CN112750967A - Photoelectric device and preparation method thereof - Google Patents
Photoelectric device and preparation method thereof Download PDFInfo
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- CN112750967A CN112750967A CN202011644171.XA CN202011644171A CN112750967A CN 112750967 A CN112750967 A CN 112750967A CN 202011644171 A CN202011644171 A CN 202011644171A CN 112750967 A CN112750967 A CN 112750967A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/14—Carrier transporting layers
- H10K50/15—Hole transporting layers
- H10K50/156—Hole transporting layers comprising a multilayered structure
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/15—Deposition of organic active material using liquid deposition, e.g. spin coating characterised by the solvent used
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Abstract
The invention discloses a preparation method of a photoelectric device, which comprises the steps of forming at least one first functional layer on a first substrate and at least one second functional layer on a second substrate; attaching the first substrate and the second substrate to attach the at least one first functional layer and the at least one second functional layer to form an electroluminescent part; pressing the attached first substrate and second substrate by using an isostatic pressing device; and packaging the pressed first substrate and the pressed second substrate. The invention also discloses a photoelectric device. The invention divides the multi-layer film of the electroluminescent part of the photoelectric device into two parts, forms one functional layer with a plurality of layers on the two substrates, and presses the two functional layers together through the isostatic pressing device to form the complete electroluminescent part.
Description
Technical Field
The invention relates to the technical field of photoelectric devices, in particular to a preparation method of a photoelectric device and the photoelectric device.
Background
The electroluminescent part in an optoelectronic device usually comprises a plurality of functional layers. In the preparation process of the photoelectric device, films forming each functional layer need to be formed layer by layer in sequence, but when a new film is spread on the formed film, the new film is difficult to spread and flatten under the influence of the formed film. When the number of the formed thin film layers is more, the spreading of a new thin film is more difficult, and therefore, when the number of the thin film layers to be formed is too large, the preparation difficulty of the photoelectric device is large.
The above is only for the purpose of assisting understanding of the technical aspects of the present invention, and does not represent an admission that the above is prior art.
Disclosure of Invention
The invention mainly aims to provide a preparation method of a photoelectric device and the photoelectric device, and aims to reduce the preparation difficulty of the photoelectric device by respectively forming a part of a plurality of functional layers of an electroluminescent part on two substrates.
In order to achieve the above object, the present invention provides a method for manufacturing a photoelectric device, the method comprising the steps of:
forming at least one first functional layer on a first substrate and at least one second functional layer on a second substrate;
attaching the first substrate and the second substrate to attach at least one first functional layer and at least one second functional layer to form an electroluminescent part;
pressing the attached first substrate and the second substrate by using an isostatic pressing device;
and packaging the pressed first substrate and the pressed second substrate.
Optionally, before the step of forming at least one first functional layer on the first substrate and at least one second functional layer on the second substrate, the method further includes:
performing plasma processing on the first substrate and/or the second substrate.
Optionally, the electroluminescent part includes at least two functional layers formed by superposition, and the at least two functional layers include a light emitting layer and a carrier transport layer.
Optionally, the carrier transport layer comprises at least a hole functional layer and an electron functional layer.
Optionally, the first substrate is ito glass, and when the at least one first functional layer includes a hole functional layer, the at least one second functional layer includes a light emitting layer and an electron functional layer, and the step of forming the at least one first functional layer on the first substrate includes:
spreading ink corresponding to the cavity functional layer on the first substrate;
and carrying out drying treatment and/or crystallization treatment on the first substrate after the ink corresponding to the hole function layer is spread, so as to form the hole function layer on the first substrate.
Optionally, the first substrate is ito glass, and when the at least one first functional layer includes a hole functional layer and a light emitting layer, the at least one second functional layer includes an electron functional layer, and the step of forming the at least one first functional layer on the first substrate includes:
spreading ink corresponding to the cavity functional layer on the first substrate;
carrying out drying treatment and/or crystallization treatment on the first substrate after the ink corresponding to the hole functional layer is spread, so as to form the hole functional layer on the first substrate;
spreading ink corresponding to the light-emitting layer on the hole function layer of the first substrate;
and performing drying treatment and/or crystallization treatment on the first substrate after the ink corresponding to the light-emitting layer is spread, so as to form the light-emitting layer on the hole function layer.
