CN112667493B - Stress testing method and device for simulating boards and applications occupying CPU resources - Google Patents

Abstract

The invention provides a stress testing method and device in which an analog board and an application occupy full CPU resources. The method includes the steps of: building a test environment, installing a board to be tested in a server; starting the test, and setting the board to be tested to run under full pressure , and obtain the CPU logic cores and remaining logic cores occupied by the board to be tested when running at full pressure; pressurize the remaining logic cores until the remaining logic cores run at full pressure, so that the simulated boards and applications occupy full CPU resources; The actual operating power consumption and heat dissipation of the board to be tested are output. The invention monitors the occupancy of the CPU logic cores running at full load of the board to be tested, pressurizes the remaining logic cores until the board to be tested and the CPU can run at full load, simulates the actual application scenario of the server, and is the board to be tested. The card power consumption and CPU heat dissipation test provide data basis, which can not only ensure the full-load operation of the board under test, but also greatly save the test time and manual test workload.

Description

Stress testing method and device for simulating boards and applications occupying CPU resources

technical field

The invention belongs to the technical field of server board card testing, and in particular relates to a stress testing method and device in which an analog board card and an application occupy CPU resources.

Background technique

As the demand for servers with different boards continues to increase, taking the next-generation Whitely platform as an example, a dual-socket server will be filled with many board devices. On the current Purly platform, servers can be equipped with GPUs, NPUs, graphics cards and other devices as required. In the field of server testing, when a certain board device is plugged into the server, the device will only occupy a part of the CPU resources. According to the test requirements, it is necessary to ensure that the remaining CPU utilization is fully loaded when the board device is fully stressed and tested. The so-called In practical application scenarios, full load is achieved through the operation of some applications or the occupation of hard disks and other board hardware. One of the existing test methods is to match other board equipment, first run the tested board at full power, and then pressurize other devices; the second is to run the tested board at full power and then use the PTU tool to test the CPU. Pressurize.

Although the above two methods can make the CPU meet the full occupancy rate, they will affect the tested board components, reduce the occupancy rate of the tested board on the CPU, and cause the tested board components not to be fully functional. It is not possible to run at full load on the remaining CPU resources under the condition that the board components under test are run at full voltage.

This is a shortcoming of the prior art. Therefore, in view of the above-mentioned defects in the prior art, it is very necessary to provide a stress testing method and apparatus for simulating a board card and an application to occupy CPU resources.

SUMMARY OF THE INVENTION

Aiming at the shortcomings of the prior art that the above-mentioned two existing board testing methods cannot realize the full pressure operation of the tested board, or need to be matched with other hardware, and the method of step-by-step regulation is time-consuming and labor-intensive, the present invention provides an analog board with A stress testing method and device that occupies CPU resources are applied to solve the above-mentioned technical problems.

In a first aspect, the present invention provides a stress test method for simulating a board and an application to occupy CPU resources, including the following steps:

S1. Build a test environment and install the board to be tested in the server;

S2. Start the test, set the board to be tested to run at full pressure, and obtain the CPU logic cores and remaining logic cores occupied by the board to be tested when running at full pressure;

S3. Pressurize the remaining logic cores until the remaining logic cores run under full pressure, so that the simulation board and application can occupy the CPU resources;

S4. Record the actual operating power consumption and heat dissipation of the CPU and the board to be tested, and output them.

Further, the specific steps of step S1 are as follows:

S11. Build a test environment;

S12. Set the server memory and CPU full configuration;

S13. Install the operating system;

S14. Install the board to be tested.

Further, the specific steps of step S2 are as follows:

S21. Start the test;

S22. Obtain the type of the board to be tested, and select a test tool according to the type of the board to be tested to perform a full pressure test on the board to be tested;

S23. Obtain the logic cores occupied by the CPU when the board to be tested is running under full pressure;

S24. Determine whether all logical cores of the CPU are occupied;

If yes, go to step S4;

If not, obtain the remaining logic cores, and go to step S3.

Further, the specific steps of step S3 are as follows:

S31. Determine whether the occupancy rate of the CPU occupied logic core is 100%;

If yes, go to step S33;

If not, go to step S32;

S32. Obtain the logical core whose occupancy rate is not 100%, set it as an underutilized core, and perform a stress test on the underutilized core through the PTU tool until the underutilized core utilization rate reaches 100%;

S33. Use the PTU tool to perform a pressure test on the remaining logic cores until the remaining logic cores run under full pressure, so that the simulated boards and applications can fill up the CPU resources.

