WO2022267377A1

WO2022267377A1 - Photographing device

Info

Publication number: WO2022267377A1
Application number: PCT/CN2021/137055
Authority: WO
Inventors: 刘爽
Original assignee: 歌尔科技有限公司
Priority date: 2021-06-22
Filing date: 2021-12-10
Publication date: 2022-12-29
Also published as: CN113411480A; CN113411480B

Abstract

The present application discloses a photographing device. The photographing device comprises a support member, a housing, a main control board, a heat dissipation member, and an elastic member; the support member is provided with a rotating shaft; the housing can rotate around the rotating shaft; the heat dissipation member can rotate up and down relative to the rotating shaft; the main control board is mounted on the housing and located outside the housing, and the main control board is rotatable relative to the heat dissipation member; one end of the elastic member is connected to the housing, and the other end of the elastic member is connected to the heat dissipation member; the elastic member is used for pulling the heat dissipation member to rotate; when the main control board is located at the top of the housing, at least part of the heat dissipation member is located below the main control board, and the heat dissipation member is used for absorbing heat from the main control board; the end of the heat dissipation member distant from the elastic member is located below a horizontal plane where the center of the housing is located. According to the photographing device of the present application, the heat dissipation effect of the heat dissipation member can be effectively improved, and the temperature of the main control board is decreased.

Description

camera device

This application claims the priority of the Chinese patent application with the application number 202110695737.X and the title of the invention "camera device" submitted to the China Patent Office on June 22, 2021, the entire contents of which are incorporated in this application by reference.

technical field

The present application relates to the field of electronic technology of smart devices, in particular to a camera device.

Background technique

As the requirements for shooting or recording become higher and higher, the pixel requirements of the camera are also higher and higher. Therefore, during long-term use, the heat of the camera becomes more and more serious. For example, if the temperature of the camera is high, problems such as picture quality distortion may appear that affect the picture quality. In the related art, in order to dissipate heat from the camera, generally a heat sink is fixed behind the heat source (main control board) of the camera. However, in this related art, the heat dissipation effect of the heat dissipation element is relatively poor, resulting in a relatively high temperature of the main control board.

The above content is only used to assist in understanding the technical solution of the application, and does not mean acknowledging that the above content is the prior art.

Contents of the invention

The main purpose of the present application is to propose an imaging device, aiming to solve the technical problem of poor heat dissipation effect of the heat sink in the existing imaging device.

In order to achieve the above object, the present application proposes an imaging device, comprising:

a support, the support is provided with a rotating shaft;

a casing, the casing is connected to the rotating shaft and can rotate around the rotating shaft;

The heat sink is arranged in the housing, and the heat sink can rotate up and down relative to the rotating shaft;

a main control board, installed on the housing and located outside the housing, the main control board is rotatable relative to the heat sink; and

An elastic member is arranged in the housing, one end of the elastic member is connected to the housing, and the other end is connected to the heat sink, and the elastic member is used to pull the heat sink to rotate;

Wherein, when the main control board is located on the top of the housing, at least part of the heat sink is located under the main control board for absorbing heat from the main control board; the heat sink is far away from the main control board. One end of the elastic member is located below the horizontal plane where the center of the housing is located.

In one embodiment, the rotating shaft is provided with an arc-shaped chute, and the arc-shaped chute has a notch facing the heat sink, and the heat sink is provided with a slide bar, and the slide bar is connected to the heat sink. Sliding fit with the chute.

In one embodiment, the heat sink is connected to the rotating shaft through a rotating mechanism.

In an embodiment, the camera device further includes a driving mechanism, and the driving mechanism is used to drive the casing to rotate.

In one embodiment, the drive mechanism includes a drive motor, a gear and a ring rack, the drive motor is mounted on the support, the gear is arranged on the output shaft of the drive motor, and the ring gear The bar is arranged on the housing and engages with the gear.

In one embodiment, the heat dissipation element includes a heat dissipation plate and a plurality of heat dissipation fins, the heat dissipation plate extends along the circumferential direction of the housing, and the plurality of heat dissipation fins are arranged at intervals on the heat dissipation plate close to the side of the axis of rotation.

In one embodiment, the height of the heat dissipation fins decreases from the center of the heat dissipation plate to the end of the heat dissipation plate.

In one embodiment, the housing is spherical, the circumference of the cross section of the housing is L ₁ , the diameter of the main control board is L ₂ , and the length of the heat sink along the rotation direction of the housing is is L, where (L ₁ +2L ₂ )/4<L≤L ₁ /2.

In one embodiment, the distance between the heat sink and the inner surface of the housing is greater than 0 and less than or equal to 0.1 mm.

In one embodiment, the outer surface of the casing is recessed inwardly to form a groove, the main control board is installed in the groove, and a heat transfer device is installed on the side of the main control board close to the casing. plate.

The imaging device of the present application includes a support, a housing, a main control board, a heat sink, and an elastic member. The support is provided with a rotating shaft; the housing is connected to the rotating shaft and can rotate around the rotating shaft. The heat dissipation element is arranged in the housing, and the heat dissipation element can rotate up and down relative to the rotating shaft; the main control board is installed on the housing and is located outside the housing, and the main control board Rotatable with respect to the heat dissipation element; the elastic element is arranged in the housing, one end of the elastic element is connected with the housing, and the other end is connected with the heat dissipation element, and the elastic element is used for pulling The heat sink rotates; wherein, when the main control board is located on the top of the housing, at least a part of the heat sink is located below the main control board for absorbing heat from the main control board; The end of the radiating element away from the elastic element is located below the horizontal plane where the center of the housing is located; thus, due to direct sunlight, the angle between the surface of the housing and the sun's rays transitions from 90° to 0°, and the surface of the housing The received solar radiation is gradually reduced to 0, and the temperature of the casing is also gradually reduced, that is, the temperature at the top of the casing is higher than the temperature at the lower side of the casing; thus, the temperature difference between the top of the casing and its lower side can be utilized, so that The heat of the main control board located on the top of the housing can be effectively transferred to the heat sink part located directly below the main control board, and further transferred to the lower side of the housing by the heat sink, thus using the shell The difference in temperature distribution on the surface of the body effectively improves the heat dissipation effect of the heat sink and reduces the temperature of the main control board.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only The accompanying drawings are a part of this application. For those skilled in the art, other drawings can be obtained according to the provided drawings without creative work.

FIG. 1 is a schematic structural view of an embodiment of an imaging device of the present application;

Fig. 2 is an internal detailed view of the camera device shown in Fig. 1, wherein the main control board is located in the middle of the housing;

Fig. 3 is an internal detailed view of the imaging device shown in Fig. 1, wherein the heat sink is rotated to a maximum angle;

Fig. 4 is an internal detailed view of the camera device shown in Fig. 1, wherein the main control board is located on the top of the housing;

Fig. 5 is a schematic structural view of an embodiment of the heat sink in Fig. 4;

Fig. 6 is a diagram of the surface temperature range of the housing of the imaging device of the present application;

FIG. 7 is a schematic structural diagram of another embodiment of the imaging device of the present application;

Fig. 8 is a structural schematic diagram of another viewing angle of the imaging device in Fig. 7;

FIG. 9 is a schematic structural diagram of the turntable assembly in FIG. 8 .

Explanation of reference numbers:

标号label	名称name	标号label	名称 name	标号label		名称name
1010	摄像装置 camera device	131131	凹槽 groove	171171	驱动电机 motor
1111	支撑件supporting item	1414	主控板 main control board	172172	齿轮gear

111111	第一支撑架 first support frame	1515	散热件 Heat sink	173173	环形齿条 Ring rack
112112	第二支撑架 second support frame	151151	散热板 Radiating plate	1818	转盘 turntable
113113	旋转轴axis of rotation	152152	散热翅片 cooling fins	181181	旋转电机rotating electrical machine
1212	弧形滑槽 Arc chute	153153	滑杆 slider	1919	底座 base
1313	壳体 case	170170	驱动机构Drive mechanism	the	the

The realization, functional features and advantages of the present application will be further described in conjunction with the embodiments and with reference to the accompanying drawings.

detailed description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

It should be noted that, unless otherwise specified, technical terms or scientific terms used in this application shall have the usual meanings understood by those skilled in the art to which this application belongs.

In addition, the terms "first" and "second", etc. are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes unlisted steps or units, or optionally further includes For other steps or units inherent in these processes, methods, products or apparatuses.

The present application proposes an imaging device.

Referring to FIG. 1 to FIG. 6 , the present application proposes a camera device 10 , the camera device 10 includes a support member 11 , a housing 13 , a main control board 14 and a heat sink 15 . The supporting member 11 is provided with a rotating shaft 113; the housing 13 is connected to the rotating shaft 113 and can rotate around the rotating shaft 113; the heat sink 15 is arranged in the housing 13, the The heat sink 15 can rotate up and down relative to the rotating shaft 113; can be rotated. The elastic member 16 is arranged in the housing 13, one end of the elastic member 16 is connected to the housing 13, and the other end is connected to the heat sink 15, and the elastic member 16 is used to pull the The radiator 15 rotates. Wherein, when the main control board 14 is located on the top of the housing 13, at least a part of the heat sink 15 is located under the main control board 14, for absorbing heat on the main control board 14; An end of the heat sink 15 away from the elastic member 16 is located below the horizontal plane where the center of the housing 13 is located.

In the embodiment of the present application, the camera device 10 includes, but is not limited to, a camera, a light with a camera function, and the like. The housing 13 is at least partially spherical. That is, at least a part of the housing 13 is spherical or similar to a spherical surface. For example, the housing 13 as a whole is spherical or similar to a spherical shape, or part of the housing 13 is spherical, such as hemispherical or similar to a hemispherical shape. The following will take the spherical housing 13 as an example to describe in detail. In order to enable the housing 13 to rotate, the housing 13 may be rotatably connected to the support member 11 . There may be various structures of the support member 11 , for example, the support member 11 may be a support seat or a support frame, etc., which are not specifically limited. The support member 11 is provided with a rotating shaft 113 extending along the horizontal direction, and the housing 13 is provided with a shaft hole through which the rotating shaft 113 passes. The rotating shaft 113 is rotatably installed in the shaft hole of the housing 13 , so that the housing 13 can rotate around the rotating shaft 113 .

Without loss of generality, the main control board 14 of the camera device 10 is disposed outside the casing 13 . The main control board 14 is provided with components that are prone to heat such as an imaging chip (such as a photosensitive chip). During the use of the camera device 10 , picture distortion usually occurs, and the reason is that the main control board 14 of the camera device 10 is overheated during use. In the embodiment of the present application, in order to dissipate heat from the main control board 14 , a heat dissipating element 15 is disposed inside the casing 13 . The heat dissipation element 15 may be in an arc shape, or the heat dissipation element 15 may also be in a similar arc shape, for example, the heat dissipation element 15 is a polygonal structure formed by sequentially connecting a plurality of flat plates. Wherein, there are many ways that the heat sink 15 can rotate up and down relative to the rotating shaft 113. For example, the heat sink 15 and the rotating shaft 113 are slidably connected through a sliding fit structure, so that the heat sink 15 It can rotate up and down relative to the rotating shaft 113 ; for another example, the heat sink 15 is connected to the rotating shaft 113 through a rotating mechanism so that the heat sink 15 can rotate up and down relative to the rotating shaft 113 . This will be described in detail below.

In the embodiment of the present application, in order to drive the heat sink 15 to rotate, an elastic member 16 is also provided. One end of the elastic member 16 is connected to the inner surface of the housing 13 , and the other end is connected to the heat sink 15 , and the elastic member 16 is used to pull the heat sink 15 to rotate. Optionally, the elastic member 16 is a spring or other spring-like structures. When the housing 13 rotates, the housing 13 will stretch the elastic member 16, so that the elastic member 16 is in a stretched state, thereby having a certain elastic tension, which can pull the heat sink 15 to rotate . When the heat sink 15 rotates, one end of the heat sink 15 close to the elastic member 16 first rotates to the top of the housing 13; after that, the heat sink 15 cannot continue to rotate relative to the rotating shaft 113 , and the main control board 13 can continue to rotate with the housing 13, thus, as the housing 13 continues to rotate, the main control board 14 can rotate relative to the heat sink 15 until the main control board 14 The control board 14 is rotated to the top of the housing 13 . Here, the main control board 14 rotates to the top of the housing 13 , which can be understood as the main control board 14 rotates directly above the rotation shaft 113 .

When the main control board 14 is located on the top of the housing 13, at least part of the heat sink 15 is located below the main control board 14. It can be understood that the heat sink 15 is close to the end surface of the elastic member 16 flush with the end surface of the main control board 14 close to the elastic member 16, or the end surface of the heat sink 15 close to the elastic member 16 is located on the front side of the main control board 14 close to the end surface of the elastic member 16 . In this way, it can be ensured that the heat dissipation element 15 can more fully conduct heat transfer with the main control board 14 , and improve the heat dissipation effect on the main control board 14 . The end of the heat sink 15 away from the elastic member 16 is located below the horizontal plane where the center of the housing 13 is located, so as to ensure that the end of the heat sink 15 away from the elastic member 16 can extend to the bottom of the housing 13 The side (that is, the low-temperature area of the housing 13 ), so that the difference in temperature distribution on the surface of the housing 13 is used to improve the heat dissipation effect of the heat sink 15 .

It should be explained that, as shown in Figure 6, due to direct sunlight, the angle between the surface of the housing 13 and the sun’s rays transitions from 90° to 0°, and the solar radiation received by the surface of the housing 13 gradually decreases to 0, and the housing 13 The temperature of the surface of 13 is also gradually reduced, so the temperature on the upper side of the housing 13 is higher than that on the lower side of the housing 13 . Therefore, the upper side of the housing 13 can be defined as a high-temperature zone, and the lower side of the housing 13 can be defined as a low-temperature zone by taking the horizontal plane where the center of the housing 13 is located as a dividing line. Among them, the top of the casing 13 is exposed to direct sunlight and has the highest temperature. When the main control board 14 is located on the top of the housing 13, at least part of the heat sink 15 is located below the main control board 14, that is, the top of the corresponding housing 13 has the highest temperature; The end of the heat sink 15 away from the elastic member 16 is located in the low temperature area of the housing 13, so that the temperature difference between the top of the housing 13 and its underside can be utilized, so that the main control board 14 at the top of the housing 13 The heat can be more effectively transferred to the heat sink 15, and further transferred from the heat sink 15 to the lower side of the housing 13, so as to use the temperature distribution difference on the surface of the housing 13 to improve the heat dissipation of the heat sink 15. The role of the heat dissipation effect.

It is worth mentioning that in the embodiment of the present application, the relative position of the heat sink 15 and the main control board 14 can be changed without increasing the heat dissipation area of the heat sink 15, so that the position of the heat sink 15 on the casing can be reduced. The heat dissipation area of the high temperature area on the surface of 13 increases the heat dissipation area of the heat dissipation element 15 located in the low temperature area of the housing 13, thereby more effectively improving the heat dissipation effect of the heat dissipation element 15.

The imaging device 10 of the present application includes a support member 11, a casing 13, a main control board 14, a heat sink 15 and an elastic member 16. The support member 11 is provided with a rotating shaft 113; the rotating shaft 113 is passed through the The housing 13, so that the housing 13 can rotate around the rotating shaft 113, the housing 13 at least includes the housing 13; the main control board 14 is arranged on the outer surface of the housing 13; the The cooling element 15 is arranged in the housing 13 and extends along the circumferential direction of the housing 13, the cooling element 15 is movably connected with the rotating shaft 113, so that the cooling element 15 is relative to the rotating shaft 113 can rotate at a preset angle; the elastic member 16 is arranged in the housing 13, one end of the elastic member 16 is connected to the housing 13, and the other end is connected to the heat sink 15, the elastic Part 16 is used to pull the heat sink 15 to rotate; wherein, when the main control board 14 is located on the top of the housing 13, one end of the heat sink 15 is located below the main control board 14, and the other end is located Below the rotating shaft 113; like this, due to direct sunlight, the angle between the surface of the housing 13 and the sun’s rays transitions from 90° to 0°, and the solar radiation received by the surface of the housing 13 gradually decreases to 0, and the housing 13 The temperature at the top of the housing 13 is also gradually reduced, that is, the temperature at the top of the housing 13 is higher than the temperature at the lower side of the housing 13; thereby the temperature difference between the top of the housing 13 and its lower side can be used to make the main body at the top of the housing 13 The heat from the control board 14 can be effectively transferred to the part of the heat sink 15 located directly below the main control board 14, and further transferred to the lower side of the housing 13 by the heat sink 15, so that the surface of the housing 13 can be used to The difference in temperature distribution effectively improves the heat dissipation effect of the heat sink 15, greatly reduces the temperature of the main control board 14, and can reduce the temperature of the main control board 14 to below 70°C, thereby effectively preventing the camera device 100 from appearing The picture is distorted.

There are two ways to drive the housing 13 to rotate, one is to drive the housing 13 to rotate manually by the user, and the other is to drive the housing 13 to rotate through the driving mechanism 170 . Referring to FIG. 6 and FIG. 7 , in an embodiment, the camera device 10 further includes a driving mechanism 170 for driving the casing 13 to rotate. Wherein, the driving mechanism 170 may include a driving motor 171 and a transmission assembly, and the driving motor 171 drives the housing 13 to rotate through the transmission assembly. Of course, the driving motor 171 can also directly drive the housing 13 to rotate.

Optionally, the transmission assembly includes a gear 172 and a rack, the driving motor 171 is mounted on the support 11, the gear 172 is arranged on the output shaft of the driving motor 171, and the rack is The ring rack 173 is arranged on the housing 13 and meshes with the gear 172 . In this way, the driving motor 171 can drive the casing 13 to rotate through the gear 172 meshing with the rack, which is beneficial to drive the casing 13 to rotate more smoothly.

In this embodiment, the number of the driving mechanism 170 may be one, or two or more. For example, the number of the driving mechanism 170 is two, and the two driving mechanisms 170 are respectively arranged on opposite sides of the housing 13. By providing two driving mechanisms 170, the housing 13 can be guaranteed to rotate smoothly.

Referring to FIG. 2 to FIG. 4 , in an embodiment, the heat sink 15 is slidably connected to the rotating shaft 113 through a sliding fit structure. Specifically, the sliding fit structure includes an arc-shaped sliding slot 12 provided on the rotating shaft 113, and a sliding rod 153 provided on the heat sink 15, and the arc-shaped sliding slot 12 has a The notch of the component 15, the sliding rod 153 is slidingly fitted with the sliding groove.

Wherein, when the sliding rod 153 slides to the upper end of the arc-shaped slot 12 , at least a part of the heat sink 15 is located on the top of the housing 13 . The arc-shaped slide groove 12 defines the sliding track of the sliding rod 153 , that is, defines the rotating track of the heat sink 15 , so as to well prevent the limiting member from swinging during the rotation. At the same time, the arc-shaped slide groove 12 also defines the maximum sliding position of the sliding rod 153 , that is, limits the maximum rotation angle of the heat sink 15 . That is, when the sliding bar 153 slides to the maximum sliding position, and the heat dissipation element 15 rotates to the maximum angle correspondingly, the sliding bar 153 cannot continue to slide, and the heat dissipation element 15 cannot continue to rotate. By making the heat sink 15 rotate to the maximum angle and then stop rotating, the main control board 14 can continue to rotate with the rotation of the housing 13, so that the relative position of the heat sink 15 and the main control board 14 Changes are made to reduce the heat dissipation area of the heat sink 15 in the high temperature area of the housing 13 and increase the heat dissipation area of the heat sink 15 in the low temperature area of the shell 13, thereby improving the heat dissipation effect of the heat sink 15.

Further, in this embodiment, in order to prevent the sliding rod 153 from protruding from the notch of the arc-shaped chute 12, so as to ensure that the sliding rod 153 can always slide along the arc-shaped chute 12, it is possible to One end of the slide bar 153 close to the arc-shaped chute 12 is provided with a limit block, and the two sides of the notch of the arc-shaped chute 12 protrude inward respectively to form two limit flanges. The flanging is used to limit the limit block in the arc-shaped chute 12, thereby preventing the limit block from protruding from the notch of the arc-shaped chute 12, thereby preventing the sliding rod 153 The effect that escapes from the notch of described arc chute 12.

In addition, in this embodiment, the sliding rod 153 is arranged at the center of the heat sink 15, so that when the sliding rod 153 slides in the arc-shaped sliding groove 12, the cooling of the heat sink 15 can be ensured. It can rotate more stably as the sliding bar 153 slides.

