CN112686113B - Display panel - Google Patents
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- CN112686113B CN112686113B CN202011544823.2A CN202011544823A CN112686113B CN 112686113 B CN112686113 B CN 112686113B CN 202011544823 A CN202011544823 A CN 202011544823A CN 112686113 B CN112686113 B CN 112686113B
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Abstract
The embodiment of the application discloses a display panel, which comprises: at least one film layer is arranged on one side surface of the substrate; the groove is arranged on the substrate and penetrates through at least one film layer; the fingerprint identification sensor is arranged in the groove; and the shading structure is arranged inside the film layer and surrounds the groove.
Description
Technical Field
The application relates to the field of LCD display, in particular to a display panel.
Background
Fingerprint recognition technology has been widely used in medium and small sized panels, in which there are mainly capacitive, ultrasonic and optical modes. The current mature scheme is capacitive fingerprint identification, the working principle is that a silicon wafer and conductive subcutaneous electrolyte are utilized to form an electric field, and the difference between the silicon wafer and the conductive subcutaneous electrolyte is caused by the difference of the height between the silicon wafer and the conductive subcutaneous electrolyte, so that accurate fingerprint measurement is realized. However, with capacitive fingerprint recognition, the detection effect is significantly deteriorated when the finger is wet. Compared with capacitive fingerprint recognition, the ultrasonic fingerprint recognition technology has the advantages of high penetrating capacity, stability, accuracy and the like, but has relatively high cost. The optical fingerprint identification technology uses the refraction and reflection principle of light, when the light irradiates the finger, the light is reflected to a photosensitive sensor (sensor) by the finger, and the reflected light intensity of the valley and the ridge received by the sensor is different due to the different reflection of the fingerprint valley and the ridge, and then the light signal is converted into an electrical signal, so that fingerprint identification is performed. The optical fingerprint identification technology has the advantages of good stability, strong penetrating power and relatively low manufacturing cost.
In the course of research and practice of the prior art, the inventors of the present application found that the mobile phone or tablet currently carrying the optical fingerprint recognition function is a self-luminous OLED (organic light emitting semiconductor) screen. For the mobile phone with LCD (Liquid Crystal Display) screen, the difficulty of integrating the optical fingerprint identification function in the liquid crystal screen is increased due to the limitation of backlight, aperture ratio and other factors.
Disclosure of Invention
The embodiment of the application provides a display panel, which can solve the technical problem of reduced fingerprint identification sensitivity caused by stray light in an LCD display panel in the prior art.
An embodiment of the present application provides a display panel including: at least one film layer is arranged on one side surface of the substrate; the groove is arranged on the substrate and penetrates through at least one film layer; the fingerprint identification sensor is arranged in the groove; and the shading structure is arranged inside the film layer and surrounds the groove.
Further, the fingerprint identification sensor comprises an electron transmission layer arranged at the bottom of the groove; the light sensing layer is arranged on the surface of one side of the electron transmission layer, which is far away from the bottom; and the hole transmission layer is arranged on one side surface of the photoinduction layer, which is far away from the electron output layer.
Further, the fingerprint identification sensor is an NIP photoelectric sensor.
Further, the film layer comprises a shading metal unit which is arranged on one side surface of the substrate; the buffer layer is arranged on one side surface of the substrate and covers the shading metal unit; the active layer is arranged on one side surface of the buffer layer, which is far away from the substrate, and corresponds to the shading metal unit; the first insulating layer is arranged on one side surface of the buffer layer and covers the active layer; the grid electrode layer is arranged on the first insulating layer and corresponds to the active layer; the dielectric layer is arranged on one side surface of the first insulating layer and is connected with the grid electrode layer; the source electrode and the drain electrode are arranged on one side surface of the dielectric layer, penetrate through the dielectric layer and the first insulating layer and are connected to the active layer; and the second insulating layer is arranged on one side surface of the dielectric layer and covers the source electrode and the drain electrode.
Further, the groove penetrates through the second insulating layer, the dielectric layer and the first insulating layer, and the bottom of the groove is flush with the surface of one side, away from the substrate, of the buffer layer.
Further, the display panel further includes a first electrode disposed on the second insulating layer, wherein a first end of the first electrode penetrates through the second insulating layer and is connected to the source/drain electrode, and the other end extends to the groove and covers the inner side wall and the bottom of the groove.
Optionally, in some embodiments of the present application, the first electrode is a light-transmitting electrode, and the light shielding structure is disposed on the buffer layer and surrounds a sidewall of the groove.
Optionally, in some embodiments of the present application, the material of the first electrode is a light shielding material, and the first electrode covering the inner sidewall and the bottom of the groove is the light shielding structure.
Optionally, in some embodiments of the present application, the first electrode is a light-transmitting electrode, the light shielding structure and the source-drain electrode enclose a closed pattern, and the groove is disposed in the closed pattern.
Optionally, in some embodiments of the present application, the display panel further includes a third insulating layer disposed on a side surface of the second insulating layer and covering the first electrode and the fingerprint recognition sensor; and the second electrode is arranged on the third insulating layer and corresponds to the groove position, and the second electrode part penetrates through the third insulating layer and is connected to the fingerprint identification sensor.
The display panel adopted by the embodiment of the application is an LCD panel, the fingerprint identification sensor is arranged in the color film substrate or the array substrate, a plurality of grooves are arranged in the color film substrate or the array substrate for accommodating the fingerprint identification sensor, and the first electrodes covering the inner side walls and the bottom of the grooves are made of opaque metal materials, so that stray light emitted to the bottoms and the side walls of the grooves can be effectively shielded, the stray light is prevented from being emitted to the fingerprint identification sensor, optical noise is reduced, the identification sensitivity of the fingerprint identification sensor is improved, or a circle of shading structure is arranged around the grooves, and the shading structure is used for shading the stray light emitted to the inside of the grooves from the outer side surfaces of the grooves, so that the identification sensitivity of the fingerprint identification sensor is improved. Meanwhile, the source and drain electrodes at the side of the groove are made of opaque metal materials, so that the shading structure can be partially overlapped with the source and drain electrodes, namely, the shading structure and the source and drain electrodes can enclose a closed pattern, stray light emitted from the outer side surface of the groove to the inside of the groove is shielded, and the recognition sensitivity of the fingerprint recognition sensor is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic view of a display panel according to a first embodiment of the present application;
FIG. 2 is a schematic diagram of an array substrate according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a display panel according to a second embodiment of the present application;
FIG. 4 is a schematic view of a second embodiment of the present application for preparing a light shielding metal layer; the method comprises the steps of carrying out a first treatment on the surface of the
FIG. 5 is a schematic diagram of a buffer layer according to a second embodiment of the present application;
FIG. 6 is a schematic diagram of an active layer preparation according to a second embodiment of the present application;
FIG. 7 is a schematic diagram of a second embodiment of a method for fabricating a gate layer;
FIG. 8 is a schematic diagram of a preparation groove according to a second embodiment of the present application;
fig. 9 is a schematic diagram of a light shielding structure according to a second embodiment of the present application;
FIG. 10 is a schematic view of a second embodiment of the present application for preparing a first electrode;
FIG. 11 is a schematic diagram of a fingerprint sensor according to a second embodiment of the present application;
fig. 12 is a schematic view of a second embodiment of the present application for preparing a third insulating layer;
fig. 13 is a schematic structural diagram of a color film substrate according to a second embodiment of the present application;
FIG. 14 is a plan view of a light shielding structure and a groove according to a second embodiment of the present application;
FIG. 15 is a plan view of a light shielding structure and a recess provided by another embodiment of the present application;
FIG. 16 is a schematic view of a preparation groove according to a third embodiment of the present application;
fig. 17 is a schematic structural diagram of a color film substrate according to a third embodiment of the present application.
Reference numerals illustrate:
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application. Furthermore, it should be understood that the detailed description is presented herein for purposes of illustration and description only, and is not intended to limit the application. In the present application, unless otherwise indicated, terms of orientation such as "upper" and "lower" are used to generally refer to the upper and lower positions of the device in actual use or operation, and specifically the orientation of the drawing figures; while "inner" and "outer" are for the outline of the device.
The embodiment of the application provides a display panel. The following will describe in detail. The following description of the embodiments is not intended to limit the preferred embodiments.
Embodiment 1,
As shown in fig. 1 and 2, in the present embodiment, the display panel 1 of the present application includes an array substrate 100, a color film substrate 200, a backlight module 300, and a fingerprint sensor 400.
