CN112803164A - Miniaturized multi-frequency antenna and manufacturing method thereof - Google Patents
Miniaturized multi-frequency antenna and manufacturing method thereof Download PDFInfo
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- CN112803164A CN112803164A CN202011624246.8A CN202011624246A CN112803164A CN 112803164 A CN112803164 A CN 112803164A CN 202011624246 A CN202011624246 A CN 202011624246A CN 112803164 A CN112803164 A CN 112803164A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 239000000919 ceramic Substances 0.000 claims abstract description 125
- 239000002184 metal Substances 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 24
- 238000009792 diffusion process Methods 0.000 claims abstract description 6
- 230000005855 radiation Effects 0.000 claims description 16
- 238000003466 welding Methods 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 4
- 230000008602 contraction Effects 0.000 description 10
- 238000009413 insulation Methods 0.000 description 5
- 229910010293 ceramic material Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 230000005489 elastic deformation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/002—Protection against seismic waves, thermal radiation or other disturbances, e.g. nuclear explosion; Arrangements for improving the power handling capability of an antenna
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/0428—Substantially flat resonant element parallel to ground plane, e.g. patch antenna radiating a circular polarised wave
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/045—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means
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Abstract
The invention relates to the technical field of circularly polarized antennas of Beidou systems, in particular to a miniaturized multi-frequency antenna which comprises a circuit board, wherein the circuit board comprises at least two ceramic antennas which are arranged in a stacked mode and have different frequency bands and at least one ceramic antenna which is arranged independently, an elastic connecting sheet is arranged between a feed needle and a ceramic dielectric layer and comprises an annular inner ring and an annular outer ring, the annular inner ring and the annular outer ring are connected through a connecting end and then expand in a diffusion mode along the axial direction, the annular inner ring is attached to the feed needle, and the annular outer ring is attached to the inner wall of a metal through hole in the ceramic dielectric layer. The invention effectively improves the low elevation gain of each frequency band, avoids the damage of the ceramic medium layer in the welding process by using the elastic connecting sheet, and can solve the problem of local damage of the connecting part caused by impact in the use process due to the elasticity of the elastic connecting sheet relative to welding. Meanwhile, the invention also discloses a manufacturing method of the miniaturized multi-frequency antenna, which has the same technical effect.
Description
Technical Field
The invention relates to the technical field of circularly polarized antennas of Beidou systems, in particular to a miniaturized multi-frequency antenna and a manufacturing method thereof.
Background
The conventional multi-frequency antenna of the Beidou system is in a laminated form or a tiled combination, wherein the laminated form is from the lower layer to the upper layer, the size is smaller and smaller, but the bandwidth of the frequency band of the antenna is required to be narrow, the frequency band is high, the frequency interval is large, and the available space of the handheld terminal is generally long, so that the tiled form is more common, but the size of the antenna is larger due to the tiled combination mode, and the antenna is difficult to be widely used in the handheld terminal.
In order to solve the above problems, in the prior art, a plurality of frequency bands are covered by a combined multi-frequency antenna which is formed by stacking a ceramic antenna and an independent ceramic antenna, wherein the frequency bands with small mutual influence are stacked, the area of the antenna is effectively reduced, the frequency bands with serious interference are independently arranged, and good isolation can be ensured. In the structure, the feed pin of the ceramic antenna is connected with the ceramic dielectric layer in a welding mode, and in the welding process, thermal stress is generated inside the ceramic material due to the uneven heating inside the ceramic dielectric layer, so that the ceramic material can be locally damaged under the condition, and the quality of the whole multi-frequency antenna is affected.
In view of the above problems, the present designer is based on the practical experience and professional knowledge that are abundant for many years in engineering application of such products, and is engaged with the application of theory to actively make research and innovation, so as to create a miniaturized multi-frequency antenna and a manufacturing method thereof, which are more practical.
Disclosure of Invention
The invention provides a miniaturized multi-frequency antenna, thereby effectively solving the problems in the background art, and simultaneously, the invention also requests to protect the manufacturing method of the miniaturized multi-frequency antenna, and the miniaturized multi-frequency antenna has the same technical effect.
