CN112788328B - Camera module reliability testing device - Google Patents

Camera module reliability testing device Download PDF

Info

Publication number
CN112788328B
CN112788328B CN202011495106.5A CN202011495106A CN112788328B CN 112788328 B CN112788328 B CN 112788328B CN 202011495106 A CN202011495106 A CN 202011495106A CN 112788328 B CN112788328 B CN 112788328B
Authority
CN
China
Prior art keywords
tested
chip
camera module
power
interface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202011495106.5A
Other languages
Chinese (zh)
Other versions
CN112788328A (en
Inventor
侯栋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshanqiu Titanium Photoelectric Technology Co Ltd
Original Assignee
Kunshanqiu Titanium Photoelectric Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshanqiu Titanium Photoelectric Technology Co Ltd filed Critical Kunshanqiu Titanium Photoelectric Technology Co Ltd
Priority to CN202011495106.5A priority Critical patent/CN112788328B/en
Publication of CN112788328A publication Critical patent/CN112788328A/en
Application granted granted Critical
Publication of CN112788328B publication Critical patent/CN112788328B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N17/00—Diagnosis, testing or measuring for television systems or their details
    • H04N17/002—Diagnosis, testing or measuring for television systems or their details for television cameras
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B43/00—Testing correct operation of photographic apparatus or parts thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

The invention relates to the technical field of camera modules, in particular to a camera module reliability testing device, which comprises: the IIC expansion chip is used for expanding and connecting the interfaces of the camera modules to be tested; the buffer chip is used for expanding a clock signal, a standby signal and a reset signal; the adapter plates are respectively used for connecting each camera module to be tested with the cache chip so as to apply a test signal to each camera module to be tested through the cache chip; the tooling interface is used for respectively connecting at least one IIC extended chip and the cache chip with the control terminal through a tooling channel of the tooling so that the control terminal can simultaneously carry out reliability test on a plurality of camera modules to be tested; and then the efficiency of the reliability test of camera module has been improved.

Description

Camera module reliability testing device
Technical Field
The invention relates to the technical field of camera modules, in particular to a camera module reliability testing device.
Background
The reliability test of camera module is many in damp and hot environment, because damp and hot environment is great to the influence of camera module, at present, adopt many modules to measure the environment of back test item of putting into, do not switch on and test the module in the reliability test, wait for the unified measurement module after experimental the end, adopt the state of camera module work under the unable effective simulation damp and hot environment of such mode, also can't know the camera module just damaged when, be unfavorable for follow-up analysis and improvement.
In the prior art, a small number of modules can be placed into the experiment box, the camera module is connected to the tooling mainboard and the computer through the communication line, image operation is carried out on the camera module, reliability test is carried out, although the method can solve the problem through a real-time image drawing mode, the efficiency is low, and only 1 module can be tested in each single tooling channel.
Therefore, how to improve the efficiency of the reliability test of the camera module is a technical problem to be solved urgently at present.
Disclosure of Invention
In view of the above problems, the present invention has been made to provide a camera module reliability testing apparatus that overcomes or at least partially solves the above problems.
In a first aspect, an embodiment of the present invention provides a device for testing reliability of a camera module, including:
the device comprises a cache chip, a tool interface, a tool, a control terminal, at least one IIC expansion chip and a plurality of adapter plates;
the IIC expansion chip is used for expanding and connecting a plurality of camera modules to be tested;
the cache chip is used for providing a test signal;
the adapter plates are respectively used for connecting each camera module to be tested with the cache chip so that the cache chip respectively applies test signals to each camera module to be tested;
the tooling interface is used for connecting the at least one IIC expansion chip and the cache chip with the control terminal through a tooling channel of the tooling respectively, so that the control terminal can simultaneously carry out reliability test on the plurality of camera modules to be tested.
Further, the method also comprises the following steps:
and the power supply conversion unit is used for respectively connecting each camera module to be tested through the plurality of adapter plates so as to convert the voltage of an external power supply into the voltage required by each camera module to be tested.
Furthermore, a power switch is connected between the power conversion unit and the external power supply and is used for controlling the on and off of power supply.
Further, the power conversion unit comprises a plurality of power conversion chips to meet the conversion of different power voltages.
Further, the tool interface comprises an I/O interface or a power output interface for connecting the power conversion chip, and the I/O interface or the power output interface is used for controlling the power-on sequence and the power-off sequence of the plurality of camera modules to be tested.
Further, the plurality of adapter plates each include: a power supply input interface and a signal input interface;
supplying power to the plurality of camera modules to be tested through the power supply input interface;
and providing signals for the plurality of camera modules to be tested through the signal input interface.
Furthermore, a first light emitting diode is connected to the power supply input interface and used for prompting whether power supply is normal or not;
and a second light-emitting diode is connected to the signal input interface and used for prompting whether the communication is normal or not.
Further, the number of the plurality of adapter plates is equal to the number of the plurality of camera modules to be tested.
Further, the cache chip includes: the clock buffer chip is used for providing a clock signal in the test signal:
the first IO cache chip is used for providing a standby signal in the test signal;
and the second IO cache chip is used for providing a reset signal in the test signal.
Further, each tool corresponds to at least two tool channels.
One or more technical solutions in the embodiments of the present invention at least have the following technical effects or advantages:
the invention provides a camera module reliability testing device, which comprises: the device comprises a cache chip, a tool interface, a tool, a control terminal, at least one IIC expansion chip and a plurality of adapter plates; the at least one IIC expansion chip is used for expanding and connecting a plurality of camera modules to be tested; the buffer chip is used for providing a test signal; the adapter plates are respectively used for connecting each camera module to be tested with the cache chip so that the cache chip can apply test signals to each camera module to be tested; the tooling interface is used for connecting at least one IIC extension chip and the cache chip with the control terminal through the tooling interface of the tooling respectively, so that the control terminal can carry out reliability test on a plurality of camera modules to be tested simultaneously.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
fig. 1 is a schematic structural diagram illustrating a device for testing reliability of a camera module according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram illustrating that a tool with two tool channels is used for realizing reliability testing of a camera module in the embodiment of the present invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
The invention provides a camera module reliability testing device, as shown in fig. 1, comprising: cache chip, frock 10, control terminal 20, at least one IIC extension chip and a plurality of keysets J 1 -J n 。
At least one IIC extended chip U 5 The test system is used for connecting a plurality of camera modules to be tested in an expanding way.
And the buffer chip is used for providing a test signal.
Multiple adapter plates J 1 ～J n And the cache chip is used for respectively connecting each camera module to be tested with the cache chip so as to apply a test signal to each camera module to be tested through the cache chip.
Tool interface J n+1 And the controller is configured to connect the at least one IIC expansion chip and the cache chip with the control terminal 20 through a tool channel of the tool 10, so that the control terminal 20 performs reliability test on the plurality of camera modules to be tested.
As shown in fig. 1, the cache chip specifically includes a clock cache chip U 6 And a first IO cache chip U 7 And a second IO cacheChip storage U 8 The clock caches the chip U 6 The first IO cache chip U is used for providing a clock signal in the test signal 7 The second IO buffer chip U is used for providing a standby signal in the test signal 8 For providing a reset signal in the test signal.
In an alternative embodiment, the reliability testing apparatus further includes: a power conversion chip for passing through multiple adapter plates J 1 ～J n And respectively connecting each camera module to be tested to convert the voltage of the external power supply into the voltage required by each camera module to be tested.
And a power switch is connected between the external power supply and the power conversion unit and used for controlling the on and off of power supply.
The power conversion unit comprises a plurality of power conversion chips so as to meet the conversion of different power voltages.
As shown in fig. 1, when the power conversion unit includes 4 power conversion chips, it is specifically U 1 、U 2 、U 3 、U 4 The chip shown. Certainly, the number of the power conversion chips can also be increased according to the increase of the number of the camera modules to be tested, which is not limited herein. The power supply capacity can be improved by adopting various power conversion chips.
The cache chip provides clock signals, standby signals and reset signals for the plurality of camera modules to be tested, and the power conversion chip supplies power for the plurality of camera modules to be tested, so that the plurality of camera modules to be tested can work normally.
The cache chip includes: a clock buffer chip for providing a clock signal U 6 (ii) a Two IO cache chips U 7 And U 8 For providing a standby signal and a reset signal, respectively.
In an optional embodiment, the tool interface further includes an I/O interface or a power output interface, which is used to connect to a power conversion chip, and the control terminal 20 implements power-on timing control and power-off timing control on a plurality of camera modules to be tested through the I/O interface or the power output interface via the tool channel.
The I/O interface or the power output interface is used as the enabling input of the power conversion chip, so that the power-on time sequence control and the power-off time sequence control of a plurality of camera modules to be tested are realized.
In an alternative embodiment, the plurality of adapter plates J 1 ～J n All of which comprise: a power supply input interface and a signal input interface; supplying power to a plurality of camera modules to be tested through the power supply input interface; and providing signals for a plurality of camera modules to be tested through the signal input interface.
In an optional implementation mode, a first light emitting diode is connected at the power supply input interface and used for prompting whether power supply is normal or not; and the signal input interface is connected with a second light-emitting diode and used for prompting whether the communication is normal or not.
Specifically, when the first light-emitting diode is lighted, it is determined that the power supply of the corresponding line is normal, and when the first light-emitting diode is not lighted, it is determined that the power supply of the corresponding line fails; and when the second light-emitting diode is not lightened, determining that the communication of the corresponding line is normal.
An IIC extended chip is taken as an example in FIG. 1.
Due to the IIC extended chip U 5 Can expand 8 to await measuring camera module's interface, consequently, if need carry out the reliability test to more camera modules that await measuring, need connect more IIC extension chip U 5 For example, two IIC extended chips U 5 And 16 interfaces of the camera modules to be tested can be expanded.
In order to read the serial number of the internal chip of each camera module to be tested normally, each adapter plate J is used i (J i Is J 1 ～J n Any adapter plate) connects the camera modules to be tested with the cache chip to apply a clock signal, a standby signal and a reset signal to each camera module to be tested respectively.
Thus, the adapter plate J 1 ～J n The number of the camera modules to be tested is the same as that of the camera modules to be tested, so that one-to-one corresponding connection is realized.
Tool interface J n+1 The fixture is used for connecting the IIC extended chip and the cache chip with the control terminal 20 through a fixture channel of the fixture 10, so that the control terminal 20 is connected with each camera module to be tested, and reliability of each camera module to be tested is tested through the control terminal 20.
Each tool 10 corresponds to at least two tool channels, but may also be four tool channels, etc. When a tool with two tool channels (a tool channel 1 and a tool channel 2) is adopted, the structural schematic diagram of the camera module reliability testing device is shown in fig. 2.
The control terminal 20 is specifically a desktop computer, a tablet computer, or an upper computer.
After the above-mentioned camera module reliability testing device is assembled, a method for using the reliability testing device is described.
Specifically, the camera module to be tested is placed in a constant damp and hot environment.
The camera modules to be tested are placed in a constant damp and hot environment, and particularly the camera modules to be tested are placed in the device through the device for creating the constant damp and hot environment. To test the reliability in this hot and humid environment.
The serial numbers of the internal chips of the camera modules to be tested are read according to a preset period through the control terminal 20 (for example, an upper computer), the corresponding camera modules are determined to pass the reliability test when the serial numbers of the internal chips are read, and the corresponding camera modules are determined not to pass the reliability test when the serial numbers of the internal chips are not read.
And when the serial numbers of the internal chips of the camera modules to be tested are read according to a preset period, recording time and reading times.
The serial number of the internal chip of each camera module to be tested is read according to a preset period, so that the state of each camera module to be tested can be monitored in real time, and the time of failure can be recorded.
By adopting the method for testing the reliability of the camera module, the testing efficiency can be greatly improved, the cost is reduced, the requirement of the camera module to work in a damp and hot reliability environment is met, meanwhile, the number of times and the time for reading the serial number of the chip in the camera module are recorded, the damage time of the camera module can be positioned, and the later-stage targeted analysis and improvement are facilitated.
One or more technical solutions in the embodiments of the present invention have at least the following technical effects or advantages:
the invention provides a camera module reliability testing device, which comprises: the device comprises a cache chip, a tool interface, a tool, a control terminal, at least one IIC expansion chip and a plurality of adapter plates; the at least one IIC expansion chip is used for expanding and connecting a plurality of camera modules to be tested; the buffer chip is used for providing a test signal; the adapter plates are respectively used for connecting each camera module to be tested with the cache chip so that the cache chip can apply test signals to each camera module to be tested; the tooling interface is used for connecting at least one IIC extension chip and the cache chip with the control terminal through a tooling channel of the tooling respectively, so that the control terminal can carry out reliability test on a plurality of camera modules to be tested simultaneously.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all changes and modifications that fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (10)

1. The utility model provides a camera module reliability testing arrangement which characterized in that includes:
the device comprises a cache chip, a tool interface, a tool, a control terminal, at least one IIC expansion chip and a plurality of adapter plates;
the at least one IIC expansion chip is used for expanding and connecting a plurality of camera modules to be tested;
the cache chip is used for providing a test signal;
the adapter plates are respectively used for connecting each camera module to be tested with the cache chip so that the cache chip can apply a test signal to each camera module to be tested;
the tooling interface is used for connecting the at least one IIC expansion chip and the cache chip with the control terminal through a tooling channel of the tooling respectively, so that the control terminal can simultaneously carry out reliability test on the plurality of camera modules to be tested.
2. The apparatus of claim 1, further comprising:
and the power supply conversion unit is used for respectively connecting each camera module to be tested through the plurality of adapter plates so as to convert the voltage of an external power supply into the voltage required by each camera module to be tested.
3. The device of claim 2, wherein a power switch is connected between the power conversion unit and the external power source for controlling the on and off of power supply.
4. The apparatus of claim 2, wherein the power conversion unit comprises a plurality of power conversion chips to satisfy conversion of different power supply voltages.
5. The apparatus of claim 4, wherein the tool interface comprises an I/O interface or a power output interface, and is configured to connect to the power conversion chip, and implement power-on timing control and power-off timing control on the plurality of camera modules to be tested through the I/O interface or the power output interface.
6. The apparatus of claim 1, wherein the plurality of adapter plates each comprise: a power supply input interface and a signal input interface;
supplying power to the plurality of camera modules to be tested through the power supply input interface;
and providing signals for the plurality of camera modules to be tested through the signal input interface.
7. The apparatus of claim 6, wherein a first light emitting diode is connected at the power input interface for indicating whether power is supplied normally;
and a second light emitting diode is connected at the signal input interface and used for prompting whether the communication is normal or not.
8. The apparatus of claim 1, wherein the number of the plurality of adapter plates is equal to the number of the plurality of camera modules to be tested.
9. The apparatus of claim 1, wherein the cache chip comprises:
the clock buffer chip is used for providing a clock signal in the test signal;
the first IO cache chip is used for providing a standby signal in the test signal;
and the second IO cache chip is used for providing a reset signal in the test signals.
10. The apparatus of claim 1, wherein each tooling corresponds to at least two tooling channels.
CN202011495106.5A 2020-12-17 2020-12-17 Camera module reliability testing device Active CN112788328B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011495106.5A CN112788328B (en) 2020-12-17 2020-12-17 Camera module reliability testing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011495106.5A CN112788328B (en) 2020-12-17 2020-12-17 Camera module reliability testing device