The display panel 1 comprises a light emitting side 11, when a user performs fingerprint identification, the user needs to press a finger close to the light emitting side 11, and when the finger is irradiated by light, the finger is reflected to the fingerprint identification sensor 400 by utilizing the refraction and reflection principle of light, and the fingerprint identification sensor 400 receives different reflected light intensities of the valley and the ridge due to different reflection of the valley and the ridge in the fingerprint, and converts the light signal into an electrical signal, thereby performing fingerprint identification.
In this embodiment, the array substrate 100 and the color film substrate 200 are disposed opposite to each other, and the backlight module 300 is disposed on a side of the color film substrate 200 away from the array substrate 100. The side of the array substrate 100 away from the color film substrate 200 is a light emitting side 11, and the fingerprint identification sensor 400 is disposed in the array substrate 100.
The array substrate 100 includes a substrate 110, and a plurality of fingerprint driving units 101 are disposed on the substrate 110, where each fingerprint driving unit 101 corresponds to a fingerprint identification sensor 400.
The array substrate 100 further includes a light shielding metal unit 120, a buffer layer 130, an active layer 140, a first insulating layer 150, a gate layer 160, a dielectric layer 170, a source/drain electrode 180, and a second insulating layer 190.
Each of the light shielding metal unit 120, the active layer 140, the gate layer 160 and the source/drain electrode 180 form a fingerprint driving unit 101, and the fingerprint driving unit 101 is used for driving the fingerprint identification sensor 400.
The substrate 110 is a hard substrate, typically a glass substrate, and serves as a support and a substrate.
The light shielding metal unit 120 is disposed on the upper surface of the substrate 110, the light shielding metal unit 120 is made of a light shielding material, and the light shielding material is made of metal and includes: molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), or the like, or an alloy, the thickness of the light shielding metal unit 120 is 500 to 2000 angstroms, and the light shielding metal unit 120 plays a role of shielding light.
The buffer layer 130 is disposed on the upper surfaces of the light shielding metal unit 120 and the substrate 110, and plays a role in buffering, the material of the buffer layer 130 is an inorganic material, the inorganic material includes silicon oxide or silicon nitride, or is a multi-layer structure, and the thickness of the buffer layer 130 is 1000-5000 a.
The active layer 140 is disposed on the upper surface of the buffer layer 130, and the active layer 140 is made of a semiconductor material including Indium Gallium Zinc Oxide (IGZO) and indium gallium titanium oxide (IZTO), indium Gallium Zinc Titanium Oxide (IGZTO), and the thickness of the active layer 140 is 100-1000 a. The active layer 140 is disposed above the light shielding metal unit 120, i.e., the active layer 140 is disposed opposite to the light shielding metal unit 120, and the active layer 140 provides circuit support for the display panel.
The active layer 140 includes a conductive region and a non-conductive region, wherein the conductive region surrounds the non-conductive region.
The first insulating layer 150 is disposed on the upper surface of the active layer 140, the material of the first insulating layer 150 is an inorganic material, the inorganic material includes silicon oxide or silicon nitride or a multi-layer thin film structure, and the thickness of the first insulating layer 150 is 1000-3000 a. The first insulating layer 150 is disposed opposite to the active layer 140, and the first insulating layer 150 serves to insulate and prevent short circuits between lines inside the display panel 1.
The gate layer 160 is disposed on the upper surface of the first insulating layer 150, and the gate layer 160 is made of a metal material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), or the like, or an alloy, or a multi-layer thin film structure. The gate layer 160 has a thickness of 2000 to 8000 a. And gate layer 160 corresponds to the conductive region.
The dielectric layer 170 is disposed on the upper surfaces of the gate layer 160 and the first insulating layer 150, the dielectric layer 170 is an interlayer insulating layer, the material of the dielectric layer 170 is an inorganic material, and the inorganic material includes silicon oxide or silicon nitride or a multi-layer thin film structure, so as to perform an insulating function and prevent a short circuit. The thickness of the dielectric layer 170 is 2000 to 10000 a. A via hole is formed above the active layer 140 and the light shielding unit 120, and the via hole facilitates electrical connection between the source and drain electrodes 180 and the active layer 140.
The source/drain electrode 180 is disposed on the upper surface of the dielectric layer 170, and the source/drain electrode 180 is made of a metal material, wherein the metal material includes molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), or the like, or is an alloy, or is a multi-layer thin film structure. A portion of the metal material is disposed in the via hole, and the source/drain electrode 180 is electrically connected to the active layer 140 through the via hole, thereby forming a circuit connection. The thickness of the source/drain electrode 180 is 2000 to 8000 a.
The second insulating layer 190 is disposed on the dielectric layer 170 and the upper surface of the source/drain electrode 180, the material of the second insulating layer 190 includes an oxide material of silicon, and the thickness of the second insulating layer 190 is 1000 to 5000 a. The second insulating layer 190 plays a role of insulating and isolating external water and oxygen.
A plurality of grooves 401 are formed on the array substrate 100, the grooves 401 are disposed at sides of the fingerprint driving unit 101, and each groove 401 corresponds to one fingerprint driving unit 101.
Specifically, the groove 401 penetrates through the second insulating layer 190, the dielectric layer 170 and the first insulating layer 150, and the bottom of the groove 401 is flush with a surface of the buffer layer 120 away from the substrate 110. The opening of the recess 401 is flush with a surface of a side of the second insulating layer 190 remote from the dielectric layer 170. And the opening of the recess 401 is directed towards the light exit side 11.
The first electrode 191 is disposed on the upper surface of the second insulating layer 190, one end of which penetrates the second insulating layer 190 and is connected to the source/drain electrode 180, and the other end of which extends to the opening edge of the recess 401 and covers the inner sidewall and the bottom of the recess 401.
The fingerprint sensor 400 is disposed inside the recess 410, and the first electrode 191 covers the inner side and the bottom of the recess 401, so that the fingerprint sensor 400 can be electrically connected to the first electrode 191.
The fingerprint sensor 400 includes an electron transport layer 410, a light sensing layer 420, and a hole transport layer 430, wherein the electron transport layer 410 is disposed at the bottom of the recess 401, and one side surface of the electron transport layer is electrically connected to the first electrode 191.
The light sensing layer 420 is disposed on a surface of the side of the electron transmission layer 410 away from the first electrode 191, the hole transmission layer 430 is disposed on a side of the light sensing layer 420 away from the electron transmission layer 410, when the fingerprint identification sensor 400 receives light reflected by a finger, a photo current is generated, the fingerprint driving unit 101 corresponding to the groove 401 is opened, and the photo current is read and identified through the first electrode 191, thereby completing a fingerprint identification process.
Since the display panel 1 is an LCD display panel, and includes the backlight module 300, the backlight module 300 emits light continuously, and if the light emitted by the backlight module 300 irradiates the fingerprint sensor 400, the sensitivity of the fingerprint sensor 400 is affected.
Since the backlight module 300 is disposed on a side surface of the color film substrate 200 away from the array substrate 100, light emitted from the backlight module 300 passes through the bottom of the groove 401 and irradiates the fingerprint identification sensor 400, in order to isolate light of the backlight module 300, in this embodiment, the first electrode 191 is made of a light-shielding metal material, and since the first electrode 191 completely covers the inner sidewall and the bottom of the groove 401, light of the backlight module 300 irradiating the fingerprint identification sensor 400 can be perfectly isolated, and the first electrode 191 does not shade light at the opening of the groove 401, i.e. the first electrode 191 does not affect light reflected by a finger fingerprint and does not affect fingerprint identification.
The third insulating layer 192 is disposed on a surface of the second insulating layer 190 away from the dielectric layer 170, and the third insulating layer 192 covers the first electrode 192 and the fingerprint sensor 400.
The third insulating layer 192 is provided with a first through hole 193 corresponding to the opening of the groove 401, and a surface portion of the fingerprint identification sensor 400 far away from the substrate 110 is exposed in the first through hole 193.
The second electrode 194 is disposed on a side surface of the third insulating layer 192 away from the second insulating layer 190, and the second electrode 194 corresponds to the groove 401, and the second electrode 194 covers an inner surface of the first through hole 193 and is connected to the fingerprint sensor 400.
The second electrode 194 is a transparent electrode, which does not affect the light reflected by the finger print and does not affect the fingerprint identification.
The display panel in this embodiment is an LCD panel, one side of the array substrate is a light-emitting side, the fingerprint identification sensor is disposed inside the array substrate, in order to increase the light transmittance of the fingerprint identification sensor, a plurality of grooves are disposed in the array substrate for accommodating the fingerprint identification sensor, and since the light-emitting side is located at the opening of the grooves, the first electrodes covering the inner side walls and the bottom of the grooves are made of opaque metal materials, so that stray light emitted to the bottoms and the side walls of the grooves can be effectively shielded, stray light emitted to the fingerprint identification sensor is avoided, optical noise is reduced, and the identification sensitivity of the fingerprint identification sensor is improved.