Certainly, in another embodiment, the heat sink 15 and the rotating shaft 113 may also be rotatably connected through a rotating mechanism. The rotating mechanism may include a universal joint. For example, the universal joint includes a fixed seat provided on the rotating shaft 113 and a connecting rod provided on the heat sink 15. The fixed seat has a fixing groove, so One end of the connecting rod close to the fixing groove is provided with a ball head, and the ball head is rotatably installed in the fixing groove.

Please refer to FIGS. 2 to 5. In one embodiment, the heat sink 15 includes a heat sink 151 and a plurality of heat sink fins 152. The heat sink 151 extends along the circumference of the housing 13, and the plurality of fins The cooling fins 152 are spaced apart from one side of the cooling plate 151 close to the rotating shaft 113 .

Wherein, the heat dissipation plate 151 is arranged in an arc shape, and the heat dissipation fins 152 are arranged in a flat plate shape. The plurality of heat dissipation fins 152 and the heat dissipation plate 151 can be integrally formed, or can be formed separately, such as adhesive connection or snap connection. A plurality of heat dissipation fins 152 are provided on the heat dissipation plate 151 to increase the heat dissipation area of the heat dissipation plate 151 to enhance heat dissipation and enhance the heat dissipation effect.

In this embodiment, the heat dissipation plate 151 is arranged symmetrically about its own center. There are many ways to arrange the plurality of heat dissipation fins 152 on the heat dissipation plate 151 , which are not specifically limited. For example, the plurality of heat dissipation fins 152 may be regularly arranged on the heat dissipation plate 151 , for example, the plurality of heat dissipation fins 152 are arranged symmetrically with respect to the center of the heat dissipation plate 151 . Certainly, the plurality of heat dissipation fins 152 may also be randomly arranged on the heat dissipation plate 151 .

Considering that there are multiple heat dissipation fins 152 , the heights of the plurality of heat dissipation fins 152 may be the same or different. Here, the height of the heat dissipation fins 152 can be understood as the distance between the end of the heat dissipation fins 152 away from the heat dissipation plate 151 and the heat dissipation plate 151 . Optionally, the height of the heat dissipation fins 152 decreases from the center of the heat dissipation plate 151 to the end of the heat dissipation plate 151 . In this way, on the one hand, it can ensure that the heat dissipation element 15 has a better heat dissipation effect; That is to say, the heat dissipation fins 152 are prevented from interfering with the rotation of the heat dissipation element 15 , so that the heat dissipation element 15 can rotate smoothly, and the pulling force required for the rotation of the heat dissipation element 15 is also reduced.

In the above embodiment, the housing 13 is spherical, wherein the center of the circle corresponding to the arc-shaped cooling element 15 coincides with the center of the spherical housing 13 . The cross section of the spherical housing 13 is circular. As shown in Figures 4 and 5, for the convenience of description, as shown in Figure 4, the perimeter of the cross section of the housing 13 is defined as L ₁ , the diameter of the main control board 14 is L ₂ , and the heat sink The length of 15 along the rotation direction of the housing is L, where (L ₁ +2L ₂ )/4<L≤L ₁ /2.

When the main control board 14 is located on the top of the housing 13, in order to ensure that the end of the heat sink 15 away from the elastic member 16 is located in the low temperature area of the housing 13, the surface of the housing 13 is used to The temperature difference between the high temperature zone and the low temperature zone is used to improve the heat dissipation effect of the heat sink 15 on the main control board 14 , so it is necessary to ensure that the length L of the heat sink 15 has an appropriate length.

If L<(L ₁ +2L ₂ )/4, the length of the heat sink 15 is relatively short, which will cause the lower end of the heat sink 15 to Located in the high temperature zone of the housing 13, that is, the heat sink 15 is entirely located in the high temperature zone of the housing 13, so that the temperature difference between the upper end and the lower end of the heat sink 15 is small, which is not conducive to the heat sink located in the housing 13. The heat of the main control board 14 on the top of 13 is transferred to the heat sink 15, which is not conducive to the heat dissipation of the main control board 14. If L>L _1/2 , then the length of the heat sink 15 is longer, and the weight of the heat sink 15 is heavier, then driving the rotation of the heat sink 15 requires a larger pulling force, which is not conducive to the heat sink 15. rotation. Therefore, the length L of the heat sink 15 needs to satisfy (L ₁ +2L ₂ )/4<L≦L ₁ /2.

In the above-mentioned embodiments, considering that the heat sink 15 and the housing 13 can rotate relative to each other, in order to make the distance between the heat sink 15 and the housing 13 smaller, the heat dissipation While the heat transfer between the main control board 14 and the main control board 14 can be effectively carried out, the relative rotation between the heat sink 15 and the housing 13 can be ensured. In one embodiment, the heat sink 15 can be connected to the The distance between the inner surfaces of the housing 13 is greater than 0 and less than or equal to 0.1mm.

Wherein, the distance between the heat sink 15 and the inner surface of the housing 13 may be 0.01mm, 0.02mm, 0.03mm, 0.05mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm and so on. If the distance between the heat sink 15 and the inner surface of the housing 13 is greater than 0.1 mm, the distance between the heat sink 15 and the inner surface of the housing 13 is too large, which is not conducive to the heat dissipation. The heat transfer between the component 15 and the main control board 14 is not conducive to the heat transfer from the main control board 14 to the heat sink 15 , which will lead to the deterioration of the heat dissipation effect on the main control board 14 . Therefore, it is necessary to make the distance between the heat sink 15 and the inner surface of the housing 13 less than or equal to 0.1 mm.

Please refer to FIG. 1 again. In order to facilitate the installation of the main control board 14, in one embodiment, the outer surface of the housing 13 is recessed inward to form a groove 131, and the main control board 14 is installed in the recess. Inside the groove 131. Specifically, the main control board 14 may be glued in the groove 131 , or fixed in the groove 131 by screws. Here, it is worth mentioning that, by making the outer surface of the housing 13 recess to form the groove 131, on the one hand, it is convenient to install and fix the main control board 14 in the groove 131; 13 becomes thinner, thereby reducing the distance between the main control board 14 and the heat sink 15, which is more conducive to the heat transfer between the heat sink 15 and the main control board 14, thus more It is beneficial for the heat of the main control board 14 to be transferred to the heat sink 15 , thereby more effectively improving the heat dissipation effect of the heat sink 15 on the main control board 14 .

In addition, in order to facilitate the installation of the main control board 14 , in an embodiment, the side of the main control board 14 close to the housing 13 may be an arc-shaped surface. Wherein, the shape of the arc-shaped surface and the shape of the housing 13 are profiling designed, which facilitates the bonding of the arc-shaped surface of the main control board 14 and the surface of the spherical portion.

In an embodiment, a heat transfer plate may be provided on a side of the main control board 14 close to the housing 13 . The heat transfer plate includes but not limited to thin metal plates, such as thin aluminum plates, thin copper plates and the like. The heat transfer plate can be connected to the main control board 14 by welding; or, the heat transfer plate can be bonded to the main control board 14 by glue. Likewise, the heat transfer plate can be connected to the casing 13 by welding; or, the heat transfer plate can be bonded to the casing 13 by glue. In this embodiment, by providing the heat transfer plate, the heat on the main control board 14 can be better transferred to the heat sink 15 , so that the main control board 14 can be better radiated and cooled.

Referring to Fig. 1, Fig. 7 and Fig. 8, in one embodiment, the support member 11 includes a first support frame 111 and a second support member 11, and the first support frame 111 and the second support frame 112 are respectively arranged on opposite sides of the housing 13 , one end of the rotating shaft 113 is connected to the first support frame 111 , and the other end is connected to the second support frame 112 . In this way, by arranging the first support frame 111 and the second support frame 112, and setting the first support frame 111 and the second support frame 112 on opposite sides of the housing 13, the housing 13 can be improved. With a certain limit effect, the casing 13 can be prevented from moving toward the first support frame 111 or the second support frame 112 during the rotation process along the rotation axis 113 .

Wherein, the first support frame 111 and the second support frame 112 are triangular support frames, which can improve the stability of the first support frame 111 and the second support frame 112 . Certainly, the first support frame 111 and the second support frame 112 may also be square frames, which are not specifically limited.

In the above embodiment, the rotation of the camera is a vertical rotation. Further, in order to realize the rotation of the camera device 10 in the horizontal direction, the camera device 10 may also include a turntable 18 assembly, and the turntable 18 assembly is arranged under the support 11 to drive the support The component 11 rotates, thereby realizing the rotation of the camera device 10 along the horizontal direction.

