CN112763762B - Resistance detection device for microelectronic semiconductor - Google Patents
Resistance detection device for microelectronic semiconductor Download PDFInfo
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- CN112763762B CN112763762B CN202011593162.2A CN202011593162A CN112763762B CN 112763762 B CN112763762 B CN 112763762B CN 202011593162 A CN202011593162 A CN 202011593162A CN 112763762 B CN112763762 B CN 112763762B
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- 238000001514 detection method Methods 0.000 title claims abstract description 99
- 239000004065 semiconductor Substances 0.000 title claims abstract description 81
- 238000004377 microelectronic Methods 0.000 title claims abstract description 17
- 238000012360 testing method Methods 0.000 claims abstract description 72
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 24
- 239000010959 steel Substances 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 22
- 230000017525 heat dissipation Effects 0.000 claims description 26
- 238000005187 foaming Methods 0.000 claims description 10
- 230000002209 hydrophobic effect Effects 0.000 claims description 6
- 239000000565 sealant Substances 0.000 claims description 6
- 230000006835 compression Effects 0.000 claims description 5
- 238000007906 compression Methods 0.000 claims description 5
- 239000000523 sample Substances 0.000 claims description 5
- 230000001360 synchronised effect Effects 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 3
- 210000001503 joint Anatomy 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 2
- 230000005855 radiation Effects 0.000 description 9
- 238000012546 transfer Methods 0.000 description 9
- 239000006260 foam Substances 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The application discloses a resistance detection device for a microelectronic semiconductor, which comprises a detection fixed carrier plate, a detection fixed carrier plate protection panel and a resistance detection device, wherein the resistance detection device comprises a transverse adjusting mechanism and a detection unit; the guide post and the guide steel ball are also included; the electronic semiconductors with different specifications can be pressed and fixed by adjusting the resistance detection device, so that stability and precision in test are realized; the stability of the filling plate in the adjusting process is realized through the guide post on the positioning plate and the guide steel ball embedded in the sliding plate.
Description
Technical Field
The application relates to the field of resistance detection devices, in particular to a resistance detection device for a microelectronic semiconductor.
Background
The test and detection fixed carrier plate is used for bearing the electronic semiconductor which completes the manufacturing process and is coupled with the test machine, so that the test machine can detect whether the electronic semiconductor is normal or not by the test and detection fixed carrier plate and reject the electronic semiconductor with incomplete function, wherein the electronic semiconductor can be arranged on the electronic semiconductor base to be coupled with the test and detection fixed carrier plate by the electronic semiconductor base. The conventional test fixture carrier plate has a plurality of test pads thereon.
The electronic semiconductor needs to be tested after manufacturing, the prior art generally fixes the electronic semiconductor on a test detection fixed carrier plate, but the electronic semiconductor is various in size and specification, so that different detection fixed carrier plates are needed during testing, the expenditure of equipment cost is increased, and moreover, when the specification is large, the size of the electronic semiconductor is fixed due to the fact that the size of the detection fixed carrier plate is fixed, the place where the electronic semiconductor is contacted with the detection fixed carrier plate is suspended, the stability of the test is not facilitated, meanwhile, the filling plate easily shakes in the adjusting process, and the problem that the surface is uneven during the test possibly exists. In addition, the electronic semiconductor test and detection fixed carrier plate can test a plurality of electronic semiconductors simultaneously in the test process, and the poor heat dissipation performance can also cause the problem of poor whole test performance.
Therefore, a technical solution is needed to solve the above technical problems.
