CN116644695A - L-band local oscillator integrated multichannel miniaturized variable frequency component design method - Google Patents
L-band local oscillator integrated multichannel miniaturized variable frequency component design method Download PDFInfo
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Abstract
The invention discloses a design method of an L-band local oscillator integrated multi-channel miniaturized variable frequency component, which is suitable for ground electronic reconnaissance equipment, adopts a surface mounted device and a miniaturized local oscillator source through the integration of functions of multiple components, adopts the interpenetrating technology of radio frequency signals in front and back cavities of the component, ingeniously utilizes the height of the cavities in structural members of the component, reasonably divides the space occupied by each circuit, effectively reduces the volume of the L-band multi-channel variable frequency component in a microwave subsystem, realizes the miniaturization of the component, has obvious advantages in terms of volume and weight compared with the integration mode of partial components, and meets the actual engineering needs.
Description
Technical Field
The invention belongs to the microwave communication technology, and particularly relates to a design method of an L-band local oscillator integrated multichannel miniaturized variable frequency component.
Background
In recent years, military and aerospace electronic equipment is developed to be light, thin, short and small, and the requirements for high density, high function and high speed of circuit components are more and more urgent. The L-band local oscillator integrated multi-channel miniaturized frequency conversion assembly is used as a core part of a microwave system of certain ground electronic reconnaissance equipment, and the miniaturized design method has important significance.
At present, for a multichannel variable frequency system, a plurality of variable frequency channels are integrated in a box body, the front surface is the variable frequency channel adopting a micro-assembly process, and the back surface is designed to be a power supply and filter circuit. The local oscillation signal is generated by a local oscillation source module. The local oscillator signal power division network is designed by adopting an independent box body. The variable frequency channel box body is connected with the local oscillator signal power division network module through 4 radio frequency cables. Because two boxes are adopted to design a frequency conversion channel and a power division network respectively, a local oscillator source module is required to provide local oscillator signals, the occupied area of the whole system is large, and the three boxes are connected by adopting cables, so that independent radio frequency cables are required to be manufactured, and the assembly time and the assembly cost of the whole system can be increased.
Under the condition that the local oscillator power division network and the frequency conversion channel are designed on the same surface of the box body, on one hand, the whole area of the module can be increased, and on the other hand, the situation that local oscillator signals and the frequency conversion channel are crossed can be encountered. In order to avoid the cross between the local oscillation signal and the radio frequency link, a multi-layer board technology is used, which causes the rise of circuit cost.
Under the condition that the reference signal amplifying power dividing module is assembled by using one box body independently, the number of the modules can be increased, so that the occupied volume of the modules is increased, meanwhile, the cables are required to be increased to connect the reference signals with the local oscillator source circuit, and the assembly time and the assembly cost of the whole system are increased.
Disclosure of Invention
The invention provides an L-band local oscillator integrated formDesign method of multichannel miniaturized frequency conversion assembly with assembly size of 78×98×10mm 3 In the case of (2), 4 components would be required: the frequency conversion channel, the vibration source and the local oscillation power division network are integrated into 1 component, the number of the components with corresponding functions is reduced, meanwhile, radio frequency cables between the local oscillation source component and the local oscillation power division component, between the local oscillation power division component and the frequency conversion channel and between the reference signal amplifying power division component and the local oscillation source component are omitted, the assembly steps of the system are simplified, the assembly speed of the whole module is accelerated, the cost of the whole system is reduced, and meanwhile, the occupied area of the whole system is effectively reduced.
The technical scheme for realizing the invention is as follows: a design method of an L-band local oscillator integrated multichannel miniaturized variable frequency component comprises the following steps:
s1: according to the size requirement and the function requirement of the L-band local oscillator integrated multi-channel miniaturized frequency conversion component in the radio frequency receiver, the functional circuit which is needed to be contained in the L-band local oscillator integrated multi-channel miniaturized frequency conversion component is manufactured, and the functional circuit is specifically as follows:
the L-band local oscillation integrated multichannel miniaturized variable frequency component is limited at the size of 78 multiplied by 98 multiplied by 10mm 3 Is arranged in the box body structure.
