CN112739070A - Method for processing core layer of any-layer interconnected high-density circuit board - Google Patents
Method for processing core layer of any-layer interconnected high-density circuit board Download PDFInfo
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- CN112739070A CN112739070A CN202011470354.4A CN202011470354A CN112739070A CN 112739070 A CN112739070 A CN 112739070A CN 202011470354 A CN202011470354 A CN 202011470354A CN 112739070 A CN112739070 A CN 112739070A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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Abstract
The invention discloses a method for processing a core layer of an optional-layer interconnected high-density circuit board, relates to the technical field of circuit boards, and aims to solve the problem that when a blind hole is processed by using a copper-clad plate with 12-micron copper foils on both sides, the bottom copper foil can be penetrated by liquid medicine due to thinness; after the blind hole filling electroplating is finished, the surface copper is too thick, and the thin circuit can be manufactured only by etching and thinning the copper. The technical scheme is characterized in that copper foil copper-clad plates with two different thicknesses are customized (the thickness of an upper copper foil is 12 mu m, the thickness of a lower copper foil is 18 mu m), and after copper reduction and browning, the thickness of the surface copper is 7 mu m and 13 mu m respectively. And (3) carrying out carbon dioxide laser drilling on the surface of the 7 mu m copper foil. The copper-clad plate with the copper thickness of 20 mu m on both sides is obtained by removing glue, black hole and filling hole electroplating, and can be directly used for inner layer circuit manufacturing.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a method for processing a core layer of an arbitrary-layer interconnected high-density circuit board.
Background
With the increasing market demand of electronic consumer products in the world, the development of electronic technology is driven, and electronic products have more and more complex functions, more and more excellent performance, smaller and smaller volumes and lighter weights. Therefore, the requirement for the HDI (High Density Interconnection) board is more and more High, and the HDI board is widely applied to the fields of navigation, medical treatment, transportation, remote communication and the like.
Automobile telephones, wireless communications, and base stations have all been developed toward high-density interconnection, and communication transmission with high security and high transmission quality is required. And the demand for such HDI-made boards is increasing under the wide use of small-sized packaged portable electronic devices and high-density interconnects. In order to meet the requirements of terminal electronic products to the greatest extent, more complex electrical connection designs are generally adopted, wherein the most prominent is any layer of interconnection, and specifically, the adjacent two or more layers of circuits are electrically interconnected through blind vias.
The manufacturing method of the core layer of the current any-layer interconnection high-density circuit board (ANYLAYER HDI) comprises the following steps: the copper clad laminate with copper foils of 12 mu m on both sides is used and is manufactured by copper thinning, browning, carbon dioxide laser drilling, glue removal, copper melting, hole filling electroplating, baking, copper thinning and circuits.
The above prior art solutions have the following drawbacks:
(1) after the copper clad laminate with the copper foil of 12 micrometers is subjected to copper reduction and browning LDD, the residual thickness of the copper foil is 7 micrometers, and when the hole is drilled by a carbon dioxide laser, if the energy is too low, residual glue at the bottom of the blind hole can influence conduction; if the energy is too high, the copper foil at the bottom can be punctured by laser, or when the board passes through a copper wire or a black hole wire, the copper foil at the bottom of the blind hole is punctured by the liquid medicine;
(2) the thickness of a dielectric layer used by the core layer is usually 65 mu m or 75 mu m, surface copper is added, the size of a blind hole is 100x70 mu m or 100x80 mu m, common electroplating pore-filling liquid medicine is used for hole-filling electroplating, the blind hole can be filled up only by electroplating 18 mu m, the surface copper after electroplating reaches more than 25 mu m, and the superfine circuit can not be directly manufactured;
(3) after the hole filling of the electroplating is finished, high-temperature baking is needed for several hours to recrystallize the electroplated copper layer, and the copper on the thinning surface can be etched to 20 mu m for manufacturing the superfine circuit; if the copper is directly etched without baking, many pits are generated on the copper surface, which affects the product quality, and therefore, the copper surface needs to be further improved.
Disclosure of Invention
The invention aims to provide a method for processing a core layer of an optional-layer interconnected high-density circuit board, which has the effects of preventing a copper foil at the bottom of a blind hole from being punctured during drilling, avoiding baking and reducing copper flow and improving the processing efficiency.
The technical purpose of the invention is realized by the following technical scheme:
a method for processing a core layer of an arbitrary-layer interconnected high-density circuit board comprises the following steps,
step one, selecting materials: a double-sided copper-clad plate comprises a dielectric layer with the thickness of 75 mu m, an upper copper foil arranged on the top surface of the dielectric layer and a lower copper foil arranged on the bottom surface of the dielectric layer, wherein the thickness of the upper copper foil is 12 mu m, and the thickness of the lower copper foil is 18 mu m;
step two, copper reduction: etching the double-sided copper-clad plate in the first step by using a horizontal copper reduction wire to reduce the copper by 3 microns, wherein the thickness of the upper copper foil is 9 +/-1 microns after copper reduction, and the thickness of the lower copper foil is 15 +/-1 microns;
step three, browning: carrying out browning treatment on the copper-clad plate subjected to copper reduction in the second step by using a horizontal browning line, wherein the temperature of a browning liquid is 32-38 ℃, the browning micro-etching amount is 2 mu m, the thickness of an upper copper foil after browning is changed to 7 +/-1 mu m, and the thickness of a lower copper foil is changed to 13 +/-1 mu m;
step four, laser drilling: drilling a copper foil surface with the diameter of 7 mu m obtained in the third step by using carbon dioxide laser to obtain a blind hole with the diameter of 100 mu m;
step five, removing glue and black holes: removing the glue by using a plasma glue removing machine to remove the residual glue on the wall and the bottom of the blind hole;
the copper-clad plate after the glue removal passes through a black hole line, so that the carbon layer is attached to the resin on the wall of the blind hole; the back end of the black hole line is provided with a microetching flow, the microetching amount is 1 mu m, the thickness of the upper copper foil after the microetching is 6 +/-1 mu m, and the thickness of the lower copper foil is 12 +/-1 mu m;
placing the copper-clad plate subjected to black hole treatment into black hole microetching solution at the temperature of 28-32 ℃ for microetching, wherein the microetching amount is 1 mu m, the thickness of the upper copper foil is changed into 6 mu m after the microetching of the black holes, and the thickness of the lower copper foil is changed into 12 mu m;
step six, filling hole electroplating: filling the copper-clad plate obtained in the fifth step in electroplating solution at the temperature of 22-26 ℃ for electroplating, wherein the electroplating time is 50 minutes, the opening surface of the blind hole is electroplated with 14 mu m, the back surface is electroplated with 8 mu m, and after the electroplating is finished, the copper thickness of both surfaces of the copper-clad plate is 20 +/-2 mu m;
and seventhly, completing the manufacturing of the superfine circuit by sequentially carrying out the processes of dry film pretreatment, film pressing, LDI exposure, development, etching, film removal and the like.
The invention is further configured to: in the second step, the copper reducing agent is a product of Maitrex CRICUTETCH 100(179517) of Mide American technology, Suzhou, Inc.
The invention is further configured to: in the third step, the browning liquid is a product of Madmersus Multibond MP100(179501) model number of Madmersus technologies (Suzhou).
The invention is further configured to: in the fifth step, the liquid medicine in the black hole groove is a product of a Blackhole AF Starter (T0002) model of Madmay technology (Suzhou) Limited.
The invention is further configured to: in the sixth step, the electroplating solution is a product of MadeMei technology, Inc. model AVF700(191209), the electroplating solution comprises sulfuric acid, copper sulfate, chlorine ions, brightening agent, leveling agent and wetting agent, and the operating concentrations of the sulfuric acid, the copper sulfate, the chlorine ions, the brightening agent, the leveling agent and the wetting agent are respectively 40-60g/L, 235-265g/L, 45-55ppm, 1-1.5ml/L, 1-2.5ml/L and 9-25 ml/L.
The invention is further configured to: and sixthly, electroplating 14 micrometers on the open surface of the blind hole, and electroplating 8 micrometers on the back surface of the blind hole.
