3 is a cross-sectional view of a microwave multi-layer PCB board of the present invention;
FIG. 4 is a layer diagram of a microwave multi-layer PCB board of the present invention;
FIG. 5 is a schematic diagram of a first IF amplifier connected to a second RF bandpass filter in a common branch according to the present invention;
FIG. 6 is a schematic diagram of a branch link connected to a second RF band-pass filter in a common branch according to the present invention;
FIG. 7 is a schematic diagram of the structure of the RF digital step attenuator in the frequency conversion receiving channel connected to the first IF low pass filter according to the present invention;
FIG. 8 is a schematic diagram of a first IF low pass filter connected to a second IF low pass filter in a frequency conversion receiving channel according to the present invention;
FIG. 9 is a schematic structural diagram of a radio frequency TR chip according to the present invention;
the labels in the figure are: 1. the microwave antenna comprises a radio frequency chip, 2 a supporting cavity, 3 a microwave multilayer PCB, 4 a surface-mounted high-frequency connector, 5 a cover plate, 6 a variable-frequency receiving channel, 7 a variable-frequency transmitting channel, 8 a transmitting port.
Detailed Description
Example 1
Referring to fig. 1-3, a high-integration frequency conversion channel assembly includes a radio frequency chip 1, a supporting cavity 2 and a microwave multilayer PCB 3, wherein a top layer and a bottom layer of the microwave multilayer PCB 3 are both connected with a surface-mounted high frequency connector 4 through conductive glue, the radio frequency chip 1 is connected with the top layer of the microwave multilayer PCB 3 through conductive glue, the bottom layer of the microwave multilayer PCB 3 is connected with the supporting cavity 2 through conductive glue, a cover plate 5 is installed on the top layer of the microwave multilayer PCB 3, the microwave multilayer PCB 3 includes a frequency conversion receiving channel 6 and a frequency conversion transmitting channel 7, a high local oscillation power division network and a low local oscillation power division network are built in the microwave multilayer PCB 3, a signal is divided into local oscillation signals for the frequency conversion transmitting channel 7 sequentially through the high local oscillation power division network and the low local oscillation power division network, a vertical transition hole is formed in the microwave multilayer PCB 3, the vertical transition hole penetrates through the microwave multilayer PCB 3, an excitation signal is transmitted to the variable frequency transmission channel 7, the excitation signal passes through the vertical transition hole after up-conversion, filtering and amplification, and then is output after power distribution.
The top layer and the bottom layer of the microwave multilayer PCB 3 are both connected with a surface-mounted high-frequency connector 4 through conductive glue, the radio frequency chip 1 is connected with the top layer of the microwave multilayer PCB 3 through the conductive glue, the bottom layer of the microwave multilayer PCB 3 is connected with the supporting cavity 2 through the conductive glue, a cover plate 5 is arranged on the top layer of the microwave multilayer PCB 3, the microwave multilayer PCB 3 comprises a frequency conversion receiving channel 6 and a frequency conversion transmitting channel 7, a high-local-vibration power distribution network and a low-local-vibration power distribution network are arranged in the microwave multilayer PCB 3, signals are divided sequentially through the high-local-vibration power distribution network and the low-local-vibration power distribution network to provide local-vibration signals for the frequency conversion transmitting channel 7, a vertical transition hole is arranged on the microwave multilayer PCB 3, the vertical transition hole penetrates through the microwave multilayer PCB 3 to transmit excitation signals to the frequency conversion transmitting channel 7, the excitation signals pass through the vertical transition hole after being subjected to up-, the frequency conversion receiving channel 6 and the frequency conversion transmitting channel 7 have higher requirements on amplitude-phase consistency and channel isolation, so that the miniaturization and integration difficulty of the frequency conversion channel are increased; compared with the prior art, the method has the characteristics of high integration level, small size, low profile, easiness in processing and assembling and strong applicability.