The L-band local oscillator integrated multichannel miniaturized frequency conversion assembly comprises 4 mutually independent frequency conversion channels, 1 local oscillator source circuit, 1 local oscillator power dividing circuit, 1 local oscillator reference signal amplifying power dividing circuit and a power supply filter circuit. The 4 independent frequency conversion channels down-convert the received 4 paths of L-band radio frequency signals to 70MHz; the main function of the vibration source circuit is to generate local oscillation signals required by a frequency conversion channel; the local oscillation power dividing circuit is used for dividing the local oscillation signals generated by the local oscillation source circuit into power and respectively sending the power to 4 frequency conversion channels; the local oscillator reference signal amplifying power dividing circuit has the main functions of amplifying and dividing the reference signal input into the frequency conversion assembly, ensuring that the amplitude of the signal after power division is consistent with that of the signal input into the assembly, and sending the local oscillator reference signal after power division into the local oscillator source circuit in one path and outputting the local oscillator reference signal as the local oscillator reference signal of the next similar assembly in one path. The main function of the power supply filter circuit is to stabilize the voltage of the input component to the voltage value required by the device and perform filter processing.
The process proceeds to step S2.
S2: according to the functional index requirement of the radio frequency receiver on the L-band local oscillator integrated multi-channel miniaturized frequency conversion assembly, the functions realized by the L-band local oscillator integrated multi-channel miniaturized frequency conversion assembly are analyzed, a corresponding scheme block diagram is made, and the step S3 is carried out.
S3: according to the scheme block diagram in the step S2, the heights of all parts of the component structure are calculated, and the packaging type of the device is determined. The front microwave circuit of the assembly is designed by adopting a bare chip, the local oscillator source circuit, the local oscillator power dividing circuit and the local oscillator reference signal amplifying power dividing circuit on the back of the assembly adopt encapsulated surface mounted devices, the power supply filter circuit adopts a low-profile surface mounted voltage stabilizer and 0603 encapsulated capacitor resistors, and the step S4 is carried out.
The front side of the whole assembly is assembled and processed by adopting a micro-assembly process, the front side is provided with 4 independent frequency conversion channels, and the frequency conversion channels on the front side of the assembly are made of radio frequency bare chips serving as main devices in frequency conversion channel links. The back of the component comprises a local oscillation source circuit, a local oscillation power dividing circuit, a local oscillation reference signal amplifying power dividing circuit and a power supply filter circuit. The miniature packaged surface-mounted local oscillator source is selected as a main device of the local oscillator source circuit, the packaged surface-mounted power divider is selected as a main device of the local oscillator power divider circuit, and the 0603 packaged resistor and the packaged surface-mounted amplifier are selected as main devices of the local oscillator reference signal amplifying power divider circuit. The low-profile surface-mounted voltage stabilizer and 0603 packaged capacitor resistor are selected as main devices of a power supply filter circuit
S4: and (5) according to the assembly form and the device package determined in the step (S3), designing a schematic diagram according to the technical indexes of the components, and turning to the step (S5).
S5: according to the schematic diagram, the front side of the assembly adopts an RO5880 double-sided printed board with the thickness of 0.254mm, and the front side of the assembly is provided with 4 independent radio frequency channel links. The back of the component is a 4-layer printed board with the thickness of 0.6mm and the material of FR4, and the area, which faces the printed board of the cover plate, of the back of the component is close to the radio frequency input interface and is a local oscillation reference signal amplifying power division circuit. The back of the component corresponds to the front mixer circuit, the area facing the cover plate is a local oscillator power dividing circuit, and the area of the printed board facing the cavity side is a local oscillator source circuit. The back of the assembly is close to the assembly output port, and the power supply filter circuit is arranged towards the cover plate area. And the 3 rd layer of the multilayer printed board on the back of the cavity is a power supply signal circuit. After the components are divided into areas according to the implementation functions, the step S6 is performed.
S6: and (3) drawing a corresponding PCB layout according to the links, the devices and the circuit areas determined in the step (S4) and the step (S5), and turning to the step (S7).
S7: and (3) according to the device height determined in the step (S3), the circuit function area and layout design determined in the step (S5) and the step (S6), determining the cavity height distribution of the component, and carrying out structural design to go to the step (S8).
A cavity is dug between the two radio frequency channels from the back of the assembly by utilizing the structural space between the two channels in the middle of the front of the assembly, and a local oscillation source is placed on one side of the cavity of the back of the assembly, which faces the structural member, by utilizing the cavity. The local oscillator signals are connected through radio frequency insulators which are interconnected on the front side and the back side of the component, and the radio frequency insulators are connected with circuit boards on the front side and the back side of the component through build-up welding. The printed board on the front of the assembly is fixed on the structural member of the assembly through sintering. The multilayer printed board on the back of the assembly is fixed on the structural member of the assembly through screws.
S8: and processing and manufacturing the frequency conversion assembly according to the designed printed board diagram and the structure diagram.
Compared with the existing design method, the design method has the following advantages:
(1) The size of the assembly is 78X 98X 10mm 3 Under the condition of (1), the multichannel variable frequency channel, the local oscillator source circuit, the local oscillator source power dividing circuit, the reference signal amplifying power dividing circuit, the power supply and the filter circuit are compressed into a box body, and the functions of 4-5 components are realized in the prior art.
(2) The radio frequency cable for interconnecting the original discrete components is reduced, the assembly steps of the system are simplified, the assembly speed of the whole module is increased, and the assembly efficiency is improved.
(3) The functions which are finished by 4 components are integrated into 1 component, so that the cost of a printed board and structural parts required by processing the original components is saved, and the cost of the components is reduced.
(4) The reference signal amplifying power dividing circuit is integrated in the component, a box body and a cable interconnected with the box body can be omitted from being independently assembled for the reference power dividing circuit, and cost and occupied area of the component are saved. Meanwhile, an amplifier is adopted, so that the amplitude of a reference signal of an output assembly is consistent with that of an input reference signal, and a plurality of similar assemblies are convenient to interconnect.
(5) The local oscillator source module is integrated in the assembly, and partition walls between different channels of the front microwave circuit are used as cavities, so that independent assembly of the local oscillator source assembly and cables connected with the local oscillator source assembly are omitted, the weight of the whole assembly is reduced, the assembly process is simplified, the processing cost is reduced, and the production assembly efficiency is improved.
Drawings
Fig. 1 is a flow chart of a design method of an L-band local oscillator integrated multi-channel miniaturized frequency conversion assembly.
Fig. 2 is a functional block diagram of an implementation of the present invention.
Fig. 3 is a diagram of the dimensions of a structural stack in accordance with the present invention.
Fig. 4 is a schematic block diagram of the present vibration source and the local oscillation power division.
Fig. 5 is a schematic diagram of a single frequency conversion channel in an assembly.
Fig. 6 is a schematic diagram of reference signal amplification power division.
Fig. 7 is a diagram of a front side circuit distribution area of a component.
FIG. 8 is a circuit distribution area diagram of the back side of the component
Fig. 9 is a flow chart of the reference signal and the local oscillator signal in the component structure.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by one of ordinary skill in the art without creative efforts, are within the scope of the present invention based on the embodiments of the present invention.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present invention, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; the "connection" may be mechanical or electrical. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In addition, the technical solutions of the embodiments of the present invention may be combined with each other, but it is necessary to base that the technical solutions can be implemented by those skilled in the art, and when the technical solutions are contradictory or cannot be implemented, the combination of the technical solutions should be considered to be absent, and not included in the scope of protection claimed in the present invention.
The following describes the specific embodiments, technical difficulties and inventions of the present invention in further detail in connection with the present design examples.
The L-band local oscillator integrated multi-channel miniaturized variable frequency component design method is suitable for ground electronic reconnaissance equipment, adopts an insulator interpenetrating radio frequency signal, integrates a local oscillator source circuit, a local oscillator power dividing circuit and a reference signal amplifying power dividing circuit, effectively reduces the electronic reconnaissance volume of a microwave subsystem, realizes the miniaturization of the system, has obvious advantages compared with an integrated mode of the volume and the weight of the component, and meets the actual engineering requirements.
