CN112788222A - Camera module and electronic equipment - Google Patents
Camera module and electronic equipment Download PDFInfo
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- CN112788222A CN112788222A CN202110181232.1A CN202110181232A CN112788222A CN 112788222 A CN112788222 A CN 112788222A CN 202110181232 A CN202110181232 A CN 202110181232A CN 112788222 A CN112788222 A CN 112788222A
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- module
- heat
- heat conducting
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- chip module
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Aviation & Aerospace Engineering (AREA)
- General Physics & Mathematics (AREA)
- Studio Devices (AREA)
- Adjustment Of Camera Lenses (AREA)
Abstract
The application discloses module and electronic equipment make a video recording relates to the electronic product field. A camera module, comprising: a lens module; the chip module is arranged opposite to the lens module; the anti-shake module is connected with the chip module and drives the chip module to move in a first plane, and the first plane is perpendicular to the optical axis of the lens module; the heat dissipation module comprises a heat conduction assembly and a heat dissipation piece, the heat conduction assembly is arranged on the heat dissipation piece, the chip module is arranged on the heat conduction assembly, and the chip module can move relative to the heat conduction assembly. An electronic device comprises the camera module. The problem of conventional imaging chip anti-shake system can't dispel the heat and influence the formation of image effect has been solved to this application.
Description
Technical Field
The application belongs to the technical field of electronic products, and particularly relates to a camera module and electronic equipment.
Background
Some current electronic equipment, in order to satisfy the stable shooting demand of high definition, require electronic equipment to have powerful imaging chip anti-shake system, and possess the chip of high image quality, however, along with the promotion of chip pixel, its calorific capacity is increasing gradually, meanwhile, imaging chip anti-shake system can be multi-angle compensation motion at the during operation, this process can produce the heat equally, so, long-time shoot and video recording in-process, the heat height that produces, the noise, greatly increased such as noise, thereby lead to the imaging effect not good, influence user experience.
Disclosure of Invention
The embodiment of the application aims to provide a camera module and electronic equipment, and the problem that the imaging effect is influenced by the fact that a conventional imaging chip anti-shaking system cannot dissipate heat can be solved.
In order to solve the technical problem, the present application is implemented as follows:
the embodiment of the application provides a module of making a video recording, this module of making a video recording includes:
a lens module;
the chip module is arranged opposite to the lens module;
the anti-shake module is connected with the chip module and drives the chip module to move in a first plane, and the first plane is perpendicular to the optical axis of the lens module;
the heat dissipation module comprises a heat conduction assembly and a heat dissipation piece, the heat conduction assembly is arranged on the heat dissipation piece, the chip module is arranged on the heat conduction assembly, and the chip module can move relative to the heat conduction assembly.
The embodiment of the application also provides electronic equipment which comprises the camera module.
In this application embodiment, at the module during operation of making a video recording, anti-shake module and chip module continue to work, and produce the heat in real time, link to each other with the chip module through anti-shake module, and set up the chip module on heat-conducting component, can be constantly with the heat transfer that produces on anti-shake module and the chip module for heat-conducting component, and give the heat radiating piece by heat-conducting component with the heat fast transfer, finally distribute away the heat from the module of making a video recording through the heat radiating piece, in order to realize the radiating effect. Based on the above setting, make anti-shake module and chip module have good radiating effect, even the module of making a video recording is long-time to shoot and the video recording also is difficult because the temperature is higher and produce noise point, noise scheduling problem, has guaranteed image quality, has further promoted user experience.
Drawings
Fig. 1 is a disassembled schematic view of a camera module disclosed in the embodiment of the present application;
fig. 2 is an assembly schematic diagram of a camera module disclosed in the embodiment of the present application;
fig. 3 is a schematic cross-sectional view of a camera module disclosed in an embodiment of the present application;
fig. 4 is a schematic structural diagram of the camera module with the substrate removed, disclosed in the embodiment of the present application;
fig. 5 is an assembly diagram of a flexible circuit board, a heat conducting module, a substrate module, a chip module, a bracket, and an anti-shake module disclosed in the embodiment of the present application;
fig. 6 is an assembly diagram of a flexible circuit board, a heat conducting module, a substrate module, a chip module and a bracket disclosed in the embodiment of the present application;
fig. 7 is an assembly diagram of a flexible circuit, a heat conducting module and a substrate module according to an embodiment of the disclosure;
FIG. 8 is an assembled schematic view of a first form of a thermally conductive module as disclosed in an embodiment of the present application;
fig. 9 is an assembly view of a second form of the thermal conduction module disclosed in an embodiment of the present application;
fig. 10 is a schematic structural diagram of a substrate module disclosed in an embodiment of the present application;
fig. 11 is a schematic structural diagram of a chip module disclosed in an embodiment of the present application;
FIG. 12 is a schematic structural view of a stent disclosed in an embodiment of the present application;
fig. 13 is an assembly view of the anti-shake module disclosed in the embodiment of the present application;
fig. 14 is an assembly view of a zoom motor and a lens module disclosed in an embodiment of the present application;
fig. 15 is a schematic diagram of heat transfer as disclosed in an embodiment of the present application.
Description of reference numerals:
10-a housing;
20-a lens module;
30-a zoom motor;
40-an anti-shake module;
50-a scaffold;
60-a chip module;
70-a substrate module; 71-a stationary part; 72-a flexible connection; 73-a moving part;
80-a flexible circuit board;
90-a heat dissipation module; 91-a heat conducting component; 911-thermally conductive balls; 912-heat conducting fins; 9121-a first groove; 92-a heat sink; 921-second groove; 922-a third groove;
100-optical filter.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The embodiments of the present application are described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.
As shown in fig. 1 to 15, an embodiment of the present application discloses a camera module, which includes a lens module 20, a chip module 60, an anti-shake module 40, and a heat dissipation module 90.
The lens module 20 is a light-transmitting member of the camera module, the lens module 20 may be composed of a plurality of lenses and lens fixing members, and is mainly responsible for focusing light, and the lens module 20 may refract and transmit incident light. In general, the lens module 20 may be disposed on the zoom motor 30, and the lens module 20 is driven by the zoom motor 30 to move along its optical axis to achieve zooming. Of course, the lens module 20 can also be fixedly disposed on the base of the camera module without movement.
The chip module 60 is the photosensitive member of the camera module, and the chip module 60 can sense light and convert the received optical signal into an electric signal, thereby realizing framing and shooting. The chip module 60, which typically includes a circuit board, an imaging chip and various electronic components, is an electronic part of the optoelectronic imaging system. In some alternative embodiments, the chip module 60 is disposed opposite to the lens module 20, so that the light entering through the lens module 20 can be irradiated on the chip module 60 to realize the photosensitive imaging.
The anti-shake module 40 is an adjusting member of the camera module, and can perform multi-angle compensation motion on the chip module 60 or the lens module 20 during operation, so that the relative position between the chip module 60 and the lens module 20 can be adjusted, and an anti-shake effect is achieved. In some optional embodiments, the anti-shake module 40 is connected to the chip module 60, so that the anti-shake module 40 can drive the chip module 60 to move in a first plane, and the first plane is perpendicular to the optical axis of the lens module 20, so that the relative position of the chip module 60 in the first plane can be adjusted to compensate for shake of the camera module, thereby achieving an anti-shake effect. Alternatively, the anti-shake module 40 may include a driving mechanism, such as an electromagnetic drive, for moving the chip module 60 in the first plane under the action of the electromagnetic drive.
The heat dissipation module 90 is an auxiliary component of the camera module, and the heat dissipation module 90 can dissipate heat generated by the anti-shake module 40, the chip module 60 and other components to prevent the normal operation of the anti-shake module 40, the chip module 60 and other components from being affected by higher temperature. Alternatively, the heat dissipation module 90 includes a heat conduction assembly 91 and a heat dissipation member 92, wherein the heat conduction assembly 91 is disposed on the heat dissipation member 92, the chip module 60 is disposed on the heat conduction assembly 91, and the chip module 60 is movable relative to the heat conduction assembly 91.
The module of making a video recording is when shooing external environment, object, and anti-shake module 40 and chip module 60 can continuously work to can produce more heat, because heat-conducting component 91 has stronger heat-conducting capacity, make the heat on chip module 60 and the anti-shake module 40 constantly transmit to heat-conducting component 91, and transmit to heat-dissipating piece 92 via heat-conducting component 91, finally distribute away by heat-dissipating piece 92. It should be noted here that the anti-shake module 40 is connected to the chip module 60 and is disposed at a close position, and the heat on the anti-shake module 40 can be transferred to the heat conducting assembly 91 via the chip module 60, and certainly, since the distance between the anti-shake module 40 and the heat conducting assembly 91 in the spatial position is close, the heat on the anti-shake module 40 can also be transferred to the heat conducting assembly 91 via the gas medium, as long as the heat dissipation of the anti-shake module 40 and the chip module 60 can be realized, and the specific manner is not limited.
In the embodiment of the present application, in order to achieve the anti-shake effect, the anti-shake module 40 drives the chip module 60 to move in the first plane, and the heat dissipation module 90 is fixed, so that the chip module 60 and the heat conduction assembly 91 can move relatively to each other to meet the anti-shake requirement.
Based on the above setting, through setting up heat dissipation module 90 in the embodiment of this application, can give off the heat on anti-shake module 40 and the chip module 60 constantly, thereby can reach the effect to the cooling of anti-shake module 40 and chip module 60, guarantee that anti-shake module 40 and chip module 60 work at comparatively reasonable temperature range, and then can effectively improve the high pixel module of making a video recording because of operating time is long, the too high problem that can not in time give off and influence the module of making a video recording and shoot the effect of heat. Therefore, the problems of noise, noise and the like of the picture shot by the camera module can be obviously improved, and the user experience is further improved.
Referring to fig. 8, in some alternative embodiments, the heat conducting assembly 91 may include a heat conducting sheet 912 and a plurality of heat conducting balls 911. The heat conducting sheet 912 may be a sheet made of a metal material, such as a silver sheet, a copper sheet, an aluminum sheet, or may be a sheet made of a non-metal material, such as a graphite sheet. In the present application, the specific material of the thermally conductive sheet 912 is not limited, and any material having high thermal conductivity may be used. The heat conducting balls 911 may be a revolving body made of a metal material, such as silver balls, copper balls, aluminum balls, etc., or may be a revolving body made of a non-metal material, such as graphite balls, etc. The application does not limit the specific material of the heat conducting ball 911, and the heat conducting ball can be made of a material with high heat conducting efficiency. The heat dissipation member 92 may be a plate made of a metal material, such as a silver plate, a copper plate, an aluminum plate, etc., and the specific material of the heat dissipation member 92 is not limited in this application, as long as it is a material having a high heat dissipation efficiency.
The conducting strip 912 sets up on heat sink 92, conducting ball 911 sets up on conducting strip 912, chip module 60 sets up on conducting ball 911, conducting strip 912 sets up on heat sink 92, so, conducting strip 912 can play the supporting role to conducting ball 911, and simultaneously, conducting ball 911 still conveniently moves on conducting strip 912, and conducting ball 911 can play the supporting role to chip module 60, and simultaneously, still makes things convenient for chip module 60 to remove in the first plane. Based on the above arrangement, the supporting effect on the chip module 60 is achieved, and heat on the chip module 60 and the anti-shake module 40 can be rapidly transferred to the heat conducting sheet 912 through the heat conducting balls 911, and is rapidly transferred to the heat dissipation member 92 through the heat conducting sheet 912, so that heat dissipation of the chip module 60 and the anti-shake module 40 is achieved.
Referring to fig. 8, in consideration that the heat conductive balls 911 may move between the chip module 60 and the heat conductive sheet 912, in the embodiment of the present application, the heat conductive sheet 912 is provided with a plurality of first grooves 9121, the plurality of heat conductive balls 911 are correspondingly disposed in each of the first grooves 9121, and the heat conductive balls 911 may also rotate in the first grooves 9121, so that, during the anti-shake process, the anti-shake module 40 drives the chip module 60 to move, so that the chip module 60 moves relative to the heat conductive sheet 912, and the heat conductive balls 911 between the chip module 60 and the heat conductive sheet 912 may rotate in the first grooves 9121, thereby greatly reducing the resistance of the chip module 60 to move, facilitating the movement of the chip module 60, and reducing the power consumption of the anti-shake module 40 driving the chip module 60 to move.
In order to be more favorable to the movement of chip module 60, the size of first recess 9121 is made big in this application embodiment, that is, when heat conduction ball 911 was placed in first recess 9121, be formed with the headspace between the wall of the inner chamber of first recess 9121 and the outer wall of heat conduction ball 911, so, at the in-process that chip module 60 removed, heat conduction ball 911 can roll along the wall of first recess 9121, further reduce the resistance that chip module 60 received in-process, be more favorable to the removal of chip module 60.
Certainly, in other embodiments, a groove may be further formed in a side surface of the chip module 60 facing the heat conducting sheet 912, so that the heat conducting ball 911 is at least partially embedded in the groove, and thus the relative position between the heat conducting ball 911 and the chip module 60 may not be changed, and the problem of the play of the heat conducting ball 911 may be effectively alleviated to a certain extent.
Referring to fig. 1 and 8, considering that the thickness of the heat conducting sheet 912 is small, it is relatively difficult to dig the first groove 9121 on the heat conducting sheet 912, optionally, the first groove 9121 may be punched on the heat conducting sheet 912, and at this time, the bottom of the first groove 9121 may protrude out of the surface of the heat conducting sheet 912, so that when the heat conducting sheet 912 is disposed on the heat dissipating member 92, the bottom of the first groove 9121 may limit the heat conducting sheet 912 to completely attach to the heat dissipating member 92, and the contact area between the heat conducting sheet 912 and the heat dissipating member 92 is reduced to a certain extent, thereby reducing the heat transfer efficiency. Based on this, in this embodiment of the application, the heat dissipation member 92 is provided with the plurality of second grooves 921, optionally, the heat dissipation member 92 is a heat dissipation plate, and when the heat conduction sheet 912 is disposed on the heat dissipation plate, the bottom of the first groove 9121 is embedded into the second groove 921, so that other portions of the heat conduction sheet 912 can be tightly attached to the surface of the heat dissipation plate, the contact area between the heat conduction sheet 912 and the heat dissipation plate is greatly increased, and further the heat transfer efficiency can be improved.
Of course, in other embodiments, the first groove 9121 on the heat conducting sheet 912 may be replaced by a through hole, and the heat conducting ball 911 is disposed in the through hole, and optionally, the cross section of the through hole is larger than the diameter of the heat conducting ball 911, so that the heat conducting ball 911 may directly contact the heat dissipating member 92, and of course, the heat conducting ball 911 may also contact both the heat conducting sheet 912 and the heat dissipating member 92. It should be noted here that, since the through hole may play a certain limiting role in the heat conducting ball 911, the heat dissipating member 92 may not be provided with a groove, and of course, the heat dissipating member 92 may also be provided with a groove opposite to the through hole, and at this time, the through hole and the groove may play a limiting role in the heat conducting ball 911 together to prevent the heat conducting ball 911 from moving.
Referring to fig. 9, in other embodiments, the heat conducting assembly 91 may further include a heat conducting ball 911 instead of the heat conducting sheet 912, and at this time, the heat conducting ball 911 may directly contact the heat sink 92, so that heat on the chip module 60 and the anti-shake module 40 may be directly transferred to the heat sink 92 through the heat conducting ball 911, which simplifies the structure and meets the heat transfer requirement. Optionally, a plurality of third grooves 922 are formed on the heat sink 92, a plurality of heat conducting balls 911 are correspondingly disposed in each of the third grooves 922, and the heat conducting balls 911 may rotate in the third grooves 922. The third groove 922 can accommodate the thermal conductive ball 911 and limit the thermal conductive ball 911 to prevent the thermal conductive ball 911 from moving.