Example 2
Referring to fig. 1 to 4, a high-integration frequency conversion channel assembly includes a radio frequency chip 1, a support cavity 2 and a microwave multilayer PCB 3, wherein a top layer and a bottom layer of the microwave multilayer PCB 3 are both connected with a surface-mounted high frequency connector 4 through conductive glue, the radio frequency chip 1 is connected with the top layer of the microwave multilayer PCB 3 through conductive glue, the bottom layer of the microwave multilayer PCB 3 is connected with the support cavity 2 through conductive glue, a cover plate 5 is installed on the top layer of the microwave multilayer PCB 3, the microwave multilayer PCB 3 includes a frequency conversion receiving channel 6 and a frequency conversion transmitting channel 7, a high local oscillation power division network and a low local oscillation power division network are built in the microwave multilayer PCB 3, a signal is divided into local oscillation signals for the frequency conversion transmitting channel 7 sequentially through the high local oscillation power division network and the low local oscillation power division network, a vertical transition hole is formed in the microwave multilayer PCB 3, the vertical transition hole penetrates through the microwave multilayer PCB 3, an excitation signal is transmitted to the variable frequency transmission channel 7, the excitation signal passes through the vertical transition hole after up-conversion, filtering and amplification, and then is output after power distribution.
The microwave multilayer PCB 3 sequentially comprises a radio frequency signal layer, a power supply control line layer, a high local oscillation signal layer, a low local oscillation signal layer and an excitation signal layer which are connected together from top to bottom.
The development of the microwave integrated chip is benefited, and the devices used in the frequency conversion channel are all bare chips, so that the problem of overlarge occupied area of the packaged devices is avoided, and the space utilization rate is improved.
Example 3
Referring to fig. 1 to 6, a high-integration frequency conversion channel assembly includes a radio frequency chip 1, a support cavity 2 and a microwave multilayer PCB 3, wherein a top layer and a bottom layer of the microwave multilayer PCB 3 are both connected with a surface-mounted high frequency connector 4 through conductive glue, the radio frequency chip 1 is connected with the top layer of the microwave multilayer PCB 3 through conductive glue, the bottom layer of the microwave multilayer PCB 3 is connected with the support cavity 2 through conductive glue, a cover plate 5 is installed on the top layer of the microwave multilayer PCB 3, the microwave multilayer PCB 3 includes a frequency conversion receiving channel 6 and a frequency conversion transmitting channel 7, a high local oscillation power division network and a low local oscillation power division network are built in the microwave multilayer PCB 3, a signal is divided into local oscillation signals for the frequency conversion transmitting channel 7 sequentially through the high local oscillation power division network and the low local oscillation power division network, a vertical transition hole is formed in the microwave multilayer PCB 3, the vertical transition hole penetrates through the microwave multilayer PCB 3, an excitation signal is transmitted to the variable frequency transmission channel 7, the excitation signal passes through the vertical transition hole after up-conversion, filtering and amplification, and then is output after power distribution.
The microwave multilayer PCB 3 sequentially comprises a radio frequency signal layer, a power supply control line layer, a high local oscillation signal layer, a low local oscillation signal layer and an excitation signal layer which are connected together from top to bottom.
The frequency conversion transmitting channel 7 comprises a common branch and four branch links connected with the common branch, the common branch is used for finishing the up-conversion, filtering and amplification of an excitation signal, and the branch links are used for distributing the power of a transmitting signal to a radio frequency quadrant I output, a radio frequency quadrant II output, a radio frequency quadrant III output and a radio frequency quadrant IV output.
The common branch comprises a first intermediate frequency amplifier, a first band-pass filter, a second intermediate frequency amplifier, a mixer, a first radio frequency amplifier, a first radio frequency band-pass filter, a second radio frequency band-pass filter, a first two-way power divider, a second two-way power divider and a third two-way power divider, wherein the first intermediate frequency amplifier, the first band-pass filter, the second intermediate frequency amplifier, the mixer, the first radio frequency amplifier, the first radio frequency band-pass filter, the second radio frequency amplifier, the second radio frequency band-pass filter and the first two-way power divider are sequentially connected in series, and the first two-way power divider is respectively connected with the second two-way power divider and the third two-way power divider.