The implementation steps of the design method of the L-band local oscillator integrated multichannel miniaturized variable frequency component disclosed by the invention are described in detail below with reference to fig. 1 to 9:
s1: according to the size requirement and the function requirement of the L-band local oscillator integrated multi-channel miniaturized frequency conversion component in the radio frequency receiver, the functional circuit which is needed to be contained in the L-band local oscillator integrated multi-channel miniaturized frequency conversion component is manufactured, and the functional circuit is specifically as follows:
the L-band local oscillator integrated multichannel miniaturized frequency conversion assembly comprises 4 mutually independent frequency conversion channels, 1 local oscillator source circuit, 1 local oscillator power dividing circuit, 1 local oscillator reference signal amplifying power dividing circuit and a power supply filter circuit. The 4 independent frequency conversion channels down-convert the received 4 paths of L-band radio frequency signals to 70MHz; the main function of the vibration source circuit is to generate local oscillation signals required by a frequency conversion channel; the local oscillation power dividing circuit is used for dividing the local oscillation signals generated by the local oscillation source circuit into power and respectively sending the power to 4 frequency conversion channels; the local oscillator reference signal amplifying power dividing circuit has the main functions of amplifying and dividing the reference signal input into the frequency conversion assembly, ensuring that the amplitude of the signal after power division is consistent with that of the signal input into the assembly, and sending the local oscillator reference signal after power division into the local oscillator source circuit in one path and outputting the local oscillator reference signal as the local oscillator reference signal of the next similar assembly in one path. The main function of the power supply and filter circuit is to stabilize the voltage of the input assembly to the voltage value required by the device and to carry out filter treatment.
The L-band local oscillation integrated multichannel miniaturized variable frequency component is limited at the size of 78 multiplied by 98 multiplied by 10mm 3 Is arranged in the box body structure.
The process proceeds to step S2.
S2: according to the functional index requirement of the radio frequency receiver on the L-band local oscillator integrated multi-channel miniaturized frequency conversion component, the functional analysis is carried out on the L-band local oscillator integrated multi-channel miniaturized frequency conversion component, a corresponding scheme block diagram is made, as shown in fig. 2, and the step S3 is carried out.
S3: according to the scheme block diagram in the step S2, the heights of all parts of the component structure are calculated, and the packaging type of the device is determined. The front microwave circuit of the assembly is designed by adopting a bare chip, the local oscillator source circuit, the local oscillator power dividing circuit and the local oscillator reference signal amplifying power dividing circuit on the back of the assembly adopt encapsulated surface mounted devices, the power supply filter circuit adopts a low-profile surface mounted voltage stabilizer and 0603 encapsulated capacitor resistors, and the step S4 is carried out.
The total thickness of the L-band local oscillator integrated multichannel miniaturized variable frequency component is 10mm, the component structure of the component is that a front sealing cover plate is 0.8mm, a screw cover plate is 1mm, a cavity space is 3.2mm, a front microwave printed board and solder are 0.3mm, a structural part is 1mm, a back multilayer printed board of the component is 0.8mm, a cavity space is 2.1mm, and a back sealing cover plate is 0.8mm from top to bottom, as shown in fig. 3. The device height in the front cavity of the assembly cannot exceed 3.2mm and the device height in the back cavity cannot exceed 2.1mm, calculated according to the heights of the parts of the assembly. The front surface of the component adopts a radio frequency bare chip as a main device, compared with a packaged device, the area occupied by a circuit can be effectively reduced, the height of the device is 0.1mm, and the height of the device is not more than 0.3mm in addition to solder. The integrated type packaging PLS module circuit is selected as a local oscillation source module, compared with the traditional PLS, the module has the advantages of high integration level, small occupied area, good EMC effect, capability of effectively reducing electromagnetic influence between the integrated type packaging PLS module circuit and other circuits, convenience in assembly and capability of welding on the surface of a printed board by using an SMT technology. The envelope size of the module is 15 x 12 x 3mm, which is about 1/3 of the size of a conventionally designed local oscillator source module. The local oscillation power dividing circuit needs 2 stages of power dividers, and total 3 power dividers are shown in fig. 4. The power divider in the local oscillator power dividing circuit selects BW1601PQ4 packaged by the alumina ceramic tube shell, the working frequency range of the device is 0.5-1.5GHz, the packaging size is 4 x 1.1mm, compared with the integrated winding inductance height of 2.3mm, the device has lower height, can meet the assembly requirement of the component, and can be directly welded on a printed board by adopting an SMT technology. The size of the packaged power divider is about 1/4 of the size of the microstrip line power divider directly printed on the printed board in the same frequency range, the power divider has obvious advantages in occupied area, and the power divider is convenient to install in a welding mode, can be assembled with circuits on the back of other components, and saves assembly time. And a 0603 packaged resistor and a packaged surface mounted amplifier are selected as main devices of the local oscillator reference signal amplification power division circuit. The low-profile surface-mounted voltage stabilizer and the 0603 packaged capacitor resistor are selected as main devices of the power supply and filter circuit. The circuits in the cavity on the back of the assembly are all packaged devices, and all devices can be installed through one SMT, so that the assembly time can be effectively shortened, and the assembly efficiency is improved.