Disclosure of Invention
In order to overcome the defects of the prior art, the application aims to provide the resistance detection device for the microelectronic semiconductor, which solves the problems that the electronic semiconductor needs to be tested after being manufactured, the prior art is generally used for fixing the electronic semiconductor on a test and detection fixed carrier plate, but the electronic semiconductor is various in size and specification, so that different test and detection fixed carrier plates are needed during the test, the expenditure of equipment cost is increased, and moreover, when the specification is large, the size of the electronic semiconductor is fixed due to the fixed size of the test and detection fixed carrier plate, the suspension arrangement is formed at the contact position of the electronic semiconductor and the test and is unfavorable for the stability of the test, and meanwhile, the filling plate easily shakes in the adjustment process, so that the problem of uneven surface possibly exists during the test. In addition, the electronic semiconductor test and detection fixed carrier plate can test a plurality of electronic semiconductors simultaneously in the test process, and the poor heat dissipation performance can also cause the problem of poor whole test performance.
To achieve the purpose, the application adopts the following technical scheme:
the application provides a resistance detection device for a microelectronic semiconductor, which is a tower-shaped heat dissipation structure;
the detection fixed carrier plate protection panel is adhered to the upper end of the detection fixed carrier plate to face the detection fixed carrier plate so as to form panel protection;
the resistance detection device comprises a transverse adjustment mechanism capable of filling a gap between the electronic semiconductor and the detection fixed carrier plate in a transverse adjustment process and a detection unit for adjusting the compression degree of the probe to the electronic semiconductor during testing;
the transverse adjusting mechanism comprises a positioning plate fixedly connected with the detection fixed carrier plate, a sliding plate capable of being in sliding connection with the positioning plate, an air cylinder fixed on the sliding plate, and a filling plate fixedly connected with a telescopic rod of the air cylinder;
the detection unit comprises a lifting cylinder fixed on the sliding plate and a test part which is synchronous with the lifting cylinder and realizes tightening of electronic semiconductors with different specifications;
the guide post is welded on the sliding plate, and the guide steel ball is embedded in the sliding plate;
the electronic semiconductors with different specifications can be pressed and fixed by adjusting the resistance detection device, so that stability and precision in test are realized; the stability of the filling plate in the adjusting process is realized through the guide post on the sliding plate and the guide steel ball embedded in the sliding plate.
Preferably, a plurality of first heat dissipation grooves which are transversely and penetratingly arranged and a plurality of second heat dissipation grooves which are longitudinally and penetratingly arranged are arranged on the bottom end surface of the detection fixing carrier plate;
heat dissipation is formed between the adjacent first heat dissipation groove and the second heat dissipation groove
A boss array;
the radiating boss array is an inverted pyramid and is formed by uniformly and densely arranging a plurality of groups of square radiating bosses which are horizontally arranged at intervals up and down;
the side length of the square radiating boss linearly increases from the bottommost layer to the topmost layer.
Preferably, the lifting cylinder is fixedly connected with the sliding plate through a connecting seat.
Preferably, the detection immobilization carrier plate protection panel is a composite layered structure.
The waterproof layer and the anti-skid fixing layer are in embedded contact with each other along the periphery of the horizontal direction, an inner space is defined, the microporous foaming layer is located in the inner space, and the waterproof layer, the microporous foaming layer and the anti-skid fixing layer are fixed through sealant.
Preferably, the bottom of the anti-slip fixing layer is provided with a trapezoid groove.
Preferably, a linear bearing is arranged between the guide post and the filling plate;
the outer end part of the guide post is provided with an anti-slip positioning part;
the anti-skid positioning part is a conical positioning part, and the two parts are connected by adopting threads;
the diameter of the conical positioning part gradually increases along the direction of the outer end.
Preferably, the sliding plate is of a two-flap split type structure; and is formed by combining two sliding flap split plates which are arranged in a butt joint way;
the bottom of the sliding flap split plate is provided with a semi-arc groove arranged along the sliding direction; the sliding valve split plates are connected through bolts; and a guide steel ball installation space is formed between the two semi-arc grooves.
Preferably, a perforation is arranged in the guide steel ball, a guide rod is arranged in the perforation, and two ends of the guide rod penetrate through the sliding flap split plate to realize rotation of the guide steel ball around the guide rod.
