CN112676705B - Silicon wafer etching method - Google Patents
Silicon wafer etching method Download PDFInfo
- Publication number
- CN112676705B CN112676705B CN202011447375.4A CN202011447375A CN112676705B CN 112676705 B CN112676705 B CN 112676705B CN 202011447375 A CN202011447375 A CN 202011447375A CN 112676705 B CN112676705 B CN 112676705B
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- feeding
- driving
- groove
- discharging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 70
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 70
- 239000010703 silicon Substances 0.000 title claims abstract description 70
- 238000005530 etching Methods 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000007599 discharging Methods 0.000 claims abstract description 34
- 238000010329 laser etching Methods 0.000 claims abstract description 8
- 230000007246 mechanism Effects 0.000 claims description 13
- 238000005192 partition Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 abstract description 57
- 230000008569 process Effects 0.000 abstract description 6
- 230000010354 integration Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 5
- 238000005096 rolling process Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Weting (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011447375.4A CN112676705B (en) | 2020-12-09 | 2020-12-09 | Silicon wafer etching method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011447375.4A CN112676705B (en) | 2020-12-09 | 2020-12-09 | Silicon wafer etching method |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112676705A CN112676705A (en) | 2021-04-20 |
CN112676705B true CN112676705B (en) | 2022-09-13 |
Family
ID=75448367
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202011447375.4A Active CN112676705B (en) | 2020-12-09 | 2020-12-09 | Silicon wafer etching method |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112676705B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114137260B (en) * | 2021-11-26 | 2023-06-27 | 国网湖北省电力有限公司直流运检公司 | Flexible direct-current transmission converter valve power unit test device and test method |
EP4290564A1 (en) * | 2022-06-07 | 2023-12-13 | Siltronic AG | Gripper for transporting an upright semiconductor wafer and method for cleaning the semiconductor wafer |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3678812D1 (en) * | 1986-01-06 | 1991-05-23 | Stephanois Rech Mec | METHOD AND MEANS FOR GRAPPING AND TRANSPORTING SILICON PLATES. |
JP3558543B2 (en) * | 1999-01-25 | 2004-08-25 | マック産業機器株式会社 | Plate material clamping device |
KR100949256B1 (en) * | 2009-12-24 | 2010-03-25 | 이인오 | Chuck for fixing wafer |
CN206842626U (en) * | 2017-06-28 | 2018-01-05 | 安徽中烟工业有限责任公司 | Cigarette machine obbbin clamping device |
CN107775560B (en) * | 2017-10-13 | 2019-04-26 | 宁波库贴汽车塑料有限公司 | A kind of automobile plastic pipeline processing clamping device |
CN207616181U (en) * | 2017-12-06 | 2018-07-17 | 天津市久华新瑞科技有限公司 | High-precision mold processing milling machine |
CN207534173U (en) * | 2017-12-08 | 2018-06-26 | 政和县瑞昌工艺品有限公司 | A kind of production high-precision combination bamboo craftwork product laser engraving machine |
CN207386837U (en) * | 2018-01-11 | 2018-05-22 | 广州泰森新材料科技有限公司 | A kind of cutting system of automatic cutting plane material |
CN207757092U (en) * | 2018-01-25 | 2018-08-24 | 宝鸡文理学院 | A kind of lithography device of aluminium oxide ceramics |
CN207982564U (en) * | 2018-02-09 | 2018-10-19 | 广州市镭拓光电有限公司 | A kind of laser marking machine of adjustable mark location |
CN108480743A (en) * | 2018-03-21 | 2018-09-04 | 杨艳 | A kind of working method of the strip material equidistant disconnecting device with ratchet auxiliary material feeding function |
CN208163126U (en) * | 2018-03-29 | 2018-11-30 | 响水县永恒传动件制造有限公司 | A kind of fixed device of bearing block processing |
CN208729267U (en) * | 2018-09-15 | 2019-04-12 | 山东圣嘉型材有限公司 | It is a kind of to cut accurately aluminum profile cutting equipment |
CN209035717U (en) * | 2018-11-06 | 2019-06-28 | 宁波欣睿激光设备有限公司 | Automatic loading/unloading disk laser marking machine |
CN210172810U (en) * | 2018-12-14 | 2020-03-24 | 博深普锐高(上海)工具有限公司 | Novel laser marking machine |
CN210025214U (en) * | 2019-03-01 | 2020-02-07 | 深圳市杰盛微半导体有限公司 | A deposit structure for depositing silicon wafer |
CN109940280B (en) * | 2019-04-25 | 2020-09-08 | 巢湖学院 | Multi freedom laser marking machine |
CN110211903B (en) * | 2019-06-24 | 2021-02-26 | 江苏守航实业有限公司 | Processing device for third-generation semiconductor material |
CN110280795A (en) * | 2019-07-23 | 2019-09-27 | 徐州昊圣机械制造有限公司 | A kind of spare parts processing machinery drilling device |
CN210775329U (en) * | 2019-07-28 | 2020-06-16 | 江苏纽克光谱科技有限公司 | Special double-station fluorescent magnetic powder flaw detector for wind power generation gear ring |