The four branch links respectively comprise a radio frequency TR chip and a radio frequency digital step attenuator connected with the radio frequency TR chip, the second two power dividers are respectively connected with the radio frequency TR chips output by the radio frequency quadrant I and the radio frequency quadrant II, and the third two power dividers are respectively connected with the radio frequency TR chips output by the radio frequency quadrant III and the radio frequency quadrant IV.
Based on the micro-assembly process, the bare chip is adhered to the top layer of the microwave multilayer PCB 3 by using the conductive adhesive, and the substrate of the microwave multilayer PCB 3 is made of a material with a thermal expansion coefficient close to that of silicon, so that the problem that the chip is cracked due to the fact that the difference between the thermal expansion coefficients of the two materials is too large can be effectively solved.
Example 4
Referring to fig. 1 to 6, a high-integration frequency conversion channel assembly includes a radio frequency chip 1, a support cavity 2 and a microwave multilayer PCB 3, wherein a top layer and a bottom layer of the microwave multilayer PCB 3 are both connected with a surface-mounted high frequency connector 4 through conductive glue, the radio frequency chip 1 is connected with the top layer of the microwave multilayer PCB 3 through conductive glue, the bottom layer of the microwave multilayer PCB 3 is connected with the support cavity 2 through conductive glue, a cover plate 5 is installed on the top layer of the microwave multilayer PCB 3, the microwave multilayer PCB 3 includes a frequency conversion receiving channel 6 and a frequency conversion transmitting channel 7, a high local oscillation power division network and a low local oscillation power division network are built in the microwave multilayer PCB 3, a signal is divided into local oscillation signals for the frequency conversion transmitting channel 7 sequentially through the high local oscillation power division network and the low local oscillation power division network, a vertical transition hole is formed in the microwave multilayer PCB 3, the vertical transition hole penetrates through the microwave multilayer PCB 3, an excitation signal is transmitted to the variable frequency transmission channel 7, the excitation signal passes through the vertical transition hole after up-conversion, filtering and amplification, and then is output after power distribution.
The microwave multilayer PCB 3 sequentially comprises a radio frequency signal layer, a power supply control line layer, a high local oscillation signal layer, a low local oscillation signal layer and an excitation signal layer which are connected together from top to bottom.
The frequency conversion transmitting channel 7 comprises a common branch and four branch links connected with the common branch, the common branch is used for finishing the up-conversion, filtering and amplification of an excitation signal, and the branch links are used for distributing the power of a transmitting signal to a radio frequency quadrant I output, a radio frequency quadrant II output, a radio frequency quadrant III output and a radio frequency quadrant IV output.
The common branch comprises a first intermediate frequency amplifier, a first band-pass filter, a second intermediate frequency amplifier, a mixer, a first radio frequency amplifier, a first radio frequency band-pass filter, a second radio frequency band-pass filter, a first two-way power divider, a second two-way power divider and a third two-way power divider, wherein the first intermediate frequency amplifier, the first band-pass filter, the second intermediate frequency amplifier, the mixer, the first radio frequency amplifier, the first radio frequency band-pass filter, the second radio frequency amplifier, the second radio frequency band-pass filter and the first two-way power divider are sequentially connected in series, and the first two-way power divider is respectively connected with the second two-way power divider and the third two-way power divider.
The four branch links respectively comprise a radio frequency TR chip and a radio frequency digital step attenuator connected with the radio frequency TR chip, the second two power dividers are respectively connected with the radio frequency TR chips output by the radio frequency quadrant I and the radio frequency quadrant II, and the third two power dividers are respectively connected with the radio frequency TR chips output by the radio frequency quadrant III and the radio frequency quadrant IV.
The common branch is arranged at the center of the microwave multilayer PCB 3, and the common branch reaches the back of the microwave multilayer PCB 3 through the vertical transition hole after finishing up-conversion, filtering and amplification of an excitation signal and is output to the transmitting port 8 after power distribution.
The total thickness of whole high integration frequency conversion passageway subassembly is less than 8mm, and the air cavity height between the top layer of microwave multilayer PCB board 3 and the bottom is 4mm, and the thickness of supporting cavity 2 is 1.8mm for section thickness is little, light in weight.