The beneficial effects of the application are as follows:
according to the resistance detection device for the microelectronic semiconductor, the electronic semiconductor is fixed on the detection fixed carrier plate protection panel 2 for resistance test, the measurement distance between the test sliding plates 312 is adjusted according to the test requirement, so that the electronic semiconductor is conveniently arranged on the detection fixed carrier plate protection panel 2, and the size and the specification of the electronic semiconductor are adapted, so that different detection fixed carrier plates are required during the test, the expenditure of equipment cost is increased, and moreover, when the specification is large, the size of the electronic semiconductor is fixed due to the fixed size of the detection fixed carrier plate, the suspension arrangement occurs at the place where the size of the electronic semiconductor is contacted with the detection fixed carrier plate, so that the stability of the test is not facilitated; in order to solve the technical problem, the application uses the resistance detection device 3, more specifically, the resistance detection device 3 comprises a transverse adjustment mechanism 31 capable of filling the gap between the electronic semiconductor and the detection fixed carrier plate 1 in the transverse adjustment process and a detection unit 32 for adjusting the compression degree of the probe to the electronic semiconductor during the test; the transverse adjusting mechanism 31 comprises a positioning plate 311 fixedly connected with the detection fixed carrier plate 1, a sliding plate 312 capable of being in sliding connection with the positioning plate 311, an air cylinder 313 fixed on the sliding plate 312, and a filling plate 314 fixedly connected with a telescopic rod of the air cylinder 313; the detecting unit 32 includes a lifting cylinder 321 fixed on the slide plate 312, a testing part 322 synchronized with the lifting cylinder 321 and implementing tightening of electronic semiconductors of different specifications; the guide post 4 is welded on the positioning plate 311, and the guide steel ball 5 is embedded in the sliding plate 312;
the electronic semiconductors with different specifications can be pressed and fixed by adjusting the resistance detection device 3, so that stability and precision in test are realized; the stability of the filling plate 314 in the adjusting process is realized through the guide post 4 on the positioning plate 311 and the guide steel ball 5 embedded in the sliding plate 312. The filler plate 314 can completely cover the suspended area where the size of the electronic semiconductor contacts the test fixture carrier plate, ensuring the stability of the electronic semiconductor plate during testing. Therefore, the electronic semiconductors with different specifications can be pressed and tested by adjusting the resistance detection device 3, so that stability and precision in testing are realized; in the test process, the electronic semiconductor test and detection fixed carrier plate can test a plurality of electronic semiconductors at the same time, so that the heat dissipation performance is poor, and the problem of poor whole test performance can be caused; to approach the above problem, a heat radiation boss array is formed between the adjacent first heat radiation grooves 11 and second heat radiation grooves 12 of the present embodiment; the radiating boss array is an inverted pyramid and is formed by uniformly and densely arranging a plurality of groups of square radiating bosses which are horizontally arranged at intervals up and down; the side length of the square radiating boss linearly increases from the bottommost layer to the topmost layer; the radiating boss array is an inverted pyramid body to play a role in supporting and heat transfer, and the radiating fin array in the shape of the inverted pyramid and the radiating through holes which are penetrated up and down are arranged on the radiating section of the inverted pyramid of the radiating boss array, so that the radiating area and the heat transfer channel are greatly increased, and the heat transfer efficiency is improved; a good heat conduction effect is realized in the test process; moreover, the electronic semiconductors with different specifications can be pressed and fixed by adjusting the resistance detection device 3, so that stability and precision in test are realized; the stability of the filling plate 314 in the adjusting process is realized through the guide post 4 on the positioning plate 311 and the guide steel ball 5 embedded in the sliding plate 312.
Drawings
FIG. 1 is a schematic diagram of a resistance detection apparatus for a microelectronic semiconductor according to an embodiment of the present application;
FIG. 2 is a schematic perspective view of a detection immobilization carrier plate according to an embodiment of the present application;
FIG. 3 is an enlarged schematic view of the structure at A provided in the embodiment of the present application;
FIG. 4 is a schematic view of the installation structure of the guide steel ball provided in the embodiment of the application;
FIG. 5 is a schematic view showing another angle of the detection immobilization carrier plate according to the embodiment of the present application;
fig. 6 is an enlarged schematic view of the structure at B provided in the embodiment of the present application.
