CN112706055A - Nano SiC fluid electrostatic atomization diamond wire saw cutting method - Google Patents

Nano SiC fluid electrostatic atomization diamond wire saw cutting method Download PDF

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Publication number
CN112706055A
CN112706055A CN202011361614.4A CN202011361614A CN112706055A CN 112706055 A CN112706055 A CN 112706055A CN 202011361614 A CN202011361614 A CN 202011361614A CN 112706055 A CN112706055 A CN 112706055A
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China
Prior art keywords
fluid
cutting
nano sic
saw wire
nano
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Pending
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CN202011361614.4A
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Chinese (zh)
Inventor
姚春燕
陈冬冬
许凯翔
王鸿炳
许雪峰
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Zhejiang University of Technology ZJUT
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Zhejiang University of Technology ZJUT
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Priority to CN202011361614.4A priority Critical patent/CN112706055A/en
Publication of CN112706055A publication Critical patent/CN112706055A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/06Grinders for cutting-off
    • B24B27/0633Grinders for cutting-off using a cutting wire
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M169/00Lubricating compositions characterised by containing as components a mixture of at least two types of ingredient selected from base-materials, thickeners or additives, covered by the preceding groups, each of these compounds being essential
    • C10M169/04Mixtures of base-materials and additives
    • C10M169/048Mixtures of base-materials and additives the additives being a mixture of compounds of unknown or incompletely defined constitution, non-macromolecular and macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2201/00Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/10Compounds containing silicon
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2209/00Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
    • C10M2209/10Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/103Polyethers, i.e. containing di- or higher polyoxyalkylene groups
    • C10M2209/104Polyethers, i.e. containing di- or higher polyoxyalkylene groups of alkylene oxides containing two carbon atoms only
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2209/00Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
    • C10M2209/12Polysaccharides, e.g. cellulose, biopolymers

Abstract

A cutting method of a nano SiC fluid electrostatic atomization diamond wire saw comprises the following steps: 1) preparing a nano SiC fluid by using nano silicon carbide, polyethylene glycol and sodium carboxymethyl cellulose as raw materials; 2) the nano SiC fluid is sprayed onto the diamond saw wire through the nozzle, and the nozzle sprays the vaporific nano SiC fluid with negative electricity to the saw wire due to the fact that the nozzle is connected with the high-voltage static electricity generating device with negative electricity; because the diamond saw wire is grounded, the sprayed nano SiC cutting fluid can be adsorbed on the diamond saw wire and is brought into a cutting area in the cutting process of the reciprocating motion of the saw wire; due to the nanometer size effect, the nanometer SiC particles can form a physical adsorption film between the saw wire and the workpiece; meanwhile, the addition of the nano SiC increases the conductivity of the cutting fluid, so that the sawing force in the cutting process is reduced, and the edge breakage width of the workpiece is reduced. The invention improves the cutting efficiency of the saw wire and the surface quality of the workpiece, and reduces the subsequent processing cost.

Description

Nano SiC fluid electrostatic atomization diamond wire saw cutting method
Technical Field
The invention belongs to the technical field of diamond wire saw cutting, and particularly relates to a nano SiC fluid electrostatic spraying diamond wire saw cutting method.
Background
In the traditional diamond wire saw cutting, because the heat generated in the cutting process is large, the water-based cutting fluid with high water content is commonly used for lubricating and cooling. However, the poor lubricating performance of the water-based cutting fluid causes a plurality of grooves and cuts on the surface of the workpiece, which increases the subsequent processing cost and also causes the cutting efficiency to be low.
Aiming at the defect of poor lubricating property of cutting fluid in diamond wire saw cutting, two methods are mainly adopted at present, namely: the supply amount of the cutting fluid in the cutting process is increased. This is the method that most enterprises adopted at present, but because the cutting fluid that gets into the cutting region is certain, improve the supply of cutting fluid and can cause cutting fluid's a large amount of wastes, increase the cost of follow-up treatment, do not accord with the theory of environmental protection. The second method comprises the following steps: various oily additives are added into the cutting fluid to improve the lubricating property of the cutting fluid. This method increases the lubricating performance of the cutting fluid to some extent, but at the same time reduces the cooling performance of the cutting fluid, thereby causing warping of the workpiece.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides the nano SiC fluid electrostatic atomization diamond wire saw cutting method, which improves the wire saw cutting efficiency and the surface quality of a workpiece and reduces the subsequent processing cost.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a cutting method of a nano SiC fluid electrostatic atomization diamond wire saw comprises the following steps:
1) preparing a nano SiC fluid by using nano silicon carbide, polyethylene glycol and sodium carboxymethylcellulose as raw materials, wherein a base solution in the nano SiC fluid is deionized water, the mass fraction of the nano SiC is 0.1-0.3 wt%, the mass fraction of the polyethylene glycol is 4-8 wt%, and the mass fraction of the sodium carboxymethylcellulose is 0.4-0.6 wt%;
2) the nano SiC fluid is sprayed onto the diamond saw wire through the nozzle, and the nozzle sprays the vaporific nano SiC fluid with negative electricity to the saw wire due to the fact that the nozzle is connected with the high-voltage static electricity generating device with negative electricity; because the diamond saw wire is grounded, the sprayed nano SiC cutting fluid can be adsorbed on the diamond saw wire and is brought into a cutting area in the cutting process of the reciprocating motion of the saw wire;
due to the nanometer size effect, the nanometer SiC particles can form a physical adsorption film between the saw wire and the workpiece, so that the shearing strength between friction pairs is reduced, the effects of friction reduction and wear resistance are achieved, and the surface quality of the workpiece is improved; meanwhile, the addition of the nano SiC increases the conductivity of the cutting fluid, so that the sawing force in the cutting process is reduced, and the edge breakage width of the workpiece is reduced.
Further, in the step 2), the nano SiC fluid is supplied by adopting an electrostatic atomization mode, so that the saw wire is favorable for adsorbing more cutting fluid and bringing the cutting fluid into a cutting area for lubrication.
Preferably, the nozzle is connected with an air pump.
The technical conception of the invention is as follows: the researches of domestic and foreign scholars find that the nanoparticles used as the additive can obviously improve the tribological performance of the water-based lubricant, because the nanoparticles easily enter a friction interface to form a lubricating film, the friction pair is effectively separated, the ball effect is generated on the friction interface, pits generated by friction are filled, and the lubricating performance is improved. The addition of the nano material can improve the micro-lubricating property of the cutting fluid and effectively reduce the processing temperature and the cutter abrasion. The nano SiC has excellent toughness, higher strength and heat dissipation performance, can resist oxidation at high temperature and has high chemical stability. Therefore, the present invention prepares a nano SiC fluid and supplies it by means of electrostatic atomization. The cutting fluid is adsorbed on the surface of the saw wire under the action of static electricity, and the nano SiC particles in the cutting fluid are beneficial to improving the lubricating property of the cutting fluid along with the saw wire entering a cutting area, so that the cutting efficiency of the saw wire and the surface quality of a workpiece are improved, and the subsequent processing cost is reduced.
The invention has the following beneficial effects: the cutting efficiency of the saw wire and the surface quality of the workpiece are improved, and the subsequent processing cost is reduced.
Drawings
FIG. 1 is a schematic illustration of the principles of the practice of the present invention;
in the figure, 1, a workpiece; 2. sawing wires by using diamond; 3. an air pump; 4. a static electricity generating device; 5. a nozzle; 6. and (4) nano SiC fluid.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
Referring to fig. 1, a cutting method of a nano SiC fluid electrostatic atomization diamond wire saw comprises the following steps:
1) preparing a nano SiC fluid by using nano silicon carbide, polyethylene glycol and sodium carboxymethylcellulose as raw materials, wherein a base solution in the nano SiC fluid is deionized water, the mass fraction of the nano SiC is 0.1-0.3 wt%, the mass fraction of the polyethylene glycol is 4-8 wt%, and the mass fraction of the sodium carboxymethylcellulose is 0.4-0.6 wt%;
2) the nano SiC fluid is sprayed on the diamond saw wire 2 through a nozzle 5, and as the nozzle 5 is connected with a high-voltage electrostatic generating device 4 with negative electricity, the nozzle 5 sprays vaporous nano SiC fluid 6 with negative electricity to the saw wire; because the diamond saw wire 2 is grounded, the sprayed nano SiC cutting fluid can be adsorbed on the diamond saw wire and is brought into a cutting area in the cutting process of the reciprocating motion of the saw wire;
due to the nanometer size effect, the nanometer SiC particles can form a physical adsorption film between the saw wire and the workpiece 1, so that the shearing strength between friction pairs is reduced, the effects of friction reduction and wear resistance are achieved, and the surface quality of the workpiece is improved; meanwhile, the addition of the nano SiC increases the conductivity of the cutting fluid, so that the sawing force in the cutting process is reduced, and the edge breakage width of the workpiece is reduced.
Further, in the step 2), the nano SiC fluid is supplied by adopting an electrostatic atomization mode, so that the saw wire is favorable for adsorbing more cutting fluid and bringing the cutting fluid into a cutting area for lubrication.
Preferably, the nozzle 5 is connected to the air pump 3.
Example 1: in the step 1), the base solution in the nano SiC fluid is deionized water, the mass fraction of the nano SiC is 0.2 wt%, the mass fraction of the polyethylene glycol is 6 wt%, and the mass fraction of the sodium carboxymethylcellulose is 0.5 wt%.
In the example, the kerf width of the workpiece is 307.9 mu m, which is reduced by 0.9 percent compared with the case of not adding the nano SiC; the width of the edge breakage is 23.5 mu m, which is reduced by 21.4 percent compared with the case of not adding nano SiC; the surface roughness was 0.88 μm, which is a 26.7% reduction over the case without the addition of nano SiC.
Example 2: in the step 1), the base solution in the nano SiC fluid is deionized water, the mass fraction of the nano SiC is 0.1 wt%, the mass fraction of the polyethylene glycol is 4 wt%, and the mass fraction of the sodium carboxymethylcellulose is 0.4 wt%.
In the example, the kerf width of the workpiece is 307.8 mu m, which is reduced by 0.9 percent compared with the case of not adding the nano SiC; the edge breakage width is 27.2 mu m, which is reduced by 7.8 percent compared with the case of not adding nano SiC; the surface roughness is 1.08 μm, which is 10% less than that without the addition of nano SiC.
Example 3: in the step 1), the base solution in the nano SiC fluid is deionized water, the mass fraction of the nano SiC is 0.3 wt%, the mass fraction of the polyethylene glycol is 8 wt%, and the mass fraction of the sodium carboxymethylcellulose is 0.6 wt%.
In the example, the kerf width of the workpiece is 306 mu m, which is reduced by 1.4 percent compared with the case of not adding the nano SiC; the edge breakage width is 20 μm, which is reduced by 32.2% compared with the case of not adding nano SiC; the surface roughness is 0.92 mu m, which is reduced by 23.3 percent compared with the case without adding the nano SiC
The embodiments described in this specification are merely illustrative of implementations of the inventive concepts, which are intended for purposes of illustration only. The scope of the present invention should not be construed as being limited to the particular forms set forth in the examples, but rather as being defined by the claims and the equivalents thereof which can occur to those skilled in the art upon consideration of the present inventive concept.

Claims (3)

1. A cutting method of a nano SiC fluid electrostatic atomization diamond wire saw is characterized by comprising the following steps:
1) preparing a nano SiC fluid by using nano silicon carbide, polyethylene glycol and sodium carboxymethylcellulose as raw materials, wherein a base solution in the nano SiC fluid is deionized water, the mass fraction of the nano SiC is 0.1-0.3 wt%, the mass fraction of the polyethylene glycol is 4-8 wt%, and the mass fraction of the sodium carboxymethylcellulose is 0.4-0.6 wt%;
2) the nano SiC fluid is sprayed onto the diamond saw wire through the nozzle, and the nozzle sprays the vaporific nano SiC fluid with negative electricity to the saw wire due to the fact that the nozzle is connected with the high-voltage static electricity generating device with negative electricity; because the diamond saw wire is grounded, the sprayed nano SiC cutting fluid can be adsorbed on the diamond saw wire and is brought into a cutting area in the cutting process of the reciprocating motion of the saw wire;
due to the nanometer size effect, the nanometer SiC particles can form a physical adsorption film between the saw wire and the workpiece, so that the shearing strength between friction pairs is reduced, the effects of friction reduction and wear resistance are achieved, and the surface quality of the workpiece is improved; meanwhile, the addition of the nano SiC increases the conductivity of the cutting fluid, so that the sawing force in the cutting process is reduced, and the edge breakage width of the workpiece is reduced.
2. The method for cutting the nano SiC fluid by the electrostatic atomization diamond wire saw according to claim 1, wherein in the step 2), the nano SiC fluid is supplied in an electrostatic atomization mode, so that the saw wire can adsorb more cutting fluid and can be brought into a cutting area for lubrication.
3. The method for cutting the nano SiC fluid electrostatic atomization diamond wire saw according to claim 1 or 2, wherein the nozzle is connected with a gas pump.
CN202011361614.4A 2020-11-27 2020-11-27 Nano SiC fluid electrostatic atomization diamond wire saw cutting method Pending CN112706055A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113927764A (en) * 2021-09-27 2022-01-14 西安奕斯伟材料科技有限公司 Multi-wire cutting device and multi-wire cutting method
CN114418206A (en) * 2022-01-10 2022-04-29 广东气派科技有限公司 ESD (electro-static discharge) field control method on GaN (gallium nitride) product

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Publication number Priority date Publication date Assignee Title
US20090032006A1 (en) * 2007-07-31 2009-02-05 Chul Woo Nam Wire saw process
CN102433191A (en) * 2011-10-24 2012-05-02 江西赛维Ldk太阳能高科技有限公司 Silicon carbide cutting fluid and using method thereof
CN106398814A (en) * 2015-08-02 2017-02-15 姹ゅ浆 Composite cutting fluid for solar silicon wafer
CN108466156A (en) * 2018-02-28 2018-08-31 浙江工业大学 A kind of absorption free abrasive grain wiresaw cutting method certainly
CN109465728A (en) * 2018-12-10 2019-03-15 宁波职业技术学院 A kind of electrostatic spray diamond wire saw cutting process

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090032006A1 (en) * 2007-07-31 2009-02-05 Chul Woo Nam Wire saw process
CN102433191A (en) * 2011-10-24 2012-05-02 江西赛维Ldk太阳能高科技有限公司 Silicon carbide cutting fluid and using method thereof
CN106398814A (en) * 2015-08-02 2017-02-15 姹ゅ浆 Composite cutting fluid for solar silicon wafer
CN108466156A (en) * 2018-02-28 2018-08-31 浙江工业大学 A kind of absorption free abrasive grain wiresaw cutting method certainly
CN109465728A (en) * 2018-12-10 2019-03-15 宁波职业技术学院 A kind of electrostatic spray diamond wire saw cutting process

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
姚春燕,陈冬冬等: "Study on nano silicon carbide water-based cutting fluid in polysilicon cutting,https://www.sciencedirect.com/science/article/pii/S1369800120314463", 《MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING》 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113927764A (en) * 2021-09-27 2022-01-14 西安奕斯伟材料科技有限公司 Multi-wire cutting device and multi-wire cutting method
CN114418206A (en) * 2022-01-10 2022-04-29 广东气派科技有限公司 ESD (electro-static discharge) field control method on GaN (gallium nitride) product
CN114418206B (en) * 2022-01-10 2023-05-23 广东气派科技有限公司 ESD field control method on GaN product

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Application publication date: 20210427