CN112993561B - Antenna low-profile adapter plate, adapter method and dual-band common-caliber antenna - Google Patents
Antenna low-profile adapter plate, adapter method and dual-band common-caliber antenna Download PDFInfo
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- CN112993561B CN112993561B CN202110439123.5A CN202110439123A CN112993561B CN 112993561 B CN112993561 B CN 112993561B CN 202110439123 A CN202110439123 A CN 202110439123A CN 112993561 B CN112993561 B CN 112993561B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
Abstract
The invention provides an antenna low-profile adapter plate, an adapter method and a dual-band common-caliber antenna, wherein the adapter plate comprises an upper plate and a lower plate; the bottom surface of the lower plate is provided with high-frequency connectors in an array mode, and inner conductors of the high-frequency connectors extend out of the top surface of the lower plate by a preset height; the upper plate array is provided with conductor through holes penetrating through the bottom surface and the top surface, and the conductor through holes are matched with the inner conductors and used for the inner conductors to penetrate through; the bottom surface of the upper plate is provided with a plurality of microstrip wiring grooves, microstrip lines are arranged in the microstrip wiring grooves, one ends of the microstrip lines are connected with low-frequency connectors, the other ends of the microstrip lines extend to preset low-frequency antenna feed points along with the microstrip wiring grooves, and the preset low-frequency antenna feed points are used for being connected with low-frequency antennas. The upper and lower plate structures are adopted, the antenna common apertures of the two frequency bands are effectively integrated, the low-frequency band antenna feed points are uniformly distributed in the high-frequency band antenna feed point array, the switching height is greatly reduced, the space is greatly saved, and cavities are physically separated among all unit paths, so that the radar antenna common aperture integrated circuit is suitable for the development of radar technology.
Description
Technical Field
The invention relates to a common-caliber antenna technology, in particular to an antenna low-profile adapter plate, an adapter method and a dual-band common-caliber antenna.
Background
With the development of times, phased array antennas are more and more popularized, and the integration level of antenna functions is higher and higher, such as radar communication integration, interference and guidance integration, multiband composite guidance and the like. In order to reduce the system volume, the antennas need to be designed with a common aperture, which is equivalent to placing two or more antennas in the area of the original antenna, and the space between the antenna units will inevitably be reduced. The antenna may be rectangular or triangular, full or sparse according to performance requirements, the feed interface positions may also be irregularly arranged, the TR component generally uses a regular layout in order to reduce the variety, the number of channels of the TR component is generally the same as the number of antenna elements, and therefore, the interface of the TR component and the antenna feed interface are difficult to directly correspond to each other physically. Particularly for millimeter wave precision guidance radar antennas, due to the fact that the channel distance is small, the number of channels is large, and the TR component interface and the antenna interface are difficult to directly correspond to each other one by one in physical positions, an antenna adapter plate is needed to complete transition from the TR component interface to the antenna feed interface.
The currently common switching mode is cable switching, in which a plurality of cable assemblies are mounted on a fixing frame and designed as a cable switching board to realize radio frequency connection between a TR assembly and an antenna unit. In the existing cable switching scheme, because the cable utilizes the longitudinal size of the antenna, the height of the system is inevitably increased, and due to poor thermal conductivity of the cable, the temperature of the cable is higher and higher due to heat accumulation during long-time work for a high-power antenna, and the electrical property and reliability are influenced.
The S/Ku dual-frequency common-caliber linear polarization phased array scanning antenna disclosed in chinese patent publication No. CN 109755763 a, wherein the position of the TR component is limited by directly interconnecting the S-band of the low frequency band up and down using a coaxial feeder, and the S-band TR component and the Ku-band TR component cannot be staggered in the transverse direction due to the limited antenna caliber, thereby reducing the space that can be used by each component; for the millimeter wave application of higher frequency, the layout and assembly are very difficult due to smaller channel distance, the finished product rate, the heat dissipation and the reliability are influenced, a filter cannot be placed in the low-frequency antenna, and the utilization space of the TR component is further reduced if the filter is placed in the TR component; and the Ku wave band adopts a method of vertical transition in a dielectric plate and coupling feed by a strip line, so that the loss is large when the Ku wave band is used in millimeter waves, the antenna gain is reduced, and the radar detection distance is influenced.
Disclosure of Invention
In order to solve the defects of the related prior art, the invention provides an antenna low-profile adapter plate, a switching method and a dual-band common-caliber antenna, wherein an upper plate structure and a lower plate structure are adopted, the common calibers of the antennas of two frequency bands are effectively integrated together, the feed points of the low-band antenna are uniformly distributed in and at the periphery of a high-band antenna feed point array, the switching height is greatly reduced, the space is greatly saved, cavities are physically separated among all unit paths, the isolation degree is improved, the antenna low-profile adapter plate is suitable for the development of the radar technology, and the thickness and heat dissipation defects existing in a cable switching scheme are avoided.
In order to realize the purpose of the invention, the following scheme is adopted:
a low-profile adapter plate of a dual-band common-caliber antenna comprises an upper plate and a lower plate which are assembled and used in an overlapping mode;
the bottom surface of the lower plate is provided with high-frequency connectors in an array mode, and inner conductors of the high-frequency connectors extend out of the top surface of the lower plate by a preset height;
the upper plate array is provided with conductor through holes penetrating through the bottom surface and the top surface, and the conductor through holes are matched with the inner conductors and used for the inner conductors to penetrate through; the bottom surface of the upper plate is provided with a plurality of microstrip wiring grooves, microstrip lines are arranged in the microstrip wiring grooves, one end of each microstrip line is connected with a low-frequency connector, the other end of each microstrip line extends to a preset low-frequency antenna feed point along with the microstrip wiring grooves, the preset low-frequency antenna feed point is used for being connected with a low-frequency antenna, the low-frequency antenna comprises a low-frequency radiation unit, a feed shaft and a feed support rod, and one end of the feed shaft and one end of the feed support rod are connected to the bottom surface of the low-frequency radiation unit;
during application, the bottom surface of the upper plate is assembled on the top surface of the lower plate, the top surface of the upper plate is assembled with a high-frequency antenna layer, the high-frequency antenna layer is arrayed with high-frequency patch antenna units, each inner conductor penetrates through each conductor perforation respectively and is connected with the high-frequency patch antenna units, the feeding of the low-frequency antenna is coaxial, the other end of the feeding support rod penetrates through the gap between the high-frequency patch antenna units of the high-frequency antenna layer, after the feeding support rod penetrates through the gap, the other end of the feeding support rod is connected to the top surface of the upper plate, and the other end of the feeding coaxial is connected with a preset low-frequency antenna feeding point.
Furthermore, the bottom surface array of the lower plate is provided with a first mounting groove, and the high-frequency connector is arranged in the first mounting groove in a threaded mounting mode or a soldering tin sintering mode.
Furthermore, the bottom surface of the upper plate is provided with a plurality of second mounting grooves, the number of the second mounting grooves is consistent with that of the microstrip wiring grooves, one end of each microstrip wiring groove is communicated with the corresponding second mounting groove, the corresponding second mounting grooves are distributed on the periphery of the conductor perforated array area, the low-frequency connector is arranged in the corresponding second mounting groove, the preset low-frequency antenna feed points are arranged on the upper plate in an array mode, part of the preset low-frequency antenna feed points are embedded in the conductor perforated array area, and each preset low-frequency antenna feed point is used for correspondingly installing a low-frequency antenna.
Furthermore, the second mounting grooves are distributed on the periphery of the conductor perforation array area and have a preset distance with the conductor perforation array area.
Further, the microstrip line is arranged in the microstrip wiring groove in a conductive adhesive bonding mode or a soldering tin sintering mode, a chip filter or a film filter is arranged on the microstrip line and used for suppressing high-frequency clutter, and the low-frequency connector is arranged in the second mounting groove in a soldering tin sintering mode.
Further, the high-frequency connector is an SMP or SSMP type connector, and the low-frequency connector is an SMP bent pin connector.
Further, the lower plate is provided with a through hole corresponding to the second mounting groove and used for allowing the low-frequency connector to pass through when the lower plate is assembled with the upper plate, the bottom surface of the lower plate is provided with a bottom plate, the bottom plate is provided with a through hole I corresponding to the through hole and used for allowing the low-frequency connector to pass through, and the bottom plate is provided with a through hole II corresponding to the first mounting groove and used for allowing the high-frequency connector to pass through.
A dual-band common-aperture antenna, comprising: the antenna comprises a high-frequency antenna layer, a low-frequency antenna and a low-profile adapter plate of a dual-band common-caliber antenna;
high-frequency patch antenna units are arrayed on the high-frequency antenna layer; the low-frequency antenna comprises a low-frequency radiation unit, a feed coaxial and a feed support rod, wherein one end of the feed coaxial and the feed support rod is connected with the bottom surface of the low-frequency radiation unit;
the bottom surface of the upper plate is assembled on the top surface of the lower plate, the top surface of the upper plate is assembled with a high-frequency antenna layer, and each inner conductor penetrates through each conductor through hole to be connected with the high-frequency patch antenna unit;
the other ends of the feeding coaxial and feeding support rods penetrate through gaps between the high-frequency patch antenna units on the high-frequency antenna layer, after the feeding coaxial and feeding support rods penetrate through the gaps, the other ends of the feeding support rods are connected to the top surface of the upper plate, and the other ends of the feeding coaxial and feeding support rods are connected with a preset low-frequency antenna feeding point.
A low-profile switching method of a dual-band common-caliber antenna comprises the following steps:
providing a lower plate, installing high-frequency connectors on the bottom surface of the lower plate in an array mode, and enabling inner conductors of the high-frequency connectors to extend out of the top surface of the lower plate by a preset height;
providing an upper plate, processing conductor through holes which penetrate through the bottom surface and the top surface of the upper plate and are in an array on the upper plate, wherein the positions and the number of the conductor through holes are matched with those of the inner conductors;
processing a plurality of microstrip wiring grooves on the bottom surface of the upper plate, arranging a microstrip line in each microstrip wiring groove, connecting one end of the microstrip line with the low-frequency connector, and extending the other end of the microstrip line to a preset low-frequency antenna feed point along with the microstrip wiring grooves;
providing a high-frequency antenna layer, wherein the high-frequency antenna layer is provided with high-frequency patch antenna units in an array;
providing a plurality of low-frequency antennas, wherein the number of the low-frequency antennas is consistent with the number of preset low-frequency antenna feed points, and a feed support rod and a feed coaxial are arranged on the bottom surface of a low-frequency radiation unit of the low-frequency antenna;
assembling the upper plate on the top surface of the lower plate, and assembling the high-frequency antenna layer on the top surface of the upper plate, so that the inner conductors respectively penetrate through the conductor through holes to be connected with the high-frequency patch antenna units;
and installing the low-frequency antenna on the surface of the high-frequency antenna layer, enabling the bottom ends of the feed supporting rods to penetrate through the high-frequency antenna layer, enabling the penetrating positions to be located in gaps between the high-frequency patch antenna units, enabling the bottom ends of the feed supporting rods to be connected to the top surface of the upper plate after the penetration, and enabling the bottom ends of the feed coaxial rods to be connected with a preset low-frequency antenna feed point.
Furthermore, the preset low-frequency antenna feed points are arranged on the upper plate in an array mode, part of the preset low-frequency antenna feed points are embedded in the conductor perforated array area, and one low-frequency antenna is correspondingly installed on each preset low-frequency antenna feed point.
Further, the high-frequency connector is arranged on the bottom surface array of the lower plate, and the method specifically comprises the following steps: and processing first mounting grooves in an array on the bottom surface of the lower plate, and mounting the high-frequency connector in the first mounting grooves in a threaded mounting mode or a soldering tin sintering mode.
Further, make microstrip line one end connect low frequency connector, specifically be: a plurality of second mounting grooves communicated with one end of the microstrip wiring groove are machined in the bottom surface of the upper plate, the number of the second mounting grooves is consistent with that of the microstrip wiring groove, the second mounting grooves are distributed on the periphery of the conductor perforated array area and have a preset interval with the conductor perforated array area, and the low-frequency connector is mounted in the second mounting grooves in a soldering tin sintering mode.
The invention has the beneficial effects that:
1. through microstrip switching, the common-caliber design of the antennas in multiple frequency bands is realized, meanwhile, the low-frequency antennas can be uniformly embedded and arranged between the high-frequency patch antenna unit arrays, the two frequency band antennas are reasonably arranged in a staggered manner, the limited space of the switching board is fully utilized, the size and the volume of the switching board and the whole antenna are favorably reduced, the two frequency band antennas are not influenced with each other, the high-frequency switching connector is positioned in the middle area of the bottom surface of the switching board, the low-frequency switching connector is arranged on the periphery of the middle area to form a circle and is separated from the middle area, and the isolation and the relative independence of the switching of the two frequency bands are effectively realized;
2. a novel radio frequency antenna switching scheme is provided, microstrip lines are used for transition, the transverse size of a radio frequency antenna is fully utilized, the traditional cable connection scheme is replaced, the microstrip lines are buried in the middle by utilizing an upper structural plate and a lower structural plate, and compared with the traditional cable scheme, the novel radio frequency antenna switching scheme is lower in height and close to the thickness of the antenna, and the space is greatly saved;
3. through setting the microstrip wiring groove and enabling the second grooves at one end of the microstrip wiring groove to be positioned in the peripheral area of the lower plate and to be in a circle, the other end of the microstrip wiring groove is enabled to extend to different positions, through controlling the extending direction and the extending termination point of the microstrip wiring groove, a plurality of preset low-frequency antenna feed points can be arranged in and out of the conductor perforated array area to form a relatively uniform array, and the space of the adapter plate is further utilized to reduce the size of the adapter plate;
4. cavities are arranged among all unit paths for physical separation, so that the isolation is improved, and the performance of the phased array antenna can be improved; a chip filter, a thin film filter and the like can be placed in the middle of the microstrip line, so that the suppression on clutter in a high-frequency band is improved, the sensitivity of a system in the high-frequency band is improved, the isolation between the two frequency bands is improved, and the performance of the system applied to radar is greatly improved;
5. the high-frequency band antenna is tightly attached to the structural plate by using the microstrip patch antenna, so that the height is reduced; the high-frequency band antenna is in a full-spread mode, is interconnected with the TR component channel interface through SMP or SSMP, does not use switching, can effectively reduce insertion loss and improve antenna gain;
6. the bottom surface of the high-frequency-band antenna plate is not paved, the upper structural plate is used as an antenna reference ground, and the condition that the ground of the antenna plate is in poor contact with the upper structural plate after the bottom surface of the antenna layer is paved to form virtual ground, influence performance and even generate resonance is avoided;
7. in the prior art, a method of vertically transitioning in a dielectric plate and coupling feeding by using a strip line is adopted, so that the loss is large and the antenna gain is reduced in millimeter waves;
8. compare in prior art 'S S wave band TR subassembly and Ku wave band TR subassembly can't staggered problem in the transverse direction, the microstrip line interconnection of horizontal overall arrangement is used in this application, the thickness has not only been reduced greatly, can also make two frequency channel antennas can crisscross/cross arrangement in same region, two frequency channel connectors are in middle zone and periphery respectively, make TR subassembly position not restricted by antenna position, can make TR subassembly make full use of space, reasonable overall arrangement, to high-power TR subassembly, the heat dissipation heat-retaining is more favourable.
Drawings
The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.
Fig. 1 is a front view of a three-dimensional structure of an interposer and a dual-band common-aperture antenna according to an embodiment of the present application.
Fig. 2 is a back view of the interposer and dual-band common-aperture antenna in the embodiment of the present application.
Fig. 3 is a partial view of a cross-sectional structure of an interposer and a dual-band common-aperture antenna according to an embodiment of the present application.
Fig. 4 is a front view of the upper plate three-dimensional structure according to the embodiment of the present application.
Fig. 5 is a back view of a lower plate three-dimensional structure according to an embodiment of the present application.
Fig. 6 is a front view of a lower plate perspective structure according to an embodiment of the present application.
Fig. 7 is a perspective structural back view of a lower plate mounted low frequency connector and low frequency antenna of an embodiment of the present application.
Fig. 8 is a partial view of a cross-sectional configuration of a lower plate mounted low frequency connector and low frequency antenna of an embodiment of the present application.
Fig. 9 is a perspective structural view of a low-frequency antenna according to an embodiment of the present application.
Reference numerals: the antenna comprises a lower plate 1, a first mounting groove 10, a bottom plate 11, an upper plate 2, a conductor through hole 20, a microstrip wiring groove 21, a second mounting groove 211, a preset low-frequency antenna feeding point 212, a high-frequency antenna layer 3, a low-frequency antenna 4, a low-frequency radiation unit 41, a feeding coaxial 42, a feeding support rod 43, a low-frequency connector 44, a microstrip line 45, a high-frequency patch antenna unit 5, a high-frequency connector 51 and an inner conductor 52.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings, but the described embodiments of the present invention are a part of the embodiments of the present invention, not all of the embodiments of the present invention.
Example one
The present embodiment provides a low-profile adapter plate for a dual-band common-aperture antenna, as shown in fig. 1 and 2, comprising an upper plate 2 and a lower plate 1 which are assembled in an overlapping manner.
Specifically, as shown in fig. 3 and 4, the high-frequency connectors 51 are mounted on the bottom surface of the lower plate 1 in an array, and the inner conductors 52 of the high-frequency connectors 51 protrude upward from the top surface of the lower plate 1 by a predetermined height.
Specifically, as shown in fig. 5 to 8, the upper plate 2 has an array of conductor through holes 20 penetrating through the bottom surface and the top surface, and the conductor through holes 20 are matched with the inner conductors 52 and used for the inner conductors 52 to pass through; the bottom surface of the upper plate 2 is provided with a plurality of microstrip wiring grooves 21, microstrip lines 45 are arranged in the microstrip wiring grooves 21, one end of each microstrip line 45 is connected with a low-frequency connector 44, the other end of each microstrip line 45 extends to a preset low-frequency antenna feed point 212 along with the microstrip wiring grooves 21, and the preset low-frequency antenna feed point 212 is used for being connected with the low-frequency antenna 4.
