CN113608105A - Probe station drive configuration method and system in chip CP test - Google Patents
Probe station drive configuration method and system in chip CP test Download PDFInfo
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- CN113608105A CN113608105A CN202110889908.2A CN202110889908A CN113608105A CN 113608105 A CN113608105 A CN 113608105A CN 202110889908 A CN202110889908 A CN 202110889908A CN 113608105 A CN113608105 A CN 113608105A
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- 239000013256 coordination polymer Substances 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000012545 processing Methods 0.000 claims abstract description 59
- 238000001514 detection method Methods 0.000 claims abstract description 51
- 238000012544 monitoring process Methods 0.000 claims abstract description 25
- 238000000926 separation method Methods 0.000 claims abstract description 4
- 238000010835 comparative analysis Methods 0.000 claims description 3
- 239000000284 extract Substances 0.000 claims description 3
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
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- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
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Abstract
The invention provides a probe station drive configuration method in chip CP test, which comprises the following steps: step S1, scanning the batch number of the tested chip through the monitoring module of the testing machine, and then carrying out batch processing according to the different batch numbers of the chip through the batch processing module; step S2, obtaining the test information of the tested chip from the server through the test module of the tester; step S3, when the batch number of the detection chip is odd, the priority detection unit in the batch processing module carries out priority processing, and when the signal of the detection chip is even, the delay processing is carried out by the detection waiting unit in the separation processing module; and step S4, the test chip can be integrally detected by setting a plurality of sets of conversion methods for the decryption codes, the required Recip can be automatically downloaded according to the batch number of the test chip, the integrated process is improved, the test accuracy is improved, a large amount of labor is saved, and the detection cost is reduced.
Description
Technical Field
The invention relates to the technical field of chip CP testing, in particular to a probe station drive configuration method and a probe station drive configuration system in chip CP testing.
Background
The CP (chipcombining) test is to test the wafer chip which is not packaged, screen qualified products, determine whether packaging is carried out, the basic principle is that a probe adds a signal excitation to a pad, then the function is tested, the CP test is usually only used for basic connection test and low-speed digital circuit test, and a probe station is used for detecting in the CP test of the chip.
In the prior art, when a chip finished product is tested through a test bench, manual detection is carried out, errors are easy to occur when manual detection is utilized, test results are affected, a large amount of manpower is wasted, and the production cost is increased, so that the probe bench driving configuration method and the probe bench driving configuration system in the CP test of the chip are provided.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a probe station drive configuration method and a probe station drive configuration system in chip CP testing, which can integrally detect a test chip, can automatically download required Recip according to a test chip batch number, improve the integration process, improve the testing accuracy, save a large amount of manpower and reduce the detection cost.
In order to achieve the purpose, the invention is realized by the following technical scheme: the method for configuring the drive of the probe station in the chip CP test comprises the following steps:
step S1, scanning the batch number of the tested chip through the monitoring module of the testing machine, and then carrying out batch processing according to the different batch numbers of the chip through the batch processing module;
step S2, obtaining the test information of the tested chip from the server through the test module of the tester;
step S3, when the batch number of the detection chip is odd, the priority detection unit in the batch processing module carries out priority processing, and when the signal of the detection chip is even, the delay processing is carried out by the detection waiting unit in the separation processing module;
and step S4, detecting the chip to be tested by driving the probe platform through the driving module of the tester.
Further, the monitoring module includes an image scanning unit, an angle adjusting unit, and a contrast analyzing unit, the step S1 further includes a step a1, and the step a1 includes: the chips of different lot numbers are subjected to image shooting through the image scanning unit in the monitoring module, the angle adjusting unit controls the monitoring module to carry out multi-angle shooting, the comparative analysis unit carries out analysis processing on a plurality of shot images, and the chip lot numbers obtained are subjected to signal transmission.
Further, the step S1 further includes a step a2, and the step a2 includes: the comparison and analysis unit compares and identifies a plurality of pictures one by one, extracts chip batch numbers therein, compares the chip batch numbers identified by a plurality of groups, and selects the identification batch numbers with more repeated times to convey.
Further, the step S3 further includes a step B1, and the step B1 includes: the priority detection unit arranges the odd chip batch numbers in sequence to obtain the test information of each odd chip batch number in the test module, the test module in the test machine downloads the Recipe according to the test information, the test module transmits the Recipe to the drive module through the GPIB, and the drive module drives the probe station to detect the odd chip batch numbers according to the test information; the detection waiting unit arranges the even chip batch numbers in sequence, after the odd chip is detected, the detection waiting unit receives a detection completion signal of the priority detection unit, and the driving module drives the probe station to detect the even chip batch numbers according to the test information.
