CN112739152A - High-power low-thermal resistance heat pipe radiator - Google Patents
High-power low-thermal resistance heat pipe radiator Download PDFInfo
- Publication number
- CN112739152A CN112739152A CN202011421935.9A CN202011421935A CN112739152A CN 112739152 A CN112739152 A CN 112739152A CN 202011421935 A CN202011421935 A CN 202011421935A CN 112739152 A CN112739152 A CN 112739152A
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- China
- Prior art keywords
- heat pipe
- thermal resistance
- heat
- fins
- heat pipes
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- 239000000758 substrate Substances 0.000 claims abstract description 26
- 230000017525 heat dissipation Effects 0.000 abstract description 19
- 238000002844 melting Methods 0.000 abstract description 12
- 238000001816 cooling Methods 0.000 abstract description 9
- 230000008018 melting Effects 0.000 abstract description 7
- 238000009434 installation Methods 0.000 description 5
- 238000009423 ventilation Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000009528 severe injury Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000002887 superconductor Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
Abstract
The invention discloses a high-power low-thermal resistance heat pipe radiator, which comprises a substrate, heat pipes, fins and an air duct frame, wherein power devices to be radiated are symmetrically fixed on the upper surface and the lower surface of the substrate, a row of heat pipes are horizontally embedded at the top and the bottom of the substrate respectively, the two rows of heat pipes are directly attached to the corresponding power devices respectively, the heat pipes extend out from the side surface of the substrate and then are inserted into the air duct frame to penetrate through a plurality of fins arranged in parallel, all the fins are fixed by the air duct frame, and the air flow direction in the air duct frame is vertical to the heat pipes. When the power device heats, heat is directly and quickly conducted to the fins through the heat pipes and is quickly diffused into the air along with the wind flow. The substrate only plays a role in mechanical fixation, heat transfer links are few, substrate conduction thermal resistance and contact thermal resistance are eliminated, total thermal resistance of the radiator is greatly reduced, air-cooled heat dissipation efficiency is improved, and reliability of the ice melting device is improved. The heat exchange thermal resistance between the fins and cooling air can be reduced by adjusting the length of the heat pipes, the number of the fins and the sectional area, and the volume and the weight of the complete device are reduced.
Description
Technical Field
The invention belongs to the technical field of heat dissipation of power electronic devices, and particularly relates to a high-power low-thermal-resistance heat pipe radiator.
Background
The ice coating is easy to occur on the power transmission line in winter due to rain, snow and ice, and the ice coated power transmission line is easy to swing under the action of strong wind. The waving time of the waving section sometimes exceeds 72 hours, and long-time and high-intensity continuous waving is a main reason for causing large-scale severe damage to the line. The waving causes a line trip if light, and may cause serious consequences such as wire breakage, tower collapse and the like if heavy. In recent years, global climate is abnormal, freezing rain disasters easily cause the galloping of large-area lines, the galloping may cause large-scale tower collapse, line breakage and large power failure accidents, the safe and stable operation of a power grid is seriously influenced, meanwhile, a large number of galloping lines cross important channels such as railways and highways, the damage of the lines caused by the galloping easily causes the outage of high-speed rails, high-speed rails and the like, and the normal social order is seriously influenced.
If ice melting measures are taken for the galloping circuit in time, the circuit galloping can be actively eliminated, and therefore the damage of the power equipment is avoided. However, because the galloping generally occurs under the condition of high wind speed, the larger the wind speed is, the faster the heat dissipation of the wire is, and the larger the required ice-melting current is, according to the simulation experiment, when other conditions are the same, the ice-melting current of the wire with the same section at the wind speed of 10m/s is about 1.5 times or more than that at the low wind speed of 3m/s, so that the galloping ice-melting device has larger current and more serious heating compared with the conventional ice-melting device, and is constrained by the conditions of equipment size, occupied area, weight and the like, the requirements on the cooling and heat dissipation inside the device are more severe, and the existing heat radiator for the ice-melting device or other high-power electronic equipment is difficult to.
Disclosure of Invention
The invention aims to provide a high-power low-thermal resistance heat pipe radiator for efficiently cooling and radiating power devices in a high-capacity rectifying device such as a dancing and ice melting device and the like by air aiming at the defects in the prior art.
The invention provides a high-power low-thermal resistance heat pipe radiator which comprises a substrate, heat pipes, fins and an air duct frame, wherein power devices needing heat dissipation are symmetrically fixed on the upper surface and the lower surface of the substrate, a row of heat pipes are horizontally embedded in the top and the bottom of the substrate respectively, the upper sides of the upper row of heat pipes and the lower sides of the lower row of heat pipes are respectively attached to the corresponding power devices, the two rows of heat pipes extend out of the side surface of the substrate and then are inserted into the air duct frame to penetrate through a plurality of fins arranged in parallel, all the fins are fixed through the air duct frame, and the air flow direction in the.
Preferably, the adjacent heat pipes of each row of heat pipes are uniformly arranged at intervals, the heat pipes on two sides of each row are respectively close to the transverse outer side of the power device, and the end of each heat pipe at least extends to the longitudinal outer side of the power device.
Preferably, the contact surface of the heat pipe and the power device is a plane, the heat pipe is pressed or milled into a plane on one axial side by a circular pipe, or the heat pipe is a square pipe with a plane side.
Preferably, two rows of heat pipe embedding grooves are symmetrically formed in the top surface and the bottom surface of the substrate corresponding to the power device mounting area, and the groove depth is the size of the cross section of the heat pipe.
Preferably, the fin is symmetrically provided with an upper heat pipe mounting hole and a lower heat pipe mounting hole, and the heat pipe mounting holes are provided with spacing limiting rings.
Preferably, the side plate of the air duct frame close to the base plate is provided with an upper row of heat pipe mounting holes and a lower row of heat pipe mounting holes.
Preferably, the upper and lower edges of the fins are in contact with the inner wall of the air duct frame.
Preferably, the four corners of the top surface and the bottom surface of the substrate are respectively provided with a threaded blind hole, an insulating screw rod is arranged in the threaded blind hole, the outer ends of the top insulating screw rod and the bottom insulating screw rod are respectively connected with other radiators, and the power devices are respectively pressed on the upper surface and the lower surface of the substrate.
The heat pipe directly contacted with the power device needing heat dissipation is embedded in the substrate, when the power device generates heat, the heat is directly conducted to the heat pipe and then to the fins, and finally the heat is diffused to the air along with the wind flow. Because the power device is in direct contact and conduction with a heat pipe called a plain heat superconductor, the substrate with poor heat conductivity does not participate in heat transfer and only plays a role of mechanical fixation, the heat transfer links are few, the substrate conduction thermal resistance and contact thermal resistance are eliminated, and the overall thermal resistance is small, so that high-efficiency heat dissipation is realized, the device temperature saving and the heat dissipation air quantity and the fan loss during the operation of the ice melting and dancing elimination device are greatly reduced, and the reliability of the ice melting device is further improved. In addition, because the power device needing heat dissipation and the ventilation and heat dissipation fins are arranged in a staggered mode, the ventilation and heat dissipation area of the fins is not limited by the sectional area of the base plate, and the heat exchange thermal resistance between the fins and cooling air can be greatly reduced by adjusting the length of the heat pipes and the number and the sectional area of the fins, so that the installation size of the power device is more compact on the premise of ensuring sufficient heat dissipation, and the volume and weight of the dancing and ice melting device can be reduced.
Drawings
FIG. 1 is a side view of one embodiment of the present invention.
Fig. 2 is a schematic top view of fig. 1.
Detailed Description
As can be seen from fig. 1 and fig. 2, the high-power low-thermal resistance heat pipe radiator disclosed in this embodiment includes a substrate 1, a heat pipe 2, fins 3, an air duct frame 4, and an insulating screw 5.
The base plate 1 is a rectangular plate with a certain thickness, the thickness at least reaches 20mm so as to be convenient for embedding two rows of heat pipes and have enough mechanical strength, two rows of heat pipe installation grooves are symmetrically formed in the installation areas of the top surface and the bottom surface of the base plate corresponding to the power device, the depth of each groove is the cross section size of the heat pipe 2, and the heat pipe 2 is flush with the upper surface and the lower surface of the base plate 1 respectively after being embedded.
After the heat pipes 2 are embedded in the mounting grooves on the substrate 1, the upper sides of the upper heat pipes are contact planes, and the lower sides of the lower heat pipes are contact planes.
The heat pipe 2 adopts a round pipe to press one axial side of the heat pipe into a plane or mill the axial side of the heat pipe into a plane, or the heat pipe adopts a square pipe with a plane side, and the shape of the cross section of the heat pipe installation groove on the substrate 1 is matched with the shape of the cross section of the heat pipe 2.