Publications (2)

Publication Number Publication Date
CN112788328A CN112788328A (en) 2021-05-11
CN112788328B true CN112788328B (en) 2023-04-07

Family

ID=75751093

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011495106.5A Active CN112788328B (en) 2020-12-17 2020-12-17 Camera module reliability testing device

Country Status (1)

Country Link
CN (1) CN112788328B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113777528A (en) * 2021-09-10 2021-12-10 昆山丘钛微电子科技股份有限公司 IIC leakage current detection circuit, detection method and test tool

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202261661U (en) * 2011-09-21 2012-05-30 深圳市度信科技有限公司 High-pixel camera head testing board
CN107483919B (en) * 2017-07-31 2019-03-15 歌尔股份有限公司 A kind of camera module detection circuit
CN207528883U (en) * 2017-12-14 2018-06-22 信利光电股份有限公司 A kind of voice coil motor life-span test system of multi-cam module
CN108521548A (en) * 2018-04-16 2018-09-11 昆山软龙格自动化技术有限公司 Multi-cam based on PCIE and camera coaxial transmission technology is same to survey device
CN211267009U (en) * 2020-02-17 2020-08-14 南昌欧菲光电技术有限公司 Test module and test device

Also Published As

Publication number Publication date
CN112788328A (en) 2021-05-11

Similar Documents

Publication Publication Date Title
US20090306925A1 (en) Systems and methods for testing integrated circuit devices
US7688099B2 (en) Sequential semiconductor device tester
CN115210589A (en) Chip testing device and testing method
US8607079B2 (en) Power-on test system for testing storage device and test method employing the same
WO2020057084A1 (en) Display module test platform
CN100426244C (en) Designation system and method
CN112788328B (en) Camera module reliability testing device
CN115932540A (en) Multi-channel multifunctional chip testing machine and testing method
CN211529147U (en) Test platform framework of computer mainboard standard
US10684664B2 (en) Removable test and diagnostics circuit
CN202339398U (en) Ageing module for VXI bus digital test system
US10992378B2 (en) Information processing apparatus and optical fiber inspection method
CN208654638U (en) Function of the MCU test device
CN110018934A (en) A kind of system and method based on server master board quick diagnosis power-on error
CN202475547U (en) Voltage conversion adaptation board
CN213181887U (en) Voltage detection circuit and interactive intelligent panel
US20130171841A1 (en) Test device for testing usb sockets
CN212180927U (en) Multi-path voltage signal output board card for testing battery management unit
US7652497B2 (en) Sequential semiconductor device tester
CN210984288U (en) Non-volatile memory test equipment
CN103647599B (en) The general-utility test platform of optical communication equipment functional module and method of testing thereof
CN113126716A (en) Hard disk backboard and electronic equipment
CN114187957A (en) Memory test system and use method thereof
US8461859B2 (en) Semiconductor device and interface board for testing the same
CN110647431A (en) Test box for board card and complete machine diagnosis test

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant