CN112666448A - DELP series probe station driving configuration method in chip CP test - Google Patents
DELP series probe station driving configuration method in chip CP test Download PDFInfo
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Abstract
The invention discloses a DELP series probe station drive configuration method in a chip CP test, which comprises classifying probe card distribution maps and configuring a corresponding drive program for each distribution map; making a list containing all the drivers and a batch file according to the classification condition; executing the batch processing file, selecting a drive program number, and automatically registering the used probe station drive to the host operating system of the tester by the batch processing program; and performing the air-out CP test to obtain the crystal core coordinates of the probe station and the test machine, performing coordinate comparison, and performing the CP volume production test of the wafer after confirming no error. By adopting the drive configuration method, the CP test coordinates can be completely matched, and the test machine can acquire correct wafer position coordinates from the probe station, so that the CP test of the chip wafer can be normally carried out; the mode that 9 types of drive registration can be processed by one batch processing is adopted, the operation of operators is simplified, and the test cost is saved.
Description
Technical Field
The invention belongs to the technical field of chip testing, and particularly relates to a DELP series probe station drive configuration method in chip CP testing.
Background
The CP (chip bonding) test is to test a wafer chip that has not been packaged, screen a qualified product, and determine whether to package, and the basic principle is to add a signal excitation to a pad, and then test a function, usually a CP test, which is only used for a basic connection test and a low-speed digital circuit test, but the cost of a machine test is high.
In the prior art, when a DELP12 probe station is used for chip CP testing, a coordinate mapping map matching error is easy to occur, and a site location (position) number cannot be correctly transmitted, namely, a wafer position coordinate acquired by a testing machine from the probe station is incorrect, so that a testing result is influenced; in addition, hardware maintenance costs for precision equipment Prober DELP12 are high, and equipment software program service costs are high for the vendor.
Disclosure of Invention
The technical problems solved by the invention are as follows: the testing result is influenced by the inaccuracy of the wafer position coordinate acquired by the testing machine from the probe station, the maintenance cost of the testing equipment is high, and the testing cost is high.
The technical scheme is as follows: in order to solve the technical problems, the technical scheme adopted by the invention is as follows:
a DELP series probe station driving configuration method in chip CP test mainly comprises the following steps:
s1: classifying the needle card distribution maps, and configuring a corresponding driving program for each type of distribution map;
s2: making a list containing all the driving program pairs according to the classification situation, and making corresponding batch processing files;
s 3: and executing the batch processing file, selecting a driver program number, and automatically registering the used probe station driver to the operating system of the tester host by the batch processing program.
S4: and performing an idle running CP test to obtain the crystal core coordinates of the probe station and the test machine, comparing coordinate mapping maps, and performing a wafer CP mass production test after confirming that no error exists.
Preferably, in step S1, the 20 common needle card distributions are grouped into 9 types of profiles, and a corresponding driver is provided for each type of profile.
Preferably, in step S1, the parameters used in each driver are determined and applied to the driver.
Preferably, the parameters determined to be given include GridCoords (coordinates of the first die measured), NumSites (number of channels measured at the same time), offsetti (coordinate offset of the die), PosX (relative relationship of the coordinates of the second die to the coordinates of the first die in the X direction at each test) and Posy (relative relationship of the coordinates of the second die to the coordinates of the first die in the Y direction at each test).
Preferably, in step S2, the list is a driver selection guide table, and corresponding driver names are provided according to the distribution of the used pincards.
Preferably, in step S3, the driver number used is presented when the batch file is executed, and the operator can perform the subsequent processing by selecting the driver number.
Preferably, in step S4, the coordinates of the probe station die and the coordinates of the tester die are compared using a map comparison tool, and it is determined whether the two are matched, if they are completely matched, a mass production test is performed, and if they are not matched, the test is returned.
Has the advantages that: compared with the prior art, the invention has the following advantages:
in the invention, under the condition that the TELP P12 prober of the probe station fails and cannot correctly transmit the site location number, the drive configuration method can ensure that the CP test map is completely matched, and the test machine can obtain the correct wafer position coordinate from the probe station, thereby normally carrying out the CP test on the chip wafer; and the operator can intuitively understand the situation of the test channel position and participate in the configuration. The method of processing 9 types of drive registration by one batch processing is adopted, so that the operation of operators is simplified; in addition, the high hardware maintenance costs of the precision equipment Prober DELP12 and the high equipment software program service costs of the vendor can be saved.
Drawings
FIG. 1 is a flowchart of the operation of a DELP series probe station drive configuration method in chip CP testing;
FIG. 2 is a diagram of a conventional pincard distribution;
FIG. 3 is a CP test interface for a 45 degree probe card;
FIG. 4 is a distribution diagram of a 45 degree distributed pin card;
FIG. 5 is a CP test interface for a chip wafer with a vertical site pincard;
FIG. 6 is a distribution diagram of a vertical site pincard;
FIG. 7 is a sorted 9-category pincard distribution list;
FIG. 8 is a batch file start interface;
FIG. 9 is a batch file input driver numbering interface;
FIG. 10 is a batch file run interface;
FIG. 11 is a graph showing a comparative result.
Detailed Description
The present invention will be further illustrated by the following specific examples, which are carried out on the premise of the technical scheme of the present invention, and it should be understood that these examples are only for illustrating the present invention and are not intended to limit the scope of the present invention.
A DELP series probe station driving configuration method in chip CP test mainly comprises the following steps:
s1: classifying the needle card distribution maps, and configuring a corresponding driving program for each type of distribution map;
the common pin card Site (test channel) distribution is 20, and several distribution forms are given as shown in fig. 2:
for example: as shown in fig. 3, the four Die are taken as the positional relationship when the TELPP12 prober is testing four Die simultaneously in the chip wafer CP test. It can be seen that the four dies are diagonally arranged at an angle of 45 degrees in the fourth quadrant, i.e. corresponding to a pincard distribution of 4 sites at 45 degrees. The pincard distribution used in the CP test is the fourth quadrant 45 degree site4, i.e., the pincard distribution shown in FIG. 4.
For example: as shown in fig. 5, the pin card distribution used in the CP test is vertical site, and 2 sites in total are the pin card distribution shown in fig. 6.
The common 20 pin card distributions are reduced into 9 types of distribution maps, and each type of distribution map is configured with a corresponding driver, namely one driver for each type, as shown in fig. 7, for example, in the case of the pin card distribution being a vertical distribution, the driver name is DELP12_ LJH _ DRV2_ nu.dll. There are 9 drivers if the distribution is divided into 9 types of pincards.
The parameters used in each driver are determined and applied to the driver. The parameters determined to be given include GridCoords (coordinates of the first die measured), NumSites (number of channels measured at the same time), offsetti (coordinate offset of the die), PosX (relative relationship of the coordinates of the second die to the coordinates of the first die in the X direction at each test) and PosY (relative relationship of the coordinates of the second die to the coordinates of the first die in the Y direction at each test).
S2: making a list containing all the drivers according to the classification condition, and making a corresponding batch processing file;
the list is a drive selection guide table, and corresponding drive names are provided in the table according to the distribution condition of the used pincards. Bat file bat, while providing the operator with a batch file OneKeyP12Driver _ Ljh1_9 dllwlag.
S3: executing the batch file will prompt the driver number, the operator selects the driver number, and the batch program will register the probe station driver to the host computer operation system automatically.
As shown in fig. 8 to 10, in the application, after double-clicking the bat batch file, the corresponding driver number may be input. The driver of the probe station DELP12 can be automatically registered with the tester host operating system by executing the batch file.
S4: performing an idle CP test to obtain the coordinates of all the crystal cores measured by the probe station, namely the rober map (the crystal core coordinates of the probe station); all the crystal core coordinates given by the tester system are tester maps; and comparing the maps (coordinate mapping maps) of the two, and performing the CP mass production test of the wafer after the correctness is confirmed.