Of course, although the structure is reduced in the manner in which the heat conduction member 91 includes the heat conduction balls 911 as compared to the manner in which the heat conduction member 91 includes the heat conduction balls 911 and the heat conduction sheet 912, the contact area between the heat conduction member 91 and the heat sink 92 is reduced. Therefore, in order to improve the heat transfer efficiency, the heat transfer balls 911 normally transfer the heat from the chip module 60 and the anti-shake module 40 to the heat conductive sheet 912, and the contact area between the heat conductive sheet 912 and the heat sink 92 is large, so that the heat on the heat conductive sheet 912 can be transferred to the heat sink 92 more quickly, and thus, the heat dissipation efficiency can be improved.
Referring to fig. 2 to 4, in the embodiment of the present application, the camera module further includes a zoom motor 30, the zoom motor 30 is fixed on the housing 10 of the camera module, the lens module 20 is disposed on the zoom motor 30, and the lens module 20 can be driven to approach or separate from the chip module 60 by the zoom motor 30, so as to achieve a zoom effect.
Referring to fig. 5, in some alternative embodiments, the anti-shake module 40 includes a memory metal anti-shake assembly (SMA assembly), which can be electrically connected to the zoom motor 30 to energize the zoom motor 30, and simultaneously contact 4 SMA connecting wires between the elastic pieces and the movable pieces to realize the translational or rotational movement between the upper and lower suspension systems. It should be noted that the specific structure and operation principle of the memory metal anti-shake assembly can refer to the related art, and will not be described in detail herein.
Referring to fig. 7, in order to support the chip module 60 and meet the requirement of the chip module 60 for movement, the image pickup module in the embodiment of the present application further includes a substrate module 70, wherein the chip module 60 is disposed on the substrate module 70, and the chip module 60 can move locally relative to the substrate module 70. The substrate module 70 and the heat conductive sheet 912 are disposed at an interval, and the heat conductive balls 911 are connected between the substrate module 70 and the heat conductive sheet 912. So, can support base plate module 70 through heat conduction ball 911, can satisfy the chip module 60 on the one hand and remove and realize the requirement of anti-shake, and on the other hand, the heat that chip module 60 and anti-shake module 40 produced can also transmit to base plate module 70 on, and transmit to heat conduction ball 911 by base plate module 70, transmit to conducting strip 912 via heat conduction ball 911, transmit to heat dissipation piece 92 via conducting strip 912, finally give off by heat dissipation piece 92, in order to realize the cooling effect.
Referring to fig. 10, in some alternative embodiments, the substrate module 70 includes a fixed portion 71, a movable portion 73 and a flexible connecting portion 72, wherein the fixed portion 71 may be an outer frame structure, and the movable portion 73 is located inside the fixed portion 71, so that the fixed portion 71 and the movable portion 73 form a zigzag structure, the flexible connecting portion 72 is connected between the fixed portion 71 and the movable portion 73, the flexible connecting portion 72 may be a flexible metal sheet, a flexible metal wire, a flexible circuit board, etc., the flexible connecting portion 72 can both achieve electrical conduction between the movable portion 73 and the fixed portion 71, and can play a certain supporting role for the movable portion 73, and enable the movable portion 73 to move relative to the fixed portion 71, and the chip module 60 is fixed on the movable portion 73.
Optionally, the heat conducting balls 911 are disposed between the moving portion 73 and the heat conducting sheet 912, on one hand, the heat conducting balls 911 can support the moving portion 73, and on the other hand, the heat conducting balls 911 can also transfer heat transferred from the chip module 60 and the anti-shake module 40 to the moving portion 73, so as to dissipate heat of the chip module 60 and the anti-shake module 40. In addition, the chip module 60 and the moving part 73 can be electrically conducted, so that the chip module 60, the moving part 73, the flexible connecting part 72 and the fixing part 71 are sequentially electrically conducted, the fixing part 71 is electrically connected with the flexible circuit board 80, the connector of the flexible circuit board can be electrically connected with the main board of the electronic device, meanwhile, the chip module 60 is electrically connected with the anti-shake module 40, the lens module 20 is electrically connected with the anti-shake module 40, and therefore, the electric signal transmission between each electronic component of the camera module and the main board of the electronic device can be realized, and the camera module is powered and controlled. It should be noted that, the electrical connection between the chip module 60 and the anti-shake module 40, the electrical connection between the lens module 20 and the anti-shake module 40, and the like can refer to the related art, and are not described in detail herein.
Referring to fig. 6, 7 and 12, in some alternative embodiments, the camera module further includes a bracket 50, the bracket 50 may be used to mount an optical filter 100, and the optical filter 100 may filter light entering through the lens module 20 to filter out light that does not meet requirements according to requirements. The bracket 50 may further include a ring structure formed by a plurality of conductive elastic pieces, and the bracket 50 is loaded with the photosensitive electronic element, so that the zoom motor 30 and the bracket 50 may be electrically connected together through the elastic pieces to transmit an electrical signal and electrical energy to the zoom motor 30.
Further, the bracket 50 is disposed on the substrate module 70, specifically, the edge of the bracket 50 is overlapped on the fixing portion 71 of the substrate module 70, and an accommodating cavity is defined between the bracket 50 and the substrate module 70, the chip module 60 is disposed in the accommodating cavity, and a portion of the chip module 60 protrudes out of the accommodating cavity. Anti-shake module 40 sets up on support 50, can play certain supporting role to anti-shake module 40 through support 50, and anti-shake module 40 then is connected with the extension of chip module 60, on the one hand, can drive chip module 60 and even support 50 and remove for the fixed part 71 of base plate module 70 through anti-shake module 40, on the other hand, anti-shake module 40 still leads to with chip module 60 electricity to can with anti-shake module 40 between carry out signal and power transmission.
In the embodiment of the present application, the working principle that the chip module 60 and the anti-shake module 40 conduct heat through the heat dissipation module 90 and achieve the heat dissipation effect is as follows:
heat is transferred by means of heat conduction. Heat conduction is also called heat conduction, and refers to a heat transfer phenomenon that objects do not generate relative displacement and are generated by the thermal motion of electrons, atoms, molecules and crystal lattices in a material; the thermal conduction of the metallic solid transfers heat primarily through the migration of free electrons, as shown in fig. 15. However, the materials have different properties, different main heat conduction mechanisms and different effects. Generally, metals have a thermal conductivity greater than non-metals, and pure metals have a thermal conductivity greater than alloys.
The basic formula of heat conduction is K x a Δ T/Δ L, Q represents heat, K is the heat conduction coefficient of the material, a represents the heat transfer area, Δ T represents the temperature difference, and Δ L represents the distance between the two ends. It can be seen from the formula that the heat transfer is proportional to the heat transfer coefficient and the heat transfer area and inversely proportional to the distance between the two ends.
Based on this, in the embodiment of the present application, the heat conducting balls 911, the heat conducting fins 912 and the heat dissipating member 92 may be made of metal materials, especially pure metal materials, so as to improve the heat conducting efficiency.
The embodiment of the application further discloses electronic equipment which comprises the camera module.
Electronic equipment in this application can be cell-phone, panel computer, electronic book reader, wearable equipment, mobile device, unmanned aerial vehicle equipment etc. and this application embodiment does not restrict electronic equipment's specific kind.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. The utility model provides a module of making a video recording which characterized in that includes:
a lens module (20);
a chip module (60), the chip module (60) being disposed opposite to the lens module (20);
the anti-shake module (40), the anti-shake module (40) is connected with the chip module (60), the anti-shake module (40) drives the chip module (60) to move in a first plane, and the first plane is perpendicular to the optical axis of the lens module (20);
a heat sink module (90), the heat sink module (90) including a heat conducting component (91) and a heat sink (92), the heat conducting component (91) disposed on the heat sink (92), the chip module (60) disposed on the heat conducting component (91), and the chip module (60) movable relative to the heat conducting component (91).
2. The camera module according to claim 1, wherein the heat conducting assembly (91) comprises a heat conducting sheet (912) and a plurality of heat conducting balls (911), the heat conducting sheet (912) is disposed on the heat dissipating member (92), a plurality of first grooves (9121) are disposed on the heat conducting sheet (912), the heat conducting balls (911) are correspondingly disposed in the first grooves (9121), and the heat conducting balls (911) are rotatable in the first grooves (9121).
3. The camera module according to claim 2, wherein a space is provided between an inner cavity of the first recess (9121) and an outer wall of the thermally conductive ball (911) to allow the thermally conductive ball (911) to roll in the first recess (9121).
4. The camera module according to claim 2, wherein the heat dissipating member (92) is a heat dissipating plate, the heat dissipating plate is provided with a plurality of second grooves (921), the heat conducting sheet (912) is attached to the surface of the heat dissipating plate, and the first grooves (9121) are correspondingly embedded in the second grooves (921).
5. The camera module according to claim 1, wherein the heat conducting assembly (91) comprises a heat conducting sheet (912) and a plurality of heat conducting balls (911), the heat conducting sheet (912) is disposed on the heat dissipating member (92), a plurality of through holes are disposed on the heat conducting sheet (912), and the heat conducting balls (911) are correspondingly disposed in the through holes and contact with the heat conducting sheet (912) and/or the heat dissipating member (92).
6. The camera module according to claim 1, wherein the heat conducting assembly (91) comprises a plurality of heat conducting balls (911), a plurality of third grooves (922) are formed on the heat dissipating member (92), the heat conducting balls (911) are correspondingly disposed in the third grooves (922), and the heat conducting balls (911) are rotatable in the third grooves (922).
7. The camera module according to claim 2, further comprising a substrate module (70), wherein the substrate module (70) is spaced apart from the thermally conductive sheet (912), and the thermally conductive balls (911) are connected between the substrate module (70) and the thermally conductive sheet (912);
the chip module (60) is disposed on the substrate module (70).
8. The camera module according to claim 7, wherein the substrate module (70) comprises a fixed part (71), a movable part (73) located inside the fixed part (71), and a flexible connecting part (72) connected between the fixed part (71) and the movable part (73), the movable part (73) being movable relative to the fixed part (71), the chip module (60) being fixed to the movable part (73);
the chip module (60), the moving section (73), the flexible connecting section (72), and the fixing section (71) are electrically connected in this order.
9. The camera module according to claim 7, further comprising a bracket (50) for mounting at least the optical filter (100), wherein the bracket (50) is disposed on the substrate module (70), a receiving cavity is formed between the bracket (50) and the substrate module (70), the chip module (60) is at least partially disposed in the receiving cavity, the anti-shake module (40) is disposed on the bracket (50), and the chip module (60) partially extends out of the receiving cavity and is connected to the anti-shake module (40).
10. An electronic device comprising the camera module of any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110181232.1A CN112788222B (en) | 2021-02-07 | 2021-02-07 | Camera module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN114615363A (en) * | 2022-02-23 | 2022-06-10 | 昆山丘钛微电子科技股份有限公司 | Camera module and electronic equipment |
| CN115396583A (en) * | 2022-09-19 | 2022-11-25 | 昆山丘钛光电科技有限公司 | Camera module and endoscope |
| WO2022267377A1 (en) * | 2021-06-22 | 2022-12-29 | 歌尔科技有限公司 | Photographing device |
| WO2023231103A1 (en) * | 2022-05-30 | 2023-12-07 | 歌尔光学科技有限公司 | Projection optical engine |
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