CN112786475B - Automatic deviation correcting method for wafer - Google Patents

Automatic deviation correcting method for wafer Download PDF

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CN112786475B
CN112786475B CN201911084735.6A CN201911084735A CN112786475B CN 112786475 B CN112786475 B CN 112786475B CN 201911084735 A CN201911084735 A CN 201911084735A CN 112786475 B CN112786475 B CN 112786475B
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coordinates
wafer
robot
center
laser sensor
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CN112786475A (en
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徐方
凌霄
杨奇峰
谭学科
朱洪彪
姚东东
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Shenyang Xinsong Semiconductor Equipment Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

The invention belongs to a control technology for automatically correcting the position of a wafer on a finger in the process of transporting the wafer by a vacuum robot, and particularly relates to an Automatic Wafer Correction (AWC) method, which mainly comprises an implementation mode of the AWC method and an AWC algorithm. The invention comprises the following steps: AWC data acquisition: when the wafer passes through the laser sensor, coordinates recorded by the laser sensor are collected; AWC calibration: calculating to obtain the coordinate of the laser sensor under the robot base coordinate through the center coordinate of the finger of the robot and the radius of the wafer, wherein the coordinate is used for carrying out an automatic deviation correcting function by taking the coordinate as a reference; AWC deviation calculation: and calculating to obtain an offset value through the coordinates of the laser sensor under the robot base coordinates, the coordinates of the finger center under the robot base coordinates, the coordinates of the wafer center and the included angle of the trigger point relative to the origin of the robot base coordinates. The invention realizes the self-correcting function of the robot arm in the wafer transmission process, and ensures the accuracy of wafer transmission of the robot arm.

Description

Automatic deviation correcting method for wafer
Technical Field
The invention belongs to a control technology for automatically correcting the position of a wafer on a finger in the process of transporting the wafer by a vacuum robot, which mainly comprises an implementation mode of an AWC method and an AWC algorithm.
Background
The domestic robot has no function of automatically adjusting the position of the wafer on the finger of the robot in the process of transmitting the wafer, but the wafer can deviate from the center position of the finger of the robot to cause the phenomenon of falling or bumping after being transmitted for a plurality of times in practical application, so that the wafer is always kept within the allowable error range of the center of the finger in the process of transmitting the wafer by the robot, and the robot needs to develop a function of automatically correcting the position of the wafer on the finger.
Disclosure of Invention
The invention realizes the method for automatically correcting the wafer position on the finger during the wafer conveying process of the robot.
The technical scheme adopted by the invention for achieving the purpose is as follows:
An automatic deviation rectifying method for a wafer comprises the following steps:
1) AWC data acquisition: collecting the center coordinates of the fingers of the robot hand recorded by the laser sensor when the wafer passes through the laser sensor;
2) AWC calibration: calculating to obtain the coordinate of the laser sensor under the robot base coordinate through the center coordinate of the finger of the robot and the radius of the wafer, wherein the coordinate is used for carrying out an automatic deviation correcting function by taking the coordinate as a reference;
3) AWC data are acquired again: collecting the center coordinates of the fingers of the robot hand recorded by the laser sensor when the wafer passes through the laser sensor;
4) AWC deviation calculation: and obtaining an offset value by the coordinates of the laser sensor under the robot base coordinates, the coordinates of the finger center under the robot base coordinates, the coordinates of the wafer center and the included angle of the trigger point relative to the origin of the robot base coordinates, and realizing the automatic deviation correcting function of the robot.
The step 1) is specifically as follows: the wafer shields the laser sensor A, B during the transfer of the wafer and 4 sets of coordinates of the center of the robot finger at the 4 trigger times t 1-t 4 generated when leaving the laser sensor A, B.
The positions of the laser sensors A and B cannot be symmetrical relative to the movement track of the robot.
The step 2) is specifically as follows: and (3) calculating the coordinates of the laser sensor A or B under the robot base coordinates according to the coordinates obtained in the step (1) and the wafer radius R, wherein the calculation formula is as follows:
(x2-a)^2+(y2-b)^2＝R^2 (1)
(x3-a)^2+(y3-b)^2＝R^2 (2)
And (3) finishing to obtain:
(C2^2+1)*b^2+(2*x2*C2-2*C1*C2-2*y2)*b+x2^2-2*x2*C1+C1^2+y2^2-R^2＝0
C1＝(x3^2-x2^2+y3^2-y2^2)/(2*(x3-x2))
C2＝(y3-y2)/(x3-x2)
b can be obtained by solving the formulas (1) and (2), and a can be obtained by substituting the formulas;
Wherein, (x 2, y 2), (x 3, y 3) are the coordinates of the robot finger center O 2、O3 under the robot base coordinates, respectively, (a, B) are the coordinates of the laser sensor a or B under the robot base coordinates, and C1, C2 are constants converted from the coordinates acquired in step 1).
The step 4) is specifically as follows: calculating an offset value by the coordinates of the laser sensor A, B obtained in the step 2) under the coordinates of the robot base, the coordinates of the centers of the fingers of the 4 groups of robots obtained in the step 3), the coordinates of the centers of the wafers at the time points t1 to t4 and the included angle of the trigger point at the time points t1 to t4 relative to the origin of the coordinates of the robot base, wherein the calculation formula is as follows:
X1＝x1+d*cos(θ1+ψ-π/2)
Y1＝y1+d*sin(θ1+ψ-π/2)；
X2＝x2+d*cos(θ2+ψ-π/2)
Y2＝y2+d*sin(θ2+ψ-π/2)
X3＝x3+d*cos(θ3+ψ-π/2)
Y3＝y3+d*sin(θ3+ψ-π/2)
X4＝x4+d*cos(θ4+ψ-π/2)
Y4＝y4+d*sin(θ4+ψ-π/2)
(X1-Xa)^2+(Y1-Ya)^2＝R^2 ①
(X2-Xb)^2+(Y2-Yb)^2＝R^2 ②
(X3-Xb)^2+(Y3-Yb)^2＝R^2 ③
(X4-Xa)^2+(Y4-Ya)^2＝R^2 ④
Wherein, (Xa, ya), (Xb, yb) are respectively used as coordinates (a, b) of the laser sensor A, B under the coordinates of the robot base, R is the radius of the wafer, (X1, Y1), (X2, Y2), (X3, Y3), (X4, Y4) are respectively used as coordinates of the center of the finger of the robot at the time t 1-t 4, (X1, Y1), (X2, Y2), (X3, Y3) and (X4, Y4) are respectively used as coordinates of the center of the wafer at the time t 1-t 4, theta 1, theta 2, theta 3 and theta 4 are respectively used as angles of the trigger points at the time t 1-t 4 relative to the origin of the coordinates of the robot base, d is the deviation distance between the center of the wafer and the center of the finger, and phi is the deviation angle between the center of the wafer and the center of the finger relative to the coordinate system of the finger;
And according to any three groups of solutions in ①～④ equations, obtaining a group of deviation values d and psi, obtaining 4 groups in total, respectively using the 4 groups of deviation values and corresponding trigger points to calculate the calculated values of the distances from the center (X1, Y1) of the wafer to the sensor A (Xa, ya) at the trigger moment to be equal to the radius of the wafer, selecting a group of deviation values of which the calculated radius of the wafer is closest to the actual radius of the wafer as deviation rectifying deviation, and converting the deviation into joint deviation values to rectify.
The invention has the following beneficial effects and advantages:
The invention realizes the self-correcting function of the robot arm in the wafer transmission process, and ensures the accuracy of wafer transmission of the robot arm.
Drawings
FIG. 1 is a flow chart of an embodiment of the present invention;
FIG. 2 is a schematic view of AWC data acquisition;
FIG. 3 is a schematic diagram of the AWC calibration principle;
fig. 4 is a schematic diagram of wafer bias.
Detailed Description
The technical key points of the invention are as follows:
1. two sensors are installed on the station.
2. The robot triggers the sensor during the telescoping process.
3. And calculating a calibration position through the code disc value recorded at the triggering moment.
4. And calculating the deviation value of the wafer and the center of the finger through the code disc value recorded at the triggering moment.
5. The robot uses the offset value to automatically correct the wafer position.
The present invention will be described in further detail with reference to the accompanying drawings and examples.
As shown in fig. 1, the AWC (ACTIVE WAFER CENTERING wafer self-centering) functional overall scheme includes: AWC data acquisition, AWC calibration and AWC deviation calculation.
As shown in fig. 2, AWC data collection is performed by two laser sensors, the robot arm sequentially shields the laser sensors A, B in the process of transmitting the wafer, a driver records the code disc values of each axis of the robot arm at the moment when a trigger signal is generated, and similarly, when the wafer leaves the sensors, the trigger signal is also generated and the code disc values of each axis are recorded. The robot hand will record four codewheel values in total during the process of passing through the two laser sensors.
The robot hand needs to carry out AWC calibration before realizing the AWC correction function, and the AWC calibration aims at recording the standard position of the wafer on the fingers of the robot hand and carrying out the automatic correction function by taking the position as a reference. In the AWC calibration process, the robot hand records the code disc values of each shaft at four trigger moments, and then data are transmitted to the robot hand controller through a bus. The robot calculates the coordinate value of the sensor relative to the base coordinate of the robot through a calibration algorithm.
After calibration is completed, when the robot hand carries the wafer again and transmits the wafer to the designated station, the robot hand records the code disc values of each axis triggered four times again, and data are transmitted to the robot controller through the bus. The robot calculates the deviation value between the wafer and the center of the finger of the robot by using the code wheel value of each axis at the moment of triggering for 4 times, and then converts the deviation into the joint deviation value of each axis, thereby realizing the automatic deviation correcting function of the robot.
AWC calibration principle:
as shown in fig. 3, the black solid box is the position of the sensor A, B, which is required to be asymmetric to the motion track of the robot, so as to ensure that the time interval between two triggers is ensured.
The calibration aims to calculate the coordinate value of the sensor under the robot base coordinate by recording the code disc value of the center of the finger twice and the radius R of the wafer. Principle of: the circle center of two points and the radius on the known circle is shown as a dotted line circle. The code disc value of the center of the robot finger recorded when the sensor B is triggered for the first time by the wafer is O2, at this time, the distance from the O2 to the sensor B is the radius R of the wafer, the code disc value of the center of the robot finger recorded when the wafer leaves the sensor B is O3, at this time, the distance from the O3 to the sensor B is the radius R of the wafer, and the O2 and the O3 can be regarded as two points on the wafer (namely, the circle with the radius R) taking the sensor B as the center of the circle. Knowing the coordinates and radius of the two points on the circle, the coordinates (a, B) of sensor B can be found. The coordinates of sensor a can be found in the same way.
Let the coordinate values of O2, O3 at the robot base coordinates be (x 2, y 2), (x 3, y 3), the wafer radius R, and the center of the dotted line (i.e., the coordinates of sensor B) be (a, B).
The coordinate values of a and b can be found by using the following formula:
(x2-a)^2+(y2-b)^2＝R^2
(x3-a)^2+(y3-b)^2＝R^2
And (3) finishing to obtain:
(C2^2+1)*b^2+(2*x2*C2-2*C1*C2-2*y2)*b+x2^2-2*x2*C1+C1^2+y2^2-R^2＝0
C1＝(x3^2-x2^2+y3^2-y2^2)/(2*(x3-x2))
C2＝(y3-y2)/(x3-x2)
the value of b can be obtained by solving a unitary quadratic equation, the value of a can be obtained by taking the formula, and the coordinate value of the sensor A can be obtained by the same method.
Principle of deviation calculation
The coordinate values of the two sensors under the basic coordinates can be determined A, B through calibration, the wafer triggers the sensors 4 times during correction, and the coordinate value of the center of the finger recorded at the moment is not the coordinate value of the center of the finger at the calibration moment because the wafer has deviation on the finger, and the deviation distance between the center of the wafer and the center of the finger is assumed to be d, and the angle is psi (the included angle between the line segment from the center of the wafer to the center of the finger and the positive direction of the x axis of the finger coordinate system). As shown in fig. 4. The coordinate value of the center of the wafer can be calculated through the 4 coordinate values recorded during triggering, and the coordinates of the two sensors are set as A (Xa, ya) and B (Xb, yb); the radius is R; the coordinate values of the center of the finger of the trigger sensor for 4 times are a (X1, Y1), B (X2, Y2), C (X3, Y3) and D (X4, Y4), and the coordinate values of the center of the wafer at corresponding moments are A (X1, Y1), B (X2, Y2), C (X3, Y3) and D (X4, Y4). The angles of the trigger points a, B, c, d to the robot base coordinates for times θ1, θ2, θ3 and θ4 (the angles are the angles between the trigger points and the origin of the robot base coordinates and the positive direction of the x axis of the robot base coordinates) are 4 times, and according to the physical meaning, the distance from the centers of the two points A, D to the sensor A is the radius R of the wafer, and the distance from the centers of the two points B, C to the sensor B is the radius R of the wafer. Standard equations for 4 circles can be listed. The formula is as follows:
X1＝x1+d*cos(θ1+ψ-π/2)
Y1＝y1+d*sin(θ1+ψ-π/2)；
X2＝x2+d*cos(θ2+ψ-π/2)
Y2＝y2+d*sin(θ2+ψ-π/2)
X3＝x3+d*cos(θ3+ψ-π/2)
Y3＝y3+d*sin(θ3+ψ-π/2)
X4＝x4+d*cos(θ4+ψ-π/2)
Y4＝y4+d*sin(θ4+ψ-π/2)
(X1-Xa)^2+(Y1-Ya)^2＝R^2 ①
(X2-Xb)^2+(Y2-Yb)^2＝R^2 ②
(X3-Xb)^2+(Y3-Yb)^2＝R^2 ③
(X4-Xa)^2+(Y4-Ya)^2＝R^2 ④
according to ①、②、③ equation, a set of deviation values d and psi can be solved, according to ①、②、④ equation, a set of deviation values d and psi can be solved, according to ②、③、④ equation, a set of deviation values d and psi can be solved, according to ①、③、④ equation, a set of deviation values d and psi can be solved, 4 sets of deviation values and corresponding trigger points are used for calculating calculated values of the radius at the trigger moment, a set of deviation values with the radius closest to the radius of the wafer are selected to be used as deviation rectifying deviation, and the deviation is converted into joint deviation values to be rectified.