Optionally, the step of spreading the ink corresponding to the hole function layer on the first substrate includes:
and spreading ink corresponding to the hole functional layer on the first substrate by using a spin coating process or an ink-jet printing process.
Optionally, before the step of bonding the first substrate and the second substrate to bond the at least one first functional layer and the at least one second functional layer to form the electroluminescent part, the method further includes:
respectively smearing packaging glue on the side edge of the first substrate with at least one first functional layer and the side edge of the second substrate with at least one second functional layer;
the step of encapsulating the pressed first substrate and the pressed second substrate includes:
and curing the packaging adhesive on the first substrate and the second substrate after pressing.
Optionally, before the step of forming at least one first functional layer on the first substrate and at least one second functional layer on the second substrate, the method further includes:
and cleaning the first substrate and/or the second substrate.
In addition, in order to achieve the above object, the present invention further provides a photovoltaic device formed by the method for manufacturing a photovoltaic device according to any one of the above aspects, the photovoltaic device including a first substrate and a second substrate bonded after packaging, and an electroluminescence part disposed between the first substrate and the second substrate.
Optionally, the first substrate and the second substrate are bonded by a packaging adhesive, and the packaging adhesive is disposed between the side edge of the first substrate and the side edge of the second substrate.
According to the manufacturing method of the photoelectric device and the photoelectric device, at least one first functional layer is formed on a first substrate, at least one second functional layer is formed on a second substrate, the first substrate and the second substrate are attached to each other, so that the at least one first functional layer and the at least one second functional layer are attached to each other to form an electroluminescence part, the attached first substrate and the attached second substrate are pressed by an isostatic pressing device, and the pressed first substrate and the pressed second substrate are packaged. The invention divides the multi-layer functional layer of the electroluminescent part of the photoelectric device into two parts, forms one of the functional layers with different layers on the two substrates, and presses the two parts of the functional layers formed respectively together through the isostatic pressing device to form the complete electroluminescent part.
Drawings
FIG. 1 is a schematic process flow diagram of a method of making a photovoltaic device according to the present invention;
FIG. 2 is a schematic view of an ink jet printing process of the present invention;
FIG. 3 is a schematic view of a spin-coating process of the present invention;
FIG. 4 is a schematic illustration of a drying process according to the present invention;
FIG. 5 is a schematic illustration of a crystallization process according to the present invention;
FIG. 6 is a schematic diagram of a pressing process of the isostatic press according to the invention;
fig. 7 is a schematic view of the curing process of the packaging adhesive according to the present invention.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
First, a brief overview of a method for manufacturing a photovoltaic device according to an embodiment of the present invention is provided.
Referring to fig. 1, a method for manufacturing a photovoltaic device according to an embodiment of the present invention includes the following steps:
step S1 of forming at least one first functional layer on the first substrate and at least one second functional layer on the second substrate;
step S2 of bonding the first substrate and the second substrate to bond at least one first functional layer and at least one second functional layer to form an electroluminescent part;
in this embodiment, the first substrate and the second substrate are flat plates, and the material of the first substrate and the second substrate may be common glass or ITO (indium tin oxide) glass.
The optoelectronic device comprises a first substrate, a second substrate and an electroluminescent portion between the first substrate and the second substrate, and the optoelectronic device can be made to emit light by energizing the optoelectronic device.
Each functional layer in the electroluminescent part is a thin film and is formed by adopting a specific material so as to achieve the purpose of electroluminescence, wherein each first functional layer in at least one first functional layer and each second functional layer in at least one second functional layer are made of different materials and are used for achieving different functions.
The first substrate and the second substrate respectively comprise two side faces, at least one first functional layer is formed on one side face of the first substrate, at least one second functional layer is formed on one side face of the second substrate, and then the side face, covered with the at least one first functional layer, of the first substrate is attached to the side face, covered with the at least one second functional layer, of the second substrate, so that the at least one first functional layer and the at least one second functional layer are attached to form the electroluminescent part.
