CN112763762A - Resistance detection device for microelectronic semiconductor - Google Patents
Resistance detection device for microelectronic semiconductor Download PDFInfo
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- CN112763762A CN112763762A CN202011593162.2A CN202011593162A CN112763762A CN 112763762 A CN112763762 A CN 112763762A CN 202011593162 A CN202011593162 A CN 202011593162A CN 112763762 A CN112763762 A CN 112763762A
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- 238000001514 detection method Methods 0.000 title claims abstract description 98
- 239000004065 semiconductor Substances 0.000 title claims abstract description 77
- 238000004377 microelectronic Methods 0.000 title claims abstract description 17
- 238000012360 testing method Methods 0.000 claims abstract description 72
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 25
- 239000010959 steel Substances 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 19
- 230000017525 heat dissipation Effects 0.000 claims description 67
- 238000005187 foaming Methods 0.000 claims description 12
- 230000002209 hydrophobic effect Effects 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 239000000523 sample Substances 0.000 claims description 5
- 239000000565 sealant Substances 0.000 claims description 5
- 230000001360 synchronised effect Effects 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 4
- 230000006835 compression Effects 0.000 claims description 4
- 238000007906 compression Methods 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 3
- 210000001503 joint Anatomy 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims description 3
- 230000033228 biological regulation Effects 0.000 claims 1
- 230000006641 stabilisation Effects 0.000 description 5
- 238000011105 stabilization Methods 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 4
- 238000012669 compression test Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
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- 239000011435 rock Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
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Abstract
The invention discloses a resistance detection device for a microelectronic semiconductor, which comprises a detection fixed carrier plate, a detection fixed carrier plate protection panel and a resistance detection device, wherein the resistance detection device comprises a transverse adjusting mechanism and a detection unit; the device also comprises a guide post and a guide steel ball; the electronic semiconductors of different specifications can be pressed and fixed by adjusting the resistance detection device, so that the stability and the precision during testing are realized; the stability of the filling plate in the adjusting process is realized through the guide post on the positioning plate and the guide steel ball embedded in the sliding plate.
Description
Technical Field
The invention relates to the field of resistance detection devices, in particular to a resistance detection device for a microelectronic semiconductor.
Background
The test detection fixing carrier plate is used for bearing the electronic semiconductor which completes the manufacturing process and is coupled with the test machine, so that the test machine can detect whether the function of the electronic semiconductor is normal or not by the test detection fixing carrier plate and reject the electronic semiconductor with incomplete function, wherein the electronic semiconductor can be configured on the electronic semiconductor base and is coupled with the test detection fixing carrier plate by the electronic semiconductor base. Conventional test detection mounting carrier plates have a plurality of test pads thereon.
Electronic semiconductor need test after the preparation, prior art generally fixes it and goes on test detection fixed carrier board, but electronic semiconductor's size and specification are various, consequently need different detection fixed carrier board when the test, the expenditure of equipment expense has been increased, moreover, it is big because detection fixed carrier board size is fixed when the specification, make electronic semiconductor's size and the local unsettled setting of appearance that detects fixed carrier board contact, be unfavorable for the stability of test, fill the board and produce easily in accommodation process and rock simultaneously, make the problem that probably has the surface injustice during the test. In addition, the electronic semiconductor test detection fixed carrier plate can simultaneously test a plurality of electronic semiconductors in the test process, and has poor heat dissipation performance and poor whole test performance.
Therefore, a technical solution is needed to solve the above technical problems.
