CN213694667U - Temperature equalizing plate radiator for high-power diode - Google Patents
Temperature equalizing plate radiator for high-power diode Download PDFInfo
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- CN213694667U CN213694667U CN202022864524.9U CN202022864524U CN213694667U CN 213694667 U CN213694667 U CN 213694667U CN 202022864524 U CN202022864524 U CN 202022864524U CN 213694667 U CN213694667 U CN 213694667U
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Abstract
The utility model discloses a temperature-uniforming plate radiator for high-power diode, including radiator main part, imbibition core, heat dissipation dentate lamella and cold liquid working medium, the radiator main part is including equal casing and temperature-uniforming plate cover plate, temperature-uniforming plate cover plate fixed connection is in the side of equal casing, the outside fixed connection heat dissipation dentate lamella of radiator main part, the inside of radiator main part is equipped with cold liquid working medium and imbibition core. This a samming board radiator for high-power diode, through adopting the radiator that the samming board was made as the basis, the better lower problem of traditional radiator coefficient of heat conductivity of having solved, replace with the samming board structure through the base plate with ordinary section bar radiator, with the base plate heat conductivility that improves section bar radiator, the quick conduction distribution of single-point heat source that makes the diode concentrate relatively is to the base plate side, by the heat dissipation tooth piece nature heat dissipation mode with the heat release again, the coefficient of heat conductivity of this radiator when using has been improved greatly, overall structure is simple, comparatively practical during the use.
Description
Technical Field
The utility model relates to a radiator technical field specifically is a temperature equalization board radiator for high-power diode.
Background
Along with the requirements of integration, light weight and miniaturization of airborne electronic design, the heat flux density of electronic equipment is increasingly large, and the thermal design problem of the electronic equipment becomes a key problem of the design of airborne electronic products. The high-power diode is widely applied to airborne electronic equipment, and the thermal design of the high-power diode is also a main problem of thermal design tasks of a plurality of airborne electronic equipment.
The conventional section radiator in the current market cannot meet the heat dissipation requirement of a high-power diode, and in an onboard electronic equipment set, the conventional section radiator is made of an aluminum alloy material, the heat conductivity coefficient of the aluminum alloy is about (120-205) W/m DEG C, the heat conductivity coefficient is low, the effective heat dissipation area of the radiator cannot be effectively increased in the using process, the heat resistance of the radiator cannot be well reduced, and certain limitation exists in application.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a not enough to prior art, the utility model provides a temperature equalization board radiator for high-power diode, the heat dissipation requirement that does benefit to conventional section bar radiator on having solved current market has can't satisfy high-power diode, at airborne electronic equipment group, conventional section bar radiator material adopts aluminum alloy material, the coefficient of heat conductivity of aluminum alloy is about (120 ~ 205) W/m.
(II) technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides a temperature-uniforming plate radiator for high-power diode, includes radiator main part, imbibition core, heat dissipation teeth piece and cold liquid working medium, the radiator main part is including equal casing and temperature-uniforming plate apron, temperature-uniforming plate apron fixed connection is in the side of equal casing, the outside fixed connection heat dissipation teeth piece of radiator main part, the inside of radiator main part is equipped with cold liquid working medium and imbibition core, be equipped with the vacuum cavity between equal casing and the temperature-uniforming plate apron.
Preferably, the liquid absorption cores are fixedly connected to the inner parts of the uniform shells, and the surfaces of the liquid absorption cores are covered with cold liquid working media.
Preferably, the heat dissipation fins are evenly distributed, the heat dissipation fins are installed on the outer surface of the uniform shell, and the uniform shell and the heat dissipation fins are integrated.
Preferably, the diodes are fixedly connected to the outer portion of the temperature equalization plate cover plate and are symmetrically distributed.
Preferably, the outer edge of the shell is connected with the press riveting nuts in an embedded mode, and the press riveting nuts are evenly distributed.
(III) advantageous effects
The utility model provides a temperature-uniforming plate radiator for high-power diode. The method has the following beneficial effects:
the temperature-equalizing plate radiator for the high-power diode well solves the problem of low heat conductivity coefficient of the traditional radiator by adopting the radiator made on the basis of the temperature-equalizing plate, the heat conduction performance of the base plate of the profile radiator is improved by replacing the base plate of the common profile radiator with the temperature-equalizing plate structure, so that a single-point heat source relatively concentrated by the diode is quickly conducted and distributed to the side surface of the base plate, heat is dissipated by a natural heat dissipation mode of a heat dissipation toothed sheet, meanwhile, because acetone C3H6O is adopted as a cold liquid working medium of the temperature-equalizing plate, the high-efficiency heat conduction performance is realized by utilizing phase change latent heat generated by gas-liquid phase change, liquid-vapor phase change can be generated in the working temperature range of the temperature-equalizing plate radiator, the saturated steam pressure is closed, the thermal stability is good in the operation process, the shell and the liquid absorption core can be wetted, and the shell, the heat radiator has the advantages of no influence on the service life of the uniform temperature plate heat radiator, large surface tension, low viscosity and good wettability, greatly improves the heat conductivity coefficient of the heat radiator in use, well reduces the thermal resistance of the heat radiator, and has simple integral structure, stronger functionality and comparatively practical use.