Further, the step S3 further includes a step B2, and the step B2 includes: the driving module determines the coordinate position of the chip through a coordinate positioning module in the testing machine, test information is transmitted to the driving module, the driving module adjusts the position of a probe on the probe table according to the test information, and the probe on the probe table detects the chip.
The system for driving and configuring the probe station in the CP test comprises a monitoring module, a testing module and a driving module, wherein the monitoring module is in signal connection with a batch processing module used for processing chip batch numbers, the batch processing module comprises a priority detection unit and a detection waiting unit, the batch processing unit is connected with the waiting detection unit in parallel, the monitoring module, the batch processing module and the testing module are connected in series, the testing module is connected with the driving module used for driving the probe station in the tester, and the driving module is in signal connection with a coordinate positioning module used for determining the coordinate position of the chip.
Furthermore, the monitoring module comprises an image scanning unit, an angle adjusting unit and a comparison and analysis unit, the image scanning unit is connected with the angle adjusting unit for controlling the angle adjustment of the image scanning unit, the image scanning unit is electrically connected with the comparison and analysis unit for analyzing and processing the shot image, and the comparison and analysis unit is connected with the batch processing module.
Further, the image scanning unit comprises a camera, a counter and a memory, the testing machine is provided with the camera for shooting the chip batch number, the camera is connected with the counter for counting the shot images, the camera is electrically connected with the memory for storing the shot images, and the camera is connected with the batch processing module in a data connection mode.
Furthermore, the coordinate positioning unit comprises an X-axis positioning piece for positioning the X direction, a Y-axis positioning piece for positioning the Y axis and a Z-axis positioning piece for positioning the Z axis, and the X-axis positioning piece, the Y-axis positioning piece and the Z-axis positioning piece are all installed on the probe table in the testing machine.
The X-axis positioning piece comprises an X-axis measuring coordinate and a moving frame capable of moving along the X-axis measuring coordinate, an infrared camera is mounted on the moving frame and connected with a PLC (programmable logic controller) mounted on the moving frame, the PLC is connected with a distance measurer mounted on the moving frame, and the distance measurer is divided into a first distance measurer and a second distance measurer.
The Y-axis positioning piece comprises a Y-axis measuring coordinate and a moving frame capable of moving along the Y-axis measuring coordinate, an infrared camera is mounted on the moving frame and connected with a PLC (programmable logic controller) mounted on the moving frame, the PLC is connected with a distance measurer mounted on the moving frame, and the distance measurer is divided into a first distance measurer and a second distance measurer.
Z axle setting element includes Z axle measuring coordinate, can follow the removal frame that Z axle measuring coordinate removed, install infrared camera on the removal frame, infrared camera is last to link to each other with the PLC controller of installing on removing the frame, the PLC controller links to each other with the distance measurement ware of installing on removing the frame, the distance measurement ware sets up and divide into first distance measurement ware and second distance measurement ware.
Furthermore, the driving module comprises an information receiving unit, a position memory unit, a driving unit, a position adjusting unit and a data receiving unit, the position memory unit is in signal connection with the coordinate positioning module, the position memory unit is connected with the driving unit, the driving unit is connected with the position adjusting unit for position processing, the driving unit receives data and is connected with the information receiving unit for receiving test information, the driving unit is connected with the data receiving unit for receiving detection data of the probe station, and the data receiving information unit is externally connected with a display terminal.
The invention has the beneficial effects that: when the driving detection is carried out, the position of the chip to be detected can be automatically positioned through the coordinate positioning module, the driving module receives the position information, the position of the probe on the probe table is automatically adjusted, the probe on the probe table detects the chip, and the detection accuracy is improved.
The invention can integrally detect the test chip, can automatically download the required Recip according to the batch number of the test chip, improves the integration process, improves the test accuracy, saves a large amount of manpower and reduces the detection cost.
According to the invention, through the batch processing module, the chips of different batches can be subjected to separate and prior processing, the separate processing is carried out, the even-number batches are preferentially detected, and when the chips are marked, the chips which are detected in advance can be marked with odd numbers.
According to the invention, the image can be scanned for multiple times through the monitoring module, the chip batch number is selected by comparison, and the scanning accuracy of the chip batch number is improved.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a flowchart of a method for configuring a probe station driver in a CP test of a chip according to the present invention;
FIG. 2 is a system schematic block diagram of a probe station driver configuration method and system in chip CP testing according to the present invention.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
Referring to fig. 2, a probe station driving configuration system in a CP test includes a monitoring module, a testing module and a driving module, the monitoring module is connected to a batch processing module for processing a chip batch number, the batch processing module includes a priority detection unit and a detection waiting unit, the batch processing unit is connected to the waiting detection unit in parallel, the monitoring module and the batch processing module are connected to the testing module in series, the testing module is connected to the driving module for driving a probe station in a tester, the driving module is connected to a coordinate positioning module for determining a coordinate position of a chip, the monitoring module performs image shooting on the chip to be tested, the batch processing is performed by the batch processing module, test information is extracted from a server by the testing module, the coordinate positioning module determines the position of the chip, and the probe station is driven by the driving module for detection.
The monitoring module comprises an image scanning unit, an angle adjusting unit and a contrast analysis unit, the image scanning unit is connected with the angle adjusting unit used for controlling angle adjustment of the image scanning unit, the image scanning unit is electrically connected with the contrast analysis unit used for analyzing and processing images shot by the image scanning unit, the contrast analysis unit is connected with the batch processing module, the image scanning unit shoots the images on the chip, the angle adjusting unit controls the image scanning unit to adjust the angle, and the shot images are analyzed and processed by the contrast analysis unit.
The image scanning unit comprises a camera, a counter and a memory, the camera used for shooting the chip batch number is installed on the testing machine, the camera is connected with the counter used for counting the shot images, the camera is electrically connected with the memory used for storing the shot images, the camera is connected with a batch processing module in data, the camera shoots the images on the chip, the counter records the shot images in real time, and the memory stores the shot images.
The coordinate positioning unit comprises an X-axis positioning piece for positioning the X direction, a Y-axis positioning piece for positioning the Y axis and a Z-axis positioning piece for positioning the Z axis;
the X-axis positioning piece comprises an X-axis measuring coordinate and a moving frame capable of moving along the X-axis measuring coordinate, an infrared camera is mounted on the moving frame and connected with a PLC (programmable logic controller) mounted on the moving frame, the PLC is connected with a distance measuring device mounted on the moving frame, and the distance measuring device is divided into a first distance measuring device and a second distance measuring device.
The Y-axis positioning piece comprises a Y-axis measuring coordinate and a moving frame capable of moving along the Y-axis measuring coordinate, an infrared camera is mounted on the moving frame and connected with a PLC (programmable logic controller) mounted on the moving frame, the PLC is connected with a distance measuring device mounted on the moving frame, and the distance measuring device is divided into a first distance measuring device and a second distance measuring device.
The Z-axis positioning piece comprises a Z-axis measuring coordinate and a movable frame capable of moving along, an infrared camera is mounted on the movable frame, the infrared camera is connected with a PLC (programmable logic controller) mounted on the movable frame, the PLC is connected with a distance measurer mounted on the movable frame, and the distance measurer is divided into a first distance measurer and a second distance measurer.
When the moving frame moves on the X/Y/Z axis measuring coordinate during use, the PLC controller controls the first distance measuring device to measure the moving distance, when the infrared camera is shielded, the PLC controller controls the second distance measuring device to measure the distance, when the infrared camera is not shielded, the second distance sensor stops measuring the distance, X, Y, Z axis moving distance is carried out, and the first distance sensor transmits moving position information to the position memory unit in real time to carry out position memory.
The driving module comprises an information receiving unit, a position memory unit, a driving unit, a position adjusting unit and a data receiving unit, the position memory unit is connected with a coordinate positioning module through signals, the position memory unit is connected with the driving unit, the driving unit is connected with the position adjusting unit for position processing, the driving unit is connected with the information receiving unit for receiving test information through data receiving, the driving unit is connected with the data receiving unit for receiving the detection data of the probe station, the data receiving information unit is externally connected with a display terminal and displays the detected information through the display terminal, the information receiving unit receives chip test information transmitted by the testing module, the coordinate positioning module transmits the position of the chip test information to the position memory unit in real time, the driving unit adjusts the position of the probe on the probe station through the position adjusting unit according to the position recorded by the position memory unit, and detecting, and displaying the detected information through an external display terminal by a data receiving unit after the detection is finished.
Referring to fig. 1 and 2, a method for configuring a probe station driver in a chip CP test includes the following steps:
and step S1, scanning the batch number of the tested chip through the monitoring module of the testing machine, and performing batch processing according to the different batch numbers of the chips through the batch processing module.
The chips of different lot numbers are subjected to image shooting through the image scanning unit in the monitoring module, the angle adjusting unit controls the monitoring module to carry out multi-angle shooting, the comparative analysis unit carries out analysis processing on a plurality of shot images, and the chip lot numbers obtained are subjected to signal transmission.