In order to achieve the purpose, the invention adopts the technical scheme that:
miniaturized multifrequency antenna, including the circuit board, still including set up in following structure on the circuit board:
at least two ceramic antennas which are stacked from bottom to top relative to the circuit board and have different frequency bands, wherein the top surfaces and the bottom surfaces of the stacked ceramic antennas are square; the antenna comprises at least one independently arranged ceramic antenna, wherein the top surface and the bottom surface of the independently arranged ceramic antenna are rectangular; the central lines of the stacked ceramic antennas are superposed and coplanar with the central planes of the two side surfaces of the short side of the independently arranged ceramic antennas, and the two side surfaces are covered with metal layers; the ceramic antenna sequentially comprises a metal reflecting layer, a ceramic dielectric layer and a radiation patch layer from bottom to top;
a metalized hole for a feed pin of the ceramic antenna to penetrate through is formed in the circuit board, a pad structure is arranged on the bottom surface of the circuit board opposite to the mounting surface of the ceramic antenna, and the metalized hole is electrically connected with the pad structure;
an elastic connecting sheet is arranged between the feed needle and the ceramic dielectric layer and comprises an annular inner ring and an annular outer ring, the annular inner ring and the annular outer ring are connected through a connecting end and then expand in a diffusion shape along the axial direction, the annular inner ring is attached to the feed needle, and the annular outer ring is attached to the inner wall of the metal via hole in the ceramic dielectric layer.
Further, the metallized hole is of an arc-shaped structure.
Furthermore, the radiation patch layer of the independently arranged ceramic antenna is connected with the metal layers on the side surfaces of the two sides.
Further, the feed pin is provided with a contraction section, and the formed step surface limits the elastic connecting sheet.
Furthermore, an insulating layer is arranged around the periphery of the feed needle and at least partially filled in a gap between the annular inner ring and the annular outer ring.
The manufacturing method of the miniaturized multi-frequency antenna comprises the following steps:
at least two ceramic antennas are stacked on the circuit board, and the top surfaces and the bottom surfaces of the ceramic antennas are square;
the antenna comprises a circuit board, at least one ceramic antenna, a first antenna and a second antenna, wherein the circuit board is provided with the ceramic antenna;
the central lines of the stacked ceramic antennas are overlapped, the central lines are coplanar with the central planes of the two side surfaces of the short side of the independently arranged ceramic antennas, and the two side surfaces are covered with metal layers;
the ceramic antennas are sequentially provided with a metal reflecting layer, a ceramic dielectric layer and a radiation patch layer from bottom to top; a metalized hole for a feed pin of the ceramic antenna to penetrate through is formed in the circuit board, a pad structure is arranged on the bottom surface of the circuit board opposite to the mounting surface of the ceramic antenna, and the metalized hole is electrically connected with the pad structure;
the feed needle is connected with the ceramic dielectric layer through an elastic connecting sheet, wherein the elastic connecting sheet comprises an annular inner ring and an annular outer ring, the annular inner ring and the annular outer ring are connected through a connecting end and then expand in a diffusion mode along the axial direction, the annular inner ring is attached to the feed needle, and the annular outer ring is attached to the inner wall of the metal via hole in the ceramic dielectric layer.
Further, the metalized holes of the feed pins of the ceramic antennas on the bottom layer are arranged to be arc-shaped structures.
Furthermore, the radiation patch layer of the independently arranged ceramic antenna is connected with the metal layers on the two side surfaces.
Further, a contraction section is arranged on the feeding needle, so that after the feeding needle and the elastic connecting sheet are installed in place, the step formed by the contraction section limits the elastic connecting sheet.
Further, an insulating layer is arranged on the periphery of the feed pin, and the insulating layer is at least partially filled in a gap between the annular inner ring and the annular outer ring.