Further, the specific steps of step S4 are as follows:

S41. Obtain and record the operating power consumption and heat dissipation of the board to be tested under full pressure;

S42. Obtain and record the total operating power consumption and heat dissipation of each logical core of the CPU running under full pressure;

S43. Output the respective operating power consumption and heat dissipation of the board to be tested and the CPU.

In a second aspect, the present invention provides a stress testing device in which an analog board and an application occupy full CPU resources, including:

The test environment building module is used to build the test environment and install the board to be tested in the server;

The board under test is full of pressure test module, which is used to start the test, set the board under test to run under full pressure, and obtain the CPU logic cores and remaining logic cores occupied by the board under test when it runs under full pressure;

The CPU logic core fills the analog module, and the remaining logic cores are pressurized until the remaining logic cores run under full pressure, so that the simulation board and applications can fill up the CPU resources;

The power consumption and heat dissipation output module is used to record and output the actual operating power consumption and heat dissipation of the CPU and the board under test.

Further, the test environment building module includes:

The test environment building unit is used to build the test environment;

The memory and CPU configuration unit is used to set the full configuration of server memory and CPU;

an operating system installation unit for installing an operating system;

The installation unit for the board to be tested is used to install the board to be tested.

Further, the full pressure test module of the board to be tested includes:

Test start unit, used to start the test;

The full pressure test setting unit of the board to be tested is used to obtain the type of the board to be tested, and select a test tool to perform a full pressure test of the board to be tested according to the type of the board to be tested;

The CPU occupied logic core acquisition unit is used to obtain the logic cores occupied by the CPU when the board under test is running under full pressure;

The logic core occupancy judgment unit is used to judge whether all the logic cores of the CPU are occupied;

The remaining logical core acquiring unit is used to acquire the remaining logical cores when all logical cores of the CPU are not occupied.

Further, the full simulation module of the CPU logic core includes:

The occupied logic core occupancy rate judgment unit is used to judge whether the occupancy rate of the CPU occupied logic core is 100%;

The underutilized core pressurization unit is used to obtain logical cores whose occupancy rate is not 100% when the CPU is occupied and the logical cores are not fully occupied, and set them as underutilized cores. Pressure testing until the underutilized nuclear utilization reaches 100%;

The remaining logic pressurization unit is used to pressurize the remaining logic cores through the PTU tool until the remaining logic cores run under full pressure, so that the simulation board and applications can occupy the CPU resources.

Further, the power consumption and heat dissipation output module includes:

The power consumption and heat dissipation acquisition unit of the board to be tested is used to obtain and record the operating power consumption and heat dissipation of the board to be tested under full pressure;

The CPU power consumption and heat dissipation acquisition unit is used to obtain and record the total operating power consumption and heat dissipation of each logical core of the CPU running under full pressure;

The power consumption and heat dissipation output unit is used to output the respective operating power consumption and heat dissipation of the board under test and the CPU.

The beneficial effect of the present invention is that,

The stress testing method and device for simulating board cards and applications that occupy full CPU resources provided by the present invention monitor the actual occupancy of the number of CPU logical cores when the board to be tested is fully loaded, and then pressurize the remaining logical cores until the The application scenario where both the board to be tested and the CPU can run at full load provides data basis for the actual application scenario of the simulated server, the power consumption of the board to be tested, and the heat dissipation test of the CPU. Compared with the traditional testing method, the present invention can ensure that both The full-load operation of the board under test also greatly saves test time and manual test workload.

In addition, the present invention has reliable design principle and simple structure, and has a very wide application prospect.

It can be seen that, compared with the prior art, the present invention has outstanding substantive features and significant progress, and the beneficial effects of its implementation are also obvious.

Description of drawings

In order to illustrate the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. In other words, other drawings can also be obtained based on these drawings without creative labor.