Disclosure of Invention
In order to overcome the defects of the prior art, the technical problem to be solved by the invention is to provide a resistance detection device for a microelectronic semiconductor, which solves the problem that the electronic semiconductor needs to be tested after being manufactured, the electronic semiconductor is generally fixed on a test detection fixed carrier plate in the prior art, but the size and the specification of the electronic semiconductor are various, so that different detection fixed carrier plates are needed during testing, the expenditure of equipment cost is increased, and in addition, when the specification is large, the contact position between the size of the electronic semiconductor and the detection fixed carrier plate is suspended due to the fixed size of the detection fixed carrier plate, the stability of the test is not facilitated, and meanwhile, the filling plate is easy to shake in the adjustment process, so that the problem of uneven surface can exist during the test. In addition, the electronic semiconductor test detection fixed carrier plate can simultaneously test a plurality of electronic semiconductors in the test process, and has poor heat dissipation performance and poor whole test performance.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a resistance detection device for a microelectronic semiconductor, which is a character tower-shaped heat dissipation structure;
the detection fixing carrier plate protection panel is attached to the upper end surface of the detection fixing carrier plate and forms panel protection to the detection fixing carrier plate;
the resistance detection device comprises a transverse adjusting mechanism which can fill up a gap between the electronic semiconductor and the detection fixing carrier plate in the transverse adjusting process and a detection unit which is used for adjusting the compression degree of the probe to the electronic semiconductor during testing;
the transverse adjusting mechanism comprises a positioning plate fixedly connected with the detection fixed carrier plate, a sliding plate capable of realizing sliding connection with the positioning plate, an air cylinder fixed on the sliding plate, and a filling plate fixedly connected with an expansion link of the air cylinder;
the detection unit comprises a lifting cylinder fixed on the sliding plate and a test part which is synchronous with the lifting cylinder and realizes tightening of electronic semiconductors of different specifications;
the sliding plate is characterized by also comprising a guide post welded on the positioning plate and a guide steel ball embedded in the sliding plate;
the electronic semiconductors of different specifications can be pressed and fixed by adjusting the resistance detection device, so that the stability and the precision during testing are realized; the stability of the filling plate in the adjusting process is realized through the guide post on the positioning plate and the guide steel ball embedded in the sliding plate.
Preferably, a plurality of first heat dissipation grooves transversely arranged in a penetrating manner and a plurality of second heat dissipation grooves longitudinally arranged in a penetrating manner are arranged on the bottom end face of the detection fixed carrier plate;
a heat dissipation boss array is formed between the adjacent first heat dissipation grooves and the adjacent second heat dissipation grooves;
the heat dissipation boss array is an inverted pyramid and is formed by uniformly and densely arranging a plurality of groups of horizontally arranged square heat dissipation bosses at intervals from top to bottom;
the side length of the square heat dissipation boss increases linearly from the bottommost layer to the topmost layer.
Preferably, the lifting cylinder is fixedly connected with the positioning plate through a connecting seat.
Preferably, the detection immobilization carrier plate protective panel is a composite layered structure.
The hydrophobic layer with anti-skidding fixed layer is along the mutual embedded contact all around of horizontal direction to inject inner space, the micropore foaming layer is located inner space, the hydrophobic layer the micropore foaming layer with it is fixed through sealed glue between the anti-skidding fixed layer.
Preferably, the bottom of the anti-skid fixing layer is provided with a trapezoidal groove.
Preferably, a linear bearing is arranged between the guide column and the filling plate;
the outer end part of the guide post is provided with an anti-skid positioning part;
the anti-skid positioning part is a conical positioning part and is in threaded connection with the conical positioning part;
the diameter size of toper location portion increases gradually along the outer end direction.
Preferably, the sliding plate is of a two-petal split structure; and is formed by combining two split plates of the sliding valve which are arranged in a butt joint way;
the bottom of the sliding valve split plate is provided with a semi-arc groove which is arranged along the sliding direction; the sliding valve split plates are connected through bolts; and a mounting space for accommodating the guide steel ball is formed between the two semi-arc grooves.
Preferably, a through hole is formed in the guide steel ball, a guide rod is arranged in the through hole, and two ends of the guide rod penetrate through the sliding valve split plate to realize that the guide steel ball rotates around the guide rod.
