CN112667493B - Pressure test method and device for simulating board card and application to fully occupy CPU resource - Google Patents
Pressure test method and device for simulating board card and application to fully occupy CPU resource Download PDFInfo
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Abstract
The invention provides a pressure test method and a pressure test device for simulating board cards and applications occupying CPU resources, wherein the method comprises the following steps: building a test environment, and installing a board card to be tested in a server; starting a test, setting the full-pressure operation of the board to be tested, and acquiring a CPU logic core and the residual logic cores occupied by the board to be tested when the board to be tested operates at the full pressure; pressurizing the rest logic cores until the rest logic cores run at full pressure, and realizing that the CPU resources are fully occupied by the simulation board card and the application; and recording the actual operation power consumption and the heat dissipation capacity of the CPU and the board card to be tested, and outputting. The invention monitors the occupation condition of the CPU logic core number of the board card to be tested in full-load operation, pressurizes the rest logic cores until the board card to be tested and the CPU can be operated in full-load, simulates the practical application scene of the server, provides data basis for the power consumption of the board card to be tested and the CPU heat dissipation test, can ensure the full-load operation of the board card to be tested, and greatly saves the test time and the manual test workload.
Description
Technical Field
The invention belongs to the technical field of server board card testing, and particularly relates to a pressure testing method and device for simulating a board card and an application to fully occupy CPU resources.
Background
With the increasing demand of servers matching different board cards, for example, the following generation Whitely platform, a two-way server will be full of many board card devices. In the current pull platform, a server can be matched with devices such as a GPU, an NPU and a display card according to requirements. In the field of server testing, after a certain board card device is plugged in a server, the device only occupies a part of resources of a CPU, and the residual utilization rate of the CPU is fully loaded under the condition that the full pressure test of the board card device is required to be ensured according to the test requirement, wherein the full load is realized by the operation of some applications or the occupation of hard disks and other board card hardware in an actual application scene. One of the existing testing methods is to match with other board card devices, firstly run the tested board card at full power, and then pressurize the other devices; the second is to run the board under test at full power and then pressurize the CPU with the PTU tool.
Although the two methods can enable the CPU to meet the condition of occupancy rate and full pressure, the method can affect the tested board card component, reduce the occupancy rate of the tested board card to the CPU, cause the tested board card component not to run at full power consumption, and achieve the condition that the CPU is not run at full load under the condition that the tested board card component runs at full pressure.
Therefore, it is very necessary to provide a method and an apparatus for testing the pressure of the analog board and the application occupying the CPU resources, in order to overcome the above-mentioned drawbacks in the prior art.
Disclosure of Invention
The invention provides a pressure test method and a pressure test device for simulating a board card and an application occupying CPU resources, aiming at the defects that the two existing board card test methods in the prior art can not realize full-pressure operation of the tested board card, or need to be matched with other hardware, and the mode of gradual regulation and control wastes time and labor.
In a first aspect, the present invention provides a pressure test method for simulating a board card and an application occupying CPU resources, including the following steps:
s1, building a test environment, and installing a board card to be tested in a server;
s2, starting a test, setting the board to be tested to operate under full pressure, and acquiring a CPU logic core and the rest logic cores occupied by the board to be tested when the board to be tested operates under full pressure;
s3, pressurizing the residual logic cores until the residual logic cores run at full pressure, and realizing that the CPU resources are fully occupied by the simulation board card and the application;
and S4, recording the actual operation power consumption and the heat dissipation capacity of the CPU and the board card to be tested, and outputting.
Further, the step S1 specifically includes the following steps:
s11, building a test environment;
s12, setting a server memory and a CPU full configuration;
s13, installing an operating system;
s14, mounting the board card to be tested.
Further, the step S2 specifically includes the following steps:
s21, starting a test;
s22, acquiring the type of the board card to be tested, and selecting a testing tool to perform full pressure test on the board card to be tested according to the type of the board card to be tested;
s23, acquiring an occupied logic core of the CPU when the board to be tested runs under full pressure;
s24, judging whether all logic cores of the CPU are occupied or not;
if yes, go to step S4;
if not, the remaining logical cores are acquired, and the process proceeds to step S3.
Further, the step S3 specifically includes the following steps:
s31, judging whether the occupancy rates of the occupied logic cores of the CPU are both 100%;
if yes, go to step S33;
if not, go to step S32;
s32, acquiring a logic core with the occupancy rate of not 100%, setting the logic core as an underutilized core, and performing a pressurization test on the underutilized core through a PTU tool until the utilization rate of the underutilized core reaches 100%;
and S33, performing pressurization test on the remaining logic cores through the PTU tool until the remaining logic cores run at full pressure, so that the CPU resources are fully occupied by the simulation board card and the application.
Further, the step S4 specifically includes the following steps:
s41, acquiring and recording the running power consumption and the heat dissipation capacity of the board to be tested in full-pressure running;
s42, acquiring and recording the total operation power consumption and heat dissipation capacity of each logic core of the CPU in full-pressure operation;
and S43, outputting the respective running power consumption and heat dissipation capacity of the board card to be tested and the CPU.
In a second aspect, the present invention provides a pressure testing apparatus for simulating a board card and an application occupying CPU resources, including:
the test environment building module is used for building a test environment and installing a board card to be tested in the server;
the full pressure test module of the board card to be tested is used for starting the test, setting the full pressure operation of the board card to be tested, and acquiring the CPU logic core and the residual logic core occupied by the board card to be tested when the board card is operated at the full pressure;
the CPU logic core full-occupation simulation module is used for pressurizing the rest logic cores until the rest logic cores run at full pressure, so that the CPU resources are occupied by the simulation board card and the application;
and the power consumption and heat dissipation output module is used for recording the actual operation power consumption and heat dissipation of the CPU and the board card to be tested and outputting the actual operation power consumption and heat dissipation.
Further, the test environment building module includes:
the test environment building unit is used for building a test environment;
the memory and CPU configuration unit is used for setting the full configuration of the server memory and the CPU;
an operating system installation unit for installing an operating system;
and the board card installation unit to be tested is used for installing the board card to be tested.
Further, the board full pressure test module that awaits measuring includes:
the test starting unit is used for starting a test;
the full pressure test setting unit of the board card to be tested is used for acquiring the type of the board card to be tested and selecting a test tool to perform full pressure test on the board card to be tested according to the type of the board card to be tested;
the CPU occupation logic core acquisition unit is used for acquiring the logic core occupied by the CPU when the board to be tested runs at full pressure;
the logic core occupation judging unit is used for judging whether all logic cores of the CPU are occupied or not;
and the residual logic core acquisition unit is used for acquiring the residual logic cores when all the logic cores of the CPU are not occupied.
Further, the CPU logic core full simulation module includes:
the occupancy rate judging unit is used for judging whether the occupancy rates of the occupied logic cores of the CPU are both 100%;
the underutilization core pressurizing unit is used for acquiring the logic core with the occupancy rate of not 100% when the logic core occupied by the CPU is not fully occupied, setting the logic core as the underutilization core, and performing pressurization test on the underutilization core through a PTU tool until the utilization rate of the underutilization core reaches 100%;
and the residual logic pressurization unit is used for performing pressurization test on the residual logic cores through the PTU tool until the residual logic cores run at full pressure, so that the CPU resources are fully occupied by the simulation board card and the application.
Further, the power consumption and heat dissipation output module comprises:
the device comprises a to-be-tested board power consumption and heat dissipation capacity acquisition unit, a to-be-tested board power consumption and heat dissipation capacity acquisition unit and a to-be-tested board power consumption and heat dissipation capacity acquisition unit, wherein the to-be-tested board power consumption and heat dissipation capacity acquisition unit is used for acquiring and recording the operation power consumption and heat dissipation capacity of the to-be-tested board in full-pressure operation;
a CPU power consumption and heat dissipation capacity acquisition unit for acquiring and recording the total operation power consumption and heat dissipation capacity of each logic core of the CPU in full-pressure operation;
and the power consumption and heat dissipation output unit is used for outputting the respective operation power consumption and heat dissipation of the board card to be tested and the CPU.
The beneficial effect of the invention is that,
according to the pressure test method and device for simulating the board card and the CPU resource occupied by the application, the actual occupation situation of the CPU logic cores is monitored when the board card to be tested runs in full load, then the rest logic cores are pressurized until the application scene that both the board card to be tested and the CPU can run in full load is reached, and data basis is provided for the actual application scene of a simulation server, the power consumption of the board card to be tested and the heat dissipation test of the CPU.
In addition, the invention has reliable design principle, simple structure and very wide application prospect.