S4: and (5) according to the assembly form and the device package determined in the step (S3), designing a schematic diagram according to the technical indexes of the components, and turning to the step (S5).
The L-band local oscillation integrated multichannel miniaturized frequency conversion assembly comprises a local oscillation source circuit and a corresponding local oscillation power division circuit, as shown in fig. 4. The local oscillation source adopts an integrated package type miniaturized local oscillation source, and after a 100MHz local oscillation reference signal is input into the local oscillation source, local oscillation signals of corresponding frequency points are generated. And after the local oscillation signals are output, the local oscillation signals are output into 4 paths of local oscillation signals with constant amplitude and the like through a local oscillation power dividing circuit. The local oscillation power dividing circuit adopts a 2-level surface-mounted type packaging power divider, and outputs two paths of local oscillation signals with equal amplitude and the like after the local oscillation signals pass through the first-level local oscillation power divider, and the two paths of local oscillation signals pass through the second-level two local oscillation power dividers and output 4 paths of local oscillation signals with equal amplitude and the like.
The L-band local oscillator integrated multi-channel miniaturized frequency conversion component receives signals of 0.7-1.5GHz, the received power range is-64 dBm to-14 dBm, harmonic signals and mirror image signals are selectively filtered through a first-stage filter (radio frequency filter) after passing through a first-stage amplifier (low noise amplifier), the image rejection reaches more than 50dBc, the signals are mixed through a mixer and then converted into 70MHz intermediate frequency signals, the local oscillators and the radio frequency signals are filtered through a second-stage filter (band pass filter), the signals are amplified through a second-stage amplifier and a third-stage amplifier, the signals are filtered through a third-stage filter, and finally, two paths of signals are divided through a power divider, one path of signals is detected through a large dynamic detector, the other path of signals are output, and the output power range of the signals is-41 dBm to +5dBm, as shown in figure 5.
The L-band local oscillation integrated multichannel miniaturized frequency conversion assembly comprises a local oscillation reference signal amplifying power dividing circuit, the function of the circuit is to amplify and power divide the local oscillation reference signal of the input assembly, one path of the local oscillation reference signal after power division is input into the local oscillation source circuit to serve as the reference signal of the local oscillation module, and the other path of the local oscillation reference signal is output to serve as the local oscillation reference signal of the next-stage module. An amplifier with proper primary gain is selected and matched with a power divider, so that the amplitude of the local oscillation reference signal of the output assembly is ensured to be consistent with that of the local oscillation reference signal of the input assembly, as shown in fig. 6.
S5: according to the schematic diagram, the front side of the assembly adopts an RO5880 double-sided printed board with the thickness of 0.254mm, and the front side of the assembly is provided with 4 independent radio frequency channel links. The back of the component is a 4-layer printed board with the thickness of 0.6mm and the material of FR4, and the area, which faces the printed board of the cover plate, of the back of the component is close to the radio frequency input interface and is a local oscillation reference signal amplifying power division circuit. The back of the component corresponds to the front mixer circuit, the area facing the cover plate is a local oscillator power dividing circuit, and the area of the printed board facing the cavity side is a local oscillator source circuit. The back of the assembly is close to the assembly output port, and the power supply filter circuit is arranged towards the cover plate area. And the 3 rd layer of the multilayer printed board on the back of the cavity is a power supply signal circuit. After the components are divided into areas according to the implementation functions, the step S6 is performed.
The front side of the component is provided with a frequency conversion circuit with the same 4 paths of patterns, as shown in (1) of fig. 7, and (3) of the drawing is provided with a local oscillation source circuit with a printed board on the back side of the component facing the direction of the structural member, and the side view of the local oscillation source circuit is shown in fig. 9. In the back circuit of the component, (1) is a local oscillation reference signal amplifying power dividing circuit, (2) is a local oscillation power dividing circuit, (3) is a local oscillation source circuit facing to the direction of the structural member, and (4) is a power supply and filtering circuit. (1) (2) (4) the circuit devices are all oriented to the cover plate side of the assembly on the back surface printed board of the assembly, and (3) the circuit devices are oriented to the assembly structural member.