As shown in fig. 9, the low-frequency antenna 4 includes a low-frequency radiating element 41, a feeding coaxial line 42, and a feeding supporting rod 43, and one end of the feeding coaxial line 42 and one end of the feeding supporting rod 43 are connected to the bottom surface of the low-frequency radiating element 41.
During application, as shown in fig. 1, 2, 3, and 8, the bottom surface of the upper plate 2 is mounted on the top surface of the lower plate 1, the top surface of the upper plate 2 is mounted with the high-frequency antenna layer 3, the high-frequency antenna layer 3 is arrayed with the high-frequency patch antenna units 5, each inner conductor 52 passes through each conductor through hole 20 and is connected with the high-frequency patch antenna unit 5, the other ends of the feed coaxial 42 and the feed support rod 43 of the low-frequency antenna 4 pass through the gap between the high-frequency patch antenna units 5 of the high-frequency antenna layer 3, after passing through, the other end of the feed support rod 43 is connected to the top surface of the upper plate 2, and the other end of the feed coaxial 42 is connected with the preset low-frequency antenna feed point 212.
As a further specific embodiment, as shown in fig. 3, the first mounting grooves 10 are formed in the bottom surface of the lower plate 1 in an array, and the high-frequency connectors 51 are mounted in the first mounting grooves 10 by a screw-mounting method or a solder-sintering method. The high-frequency connector 51 is an SMP or SSMP type connector, and the inner conductor 52 is a long feed pin and has a coaxial structure.
As a further specific embodiment, as shown in fig. 5, 7 and 8, the bottom surface of the upper plate 2 is provided with a plurality of second mounting grooves 211, the number of the second mounting grooves 211 is the same as that of the microstrip wiring grooves 21, one end of the microstrip wiring grooves 21 is communicated with the second mounting grooves 211, and the second mounting grooves 211 are distributed on the periphery of the array region of the conductor through holes 20 and have a predetermined distance from the array region of the conductor through holes 20. The preset low-frequency antenna feed points 212 are arranged on the upper plate 2 in an array manner, and a part of the preset low-frequency antenna feed points 212 are embedded in the array area of the conductor through holes 20, and each preset low-frequency antenna feed point 212 is used for correspondingly installing one low-frequency antenna 4. Specifically, the microstrip line 45 is disposed in the microstrip wiring groove 21 by a conductive adhesive bonding method or a solder sintering method, and the low-frequency connector 44 is disposed in the second mounting groove 211 by a solder sintering method. The low frequency connector 44 is an SMP bent pin connector.
After the switching installation is accomplished, as shown in fig. 1, high frequency patch antenna unit 5 is covered in the adapter plate middle area to be the array setting, 4 relatively even arrays of low frequency antenna in the adapter plate, most inlay in 5 array area's of high frequency patch antenna unit clearance department, a small part is arranged in 5 array area's of high frequency patch antenna unit periphery, has realized the effective utilization in adapter plate space, the antenna of two kinds of frequency channels at limited spatial layout simultaneously.
As a further specific embodiment, as shown in fig. 2 and 4, the lower plate 1 is provided with a through hole corresponding to the second mounting groove 211 for passing the low frequency connector 44 when the lower plate 1 is assembled with the upper plate 2, the bottom surface of the lower plate 1 is provided with a bottom plate 11, the bottom plate 11 is provided with a through hole I corresponding to the through hole for passing the low frequency connector 44, and the bottom plate 11 is provided with a through hole II corresponding to the first mounting groove 10 for passing the high frequency connector 51.
After the assembly is completed, although it can be seen from fig. 1 that the low-frequency antenna 4 and the high-frequency patch antenna unit 5 are both distributed on the adapter plate in an array manner and are both arranged relatively uniformly, the effective space of the adapter plate is conveniently utilized; as can be seen from fig. 2, the low-frequency connectors 44 connected to the low-frequency antenna 4 are all distributed around the periphery and arranged in a circle, and the high-frequency connectors 51 connected to the high-frequency patch antenna units 5 are all concentrated in the middle area, and the circle lacking the periphery has a preset distance from the middle area, so that the isolation and relative independence of the two frequency bands after the antenna is switched can be ensured, and mutual noninterference is realized.
Preferably, a chip filter, a thin film filter, etc. may be placed in the middle of the microstrip line 45, so as to improve the suppression of clutter in the high frequency band, improve the sensitivity of the system in the high frequency band, and improve the isolation between the two frequency bands.
