CN112798818A - Micro-mechanical accelerometer - Google Patents

Micro-mechanical accelerometer Download PDF

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Publication number
CN112798818A
CN112798818A CN202011616575.8A CN202011616575A CN112798818A CN 112798818 A CN112798818 A CN 112798818A CN 202011616575 A CN202011616575 A CN 202011616575A CN 112798818 A CN112798818 A CN 112798818A
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sensitive
comb teeth
accelerometer
arc
substrate
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CN112798818B (en
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侯占强
吴学忠
肖定邦
蹇敦想
邝云斌
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National University of Defense Technology
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802Details
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0862Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system

Abstract

The invention belongs to the technical field of micromechanical sensors, and discloses a micromechanical accelerometer, which comprises a sensitive frame, a substrate, anchor points, a combined folding beam and arc-shaped comb teeth; the sensitive frame is connected with the first anchor point through the combined folding beam; the substrate is arranged on the inner side of the sensitive frame and is in the same plane with the sensitive frame, and the substrate is fixed by a second anchor point; the arc-shaped comb teeth comprise arc-shaped movable comb teeth and arc-shaped fixed comb teeth, the arc-shaped movable comb teeth are fixedly connected with the sensitive frame, and the arc-shaped fixed comb teeth are fixedly connected with the substrate; the micro-mechanical accelerometer comprises a plurality of first anchor points, the sensitive frame and the substrate are divided into a plurality of sub sensitive areas by the first anchor points, and each sub sensitive area is a sub accelerometer system. The micro-mechanical accelerometer has the advantages of high sensitivity, low cross-coupling, high space utilization rate of devices, wide application range and the like.

Description

Micro-mechanical accelerometer
Technical Field
The invention belongs to the technical field of micromechanical sensors, and particularly relates to a micromechanical accelerometer.
Background
The accelerometer is mainly used for measuring the acceleration of a moving carrier, and is an important inertial device in the technical field of sensing. Compared with the traditional accelerometer, the micro-mechanical accelerometer based on the MEMS technology has smaller volume, lower cost, batch processing and low power consumption application. With the progress of micro-nano processing technology, the micro-mechanical accelerometer is increasingly applied in the fields of navigation guidance, automobile industry, consumer electronics and the like.
At present, foreign enterprises represented by ADI, Silicon Sensing and Colibrys have been widely developed and commercially applied in the aspects of comb-tooth type micro-accelerometers, and although a plurality of works of the comb-tooth type micro-accelerometers in the aspects of structural design, process exploration, performance testing and the like are carried out by a plurality of national scientific research institutes and enterprises, the commercial application has a great gap with foreign countries. Along with the development of the domestic process level, the micro mechanical accelerometer which is novel in structure, reliable in process and prominent in performance is designed to have important practical significance. Comb tooth type micro accelerometer is extensively studied because of advantages such as structural design is simple, the performance is good, the precision is high, the low power consumption. However, the processing of the comb teeth has a higher depth-to-width ratio, and in order to reduce the processing difficulty, the number of the comb teeth is often designed to be less, so that the space utilization rate of a device is not high, and the detection precision and sensitivity are also reduced.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide the multi-anchor multi-beam high-sensitivity comb-tooth type micro mechanical accelerometer which is novel in structure, reliable in process and prominent in performance.
In order to solve the technical problems, the invention adopts the technical scheme that:
a micromechanical accelerometer comprises a sensitive frame, a substrate, anchor points, a combined folding beam and arc-shaped comb teeth; the anchor points comprise a first anchor point and a second anchor point, and the sensitive frame is connected with the first anchor point through the combined folding beam; the substrate is arranged on the inner side of the sensitive frame and is in the same plane with the sensitive frame, and the substrate is fixed by the second anchor point; the arc-shaped comb teeth comprise arc-shaped movable comb teeth and arc-shaped fixed comb teeth, the arc-shaped movable comb teeth are fixedly connected with the sensitive frame, and the arc-shaped fixed comb teeth are fixedly connected with the substrate; the micro-mechanical accelerometer comprises a plurality of first anchor points, the sensitive frame and the substrate are divided into a plurality of sub sensitive areas by the first anchor points, and each sub sensitive area is a sub accelerometer system.