Example 5
Referring to fig. 1 to 8, a high-integration frequency conversion channel assembly includes a radio frequency chip 1, a support cavity 2 and a microwave multilayer PCB 3, wherein a top layer and a bottom layer of the microwave multilayer PCB 3 are both connected with a surface-mounted high frequency connector 4 through conductive glue, the radio frequency chip 1 is connected with the top layer of the microwave multilayer PCB 3 through conductive glue, the bottom layer of the microwave multilayer PCB 3 is connected with the support cavity 2 through conductive glue, a cover plate 5 is installed on the top layer of the microwave multilayer PCB 3, the microwave multilayer PCB 3 includes a frequency conversion receiving channel 6 and a frequency conversion transmitting channel 7, a high local oscillation power division network and a low local oscillation power division network are built in the microwave multilayer PCB 3, a signal is divided into local oscillation signals for the frequency conversion transmitting channel 7 sequentially through the high local oscillation power division network and the low local oscillation power division network, a vertical transition hole is formed in the microwave multilayer PCB 3, the vertical transition hole penetrates through the microwave multilayer PCB 3, an excitation signal is transmitted to the variable frequency transmission channel 7, the excitation signal passes through the vertical transition hole after up-conversion, filtering and amplification, and then is output after power distribution.
The microwave multilayer PCB 3 sequentially comprises a radio frequency signal layer, a power supply control line layer, a high local oscillation signal layer, a low local oscillation signal layer and an excitation signal layer which are connected together from top to bottom.
The frequency conversion transmitting channel 7 comprises a common branch and four branch links connected with the common branch, the common branch is used for finishing the up-conversion, filtering and amplification of an excitation signal, and the branch links are used for distributing the power of a transmitting signal to a radio frequency quadrant I output, a radio frequency quadrant II output, a radio frequency quadrant III output and a radio frequency quadrant IV output.
The common branch comprises a first intermediate frequency amplifier, a first band-pass filter, a second intermediate frequency amplifier, a mixer, a first radio frequency amplifier, a first radio frequency band-pass filter, a second radio frequency band-pass filter, a first two-way power divider, a second two-way power divider and a third two-way power divider, wherein the first intermediate frequency amplifier, the first band-pass filter, the second intermediate frequency amplifier, the mixer, the first radio frequency amplifier, the first radio frequency band-pass filter, the second radio frequency amplifier, the second radio frequency band-pass filter and the first two-way power divider are sequentially connected in series, and the first two-way power divider is respectively connected with the second two-way power divider and the third two-way power divider.
The four branch links respectively comprise a radio frequency TR chip and a radio frequency digital step attenuator connected with the radio frequency TR chip, the second two power dividers are respectively connected with the radio frequency TR chips output by the radio frequency quadrant I and the radio frequency quadrant II, and the third two power dividers are respectively connected with the radio frequency TR chips output by the radio frequency quadrant III and the radio frequency quadrant IV.
The common branch is arranged at the center of the microwave multilayer PCB 3, and the common branch reaches the back of the microwave multilayer PCB 3 through the vertical transition hole after finishing up-conversion, filtering and amplification of an excitation signal and is output to the transmitting port 8 after power distribution.
The frequency conversion receiving channel 6 comprises a radio frequency digital step attenuator, a radio frequency TR chip, a radio frequency filter, a first mixer, a band-pass filter, a second mixer, a first intermediate frequency low-pass filter, a first intermediate frequency amplifier, an intermediate frequency temperature compensation attenuator, a second intermediate frequency amplifier, a second intermediate frequency low-pass filter and a radio frequency doubler, the radio frequency digital step attenuator, the radio frequency TR chip, the radio frequency filter, the first mixer, the band-pass filter, the second mixer, the first intermediate frequency low-pass filter, the first intermediate frequency amplifier, the intermediate frequency temperature compensation attenuator, the second intermediate frequency amplifier and the second intermediate frequency low-pass filter are connected in sequence, and the radio frequency doubler is connected with the first mixer.
