CN112739148A - A heat sink with uniform temperature plate - Google Patents
A heat sink with uniform temperature plate Download PDFInfo
- Publication number
- CN112739148A CN112739148A CN202011400509.7A CN202011400509A CN112739148A CN 112739148 A CN112739148 A CN 112739148A CN 202011400509 A CN202011400509 A CN 202011400509A CN 112739148 A CN112739148 A CN 112739148A
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- China
- Prior art keywords
- radiator
- temperature
- heat
- heat dissipation
- plate
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- 239000007788 liquid Substances 0.000 claims abstract description 36
- 230000017525 heat dissipation Effects 0.000 claims abstract description 30
- 241000446313 Lamella Species 0.000 claims abstract 3
- 238000005213 imbibition Methods 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims 1
- 239000012141 concentrate Substances 0.000 abstract 1
- 238000010521 absorption reaction Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 229910000838 Al alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 229910000553 6063 aluminium alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004949 mass spectrometry Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a temperature-uniforming plate radiator which comprises a radiator main body, a liquid absorbing core, radiating fins and a cold liquid working medium, wherein the radiator main body comprises a uniform shell and a temperature-uniforming plate cover plate, the temperature-uniforming plate cover plate is fixedly connected to the side surface of the uniform shell, the radiating fins are fixedly connected to the outer part of the radiator main body, and the cold liquid working medium and the liquid absorbing core are arranged in the radiator main body. This samming board radiator, through adopting the radiator that the samming board was made as the basis, the better lower problem of traditional radiator coefficient of heat conductivity of having solved, replace with the samming board structure through the base plate with ordinary section bar radiator to improve section bar radiator's base plate heat conductivility, the quick conduction of the single-point heat source that makes the diode concentrate relatively distributes to the base plate side, again by the heat dissipation dentate lamella mode of dispelling the heat with the heat naturally, the coefficient of heat conductivity of this radiator when using has been improved greatly, overall structure is simple, comparatively practical during the use.
Description
Technical Field
The invention relates to the technical field of radiators, in particular to a uniform temperature plate radiator.
Background
Along with the requirements of integration, light weight and miniaturization of airborne electronic design, the heat flux density of electronic equipment is increasingly large, and the thermal design problem of the electronic equipment becomes a key problem of the design of airborne electronic products. The high-power diode is widely applied to airborne electronic equipment, and the thermal design of the high-power diode is also a main problem of thermal design tasks of a plurality of airborne electronic equipment.
The conventional section radiator in the current market cannot meet the heat dissipation requirement of a high-power diode, and in an onboard electronic equipment set, the conventional section radiator is made of an aluminum alloy material, the heat conductivity coefficient of the aluminum alloy is about (120-205) W/m DEG C, the heat conductivity coefficient is low, the effective heat dissipation area of the radiator cannot be effectively increased in the using process, the heat resistance of the radiator cannot be well reduced, and certain limitation exists in application.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a uniform temperature plate radiator, which solves the problem that the conventional section radiator on the market cannot meet the heat dissipation requirement of a high-power diode, and the conventional section radiator is made of an aluminum alloy material on an onboard electronic equipment set, wherein the heat conductivity coefficient of the aluminum alloy is about (120-205) W/m DEG C, the heat conductivity coefficient is lower, the effective heat dissipation area of the radiator cannot be effectively increased in the using process, the heat resistance of the radiator cannot be well reduced, and certain limitation exists in the application process.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides a temperature-uniforming plate radiator, includes radiator main part, imbibition core, heat dissipation teeth piece and cold liquid working medium, the radiator main part is including equal casing and temperature-uniforming plate apron, temperature-uniforming plate apron fixed connection is in the side of equal casing, the outside fixed connection heat dissipation teeth piece of radiator main part, the inside of radiator main part is equipped with cold liquid working medium and imbibition core, be equipped with the vacuum cavity between equal casing and the temperature-uniforming plate apron.
Preferably, the liquid absorption cores are fixedly connected to the inner parts of the uniform shells, and the surfaces of the liquid absorption cores are covered with cold liquid working media.
Preferably, the heat dissipation fins are evenly distributed, the heat dissipation fins are installed on the outer surface of the uniform shell, and the uniform shell and the heat dissipation fins are integrated.
Preferably, the diodes are fixedly connected to the outer portion of the temperature equalization plate cover plate and are symmetrically distributed.
Preferably, the outer edge of the shell is connected with the press riveting nuts in an embedded mode, and the press riveting nuts are evenly distributed.
(III) advantageous effects
The invention provides a temperature-uniforming plate radiator. The method has the following beneficial effects:
the temperature-equalizing plate radiator for the high-power diode well solves the problem of low heat conductivity coefficient of the traditional radiator by adopting the radiator made on the basis of the temperature-equalizing plate, the heat conduction performance of the base plate of the profile radiator is improved by replacing the base plate of the common profile radiator with the temperature-equalizing plate structure, so that a single-point heat source relatively concentrated by the diode is quickly conducted and distributed to the side surface of the base plate, heat is dissipated by a natural heat dissipation mode of a heat dissipation toothed sheet, meanwhile, because acetone C3H6O is adopted as a cold liquid working medium of the temperature-equalizing plate, the high-efficiency heat conduction performance is realized by utilizing phase change latent heat generated by gas-liquid phase change, liquid-vapor phase change can be generated in the working temperature range of the temperature-equalizing plate radiator, the saturated steam pressure is closed, the thermal stability is good in the operation process, the shell and the liquid absorption core can be wetted, and the shell, the heat radiator has the advantages of no influence on the service life of the uniform temperature plate heat radiator, large surface tension, low viscosity and good wettability, greatly improves the heat conductivity coefficient of the heat radiator in use, well reduces the thermal resistance of the heat radiator, and has simple integral structure, stronger functionality and comparatively practical use.
Drawings
FIG. 1 is a schematic structural view of the present invention as a whole;
FIG. 2 is a schematic view of the uniform shell structure of the present invention;
FIG. 3 is a schematic diagram of a cover plate structure of the temperature equalization plate according to the present invention;
FIG. 4 is a schematic view of a heat dissipation blade according to the present invention;
figure 5 is a schematic view of a wick structure according to the present invention.
In the figure, a radiator main body-1, a diode-2, a rivet pressing nut-3, a temperature equalizing plate cover plate-4, a liquid absorbing core-5, a radiating tooth sheet-6, a uniform shell-7 and a cold liquid working medium-8.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, an embodiment of the present invention provides a technical solution: the utility model provides a temperature-uniforming plate radiator, includes radiator main part 1, imbibition core 5, heat dissipation teeth 6 and cold liquid working medium 8, radiator main part 1 is including equal casing 7 and temperature-uniforming plate apron 4, temperature-uniforming plate apron 4 fixed connection is in the side of equal casing 7, radiator main part 1's outside fixed connection heat dissipation teeth 6, radiator main part 1's inside is equipped with cold liquid working medium 8 and imbibition core 5, be equipped with the vacuum cavity between equal casing 7 and the temperature-uniforming plate apron 4, through the radiator that adopts the temperature-uniforming plate to make, its coefficient of heat conductivity can improve 1000 ~ 2000W/m.
The liquid absorbing core 5 is fixedly connected inside the uniform shell 7, the surface of the liquid absorbing core 5 is covered with a cold liquid working medium 8, the liquid absorbing core 5 is formed by mixing and vacuum sintering pure aluminum powder and AlSiMg alloy powder, capillary force can be generated during application, the cold liquid working medium 8 is converged between the upper surface and the lower surface, and the functionality is strong.
The heat dissipation fins 6 are in an evenly distributed form, the heat dissipation fins 6 are installed on the outer surface of the equal shell 7, the equal shell 7 and the heat dissipation fins 6 are arranged into an integrated part, and through the heat dissipation fins 6, the heat convection resistance and the heat radiation resistance of the radiator can be reduced, so that the heat can be dissipated from the uniform temperature plate radiator.
The diodes 2 are fixedly connected to the outer portion of the temperature equalizing plate cover plate 4, the diodes 2 are symmetrically distributed, the diodes 2 are combined with the temperature equalizing plate cover plate 4, the heat conduction performance of the radiator is excellent, a single-point heat source generated by the diodes 2 can be rapidly conducted to the radiator substrate, and the heat conduction coefficient is high.
The outer edge of the equal shell 7 is connected with the press riveting nuts 3 in an embedded mode, the press riveting nuts 3 are in an evenly distributed mode, the press riveting nuts 3 which are arranged are used as connecting pieces, installation of the uniform temperature plate radiator by workers is facilitated, and the operation is convenient.
The working principle is as follows: when the temperature-uniforming plate radiator for the high-power diode is applied, a plurality of riveting nuts 3 are arranged outside a radiator main body 1 and can be used for fixing the temperature-uniforming plate radiator and a product, the temperature-uniforming plate radiator is attached to the position of the product needing heat dissipation, then the riveting nuts 3 are screwed down to finish the fixing work between the temperature-uniforming plate radiator and the product, then when the temperature-uniforming plate radiator works, the surface of the temperature-uniforming plate radiator, which is in contact with a heat source of the product, is an evaporation surface, the surface of the temperature-uniforming plate radiator, which is in contact with a heat dissipation tooth, namely a cold end, is a condensation surface, a liquid absorption core 5 structure is arranged between the evaporation surface and the condensation surface, heat generated by a diode 2 enters the plate from the evaporation surface through heat conduction, then liquid working medium in a position 5 close to the heat source absorbs heat and quickly vaporizes and, steam is cooled to be condensed on the inner wall of a condensation end and release heat, condensed cold liquid working medium 8 flows back to an evaporation surface heated area by means of self gravity and capillary force of a liquid absorption core 5 structure, so that a heat transfer work cycle is completed, the heat dissipation process of a product can be realized, then a heat dissipation toothed sheet 6 is arranged on the outer side of a shell, the material of the heat dissipation toothed sheet is 6063 aluminum alloy material and is machined and formed, meanwhile, shot blasting treatment is carried out on the outer side of the shell and the surface of the heat dissipation toothed sheet 6, the surface emissivity is better improved, the outer part of a temperature equalizing plate cover plate 4 is used as a sealing cover of the shell, the shell is welded and sealed in a vacuum mode, meanwhile, the liquid absorption core 5 is formed by mixing aluminum powder and AlSiMg alloy powder in a vacuum sintering mode, vacuumizing is carried out before welding, welding is carried out after welding, helium mass spectrometry inspection welding is carried out, and air tightness, the corrosion resistance of the radiator is improved, and the radiator is the same as the surface protection of aluminum alloy, so a better protective layer can be obtained in a black anodic oxidation mode, the coefficient of heat conductivity of the radiator is higher when the radiator is used, the thermal resistance of the radiator is better reduced, the whole structure is simple, and the practicability is stronger when the radiator is used.