Through the technical scheme, the invention has the beneficial effects that:
according to the miniaturized multi-frequency antenna, each ceramic antenna can cover a plurality of frequency bands, the frequency bands with small mutual influence are stacked, the area of the antenna is effectively reduced, the frequency bands with serious interference are independently arranged, good isolation can be guaranteed, the radiation range of the antenna can be effectively improved through the arrangement of the side metal layers of the independently arranged ceramic antennas, the low elevation gain of each frequency band is effectively improved through the arrangement mode, damage to a ceramic medium layer in the welding process is avoided through the use of the elastic connecting sheet, and compared with welding, the elasticity of the elastic connecting sheet can solve the problem that the local damage of a connecting part caused by collision is influenced in the using process.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a miniaturized multi-frequency antenna;
FIG. 2 is a top view of FIG. 1;
FIG. 3 is a side view of a ceramic antenna;
FIG. 4 is a schematic diagram of the stacked ceramic antennas of FIG. 2 rotated by 45;
FIG. 5 is a schematic structural diagram of a circuit board;
fig. 6 is a cross-sectional view of a miniaturized multi-frequency antenna;
FIG. 7 is a cross-sectional view of the mounting of the flexible connection tab and insulation layer relative to the feed pin;
FIG. 8 is a cross-sectional view of an elastic web;
FIG. 9 is a schematic diagram of an optimized mode of a feed pin;
FIG. 10 is a schematic view of the mounting of the flexible connecting tab and the insulating layer relative to the feed pin;
reference numerals: 1. a circuit board; 11. metallizing the hole; 2. a ceramic antenna; 2-1, a first stacked antenna; 2-2, a second stacked antenna; 2-3, a separate antenna; 21. a metal reflective layer; 22. a ceramic dielectric layer; 23. a radiation patch layer; 3. a side surface; 4. a central plane; 5. a metal layer; 6. a feed pin; 61. a contraction section; 7. an elastic connecting sheet; 71. an annular inner ring; 72. an annular outer ring; 73. a connecting end; 8. an insulating layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it should be noted that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like are based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, or may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art. This embodiment is written in a progressive manner.
As shown in fig. 1 and 2, a miniaturized multi-frequency antenna includes a circuit board 1, and further includes the following structures disposed on the circuit board 1: at least two ceramic antennas 2 which are stacked from bottom to top and have different frequency bands are arranged relative to the circuit board 1, the top surfaces and the bottom surfaces of the stacked ceramic antennas 2 are both square, in the embodiment, the two ceramic antennas 2 are named as a first stacked antenna 2-1 and a second stacked antenna 2-2 from bottom to top respectively; at least one independent ceramic antenna 2, in the embodiment, the independent ceramic antenna 2 is taken as an example, the top surface and the bottom surface of the antenna are both rectangular, and the antenna is named as an independent antenna 2-3 in the embodiment; the central lines of the stacked ceramic antennas 2 are superposed and coplanar with the central planes 4 of the side surfaces 3 at two sides of the short side of the independently arranged ceramic antennas, and the side surfaces 3 at two sides are covered with metal layers 5.
According to the miniaturized multi-frequency antenna, each ceramic antenna 2 can cover a plurality of frequency bands, the frequency bands with small mutual influence are stacked, the area of the antenna is effectively reduced, the frequency bands with serious interference are independently arranged, good isolation can be guaranteed, the radiation range of the antenna can be effectively enlarged through the arrangement of the metal layer 5 on the side face 3 of the ceramic antenna 2 which is independently arranged, and the low elevation gain of each frequency band is effectively enlarged through the arrangement mode.
The ceramic antenna 2 sequentially comprises a metal reflecting layer 21, a ceramic dielectric layer 22 and a radiation patch layer 23 from bottom to top, the thickness range of each layer is set according to actual needs, the lower the frequency of an antenna signal is, the longer the wiring of an antenna unit is, and the more occupied space is, so that the first stacked antenna 2-1 with lower frequency and larger occupied space is arranged at the bottom layer, and the second stacked antenna 2-2 with higher frequency and smaller occupied space is arranged at the top layer in the embodiment.