And comparing the coordinates of the probe station crystal core with the coordinates of the test machine crystal core by adopting the conventional coordinate mapping image comparison tool, judging whether the coordinates are matched, carrying out mass production test if the coordinates are completely matched, and returning to the check if the coordinates are not matched.
In this embodiment, the probe station prober map is used as the a map, the tester map is used as the B map, and a special map comparison tool software is used to perform two map comparisons, so that the results are completely matched. FIG. 11 is a graph showing the results of comparison.
Chip CP testing was performed with probe station TELP 12 attached to the tester:
the step example of testing the wafer by adopting the drive configuration method of the invention is as follows:
1) normally setting an operating system and configuration software;
2) confirming the distribution situation of the used pin cards;
3) automatically registering the drive of the probe station with a host by using a batch file according to the P12drive selection table;
4) and performing an idle running CP test to obtain a prober map and a tester map, comparing the maps, and performing subsequent wafer CP mass production test after confirming that no error exists.
In the invention, under the condition that the TELP P12 prober of the probe station fails and cannot correctly transmit the site location number, the drive configuration method can ensure that the CP test map is completely matched, and the test machine can obtain the correct wafer position coordinate from the probe station, thereby normally carrying out the CP test of the chip wafer; and the operator can intuitively understand the situation of the site location and participate in the configuration. The method of processing 9 types of drive registration by one batch processing is adopted, so that the operation of operators is simplified; in addition, the high hardware maintenance costs of the precision equipment Prober DELP12 and the high equipment software program service costs of the vendor can be saved.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that it is obvious to those skilled in the art that various modifications and improvements can be made without departing from the principle of the present invention, and these modifications and improvements should also be considered as the protection scope of the present invention.
Claims (7)
1. A DELP series probe station driving configuration method in chip CP test is characterized by comprising the following steps:
s1: classifying the needle card distribution maps, and configuring a corresponding driving program for each type of distribution map;
s2: making a list containing all the drivers according to the classification condition, and making a corresponding batch processing file;
s3: and executing the batch processing file, selecting a driver program number, and automatically registering the used probe station driver to the operating system of the tester host by the batch processing program.
S4: and performing the air-out CP test to obtain the crystal core coordinates of the probe station and the test machine, performing coordinate comparison, and performing the CP volume production test of the wafer after confirming no error.
2. The method for configuring the drive of DELP series probe stations in chip CP test according to claim 1, wherein: in step S1, the 20 common needle card distributions are summarized into 9 types of profiles, and a corresponding driver is configured for each type of profile.
3. The method for configuring the drive of DELP series probe stations in chip CP test according to claim 1, wherein: in step S1, the parameters used in each driver are determined and applied to the driver.
4. The method for configuring the drive of DELP series probe stations in chip CP test according to claim 3, wherein: the parameters determined include the coordinate of the first crystal core, the number of the crystal cores measured at the same time, the coordinate offset of the crystal cores, the relative relation of the coordinate of the second crystal core relative to the first crystal core in the X direction during each test and the relative relation of the coordinate of the second crystal core relative to the first crystal core in the Y direction during each test.
5. The method for configuring the drive of DELP series probe stations in chip CP test according to claim 1, wherein: in step S2, the list is a driver selection guide table, and provides corresponding driver names according to the distribution of the used pincards.
6. The method for configuring the drive of DELP series probe stations in chip CP test according to claim 1, wherein: in step S3, the execution of the batch file prompts the driver number to be used, and the operator can select the driver number to perform the subsequent processing.
7. The method for configuring the drive of DELP series probe stations in chip CP test according to claim 1, wherein: in step S4, the coordinate mapping comparison tool is used to compare the coordinates of the probe station and the coordinates of the test machine, determine whether the coordinates match, if so, perform a mass production test, and if not, return to the check.
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| CN114252666A (en) * | 2022-01-17 | 2022-03-29 | 上海华岭集成电路技术股份有限公司 | Method, device, medium and electronic equipment for obtaining position distribution of test needles on probe card |
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