CN112702020A - Miniaturized multichannel frequency conversion component for enemy and my people - Google Patents
Miniaturized multichannel frequency conversion component for enemy and my people Download PDFInfo
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- CN112702020A CN112702020A CN202011575597.4A CN202011575597A CN112702020A CN 112702020 A CN112702020 A CN 112702020A CN 202011575597 A CN202011575597 A CN 202011575597A CN 112702020 A CN112702020 A CN 112702020A
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- 239000012212 insulator Substances 0.000 claims abstract description 18
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- 238000010586 diagram Methods 0.000 description 3
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- 238000004806 packaging method and process Methods 0.000 description 3
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03D—DEMODULATION OR TRANSFERENCE OF MODULATION FROM ONE CARRIER TO ANOTHER
- H03D7/00—Transference of modulation from one carrier to another, e.g. frequency-changing
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Abstract
The invention discloses a miniaturized multi-channel frequency conversion component for enemies and peoples, wherein a bare chip is selected as a front device, an encapsulated device is selected as a back device, the front device is assembled by a micro-assembly process, the back device is assembled by an SMT encapsulated device, and radio frequency and control signals on the front side and the back side are transited by insulators. The working frequency band covers 0.7-1.6GHz, the output frequency is 70 +/-12 MHz, stray and harmonic wave are suppressed to be less than or equal to 50dBc, and dynamic 50dB is output; the through-wall technology based on the radio frequency insulator is adopted to realize the interconnection and power division of local oscillator radio frequency signals, the integration level is improved and the size of the assembly is reduced under the condition of not reducing the performance.
Description
Technical Field
The invention belongs to the field of microwave communication, and particularly relates to a miniaturized multi-channel frequency conversion assembly for friend or foe.
Background
In recent years, military and aerospace electronic equipment are developed to be light, thin and short, and the requirements for high density, high function and high speed of circuit components are more and more urgent. The miniaturized multi-channel frequency conversion component for the enemy and my on the ground is used as a core part of a microwave system of electronic reconnaissance equipment on the ground, and the miniaturized design of the miniaturized multi-channel frequency conversion component is of great significance.
At present, for a multi-channel frequency conversion system for enemies and peoples, a plurality of frequency conversion channels are integrated into one box body, the frequency conversion channels adopting a micro-assembly process are arranged on the front side, and a control and power supply circuit is arranged on the back side. The local oscillation signal power distribution network is designed by adopting an independent box body. The frequency conversion channel box body is connected with the local oscillator signal power distribution network box body through 4 radio frequency cables. Because the frequency conversion channel and the power distribution network are respectively designed by the two box bodies, the occupied area of the whole system is larger, and the two box bodies are connected by the cable, so that an independent radio frequency cable needs to be manufactured, and the assembly time and the assembly cost of the whole system can be increased.
The local oscillator power distribution network and the frequency conversion channel are designed under the condition that the box bodies are on the same side, on one hand, the whole area of the module can be increased, and on the other hand, the local oscillator signal and the frequency conversion link are crossed. To avoid the local oscillator signal crossing the rf link, multi-layer board technology is used, which results in increased circuit cost.
Disclosure of Invention
The invention aims to provide a miniaturized multi-channel friend or foe frequency conversion component, which compresses a frequency conversion channel and a local oscillator power distribution network into a box body under the condition of ensuring that the height of the box body is not changed, omits a radio frequency cable between the local oscillator power distribution network box body and the frequency conversion channel, simplifies the assembly steps of a system, accelerates the assembly speed of the whole module, reduces the cost of the whole system, and effectively reduces the occupied area of the whole system.
The technical solution for realizing the purpose of the invention is as follows: the utility model provides a miniaturized multichannel enemy me frequency conversion subassembly which characterized in that: the working frequency band covers 0.7-1.6GHz, the output frequency is 70 +/-12 MHz, the stray and harmonic wave is suppressed to be less than or equal to 50dBc, and the output dynamic is 50 dB; the through-wall technology based on the radio frequency insulator is adopted to realize the interconnection and power division of local oscillator radio frequency signals, the integration level is improved and the size of the assembly is reduced under the condition of not reducing the performance.
Miniaturized multichannel friend or foe frequency conversion subassembly, including box body, local oscillator merit divide the circuit, the primary amplifier, four secondary amplifiers and four frequency conversion passageways, the local oscillator merit divides the amplifier network to fix at the box body back, the primary amplifier, four secondary amplifiers and four frequency conversion passageways fix at the box body openly, positive frequency conversion passageway adopts radio frequency insulator to interconnect with the local oscillator merit at the back, local oscillator signal is after the amplification of primary amplifier, the input local oscillator merit divides the circuit to divide into 4 ways, 4 ways local oscillator signal correspond 4 frequency conversion passageways of input after the secondary amplifier is enlargied respectively.
Compared with the prior art, the invention has the remarkable advantages that:
(1) the invention integrates 4-channel friend or foe frequency conversion components, and the module height is 10mm, compared with the prior independent single-channel frequency conversion module, the invention not only has more compact total volume, but also has the height reduced to 10 mm.
(2) The local oscillator power division amplification module and the friend or foe frequency conversion assembly are integrated, so that cables which are interconnected among the modules are reduced, the size of the modules required by realizing functions is reduced, and the production cost of the assembly is reduced.
(3) The circuit at the back of the assembly is assembled by adopting the SMT surface-mounted device, and then is fixed on the structural member by using screws, so that the assembly difficulty is reduced, the assembly time of the assembly is shortened, and the production cost of the assembly is reduced.
(4) Local oscillation signals inside the assembly are interconnected on the front side and the back side through radio frequency insulators, so that the assembly difficulty is effectively reduced, and the reliability of signal interconnection is improved.
Drawings
Fig. 1 is a schematic circuit diagram of a miniaturized multi-channel frequency conversion module according to an embodiment of the present invention.
Fig. 2 is a block diagram of a local oscillator power division principle.
Fig. 3 is a circuit configuration diagram.
Detailed Description
The present invention is described in further detail below with reference to the attached drawing figures.
The invention mainly aims at the miniaturization multichannel frequency conversion component of the ground electronic reconnaissance equipment, effectively reduces the electronic reconnaissance volume of a microwave subsystem by adopting the design of insulator interpenetrating radio frequency signals, realizes the miniaturization of the system, has obvious advantages compared with a component assembly integration mode in volume and weight, and meets the actual engineering requirements. The front device is a bare chip, the back device is a packaging device, the front is assembled by a micro-assembly process, the back is assembled by an SMT packaging device, and radio frequency and control signals on the front and the back are transited by insulators.
The following detailed description of the embodiments of the invention is provided in connection with the accompanying drawings.
With reference to fig. 1 and fig. 2, the miniaturized multi-channel frequency conversion module for friend or foe includes a box, a local oscillation power dividing circuit, a first-stage amplifier, four second-stage amplifiers, and four frequency conversion channels. The local oscillator power dividing and amplifying network is fixed on the back face of the box body, the primary amplifier, the four secondary amplifiers and the four frequency conversion channels are fixed on the front face of the box body, the frequency conversion channels on the front face and the local oscillator power dividing circuit on the back face are interconnected through radio frequency insulators, the local oscillator signals are amplified by the primary amplifier, the input local oscillator power dividing circuit is divided into 4 paths, and the 4 paths of local oscillator signals are correspondingly input into the 4 frequency conversion channels after being amplified by the secondary amplifiers respectively.
Each frequency conversion channel comprises a first low noise amplifier, a first-stage filter, a frequency mixer, a second-stage filter, a second-stage amplifier, a third-stage filter and a power divider which are connected in sequence; the secondary amplifier is connected with the mixer. The signal after power division is divided into two paths, one path is output to a detector, and the other path outputs an intermediate frequency signal to a digital part.
The received power range of a 0.7-1.6GHz signal received by the frequency conversion component is-64 dBm to-14 dBm, the signal passes through a first-stage low-noise amplifier and then is selectively filtered by a radio frequency filter to obtain a harmonic signal and an image signal, the image suppression of the signal reaches more than 50dBc, the signal is converted into a 70MHz intermediate frequency signal after frequency mixing, the local oscillator and the radio frequency signal are filtered by a band-pass filter and then are amplified and then are divided into two paths by a power divider, one path of the signal is detected by a large dynamic detector to obtain a corresponding TTL signal, the other path of the signal outputs the intermediate frequency signal, and the output power range of the signal is-41 dBm to +5 d.
The back local oscillator power dividing circuit adopts an independent circuit design, selects a packaging device and the most common double-sided circuit board, is assembled by using an SMT (surface mounting technology), and is installed on the back of the box body through screws after the assembly is completed. The local oscillator signals enter from the front side of the box body, are transmitted into the back power dividing circuit through the radio frequency insulator after being amplified, and are transmitted to the front side circuit through the radio frequency insulator after being subjected to power dividing, and are mixed with the channel circuit. Referring to fig. 3, the front microwave circuit and the back local oscillator power dividing circuit are interconnected by a radio frequency insulator. On the basis of guaranteeing the radio frequency performance, use the radio frequency insulator easily to assemble, reduced the assembly degree of difficulty, reduced the assemble duration, effectual improved production efficiency simultaneously because the back merit divides the circuit to use for ordinary double sided board, can effectual reduction processing cost.
The whole module size is 78 multiplied by 98 multiplied by 10mm3Compared with the traditional design method, the local oscillator power dividing circuit is designed inside the assembly, the front radio frequency signal and the back radio frequency signal are interconnected through the radio frequency insulator, 4 interconnected cables of one module and the interconnection between the module and the module can be omitted under the condition that the thickness of the assembly is not increased, and the occupied volume of the module is effectively reduced under the condition that the performance is guaranteed. The working frequency band covers 0.7-1.6GHz, the output frequency is 70 +/-12 MHz, stray and harmonic wave are suppressed to be less than or equal to 50dBc, and dynamic 50dB is output; the through-wall technology based on the radio frequency insulator is adopted to realize the interconnection and power division of local oscillator radio frequency signals, the integration level is improved and the size of the assembly is reduced under the condition of not reducing the performance.
Claims (7)
1. The utility model provides a miniaturized multichannel enemy me frequency conversion subassembly which characterized in that: the working frequency band covers 0.7-1.6GHz, the output frequency is 70 +/-12 MHz, the stray and harmonic wave is suppressed to be less than or equal to 50dBc, and the output dynamic is 50 dB; the through-wall technology based on the radio frequency insulator is adopted to realize the interconnection and power division of local oscillator radio frequency signals, the integration level is improved and the size of the assembly is reduced under the condition of not reducing the performance.
2. A miniaturized multi-channel friend or foe frequency conversion package according to claim 1, wherein: the local oscillator power distribution amplifying network is fixed on the back face of the box body, the first-stage amplifier, the four second-stage amplifiers and the four frequency conversion channels are fixed on the front face of the box body, the front frequency conversion channels and the back local oscillator power distribution circuit are interconnected through radio frequency insulators, after local oscillator signals are amplified by the first-stage amplifier, the input local oscillator power distribution circuit is divided into 4 paths, and the 4 paths of local oscillator signals are amplified by the second-stage amplifiers and then correspondingly input into the 4 frequency conversion channels.
3. A miniaturized multi-channel friend or foe frequency conversion package according to claim 2, wherein: each frequency conversion channel comprises a first low noise amplifier, a first-stage filter, a frequency mixer, a second-stage filter, a second-stage amplifier, a third-stage filter and a power divider which are connected in sequence; the secondary amplifier is connected with the mixer;
the frequency conversion channel receives 0.7-1.6GHz enemy and my radio frequency signals, the received power range is-64 dBm- + 14dBm, the enemy and my radio frequency signals pass through the first-stage low noise amplifier and then pass through the first-stage filter to selectively filter harmonic signals and image signals, the image rejection of the enemy and my radio frequency signals reaches more than 50dBc, the enemy and my radio frequency signals pass through the mixer and are converted into 70MHz intermediate frequency signals together with the second-stage amplified local oscillator signals, the local oscillator and radio frequency signals are filtered through the second-stage filter and then are amplified through the second-stage amplifier, the third-stage amplifier and the third-stage filter, the enemy and my radio frequency signals pass through the power divider to be divided into two paths, one path passes through the detector to detect corresponding TTL signals, the other path outputs intermediate frequency signals.
4. A miniaturized multi-channel friend or foe frequency conversion package according to claim 2 or 3, characterized in that: the first-stage amplifier, the four second-stage amplifiers and the four frequency conversion channels are fixed on the front surface of the box body through micro-assembly.
5. A miniaturized multi-channel friend or foe frequency conversion package according to claim 2, wherein: the local oscillator power dividing circuit is assembled by using an SMT (surface mount technology) process, and is fixed on the back of the box body through screws after assembly is completed.
6. A miniaturised multi-channel friend or foe frequency conversion assembly according to claim 2 or 5 wherein: the local oscillator signals enter from the front side of the box body, are amplified by the first-stage amplifier and then are transmitted to the back local oscillator power dividing circuit through the radio frequency insulator, and the local oscillator signals which are power divided by the local oscillator power dividing circuit are transmitted to the front second-stage amplifier through the radio frequency insulator and then are amplified and respectively input into corresponding frequency conversion channels to be mixed with the frequency conversion channel circuit.
7. A miniaturized multi-channel friend or foe frequency conversion package according to any of claims 1 or 6, characterized in that: the whole module size is 78 multiplied by 98 multiplied by 10mm3。
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| CN202011575597.4A CN112702020A (en) | 2020-12-28 | 2020-12-28 | Miniaturized multichannel frequency conversion component for enemy and my people |
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| CN202011575597.4A CN112702020A (en) | 2020-12-28 | 2020-12-28 | Miniaturized multichannel frequency conversion component for enemy and my people |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114421984A (en) * | 2021-12-22 | 2022-04-29 | 中国航天科工集团八五一一研究所 | Miniaturized binary channels millimeter wave frequency conversion subassembly |
| CN116644695A (en) * | 2023-03-23 | 2023-08-25 | 中国航天科工集团八五一一研究所 | L-band local oscillator integrated multichannel miniaturized variable frequency component design method |
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| CN116644695A (en) * | 2023-03-23 | 2023-08-25 | 中国航天科工集团八五一一研究所 | L-band local oscillator integrated multichannel miniaturized variable frequency component design method |
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