Detailed Description
The technical scheme of the application is further described below by the specific embodiments with reference to the accompanying drawings.
As shown in fig. 1 to 6, the present application provides a resistance inspection device for a microelectronic semiconductor, comprising an inspection fixing carrier plate 1; an inverted pyramid-shaped heat dissipation structure is formed on the bottom end surface of the detection fixed carrier plate 1;
the detection fixed carrier plate is attached to the upper end face of the detection fixed carrier plate 1 to form panel protection for the detection fixed carrier plate 1;
the resistance detection device 3, the resistance detection device 3 comprises a transverse adjustment mechanism 31 which can fill the gap between the electronic semiconductor and the detection fixed carrier plate 1 in the transverse adjustment process and a detection unit 32 which is used for adjusting the compression degree of the probe to the electronic semiconductor during the test;
the transverse adjusting mechanism 31 comprises a positioning plate 311 fixedly connected with the detection fixed carrier plate 1, a sliding plate 312 capable of being in sliding connection with the positioning plate 311, an air cylinder 313 fixed on the sliding plate 312, and a filling plate 314 fixedly connected with a telescopic rod of the air cylinder 313;
the detecting unit 32 includes a lifting cylinder 321 fixed on the slide plate 312, a testing part 322 synchronized with the lifting cylinder 321 and implementing tightening of electronic semiconductors of different specifications;
the guide post 4 is welded on the sliding plate 312, and the guide steel ball 5 is embedded in the sliding plate 312;
the electronic semiconductors with different specifications can be pressed and fixed by adjusting the resistance detection device 3, so that stability and precision in test are realized; the stability of the filling plate 314 in the adjustment process is realized by the guide post 4 on the sliding plate 312 and the guide steel ball 5 embedded in the sliding plate 312.
In the above implementation, specifically, the electronic semiconductor is fixed on the protection panel 2 of the detection fixed carrier plate for resistance test, and according to the test requirement, the measurement distance between the test sliding plates 312 is adjusted, so that the electronic semiconductor is conveniently arranged on the protection panel 2 of the detection fixed carrier plate, and the size and the specification of the electronic semiconductor are adapted, so that different detection fixed carrier plates are required during the test, the expenditure of equipment cost is increased, and moreover, when the specification is large, the size of the electronic semiconductor is fixed due to the size of the detection fixed carrier plate, the suspension arrangement occurs at the place where the size of the electronic semiconductor contacts with the detection fixed carrier plate, which is unfavorable for the stability of the test; in order to solve the technical problem, the application uses the resistance detection device 3, more specifically, the resistance detection device 3 comprises a transverse adjustment mechanism 31 capable of filling the gap between the electronic semiconductor and the detection fixed carrier plate 1 in the transverse adjustment process and a detection unit 32 for adjusting the compression degree of the probe to the electronic semiconductor during the test; the transverse adjusting mechanism 31 comprises a positioning plate 311 fixedly connected with the detection fixed carrier plate 1, a sliding plate 312 capable of being in sliding connection with the positioning plate 311, an air cylinder 313 fixed on the sliding plate 312, and a filling plate 314 fixedly connected with a telescopic rod of the air cylinder 313; the detecting unit 32 includes a lifting cylinder 321 fixed on the slide plate 312, a testing part 322 synchronized with the lifting cylinder 321 and implementing tightening of electronic semiconductors of different specifications; the guide post 4 is welded on the positioning plate 311, and the guide steel ball 5 is embedded in the sliding plate 312;
the electronic semiconductors with different specifications can be pressed and fixed by adjusting the resistance detection device 3, so that stability and precision in test are realized; the stability of the filling plate 314 in the adjusting process is realized through the guide post 4 on the positioning plate 311 and the guide steel ball 5 embedded in the sliding plate 312. The filler plate 314 can completely cover the suspended area where the size of the electronic semiconductor contacts the test fixture carrier plate, ensuring the stability of the electronic semiconductor plate during testing. Therefore, the electronic semiconductors with different specifications can be pressed and tested by adjusting the resistance detection device 3, so that stability and precision in testing are realized; in the test process, the electronic semiconductor test and detection