Drawings
Fig. 1 is a schematic overall structure diagram of the present invention;
FIG. 2 is a schematic view of the uniform shell structure of the present invention;
FIG. 3 is a schematic view of the structure of the cover plate of the vapor chamber of the present invention;
fig. 4 is a schematic structural view of the heat dissipation tooth plate of the present invention;
fig. 5 is a schematic view of a wick structure according to the present invention.
In the figure, a radiator main body-1, a diode-2, a rivet pressing nut-3, a temperature equalizing plate cover plate-4, a liquid absorbing core-5, a radiating tooth sheet-6, a uniform shell-7 and a cold liquid working medium-8.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, an embodiment of the present invention provides a technical solution: the utility model provides a temperature-uniforming plate radiator for high-power diode, includes radiator main part 1, imbibition core 5, heat dissipation teeth 6 and cold liquid working medium 8, radiator main part 1 is including equal casing 7 and temperature-uniforming plate apron 4, temperature-uniforming plate apron 4 fixed connection is in the side of equal casing 7, radiator main part 1's outside fixed connection heat dissipation teeth 6, radiator main part 1's inside is equipped with cold liquid working medium 8 and imbibition core 5, be equipped with the vacuum cavity between equal casing 7 and the temperature-uniforming plate apron 4, through the radiator that adopts the temperature-uniforming plate to make, its coefficient of heat conductivity can improve 1000 ~ 2000W/m.
The liquid absorbing core 5 is fixedly connected inside the uniform shell 7, the surface of the liquid absorbing core 5 is covered with a cold liquid working medium 8, the liquid absorbing core 5 is formed by mixing and vacuum sintering pure aluminum powder and AlSiMg alloy powder, capillary force can be generated during application, the cold liquid working medium 8 is converged between the upper surface and the lower surface, and the functionality is strong.
The heat dissipation fins 6 are in an evenly distributed form, the heat dissipation fins 6 are installed on the outer surface of the equal shell 7, the equal shell 7 and the heat dissipation fins 6 are arranged into an integrated part, and through the heat dissipation fins 6, the heat convection resistance and the heat radiation resistance of the radiator can be reduced, so that the heat can be dissipated from the uniform temperature plate radiator.
The diodes 2 are fixedly connected to the outer portion of the temperature equalizing plate cover plate 4, the diodes 2 are symmetrically distributed, the diodes 2 are combined with the temperature equalizing plate cover plate 4, the heat conduction performance of the radiator is excellent, a single-point heat source generated by the diodes 2 can be rapidly conducted to the radiator substrate, and the heat conduction coefficient is high.
The outer edge of the equal shell 7 is connected with the press riveting nuts 3 in an embedded mode, the press riveting nuts 3 are in an evenly distributed mode, the press riveting nuts 3 which are arranged are used as connecting pieces, installation of the uniform temperature plate radiator by workers is facilitated, and the operation is convenient.
The working principle is as follows: when the temperature-uniforming plate radiator for the high-power diode is applied, a plurality of riveting nuts 3 are arranged outside a radiator main body 1 and can be used for fixing the temperature-uniforming plate radiator and a product, the temperature-uniforming plate radiator is attached to the position of the product needing heat dissipation, then the riveting nuts 3 are screwed down to finish the fixing work between the temperature-uniforming plate radiator and the product, then when the temperature-uniforming plate radiator works, the surface of the temperature-uniforming plate radiator, which is in contact with a heat source of the product, is an evaporation surface, the surface of the temperature-uniforming plate radiator, which is in contact with a heat dissipation tooth, namely a cold end, is a condensation surface, a liquid absorption core 5 structure is arranged between the evaporation surface and the condensation surface, heat generated by a diode 2 enters the plate from the evaporation surface through heat conduction, then liquid working medium in a position 5 close to the heat source absorbs heat and quickly vaporizes and, steam is cooled to be condensed on the inner wall of a condensation end and release heat, condensed cold liquid working medium 8 flows back to an evaporation surface heated area by means of self gravity and capillary force of a liquid absorption core 5 structure, so that a heat transfer work cycle is completed, the heat dissipation process of a product can be realized, then a heat dissipation toothed sheet 6 is arranged on the outer side of a shell, the material of the heat dissipation toothed sheet is 6063 aluminum alloy material and is machined and formed, meanwhile, shot blasting treatment is carried out on the outer side of the shell and the surface of the heat dissipation toothed sheet 6, the surface emissivity is better improved, the outer part of a temperature equalizing plate cover plate 4 is used as a sealing cover of the shell, the shell is welded and sealed in a vacuum mode, meanwhile, the liquid absorption core 5 is formed by mixing aluminum powder and AlSiMg alloy powder in a vacuum sintering mode, vacuumizing is carried out before welding, welding is carried out after welding, helium mass spectrometry inspection welding is carried out, and air tightness, the corrosion resistance of the radiator is improved, and the radiator is the same as the surface protection of aluminum alloy, so a better protective layer can be obtained in a black anodic oxidation mode, the coefficient of heat conductivity of the radiator is higher when the radiator is used, the thermal resistance of the radiator is better reduced, the whole structure is simple, and the practicability is stronger when the radiator is used.