S6: and (3) drawing a corresponding PCB layout according to the links, the devices and the circuit areas determined in the step (S4) and the step (S5), and turning to the step (S7).
The front surface of the assembly adopts a conventional RO5880 double-sided board with the thickness of 0.254mm, the top layer is a microwave signal, and the bottom layer is a microwave ground. The back of the component adopts 4 layers of FR4 materials, devices are mainly arranged on the top layer and the bottom layer, microwave signals mainly flow through the top layer and the bottom layer through holes, and control and power supply signals are distributed on all layers.
The reference signal enters the assembly from the back of the assembly towards one side of the cover plate, passes through the reference signal power dividing and amplifying circuit, reaches one side of the assembly control board towards the structural member through the via hole, enters the local oscillation source circuit, reaches the surface of the circuit board towards one side of the cover plate through the via hole, and performs power division through the local oscillation power dividing circuit to generate 4 paths of local oscillation signals with equal amplitude and the like. The local oscillation signals after power division reach the microwave circuit on the front side of the component through the radio frequency insulator and enter the mixer on the front side of the component to be mixed, as shown in fig. 7. Through the mode, the structural member space between the front channels of the assembly can be fully utilized, the weight of the structural member is reduced, the problem that the height of the local oscillation source module is higher than that of the cavity on the back of the assembly is solved, and the integration level of the assembly is improved.
S7: according to the device height determined in the step S3, the circuit function areas and layout determined in the step S5 and the step S6 are designed, the cavity height distribution of the component is determined, and the structural design is carried out, so that the step S8 is carried out;
the front of the assembly has 4 identical variable frequency channel structures. A cavity is dug between the two radio frequency channels from the back of the assembly by utilizing the structural space between the two channels in the middle of the front of the assembly, and a local oscillation source is placed on one side of the printed board on the back of the assembly, which faces the structural component, by utilizing the cavity. The local oscillator signals are connected through radio frequency insulators which are interconnected on the front side and the back side of the component, and the radio frequency insulators are connected with circuit boards on the front side and the back side of the component through build-up welding. The printed board on the front of the assembly is fixed on the structural member of the assembly through sintering. The multilayer printed board on the back of the assembly is fixed on the structural member of the assembly through screws.
S8: and processing, manufacturing and verifying the variable frequency assembly according to the designed printed board diagram and the structure diagram.
The whole module size is 78×98×10mm 3 Compared with the traditional design method, the vibration source and the vibration source areThe vibration power dividing circuit and the reference signal amplifying power dividing circuit are designed in the 4-channel frequency conversion assembly. The functions realized by 5 components are changed into 1 component. Local oscillator signals are interpenetrating on the front and back sides of the printed board through holes, the radio frequency insulators are interpenetrating on the front and back cavities of the components, and the transmission of radio frequency signals between two mutually parallel planes is completed through vertical interpenetrating. Under the condition of ensuring the performance, the number of modules is effectively reduced, interconnection cables are omitted, the assembly efficiency is improved, and the cost of the assembly is saved.
Claims (5)
1. The design method of the L-band local oscillator integrated multichannel miniaturized variable frequency assembly is characterized by comprising the following steps of:
s1: according to the size requirement and the function requirement of the L-band local oscillator integrated multi-channel miniaturized frequency conversion component in the radio frequency receiver, the functional circuit which is needed to be contained in the L-band local oscillator integrated multi-channel miniaturized frequency conversion component is manufactured, and the functional circuit is specifically as follows:
the L-band local oscillation integrated multichannel miniaturized variable frequency component is limited at the size of 78 multiplied by 98 multiplied by 10mm 3 Is arranged in the box body structure;
the L-band local oscillator integrated multi-channel miniaturized frequency conversion assembly comprises 4 mutually independent frequency conversion channels, 1 local oscillator source circuit, 1 local oscillator power dividing circuit, 1 local oscillator reference signal amplifying power dividing circuit and a power supply filter circuit; the 4 independent frequency conversion channels down-convert the received 4 paths of L-band radio frequency signals to 70MHz; the local oscillator source circuit is used for generating local oscillator signals required by the frequency conversion channel; the local oscillation power dividing circuit is used for carrying out power division on local oscillation signals generated by the local oscillation source circuit and sending the local oscillation signals into 4 frequency conversion channels respectively; the local oscillator reference signal amplifying power dividing circuit is used for amplifying and dividing the reference signal input into the frequency conversion assembly, ensuring that the amplitude of the signal after power division is consistent with that of the signal input into the assembly, and sending the local oscillator reference signal after power division into the local oscillator source circuit by one way and outputting the frequency conversion assembly by the other way as the local oscillator reference signal of the next assembly; the power supply filter circuit is used for stabilizing the voltage input into the frequency conversion assembly to a voltage value required by a device and performing filter treatment;