Example two
The present embodiment provides a dual-band common-aperture antenna, as shown in fig. 1 and 2, including: a high-frequency antenna layer 3, a low-frequency antenna 4 and the low-profile adapter plate of the dual-band common-caliber antenna of the first embodiment.
As shown in fig. 1 and 3, the high-frequency antenna layer 3 has high-frequency patch antenna units 5 arrayed thereon.
As shown in fig. 9, the low-frequency antenna 4 includes a low-frequency radiating element 41, a feeding coaxial line 42, and a feeding support bar 43, and one end of the feeding coaxial line 42 and one end of the feeding support bar 43 are connected to the bottom surface of the low-frequency radiating element 41. Specifically, the low-frequency radiating element 41 has various forms, such as Vivaldi antenna, patch antenna, full-metal dipole antenna, and the like, and is specifically selected according to actual antenna requirements.
As shown in fig. 1, 2, and 3, the bottom surface of the upper plate 2 is mounted on the top surface of the lower plate 1, the high-frequency antenna layer 3 is mounted on the top surface of the upper plate 2, and the inner conductors 52 are connected to the high-frequency patch antenna unit 5 by welding through the conductor through holes 20.
As shown in fig. 7 and 8, the other ends of the feeding coaxial line 42 and the feeding supporting rod 43 are both disposed through the gap between the high-frequency patch antenna units 5 of the high-frequency antenna layer 3, after passing through the gap, the other end of the feeding supporting rod 43 is connected to the top surface of the upper plate 2, and the other end of the feeding coaxial line 42 is connected to the preset low-frequency antenna feeding point 212.
Through the implementation mode, the construction of the dual-band common-caliber antenna is completed.
EXAMPLE III
The embodiment provides a low-profile switching method of a dual-band common-caliber antenna, which comprises the following steps:
first, lower plate 1, upper plate 2, high-frequency antenna layer 3, and low-frequency antenna 4 are prepared:
providing a lower plate 1, and installing high-frequency connectors 51 on the bottom surface of the lower plate 1 in an array mode, specifically, machining first installation grooves 10 in an array mode on the bottom surface of the lower plate 1, and installing the high-frequency connectors 51 in the first installation grooves 10 in a threaded installation mode or a soldering tin sintering mode; and the inner conductor 52 of the high-frequency connector 51 is caused to protrude upward from the top surface of the lower plate 1 by a predetermined height;
meanwhile, an upper plate 2 is provided, and conductor through holes 20 are formed in the upper plate 2 in an array penetrating through the bottom surface and the top surface of the upper plate 2, and the positions and the number of the conductor through holes 20 are matched with those of the inner conductors 52. Processing a plurality of microstrip wiring grooves 21 on the bottom surface of the upper plate 2, arranging a microstrip line 45 in the microstrip wiring grooves 21, and connecting one end of the microstrip line 45 with the low-frequency connector 44, specifically, processing a plurality of second mounting grooves 211 communicated with one end of the microstrip wiring grooves 21 on the bottom surface of the upper plate 2, wherein the number of the second mounting grooves 211 is the same as that of the microstrip wiring grooves 21, the second mounting grooves 211 are distributed on the periphery of the array region of the conductor through holes 20 and have a predetermined interval with the array region of the conductor through holes 20, one end of the microstrip line 45 is positioned in the second mounting groove 211, installing the low-frequency connector 44 in the second mounting groove 211 in a soldering tin sintering manner, and enabling the microstrip line 45 of the low-frequency connector 44 to be installed to be connected; the other end of the microstrip line 45 extends to a preset low-frequency antenna feed point 212 along with the microstrip wiring groove 21;
meanwhile, a high-frequency antenna layer 3 is provided, and the high-frequency antenna layer 3 is provided with high-frequency patch antenna units 5 in an array;
meanwhile, a plurality of low frequency antennas 4 are provided, the number of the low frequency antennas 4 is the same as the number of the preset low frequency antenna feeding points 212, and a feeding support rod 43 and a feeding coaxial line 42 are installed on the bottom surface of the low frequency radiating element 41 of the low frequency antenna 4.
Then, assembly is started, the upper plate 2 is assembled on the top surface of the lower plate 1, the high-frequency antenna layer 3 is assembled on the top surface of the upper plate 2, and the inner conductors 52 are respectively connected with the high-frequency patch antenna units 5 through the conductor through holes 20; and mounting the low-frequency antenna 4 on the surface of the high-frequency antenna layer 3, enabling the bottom ends of the feeding coaxial 42 and the feeding support rod 43 to penetrate through the high-frequency antenna layer 3, enabling the penetrating positions to be located at the gaps between the high-frequency patch antenna units 5, enabling the bottom end of the feeding support rod 43 to be connected to the top surface of the upper plate 2 after penetrating, enabling the bottom end of the feeding coaxial 42 to be connected with a preset low-frequency antenna feeding point 212, and achieving low-profile switching of the dual-band common-caliber antenna.