Embodiment II,
As shown in fig. 3 and 13, in the present embodiment, the display panel 1a of the present application includes an array substrate 100a, a color film substrate 200a, a backlight module 300a and a fingerprint sensor 400a.
The display panel 1a includes a light emitting side 11a, and when a user performs fingerprint identification, the user needs to press a finger against the light emitting side 11a, and when the light irradiates the finger, the light is reflected to the fingerprint identification sensor 400a by the finger according to the refraction and reflection principle of the light, and the fingerprint identification sensor 400a receives different reflected light intensities of the valley and the ridge due to different reflection of the valley and the ridge in the fingerprint, and converts the light signal into an electrical signal, thereby performing fingerprint identification.
In this embodiment, the array substrate 100a and the color film substrate 200a are disposed opposite to each other, the backlight module 300a is disposed on a side of the array substrate 100a away from the color film substrate 200a, the color film substrate 200a is disposed on a light emitting side 11a of the array substrate 100a, and the fingerprint sensor 400a is disposed in the array substrate 100 a.
Specifically, the color film substrate 200a includes a substrate 210, and a plurality of fingerprint driving units 201 are disposed on the substrate 210, where each fingerprint driving unit 201 corresponds to a fingerprint identification sensor 400a.
The fingerprint driving unit 201 has the same structure as the fingerprint driving unit 101 on the array substrate 100 in the first embodiment, and the technical effects thereof are the same.
The color film substrate 200a further includes a light shielding metal unit 220, a buffer layer 230, an active layer 240, a first insulating layer 250, a gate layer 260, a dielectric layer 270, a source/drain electrode 280, and a second insulating layer 290.
A plurality of grooves 401a are arranged on the color film substrate 200a, the grooves 401a are arranged on the side of the fingerprint driving unit 201, and each groove 401a corresponds to one fingerprint driving unit 201.
The difference is that when the color film substrate 200a faces upward, the opening of the groove 401a faces away from the light emitting side 11a, i.e. the color film substrate 200a is "reversely fastened" on the array substrate 100 a.
At this time, since the bottom of the groove 401a faces the light emitting side 11a, the light reflected by the finger fingerprint needs to be directed to the fingerprint recognition sensor 400a through the bottom of the groove 401 a. Therefore, the first electrode 291 in the present embodiment cannot use a light shielding material, and needs to use a light transmitting material, and since the buffer layer 230, the first insulating layer 250, the dielectric layer 270, and the second insulating layer 290 are made of a light transmitting material, in order to prevent non-fingerprint reflected light from shining from the side of the groove 401a toward the fingerprint sensor 400a, the sensitivity of the fingerprint sensor 400a is reduced.
As shown in fig. 14 and 15, in this embodiment, a circle of light shielding structure 500 is disposed around the outer side wall of the groove 401a, and the light shielding structure 500 is a closed pattern, and the closed pattern is similar to the outer contour of the fingerprint sensor 400a, that is, the closed pattern is similar to the outer contour of the groove 401 a.
The bottom end of the light shielding structure 500 is flush with the bottom of the groove 401a, and the top end of the light shielding structure 500 is flush with the top end of the fingerprint identification sensor 400a, i.e. the height of the light shielding structure 500 is greater than or equal to the thickness of the fingerprint identification sensor 400a, so that the light shielding structure 500 can shield the light rays irradiating the fingerprint identification sensor 400a from the outer side wall of the groove 401 a.
In order to better explain the application, the embodiment also provides a preparation method of the color film substrate, which specifically comprises the following steps:
s1) providing a substrate.
S2) as shown in FIG. 4, a plurality of shading metal units are prepared on one side surface of the substrate.
S3) as shown in FIG. 5, a buffer layer is prepared on one side surface of the substrate, and the buffer layer covers the light shielding metal unit.
S4) as shown in FIG. 6, preparing a layer of monocrystalline silicon (a-Si) material on the buffer layer, converting the monocrystalline silicon material into polycrystalline silicon (poly-Si) material by excimer laser annealing, and patterning the polycrystalline silicon material by adopting an exposure etching method to form active layers, wherein each active layer corresponds to a shading metal unit. In other preferred embodiments, the polysilicon material or IGZO material may be prepared directly on the buffer layer without performing a laser annealing process.