Under the premise of ensuring that the central lines of the stacked ceramic antennas 2 are superposed and coplanar with the central planes 4 of the side surfaces 3 at two sides of the short side of the independently arranged ceramic antennas, the invention has the following two implementation modes:
the first method is as follows: as shown in fig. 2, one diagonal of the square is at 45 ° to the center plane;
the second method comprises the following steps: as shown in fig. 4, one diagonal of the square coincides with the central plane.
As shown in fig. 5, the wiring board 1 is provided with a metallized hole 11 through which the feed pin 6 of the ceramic antenna 2 passes, the wiring board 1 is provided with a land structure on a bottom surface opposite to the mounting surface of the ceramic antenna 2, the metallized hole 11 is electrically connected to the land structure, and a connector or the like is also provided on the side of the land structure. In order to adapt to the first and second manners, the metallized holes corresponding to the feed pins 6 of the bottom ceramic antenna 2 on the circuit board 1 may be set to have an arc-shaped structure, so as to increase the versatility of the circuit board 1, so that the stacked ceramic antennas 2 can directly realize the change of the angle on the circuit board 1 of the same model in a rotating manner, the change of the angle does not affect the connectivity with the metallized holes 11, and certainly, the feed pins 6 of the top ceramic antenna 2 need to be set on the central line, thereby ensuring that the center is unchanged in the rotating process.
In the prior art, the feed pin 6 of the ceramic antenna 2 is connected with the ceramic dielectric layer 22 by welding, during the welding process, due to the uneven heating inside the ceramic dielectric layer 22, thermal stress is generated inside the ceramic material, and the ceramic material may be locally damaged in such a situation, so as to avoid the above problems, the invention improves the welding mode:
as shown in fig. 6 to 8, an elastic connecting sheet 7 is disposed between the feeding needle 6 and the ceramic dielectric layer 22, the elastic connecting sheet 7 includes an annular inner ring 71 and an annular outer ring 72, which are connected by a connecting terminal 73 and then spread in a diffused manner along the axial direction, the annular inner ring 71 is attached to the feeding needle 6, the annular outer ring 72 is attached to the inner wall of the metal via hole 11 on the ceramic dielectric layer 22, the attached annular inner ring 71 and the attached annular outer ring 72 generate restoring force by elastic deformation, the axial positioning of the feed pin 6 with respect to the ceramic medium layer 22 is achieved by the frictional force generated by the restoring force, while also ensuring the positioning of the feed pin 6 in the radial direction by the coaxiality of the annular inner ring 71 and the annular outer ring 72, the elastic connecting sheet 7 replaces solder for connection and conduction, so that high temperature generated in the welding process can be avoided, and the feed pin 6 is led out from the metal via hole 11 and then welded and fixed with the pad structure at the other end of the circuit board 1. The use of the elastic connecting sheet 7 can also improve the anti-vibration performance of the antenna, and compared with the rigid connection of welding, the elasticity of the elastic connecting sheet 7 can solve the problem of local damage of the connecting part caused by impact in the using process.
As a preference of the above embodiment, the radiation patch layer 23 of the independently provided ceramic antenna 2 is connected to the metal layers 5 of the both side surfaces 3.
In order to facilitate the installation of the elastic connection piece 7, it is preferable that the feeding pin 6 enters from the side where the connection end 73 is located, and in order to ensure the positioning accuracy during the installation, as shown in fig. 9, a contraction section 61 is provided on the feeding pin 6, so that the elastic connection piece 7 is restricted by a step formed by the contraction section 61 after the feeding pin 6 and the elastic connection piece 7 are installed in place, that is, the elastic connection piece 7 is restricted in the contraction section 61.