The preset low-frequency antenna feed points 212 are arranged in an array on the upper plate 2, and a part of the preset low-frequency antenna feed points 212 are embedded in the array region of the conductor through holes 20, and each preset low-frequency antenna feed point 212 is correspondingly provided with one low-frequency antenna 4.
Through the above-mentioned embodiment of this application, use low-loss microstrip line design with the switching circuit of the low-frequency channel in the radio frequency switching circuit, compare traditional cable switching mode: the height is greatly reduced, the miniaturization of the whole antenna is facilitated, and more space can be saved for an antenna system; secondly, according to the requirements of the whole antenna, devices such as a filter and the like can be placed in the middle of the microstrip line, so that the influence of a low frequency band on a high frequency band can be reduced, and an additional function is provided for the switching circuit; meanwhile, the microstrip patch cord adopting the method is directly assembled on the cavity, so that the heat dissipation performance is better, and the loss is equivalent to that of a cable.
The foregoing is only a preferred embodiment of the present invention and is not intended to be exhaustive or to limit the invention. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the invention.
Claims (10)
1. A low-profile adapter plate of a dual-band common-caliber antenna is characterized by comprising an upper plate (2) and a lower plate (1) which are overlapped and assembled for use;
the bottom surface of the lower plate (1) is provided with high-frequency connectors (51) in an array mode, and inner conductors (52) of the high-frequency connectors (51) extend upwards to a preset height from the top surface of the lower plate (1);
the upper plate (2) array is provided with conductor through holes (20) penetrating through the bottom surface and the top surface, and the conductor through holes (20) are matched with the inner conductors (52) and used for the inner conductors (52) to penetrate through; the bottom surface of the upper plate (2) is provided with a plurality of microstrip wiring grooves (21), microstrip lines (45) are arranged in the microstrip wiring grooves (21), one ends of the microstrip lines (45) are connected with low-frequency connectors (44), the other ends of the microstrip lines extend to preset low-frequency antenna feed points (212) along with the microstrip wiring grooves (21), the preset low-frequency antenna feed points (212) are used for being connected with a low-frequency antenna (4), the low-frequency antenna (4) comprises a low-frequency radiation unit (41), a feed coaxial line (42) and a feed support rod (43), and one ends of the feed coaxial line (42) and the feed support rod (43) are connected to the bottom surface of the low-frequency radiation unit (41);
when the antenna is used, the bottom surface of the upper plate (2) is assembled on the top surface of the lower plate (1), the top surface of the upper plate (2) is assembled with the high-frequency antenna layer (3), the high-frequency antenna layer (3) is arrayed with the high-frequency patch antenna units (5), each inner conductor (52) penetrates through each conductor through hole (20) and is connected with the high-frequency patch antenna units (5), the feeding coaxiality (42) of the low-frequency antenna (4) and the other end of the feeding support rod (43) penetrate through gaps between the high-frequency patch antenna units (5) of the high-frequency antenna layer (3), after the feeding support rod (43) penetrates through the gaps, the other end of the feeding support rod is connected to the top surface of the upper plate (2), and the other end of the feeding coaxiality (42) is connected with the preset low-frequency antenna feeding point (212).
2. The dual band common aperture antenna low profile interposer of claim 1, wherein: the bottom surface of the lower plate (1) is provided with first mounting grooves (10) in an array mode, and the high-frequency connector (51) is arranged in the first mounting grooves (10) in a threaded mounting mode or a soldering tin sintering mode.
3. The dual band common aperture antenna low profile interposer of claim 1, wherein: upper plate (2) bottom surface is equipped with a plurality of second mounting grooves (211), quantity is unanimous with microstrip wiring groove (21), microstrip wiring groove (21) one end and second mounting groove (211) intercommunication, second mounting groove (211) distribute in the periphery that conductor perforates (20) array region, low frequency connector (44) set up in second mounting groove (211), predetermine low frequency antenna feed point (212) and the array sets up and partial quantity predetermine low frequency antenna feed point (212) and inlay in conductor perforates (20) array region on upper plate (2), every predetermines low frequency antenna feed point (212) and be used for corresponding low frequency antenna (4) of installation.
4. The dual band common aperture antenna low profile interposer as claimed in claim 3, wherein the second mounting grooves (211) are distributed around the periphery of the array region of the conductor through holes (20) with a predetermined distance from the array region of the conductor through holes (20).
5. The dual band co-aperture antenna low profile interposer as claimed in claim 3, wherein the microstrip line (45) is disposed in the microstrip wiring slot (21) by means of conductive adhesive bonding or solder sintering, the microstrip line (45) is disposed with a chip filter or a thin film filter for suppressing high band noise, and the low frequency connector (44) is disposed in the second mounting slot (211) by means of solder sintering.
6. The dual band common aperture antenna low profile interposer of claim 1,
the high frequency connector (51) is an SMP or SSMP type connector and the low frequency connector (44) is an SMP bent pin connector.
7. The low-profile interposer for a dual-band co-aperture antenna as claimed in claim 3, wherein the lower plate (1) is provided with a through hole corresponding to the second mounting groove (211) for passing the low frequency connector (44) therethrough when the lower plate (1) is assembled with the upper plate (2), the lower plate (1) is provided at a bottom surface thereof with a bottom plate (11), the bottom plate (11) is provided with a through hole I corresponding to the through hole for passing the low frequency connector (44), and the bottom plate (11) is provided with a through hole II corresponding to the first mounting groove (10) for passing the high frequency connector (51).
8. A dual band common aperture antenna comprising the dual band common aperture antenna low profile interposer as claimed in any one of claims 1 to 7.
9. A low-profile switching method of a dual-band common-caliber antenna is characterized by comprising the following steps:
providing a lower plate (1), installing high-frequency connectors (51) on the bottom surface of the lower plate (1) in an array mode, and enabling inner conductors (52) of the high-frequency connectors (51) to extend upwards to a preset height from the top surface of the lower plate (1);
providing an upper plate (2), and processing conductor through holes (20) which penetrate through the bottom surface and the top surface of the upper plate (2) in an array on the upper plate (2), wherein the positions and the number of the conductor through holes (20) are matched with those of the inner conductors (52);
processing a plurality of microstrip wiring grooves (21) on the bottom surface of the upper plate (2), arranging a microstrip line (45) in the microstrip wiring grooves (21), connecting one end of the microstrip line (45) with a low-frequency connector (44), and extending the other end of the microstrip line to a preset low-frequency antenna feed point (212) along with the microstrip wiring grooves (21);
providing a high-frequency antenna layer (3), wherein the high-frequency antenna layer (3) is provided with high-frequency patch antenna units (5) in an array;
providing a plurality of low-frequency antennas (4), wherein the number of the low-frequency antennas (4) is consistent with the number of preset low-frequency antenna feed points (212), and a feed support rod (43) and a feed coaxial line (42) are arranged on the bottom surface of a low-frequency radiation unit (41) of the low-frequency antennas (4);
assembling the upper plate (2) on the top surface of the lower plate (1), assembling the high-frequency antenna layer (3) on the top surface of the upper plate (2), and enabling the inner conductors (52) to penetrate through the conductor through holes (20) respectively to be connected with the high-frequency patch antenna unit (5);
and (3) installing the low-frequency antenna (4) on the surface of the high-frequency antenna layer (3), enabling the bottom ends of the feeding coaxial cable (42) and the feeding support rod (43) to penetrate through the high-frequency antenna layer (3), enabling the penetrating positions to be located at the gap between the high-frequency patch antenna units (5), enabling the bottom end of the feeding support rod (43) to be connected to the top surface of the upper plate (2) after penetrating, and enabling the bottom end of the feeding coaxial cable (42) to be connected with a preset low-frequency antenna feeding point (212).
10. The method for adapting a dual-band co-aperture antenna to a low profile as claimed in claim 9, wherein the predetermined low frequency antenna feeding points (212) are arranged in an array on the upper plate (2), and a part of the predetermined low frequency antenna feeding points (212) are embedded in the array region of the conductor through holes (20), and each predetermined low frequency antenna feeding point (212) is correspondingly provided with a low frequency antenna (4);
installing high-frequency connectors (51) on the bottom surface of the lower plate (1) in an array mode, specifically: processing first mounting grooves (10) in an array on the bottom surface of a lower plate (1), and mounting high-frequency connectors (51) in the first mounting grooves (10) in a threaded mounting mode or a soldering tin sintering mode;
one end of the microstrip line (45) is connected with a low-frequency connector (44), specifically: a plurality of second mounting grooves (211) communicated with one ends of the microstrip wiring grooves (21) are machined in the bottom surface of the upper plate (2), the number of the second mounting grooves (211) is consistent with that of the microstrip wiring grooves (21), the second mounting grooves (211) are distributed on the periphery of an array region of the conductor through holes (20) and have a preset interval with the array region of the conductor through holes (20), and the low-frequency connector (44) is mounted in the second mounting grooves (211) in a soldering tin sintering mode.
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