CN210756092U (en) * | 2019-10-20 | 2020-06-16 | 天津晟华晔机器人有限公司 | Adjustable clamp for robot flexible welding workstation |
CN110788813A (en) * | 2019-11-14 | 2020-02-14 | 徐州市康恒机械有限公司 | Multi-station rotary assembly table for engineering machinery |
CN211889484U (en) * | 2019-11-27 | 2020-11-10 | 中山市华丽斯制衣有限公司 | Laser bag opening machine |
CN211072283U (en) * | 2019-12-06 | 2020-07-24 | 澳龙智造科技(江门)有限公司 | Laser cutting machine of easy material loading |
CN211254245U (en) * | 2019-12-06 | 2020-08-14 | 河南雅利安新材料有限公司 | Automatic feeding device for processing silicon carbide single crystal wafer |
CN111230521A (en) * | 2020-03-02 | 2020-06-05 | 刘丽 | Adjustable positioning table for aluminum alloy machining and use method |
CN111515329B (en) * | 2020-04-14 | 2021-09-14 | 杭州柏列得电器有限公司 | Riveting machine |
CN211162460U (en) * | 2020-06-11 | 2020-08-04 | 佛山市富兰激光科技有限公司 | Laser processing apparatus |
-
2020
- 2020-12-09 CN CN202011447375.4A patent/CN112676705B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN112676705A (en) | 2021-04-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN112676705B (en) | Silicon wafer etching method | |
CN115592246A (en) | Bed body steel construction automatic welder of subsidiary location calibration function | |
CN112372354A (en) | Loading and unloading device of numerical control lathe | |
CN114799584B (en) | Automatic feeding and discharging device for ultra-fast laser precision machining | |
CN115070588A (en) | High-precision automatic polishing equipment | |
CN107322012B (en) | A kind of lathe | |
CN114852675A (en) | Motorcycle starting lever spline seat processingequipment | |
CN115256106A (en) | Lithium battery nickel-plated steel strip cutting and finishing complete equipment and working method thereof | |
CN210818837U (en) | Tubular accessory burring device | |
CN210818639U (en) | Automatic feeding and discharging device for CNC engraving and milling machine | |
CN110143405B (en) | Positioning device of hardware blanking machine and using method thereof | |
CN113001234A (en) | Lifting carrying robot for machine tool machining materials and using method thereof | |
CN112916885A (en) | Vertical numerically controlled lathe | |
CN217343784U (en) | Raw material cutting equipment for machining | |
CN118081418B (en) | Milling fixture for bearing seat mounting feet | |
CN216226926U (en) | Automatic feeding and discharging device for lathe | |
CN216938559U (en) | Quick ejecting tool for producing and processing speed reducer accessories | |
CN219093649U (en) | Automatic feeding and discharging device for lathe | |
CN212264571U (en) | High-efficiency double-workbench drilling machine | |
CN219130783U (en) | Automatic feeding and discharging mechanism of eccentric machine | |
CN217370486U (en) | Automatic unloading auxiliary device that goes up of numerical control lathe | |
CN117620328B (en) | Automatic feeding and discharging device of gear shaft numerical control gear hobbing machine | |
CN221115628U (en) | Plastic plate feeding device for production and assembly of cast alloy part hooks | |
CN219617136U (en) | Unloading equipment in lamp cup processing | |
CN219900458U (en) | Feeding and discharging clamp of broaching machine |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20220824 Address after: South side of Renchuang Street and west side of Mengdong Road, Area A, Naiman Banner Industrial Park, Tongliao City, Inner Mongolia Autonomous Region 028000 Applicant after: Inner Mongolia Xinggu Technology Co.,Ltd. Address before: 518000 a5-802, Hangcheng innovation and entrepreneurship Park, 159 Hangcheng Avenue, Sanwei community, Hangcheng street, Bao'an District, Shenzhen City, Guangdong Province Applicant before: Tao Jin |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A Method for Etching Silicon Wafers Effective date of registration: 20230410 Granted publication date: 20220913 Pledgee: Tongliao branch of Bank of China Ltd. Pledgor: Inner Mongolia Xinggu Technology Co.,Ltd. Registration number: Y2023150000059 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230424 Granted publication date: 20220913 Pledgee: Tongliao branch of Bank of China Ltd. Pledgor: Inner Mongolia Xinggu Technology Co.,Ltd. Registration number: Y2023150000059 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A Method for Etching Silicon Wafers Effective date of registration: 20230425 Granted publication date: 20220913 Pledgee: Tongliao branch of Bank of China Ltd. Pledgor: Inner Mongolia Xinggu Technology Co.,Ltd. Registration number: Y2023150000062 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20220913 Pledgee: Tongliao branch of Bank of China Ltd. Pledgor: Inner Mongolia Xinggu Technology Co.,Ltd. Registration number: Y2023150000062 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |