CN112738977A - Design method and system for pin heat dissipation structure of through hole of PCB component - Google Patents
Design method and system for pin heat dissipation structure of through hole of PCB component Download PDFInfo
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- CN112738977A CN112738977A CN202011314651.XA CN202011314651A CN112738977A CN 112738977 A CN112738977 A CN 112738977A CN 202011314651 A CN202011314651 A CN 202011314651A CN 112738977 A CN112738977 A CN 112738977A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000013461 design Methods 0.000 title claims abstract description 25
- 230000005855 radiation Effects 0.000 claims abstract description 3
- 239000010410 layer Substances 0.000 claims description 118
- 238000004806 packaging method and process Methods 0.000 claims description 14
- 239000002344 surface layer Substances 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 abstract description 9
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000005538 encapsulation Methods 0.000 abstract description 2
- 239000006185 dispersion Substances 0.000 abstract 1
- 239000004744 fabric Substances 0.000 abstract 1
- GOLXNESZZPUPJE-UHFFFAOYSA-N spiromesifen Chemical compound CC1=CC(C)=CC(C)=C1C(C(O1)=O)=C(OC(=O)CC(C)(C)C)C11CCCC1 GOLXNESZZPUPJE-UHFFFAOYSA-N 0.000 abstract 1
- 239000012792 core layer Substances 0.000 description 5
- 238000012938 design process Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 238000012217 deletion Methods 0.000 description 2
- 230000037430 deletion Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 230000003252 repetitive effect Effects 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a design method and a system for a pin heat dissipation structure of a through hole of a PCB component, which comprises the following steps: acquiring the number of layers of the core board connected with each through hole pin on the PCB; judging whether the number of the core boards is greater than the maximum allowable connection number, if so, dividing each core board connected with the through hole pin into a reserved core board and a deleted core board, wherein the number of the reserved core boards is less than or equal to the maximum allowable connection number; and arranging a heat dissipation package at the through hole of each deleted layer core board, and reserving a wiring and wiring forbidden ring in the heat dissipation package along the circumferential direction of the through hole. So, utilize PCB design technology to delete layer core on each layer and add the heat dissipation encapsulation in unison, recycle and walk the wiring and forbid the cloth ring and vacate no conductor layer region around the through-hole for each through-hole pin can only be connected with keeping a layer core, thereby guarantee that the core number of piles that links to each other with through-hole pin is in the maximum allowable number of piles of connecting, guarantee that through-hole pin heat dispersion satisfies the DFM demand, conveniently, swiftly realize through-hole pin heat radiation structure design, reduce labor load.
Description
Technical Field
The invention relates to the technical field of PCBs, in particular to a design method of a pin heat dissipation structure of a through hole of a PCB component. The invention also relates to a system for designing the pin heat dissipation structure of the through hole of the PCB component.
Background
The Design and development of the PCB board is a very complicated process, and in the Design process, various Design requirements, such as SI (Signal integrity), PI (Power integrity), DFM (Design for Manufacturing) requirements, assemblability requirements, heat dissipation requirements, structural requirements, automation requirements, reliability requirements, and the like, should be considered. The manufacturability design requirement, the assemblability requirement and the automation requirement are production-oriented, and when the PCB is designed, the high-efficiency production efficiency of the product is ensured, and the problem of poor quality is avoided. For the manufacturability design requirement of the PCB, the DFM problem is checked through a DFM checking link during the design of the PCB.
One of the important inspection items of the DFM inspection is a heat dissipation problem of a through-hole pin (pin). Generally, through-hole pin can not connect more than the copper sheet more than three-layer, and every layer of copper sheet all must make the flower to connect moreover, prevents to lead to the heat dissipation too fast because of the conductor layer (like the copper sheet) that connects on through-hole pin is too many, causes the rosin joint. Especially, because the current labor cost is too high, the efficiency is low, the mechanized and automated wave soldering process is widely applied, and the heat dissipation problem of the through hole pin is important. For the pin of part SMT resistance container spare, the pin only has 2, and the symmetric distribution, when crossing reflow soldering technology, if two pins weld the height inequality or lay copper volume when too big, can cause two pins to be heated unevenly, appear welding badly easily, even one end of device receives stress and the perk, produces "the tombstone" phenomenon.
Due to market demands, high-density board cards and super-large board cards are more and more designed, more than dozens of layers of board cards are more and more designed, and the heat dissipation structure design that the through hole pins can not be connected in a multi-layer mode is more and more complex. In the prior art, each through hole pin can only be modified manually and specifically, through holes pins at each layer of core board exceeding the number of connecting layers are hollowed or modified one by one. The design method is single repetitive work, needs a large amount of repetitive labor by manpower, seriously influences the research and development efficiency and has large labor load.