Fig. 1 is method flow schematic diagram one of the present invention;

Fig. 2 is method flow schematic diagram two of the present invention;

Fig. 3 is the system schematic diagram of the present invention;

In the figure, 1- test environment building module; 1.1- test environment building unit; 1.2- memory and CPU configuration unit; 1.3- operating system installation unit; 1.4- board under test installation unit; 2- board under test full pressure test Module; 2.1-Test startup unit; 2.2-Board under test full stress test setting unit; 2.3-CPU occupied logic core acquisition unit; 2.4-Logical core occupied judgment unit; 2.5-Remaining logic core acquisition unit; 3-CPU logic core Occupied analog module; 3.1-Occupied logic core occupancy rate judgment unit; 3.2-Unfully utilized core pressure unit; 3.3-Remaining logic pressure unit; 4-Power consumption and heat dissipation output module; 4.1-Untested board power Power consumption and heat dissipation acquisition unit; 4.2-CPU power consumption and heat dissipation acquisition unit; 4.3-Power consumption and heat dissipation output unit.

Detailed ways

In order to make those skilled in the art better understand the technical solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

Example 1:

As shown in FIG. 1 , the present invention provides a stress test method for simulating a board and an application to occupy CPU resources, including the following steps:

S1. Build a test environment and install the board to be tested in the server;

S2. Start the test, set the board to be tested to run at full pressure, and obtain the CPU logic cores and remaining logic cores occupied by the board to be tested when running at full pressure;

S3. Pressurize the remaining logic cores until the remaining logic cores run under full pressure, so that the simulation board and application can occupy the CPU resources;

S4. Record the actual operating power consumption and heat dissipation of the CPU and the board to be tested, and output them.

Example 2:

As shown in FIG. 2 , the present invention provides a stress test method in which an analog board and an application occupy CPU resources, including the following steps:

S1. Build a test environment and install the board to be tested in the server; the specific steps are as follows:

S11. Build a test environment;

S12. Set the server memory and CPU full configuration;

S13. Install the operating system;

S14. Install the board to be tested;

S2. Start the test, set the board to be tested to run at full pressure, and obtain the CPU logic cores and remaining logic cores occupied by the board to be tested when running at full pressure; the specific steps are as follows:

S21. Start the test;

S22. Obtain the type of the board to be tested, and select a test tool according to the type of the board to be tested to perform a full stress test on the board to be tested; for example, when the board to be tested is a GPU board, use the nvqual test tool;

S23. Obtain the logic cores occupied by the CPU when the board to be tested is running under full pressure; you can check the logic core occupancy status of the CPU through the code: sar-P ALL 110;

S24. Determine whether all logical cores of the CPU are occupied;

If yes, go to step S4;

If not, obtain the remaining logical cores, and proceed to step S3; compare the occupied logical cores with the physical core comparison table, and then find out the remaining logical cores that need to be pressurized;

S3. Pressurize the remaining logic cores until the remaining logic cores run at full pressure, so that the simulation board and applications can occupy the CPU resources; the specific steps are as follows:

S31. Determine whether the occupancy rate of the CPU occupied logic core is 100%;

If yes, go to step S33;

If not, go to step S32;

S32. Obtain the logical core whose occupancy rate is not 100%, set it as an underutilized core, and perform a stress test on the underutilized core through the PTU tool until the underutilized core utilization rate reaches 100%;

S33. Use the PTU tool to pressurize the remaining logic cores until the remaining logic cores run under full pressure, so that the simulation board and applications can occupy the CPU resources; the following code can be used: ptugen–ct2–cpu 1core 0x** to the remaining logic Nuclear pressure test;

S4. Record the actual operating power consumption and heat dissipation of the CPU and the board to be tested, and output them; the specific steps are as follows:

S41. Obtain and record the operating power consumption and heat dissipation of the board to be tested under full pressure;

S42. Obtain and record the total operating power consumption and heat dissipation of each logical core of the CPU running under full pressure;

S43. Output the respective operating power consumption and heat dissipation of the board to be tested and the CPU.