Furthermore, the elastic stopping structure is fixedly connected with the first anchor point, and the elastic stopping structures are distributed around the first anchor point in a circumferential array manner.
Furthermore, the elastic stop structure comprises a contact head and a buffer beam, the contact head is arranged on the buffer beam and is close to the sensitive frame, the buffer beam is a double-end fixed beam, and two ends of the buffer beam are fixed on the first anchor point.
Further, the contact is arc-shaped.
Furthermore, the combined folding beam is formed by combining a plurality of single beams.
Furthermore, the circular arc-shaped fixed comb teeth adopt fixed comb teeth offset structures with unequal distances.
Furthermore, the micro-mechanical accelerometer is provided with five first anchor points which are respectively distributed in four corners and a middle area, and the sensitive frame is divided into five sub-sensitive areas by the five anchor points.
Furthermore, the combined folding beam is twenty groups, each sub-sensitive area is four groups, one group of combined folding beam is formed by combining three single beams, one end of each single beam is connected with the first anchor point, and the other end of each single beam is connected with the sensitive frame.
Further, the mechanical rigidity of the micro-mechanical accelerometer is
Figure BDA0002872390860000021
Wherein, KiFor the stiffness of the sensitive sub-regions, kjFor each set of said composite folding beam stiffness
Compared with the prior art, the invention has the advantages that:
the micromechanical accelerometer has novel structural design, can be processed by using a deep reactive ion dry etching technology, and has high processing precision and lower cost. By means of multi-anchor-point support, the out-of-plane rigidity of the structure can be obviously increased, the overall deformation of the structural layer is reduced, and the low-order modal frequency is reduced; by adopting the combined folding beam structure, the rigidity of a sensitive structure can be increased under the condition of not increasing the thickness of the structural layer and the process difficulty, the equivalent depth-to-width ratio can be improved, the coupling error is reduced, and meanwhile, the working mode of the structure can be adjusted by reasonably designing the size parameters of the folding beam; the broach design is circular-arc can increase electric capacity effective area under the condition that does not increase chip area, compares in the ordinary broach in equal clearance, can obviously improve and detect electric capacity to promote sensitivity, improve the detection precision of system, promoted the space utilization that the broach was arranged simultaneously, can also effectively avoid adsorbing. In addition, the elastic stopping structure can improve the shock resistance of the structure.
In addition to the objects, features and advantages described above, other objects, features and advantages of the present invention are also provided. The present invention will be described in further detail below with reference to the drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic diagram of a micromechanical accelerometer according to a preferred embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a neutron sensitive region of a micro-mechanical accelerometer according to an embodiment of the invention;
FIG. 3 is a partial schematic view of a combined folded beam and stop structure of a micro-mechanical accelerometer according to an embodiment of the invention;
FIG. 4 is a schematic structural diagram of a sensing frame according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a set of composite folding beams according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of circular arc-shaped comb teeth in the embodiment of the present invention;
FIG. 7 is a schematic structural diagram of an elastic stopping structure according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of a simulation of the structural change of the present invention when subjected to acceleration in the X-axis direction;
FIG. 9 is a graph of the impact deformation at high g of the present invention spring stop construction.
Wherein, 1, a sensitive frame; 2. a substrate; 3. a first anchor point; 4. combining the folding beams; 5. an elastic stop structure; 6. circular arc comb teeth; 7. circular arc movable comb teeth; 8. arc-shaped fixed comb teeth; 9. a contact head; 10. a bumper beam; 11. and a second anchor point.
Detailed Description
Embodiments of the invention will be described in detail below with reference to the drawings, but the invention can be implemented in many different ways, which are defined and covered by the claims.