The invention also provides the HDI board core layer prepared by the processing method of the optional-layer interconnected high-density circuit board core layer.
In conclusion, the beneficial technical effects of the invention are as follows:
the invention adopts copper foil copper clad plates with two surfaces of different thicknesses (the thickness of an upper copper foil is 12 mu m, the thickness of a lower copper foil is 18 mu m), after copper browning is reduced, the copper thicknesses are respectively 7 mu m and 13 mu m, after carbon dioxide laser drilling is finished, the upper copper foil and insulating layer resin are burnt by laser, the lower copper foil is burnt by 1-3 mu m, and the copper foil below a hole is thicker (10-12 mu m) so as to avoid penetration by liquid medicine in the micro-etching or copper-dissolving micro-etching process before glue removal;
the blind holes can be filled up by electroplating 14 μm on the surface of the blind holes and 8 μm on the back surface of the blind holes by electroplating with Maideme AVF700 series electroplating liquid. The expenses of metal copper, electroplating liquid medicine and electricity charge are reduced, the production cost is reduced, and resources are saved;
after hole filling is completed, the copper thickness of both sides is 20 μm, baking and copper reduction processes are not needed, superfine circuit manufacturing can be directly carried out, the manufacturing process is shortened, unnecessary carrying processes are reduced, and the processing efficiency and the yield are improved.
Drawings
FIG. 1 is a schematic step diagram of the method for processing the core layer of the arbitrary-layer interconnection high-density circuit board according to the invention.
Detailed Description
The following detailed description of the preferred embodiments of the present invention is provided to enable those skilled in the art to more readily understand the advantages and features of the present invention, and to clearly and unequivocally define the scope of the present invention.
The sources of the adopted raw materials are not limited, and if no special description is provided, the adopted raw materials are all common commercial products in the technical field, the sulfuric acid is 98% of industrial sulfuric acid, and the hydrogen peroxide is 50% of industrial hydrogen peroxide.
Wherein, the copper reducing agent adopted by the invention is purchased from McMed technology (Suzhou) Limited company, and the product number is McMed Lelesch CRUCETCH 100 (179517);
the browning liquid was purchased from McMed technologies, Suzhou, under the trade designation McMed, Less Multibond MP100 (179501);
black hole bath solution was purchased from mademe technologies (suzhou) ltd under the model Blackhole AF Starter;
the plating solution was purchased from McSt.Tech (Suzhou) Inc. under the model AVF700 (191209).
Example 1
Referring to fig. 1, a method for processing a core layer of an arbitrary-layer interconnected high-density circuit board comprises the following steps,
step one, selecting materials: a double-sided copper-clad plate comprises a dielectric layer with the thickness of 75 mu m, an upper copper foil arranged on the top surface of the dielectric layer and a lower copper foil arranged on the bottom surface of the dielectric layer, wherein the thickness of the upper copper foil is 12 mu m, and the thickness of the lower copper foil is 18 mu m;
step two, copper reduction: etching the double-sided copper-clad plate in the first step by using a horizontal copper reducing wire to reduce the copper by 3 mu m, wherein the liquid medicine for reducing the copper is Maide-Meilese CRICUTETCH 100(179517) series liquid medicine for reducing the copper, and the bath solution comprises the following components: 4% of concentrated sulfuric acid, 2% of hydrogen peroxide, 1003% of CRUCETCH and the balance of deionized water, wherein the operation temperature is 30 ℃, the thickness of the upper copper foil is 9 micrometers after copper reduction, and the thickness of the lower copper foil is 15 micrometers;
step three, browning: carrying out browning treatment on the copper-clad plate subjected to copper reduction in the second step by using a horizontal browning line, wherein the browning micro-etching amount is 2 micrometers, the thickness of the upper copper foil after browning is changed to 7 micrometers, and the thickness of the lower copper foil is changed to 13 micrometers; the medicinal liquid used for browning is Maide Mei Lesi Multibond MP100(179501) series browning medicinal liquid, and the bath solution comprises concentrated sulfuric acid 5%, hydrogen peroxide 2%, organic browning MP 3.8%, and deionized water in balance, and the operation temperature is 32 ℃;