The utility model discloses a radiator main part 1, diode 2, rivet pressing nut 3, samming board apron 4, imbibition core 5, heat dissipation dentate lamella 6, even casing 7, cold liquid working medium 8, the part is the parts that general standard spare or technical staff in the field know, its structure and principle all can all be known or can be known through the conventional experimental approach for this technical staff through the technical manual, the problem that the utility model solves is that the conventional section bar radiator that does benefit to on the market has been unable to satisfy the heat dissipation requirement of high-power diode 2, on-board electronic equipment group, conventional section bar radiator material adopts aluminum alloy material, the coefficient of heat conductivity of aluminum alloy is about 120 ~ 205W/m. The utility model discloses a combination of each other of above-mentioned parts, through the radiator that adopts the temperature-uniforming plate to make as the basis, and adopt acetone C3H6O as the cold liquid working medium 8 of temperature-uniforming plate, then utilize the phase transition latent heat that gas-liquid phase transition produced to realize high-efficient heat transfer performance, can take place liquid-vapour phase transition in the operating temperature scope of temperature-uniforming plate radiator, and have the saturated steam pressure of closing, the operation in-process heat stability is good, and can moisten casing and imbibition core 5, and have good compatibility with casing and imbibition core 5 material, do not influence the life of temperature-uniforming plate radiator, its surface tension is big, low and the good performance of wettability of viscosity, the coefficient of heat conductivity of this radiator when using has been improved greatly, better reduction the thermal resistance of radiator, overall structure is simple, the functionality is stronger, comparatively practical during the use.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (5)
1. A temperature equalization plate radiator for a high-power diode is characterized in that: including radiator main part (1), imbibition core (5), heat dissipation dentate lamella (6) and cold liquid working medium (8), radiator main part (1) is including equal casing (7) and temperature-uniforming plate cover board (4), temperature-uniforming plate cover board (4) fixed connection is in the side of equal casing (7), outside fixed connection heat dissipation dentate lamella (6) of radiator main part (1), the inside of radiator main part (1) is equipped with cold liquid working medium (8) and imbibition core (5), be equipped with the vacuum cavity between equal casing (7) and the temperature-uniforming plate cover board (4).
2. The thermal equalizer of claim 1, wherein the thermal equalizer further comprises: the liquid cooling device is characterized in that the liquid absorbing cores (5) are fixedly connected inside the uniform shell (7), and the surfaces of the liquid absorbing cores (5) are covered with cold liquid working media (8).
3. The thermal equalizer of claim 1, wherein the thermal equalizer further comprises: the heat dissipation tooth piece (6) is in an evenly distributed form, the heat dissipation tooth piece (6) is installed on the outer surface of the uniform shell (7), and the uniform shell (7) and the heat dissipation tooth piece (6) are arranged into an integrated part.
4. The thermal equalizer of claim 1, wherein the thermal equalizer further comprises: the outside fixed connection diode (2) of temperature-uniforming plate apron (4), diode (2) are the form of symmetric distribution.
5. The thermal equalizer of claim 1, wherein the thermal equalizer further comprises: the outer edge of the shell (7) is connected with the press riveting nuts (3) in an embedded mode, and the press riveting nuts (3) are evenly distributed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022864524.9U CN213694667U (en) | 2020-12-03 | 2020-12-03 | Temperature equalizing plate radiator for high-power diode |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022864524.9U CN213694667U (en) | 2020-12-03 | 2020-12-03 | Temperature equalizing plate radiator for high-power diode |
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| CN213694667U true CN213694667U (en) | 2021-07-13 |
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| CN202022864524.9U Active CN213694667U (en) | 2020-12-03 | 2020-12-03 | Temperature equalizing plate radiator for high-power diode |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220026968A1 (en) * | 2020-07-24 | 2022-01-27 | Dell Products L.P. | System and method for service life management based on condensation removal |
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2020
- 2020-12-03 CN CN202022864524.9U patent/CN213694667U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220026968A1 (en) * | 2020-07-24 | 2022-01-27 | Dell Products L.P. | System and method for service life management based on condensation removal |
| US11586262B2 (en) * | 2020-07-24 | 2023-02-21 | Dell Products L.P. | System and method for service life management based on condensation removal |
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