Example 3:

As shown in FIG. 3 , the present invention provides a stress testing device for simulating a board and an application that occupies CPU resources, including:

The test environment building module 1 is used to build the test environment and install the board to be tested in the server; the test environment building module 1 includes:

The test environment building unit 1.1 is used to build the test environment;

Memory and CPU configuration unit 1.2, used to set the server memory and CPU full configuration;

The operating system installation unit 1.3 is used to install the operating system;

The board under test installation unit 1.4 is used to install the board under test;

The board under test is full of pressure test module 2, which is used to start the test, set the board under test to run under full pressure, and obtain the CPU logic cores and remaining logic cores occupied by the board under test when the board under test runs under full pressure; the board under test is full Stress Test Module 2 includes:

Test start unit 2.1, used to start the test;

The full pressure test setting unit 2.2 of the board to be tested is used to obtain the type of the board to be tested, and select a test tool to perform a full pressure test of the board to be tested according to the type of the board to be tested;

The CPU occupied logic core acquisition unit 2.3 is used to obtain the logic cores occupied by the CPU when the board under test is running under full pressure;

The logical core occupation determination unit 2.4 is used to determine whether all logical cores of the CPU are occupied;

The remaining logical core acquisition unit 2.5 is used to acquire the remaining logical cores when all logical cores of the CPU are not occupied;

The CPU logic core fills up the simulation module 3, and pressurizes the remaining logic cores until the remaining logic cores run at full pressure, so that the simulation board and applications fill up the CPU resources; the CPU logic core fills up the simulation module 3, including:

The occupied logic core occupancy rate judgment unit 3.1 is used to judge whether the occupancy rate of the CPU occupied logic core is 100%;

The underutilized core pressure unit 3.2 is used to obtain logical cores whose occupancy rate is not 100% when the CPU is occupied and the logical cores are not fully occupied, and set them as underutilized cores. Pressure testing is performed until the underutilized nuclear utilization reaches 100%;

The remaining logic pressurization unit 3.3 is used to pressurize the remaining logic cores through the PTU tool until the remaining logic cores run under full pressure, so that the simulation boards and applications can fill up the CPU resources;

The power consumption and heat dissipation output module 4 is used to record the actual operating power consumption and heat dissipation of the CPU and the board to be tested, and output them; the power consumption and heat dissipation output module 4 includes:

The power consumption and heat dissipation acquisition unit 4.1 of the board to be tested is used to obtain and record the operating power consumption and heat dissipation of the board to be tested under full pressure;

The CPU power consumption and heat dissipation acquisition unit 4.2 is used to obtain and record the total operating power consumption and heat dissipation of each logical core of the CPU under full pressure;

The power consumption and heat dissipation output unit 4.3 is used to output the respective operating power consumption and heat dissipation of the board to be tested and the CPU.

Although the present invention has been described in detail in conjunction with the preferred embodiments with reference to the accompanying drawings, the present invention is not limited thereto. Without departing from the spirit and essence of the present invention, those of ordinary skill in the art can make various equivalent modifications or substitutions to the embodiments of the present invention, and these modifications or substitutions should all fall within the scope of the present invention/any Those skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should all be included within the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims (10)

1. A pressure test method for simulating board cards and applying full CPU resources is characterized by comprising the following steps:

s1, building a test environment, and installing a board card to be tested in a server;

s2, starting a test, setting the board to be tested to operate under full pressure, and acquiring a CPU logic core and the rest logic cores occupied by the board to be tested when the board to be tested operates under full pressure;

s3, pressurizing the residual logic cores until the residual logic cores run at full pressure, and realizing that the CPU resources are fully occupied by the simulation board card and the application;

and S4, recording the actual operation power consumption and the heat dissipation capacity of the CPU and the board card to be tested, and outputting.

2. The method for testing the pressure of the simulation board card and the application occupying the CPU resource according to claim 1, wherein the step S1 specifically comprises the following steps:

s11, building a test environment;

s12, setting a server memory and a CPU full configuration;

s13, installing an operating system;

and S14, mounting a board card to be tested.

3. The method for testing the pressure of the simulation board card and the application occupying the CPU resource according to claim 1, wherein the step S2 specifically comprises the following steps:

s21, starting a test;

s22, acquiring the type of the board card to be tested, and selecting a testing tool to perform full pressure test on the board card to be tested according to the type of the board card to be tested;

s23, acquiring an occupied logic core of the CPU when the board to be tested runs under full pressure;

s24, judging whether all logic cores of the CPU are occupied or not;

if yes, go to step S4;

if not, the remaining logical cores are acquired, and the process proceeds to step S3.