Claims (1)

1. The automatic deviation rectifying method for the wafer is characterized by comprising the following steps of:
1) AWC data acquisition: collecting the center coordinates of the fingers of the robot hand recorded by the laser sensor when the wafer passes through the laser sensor;
2) AWC calibration: calculating to obtain the coordinate of the laser sensor under the robot base coordinate through the center coordinate of the finger of the robot and the radius of the wafer, wherein the coordinate is used for carrying out an automatic deviation correcting function by taking the coordinate as a reference;
3) AWC data are acquired again: collecting the center coordinates of the fingers of the robot hand recorded by the laser sensor when the wafer passes through the laser sensor;
4) AWC deviation calculation: obtaining an offset value through the coordinates of the laser sensor under the robot base coordinates, the coordinates of the finger center under the robot base coordinates, the coordinates of the wafer center and the included angle of the trigger point relative to the origin of the robot base coordinates, and realizing the automatic deviation correcting function of the robot;
4 sets of coordinates of the center of the robot finger at 4 trigger times t 1-t 4 generated when the wafer shields the laser sensor A, B and leaves the laser sensor A, B in the process of transferring the wafer by the robot;
The positions of the laser sensors A and B cannot be symmetrical relative to the movement track of the robot;
And (3) calculating the coordinates of the laser sensor A or B under the robot base coordinates according to the coordinates obtained in the step (1) and the wafer radius R, wherein the calculation formula is as follows:
(x2-a)^2+(y2-b)^2＝R^2 (1)
(x3-a)^2+(y3-b)^2＝R^2 (2)
And (3) finishing to obtain:
(C2^2+1)*b^2+(2*x2*C2-2*C1*C2-2*y2)*b+x2^2-2*x2*C1+C1^2+y2^2-R^2＝0
C1＝(x3^2-x2^2+y3^2-y2^2)/(2*(x3-x2))
C2＝(y3-y2)/(x3-x2)
b can be obtained by solving the formulas (1) and (2), and a can be obtained by substituting the formulas;
Wherein, (x 2, y 2), (x 3, y 3) are the coordinates of the robot finger center O 2、O3 under the robot base coordinates, respectively, (a, B) are the coordinates of the laser sensor a or B under the robot base coordinates, and C1, C2 are constants converted from the coordinates collected in step 1);
Calculating an offset value by the coordinates of the laser sensor A, B obtained in the step 2) under the coordinates of the robot base, the coordinates of the centers of the fingers of the 4 groups of robots obtained in the step 3), the coordinates of the centers of the wafers at the time points t1 to t4 and the included angle of the trigger point at the time points t1 to t4 relative to the origin of the coordinates of the robot base, wherein the calculation formula is as follows:
X1＝x1+d*cos(θ1+ψ-π/2)
Y1＝y1+d*sin(θ1+ψ-π/2)；
X2＝x2+d*cos(θ2+ψ-π/2)
Y2＝y2+d*sin(θ2+ψ-π/2)
X3＝x3+d*cos(θ3+ψ-π/2)
Y3＝y3+d*sin(θ3+ψ-π/2)
X4＝x4+d*cos(θ4+ψ-π/2)
Y4＝y4+d*sin(θ4+ψ-π/2)
(X1-Xa)^2+(Y1-Ya)^2＝R^2 ①
(X2-Xb)^2+(Y2-Yb)^2＝R^2 ②
(X3-Xb)^2+(Y3-Yb)^2＝R^2 ③
(X4-Xa)^2+(Y4-Ya)^2＝R^2 ④
Wherein, (Xa, ya), (Xb, yb) are respectively used as coordinates (a, b) of the laser sensor A, B under the coordinates of the robot base, R is the radius of the wafer, (X1, Y1), (X2, Y2), (X3, Y3), (X4, Y4) are respectively used as coordinates of the center of the finger of the robot at the time t 1-t 4, (X1, Y1), (X2, Y2), (X3, Y3) and (X4, Y4) are respectively used as coordinates of the center of the wafer at the time t 1-t 4, theta 1, theta 2, theta 3 and theta 4 are respectively used as angles of the trigger points at the time t 1-t 4 relative to the origin of the coordinates of the robot base, d is the deviation distance between the center of the wafer and the center of the finger, and phi is the deviation angle between the center of the wafer and the center of the finger relative to the coordinate system of the finger;
And according to any three groups of solutions in ①～④ equations, obtaining a group of deviation values d and psi, obtaining 4 groups in total, respectively using the 4 groups of deviation values and corresponding trigger points to calculate the calculated values of the distances from the center (X1, Y1) of the wafer to the sensor A (Xa, ya) at the trigger moment to be equal to the radius of the wafer, selecting a group of deviation values of which the calculated radius of the wafer is closest to the actual radius of the wafer as deviation rectifying deviation, and converting the deviation into joint deviation values to rectify.
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