Because the stacking of the ceramic antennas 2 in different levels may cause the feed pin 6 to have a local insulation requirement when penetrating through the ceramic dielectric layers 22 in different levels, the antenna further includes an insulating layer 8, the insulating layer 8 is disposed around the periphery of the feed pin 6, as shown in fig. 7 and 10, and the insulating layer 8 is at least partially filled in the gap between the annular inner ring 71 and the annular outer ring 72, so that the insulating effect is better, and the insulating range can be expanded at the gap between the two layers of the ceramic antennas 2.
The manufacturing method of the miniaturized multi-frequency antenna comprises the following steps: at least two ceramic antennas 2 are stacked on the circuit board 1, and the top surfaces and the bottom surfaces of the ceramic antennas 2 are square; at least one ceramic antenna 2 is independently arranged on the circuit board 1, and the top surface and the bottom surface of the ceramic antenna 2 are both rectangular; the central lines of the stacked ceramic antennas 2 are overlapped and coplanar with the central planes 4 of the side surfaces 3 at the two sides of the short side of the ceramic antenna 2 which is independently arranged, and the side surfaces 3 at the two sides are covered with metal layers 5.
By the method, each ceramic antenna 2 of the miniaturized multi-frequency antenna can cover a plurality of frequency bands, the frequency bands with small mutual influence are stacked, the area of the antenna is effectively reduced, the frequency bands with serious interference are independently arranged, good isolation can be guaranteed, the radiation range of the antenna can be effectively enlarged by arranging the metal layer 5 on the side surface 3 of the ceramic antenna 2 which is independently arranged, and the low elevation gain of each frequency band is effectively enlarged by the arrangement mode. Specific embodiments can be seen in fig. 1 to 4, which are not described herein again.
In the implementation process, each ceramic antenna 2 is sequentially provided with a metal reflecting layer 21, a ceramic dielectric layer 22 and a radiation patch layer 23 from bottom to top.
On the premise of ensuring that the central lines of the stacked ceramic antennas 2 coincide and are coplanar with the central planes 4 of the side surfaces 3 on two sides of the short side of the independently arranged ceramic antennas, the following two ways are provided in the embodiment:
the first method is as follows: as shown in fig. 2, one diagonal of the square is at 45 ° to the center plane;
the second method comprises the following steps: as shown in fig. 4, one diagonal of the square coincides with the central plane.
A metallized hole 11 for a feed pin 6 of the ceramic antenna 2 to penetrate through is arranged on the circuit board 1, and a pad structure is arranged on the bottom surface of the circuit board 1 opposite to the mounting surface of the ceramic antenna 2, so that the metallized hole is electrically connected with the pad structure. In the process of the change of the setting mode, the stability of the position of the independently arranged ceramic antenna 2 can be always ensured, the angle of the stacked ceramic antenna 2 is changed, and in the process of the change of the angle, the center of each square is taken as a rotating point, in order to adapt to the first mode and the second mode, in the embodiment, the metalized hole of the feed pin 6 of each ceramic antenna 2 at the bottom layer on the circuit board 1 can be set to be in an arc structure, so that the universality of the circuit board 1 is increased, the stacked ceramic antennas 2 can be directly changed in angle on the circuit board 1 of the same model in a rotating mode, and the change of the angle does not influence the connectivity with the metalized hole 11.
Referring to fig. 6 to 8, in the setting process, the feeding pin 6 and the ceramic dielectric layer 22 are connected by the elastic connection sheet 7, the elastic connection sheet 7 includes an annular inner ring 71 and an annular outer ring 72, which are connected by the connection end 73 and then spread out in a diffusion shape along the axial direction, the annular inner ring 71 is attached to the feeding pin 6, the annular outer ring 72 is attached to the inner wall of the metal via hole 11 on the ceramic dielectric layer 22, the attached annular inner ring 71 and the annular outer ring 72 generate restoring force through elastic deformation, the axial positioning of the feeding pin 6 relative to the ceramic dielectric layer 22 is realized through the friction force generated by the restoring force, the positioning of the feeding pin 6 in the radial direction is also ensured through the coaxiality of the annular inner ring 71 and the annular outer ring 72, the connection and the conduction are performed by the elastic connection sheet 7 instead of solder, the high temperature generated in the welding process can be avoided, and the, and the other end of the circuit board 1 is welded and fixed with the pad structure. The use of the elastic connecting piece 7 is as described above and will not be described in detail here.
As a preferable example of the above embodiment, the radiation patch layer 23 of the ceramic antenna 2 provided separately is connected to the metal layers 5 of the both side surfaces 3.
In order to facilitate the installation of the elastic connecting piece 7, firstly, the elastic connecting piece 7 is installed in the ceramic medium layer 22, then, the feed pin 6 enters from the side where the connecting end 73 is located, in order to ensure the positioning accuracy in the installation process, as shown in fig. 9, a contraction section 61 is arranged on the feed pin 6, so that after the feed pin 6 and the elastic connecting piece 7 are installed in place, the elastic connecting piece 7 is limited to the contraction section 61 through a step formed by the contraction section 61, and then, in the process of adjusting the position of the feed pin 6, the elastic connecting piece 7 moves along with the feed pin 6.
Because the stacking of the ceramic antennas 2 in different levels may cause the feed pin 6 to have a local insulation requirement when penetrating through the ceramic dielectric layers 22 in different levels, the insulating layer 8 is disposed on the periphery of the feed pin 6, as shown in fig. 7 and 10, and the insulating layer 8 is at least partially filled in the gap between the annular inner ring 71 and the annular outer ring 72, so that the insulation effect is better, the insulation range can be expanded at the gap between the two layers of ceramic antennas 2, and the insulating layer 8 may be a sleeve-shaped structure or filled insulating glue.
It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. Miniaturized multifrequency antenna, including the circuit board, its characterized in that still including set up in following structure on the circuit board:
at least two ceramic antennas which are stacked from bottom to top relative to the circuit board and have different frequency bands, wherein the top surfaces and the bottom surfaces of the stacked ceramic antennas are square; the antenna comprises at least one independently arranged ceramic antenna, wherein the top surface and the bottom surface of the independently arranged ceramic antenna are rectangular; the central lines of the stacked ceramic antennas are superposed and coplanar with the central planes of the two side surfaces of the short side of the independently arranged ceramic antennas, and the two side surfaces are covered with metal layers; the ceramic antenna sequentially comprises a metal reflecting layer, a ceramic dielectric layer and a radiation patch layer from bottom to top;
a metalized hole for a feed pin of the ceramic antenna to penetrate through is formed in the circuit board, a pad structure is arranged on the bottom surface of the circuit board opposite to the mounting surface of the ceramic antenna, and the metalized hole is electrically connected with the pad structure;
an elastic connecting sheet is arranged between the feed needle and the ceramic dielectric layer and comprises an annular inner ring and an annular outer ring, the annular inner ring and the annular outer ring are connected through a connecting end and then expand in a diffusion shape along the axial direction, the annular inner ring is attached to the feed needle, and the annular outer ring is attached to the inner wall of the metal via hole in the ceramic dielectric layer.
2. The miniaturized multi-frequency antenna of claim 1 wherein the metallized holes are arc-shaped structures.
3. The miniaturized multi-frequency antenna of claim 1, wherein the radiation patch layer of the independently disposed ceramic antenna is connected to the metal layers on both sides.
4. The miniaturized multifrequency antenna of any of claims 1-3 wherein the feed pin is provided with a constriction, forming a step that constrains the elastic connection patch.
5. The miniaturized multifrequency antenna of claim 1 further comprising an insulating layer disposed around the periphery of the feed pin and at least partially filling the gap between the annular inner ring and the annular outer ring.
6. The manufacturing method of the miniaturized multifrequency antenna is characterized by comprising the following steps:
at least two ceramic antennas are stacked on the circuit board, and the top surfaces and the bottom surfaces of the ceramic antennas are square;
the antenna comprises a circuit board, at least one ceramic antenna, a first antenna and a second antenna, wherein the circuit board is provided with the ceramic antenna;
the central lines of the stacked ceramic antennas are overlapped, the central lines are coplanar with the central planes of the two side surfaces of the short side of the independently arranged ceramic antennas, and the two side surfaces are covered with metal layers;
the ceramic antennas are sequentially provided with a metal reflecting layer, a ceramic dielectric layer and a radiation patch layer from bottom to top; a metalized hole for a feed pin of the ceramic antenna to penetrate through is formed in the circuit board, a pad structure is arranged on the bottom surface of the circuit board opposite to the mounting surface of the ceramic antenna, and the metalized hole is electrically connected with the pad structure;
the feed needle is connected with the ceramic dielectric layer through an elastic connecting sheet, wherein the elastic connecting sheet comprises an annular inner ring and an annular outer ring, the annular inner ring and the annular outer ring are connected through a connecting end and then expand in a diffusion mode along the axial direction, the annular inner ring is attached to the feed needle, and the annular outer ring is attached to the inner wall of the metal via hole in the ceramic dielectric layer.
7. The method according to claim 6, wherein the metallized holes of the feeding pins of the ceramic antennas are arranged in an arc-shaped structure.
8. The method of claim 7, wherein a radiation patch layer of the ceramic antenna is connected to the metal layers on the two side surfaces.
9. The method according to any one of claims 6 to 8, wherein a constriction is provided on the feeding pin, so that a step formed by the constriction restricts the elastic connection piece after the feeding pin and the elastic connection piece are mounted in place.
10. The method as claimed in claim 6, wherein an insulating layer is disposed around the feed pin and at least partially fills a gap between the inner ring and the outer ring.
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| CN202011624246.8A CN112803164B (en) | 2020-12-31 | 2020-12-31 | Miniaturized multi-frequency antenna and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011624246.8A CN112803164B (en) | 2020-12-31 | 2020-12-31 | Miniaturized multi-frequency antenna and manufacturing method thereof |
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| CN112803164A true CN112803164A (en) | 2021-05-14 |
| CN112803164B CN112803164B (en) | 2021-10-15 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201789071U (en) * | 2010-07-23 | 2011-04-06 | 佳邦科技股份有限公司 | Elongated circular polarized antenna structure |
| CN103918126A (en) * | 2011-11-14 | 2014-07-09 | 大陆汽车系统公司 | GPS antenna on-shield/housing with grounding |
| CN204991952U (en) * | 2015-07-06 | 2016-01-20 | 广东盛路通信科技股份有限公司 | Miniaturized handheld quick -witted antenna of multifrequency |
| CN207038727U (en) * | 2017-07-28 | 2018-02-23 | 江苏北斗天汇物联网科技有限公司 | A kind of small-sized double hand-held set antenna based on a Big Dipper generation and GPS |
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2020
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201789071U (en) * | 2010-07-23 | 2011-04-06 | 佳邦科技股份有限公司 | Elongated circular polarized antenna structure |
| CN103918126A (en) * | 2011-11-14 | 2014-07-09 | 大陆汽车系统公司 | GPS antenna on-shield/housing with grounding |
| CN204991952U (en) * | 2015-07-06 | 2016-01-20 | 广东盛路通信科技股份有限公司 | Miniaturized handheld quick -witted antenna of multifrequency |
| CN207038727U (en) * | 2017-07-28 | 2018-02-23 | 江苏北斗天汇物联网科技有限公司 | A kind of small-sized double hand-held set antenna based on a Big Dipper generation and GPS |
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| CN112803164B (en) | 2021-10-15 |
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Effective date of registration: 20240109 Address after: Room 301, floor 3, unit 1, building 13, courtyard 3, gaolizhang Road, Haidian District, Beijing 100095 Patentee after: BEIJING JIUTAIN LIJIAN INFORMATION TECHNOLOGY Co.,Ltd. Address before: 213017 7th, 8th, 9th floor, No.11, Qingyang North Road, Tianning District, Changzhou City, Jiangsu Province Patentee before: CHANGZHOU RENQIAN ELECTRICAL TECHNOLOGY CO.,LTD. |