Referring to fig. 1 to 7, the present invention provides a micro-mechanical accelerometer, which includes a sensitive frame 1, a substrate 2, an anchor point, a combined folding beam 4 and arc-shaped comb teeth 6; the anchor points comprise a first anchor point 3 and a second anchor point 11, and the sensitive frame 1 is connected with the first anchor point 3 through the combined folding beam 4; the substrate 2 is arranged on the inner side of the sensitive frame 1 and is in the same plane with the sensitive frame 1, and is fixed by the second anchor point 11; the arc-shaped comb teeth 6 comprise arc-shaped movable comb teeth 7 and arc-shaped fixed comb teeth 8, the arc-shaped movable comb teeth 7 are fixedly connected with the sensitive frame 1, and the arc-shaped fixed comb teeth 8 are fixedly connected with the substrate 2; the micro-mechanical accelerometer comprises a plurality of first anchor points 3, the sensitive frame 1 and the substrate 2 are divided into a plurality of sub sensitive areas by the plurality of first anchor points 3, and each sub sensitive area is a sub accelerometer system. Except for the anchor points, the sensitive structures of the accelerometers are all in the same plane. The multi-anchor-point multi-beam high-sensitivity comb-tooth type micro mechanical accelerometer is novel in structural design, can be processed by using a deep reactive ion dry etching technology, and is high in processing precision and low in cost; by means of multiple anchor points, the overall deformation of the structural layer can be reduced, and the low-order modal frequency is reduced; the combined folding beam structure can not only increase the rigidity of a sensitive structure, but also improve the equivalent depth-to-width ratio and reduce coupling; in addition, the detection capacitance can be obviously improved on the premise of the equal gaps between the circular arc-shaped comb teeth and the common comb teeth, so that the sensitivity is improved, the space utilization rate of the arrangement of the comb teeth is high, and the detection precision of the system is improved.
In a specific embodiment, the multi-anchor multi-beam high-sensitivity comb-tooth type micro mechanical accelerometer further comprises elastic stopping structures 5, wherein the elastic stopping structures 5 are fixedly connected with the first anchors 3, and the elastic stopping structures 5 are distributed around the first anchors 3 in a circumferential array manner. Specifically, the first anchor point 3 is square, and the elastic stop structures 5 are distributed on four sides of the first anchor point 3 (as shown in fig. 3).
Specifically, as shown in fig. 7, the elastic stopping structure 5 includes a contact 9 and a bumper beam 10, the contact 9 is disposed on the bumper beam 10 and is close to the sensitive frame 1, the bumper beam 10 is a double-end clamped beam, and two ends of the bumper beam are fixed to the first anchor points 3. Preferably, the contact 9 has a circular arc shape. When the acceleration is overloaded, the sensing frame 1 is contacted in a point contact mode, and meanwhile, the buffer beam 10 is a double-end clamped beam and can rebound to give a certain buffer, so that high-g impact in the directions of an X axis and a Y axis is resisted to prevent comb teeth from being damaged.
Preferably, as shown in fig. 6, among the circular arc-shaped comb teeth 6, circular arc-shaped movable comb teeth 7 are arranged on the sensitive frame 1, and circular arc-shaped fixed comb teeth 8 are arranged on the substrate 2, and the circular arc-shaped fixed comb teeth adopt an offset structure of the fixed comb teeth at unequal distances. As shown in fig. 5, the combined folded beam is formed by combining a plurality of single beams. The single beam is a single folding beam, and the beam in the middle of the combined folding beam is shared by a plurality of single beams.
The invention will be explained and illustrated below with reference to a specific embodiment.
In this embodiment, as shown in fig. 1, the micro-mechanical accelerometer has five first anchor points 3, which are respectively distributed in four corners and a middle area, and the sensitive frame 1 is divided into five sub-sensitive frames by the five first anchor points 3A sensory area. The five sub sensitive regions comprise sub sensitive regions I distributed on the periphery and sub sensitive regions II positioned in the middle. The number of the circular arc-shaped comb teeth 6 in the sub sensitive area II is different from that of the sub sensitive area I, and other structures are the same. The substrate 2 is located inside the sensing frame 1 and fixed by a second anchor point, and the substrate 2 is independent of the sensing frame 1. The sensitive frame 1 is fixed by five first anchor points 3, has increased the intermediate strut point on the basis of four corners, can effectively reduce whole deformation and low order mode. The combined folding beams 4 have twenty groups, each first anchor point 3 is provided with four groups of combined folding beams 4, one end of each folding beam is connected with the first anchor point 3, the other end of each folding beam is connected with the sensitive frame 1 with the movable comb teeth, and each group of folding beams is formed by combining three single beams, so that the equivalent depth-to-width ratio can be improved, and the coupling can be reduced. The group of combined folding beams shown in fig. 5 is formed by combining three single beams, namely the single folding beam, and the cross beam in the middle of the combined folding beam is shared by the three single beams, so that one end of each single beam is connected with the first anchor point, and the other end of each single beam is connected with the sensitive frame. The contact end of the elastic stop structure 5 is arc-shaped, and is in contact with the sensitive mass block in a point contact mode under large impact, and meanwhile, the double-end fixed support beam can rebound for buffering; circular arc broach 6 is around each anchor point and folding beam symmetrical arrangement, compares in ordinary broach, can obviously increase detection electric capacity. In the circular arc comb teeth 6, circular arc movable comb teeth 7 are arranged on the sensitive frame 1, circular arc fixed comb teeth 8 are arranged on the substrate 2, and the circular arc fixed comb teeth adopt a fixed comb tooth offset structure with unequal distances. The structure design can lead the fixed comb teeth and the movable comb teeth to be connected with the same electrode on the circuit, and the design of the subsequent circuit is simplified by utilizing the difference of the distances to generate the capacitance difference. The micromechanical accelerometer has a mechanical stiffness of
Figure BDA0002872390860000041
Wherein, KiFor the stiffness of the sensitive sub-regions, kjThe stiffness of the composite folded beam 4 for each group.
In this embodiment, when the sensitive structure senses the acceleration in the X direction, the combined folding beam 4 will elastically deform to make the sensitive frame 1 translate along the X direction, so as to drive the movable circular arc comb teeth 7 on the sensitive frame 1, resulting in the change of the gap between the movable circular arc comb teeth 7 and the fixed circular arc comb teeth 8, and further causing the change of the capacitance, and the acceleration can be measured by detecting the change of the capacitance through a subsequent circuit.
As shown in fig. 8, when the micro-mechanical accelerometer of the present invention is subjected to an acceleration a along the positive direction of the X-axis, the combined folding beam 4 will bend under the action of an inertial force, so that the sensitive frame 1 generates displacement, and further the arc-shaped movable comb teeth 7 move with the translation of the sensitive frame 1, causing the gap between the comb teeth to change, thereby causing the corresponding capacitance to change.
As shown in fig. 9, when the micro-mechanical accelerometer of the present invention receives a high g impact along the X-axis or along the Y-axis, the circular arc contact 9 will contact the sensitive frame 1, and the stress at the contact 9 is large, and at the same time, the bumper beam 10 will generate a certain springback to release the stress. When the impact disappears, the resilient stop structure 5 will separate from the sensitive frame 1 due to the point contact, thereby avoiding failure of the sensitive structure.