step four, laser drilling: drilling a copper foil surface with the diameter of 7 mu m obtained in the third step by using carbon dioxide laser to obtain a blind hole with the diameter of 100 mu m;
step five, removing glue and black holes: removing the glue by using a plasma glue removing machine to remove the residual glue on the wall and the bottom of the blind hole;
enabling the board to pass through the horizontal black hole line, and depositing a carbon layer on the resin on the wall of the blind hole, so as to complete the metallization of the blind hole in the subsequent copper electroplating operation;
wherein the main tank liquid medicine of the black hole lines is MaindeLesi black hole series liquid medicine (T0222), the black hole tank liquid medicine is Black hole AF Starter, the liquid medicine parameter is solid content 2.2%, the pH value is 9.5, the liquid medicine temperature is 32 ℃, and the black hole treatment time is 90 seconds;
the black hole line micro-etching section comprises the following liquid medicines: 5% of sulfuric acid; 2.5 percent of hydrogen peroxide; stabilizer G5S 2%; the temperature is 28 ℃;
the micro-etching amount is 1 μm, the thickness of the upper copper foil is changed to 6 μm and the thickness of the lower copper foil is changed to 12 μm after the black hole is micro-etched;
step six, filling hole electroplating: filling holes on the gantry line by using Maideme AVF700(191209) series electroplating liquid, wherein the operation temperature is 22 ℃, the current density of the open face of the blind hole is 1.3ASD, the current density of the back face of the blind hole is 0.7ASD, the electroplating time is 50 minutes, after the filling holes are electroplated, the open face of the blind hole is electroplated by 14 mu m, the back face is electroplated by 8 mu m, and after the electroplating is finished, the copper thickness of both sides of the copper-clad plate is 20 mu m;
wherein the electroplating solution comprises sulfuric acid, copper sulfate, chloride ions, a brightening agent, a leveling agent and a wetting agent, and the operating concentrations of the sulfuric acid, the copper sulfate, the chloride ions, the brightening agent, the leveling agent and the wetting agent are respectively 40g/L, 235g/L, 45ppm, 1ml/L and 9 ml/L;
and seventhly, completing the manufacturing of the superfine circuit by sequentially carrying out the processes of dry film pretreatment, film pressing, LDI exposure, development, etching, film removal and the like.
Example 2
Referring to fig. 1, a method for processing a core layer of an arbitrary-layer interconnected high-density circuit board comprises the following steps,
step one, selecting materials: a double-sided copper-clad plate comprises a dielectric layer with the thickness of 75 mu m, an upper copper foil arranged on the top surface of the dielectric layer and a lower copper foil arranged on the bottom surface of the dielectric layer, wherein the thickness of the upper copper foil is 12 mu m, and the thickness of the lower copper foil is 18 mu m;
step two, copper reduction: etching the double-sided copper-clad plate in the first step by using a horizontal copper reducing wire to reduce the copper by 3 mu m, wherein the liquid medicine for reducing the copper is Maide-Meilese CRICUTETCH 100(179517) series liquid medicine for reducing the copper, and the bath solution comprises the following components: concentrated sulfuric acid 5%, hydrogen peroxide 3%, CRICETCH 1003% and the balance deionized water, wherein the operation temperature is 35 ℃, the thickness of the upper copper foil is 9 micrometers after copper reduction, and the thickness of the lower copper foil is 15 micrometers;
step three, browning: carrying out browning treatment on the copper-clad plate subjected to copper reduction in the second step by using a horizontal browning line, wherein the browning micro-etching amount is 2 micrometers, the thickness of the upper copper foil after browning is changed to 7 micrometers, and the thickness of the lower copper foil is changed to 13 micrometers; the medicinal liquid used for browning is Maide Mei Lesi Multibond MP100(179501) series browning medicinal liquid, and the bath solution comprises concentrated sulfuric acid 5.5%, hydrogen peroxide 3%, organic browning MP 4.2%, and deionized water in balance, and the operation temperature is 35 ℃;