After one end section of the heat pipe 2 is embedded on the substrate 1, the contact plane of the heat pipe is directly attached to the power device 6, the heat pipes on the two sides are close to the transverse outer side of the power device 6, and the end heads of the heat pipes at least correspond to the longitudinal outer side of the power device 6. The heat source power is distributed to each heat pipe in a balanced manner as much as possible while the overall contact area between the power device 6 and the heat pipe 2 is increased. The power device 6 shown in the figure of the present embodiment is a cylindrical flat plate diode commonly used in high-voltage high-power applications.
The specific number of heat pipes and the spacing between heat pipes is believed to be determined by the amount of heat generated by the various power devices.
The length sections of the two rows of heat pipes, which are positioned at the outer side of the base plate 1, penetrate through one side plate of the air duct frame 4 and then penetrate through all the fins 3 which are arranged in parallel, and the distance between the adjacent fins is uniform.
The cooling air flow in the air duct frame 4 vertically passes through the heat pipe, namely, the cooling air flow passes through the gap between adjacent fins to quickly take away heat generated by the fins, so that the air inlet and the air outlet of the air duct frame are vertical to two opposite sides of the heat pipe.
In order to avoid that cooling air flow forms an air duct short-circuit channel from the gap between the fins 3 and the air duct frame 4 and does not pass through the gaps between the fins, so that the heat dissipation effect is reduced, the inner walls of the upper side plate and the lower side plate of the air duct frame 4 are in contact with the upper edges and the lower edges of the fins 3.
Threaded blind holes are respectively formed in four corners of the top surface and the bottom surface of the substrate 1, insulating screws 5 are respectively arranged in the threaded blind holes and are connected with adjacent radiators on the upper side and the lower side through the insulating screws, and therefore the power device is tightly pressed on the upper surface and the lower surface of the radiator substrate.
It can be seen from the above structure of the radiator that it has the following advantages compared with the prior art:
the heat pipe directly contacting with the power device needing heat dissipation is embedded in the substrate, the heat generated by the power device is quickly conducted to the fin group in the air duct frame through the heat pipe by utilizing the excellent heat superconductivity of the heat pipe, and the fin group quickly dissipates heat through cold air. The base plate does not basically participate in heat transfer, and the heat conduction resistance of the base plate and the contact resistance of the base plate and a hot pipe fitting are eliminated, so that the total heat resistance of the radiator can be obviously reduced, and the air-cooling heat dissipation efficiency can be improved;
the heat pipe penetrates through the fin group after extending out of the base plate, the power device needing heat dissipation and the fins for ventilation and heat dissipation are arranged in a staggered mode, so that the ventilation and heat dissipation area of the fin group is not limited by the sectional area of the base plate, and the heat exchange thermal resistance between the fins and cooling air can be greatly reduced by adjusting the length of the heat pipe and the number and the sectional area of the fins of the fin group, so that the installation size of a single power device ladder is more compact on the premise of ensuring sufficient heat dissipation, and the volume and weight of the whole set of ice melting and damping device can.
Claims (8)
1. A high-power low-thermal resistance heat pipe radiator comprises a substrate, and is characterized in that: the power devices to be radiated are symmetrically fixed on the upper surface and the lower surface of the base plate, a row of heat pipes are horizontally embedded in the top and the bottom of the base plate respectively, the upper sides of the upper heat pipes and the lower sides of the lower heat pipes are tightly attached to the corresponding power devices respectively, the two rows of heat pipes extend out of the side surface of the base plate and then are inserted into the air channel frame to penetrate through the plurality of fins arranged in parallel, all the fins are fixed through the air channel frame, and the air flow direction in the air channel frame is perpendicular to the heat pipes.
2. The high-power low-thermal resistance heat pipe radiator of claim 1, wherein: the adjacent heat pipes of each row of heat pipes are uniformly distributed at intervals, the heat pipes on the two sides of each row are respectively close to the transverse outer side of the power device, and the end of each heat pipe at least extends to the longitudinal outer side of the power device.
3. The high-power low-thermal resistance heat pipe radiator of claim 1, wherein: the contact surface of the heat pipe and the power device is a plane.
4. The high-power low-thermal resistance heat pipe radiator of claim 3, wherein: the top surface and the bottom surface of the base plate are symmetrically provided with two rows of heat pipe embedding grooves corresponding to the power device mounting area, and the groove depth is the cross section size of the heat pipe.
5. The high-power low-thermal resistance heat pipe radiator of claim 1, wherein: the fins are symmetrically provided with an upper row of heat pipe mounting holes and a lower row of heat pipe mounting holes, and the distances between adjacent fins are equal.
6. The high-power low-thermal resistance heat pipe radiator of claim 1, wherein: the air duct frame is provided with an upper row of heat pipe mounting holes and a lower row of heat pipe mounting holes on a side plate close to the base plate.
7. The high-power low-thermal resistance heat pipe radiator of claim 6, wherein: the upper edge and the lower edge of the fin are in contact with the inner wall of the air duct frame.
8. The high-power low-thermal resistance heat pipe radiator of claim 1, wherein: threaded blind holes are respectively formed in four corners of the top surface and the bottom surface of the substrate, insulating screws are arranged in the threaded blind holes, the outer ends of the top insulating screw and the bottom insulating screw are respectively connected with other radiators, and power devices are respectively pressed on the upper surface and the lower surface of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011421935.9A CN112739152A (en) | 2020-12-08 | 2020-12-08 | High-power low-thermal resistance heat pipe radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011421935.9A CN112739152A (en) | 2020-12-08 | 2020-12-08 | High-power low-thermal resistance heat pipe radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112739152A true CN112739152A (en) | 2021-04-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011421935.9A Pending CN112739152A (en) | 2020-12-08 | 2020-12-08 | High-power low-thermal resistance heat pipe radiator |
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| Country | Link |
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| CN (1) | CN112739152A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101160034A (en) * | 2007-08-31 | 2008-04-09 | 王亚雄 | Hot pipe cooling radiator of high-power drive electronic device |
| CN101714811A (en) * | 2009-09-04 | 2010-05-26 | 株洲时代散热技术有限公司 | Method for dissipating heat of thermotube of convertor and radiator thereof |
| US20130000870A1 (en) * | 2011-06-28 | 2013-01-03 | Chun-Ming Wu | Thermal module and method of manufacturing same |
| CN103167780A (en) * | 2011-12-16 | 2013-06-19 | 台达电子企业管理（上海）有限公司 | Combined type radiator for power module and combined type radiator assembly |
| CN203656862U (en) * | 2013-10-23 | 2014-06-18 | 浙江工业大学之江学院工业研究院 | Heat pipe radiator for assembled integrated high-power LED street lamp |
| US20160282914A1 (en) * | 2013-11-14 | 2016-09-29 | Fujikura Ltd. | Cooling structure for portable electronic device |
| CN107466194A (en) * | 2017-08-31 | 2017-12-12 | 国网湖南省电力公司 | Air-cooled heat-pipe radiator for Large Copacity SVG |
| CN107734934A (en) * | 2017-11-08 | 2018-02-23 | 鞍山市久益电子有限公司 | It is a kind of directly to contact communicate-type heat-pipe radiator and application method |
| CN110572983A (en) * | 2019-08-09 | 2019-12-13 | 郭培囵 | Direct-contact low-thermal-resistance heat pipe radiator for heating device |
-
2020
- 2020-12-08 CN CN202011421935.9A patent/CN112739152A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101160034A (en) * | 2007-08-31 | 2008-04-09 | 王亚雄 | Hot pipe cooling radiator of high-power drive electronic device |
| CN101714811A (en) * | 2009-09-04 | 2010-05-26 | 株洲时代散热技术有限公司 | Method for dissipating heat of thermotube of convertor and radiator thereof |
| US20130000870A1 (en) * | 2011-06-28 | 2013-01-03 | Chun-Ming Wu | Thermal module and method of manufacturing same |
| CN103167780A (en) * | 2011-12-16 | 2013-06-19 | 台达电子企业管理（上海）有限公司 | Combined type radiator for power module and combined type radiator assembly |
| CN203656862U (en) * | 2013-10-23 | 2014-06-18 | 浙江工业大学之江学院工业研究院 | Heat pipe radiator for assembled integrated high-power LED street lamp |
| US20160282914A1 (en) * | 2013-11-14 | 2016-09-29 | Fujikura Ltd. | Cooling structure for portable electronic device |
| CN107466194A (en) * | 2017-08-31 | 2017-12-12 | 国网湖南省电力公司 | Air-cooled heat-pipe radiator for Large Copacity SVG |
| CN107734934A (en) * | 2017-11-08 | 2018-02-23 | 鞍山市久益电子有限公司 | It is a kind of directly to contact communicate-type heat-pipe radiator and application method |
| CN110572983A (en) * | 2019-08-09 | 2019-12-13 | 郭培囵 | Direct-contact low-thermal-resistance heat pipe radiator for heating device |
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Application publication date: 20210430 |
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