Step S3, pressing the first substrate and the second substrate after being attached by an isostatic pressing device;
in this embodiment, the isostatic pressing is to place the object to be processed in a closed container filled with liquid, and gradually pressurize the object by a pressurizing system to apply equal pressure to each surface of the object, so as to reduce the distance between molecules and increase the density without changing the appearance shape, thereby improving the physical properties of the substance, therefore, when the bonded first substrate and second substrate are pressed by the isostatic pressing device shown in fig. 6, the bonded first substrate and second substrate are uniformly stressed, and the applicable pressure range of the isostatic pressing device is generally [100, 630] MPa, so that sufficient pressure can be applied to the bonded first substrate and second substrate to tightly bond at least one first functional layer and at least one second functional layer. The distance between molecules when the at least one first functional layer and the at least one second functional layer are bonded can be reduced through isostatic pressing, so that the bonded electroluminescent part is closer to an electroluminescent part formed by directly and sequentially stacking a plurality of functional layers layer by layer, and the performance of the bonded electroluminescent part is improved.
Step S4, encapsulating the pressed first substrate and the second substrate.
In this embodiment, after the first substrate and the second substrate are bonded, in order to avoid the relative movement of the first substrate and the second substrate from affecting the electroluminescent part formed by the at least one first functional layer and the at least one second functional layer, the bonded first substrate and the bonded second substrate need to be directly packaged to ensure that the electroluminescent part is always in the best state after bonding.
In the technical scheme disclosed in this embodiment, the multi-layer functional layer of the electroluminescent part of the photoelectric device is divided into two parts, one of the functional layers with different numbers of layers is formed on each of the two substrates, and the two functional layers formed respectively are pressed together by the isostatic pressing device to form a complete electroluminescent part.
Alternatively, in the manufacturing process of the photoelectric device, the first substrate and/or the second substrate may be subjected to plasma treatment before forming at least one first functional layer on the first substrate and at least one second functional layer on the second substrate.
The plasma process can adopt microwave plasma, the surface of the first substrate and/or the second substrate can be modified through the plasma to change the surface energy of the first substrate and/or the second substrate, and the wettability of the surface of the first substrate and/or the second substrate is increased, so that when the functional layer is formed on the first substrate and/or the second substrate, ink corresponding to the functional layer is not condensed into a water bead shape on the first substrate and/or the second substrate, and is more uniformly and flatly laid on the first substrate and/or the second substrate, the formed functional layer is more uniformly and flatly formed, and meanwhile, due to the increase of the wettability, the formed functional layer can be more strongly adhered to the first substrate and/or the second substrate. In addition, the plasma process can also remove dust particles on the surface of the first substrate and/or the second substrate, so that the dust particles are prevented from influencing the formation of the functional layer, or the dust particles are prevented from piercing the formed functional layer to damage the functional layer.
Alternatively, the electroluminescent part includes at least two functional layers formed by stacking, for example, the at least two functional layers include a light emitting layer and a carrier transport layer, each of the functional layers is formed by using a specific material for providing a specific function, and the functional layers are stacked in sequence in a specific order for achieving the purpose of electroluminescence.
Optionally, the carrier transport layer at least comprises a hole functional layer and an electron functional layer, so as to achieve the purpose of electroluminescence through the hole functional layer, the light emitting layer and the electron functional layer.
Alternatively, the first substrate and/or the second substrate are ITO (indium tin oxide) glass, and the description is given by way of example only when the at least one first functional layer only includes one first functional layer, for example, when the at least one first functional layer only includes a hole functional layer, the at least one second functional layer should include at least a light emitting layer and an electron functional layer, so as to form a complete electroluminescent portion after the at least one first functional layer and the at least one second functional layer are attached. The step of forming at least one first functional layer on a first substrate comprises: the ink corresponding to the hole function layer is spread on the first substrate, and then the first substrate on which the ink corresponding to the hole function layer is spread is subjected to a drying process as shown in fig. 4 and/or a crystallization process as shown in fig. 5 to form the hole function layer on the first substrate. Since the plurality of functional layers of the electroluminescent part need to be stacked in a specific order, for example, the light-emitting layer needs to be located between the hole functional layer and the electron functional layer, when at least one second functional layer is formed on the second substrate, the electron functional layer is formed on the second substrate and the light-emitting layer is formed on the electron functional layer in the reverse order of the first substrate.
Optionally, the first substrate and/or the second substrate is ITO (indium tin oxide) glass, the first substrate and/or the second substrate itself may be conductive and may serve as an electrode, and if the first substrate and/or the second substrate is ordinary glass, the first substrate and/or the second substrate may not serve as an electrode, and therefore, it is necessary to form an electrode layer of a specific material on the first substrate and/or the second substrate, and then form at least one first functional layer and/or at least one second functional layer on the electrode layer, where the electrode layer may be formed by spreading silver nanowire ink, and then performing a drying process and/or a crystallization process.
Alternatively, the first substrate and/or the second substrate are ITO (indium tin oxide) glass, and the description is given by way of example that the at least one first functional layer only includes two first functional layers, for example, when the at least one first functional layer only includes a hole functional layer and a light emitting layer, the at least one second functional layer should at least include an electron functional layer, so as to form a complete electroluminescent portion after the at least one first functional layer and the at least one second functional layer are attached. The step of forming at least one first functional layer on a first substrate comprises: spreading ink corresponding to the hole function layer on the first substrate, then performing drying treatment and/or crystallization treatment on the first substrate after spreading the ink corresponding to the hole function layer to form the hole function layer on the first substrate, then spreading ink corresponding to the light-emitting layer on the hole function layer of the first substrate, and then performing drying treatment and/or crystallization treatment on the first substrate after spreading the ink corresponding to the light-emitting layer to form the light-emitting layer on the hole function layer.
Alternatively, the ink corresponding to each functional layer may be spread by a spin coating process as shown in fig. 3 or an inkjet printing process as shown in fig. 2, for example, the ink corresponding to the hole functional layer may be spread on the first substrate by a spin coating process or an inkjet printing process, and the ink may be more uniformly distributed on the first substrate by the spin coating process or the inkjet printing process, so that the formed functional layer is more uniformly and flatly formed.
Optionally, when the laminated first substrate and the second substrate are packaged, glue is generally used for packaging and fixing, for example, package glue is used for packaging. In order to avoid that the applied packaging adhesive will cause the relative displacement between the first substrate and the second substrate when the laminated first substrate and the second substrate are packaged, and affect the laminated electroluminescent part, before the first substrate and the second substrate are attached, the packaging adhesive is applied to the side edge of the first substrate on which at least one first functional layer is formed and/or the side edge of the second substrate on which at least one second functional layer is formed, and then the first substrate and the second substrate are attached after the packaging adhesive is applied, so that the influence of the applied packaging adhesive on the electroluminescent part can be avoided, when the laminated first substrate and the laminated second substrate are packaged, the curing treatment of the packaging adhesive is only required to be performed on the laminated first substrate and the laminated second substrate, for example, the previously applied packaging adhesive can be fixed through the heating treatment or the irradiation of an ultraviolet lamp as shown in fig. 7, the laminated first substrate and the laminated second substrate are packaged, so that the preparation and packaging of the photoelectric device are integrated, and the packaging cost is reduced.
Optionally, before the steps of forming at least one first functional layer on the first substrate and forming at least one second functional layer on the second substrate, the first substrate and/or the second substrate may also be cleaned, so as to remove dust particles on the surface of the first substrate and/or the second substrate and avoid the functional layer formed when the dust particles exist on the first substrate and/or the second substrate from being not smooth enough, since the functional layer is usually a film, dust particles tend to penetrate the functional layer when they are relatively large in relation to the functional layer, the functional layer is damaged, so that the flatness and the integrity of the functional layer can be ensured by cleaning the first substrate and/or the second substrate, the first substrate and/or the second substrate can be cleaned by wiping, ultrasonic oscillation and a plasma process, and the specific cleaning mode can be determined according to the size of dust particles on the first substrate and/or the second substrate and the cleanliness requirement.
In addition, an embodiment of the present invention further provides a photovoltaic device, where the photovoltaic device is formed by using the manufacturing method of the photovoltaic device according to each of the above embodiments, the photovoltaic device includes a first substrate and a second substrate which are attached after being packaged, and an electroluminescence portion is disposed between the first substrate and the second substrate.
Optionally, the first substrate and the second substrate are bonded by a packaging adhesive, and the packaging adhesive is disposed between the side edge of the first substrate and the side edge of the second substrate.
In this embodiment, a method for manufacturing an optoelectronic device provided in an embodiment of the present invention is illustrated in detail.
The preparation method of the photoelectric device comprises the following steps:
the method comprises the following steps: two substrates are provided and cleaned.
Step two: different inks are spread on the two substrates, respectively, using spin coating or printing processes.
Step three: and drying and/or crystallizing the ink spread on the two substrates to form a compact functional layer film.
Step four: the two substrates are bonded together using an isostatic pressing process.
Step five: and taking out the substrates which are attached together, and curing the packaging adhesive by using an ultraviolet lamp to finally obtain the packaged photoelectric device.
In the technical scheme disclosed in this embodiment, the surfaces of two substrates are cleaned, dust particles are removed and the surface wettability is increased, different inks are uniformly spread on different substrates through spin coating or printing processes, a wet film is dried and crystallized to form a compact functional layer dry film, then a first substrate and a second substrate are coated with a packaging adhesive at the edges, then the first substrate and the second substrate are wrapped and attached together and placed in an isostatic pressing device, the two substrates are pressed together by using an isostatic pressing process, and finally, a packaged light-emitting device is obtained through ultraviolet curing.
In order to more clearly illustrate the manufacturing method of the optoelectronic device of the present embodiment and the technical effects thereof, referring to fig. 2 to 7, the following are exemplified:
the method comprises the following steps: selecting the first substrate 10 as ITO glass and the second substrate 11 as common glass, cleaning the two substrates to remove dust particles on the surfaces of the two substrates, wherein the cleaning steps are as follows: the first substrate 10 and the second substrate 11 are respectively wiped for a plurality of times by cotton dipped with acetone and a cleaning agent, then the first substrate 10 and the second substrate 11 are sequentially placed in a solution of acetone, alcohol and deionized water for ultrasonic oscillation for 4-10 minutes, and then the two substrates are cleaned by a plasma process, so that the wettability of the surfaces of the two substrates is improved.
Step two: as shown in fig. 2, a hole function layer ink and a luminescent layer ink are sequentially printed on a first substrate 10 by an inkjet printing method, and the obtained wet film 20 is subjected to drying treatment and/or crystallization treatment in three steps in the process of printing one ink at a time; as shown in fig. 3, the silver nanowire ink and the electronic function layer ink are sequentially spin-coated on the second substrate 11 by using a spin coating method, and the obtained wet film 21 is subjected to a drying process and/or a crystallization process in three steps each time one ink is spin-coated.
Step three: the wet film 20 of hole function layer ink printed on the first substrate 10 is processed, including:
as shown in fig. 4, the first substrate 10 on which the wet film 20 of the hole function layer ink is printed is placed in a vacuum apparatus 31 for 2 to 3 minutes to dry the ink.
As shown in fig. 5, the first substrate 10 carrying the dried thin film is then placed on a heating stage 30, heated to 100 ℃ for 5 minutes, and subjected to a crystallization process, thereby obtaining a dried and crystallized thin film 20a (i.e., a hole function layer) on the first substrate 10. Similarly, the light-emitting layer ink is printed on the thin film 20a of the first substrate 10, and the drying process and/or the crystallization process in step three are repeated.
The wet film 21 of silver nanowire ink spin-coated on the second substrate 11 is processed, including:
the second substrate 11 on which the wet film 21 of the silver nanowire ink was spin-coated was placed in the vacuum apparatus 31 for 4 to 6 minutes, so that the ink was dried.
The second substrate 11 having the dried thin film thereon is placed on the heating stage 30, heated to 80 ℃ for 10 minutes, and further subjected to crystallization treatment, thereby obtaining a dried thin film 21a on the second substrate 11. Similarly, the drying process and/or the crystallization process in step three are repeated again with the electronically functional layer ink spin-coated on the thin film 21a of the second substrate 11.
Step four: and (3) coating packaging glue on the edges of the two substrates, then, as shown in fig. 6, putting the substrates together into a vacuum plastic bag, vacuumizing and wrapping the substrates, putting the substrates into an isostatic pressing device 40, setting the pressure to be 100MPa, and keeping the pressure for 30 minutes.
Step five: the two substrates bonded together are taken out of the isostatic pressing device 40, and then, as shown in fig. 7, are placed under an ultraviolet lamp 50 for 5 minutes to cure the packaging adhesive, and finally, the photoelectric device is obtained.
In this embodiment, because the current optoelectronic device that wants to realize full inkjet printing or full spin coating can only form a functional layer film layer by layer, but the preparation is more difficult as the number of functional layers to be printed or spun increases, this embodiment provides two substrates, cleans them, respectively spin-coats or prints different multilayer functional layer films on the two substrates, then coats an encapsulation adhesive on the edge of the substrate, then attaches the two substrates together and wraps them, puts them into an isostatic pressing device for standing for a period of time, tightly attaches the two substrates together by using the uniform pressure of the liquid in the isostatic pressing device, takes out the encapsulation adhesive to perform curing treatment, finally forms a packaged light emitting device, respectively prints or spin-coats the different functional layer films on the two substrates, then attaches the two substrates together by using the isostatic pressing device to form a device, the preparation difficulty of the photoelectric device is reduced, the device is directly packaged, the integration of the preparation and the packaging of the device is realized, the process flow is simplified, and the preparation cost is reduced.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or system that comprises the element.
In addition, the descriptions referred to as "first", "second", etc. in this application are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit ly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent items or equivalent procedures used in the present specification and drawings, or directly or indirectly applied to other related technical fields, are also included in the scope of the present invention.
Claims (11)
1. A method for manufacturing a photoelectric device, the method comprising the steps of:
forming at least one first functional layer on a first substrate and at least one second functional layer on a second substrate;
attaching the first substrate and the second substrate to attach at least one first functional layer and at least one second functional layer to form an electroluminescent part;
pressing the attached first substrate and the second substrate by using an isostatic pressing device;
and packaging the pressed first substrate and the pressed second substrate.
2. The method of fabricating an optoelectronic device according to claim 1, wherein prior to the steps of forming at least one first functional layer on a first substrate and at least one second functional layer on a second substrate, further comprising:
performing plasma processing on the first substrate and/or the second substrate.
3. The method of manufacturing an optoelectronic device according to claim 1, wherein the electroluminescent part comprises at least two functional layers formed by stacking, and the at least two functional layers comprise a light-emitting layer and a carrier transport layer.
4. The method for manufacturing an optoelectronic device according to claim 3, wherein the carrier transport layer comprises at least a hole functional layer and an electron functional layer.
5. The method according to claim 4, wherein the first substrate is indium tin oxide glass, the at least one second functional layer includes a light emitting layer and an electron functional layer when the at least one first functional layer includes a hole functional layer, and the step of forming the at least one first functional layer on the first substrate includes:
spreading ink corresponding to the cavity functional layer on the first substrate;
and carrying out drying treatment and/or crystallization treatment on the first substrate after the ink corresponding to the hole function layer is spread, so as to form the hole function layer on the first substrate.
6. The method according to claim 4, wherein the first substrate is indium tin oxide glass, the at least one second functional layer includes an electron functional layer when the at least one first functional layer includes a hole functional layer and a light emitting layer, and the step of forming the at least one first functional layer on the first substrate includes:
spreading ink corresponding to the cavity functional layer on the first substrate;
carrying out drying treatment and/or crystallization treatment on the first substrate after the ink corresponding to the hole functional layer is spread, so as to form the hole functional layer on the first substrate;
spreading ink corresponding to the light-emitting layer on the hole function layer of the first substrate;
and performing drying treatment and/or crystallization treatment on the first substrate after the ink corresponding to the light-emitting layer is spread, so as to form the light-emitting layer on the hole function layer.
7. The method for manufacturing an optoelectronic device according to claim 5 or 6, wherein the step of spreading the ink corresponding to the hole-function layer on the first substrate comprises:
and spreading ink corresponding to the hole functional layer on the first substrate by using a spin coating process or an ink-jet printing process.
8. The method of manufacturing an optoelectronic device according to claim 1, wherein the step of bonding the first substrate and the second substrate to each other so that at least one first functional layer and at least one second functional layer are bonded to each other to form the electroluminescent section further comprises:
respectively smearing packaging glue on the side edge of the first substrate with at least one first functional layer and the side edge of the second substrate with at least one second functional layer;
the step of encapsulating the pressed first substrate and the pressed second substrate includes:
and curing the packaging adhesive on the first substrate and the second substrate after pressing.
9. The method of fabricating an optoelectronic device according to claim 1, wherein prior to the steps of forming at least one first functional layer on a first substrate and at least one second functional layer on a second substrate, further comprising:
and cleaning the first substrate and/or the second substrate.
10. An optoelectronic device formed by the method of manufacturing an optoelectronic device according to any one of claims 1 to 9, the optoelectronic device comprising a first substrate and a second substrate bonded after encapsulation, the first substrate and the second substrate having an electroluminescent portion disposed therebetween.
11. The optoelectronic device according to claim 10, wherein the first substrate and the second substrate are bonded by an encapsulation adhesive disposed between a lateral edge of the first substrate and a lateral edge of the second substrate.
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