The frequency conversion receiving channels 6 are arranged on the microwave multilayer PCB 3 in a rotational symmetry mode, and by adopting the specific layout mode, the consistency of the layout among the frequency conversion receiving channels 6 can be ensured, and further the consistency of the amplitude and the phase is ensured.
Example 6
Referring to fig. 1 to 9, a high-integration frequency conversion channel assembly includes a radio frequency chip 1, a support cavity 2 and a microwave multilayer PCB 3, wherein a top layer and a bottom layer of the microwave multilayer PCB 3 are both connected with a surface-mounted high frequency connector 4 through conductive glue, the radio frequency chip 1 is connected with the top layer of the microwave multilayer PCB 3 through conductive glue, the bottom layer of the microwave multilayer PCB 3 is connected with the support cavity 2 through conductive glue, a cover plate 5 is installed on the top layer of the microwave multilayer PCB 3, the microwave multilayer PCB 3 includes a frequency conversion receiving channel 6 and a frequency conversion transmitting channel 7, a high local oscillation power division network and a low local oscillation power division network are built in the microwave multilayer PCB 3, a signal is divided into local oscillation signals for the frequency conversion transmitting channel 7 sequentially through the high local oscillation power division network and the low local oscillation power division network, a vertical transition hole is formed in the microwave multilayer PCB 3, the vertical transition hole penetrates through the microwave multilayer PCB 3, an excitation signal is transmitted to the variable frequency transmission channel 7, the excitation signal passes through the vertical transition hole after up-conversion, filtering and amplification, and then is output after power distribution.
The microwave multilayer PCB 3 sequentially comprises a radio frequency signal layer, a power supply control line layer, a high local oscillation signal layer, a low local oscillation signal layer and an excitation signal layer which are connected together from top to bottom.
The frequency conversion transmitting channel 7 comprises a common branch and four branch links connected with the common branch, the common branch is used for finishing the up-conversion, filtering and amplification of an excitation signal, and the branch links are used for distributing the power of a transmitting signal to a radio frequency quadrant I output, a radio frequency quadrant II output, a radio frequency quadrant III output and a radio frequency quadrant IV output.
The common branch comprises a first intermediate frequency amplifier, a first band-pass filter, a second intermediate frequency amplifier, a mixer, a first radio frequency amplifier, a first radio frequency band-pass filter, a second radio frequency band-pass filter, a first two-way power divider, a second two-way power divider and a third two-way power divider, wherein the first intermediate frequency amplifier, the first band-pass filter, the second intermediate frequency amplifier, the mixer, the first radio frequency amplifier, the first radio frequency band-pass filter, the second radio frequency amplifier, the second radio frequency band-pass filter and the first two-way power divider are sequentially connected in series, and the first two-way power divider is respectively connected with the second two-way power divider and the third two-way power divider.
The four branch links respectively comprise a radio frequency TR chip and a radio frequency digital step attenuator connected with the radio frequency TR chip, the second two power dividers are respectively connected with the radio frequency TR chips output by the radio frequency quadrant I and the radio frequency quadrant II, and the third two power dividers are respectively connected with the radio frequency TR chips output by the radio frequency quadrant III and the radio frequency quadrant IV.
The common branch is arranged at the center of the microwave multilayer PCB 3, and the common branch reaches the back of the microwave multilayer PCB 3 through the vertical transition hole after finishing up-conversion, filtering and amplification of an excitation signal and is output to the transmitting port 8 after power distribution.
The frequency conversion receiving channel 6 comprises a radio frequency digital step attenuator, a radio frequency TR chip, a radio frequency filter, a first mixer, a band-pass filter, a second mixer, a first intermediate frequency low-pass filter, a first intermediate frequency amplifier, an intermediate frequency temperature compensation attenuator, a second intermediate frequency amplifier, a second intermediate frequency low-pass filter and a radio frequency doubler, the radio frequency digital step attenuator, the radio frequency TR chip, the radio frequency filter, the first mixer, the band-pass filter, the second mixer, the first intermediate frequency low-pass filter, the first intermediate frequency amplifier, the intermediate frequency temperature compensation attenuator, the second intermediate frequency amplifier and the second intermediate frequency low-pass filter are connected in sequence, and the radio frequency doubler is connected with the first mixer.