turning to step S2;
s2: according to the functional index requirement of the radio frequency receiver on the L-band local oscillator integrated multi-channel miniaturized frequency conversion assembly, analyzing the L-band local oscillator integrated multi-channel miniaturized frequency conversion assembly and preparing a corresponding scheme block diagram, and turning to step S3;
s3: according to the scheme block diagram in the step S2, the front microwave circuit of the component is designed by using a bare chip, the back vibration source circuit, the local vibration power dividing circuit and the local vibration reference signal amplifying power dividing circuit of the frequency conversion component are packaged surface mounted devices, the power supply filter circuit is a low-profile surface mounted voltage stabilizer and a 0603 packaged capacitor resistor, and the method specifically comprises the following steps:
the front side of the whole frequency conversion assembly is assembled and processed by adopting a micro-assembly process, the front side is provided with 4 independent frequency conversion channels, and the frequency conversion channels on the front side of the frequency conversion assembly adopt radio frequency bare chips as main devices in frequency conversion channel links; the back of the frequency conversion assembly is provided with a local oscillation source circuit, a local oscillation power dividing circuit, a local oscillation reference signal amplifying power dividing circuit and a power supply filter circuit; the method comprises the steps of selecting a miniaturized packaged surface-mounted local oscillator source as a main device of a local oscillator source circuit, selecting a packaged surface-mounted power divider as a main device of a local oscillator power divider circuit, and selecting a 0603 packaged resistor and a packaged surface-mounted amplifier as main devices of a local oscillator reference signal amplifying power divider circuit; a low-profile surface-mounted voltage stabilizer and a 0603 packaged capacitor resistor are selected as main devices of a power supply filter circuit;
turning to step S4;
s4: according to the assembly form and the device encapsulation determined in the step S3, designing a schematic diagram according to the technical indexes of the frequency conversion assembly, and turning to the step S5;
s5: according to the schematic diagram, the front side of the frequency conversion assembly adopts an RO5880 double-sided printed board with the thickness of 0.254mm, and the front side of the frequency conversion assembly is provided with 4 independent radio frequency channels; the back of the frequency conversion assembly is a 4-layer printed board with the thickness of 0.6mm and the material of FR4, the back of the frequency conversion assembly is close to the radio frequency input interface, and the area facing the printed board of the cover plate is a local oscillation reference signal amplifying power division circuit; the back of the frequency conversion assembly corresponds to the front mixer circuit, the area facing the cover plate is a local oscillator power dividing circuit, and the area of the printed board facing the cavity side is a local oscillator source circuit; the back of the frequency conversion assembly is close to an output port of the frequency conversion assembly, and a power supply filter circuit is arranged towards the cover plate area; the 3 rd layer of the multilayer printed board on the back of the cavity is a power supply signal circuit; after dividing the frequency conversion assembly into areas according to the implementation function, turning to step S6;
s6: drawing a corresponding PCB layout according to the links, the devices and the circuit areas determined in the step S4 and the step S5, and turning to the step S7;
s7: according to the device height determined in the step S3, the circuit function areas and layout determined in the step S5 and the step S6 are designed, the cavity height distribution of the component is determined, and the structural design is carried out, so that the step S8 is carried out;
digging a cavity between the two radio frequency channels from the back of the frequency conversion assembly by utilizing the structural space between the two channels in the middle of the front of the frequency conversion assembly, and placing a local oscillator source on one side of the cavity on the back of the assembly, which faces the structural member, by utilizing the cavity; the local oscillation signals are connected through radio frequency insulators which are interconnected with the front side and the back side of the frequency conversion assembly, and the radio frequency insulators are connected with circuit boards on the front side and the back side of the assembly through build-up welding; the printed board on the front side of the frequency conversion assembly is fixed on a structural member of the frequency conversion assembly through sintering; the multi-layer printed board on the back of the frequency conversion assembly is fixed on a structural member of the assembly through screws;
s8: and processing and manufacturing the frequency conversion assembly according to the designed printed board diagram and the structure diagram.
2. The method for designing an L-band local oscillator integrated multi-channel miniaturized variable frequency module according to claim 1, wherein in step S3, the heights of the components of the module structure are calculated according to a scheme block diagram, and the package type of the device is determined, specifically as follows:
the whole height of the frequency conversion assembly is 10mm, the structure of the frequency conversion assembly is sequentially from top to bottom, the front surface sealing welding cover plate is 0.8mm, the screw cover plate is 1mm, the cavity space is 3.2mm, the front surface microwave printed board and solder are 0.3mm, the structural part is 1mm, the back surface multilayer printed board of the frequency conversion assembly is 0.8mm, the cavity space is 2.1mm, and the back surface sealing welding cover plate is 0.8mm; the height of a device in a front cavity of the frequency conversion assembly cannot exceed 3.2mm, and the height of the device in a back cavity cannot exceed 2.1mm; the front microwave circuit of the component adopts a bare chip; an integrated package PLS module circuit is selected as a local oscillation source module, and the envelope size of the module is 15-12-3 mm; the power divider in the local oscillator power dividing circuit selects BW1601PQ4 packaged by the alumina ceramic tube shell, the working frequency range of the device is 0.5-1.5GHz, and the packaging size is 4 x 1.1mm; a 0603 packaged resistor and a packaged surface mounted amplifier are selected as main devices of the local oscillation reference signal amplifying power dividing circuit; the low-profile surface-mounted voltage stabilizer and the 0603 packaged capacitor resistor are selected as main devices of the power supply and filter circuit.
3. The design method of the L-band local oscillation integrated multichannel miniaturized frequency conversion assembly according to claim 1, wherein in step S5, according to a schematic diagram, an RO5880 double-sided printed board with the thickness of 0.254mm is adopted on the front side of the frequency conversion assembly, and 4 independent frequency conversion channels are adopted on the front side of the frequency conversion assembly; the back of the frequency conversion assembly is a 4-layer printed board with the thickness of 0.6mm and the material of FR4, the back of the frequency conversion assembly is close to the radio frequency input interface, and the area facing the printed board of the cover plate is a local oscillation reference signal amplifying power division circuit; the back of the component corresponds to the front mixer circuit, the area facing the cover plate is a local oscillator power dividing circuit, and the area of the printed board facing the cavity side is a local oscillator source circuit; the back of the assembly is close to the assembly output port, and the area facing the cover plate is a power supply filter circuit; and the 3 rd layer of the multilayer printed board on the back of the cavity is a power supply signal circuit.
4. The design method of the L-band local oscillator integrated multichannel miniaturized variable frequency assembly of claim 1, wherein the design method is characterized by comprising the following steps: in step S6, 1 path of reference signal enters the assembly from the back of the frequency conversion assembly towards one side of the cover plate, passes through the reference signal power division amplifying circuit, reaches one side of the assembly control board towards the structural member through the via hole, enters the local oscillation source circuit, reaches the surface of the circuit board towards one side of the cover plate through the via hole, and passes through the local oscillation power division circuit to perform power division to generate 4 paths of local oscillation signals with equal amplitude and the like; the local oscillation signals after power division reach the microwave circuit on the front side of the component through the radio frequency insulator and enter the mixer on the front side of the frequency conversion component to be mixed.
5. The design method of the L-band local oscillator integrated multichannel miniaturized variable frequency assembly of claim 1, wherein the design method is characterized by comprising the following steps: in step S7, according to the device height determined in step S3, the circuit function area and layout determined in step S5 and S6 are designed, the cavity height distribution of the component is determined, and the structure is designed; the front surface of the component is provided with 4 identical variable-frequency channel structures; digging a cavity between the two radio frequency channels from the back of the assembly by utilizing the structural space between the two channels in the middle of the front of the assembly, and placing a local oscillation source on one side of the printed board on the back of the assembly, which faces the structural member, by utilizing the cavity; the local oscillation signals are connected through radio frequency insulators which are interconnected with the front side and the back side of the component, and the radio frequency insulators are connected with circuit boards on the front side and the back side of the component through build-up welding; the printed board on the front side of the component is fixed on a structural member of the component through sintering; the multilayer printed board on the back of the assembly is fixed on the structural member of the assembly through screws.
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