Therefore, how to conveniently and quickly realize the design of the through hole pin heat dissipation structure, reduce the labor load, and ensure that the through hole pin heat dissipation performance meets the requirement of DFM is a technical problem faced by technical personnel in the field.
Disclosure of Invention
The invention aims to provide a design method of a pin heat dissipation structure of a through hole of a PCB component, which can conveniently and quickly realize the design of the pin heat dissipation structure of the through hole, reduce the labor load and ensure that the heat dissipation performance of the pin of the through hole meets the requirement of DFM. The invention also aims to provide a design system of the pin heat dissipation structure of the through hole of the PCB component.
In order to solve the technical problem, the invention provides a design method of a pin heat dissipation structure of a through hole of a PCB component, which comprises the following steps:
acquiring the number of layers of the core board connected with each through hole pin on the PCB;
judging whether the core board layer number is greater than the maximum allowable connection layer number, if so, dividing each core board connected with the through hole pin into a reserved core board and a deleted core board, wherein the layer number of the reserved core board is less than or equal to the maximum allowable connection layer number;
and arranging heat dissipation packages at the through holes of the deleted layer core boards, and reserving wiring forbidden rings in the heat dissipation packages in the circumferential direction of the through holes.
Preferably, acquiring the number of layers of the core board connected by the pin of each through hole on the PCB specifically includes:
scanning the inner structure of the PCB along the thickness direction, acquiring the connection state of each through hole pin on each layer of core board in the PCB, and counting the number of the core board layers connected with each through hole pin.
Preferably, each core board connected to the through hole pin is divided into a reserved core board and a deleted core board, and the method specifically includes:
and dividing each core board which is in signal connection with the through hole pin into reserved core boards, and dividing each core board which is not in signal connection with the through hole pin into deleted core boards.
Preferably, each core board connected to the through hole pin is divided into a reserved core board and a deleted core board, and the method specifically includes:
and when the through hole pin is a grounding pin, selecting the core board with the same number as the maximum allowable connecting layer as the reserved layer core board.
Preferably, each core board connected to the through hole pin is divided into a reserved core board and a deleted core board, and the method specifically includes:
and when the through hole pin is a grounding pin, selecting a plurality of layers of core boards close to the surface layer core board as the reserved layer core board.
Preferably, the method further comprises the following steps:
when the through hole pin is an SMT device pin, a plurality of discretely distributed wiring forbidden regions for forming patterned welding pads are reserved in the circumferential direction of the through hole in the heat dissipation packaging.
Preferably, the method further comprises the following steps:
when the through hole pin is an SMT device pin, a conductive skin used for improving the through-current performance of the through hole pin is laid on the surface of the core plate on the surface layer.
The invention also provides a system for designing the pin heat dissipation structure of the through hole of the PCB component, which comprises the following steps:
the core board acquisition module is used for acquiring the number of core board layers connected with the pins of the through holes on the PCB;
the core board dividing module is used for judging whether the number of the core boards is greater than the maximum allowable connecting number, if so, dividing the core boards connected with the through holes pin into reserved core boards and deleted core boards, wherein the number of the reserved core boards is less than or equal to the maximum allowable connecting number;
and the packaging setting module is used for setting heat dissipation packaging at the through hole of each deleted layer core board and reserving a wiring forbidden ring in the heat dissipation packaging along the circumferential direction of the through hole.