Therefore, compared with the prior art, the invention has prominent substantive features and remarkable progress, and the beneficial effects of the implementation are also obvious.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
FIG. 1 is a first schematic flow chart of the method of the present invention;
FIG. 2 is a second schematic flow chart of the method of the present invention;
FIG. 3 is a schematic diagram of the system of the present invention;
in the figure, 1-a test environment building module; 1.1-a test environment building unit; 1.2-memory and CPU configuration unit; 1.3-operating system installation unit; 1.4-a board card installation unit to be tested; 2-a full pressure test module of the board to be tested; 2.1-test start unit; 2.2-a board to be tested full pressure test setting unit; 2.3-CPU occupies the logic core obtaining unit; 2.4-logic core occupation judging unit; 2.5-remaining logical core acquisition unit; 3-CPU logic core full analog module; 3.1-occupancy rate judgment unit of occupied logic core; 3.2-underutilization of the nuclear compression unit; 3.3-remaining logical compression units; 4-power consumption and heat dissipation output module; 4.1-a unit for acquiring the power consumption and the heat dissipation capacity of the board card to be tested; 4.2-CPU power consumption and heat dissipation capacity acquisition unit; 4.3-power consumption and heat dissipation output unit.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1:
as shown in fig. 1, the present invention provides a pressure testing method for simulating a board card and an application occupying CPU resources, which includes the following steps:
s1, building a test environment, and installing a board card to be tested in a server;
s2, starting a test, setting the board to be tested to operate under full pressure, and acquiring a CPU logic core and the rest logic cores occupied by the board to be tested when the board to be tested operates under full pressure;
s3, pressurizing the residual logic cores until the residual logic cores run at full pressure, and realizing that the CPU resources are fully occupied by the simulation board card and the application;
and S4, recording the actual operation power consumption and the heat dissipation capacity of the CPU and the board card to be tested, and outputting.
Example 2:
as shown in fig. 2, the present invention provides a pressure testing method for simulating a board card and an application occupying CPU resources, which includes the following steps:
s1, building a test environment, and installing a board card to be tested in a server; the method comprises the following specific steps:
s11, building a test environment;
s12, setting a server memory and a CPU full configuration;
s13, installing an operating system;
s14, mounting a board to be tested;
s2, starting a test, setting the board to be tested to operate under full pressure, and acquiring a CPU logic core and the rest logic cores occupied by the board to be tested when the board to be tested operates under full pressure; the method comprises the following specific steps:
s21, starting a test;
s22, acquiring the type of the board card to be tested, and selecting a testing tool to perform full pressure test on the board card to be tested according to the type of the board card to be tested; for example, when the board to be tested is a GPU board, an nvqual test tool is adopted;
s23, acquiring an occupied logic core of the CPU when the board to be tested runs under full pressure; the method can be realized by the following steps: the sar-P ALL 110 checks the occupation condition of the logic core of the CPU;
s24, judging whether all logic cores of the CPU are occupied or not;
if yes, go to step S4;
if not, acquiring the residual logic cores, and entering the step S3; comparing the occupied logic core with the physical core comparison table to find out the rest logic cores needing to be pressurized;
s3, pressurizing the residual logic cores until the residual logic cores run at full pressure, and realizing that the CPU resources are fully occupied by the simulation board card and the application; the method comprises the following specific steps:
s31, judging whether the occupancy rates of the occupied logic cores of the CPU are both 100%;
if yes, go to step S33;
if not, go to step S32;
s32, acquiring a logic core with the occupancy rate of not 100%, setting the logic core as an underutilized core, and performing a pressurization test on the underutilized core through a PTU tool until the utilization rate of the underutilized core reaches 100%;
s33, performing pressurization test on the remaining logic cores through a PTU tool until the remaining logic cores run at full pressure, and realizing that the CPU resources are fully occupied by the simulation board card and the application; the following code may be used: testing the residual logic cores under pressure by ptugen-ct 2-cpu 1core 0 x;
s4, recording actual operation power consumption and heat dissipation capacity of the CPU and the board card to be tested, and outputting; the method comprises the following specific steps:
s41, acquiring and recording the running power consumption and the heat dissipation capacity of the board to be tested in full-pressure running;
s42, acquiring and recording the total operation power consumption and heat dissipation capacity of each logic core of the CPU in full-pressure operation;
and S43, outputting the respective running power consumption and heat dissipation capacity of the board card to be tested and the CPU.
Example 3:
as shown in fig. 3, the present invention provides a pressure testing apparatus for simulating board card and application occupying CPU resources, including:
the test environment building module 1 is used for building a test environment and installing a board card to be tested in the server; the test environment building module 1 includes:
the test environment building unit 1.1 is used for building a test environment;
the memory and CPU configuration unit 1.2 is used for setting the full configuration of the memory and the CPU of the server;
an operating system installation unit 1.3 for installing an operating system;
the board card installation unit 1.4 to be tested is used for installing the board card to be tested;
the board to be tested full pressure test module 2 is used for starting a test, setting the board to be tested to run under full pressure, and acquiring a CPU logic core and the rest logic cores occupied by the board to be tested when the board to be tested runs under full pressure; the board full pressure test module 2 that awaits measuring includes:
a test starting unit 2.1 for starting a test;
the full pressure test setting unit 2.2 of the board to be tested is used for acquiring the type of the board to be tested and selecting a test tool to perform full pressure test on the board to be tested according to the type of the board to be tested;
a CPU occupation logic core obtaining unit 2.3, configured to obtain a logic core occupied by the CPU when the board to be tested operates at full pressure;
a logic core occupation judging unit 2.4, configured to judge whether all logic cores of the CPU are occupied;
a remaining logic core obtaining unit 2.5, configured to obtain a remaining logic core when all logic cores of the CPU are not occupied;
the CPU logic core full-occupation simulation module 3 is used for pressurizing the rest logic cores until the rest logic cores run at full pressure, so that the CPU resources are occupied by the simulation board card and the application; the CPU logic core full simulation module 3 includes:
an occupancy rate judgment unit 3.1 for judging whether the occupancy rates of the occupied logical cores of the CPU are both 100%;
the underutilization core pressurizing unit 3.2 is used for acquiring the logic cores with the occupancy rates of not 100% when the logic cores occupied by the CPU are not fully occupied, setting the logic cores as the underutilization cores, and performing pressurization test on the underutilization cores through a PTU tool until the utilization rate of the underutilization cores reaches 100%;
the residual logic pressurization unit 3.3 is used for performing pressurization test on the residual logic cores through the PTU tool until the residual logic cores run at full pressure, so that the simulation board card and the application occupy the CPU resources;
the power consumption and heat dissipation output module 4 is used for recording the actual operation power consumption and heat dissipation of the CPU and the board card to be tested and outputting the actual operation power consumption and heat dissipation; the power consumption and heat dissipation output module 4 includes:
the power consumption and heat dissipation capacity acquisition unit 4.1 of the board card to be tested is used for acquiring and recording the running power consumption and heat dissipation capacity of the board card to be tested in full-pressure running;
a CPU power consumption and heat dissipation capacity obtaining unit 4.2, which is used for obtaining and recording the total operation power consumption and heat dissipation capacity of each logic core of the CPU in full pressure operation;
and the power consumption and heat dissipation output unit 4.3 is used for outputting the respective running power consumption and heat dissipation of the board card to be tested and the CPU.
Although the present invention has been described in detail by referring to the drawings in connection with the preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and scope of the present invention, and these modifications or substitutions are within the scope of the present invention/any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A pressure test method for simulating board cards and applying full CPU resources is characterized by comprising the following steps:
s1, building a test environment, and installing a board card to be tested in a server;
s2, starting a test, setting the board to be tested to operate under full pressure, and acquiring a CPU logic core and the rest logic cores occupied by the board to be tested when the board to be tested operates under full pressure;
s3, pressurizing the residual logic cores until the residual logic cores run at full pressure, and realizing that the CPU resources are fully occupied by the simulation board card and the application;
and S4, recording the actual operation power consumption and the heat dissipation capacity of the CPU and the board card to be tested, and outputting.
2. The method for testing the pressure of the simulation board card and the application occupying the CPU resource according to claim 1, wherein the step S1 specifically comprises the following steps:
s11, building a test environment;
s12, setting a server memory and a CPU full configuration;
s13, installing an operating system;
and S14, mounting a board card to be tested.
3. The method for testing the pressure of the simulation board card and the application occupying the CPU resource according to claim 1, wherein the step S2 specifically comprises the following steps:
s21, starting a test;
s22, acquiring the type of the board card to be tested, and selecting a testing tool to perform full pressure test on the board card to be tested according to the type of the board card to be tested;
s23, acquiring an occupied logic core of the CPU when the board to be tested runs under full pressure;
s24, judging whether all logic cores of the CPU are occupied or not;
if yes, go to step S4;
if not, the remaining logical cores are acquired, and the process proceeds to step S3.
4. The method for testing the pressure of the simulation board card and the application occupying the CPU resource according to claim 1, wherein the step S3 specifically comprises the following steps:
s31, judging whether the occupancy rates of the occupied logic cores of the CPU are both 100%;
if yes, go to step S33;
if not, go to step S32;
s32, acquiring a logic core with the occupancy rate of not 100%, setting the logic core as an underutilized core, and performing a pressurization test on the underutilized core through a PTU tool until the utilization rate of the underutilized core reaches 100%;
and S33, performing pressurization test on the remaining logic cores through the PTU tool until the remaining logic cores run at full pressure, so that the CPU resources are fully occupied by the simulation board card and the application.
5. The method for testing the pressure of the simulation board card and the application occupying the CPU resource according to claim 1, wherein the step S4 specifically comprises the following steps:
s41, acquiring and recording the running power consumption and the heat dissipation capacity of the board to be tested in full-pressure running;
s42, acquiring and recording the total operation power consumption and heat dissipation capacity of each logic core of the CPU in full-pressure operation;
and S43, outputting the respective running power consumption and heat dissipation capacity of the board card to be tested and the CPU.
6. A pressure test device for simulating board cards and applications occupying CPU resources is characterized by comprising:
the test environment building module (1) is used for building a test environment and installing a board card to be tested in the server;
the full-pressure test module (2) of the board to be tested is used for starting a test, setting the full-pressure operation of the board to be tested, and acquiring a CPU logic core and the residual logic core occupied by the board to be tested when the board to be tested operates at the full pressure;
the CPU logic core full-occupation simulation module (3) is used for pressurizing the rest logic cores until the rest logic cores run at full pressure, so that the CPU resources are occupied by the simulation board card and the application;
and the power consumption and heat dissipation output module (4) is used for recording the actual operation power consumption and heat dissipation of the CPU and the board card to be tested and outputting the actual operation power consumption and heat dissipation.
7. The pressure testing device for simulating the board card and the application occupying the CPU resource according to claim 6, wherein the testing environment building module (1) comprises:
the test environment building unit (1.1) is used for building a test environment;
the memory and CPU configuration unit (1.2) is used for setting the full configuration of the memory and the CPU of the server;
an operating system installation unit (1.3) for installing an operating system;
and the board card mounting unit (1.4) to be tested is used for mounting the board card to be tested.
8. The pressure test device for simulating the board card and the application occupying the CPU resources according to claim 6, wherein the board card full pressure test module (2) to be tested comprises:
a test start unit (2.1) for starting a test;
the full pressure test setting unit (2.2) of the board card to be tested is used for acquiring the type of the board card to be tested and selecting a test tool to perform full pressure test on the board card to be tested according to the type of the board card to be tested;
a CPU occupation logic core obtaining unit (2.3) for obtaining the logic core occupied by the CPU when the board to be tested runs at full pressure;
a logic core occupation judging unit (2.4) for judging whether all logic cores of the CPU are occupied;
and a remaining logic core acquisition unit (2.5) for acquiring the remaining logic cores when all the logic cores of the CPU are not occupied.
9. The pressure test device for simulating board card and application full of CPU resources as claimed in claim 6, wherein the CPU logic core full simulation module (3) comprises:
an occupancy rate judgment unit (3.1) for judging whether the occupancy rates of the occupied logic cores of the CPU are both 100%;
the underutilization core pressurizing unit (3.2) is used for acquiring the logic core with the occupancy rate of not 100% when the logic core occupied by the CPU is not fully occupied, setting the logic core as the underutilization core, and performing pressurization test on the underutilization core through a PTU tool until the utilization rate of the underutilization core reaches 100%;
and the residual logic pressurization unit (3.3) is used for performing pressurization test on the residual logic cores through the PTU tool until the residual logic cores run at full pressure, so that the simulation board card and the application occupy the CPU resource.
10. The pressure test device for simulating the occupation of the board card and the application of the CPU resource according to claim 6, wherein the power consumption and heat dissipation output module (4) comprises:
the power consumption and heat dissipation capacity acquisition unit (4.1) of the board card to be tested is used for acquiring and recording the running power consumption and heat dissipation capacity of the board card to be tested in full-pressure operation;
a CPU power consumption and heat dissipation capacity acquisition unit (4.2) for acquiring and recording the total operation power consumption and heat dissipation capacity of each logic core of the CPU in full pressure operation;
and the power consumption and heat dissipation output unit (4.3) is used for outputting the respective operation power consumption and heat dissipation of the board card to be tested and the CPU.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104502690A (en) * | 2014-12-30 | 2015-04-08 | 中科创达软件股份有限公司 | CPU power consumption test method and CPU power consumption test system |
| CN111966549A (en) * | 2020-08-19 | 2020-11-20 | 苏州浪潮智能科技有限公司 | CPU pressure testing method and device of server and computer readable storage medium |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104502690A (en) * | 2014-12-30 | 2015-04-08 | 中科创达软件股份有限公司 | CPU power consumption test method and CPU power consumption test system |
| CN111966549A (en) * | 2020-08-19 | 2020-11-20 | 苏州浪潮智能科技有限公司 | CPU pressure testing method and device of server and computer readable storage medium |
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