step four, laser drilling: drilling a copper foil surface with the diameter of 7 mu m obtained in the third step by using carbon dioxide laser to obtain a blind hole with the diameter of 100 mu m;
step five, removing glue and black holes: removing the glue by using a plasma glue removing machine to remove the residual glue on the wall and the bottom of the blind hole;
enabling the board to pass through the horizontal black hole line, and depositing a carbon layer on the resin on the wall of the blind hole, so as to complete the metallization of the blind hole in the subsequent copper electroplating operation;
wherein the main tank liquid medicine of the black hole lines is MaindeLesi black hole series liquid medicine (T0222), the black hole tank liquid medicine is Black hole AF Starter, the liquid medicine parameters are solid content 2.7%, the pH value is 10, the liquid medicine temperature is 33 ℃, and the black hole treatment time is 110 seconds;
the black hole line micro-etching section comprises the following liquid medicines: 6 percent of sulfuric acid; 3% of hydrogen peroxide; stabilizer G5S 2%; the temperature is 30 ℃;
the micro-etching amount is 1 μm, the thickness of the upper copper foil is changed to 6 μm and the thickness of the lower copper foil is changed to 12 μm after the black hole is micro-etched;
step six, filling hole electroplating: filling holes on the gantry line by using Maideme AVF700(191209) series electroplating liquid, wherein the operation temperature is 24 ℃, the current density of the open face of the blind hole is 1.3ASD, the current density of the back face of the blind hole is 0.7ASD, the electroplating time is 50 minutes, after the filling holes are electroplated, the open face of the blind hole is electroplated by 14 mu m, the back face is electroplated by 8 mu m, and after the electroplating is finished, the copper thickness of both sides of the copper-clad plate is 20 mu m;
wherein, the electroplating solution comprises sulfuric acid, copper sulfate, chloride ions, a brightening agent, a leveling agent and a wetting agent, and the operating concentrations of the sulfuric acid, the copper sulfate, the chloride ions, the brightening agent, the leveling agent and the wetting agent are respectively 50g/L, 250g/L, 50ppm, 1.2ml/L, 1.8ml/L and 17 ml/L;
and seventhly, completing the manufacturing of the superfine circuit by sequentially carrying out the processes of dry film pretreatment, film pressing, LDI exposure, development, etching, film removal and the like.
Example 3
Referring to fig. 1, a method for processing a core layer of an arbitrary-layer interconnected high-density circuit board comprises the following steps,
step one, selecting materials: a double-sided copper-clad plate comprises a dielectric layer with the thickness of 75 mu m, an upper copper foil arranged on the top surface of the dielectric layer and a lower copper foil arranged on the bottom surface of the dielectric layer, wherein the thickness of the upper copper foil is 12 mu m, and the thickness of the lower copper foil is 18 mu m;
step two, copper reduction: etching the double-sided copper-clad plate in the first step by using a horizontal copper reducing wire to reduce the copper by 3 mu m, wherein the liquid medicine for reducing the copper is Maide-Meilese CRICUTETCH 100(179517) series liquid medicine for reducing the copper, and the bath solution comprises the following components: 7% of concentrated sulfuric acid, 5% of hydrogen peroxide, 1003% of CRUCETCH and the balance of deionized water, wherein the operation temperature is 40 ℃, the thickness of the upper copper foil is 9 micrometers after copper reduction, and the thickness of the lower copper foil is 15 micrometers;
step three, browning: carrying out browning treatment on the copper-clad plate subjected to copper reduction in the second step by using a horizontal browning line, wherein the browning micro-etching amount is 2 micrometers, the thickness of the upper copper foil after browning is changed to 7 micrometers, and the thickness of the lower copper foil is changed to 13 micrometers; the medicinal liquid used for browning is Maide Mei Lesi Multibond MP100(179501) series browning medicinal liquid, and the bath solution comprises concentrated sulfuric acid 6%, hydrogen peroxide 3.5%, organic browning MP 4.6% and deionized water in balance, and the operation temperature is 38 ℃;
step four, laser drilling: drilling a copper foil surface with the diameter of 7 mu m obtained in the third step by using carbon dioxide laser to obtain a blind hole with the diameter of 100 mu m;
step five, removing glue and black holes: removing the glue by using a plasma glue removing machine to remove the residual glue on the wall and the bottom of the blind hole;
enabling the board to pass through the horizontal black hole line, and depositing a carbon layer on the resin on the wall of the blind hole, so as to complete the metallization of the blind hole in the subsequent copper electroplating operation;
wherein the main tank liquid medicine of the black hole lines is MaindeLesi black hole series liquid medicine (T0222), the black hole tank liquid medicine is Black hole AF Starter, the liquid medicine parameter is solid content 3.2%, the pH value is 10.5, the liquid medicine temperature is 35 ℃, and the black hole treatment time is 135 seconds;
the black hole line micro-etching section comprises the following liquid medicines: 7% of sulfuric acid; 3.5 percent of hydrogen peroxide; stabilizer G5S 2%; the temperature is 32 ℃;
the micro-etching amount is 1 μm, the thickness of the upper copper foil is changed to 6 μm and the thickness of the lower copper foil is changed to 12 μm after the black hole is micro-etched;
step six, filling hole electroplating: filling holes on the gantry line by using Maideme AVF700(191209) series electroplating liquid, wherein the operation temperature is 26 ℃, the current density of the open face of the blind hole is 1.3ASD, the current density of the back face of the blind hole is 0.7ASD, the electroplating time is 50 minutes, after the filling holes are electroplated, the open face of the blind hole is electroplated by 14 mu m, the back face is electroplated by 8 mu m, and after the electroplating is finished, the copper thickness of both sides of the copper-clad plate is 20 mu m;
wherein, the electroplating solution comprises sulfuric acid, copper sulfate, chloride ions, a brightening agent, a leveling agent and a wetting agent, and the operating concentrations of the sulfuric acid, the copper sulfate, the chloride ions, the brightening agent, the leveling agent and the wetting agent are respectively 60g/L, 265g/L, 55ppm, 1.5ml/L, 2.5ml/L and 25 ml/L;
and seventhly, completing the manufacturing of the superfine circuit by sequentially carrying out the processes of dry film pretreatment, film pressing, LDI exposure, development, etching, film removal and the like.
After the carbon dioxide laser drilling is finished, the plate surface quality and the hole opening position are detected to determine whether the phenomena of glue burning and hole deviation exist, the inspection is carried out by adopting a 200-time lens with a light source, the bottom copper can be clearly seen to be qualified, and the detection results are as shown in the following table.
TABLE 1 Blind hole test results
| The result of the detection | |
| Example 1 | The bottom copper can be clearly seen |
| Example 2 | The bottom copper can be clearly seen |
| Example 3 | The bottom copper can be clearly seen |
According to the data in the above table, the copper foil copper-clad plate with two different thicknesses (the thickness of the upper copper foil is 12 μm, and the thickness of the lower copper foil is 18 μm) is adopted, and the bottom copper can be clearly seen after the carbon dioxide laser drilling is finished, so that the hole bottom breakdown during the carbon dioxide laser drilling is avoided, and the copper foil at the bottom of the blind hole is prevented from being penetrated by the liquid medicine in the micro-etching and copper dissolution micro-etching processes before the glue removal.
The blind holes can be filled up by electroplating 14 μm on the surface of the blind holes and 8 μm on the back surface of the blind holes by electroplating with Maideme AVF700 series electroplating liquid. The expenses of metal copper, electroplating liquid medicine and electricity charge are reduced, the production cost is reduced, and resources are saved;
after hole filling is completed, the copper thickness of both sides is 20 μm, baking and copper reduction processes are not needed, superfine circuit manufacturing can be directly carried out, the manufacturing process is shortened, unnecessary carrying processes are reduced, and the processing efficiency and the yield are improved.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present invention or directly or indirectly applied to other related technical fields are included in the scope of the present invention.