The design method of the pin heat dissipation structure of the through hole of the PCB component mainly comprises three steps. In the first step, considering that the PCB is designed by a multilayer composite board, the PCB is formed by pressing a multilayer core board, through holes pins of all devices installed on the PCB are respectively connected to different through holes, and each through hole pin is provided with a corresponding connecting core board, so that the main content of the step is to obtain the number of the core board layers connected with the through holes pins on the PCB. In the second step, the number of the core boards connected with each through hole pin has the corresponding maximum allowable connection number, the main content of the step is to judge whether the number of the core boards is greater than the maximum allowable connection number according to the acquired information in the first step, if so, the number of the core boards connected with the corresponding through hole pins exceeds the standard, so that the heat dissipation problem can be caused, and at the moment, the core boards connected with the corresponding through hole pins are divided into reserved core boards and deleted core boards; the number of the reserved layer core boards is less than or equal to the maximum allowable connecting layer number, and the reserved layer core boards are mainly used for keeping connection with the corresponding through holes pin; and the rest core boards are all deleted layer core boards which are mainly used for being disconnected with the corresponding through holes pin. In the third step, the main content is that on each divided deleted layer core board, heat dissipation packages are uniformly added at through hole positions corresponding to the through holes pin, and meanwhile, routing forbidden rings are reserved in the circumferential areas of the through holes in the heat dissipation packages; the heat dissipation package can be uniformly added to each through hole in the PCB design process, and the routing prohibition ring is an annular area for prohibiting routing, namely an area without a conductor layer. Therefore, the method for designing the through hole pin heat dissipation structure of the PCB component utilizes the packaging adding technology in the PCB design process to uniformly add heat dissipation packages on each divided layer of deleted layer core board, and then utilizes the preset routing distribution forbidding rings in each heat dissipation package to form conductor-free layer areas around the through holes on each layer of deleted layer core board, so that each through hole pin can only be connected with the conductor layer at the through hole on the divided reserved layer core board, the number of the layers of the core boards connected with each through hole pin is ensured to be within the maximum allowable number of connecting layers, the heat dissipation performance of the through hole pin is ensured to meet the DFM requirement, and compared with the prior art, the method can conveniently and quickly realize the through hole pin heat dissipation structure design and reduce the manual labor load.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is a flow chart of a method according to an embodiment of the present invention.
Fig. 2 is a schematic structural view of adding a heat dissipation package on a deleted core board.
Fig. 3 is a schematic structural view of adding a heat dissipation package on a surface core board.
Fig. 4 is a schematic structural view of laying a conductive skin on a surface core board.
Fig. 5 is a block diagram of an embodiment of the present invention.
Wherein, in fig. 2-5:
the packaging structure comprises a through hole pin-a, a heat dissipation packaging-b, a wiring layout forbidding ring-c, a wiring layout forbidding area-d, a conductive skin-e, a core board acquisition module-1, a core board dividing module-2 and a packaging setting module-3.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic overall structure diagram of an embodiment of the present invention.
In a specific embodiment provided by the present invention, a method for designing a pin heat dissipation structure of a through hole of a PCB device mainly includes three steps, which are:
s1, acquiring the number of layers of the core board connected with each through hole pin on the PCB;
s2, judging whether the number of the core boards is greater than the maximum allowable number of the connecting layers, if so, dividing each layer of core board connected with the through hole pin into a reserved layer of core board and a deleted layer of core board, wherein the number of the reserved layer of core board is less than or equal to the maximum allowable number of the connecting layers;
and S3, arranging heat dissipation packages at the through holes of the deleted layer core boards, and reserving wiring and wiring inhibition rings in the circumferential direction of the through holes in the heat dissipation packages.
In step S1, considering that the PCB is designed as a multilayer composite board, the PCB is formed by press-fitting a multilayer core board, through holes pins of each device mounted on the PCB are respectively connected to different through holes, and each through hole pin has a corresponding connection core board, so the main content of this step is to obtain the number of core board layers connected to each through hole pin on the PCB.
In step S2, the number of core boards connected by each through-hole pin has a corresponding maximum allowable number of connection layers, and the main content of this step is to determine whether the number of core boards is greater than the maximum allowable number of connection layers according to the information obtained in the first step, and if so, it indicates that the number of core boards connected to the corresponding through-hole pin exceeds the standard, which may cause a heat dissipation problem, and at this time, the core boards connected to the corresponding through-hole pins are divided into reserved core boards and deleted core boards; the number of the reserved layer core boards is less than or equal to the maximum allowable connecting layer number, and the reserved layer core boards are mainly used for keeping connection with the corresponding through holes pin; and the rest core boards are all deleted layer core boards which are mainly used for being disconnected with the corresponding through holes pin.
In step S3, the main content is to uniformly add heat dissipation packages to the positions of the through holes corresponding to the through hole pin on each divided deleted layer core board, and leave routing prohibition loops in the circumferential regions of the through holes in the heat dissipation packages; the heat dissipation package can be uniformly added to each through hole in the PCB design process, and the routing prohibition ring is an annular area for prohibiting routing, namely an area without a conductor layer.
Therefore, the method for designing the pin heat dissipation structure of the through hole of the PCB component provided by the embodiment utilizes the packaging adding technology in the PCB design process, the heat dissipation packaging is uniformly added on each layer of the divided core plate of the deletion layer, and the conductor-free layer area is formed around the through hole on each layer of the deletion layer by utilizing the wiring forbidden ring preset in each heat dissipation packaging, so that each through hole pin can only be connected with the conductor layer at the through hole on the divided core plate of the retention layer, the core plate layer number connected with each through hole pin is ensured to be within the maximum allowable connection layer number, and the heat dissipation performance of the through hole pin is ensured to meet the requirement of DFM.
Specifically, in step S1, in order to conveniently obtain the number of core layers connected to each through hole pin on the PCB, the internal structure of the PCB may be scanned in the thickness direction at first, so as to obtain the specific parameters of each core layer of the current PCB, such as the opening position of the through hole on each core layer, the number of the through holes, whether the through hole is connected to the device pin, etc., so as to obtain the connection state of each through hole pin on each core layer of the PCB, and finally, the number of core layers connected to each through hole pin is counted.
Generally, when the number of layers of the core board connected with each through hole pin exceeds 3 layers, the number of layers of the connecting core board connected with the through hole pin can be determined to exceed the standard, namely the maximum allowable number of connecting layers is 3, and at the moment, the area of the conductor layer on the core board connected with the through hole pin is too large, so that the problem of insufficient soldering quality caused by too fast heat dissipation is easily caused. Of course, the maximum allowable number of connection layers may be different for different through holes pin.
In addition, in step S2, when dividing the core boards, specifically, each core board to which the through holes pin keep signal connection may be divided into a reserved core board, and each core board to which the through holes pin do not generate signal connection may be divided into a deleted core board. So set up, each remains the layer core and is the core that has the functional relation with through-hole pin, remains the function that can guarantee PCB with it and does not receive the loss, for example the core that has the power supply function need keep electric connection with power pin, and each deletes the conductor layer on the layer core and only has physical connection with through-hole pin, can not cause the influence to PCB's function after getting rid of its connection.
It should be noted that the basis for dividing the core boards of the respective layers is not limited to the above method, and the division may be flexibly performed according to factors such as the actual connection necessary relationship between the through holes pin and the core boards of the respective layers, the specific connection positions, and the like.
Further, when the through hole pin is specifically a ground pin, since the through hole pin is electrically connected to the conductor layer on any layer of the core board, the attributes of the through hole pin are all ground attributes, a plurality of layers of the core boards can be selected as a reserved layer of the core board, and the rest layers of the core boards are used as a deleted layer of the core board. Of course, the number of reserved layer cores needs to be equal to or less than the maximum allowable number of connection layers of the through hole pin.
In another embodiment, when the through-hole pin is specifically a ground pin, to facilitate package addition and manufacturing, a plurality of layers of core boards closest to the surface layer core board may be further selected as reserved layer core boards, for example, the first three layers of core boards close to the surface of the PCB may be selected as reserved layer core boards, and the remaining layers of core boards are simultaneously selected as deleted layer core boards.
Of course, if the through hole pin is a common signal pin, the common signal pin is generally connected to only one core board, so that the common signal pin does not need to be packaged.
In addition, when the SMT device is arranged on the PCB, the through hole pin only needs to be connected with the surface of the PCB, and connection with a multilayer core board is not involved, but due to the fact that the through hole pin of the SMT device easily causes a tombstoning phenomenon in the SMT process, in this embodiment, a heat dissipation package is only added at the through hole, which is located on the surface layer of the core board and connected with the SMT device, and meanwhile, a plurality of routing forbidden distribution areas which are discretely distributed are reserved in the area located in the circumferential direction of the through hole in the heat dissipation package, so that the SMT device and the PCB form a patterned pad connection. Specifically, the routing forbidden region can be respectively distributed at the corner positions around the through hole, and the specific distribution condition of the routing forbidden region can be automatically adjusted along with the placement aspect, the placement position, the placement angle and the like of the SMT device.
Further, consider that the SMT device has only two pins, be power pin and ground connection pin respectively, and when actual design, the line of walking that appears power pin or ground connection pin easily is too thin, leads to the through-current performance not enough, influences the condition of PI performance, to this, this embodiment still has laid electrically conductive skin on the core surface that lies in the top layer to improve the electrically conductive area and the through-current performance of two pins of SMT device, and make the electrically conductive area of two pins tend to equal, guarantee the same radiating efficiency.
This embodiment still provides a PCB components and parts through-hole pin heat radiation structure design system, mainly includes that the core obtains module 1, the core divides module 2 and encapsulation and sets up module 3. The core board obtaining module 1 is mainly used for obtaining the number of core board layers connected with the through holes pin on the PCB. The core board dividing module 2 is mainly used for judging whether the number of core board layers is greater than the maximum allowable number of connecting layers, and if so, dividing each core board layer connected with the through hole pin into a reserved layer core board and a deleted layer core board, wherein the number of the reserved layer core board layers is less than or equal to the maximum allowable number of connecting layers. The package setting module 3 is mainly used for setting heat dissipation packages at through holes of the deleted layer core boards, and wiring and layout forbidding rings are reserved in the heat dissipation packages in the circumferential direction of the through holes.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. A design method for a pin heat dissipation structure of a through hole of a PCB component is characterized by comprising the following steps:
acquiring the number of layers of the core board connected with each through hole pin on the PCB;
judging whether the core board layer number is greater than the maximum allowable connection layer number, if so, dividing each core board connected with the through hole pin into a reserved core board and a deleted core board, wherein the layer number of the reserved core board is less than or equal to the maximum allowable connection layer number;
and arranging heat dissipation packages at the through holes of the deleted layer core boards, and reserving wiring forbidden rings in the heat dissipation packages in the circumferential direction of the through holes.
2. The method for designing the pin heat dissipation structure of the through hole of the PCB component as recited in claim 1, wherein the obtaining of the number of layers of the core board connected with each pin of the through hole on the PCB specifically comprises:
scanning the inner structure of the PCB along the thickness direction, acquiring the connection state of each through hole pin on each layer of core board in the PCB, and counting the number of the core board layers connected with each through hole pin.
3. The method for designing the pin heat dissipation structure of the through hole of the PCB component as recited in claim 1, wherein each layer of the core board connected with the through hole pin is divided into a reserved layer of the core board and a deleted layer of the core board, and specifically comprises:
and dividing each core board which is in signal connection with the through hole pin into reserved core boards, and dividing each core board which is not in signal connection with the through hole pin into deleted core boards.
4. The method for designing the pin heat dissipation structure of the through hole of the PCB component as recited in claim 3, wherein the core boards connected with the through hole pin are divided into a reserved core board and a deleted core board, and the method specifically comprises the following steps:
and when the through hole pin is a grounding pin, selecting the core board with the same number as the maximum allowable connecting layer as the reserved layer core board.
5. The method for designing the pin heat dissipation structure of the through hole of the PCB component as recited in claim 3, wherein the core boards connected with the through hole pin are divided into a reserved core board and a deleted core board, and the method specifically comprises the following steps:
and when the through hole pin is a grounding pin, selecting a plurality of layers of core boards close to the surface layer core board as the reserved layer core board.
6. The method for designing the pin heat dissipation structure of the through hole of the PCB component as recited in claim 1, further comprising:
when the through hole pin is an SMT device pin, a plurality of discretely distributed wiring forbidden regions for forming patterned welding pads are reserved in the circumferential direction of the through hole in the heat dissipation packaging.
7. The method for designing the pin heat dissipation structure of the through hole of the PCB component as recited in claim 6, further comprising:
when the through hole pin is an SMT device pin, a conductive skin used for improving the through-current performance of the through hole pin is laid on the surface of the core plate on the surface layer.
8. The utility model provides a PCB components and parts through-hole pin heat radiation structure design system which characterized in that includes:
the core board acquisition module is used for acquiring the number of core board layers connected with the pins of the through holes on the PCB;
the core board dividing module is used for judging whether the number of the core boards is greater than the maximum allowable connecting number, if so, dividing the core boards connected with the through holes pin into reserved core boards and deleted core boards, wherein the number of the reserved core boards is less than or equal to the maximum allowable connecting number;
and the packaging setting module is used for setting heat dissipation packaging at the through hole of each deleted layer core board and reserving a wiring forbidden ring in the heat dissipation packaging along the circumferential direction of the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011314651.XA CN112738977A (en) | 2020-11-20 | 2020-11-20 | Design method and system for pin heat dissipation structure of through hole of PCB component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011314651.XA CN112738977A (en) | 2020-11-20 | 2020-11-20 | Design method and system for pin heat dissipation structure of through hole of PCB component |
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|---|---|
| CN112738977A true CN112738977A (en) | 2021-04-30 |
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|---|---|---|---|
| CN202011314651.XA Withdrawn CN112738977A (en) | 2020-11-20 | 2020-11-20 | Design method and system for pin heat dissipation structure of through hole of PCB component |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114218886A (en) * | 2021-11-29 | 2022-03-22 | 北京百度网讯科技有限公司 | Method and device for realizing patterned bonding pad, electronic equipment and storage medium |
-
2020
- 2020-11-20 CN CN202011314651.XA patent/CN112738977A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114218886A (en) * | 2021-11-29 | 2022-03-22 | 北京百度网讯科技有限公司 | Method and device for realizing patterned bonding pad, electronic equipment and storage medium |
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Application publication date: 20210430 |
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| WW01 | Invention patent application withdrawn after publication |