fixed carrier plate can test a plurality of electronic semiconductors at the same time, so that the heat dissipation performance is poor, and the problem of poor whole test performance can be caused; to approach the above problem, a heat radiation boss array is formed between the adjacent first heat radiation grooves 11 and second heat radiation grooves 12 of the present embodiment; the radiating boss array is an inverted pyramid and is formed by uniformly and densely arranging a plurality of groups of square radiating bosses which are horizontally arranged at intervals up and down; the side length of the square radiating boss linearly increases from the bottommost layer to the topmost layer; the radiating boss array is an inverted pyramid body to play a role in supporting and heat transfer, and the radiating fin array in the shape of the inverted pyramid and the radiating through holes which are penetrated up and down are arranged on the radiating section of the inverted pyramid of the radiating boss array, so that the radiating area and the heat transfer channel are greatly increased, and the heat transfer efficiency is improved; a good heat conduction effect is realized in the test process; moreover, the electronic semiconductors with different specifications can be pressed and fixed by adjusting the resistance detection device 3, so that stability and precision in test are realized; the stability of the filling plate 314 in the adjusting process is realized through the guide post 4 on the positioning plate 311 and the guide steel ball 5 embedded in the sliding plate 312.
Further, a plurality of first heat dissipation grooves 11 which are transversely and longitudinally penetrated and arranged and a plurality of second heat dissipation grooves 12 which are longitudinally and penetratingly arranged are arranged on the bottom end surface of the detection fixed carrier plate 1;
heat dissipation is formed between adjacent first heat dissipation groove 11 and second heat dissipation groove 12
A boss array;
the radiating boss array is an inverted pyramid and is formed by uniformly and densely arranging a plurality of groups of square radiating bosses which are horizontally arranged at intervals up and down;
the side length of the square heat dissipation boss linearly increases from the bottommost layer to the topmost layer.
Specifically, a heat radiation boss array is formed between adjacent first heat radiation grooves 11 and second heat radiation grooves 12 of the present embodiment; the radiating boss array is an inverted pyramid and is formed by uniformly and densely arranging a plurality of groups of square radiating bosses which are horizontally arranged at intervals up and down; the side length of the square radiating boss linearly increases from the bottommost layer to the topmost layer; the heat dissipation boss array is an inverted pyramid body and plays a role in supporting and heat transfer, and the heat dissipation area and the heat transfer channel are greatly increased and the heat transfer efficiency is improved due to the inverted pyramid-shaped heat dissipation fin array and the upper and lower through heat dissipation through holes arranged on the heat dissipation section of the inverted pyramid body. Good heat conduction is realized in the test process.
Further, the lifting cylinder 321 is fixedly connected with the sliding plate 312 through a connecting seat. A fixed connection of the lifting cylinder 321 is ensured.
Further, the detection fixed carrier plate protection panel 2 is of a composite layered structure;
the anti-skid foam comprises a hydrophobic layer, a microporous foaming layer and an anti-skid fixing layer from top to bottom in sequence;
the hydrophobic layer and the anti-slip fixing layer are in embedded contact with each other along the periphery of the horizontal direction, an inner space is defined, the microporous foaming layer is located in the inner space, and the hydrophobic layer, the microporous foaming layer and the anti-slip fixing layer are fixed through sealant. Specifically, it is possible to effectively prevent water from accumulating on the detection-fixing-carrier-plate protecting panel 2; the middle layer is a microporous foaming layer, and the structural layer can greatly reduce the quality of the protection panel 2 of the detection fixed carrier plate; and the anti-slip fixing layer is arranged below the detection fixing carrier plate, so that the detection fixing carrier plate can be guaranteed to protect the panel 2 from being tightly attached to the ground. The microporous foaming layer is directly surrounded by the high hydrophobic layer and the anti-skid fixing layer, so that the microporous foaming layer can be prevented from being in direct contact with water, and the service life is further prolonged. In addition, since all layers of the detection fixed carrier plate protection panel 2 are made of rubber materials, the detection fixed carrier plate protection panel 2 is not easy to deform, and the test electronic semiconductor is protected due to softer materials.