In this embodiment, the sensitive structure of the accelerometer is based on an SOI silicon wafer and is processed by a deep reactive ion dry etching technique, and the specific process flow is as follows:
(1) the electrode substrate selects an SOI silicon chip with a customized structure layer thickness;
(2) carrying out first photoetching on the electrode structure layer, and etching to obtain an anchor point structure;
(3) carrying out second photoetching on the electrode structure layer, and etching to obtain an electrode pattern;
(4) the sensitive structure selects an SOI silicon chip with a customized structure layer thickness;
(5) bonding and connecting the sensitive structure layer and the electrode structure layer by adopting a silicon-silicon low-stress bonding technology;
(6) after bonding, removing a substrate layer and an oxide layer of the sensitive structure SOI wafer;
(7) carrying out first photoetching on the sensitive structure layer, and etching to obtain a combined folding beam and a stop structure;
(8) carrying out secondary photoetching on the sensitive structure layer, and etching to obtain a sensitive frame, a substrate and arc-shaped comb teeth;
(9) the packaging cap layer is a double polished silicon chip;
(10) photoetching the packaging cover cap layer, and obtaining a packaging cavity structure through wet etching;
(11) and bonding the structure wafer level packaging with the packaging cap layer through a glass paste bonding technology to finish the structure wafer level packaging.
The foregoing is merely a preferred embodiment of the invention and is not intended to limit the invention in any manner. Although the present invention has been described with reference to the preferred embodiments, it is not intended to be limited thereto. Those skilled in the art can make many possible variations and modifications to the disclosed embodiments, or equivalent modifications, without departing from the spirit and scope of the invention, using the methods and techniques disclosed above. Therefore, any simple modification, equivalent replacement, equivalent change and modification made to the above embodiments according to the technical essence of the present invention are still within the scope of the protection of the technical solution of the present invention.

Claims (9)

1. A micromechanical accelerometer is characterized by comprising a sensitive frame, a substrate, anchor points, a combined folding beam and arc-shaped comb teeth; the anchor points comprise a first anchor point and a second anchor point, and the sensitive frame is connected with the first anchor point through the combined folding beam; the substrate is arranged on the inner side of the sensitive frame and is in the same plane with the sensitive frame, and the substrate is fixed by the second anchor point; the arc-shaped comb teeth comprise arc-shaped movable comb teeth and arc-shaped fixed comb teeth, the arc-shaped movable comb teeth are fixedly connected with the sensitive frame, and the arc-shaped fixed comb teeth are fixedly connected with the substrate; the micro-mechanical accelerometer comprises a plurality of first anchor points, the sensitive frame and the substrate are divided into a plurality of sub sensitive areas by the first anchor points, and each sub sensitive area is a sub accelerometer system.
2. The micromachined accelerometer of claim 1, further comprising elastic stop structures fixedly connected to the first anchor points, the elastic stop structures being circumferentially arrayed about the first anchor points.
3. The micromachined accelerometer of claim 2, wherein the elastic stop structure comprises a contact and a bumper beam, the contact is disposed on the bumper beam and is close to the sensitive frame, the bumper beam is a double-clamped beam, and two ends of the bumper beam are fixed to the first anchor point.
4. The micromachined accelerometer of claim 3, wherein the contact is arcuate.
5. The micromachined accelerometer of claim 1, wherein the composite folded beam is formed from a combination of a plurality of single beams.
6. The micromachined accelerometer of claim 1, wherein the circular arc shaped fixed comb fingers employ a fixed comb finger offset structure of unequal distance.
7. The micromachined accelerometer of claim 1, wherein the micromachined accelerometer has five first anchor points distributed at four corners and a middle region, respectively, the five anchor points dividing the sensing frame into five sub-sensing regions.
8. The micro-mechanical accelerometer according to claim 7, wherein the combined folded beams have twenty groups, each sub-sensitive region has four groups, and one group of the combined folded beams is formed by combining three single beams, and each single beam has one end connected to the first anchor point and the other end connected to the sensitive frame.
9. A micromechanical accelerometer according to claim 7, characterized in that it comprisesThe mechanical stiffness of the micromechanical accelerometer is
Figure FDA0002872390850000011
Wherein, KiFor the stiffness of the sensitive sub-regions, kjThe stiffness of each set of the composite folded beams.
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