Please refer to FIG. 8 , the turntable 18 assembly includes a base 19 and a turntable 18 , the turntable 18 is rotatably mounted on the base 19 , and the support member 11 is mounted on the turntable 18 . There are two ways to drive the turntable 18 to rotate, one is to drive the turntable 18 to rotate manually by the user, and the other is to drive the turntable 18 to rotate through the rotating motor 181 . For example, the turntable 18 assembly also includes a rotating motor 181, the rotating motor 181 is arranged in the base 19, the bottom of the turntable 18 is provided with a sleeve, and the sleeve is sleeved on the output of the rotating motor 181. on axis. In this way, the rotating motor 181 drives the turntable 18 to rotate, and then drives the casing 13 to rotate, so that the camera device 10 can rotate 360 degrees in the horizontal direction.

The above are only optional embodiments of the application, and are not intended to limit the patent scope of the application. Under the application concept of the application, the equivalent structural transformation made by using the description of the application and the contents of the accompanying drawings, or direct/indirect Applications in other relevant technical fields are included in the patent protection scope of the present application.

Various embodiments in this specification are described in a parallel or progressive manner, each embodiment focuses on the differences from other embodiments, and the same or similar parts of the various embodiments can be referred to each other. As for the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and for related details, please refer to the description of the method part.

Those of ordinary skill in the art can also understand that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented by electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the relationship between hardware and software Interchangeability. In the above description, the composition and steps of each example have been generally described according to their functions. Whether these functions are executed by hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art may use different methods to implement the described functions for each specific application, but such implementation should not be regarded as exceeding the scope of the present application.

Claims

A camera device, characterized in that it comprises:

a support, the support is provided with a rotating shaft;

a casing, the casing is connected to the rotating shaft and can rotate around the rotating shaft;

The heat sink is arranged in the housing, and the heat sink can rotate up and down relative to the rotating shaft;

a main control board, installed on the housing and located outside the housing, the main control board is rotatable relative to the heat sink; and

An elastic member is arranged in the housing, one end of the elastic member is connected to the housing, and the other end is connected to the heat sink, and the elastic member is used to pull the heat sink to rotate;

Wherein, when the main control board is located on the top of the housing, at least part of the heat sink is located under the main control board for absorbing heat from the main control board; the heat sink is far away from the main control board. One end of the elastic member is located below the horizontal plane where the center of the housing is located.
The imaging device according to claim 1, wherein an arc-shaped chute is provided on the rotating shaft, and the arc-shaped chute has a notch facing the heat sink, and a slide is provided on the heat sink. rod, and the sliding rod is slidingly matched with the sliding groove.
The imaging device according to claim 1, wherein the heat sink is connected to the rotating shaft through a rotating mechanism.
The imaging device according to claim 1, further comprising a driving mechanism for driving the housing to rotate.
The imaging device according to claim 4, wherein the driving mechanism comprises a driving motor, a gear and a ring rack, the driving motor is installed on the support member, and the gear is arranged on the driving motor. On the output shaft, the ring gear rack is arranged on the housing and meshed with the gear.
The imaging device according to claim 1, wherein the heat dissipation element comprises a heat dissipation plate and a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged at intervals on the side of the heat dissipation plate close to the rotating shaft .
The imaging device according to claim 6, wherein the height of the heat dissipation fins is set to decrease from the center of the heat dissipation plate to the end of the heat dissipation plate.
The camera device according to any one of claims 1 to 7, wherein the housing is spherical, the circumference of the cross section of the housing is L 1 , and the diameter of the main control board is L 2 , the length of the heat sink along the rotation direction of the housing is L, where (L 1 +2L 2 )/4<L≤L 1 /2.
The imaging device according to any one of claims 1 to 7, wherein the distance between the heat sink and the inner surface of the housing is greater than 0 and less than or equal to 0.1mm.
The camera device according to any one of claims 1 to 7, wherein the outer surface of the casing is recessed inwardly to form a groove, the main control board is installed in the groove, and the main control board is installed in the groove. A heat transfer plate is arranged on a side of the control board close to the housing.