4. The method for testing the pressure of the simulation board card and the application occupying the CPU resource according to claim 1, wherein the step S3 specifically comprises the following steps:

s31, judging whether the occupancy rates of the occupied logic cores of the CPU are both 100%;

if yes, go to step S33;

if not, go to step S32;

s32, acquiring a logic core with the occupancy rate of not 100%, setting the logic core as an underutilized core, and performing a pressurization test on the underutilized core through a PTU tool until the utilization rate of the underutilized core reaches 100%;

and S33, performing pressurization test on the remaining logic cores through the PTU tool until the remaining logic cores run at full pressure, so that the CPU resources are fully occupied by the simulation board card and the application.

5. The method for testing the pressure of the simulation board card and the application occupying the CPU resource according to claim 1, wherein the step S4 specifically comprises the following steps:

s41, acquiring and recording the running power consumption and the heat dissipation capacity of the board to be tested in full-pressure running;

s42, acquiring and recording the total operation power consumption and heat dissipation capacity of each logic core of the CPU in full-pressure operation;

and S43, outputting the respective running power consumption and heat dissipation capacity of the board card to be tested and the CPU.

6. A pressure test device for simulating board cards and applications occupying CPU resources is characterized by comprising:

the test environment building module (1) is used for building a test environment and installing a board card to be tested in the server;

the full-pressure test module (2) of the board to be tested is used for starting a test, setting the full-pressure operation of the board to be tested, and acquiring a CPU logic core and the residual logic core occupied by the board to be tested when the board to be tested operates at the full pressure;

the CPU logic core full-occupation simulation module (3) is used for pressurizing the rest logic cores until the rest logic cores run at full pressure, so that the CPU resources are occupied by the simulation board card and the application;

and the power consumption and heat dissipation output module (4) is used for recording the actual operation power consumption and heat dissipation of the CPU and the board card to be tested and outputting the actual operation power consumption and heat dissipation.

7. The pressure testing device for simulating the board card and the application occupying the CPU resource according to claim 6, wherein the testing environment building module (1) comprises:

the test environment building unit (1.1) is used for building a test environment;

the memory and CPU configuration unit (1.2) is used for setting the full configuration of the memory and the CPU of the server;

an operating system installation unit (1.3) for installing an operating system;

and the board card mounting unit (1.4) to be tested is used for mounting the board card to be tested.

8. The pressure test device for simulating the board card and the application occupying the CPU resources according to claim 6, wherein the board card full pressure test module (2) to be tested comprises:

a test start unit (2.1) for starting a test;

the full pressure test setting unit (2.2) of the board card to be tested is used for acquiring the type of the board card to be tested and selecting a test tool to perform full pressure test on the board card to be tested according to the type of the board card to be tested;

a CPU occupation logic core obtaining unit (2.3) for obtaining the logic core occupied by the CPU when the board to be tested runs at full pressure;

a logic core occupation judging unit (2.4) for judging whether all logic cores of the CPU are occupied;

and a remaining logic core acquisition unit (2.5) for acquiring the remaining logic cores when all the logic cores of the CPU are not occupied.

9. The pressure test device for simulating board card and application full of CPU resources as claimed in claim 6, wherein the CPU logic core full simulation module (3) comprises:

an occupancy rate judgment unit (3.1) for judging whether the occupancy rates of the occupied logic cores of the CPU are both 100%;

the underutilization core pressurizing unit (3.2) is used for acquiring the logic core with the occupancy rate of not 100% when the logic core occupied by the CPU is not fully occupied, setting the logic core as the underutilization core, and performing pressurization test on the underutilization core through a PTU tool until the utilization rate of the underutilization core reaches 100%;

and the residual logic pressurization unit (3.3) is used for performing pressurization test on the residual logic cores through the PTU tool until the residual logic cores run at full pressure, so that the simulation board card and the application occupy the CPU resource.

10. The pressure test device for simulating the occupation of the board card and the application of the CPU resource according to claim 6, wherein the power consumption and heat dissipation output module (4) comprises:

the power consumption and heat dissipation capacity acquisition unit (4.1) of the board card to be tested is used for acquiring and recording the running power consumption and heat dissipation capacity of the board card to be tested in full-pressure operation;

a CPU power consumption and heat dissipation capacity acquisition unit (4.2) for acquiring and recording the total operation power consumption and heat dissipation capacity of each logic core of the CPU in full pressure operation;

and the power consumption and heat dissipation output unit (4.3) is used for outputting the respective operation power consumption and heat dissipation of the board card to be tested and the CPU.

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