The invention relates to a radiator main body 1, a diode 2, a rivet pressing nut 3, a temperature equalizing plate cover plate 4, a liquid absorbing core 5, a radiating tooth sheet 6, a uniform shell 7 and a cold liquid working medium 8, wherein the components are all universal standard components or components known by technicians in the field, the structure and the principle of the radiator can be known by technical manuals or conventional experimental methods, the invention solves the problems that the conventional section radiator favorable for the conventional market can not meet the radiating requirement of a high-power diode 2, an onboard electronic equipment set adopts an aluminum alloy material, the heat conductivity coefficient of the aluminum alloy is about 120-205W/m DEG C, the heat conductivity coefficient is lower, the effective radiating area of the radiator can not be effectively increased in the using process, the heat resistance of the radiator can not be well reduced, certain limitations exist in the application and the like, the invention combines the components, adopts the radiator made on the basis of the temperature-equalizing plate, adopts acetone C3H6O as a cold liquid working medium 8 of the temperature-equalizing plate, and then utilizes phase change latent heat generated by gas-liquid phase change to realize high-efficiency heat transfer performance, can generate liquid-vapor phase change in the working temperature range of the temperature-equalizing plate radiator, has closed saturated vapor pressure, has good thermal stability in the operation process, can wet the shell and the liquid absorption core 5, has good compatibility with the materials of the shell and the liquid absorption core 5, does not influence the service life of the temperature-equalizing plate radiator, has large surface tension, low viscosity and good wettability, greatly improves the heat conductivity coefficient of the radiator in use, well reduces the thermal resistance of the radiator, and has simple integral structure, stronger functionality and more practicability in use.
While there have been shown and described what are at present considered the fundamental principles and essential features of the invention and its advantages, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (5)
1. A vapor chamber heat sink, comprising: including radiator main part (1), imbibition core (5), heat dissipation dentate lamella (6) and cold liquid working medium (8), radiator main part (1) is including equal casing (7) and temperature-uniforming plate cover board (4), temperature-uniforming plate cover board (4) fixed connection is in the side of equal casing (7), outside fixed connection heat dissipation dentate lamella (6) of radiator main part (1), the inside of radiator main part (1) is equipped with cold liquid working medium (8) and imbibition core (5), be equipped with the vacuum cavity between equal casing (7) and the temperature-uniforming plate cover board (4).
2. A vapor plate heat sink according to claim 1, wherein: the liquid cooling device is characterized in that the liquid absorbing cores (5) are fixedly connected inside the uniform shell (7), and the surfaces of the liquid absorbing cores (5) are covered with cold liquid working media (8).
3. A vapor plate heat sink according to claim 1, wherein: the heat dissipation tooth piece (6) is in an evenly distributed form, the heat dissipation tooth piece (6) is installed on the outer surface of the uniform shell (7), and the uniform shell (7) and the heat dissipation tooth piece (6) are arranged into an integrated part.
4. A vapor plate heat sink according to claim 1, wherein: the outside fixed connection diode (2) of temperature-uniforming plate apron (4), diode (2) are the form of symmetric distribution.
5. A vapor plate heat sink according to claim 1, wherein: the outer edge of the shell (7) is connected with the press riveting nuts (3) in an embedded mode, and the press riveting nuts (3) are evenly distributed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011400509.7A CN112739148A (en) | 2020-12-03 | 2020-12-03 | A heat sink with uniform temperature plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011400509.7A CN112739148A (en) | 2020-12-03 | 2020-12-03 | A heat sink with uniform temperature plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112739148A true CN112739148A (en) | 2021-04-30 |
Family
ID=75598788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011400509.7A Pending CN112739148A (en) | 2020-12-03 | 2020-12-03 | A heat sink with uniform temperature plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112739148A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113985989A (en) * | 2021-10-20 | 2022-01-28 | 紫光股份有限公司 | Heat dissipation equipment |
| WO2023279759A1 (en) * | 2021-07-09 | 2023-01-12 | 中兴通讯股份有限公司 | Heat dissipation device and communication device |
-
2020
- 2020-12-03 CN CN202011400509.7A patent/CN112739148A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023279759A1 (en) * | 2021-07-09 | 2023-01-12 | 中兴通讯股份有限公司 | Heat dissipation device and communication device |
| CN113985989A (en) * | 2021-10-20 | 2022-01-28 | 紫光股份有限公司 | Heat dissipation equipment |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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Application publication date: 20210430 |