Claims (7)
1. A method for processing a core layer of an arbitrary-layer interconnected high-density circuit board is characterized by comprising the following steps: comprises the following steps of (a) carrying out,
step one, selecting materials: a double-sided copper-clad plate comprises a dielectric layer with the thickness of 75 mu m, an upper copper foil arranged on the top surface of the dielectric layer and a lower copper foil arranged on the bottom surface of the dielectric layer, wherein the thickness of the upper copper foil is 12 mu m, and the thickness of the lower copper foil is 18 mu m;
step two, copper reduction: etching the double-sided copper-clad plate in the first step by using a horizontal copper reduction wire to reduce the copper by 3 microns, wherein the thickness of the upper copper foil is 9 +/-1 microns after copper reduction, and the thickness of the lower copper foil is 15 +/-1 microns;
step three, browning: carrying out browning treatment on the copper-clad plate subjected to copper reduction in the second step by using a horizontal browning line, wherein the temperature of a browning liquid is 32-38 ℃, the browning micro-etching amount is 2 mu m, the thickness of an upper copper foil after browning is changed to 7 +/-1 mu m, and the thickness of a lower copper foil is changed to 13 +/-1 mu m;
step four, laser drilling: drilling a copper foil surface with the diameter of 7 mu m obtained in the third step by using carbon dioxide laser to obtain a blind hole with the diameter of 100 mu m;
step five, removing glue and black holes: removing the glue by using a plasma glue removing machine to remove the residual glue on the wall and the bottom of the blind hole;
the copper-clad plate after the glue removal passes through a black hole line, so that the carbon layer is attached to the resin on the wall of the blind hole; the back end of the black hole line is provided with a microetching flow, the microetching amount is 1 mu m, the thickness of the upper copper foil after the microetching is 6 +/-1 mu m, and the thickness of the lower copper foil is 12 +/-1 mu m;
placing the copper-clad plate subjected to black hole treatment into black hole microetching solution at the temperature of 28-32 ℃ for microetching, wherein the microetching amount is 1 mu m, the thickness of the upper copper foil is changed into 6 mu m after the microetching of the black holes, and the thickness of the lower copper foil is changed into 12 mu m;
step six, filling hole electroplating: filling the copper-clad plate obtained in the fifth step in electroplating solution at the temperature of 22-26 ℃ for electroplating, wherein the electroplating time is 50 minutes, the opening surface of the blind hole is electroplated with 14 mu m, the back surface is electroplated with 8 mu m, and after the electroplating is finished, the copper thickness of both surfaces of the copper-clad plate is 20 +/-2 mu m;
and seventhly, completing the manufacturing of the superfine circuit by sequentially carrying out the processes of dry film pretreatment, film pressing, LDI exposure, development, etching, film removal and the like.
2. The method for processing the core layer of the any-layer interconnected high-density circuit board according to claim 1, wherein the method comprises the following steps: in the second step, the copper reducing agent is a product of Maitrex CRICUTETCH 100(179517) of Mide American technology, Suzhou, Inc.
3. The method for processing the core layer of the any-layer interconnected high-density circuit board according to claim 1, wherein the method comprises the following steps: in the third step, the browning liquid is a product of Madmersus Multibond MP100(179501) model number of Madmersus technologies (Suzhou).
4. The method for processing the core layer of the any-layer interconnected high-density circuit board according to claim 1, wherein the method comprises the following steps: in the fifth step, the liquid medicine in the black hole groove is a product of a Blackhole AF Starter (T0002) model of Madmay technology (Suzhou) Limited.
5. The method for processing the core layer of the any-layer interconnected high-density circuit board according to claim 1, wherein the method comprises the following steps: in the sixth step, the electroplating solution is a product of MadeMei technology, Inc. model AVF700(191209), the electroplating solution comprises sulfuric acid, copper sulfate, chlorine ions, brightening agent, leveling agent and wetting agent, and the operating concentrations of the sulfuric acid, the copper sulfate, the chlorine ions, the brightening agent, the leveling agent and the wetting agent are respectively 40-60g/L, 235-265g/L, 45-55ppm, 1-1.5ml/L, 1-2.5ml/L and 9-25 ml/L.
6. The method for processing the core layer of the any-layer interconnected high-density circuit board according to claim 5, wherein the method comprises the following steps: and sixthly, electroplating 14 micrometers on the open surface of the blind hole, and electroplating 8 micrometers on the back surface of the blind hole.
7. An HDI board core layer prepared by the method for processing any layer of interconnected high-density circuit board core layer as claimed in any one of claims 1-6.
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