Further, the bottom of the anti-skid fixing layer is provided with a trapezoid groove. The contact area between the microporous foam layer and the sealant is increased, the gluing space between the microporous foam layer and the anti-skid fixed layer is increased, and the connection strength between the sealant and the sealant is further ensured.
Further, a linear bearing is arranged between the guide post 4 and the filling plate 314;
the outer end part of the guide post 4 is provided with an anti-slip positioning part;
the anti-slip positioning part is a conical positioning part, and the two parts are connected by adopting threads;
the diameter of the conical positioning part gradually increases along the direction of the outer end.
Further, the sliding plate 312 has a split structure with two flaps; and is formed by combining two sliding flap split plates which are arranged in a butt joint way;
the bottom of the sliding flap split plate is provided with a semi-arc groove arranged along the sliding direction; the sliding valve split plates are connected through bolts; and a mounting space for accommodating the guide steel ball 5 is formed between the two semi-arc grooves.
Further, a perforation is arranged in the guide steel ball 5, a guide rod is arranged in the perforation, and two ends of the guide rod penetrate through the sliding flap split plates to realize the rotation of the guide steel ball around the guide rod.
While the application has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the application. The application is not to be limited by the specific embodiments disclosed herein, but rather, embodiments falling within the scope of the appended claims are intended to be embraced by the application.
Claims (8)
1. A resistance sensing device for a microelectronic semiconductor, characterized by:
comprises a detection immobilization carrier plate (1); an inverted pyramid-shaped heat dissipation structure is formed on the bottom end surface of the detection fixed carrier plate (1);
a detection fixed carrier plate protection panel (2) is stuck to the upper end of the detection fixed carrier plate (1) to face the detection fixed carrier plate (1) so as to form panel protection;
the resistance detection device (3), the resistance detection device (3) comprises a transverse adjustment mechanism (31) which can fill the gap between the electronic semiconductor and the detection fixed carrier plate (1) in the transverse adjustment process and a detection unit (32) which is used for adjusting the compression degree of the probe to the electronic semiconductor during the test;
the transverse adjusting mechanism (31) comprises a positioning plate (311) fixedly connected with the detection fixed carrier plate (1), a sliding plate (312) capable of being in sliding connection with the positioning plate (311), an air cylinder (313) fixed on the sliding plate (312), and a filling plate (314) fixedly connected with a telescopic rod of the air cylinder (313);
the detection unit (32) comprises a lifting cylinder (321) fixed on the sliding plate (312), and a test part (322) which is synchronous with the lifting cylinder (321) and realizes tightening of electronic semiconductors with different specifications;
the guide post (4) is welded on the sliding plate (312) and the guide steel ball (5) is embedded in the sliding plate (312);
the electronic semiconductors with different specifications can be pressed and fixed by adjusting the resistance detection device (3), so that stability and precision in test are realized; the filling plate (314) is stabilized in the adjusting process through the guide column (4) on the sliding plate (312) and the guide steel ball (5) embedded in the sliding plate (312).
2. A resistance sensing device for microelectronic semiconductors as recited in claim 1, wherein:
a plurality of first radiating grooves (11) which are transversely and longitudinally arranged in a penetrating manner and a plurality of second radiating grooves (12) which are longitudinally arranged in a penetrating manner are formed in the bottom end face of the detection fixing carrier plate (1);
a heat dissipation boss array is formed between the adjacent first heat dissipation grooves (11) and the adjacent second heat dissipation grooves (12);
the radiating boss array is an inverted pyramid and is formed by uniformly and densely arranging a plurality of groups of square radiating bosses which are horizontally arranged at intervals up and down;
the side length of the square radiating boss linearly increases from the bottommost layer to the topmost layer.
3. A resistance sensing device for microelectronic semiconductors as recited in claim 1, wherein:
the lifting cylinder (321) is fixedly connected with the sliding plate (312) through a connecting seat.
4. A resistance sensing device for microelectronic semiconductors as recited in claim 1, wherein:
the detection fixed carrier plate protection panel (2) is of a composite lamellar structure;
the hydrophobic layer and the anti-slip fixing layer are in embedded contact with each other along the periphery of the horizontal direction and define an inner space, the microporous foaming layer is positioned in the inner space, and the hydrophobic layer, the microporous foaming layer and the anti-slip fixing layer are fixed through sealant.
5. A resistance sensing device for microelectronic semiconductors as recited in claim 4, wherein:
the bottom of the anti-skid fixing layer is provided with a trapezoid groove.
6. A resistance sensing device for microelectronic semiconductors as recited in claim 1, wherein:
a linear bearing is arranged between the guide column (4) and the filling plate (314);
an anti-slip positioning part is arranged at the outer end part of the guide column (4);
the anti-skid positioning part is a conical positioning part, and the two parts are connected by adopting threads;
the diameter of the conical positioning part gradually increases along the direction of the outer end.
7. A resistance sensing device for microelectronic semiconductors as recited in claim 1, wherein:
the sliding plate (312) is of a two-flap split type structure; and is formed by combining two sliding flap split plates which are arranged in a butt joint way;
the bottom of the sliding flap split plate is provided with a semi-arc groove arranged along the sliding direction; the sliding valve split plates are connected through bolts; and a mounting space for accommodating the guide steel ball (5) is formed between the two semi-arc grooves.
8. A resistance sensing device for microelectronic semiconductors as recited in claim 7, wherein:
the guide steel ball (5) is internally provided with a perforation, a guide rod is arranged in the perforation, and two ends of the guide rod penetrate through the sliding flap split plate to realize the rotation of the guide steel ball around the guide rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202011593162.2A CN112763762B (en) | 2020-12-29 | 2020-12-29 | Resistance detection device for microelectronic semiconductor |
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| CN202011593162.2A CN112763762B (en) | 2020-12-29 | 2020-12-29 | Resistance detection device for microelectronic semiconductor |
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| CN201859208U (en) * | 2010-11-15 | 2011-06-08 | 万向电动汽车有限公司 | Power battery insulation performance testing device |
| CN206619581U (en) * | 2017-04-26 | 2017-11-07 | 苏州震坤科技有限公司 | Semiconductor component test device |
| CN207717899U (en) * | 2017-12-22 | 2018-08-10 | 新疆雪峰科技(集团)股份有限公司 | Electric detonator automatic assembling shell earth detector |
| CN209446620U (en) * | 2018-11-01 | 2019-09-27 | 深圳市森威泰科技有限公司 | A kind of pneumatic test fixture of high-accuracy pressure maintaining |
| CN210835046U (en) * | 2019-09-26 | 2020-06-23 | 东莞市硕信电子科技有限公司 | Current measuring device of large-current resistance box |
| CN110865249A (en) * | 2019-10-11 | 2020-03-06 | 陕西安易信息科技有限公司 | Electronic component detector capable of adjusting angle |
| CN110824287A (en) * | 2019-12-11 | 2020-02-21 | 苏州工业职业技术学院 | Electron gear level test equipment |
| CN212180907U (en) * | 2020-01-17 | 2020-12-18 | 东莞市烽元科技有限公司 | Resistance test fixture |
| CN211980579U (en) * | 2020-06-05 | 2020-11-20 | 锐捷芯盛（天津）电子科技有限公司 | Semiconductor wafer detects rotary platform |
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