S5) carrying out a phosphorus ion doping process on the active layer, and forming an N+ doped region at the edge of the active layer.
S6) depositing a layer of insulating layer material to form a first insulating layer, wherein the first insulating layer covers the active layer.
S7) as shown in FIG. 7, preparing a plurality of gate layers on the first insulating layer, wherein each gate layer corresponds to an active layer, and performing N-ion implantation on a non-shielded area of the active layer by utilizing shielding of the gate layer.
S8) depositing a dielectric layer, said dielectric layer covering said gate layer.
S9) as shown in fig. 8, holes are etched in the dielectric layer and the first insulating layer, including a first via for connecting with the active layer, a second via for preparing the retaining wall structure, and a recess between the retaining wall structures.
S10) as shown in FIG. 9, a source-drain electrode and a retaining wall structure are prepared on the dielectric layer, wherein the source-drain electrode fills the first via hole and is connected to the N+ doped region of the active layer, and the retaining wall structure fills the second via hole, wherein the second via hole is in a closed pattern, and therefore the retaining wall structure also forms a closed pattern around the groove.
S11) depositing a second insulating layer, wherein the second insulating layer covers the source electrode, the drain electrode and the retaining wall structure, and openings are formed in the positions, corresponding to the source electrode, the drain electrode and the groove, of the second insulating layer, so that the source electrode, the drain electrode and the groove are exposed.
S12) as shown in fig. 10, a first electrode having one end connected to the source and drain electrodes and a first segment extending to the edge of the groove and covering the inner sidewall and the bottom of the groove is prepared on the second insulating layer.
S13) as shown in fig. 11, a fingerprint recognition sensor is prepared in the groove, the fingerprint recognition sensor being connected to the first electrode.
S14) as shown in FIG. 12, preparing a third insulating layer on the second insulating layer, wherein the third insulating layer covers the first electrode, and a through hole is formed in the third insulating layer corresponding to the groove.
S15) preparing a second electrode on the third insulating layer, the second electrode corresponding to the groove and connected to the fingerprint recognition sensor.
The beneficial effects of this embodiment lie in that, display panel in this embodiment is the LCD panel, and one side of its various membrane base plate is the light-emitting side, and fingerprint identification sensor locates inside the various membrane base plate, in order to increase fingerprint identification sensor's light transmissivity, sets up a plurality of recesses in various membrane base plate for hold fingerprint identification sensor, and set up round shading structure around the recess, shading structure is used for sheltering from the inside stray light of recess outside side orientation recess, promotes fingerprint identification sensor's recognition sensitivity.
Third embodiment,
The color film substrate 200b in the present embodiment is similar to the color film substrate 200a in the second embodiment in structure, and is different in that, as shown in fig. 17, considering that the source-drain electrode 280 is a light-shielding metal material, and the groove 401a is disposed at the side of the fingerprint driving unit 201, that is, the source-drain electrode 280 itself can play a technical role of shielding a certain light, so that the light-shielding structure 500a and the source-drain electrode 280 at the side of the groove 401a can enclose a closed pattern, and the closed pattern surrounds the groove 401a, thereby shielding the light of the outer side wall of the groove 401a irradiating the fingerprint identification sensor 400a.
The method for manufacturing the color film substrate in this embodiment is substantially similar to the method for manufacturing the color film substrate in the second embodiment, but steps S91) and S101) in this embodiment are different from steps S9) and S10) in the second embodiment.
S91) as shown in fig. 16, etching a plurality of holes on the dielectric layer and the first insulating layer, including a first via hole for connecting with the active layer, a second via hole for preparing the retaining wall structure, and a groove between the retaining wall structures, wherein the second via hole partially overlaps with the first via hole, and the second via hole and the first via hole enclose a closed pattern.
S101) preparing a source-drain electrode and a retaining wall structure on the dielectric layer, wherein the source-drain electrode fills the first via hole 281 and is connected to the n+ doped region of the active layer, the retaining wall structure fills the second via hole 282, and the retaining wall structure and the source-drain electrode close to one side of the groove form a closed pattern together, so that the material of the retaining wall structure is saved, and the cost is saved.
The display panel in this embodiment is made of opaque metal material, so the light shielding structure can partially overlap with the source and drain electrodes, that is, the light shielding structure can enclose a closed pattern with the source and drain electrodes, so that stray light emitted from the outer side surface of the groove to the inside of the groove is shielded, and the recognition sensitivity of the fingerprint recognition sensor is improved.
The foregoing has outlined a detailed description of a display panel provided by embodiments of the present application, wherein specific examples are provided herein to illustrate the principles and embodiments of the present application, and the above examples are provided to assist in understanding the method and core ideas of the present application; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, the present description should not be construed as limiting the present application.
Claims (8)
1. The utility model provides a display panel, its characterized in that, display panel includes the base plate, and set up in at least one rete of base plate one side surface, the rete includes:
the shading metal unit is arranged on one side surface of the substrate;
the buffer layer is arranged on one side surface of the substrate and covers the shading metal unit;
the active layer is arranged on one side surface of the buffer layer, which is far away from the substrate, and corresponds to the shading metal unit;
the first insulating layer is arranged on one side surface of the buffer layer and covers the active layer;
the grid electrode layer is arranged on the first insulating layer and corresponds to the active layer;
the dielectric layer is arranged on one side surface of the first insulating layer and covers the grid layer;
the source electrode and the drain electrode are arranged on one side surface of the dielectric layer, penetrate through the dielectric layer and the first insulating layer and are connected to the active layer; and
the second insulating layer is arranged on one side surface of the dielectric layer and covers the source electrode and the drain electrode;
the display panel further includes:
the groove is arranged on the substrate and penetrates through at least one film layer;
the first electrode is arranged on the second insulating layer, and the first end of the first electrode penetrates through the second insulating layer and is connected to the source-drain electrode, and the other end of the first electrode extends to the groove and covers the inner side wall and the bottom of the groove;
the fingerprint identification sensor is arranged in the groove; and
the shading structure is arranged inside the film layer and surrounds the groove.
2. The display panel of claim 1, wherein the fingerprint recognition sensor comprises an electron transport layer disposed at the bottom of the recess;
the light sensing layer is arranged on the surface of one side of the electron transmission layer, which is far away from the bottom; and
and the hole transmission layer is arranged on one side surface of the photoinduction layer, which is far away from the electron transmission layer.
3. The display panel of claim 1, wherein the fingerprint recognition sensor is a NIP photosensor.
4. The display panel of claim 1, wherein the display panel comprises,
each shading metal unit, the active layer, the grid layer and the source-drain electrode form a fingerprint driving unit;
the groove penetrates through the second insulating layer, the dielectric layer and the first insulating layer, and the bottom of the groove is flush with the surface of one side of the buffer layer away from the substrate; and each groove is arranged at the side of one fingerprint driving unit.
5. The display panel of claim 1, wherein the display panel comprises,
the first electrode is a light-transmitting electrode, and the shading structure is arranged on the buffer layer and surrounds the side wall of the groove.
6. The display panel of claim 1, wherein the display panel comprises,
the first electrode is made of a shading material, and the first electrode covering the inner side wall and the bottom of the groove is made of the shading structure.
7. The display panel of claim 1, wherein the display panel comprises,
the first electrode is a light-transmitting electrode, the shading structure and the source-drain electrode enclose a closed graph, and the groove is arranged in the closed graph.
8. The display panel of claim 1, further comprising:
the third insulating layer is arranged on one side surface of the second insulating layer and covers the first electrode and the fingerprint identification sensor; and
and the second electrode is arranged on the third insulating layer and corresponds to the groove position, and the second electrode part penetrates through the third insulating layer and is connected to the fingerprint identification sensor.
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| CN202011544823.2A CN112686113B (en) | 2020-12-23 | 2020-12-23 | Display panel |
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| CN110750021A (en) * | 2019-10-31 | 2020-02-04 | 厦门天马微电子有限公司 | Array substrate, display panel and display device |
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| CN111308755A (en) * | 2019-12-11 | 2020-06-19 | 厦门天马微电子有限公司 | Display panel and display device |
| CN111965904A (en) * | 2020-09-03 | 2020-11-20 | 厦门天马微电子有限公司 | Array substrate, display panel and display device |
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| CN106897692B (en) * | 2017-02-23 | 2020-03-03 | 京东方科技集团股份有限公司 | Fingerprint identification subassembly and display device |
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| CN110222620A (en) * | 2019-05-30 | 2019-09-10 | 武汉华星光电技术有限公司 | A kind of display panel |
| CN110718565A (en) * | 2019-09-05 | 2020-01-21 | 武汉华星光电技术有限公司 | Display panel and display device |
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