The invention has the beneficial effects that:
according to the resistance detection device for the microelectronic semiconductor, the electronic semiconductor is fixed on the detection fixed carrier plate protection panel 2 for resistance test, the measurement distance between the test sliding plates 312 is adjusted according to test requirements, the electronic semiconductor is conveniently arranged on the detection fixed carrier plate protection panel 2 and is matched with the size and the specification of the electronic semiconductor, so that different detection fixed carrier plates are required during testing, the expenditure of equipment cost is increased, and in addition, when the specification is large, due to the fact that the size of the detection fixed carrier plate is fixed, the contact place of the size of the electronic semiconductor and the detection fixed carrier plate is suspended, and the stability of the test is not facilitated; in order to solve the above technical problem, the present invention uses the resistance detection device 3, more specifically, the resistance detection device 3 includes a lateral adjustment mechanism 31 capable of filling the gap between the electronic semiconductor and the detection fixed carrier plate 1 during the lateral adjustment process, and a detection unit 32 for adjusting the compression degree of the probe to the electronic semiconductor during the test; the transverse adjusting mechanism 31 comprises a positioning plate 311 fixedly connected with the detection fixed carrier plate 1, a sliding plate 312 capable of realizing sliding connection with the positioning plate 311, an air cylinder 313 fixed on the sliding plate 312, and a filling plate 314 fixedly connected with an expansion link of the air cylinder 313; the detection unit 32 comprises a lifting cylinder 3 fixed on the sliding plate 312 and a test part 3 which is synchronous with the lifting cylinder 3 and realizes tightening of electronic semiconductors of different specifications; the device also comprises a guide post 4 welded on the positioning plate 311 and a guide steel ball 5 embedded in the sliding plate 312;
the electronic semiconductors of different specifications can be pressed and fixed by adjusting the resistance detection device 3, so that the stability and the precision during testing are realized; the stabilization of the filling plate 314 in the adjusting process is realized through the guide post 4 on the positioning plate 311 and the guide steel ball 5 embedded in the sliding plate 312. The infill panel 314 is able to completely cover the overhanging region of the electronic semiconductor where it is in contact with the test fixture plate, ensuring stable performance of the electronic semiconductor board during testing. Therefore, the electronic semiconductors of different specifications can be subjected to compression test by adjusting the resistance detection device 3, and the stability and the precision during the test are realized; in the test process, the electronic semiconductor test detection fixed carrier plate can test a plurality of electronic semiconductors simultaneously, and has poor heat dissipation and poor whole test performance; in order to solve the above problem, a heat dissipation boss array is formed between adjacent first heat dissipation grooves 11 and second heat dissipation grooves 12 in the present embodiment; the heat dissipation boss array is an inverted pyramid and is formed by uniformly and densely arranging a plurality of groups of horizontally arranged square heat dissipation bosses at intervals from top to bottom; the side length of the square heat dissipation boss is linearly increased from the bottommost layer to the topmost layer; the heat dissipation boss array is in an inverted pyramid shape and plays a role in supporting and transferring heat, and because the heat dissipation section of the inverted pyramid shape of the heat dissipation boss array is provided with the inverted pyramid-shaped heat dissipation fin array and the heat dissipation through holes which are through up and down, the heat dissipation area and the heat transfer channel are greatly increased, and the heat transfer efficiency is improved; good heat conduction effect is realized in the test process; moreover, the electronic semiconductors of different specifications can be pressed and fixed by adjusting the resistance detection device 3, so that the stability and the precision during testing are realized; the stabilization of the filling plate 314 in the adjusting process is realized through the guide post 4 on the positioning plate 311 and the guide steel ball 5 embedded in the sliding plate 312.
Drawings
Fig. 1 is a schematic structural diagram of a resistance detection apparatus for a microelectronic semiconductor according to an embodiment of the present invention;
FIG. 2 is a schematic perspective view of an assay plate according to an embodiment of the present invention;
FIG. 3 is an enlarged schematic view of the structure at A provided in the present embodiment;
FIG. 4 is a schematic view of an installation structure of a guide steel ball provided in an embodiment of the present invention;
FIG. 5 is a schematic perspective view of another embodiment of the present invention for detecting an angle of a fixed carrier plate;
fig. 6 is an enlarged schematic structural view at B provided in the embodiment of the present invention.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
As shown in fig. 1 to 6, the present invention provides a resistance test apparatus for a microelectronic semiconductor, including a test fixture carrier plate 1; detecting that an inverted pyramid-shaped heat dissipation structure is formed on the bottom end face of the fixed carrier plate 1;
a detection fixing carrier plate protection panel 2 which is attached to the upper end of the detection fixing carrier plate 1 to form panel protection to the detection fixing carrier plate 1;
the resistance detection device 3, the resistance detection device 3 includes the horizontal adjusting mechanism 31 that can fill up the interval between electronic semiconductor and fixed carrier plate 1 of detection and detect in the course of horizontal adjustment and is used for regulating the probe to the detection unit 32 of the electronic semiconductor compaction degree while testing;
the transverse adjusting mechanism 31 comprises a positioning plate 311 fixedly connected with the detection fixed carrier plate 1, a sliding plate 312 capable of realizing sliding connection with the positioning plate 311, an air cylinder 313 fixed on the sliding plate 312, and a filling plate 314 fixedly connected with an expansion link of the air cylinder 313;
the detection unit 32 comprises a lifting cylinder 3 fixed on the sliding plate 312 and a test part 3 which is synchronous with the lifting cylinder 3 and realizes tightening of electronic semiconductors of different specifications;
the device also comprises a guide post 4 welded on the positioning plate 311 and a guide steel ball 5 embedded in the sliding plate 312;
the electronic semiconductors of different specifications can be pressed and fixed by adjusting the resistance detection device 3, so that the stability and the precision during testing are realized; the stabilization of the filling plate 314 in the adjusting process is realized through the guide post 4 on the positioning plate 311 and the guide steel ball 5 embedded in the sliding plate 312.
In the above implementation, specifically, the electronic semiconductor is fixed on the detection fixed carrier plate protection panel 2 to perform resistance test, and the measurement distance between the test sliding plates 312 is adjusted according to the test requirement, so that the electronic semiconductor is conveniently arranged on the detection fixed carrier plate protection panel 2 and is adapted to the size and the specification of the electronic semiconductor, so that different detection fixed carrier plates are required during the test, the expenditure of equipment cost is increased, and moreover, when the specification is large, the size of the electronic semiconductor is fixed due to the size of the detection fixed carrier plate, so that the contact place between the size of the electronic semiconductor and the detection fixed carrier plate is suspended, which is not favorable for the stability of the test; in order to solve the above technical problem, the present invention uses the resistance detection device 3, more specifically, the resistance detection device 3 includes a lateral adjustment mechanism 31 capable of filling the gap between the electronic semiconductor and the detection fixed carrier plate 1 during the lateral adjustment process, and a detection unit 32 for adjusting the compression degree of the probe to the electronic semiconductor during the test; the transverse adjusting mechanism 31 comprises a positioning plate 311 fixedly connected with the detection fixed carrier plate 1, a sliding plate 312 capable of realizing sliding connection with the positioning plate 311, an air cylinder 313 fixed on the sliding plate 312, and a filling plate 314 fixedly connected with an expansion link of the air cylinder 313; the detection unit 32 comprises a lifting cylinder 3 fixed on the sliding plate 312 and a test part 3 which is synchronous with the lifting cylinder 3 and realizes tightening of electronic semiconductors of different specifications; the device also comprises a guide post 4 welded on the positioning plate 311 and a guide steel ball 5 embedded in the sliding plate 312;
the electronic semiconductors of different specifications can be pressed and fixed by adjusting the resistance detection device 3, so that the stability and the precision during testing are realized; the stabilization of the filling plate 314 in the adjusting process is realized through the guide post 4 on the positioning plate 311 and the guide steel ball 5 embedded in the sliding plate 312. The infill panel 314 is able to completely cover the overhanging region of the electronic semiconductor where it is in contact with the test fixture plate, ensuring stable performance of the electronic semiconductor board during testing. Therefore, the electronic semiconductors of different specifications can be subjected to compression test by adjusting the resistance detection device 3, and the stability and the precision during the test are realized; in the test process, the electronic semiconductor test detection fixed carrier plate can test a plurality of electronic semiconductors simultaneously, and has poor heat dissipation and poor whole test performance; in order to solve the above problem, a heat dissipation boss array is formed between adjacent first heat dissipation grooves 11 and second heat dissipation grooves 12 in the present embodiment; the heat dissipation boss array is an inverted pyramid and is formed by uniformly and densely arranging a plurality of groups of horizontally arranged square heat dissipation bosses at intervals from top to bottom; the side length of the square heat dissipation boss is linearly increased from the bottommost layer to the topmost layer; the heat dissipation boss array is in an inverted pyramid shape and plays a role in supporting and transferring heat, and because the heat dissipation section of the inverted pyramid shape of the heat dissipation boss array is provided with the inverted pyramid-shaped heat dissipation fin array and the heat dissipation through holes which are through up and down, the heat dissipation area and the heat transfer channel are greatly increased, and the heat transfer efficiency is improved; good heat conduction effect is realized in the test process; moreover, the electronic semiconductors of different specifications can be pressed and fixed by adjusting the resistance detection device 3, so that the stability and the precision during testing are realized; the stabilization of the filling plate 314 in the adjusting process is realized through the guide post 4 on the positioning plate 311 and the guide steel ball 5 embedded in the sliding plate 312.
Furthermore, a plurality of first heat dissipation grooves 11 which are transversely arranged in a penetrating manner and a plurality of second heat dissipation grooves 12 which are longitudinally arranged in a penetrating manner are arranged on the bottom end surface of the detection and fixation carrier plate 1;
heat dissipation is formed between the adjacent first heat dissipation grooves 11 and the second heat dissipation grooves 12
A boss array;
the heat dissipation boss array is an inverted pyramid and is formed by uniformly and densely arranging a plurality of groups of horizontally arranged square heat dissipation bosses at intervals from top to bottom;
the side length of the square heat dissipation boss increases linearly from the bottommost layer to the topmost layer.
Specifically, a heat dissipation boss array is formed between adjacent first heat dissipation grooves 11 and second heat dissipation grooves 12 in the present embodiment; the heat dissipation boss array is an inverted pyramid and is formed by uniformly and densely arranging a plurality of groups of horizontally arranged square heat dissipation bosses at intervals from top to bottom; the side length of the square heat dissipation boss is linearly increased from the bottommost layer to the topmost layer; the heat dissipation boss array is an inverted pyramid body and plays a role in supporting and transferring heat, and the heat dissipation fin array in an inverted pyramid shape and the heat dissipation through holes which are through up and down are arranged on the heat dissipation section of the inverted pyramid body of the heat dissipation boss array, so that the heat dissipation area and the heat transfer channel are greatly increased, and the heat transfer efficiency is improved. Good heat conduction was achieved during the test.
Further, the lifting cylinder 3 is fixedly connected with the positioning plate 311 through a connecting seat. The fixed connection of the lifting cylinder 3 is ensured.
Further, the detection fixed carrier plate protection panel 2 is a composite laminated structure;
the anti-skid composite material sequentially comprises a hydrophobic layer, a micropore foaming layer and an anti-skid fixing layer from top to bottom;
the hydrophobic layer and the anti-skidding fixing layer are in embedded contact with each other along the periphery of the horizontal direction, an internal space is limited, the micropore foaming layer is located in the internal space, and the hydrophobic layer, the micropore foaming layer and the anti-skidding fixing layer are fixed through a sealant. Specifically, the deposition of moisture on the detection fixed carrier plate protective panel 2 can be effectively prevented; the middle layer is a microporous foaming layer, and the structural layer can greatly reduce the mass of the protective panel 2 for detecting and fixing the carrier plate; and the anti-skid fixing layer is positioned below the carrier plate, so that the protective panel 2 of the detection and fixing carrier plate can be ensured to be tightly attached to the ground. The micropore foaming layer is directly surrounded by the high-hydrophobic layer and the anti-skidding fixing layer, so that the micropore foaming layer can be prevented from being in direct contact with water, and the service life is further prolonged. In addition, all the layers of the detection fixed carrier plate protection panel 2 are made of rubber materials, so that the detection fixed carrier plate protection panel 2 is not easy to deform, and the test electronic semiconductor is protected due to the fact that the materials are soft.
Furthermore, the bottom of the anti-skid fixing layer is provided with a trapezoidal groove. The contact area between the sealant and the microporous foaming layer is increased, the bonding space between the microporous foaming layer and the anti-slip fixing layer is improved, and the connection strength between the sealant and the sealant before is further ensured.
Further, a linear bearing is arranged between the guide column 4 and the filling plate 314;
the outer end part of the guide post 4 is provided with an anti-skid positioning part;
the anti-skid positioning part is a conical positioning part and is in threaded connection with the conical positioning part;
the diameter size of toper location portion is followed the outer end direction and is increased gradually.
Further, the sliding plate 312 is a two-piece split structure; and is formed by combining two split plates of the sliding valve which are arranged in a butt joint way;
the bottom of the sliding valve split plate is provided with a semi-arc groove which is arranged along the sliding direction; the split sliding valve plates are connected through bolts; and an installation space for accommodating the guide steel ball 5 is formed between the two semi-arc grooves.
Furthermore, a through hole is formed in the guide steel ball 5, a guide rod is arranged in the through hole, and two ends of the guide rod penetrate through the sliding valve split plates to realize that the guide steel ball rotates around the guide rod.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the invention. The present invention is not to be limited by the specific embodiments disclosed herein, and other embodiments that fall within the scope of the claims of the present application are intended to be within the scope of the present invention.
Claims (8)
1. A resistance sensing device for a microelectronic semiconductor, comprising:
comprising a detection-immobilization-carrier plate (1); an inverted pyramid-shaped heat dissipation structure is formed on the bottom end face of the detection fixed carrier plate (1);
a detection fixed carrier plate protection panel (2) which is pasted on the upper end surface of the detection fixed carrier plate (1) and forms panel protection to the detection fixed carrier plate (1);
the resistance detection device (3), the said resistance detection device (3) includes the horizontal regulating mechanism (31) that can fill the interval between said electronic semiconductor and said fixed carrier board of detection (1) in the course of horizontal regulation and is used for regulating the probe to the detection unit (32) of the electronic semiconductor compression degree while testing;
the transverse adjusting mechanism (31) comprises a positioning plate (311) fixedly connected with the detection fixed carrier plate (1), a sliding plate (312) capable of realizing sliding connection with the positioning plate (311), an air cylinder (313) fixed on the sliding plate (312), and a filling plate (314) fixedly connected with an expansion link of the air cylinder (313);
the detection unit (32) comprises a lifting cylinder (321) fixed on the sliding plate (312) and a test part (3) which is synchronous with the lifting cylinder (321) and realizes tightening of electronic semiconductors of different specifications;
the device also comprises a guide post (4) welded on the positioning plate (311) and a guide steel ball (5) embedded in the sliding plate (312);
the electronic semiconductors of different specifications can be pressed and fixed by adjusting the resistance detection device (3), so that the stability and the precision during testing are realized; the stability of the filling plate (314) in the adjusting process is realized through the guide columns (4) on the positioning plate (311) and the guide steel balls (5) embedded in the sliding plate (312).
2. A resistance sensing device for a microelectronic semiconductor according to claim 1, wherein:
a plurality of first heat dissipation grooves (11) which are transversely arranged in a penetrating manner and a plurality of second heat dissipation grooves (12) which are longitudinally arranged in a penetrating manner are formed in the bottom end face of the detection fixed carrier plate (1);
a heat dissipation boss array is formed between the adjacent first heat dissipation grooves (11) and the adjacent second heat dissipation grooves (12);
the heat dissipation boss array is an inverted pyramid and is formed by uniformly and densely arranging a plurality of groups of horizontally arranged square heat dissipation bosses at intervals from top to bottom;
the side length of the square heat dissipation boss increases linearly from the bottommost layer to the topmost layer.
3. A resistance sensing device for a microelectronic semiconductor according to claim 1, wherein:
the lifting cylinder (321) is fixedly connected with the positioning plate (311) through a connecting seat.
4. A resistance sensing device for a microelectronic semiconductor according to claim 1, wherein:
the detection fixed carrier plate protection panel (2) is of a composite layered structure.
The hydrophobic layer (21) and the anti-skid fixing layer () are in embedded contact with each other along the periphery of the horizontal direction, an inner space is defined, the micropore foaming layer () is located in the inner space, and the hydrophobic layer (21), the micropore foaming layer () and the anti-skid fixing layer () are fixed through a sealant.
5. A resistance sensing device for a microelectronic semiconductor according to claim 1, wherein:
the bottom of the antiskid fixed layer () is provided with a trapezoidal groove.
6. A resistance sensing device for a microelectronic semiconductor according to claim 1, wherein:
a linear bearing is arranged between the guide column (4) and the filling plate (314);
the outer end part of the guide column (4) is provided with an anti-skid positioning part;
the anti-skid positioning part is a conical positioning part and is in threaded connection with the conical positioning part;
the diameter size of toper location portion increases gradually along the outer end direction.
7. A resistance sensing device for a microelectronic semiconductor according to claim 1, wherein:
the sliding plate (312) is of a two-petal split structure; and is formed by combining two split plates of the sliding valve which are arranged in a butt joint way;
the bottom of the sliding valve split plate is provided with a semi-arc groove which is arranged along the sliding direction; the sliding valve split plates are connected through bolts; and an installation space for accommodating the guide steel ball (5) is formed between the two semi-arc grooves.
8. A resistance sensing device for a microelectronic semiconductor according to claim 7, wherein:
the inner side of the sliding valve split plate is provided with a guide steel ball (5), a through hole is formed in the guide steel ball (5), a guide rod is arranged in the through hole, and two ends of the guide rod penetrate through the sliding valve split plate, so that the guide steel ball rotates around the guide rod.
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| CN202011593162.2A CN112763762B (en) | 2020-12-29 | 2020-12-29 | Resistance detection device for microelectronic semiconductor |
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| KR200406312Y1 (en) * | 2005-03-23 | 2006-01-20 | 진-짜이 쳉 | Various Electrical Characteristics and Small Test Point Testing Module |
| EP1890830A1 (en) * | 2005-05-10 | 2008-02-27 | Maccaferri, Maria Helena Vieira | System for serial line for cutting and bending of steel bars, rods and coils for manufacture of stirrups and longitudinal girders as well as assembly of steel armatures for beams, pillars, base plates, blocks, stakes, drums and other structural elements of reinforced concrete |
| CN201859208U (en) * | 2010-11-15 | 2011-06-08 | 万向电动汽车有限公司 | Power battery insulation performance testing device |
| CN206619581U (en) * | 2017-04-26 | 2017-11-07 | 苏州震坤科技有限公司 | Semiconductor component test device |
| CN207717899U (en) * | 2017-12-22 | 2018-08-10 | 新疆雪峰科技(集团)股份有限公司 | Electric detonator automatic assembling shell earth detector |
| CN209446620U (en) * | 2018-11-01 | 2019-09-27 | 深圳市森威泰科技有限公司 | A kind of pneumatic test fixture of high-accuracy pressure maintaining |
| CN210835046U (en) * | 2019-09-26 | 2020-06-23 | 东莞市硕信电子科技有限公司 | Current measuring device of large-current resistance box |
| CN110865249A (en) * | 2019-10-11 | 2020-03-06 | 陕西安易信息科技有限公司 | Electronic component detector capable of adjusting angle |
| CN110824287A (en) * | 2019-12-11 | 2020-02-21 | 苏州工业职业技术学院 | Electron gear level test equipment |
| CN212180907U (en) * | 2020-01-17 | 2020-12-18 | 东莞市烽元科技有限公司 | Resistance test fixture |
| CN211980579U (en) * | 2020-06-05 | 2020-11-20 | 锐捷芯盛（天津）电子科技有限公司 | Semiconductor wafer detects rotary platform |
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