The frequency conversion receiving channels 6 are rotationally and symmetrically arranged on the microwave multilayer PCB 3.
The radio frequency TR chip comprises a receiving low-noise amplifier, a radio frequency switch and a transmitting driving amplifier, wherein one end of the radio frequency switch is connected with the receiving low-noise amplifier, and the other end of the radio frequency switch is connected with the transmitting driving amplifier.
The micro-assembly of the bare chip and the microwave multilayer PCB 3 are organically combined together, so that a foundation is laid for the miniaturization and integration design of the multi-channel frequency conversion channel.
Claims (9)
1. The utility model provides a high integration frequency conversion passageway subassembly which characterized in that: the microwave multilayer PCB comprises a radio frequency chip (1), a supporting cavity (2) and a microwave multilayer PCB (3), wherein the top layer and the bottom layer of the microwave multilayer PCB (3) are both connected with a surface-mounted high-frequency connector (4) through conductive glue, the radio frequency chip (1) is connected with the top layer of the microwave multilayer PCB (3) through the conductive glue, the bottom layer of the microwave multilayer PCB (3) is connected with the supporting cavity (2) through the conductive glue, a cover plate (5) is installed on the top layer of the microwave multilayer PCB (3), the microwave multilayer PCB (3) comprises a frequency conversion receiving channel (6) and a frequency conversion transmitting channel (7), a high local oscillation power division network and a low local oscillation power division network are arranged in the microwave multilayer PCB (3), signals are divided into local oscillation signals through the high local oscillation power division network and the low local oscillation power division network in sequence and then provide local oscillation signals for the frequency conversion transmitting channel (7), and vertical transition holes are arranged in the microwave multilayer PCB (3), the vertical transition hole penetrates through the microwave multilayer PCB (3) and transmits an excitation signal to the variable-frequency transmitting channel (7), and the excitation signal passes through the vertical transition hole after being subjected to up-conversion, filtering and amplification and then is output after being subjected to power distribution.
2. The highly integrated frequency conversion channel assembly of claim 1, wherein: the microwave multilayer PCB (3) sequentially comprises a radio frequency signal layer, a power supply control line layer, a high local oscillation signal layer, a low local oscillation signal layer and an excitation signal layer which are connected together from top to bottom.
3. The highly integrated frequency conversion channel assembly of claim 1, wherein: the frequency conversion transmitting channel (7) comprises a common branch and four branch links connected with the common branch, the common branch is used for finishing the up-conversion, filtering and amplification of an excitation signal, and the branch links are used for distributing the power of a transmitting signal to a radio frequency quadrant I output, a radio frequency quadrant II output, a radio frequency quadrant III output and a radio frequency quadrant IV output.
4. A highly integrated frequency conversion channel assembly in accordance with claim 3, wherein: the common branch comprises a first intermediate frequency amplifier, a first band-pass filter, a second intermediate frequency amplifier, a mixer, a first radio frequency amplifier, a first radio frequency band-pass filter, a second radio frequency band-pass filter, a first two-way power divider, a second two-way power divider and a third two-way power divider, wherein the first intermediate frequency amplifier, the first band-pass filter, the second intermediate frequency amplifier, the mixer, the first radio frequency amplifier, the first radio frequency band-pass filter, the second radio frequency amplifier, the second radio frequency band-pass filter and the first two-way power divider are sequentially connected in series, and the first two-way power divider is respectively connected with the second two-way power divider and the third two-way power divider.
5. A highly integrated frequency conversion channel assembly in accordance with claim 3, wherein: the four branch links respectively comprise a radio frequency TR chip and a radio frequency digital step attenuator connected with the radio frequency TR chip, the second two power dividers are respectively connected with the radio frequency TR chips output by the radio frequency quadrant I and the radio frequency quadrant II, and the third two power dividers are respectively connected with the radio frequency TR chips output by the radio frequency quadrant III and the radio frequency quadrant IV.
6. A highly integrated frequency conversion channel assembly in accordance with claim 3, wherein: the common branch is arranged at the center of the microwave multilayer PCB (3), and the common branch reaches the back of the microwave multilayer PCB (3) through a vertical transition hole after finishing up-conversion, filtering and amplification of an excitation signal and is output to an emission port (8) after power distribution.
7. The highly integrated frequency conversion channel assembly of claim 1, wherein: the frequency conversion receiving channel (6) comprises a radio frequency digital step attenuator, a radio frequency TR chip, a radio frequency filter, a first mixer, a band-pass filter, a second mixer, a first intermediate frequency low-pass filter, a first intermediate frequency amplifier, an intermediate frequency temperature compensation attenuator, a second intermediate frequency amplifier, a second intermediate frequency low-pass filter and a radio frequency doubler, the radio frequency digital step attenuator, the radio frequency TR chip, the radio frequency filter, the first mixer, the band-pass filter, the second mixer, the first intermediate frequency low-pass filter, the first intermediate frequency amplifier, the intermediate frequency temperature compensation attenuator, the second intermediate frequency amplifier and the second intermediate frequency low-pass filter are connected in sequence, and the radio frequency doubler is connected with the first mixer.
8. The highly integrated frequency conversion channel assembly of claim 1, wherein: the frequency conversion receiving channels (6) are rotationally and symmetrically arranged on the microwave multilayer PCB (3).
9. The highly integrated frequency conversion channel assembly of claim 5, wherein: the radio frequency TR chip comprises a receiving low-noise amplifier, a radio frequency switch and a transmitting driving amplifier, wherein one end of the radio frequency switch is connected with the receiving low-noise amplifier, and the other end of the radio frequency switch is connected with the transmitting driving amplifier.
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| CN112803898B true CN112803898B (en) | 2021-06-22 |
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| CN116192180B (en) * | 2023-04-25 | 2023-07-07 | 中国电子科技集团公司信息科学研究院 | Universal reconfigurable radio frequency receiving and transmitting microsystem |
| CN116707573B (en) * | 2023-05-24 | 2024-01-26 | 苏州莱尔微波技术有限公司 | Variable frequency channel assembly |
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| CN207008054U (en) * | 2017-06-29 | 2018-02-13 | 成都瑞达物联科技有限公司 | One-board reception/front end of emission millimetre-wave radar |
| CN112290890A (en) * | 2020-09-21 | 2021-01-29 | 南京微毫科技有限公司 | Chaotic confidential up-down frequency conversion assembly and method |
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| DE10300955B4 (en) * | 2003-01-13 | 2005-10-27 | Epcos Ag | Radar transceiver for microwave and millimeter wave applications |
| GB2466648B (en) * | 2008-12-30 | 2011-09-28 | Wolfson Microelectronics Plc | Apparatus and method for biasing a transducer |
| CN105305075B (en) * | 2015-11-23 | 2019-02-26 | 中国电子科技集团公司第五十四研究所 | A kind of covering type millimetre-wave satellite communication phased array antenna |
| CN206481294U (en) * | 2017-01-20 | 2017-09-08 | 成都瑞迪威科技有限公司 | Millimeter wave 4 closes 1 multi-functional reception chip |
| CN106603090B (en) * | 2017-01-20 | 2022-10-11 | 成都瑞迪威科技有限公司 | 12-channel receiving-transmitting frequency conversion channel device |
| US10374552B1 (en) * | 2018-04-13 | 2019-08-06 | Bae Systems Information And Electronic Systems Integration Inc. | Mixer driver circuit with improved slew rate |
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| CN111464243A (en) * | 2020-04-02 | 2020-07-28 | 上海航天测控通信研究所 | Down converter for communication simulator |
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| CN207008054U (en) * | 2017-06-29 | 2018-02-13 | 成都瑞达物联科技有限公司 | One-board reception/front end of emission millimetre-wave radar |
| CN112290890A (en) * | 2020-09-21 | 2021-01-29 | 南京微毫科技有限公司 | Chaotic confidential up-down frequency conversion assembly and method |
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