The comparison and analysis unit compares and identifies a plurality of pictures one by one, extracts chip batch numbers therein, compares the chip batch numbers identified by a plurality of groups, and selects the identification batch numbers with more repeated times to convey.
Step S2, test information of the chip under test is obtained from the server through the test module of the tester.
And step S3, when the batch number of the detection chip is odd, the priority detection unit in the batch processing module carries out priority processing, and when the signal of the detection chip is even, the delay processing is carried out by the detection waiting unit in the separation processing module.
The priority detection unit arranges the odd chip batch numbers in the order from small to large to obtain the test information of each odd chip batch number in the test module, the test module in the test machine downloads the Recipe according to the test information, the test module transmits the Recipe to the drive module through the GPIB, and the drive module drives the probe station to detect the odd chip batch numbers according to the test information; the detection waiting unit arranges the even chip batch numbers in sequence, after the odd chip is detected, the detection waiting unit receives a detection completion signal of the priority detection unit, and the driving module drives the probe station to detect the even chip batch numbers according to the test information.
The driving module determines the coordinate position of the chip through a coordinate positioning module in the testing machine, test information is transmitted to the driving module, the driving module adjusts the position of a probe on the probe table according to the test information, and the probe on the probe table detects the chip.
And step S4, detecting the chip to be tested by driving the probe platform through the driving module of the tester.
Finally, it should be noted that: the above-mentioned embodiments are only specific embodiments of the present invention, which are used for illustrating the technical solutions of the present invention and not for limiting the same, and the protection scope of the present invention is not limited thereto, although the present invention is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: any person skilled in the art can modify or easily conceive the technical solutions described in the foregoing embodiments or equivalent substitutes for some technical features within the technical scope of the present disclosure; such modifications, changes or substitutions do not depart from the spirit and scope of the embodiments of the present invention, and they should be construed as being included therein. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. The method for configuring the drive of the probe station in the chip CP test is characterized by comprising the following steps:
step S1, scanning the batch number of the tested chip through the monitoring module of the testing machine, and then carrying out batch processing according to the different batch numbers of the chip through the batch processing module;
step S2, obtaining the test information of the tested chip from the server through the test module of the tester;
step S3, when the batch number of the detection chip is odd, the priority detection unit in the batch processing module carries out priority processing, and when the signal of the detection chip is even, the delay processing is carried out by the detection waiting unit in the separation processing module;
and step S4, detecting the chip to be tested by driving the probe platform through the driving module of the tester.
2. The method for configuring probe station driver in chip CP test according to claim 1, wherein said step S1 further comprises a step A1, said step A1 comprising: the chips of different lot numbers are subjected to image shooting through the image scanning unit in the monitoring module, the angle adjusting unit controls the monitoring module to carry out multi-angle shooting, the comparative analysis unit carries out analysis processing on a plurality of shot images, and the chip lot numbers obtained are subjected to signal transmission.
3. The method for configuring probe station driver in chip CP test according to claim 2, wherein said step S1 further comprises a step A2, said step A2 comprising: the comparison and analysis unit compares and identifies a plurality of pictures one by one, extracts chip batch numbers therein, compares the chip batch numbers identified by a plurality of groups, and selects the identification batch numbers with more repeated times to convey.
4. The method for configuring probe station driver in chip CP test according to claim 1, wherein said step S3 further comprises a step B1, said step B1 comprises: the priority detection unit arranges the odd chip batch numbers in sequence to obtain the test information of each odd chip batch number in the test module, the test module in the test machine downloads the Recipe according to the test information, the test module transmits the Recipe to the drive module through the GPIB, and the drive module drives the probe station to detect the odd chip batch numbers according to the test information; the detection waiting unit arranges the even chip batch numbers in sequence, after the odd chip is detected, the detection waiting unit receives a detection completion signal of the priority detection unit, and the driving module drives the probe station to detect the even chip batch numbers according to the test information.
5. The method for configuring probe station driver in chip CP test according to claim 4, wherein said step S3 further comprises a step B2, said step B2 comprises: the driving module determines the coordinate position of the chip through a coordinate positioning module in the testing machine, test information is transmitted to the driving module, the driving module adjusts the position of a probe on a probe table according to the test information, and the probe on the probe table detects the chip.
The system for driving and configuring the probe station in the CP test is suitable for the method for driving and configuring the probe station in the CP test of the chip according to any one of claims 1 to 5, and is characterized by comprising a monitoring module, a test module and a driving module, wherein the monitoring module is in signal connection with a batch processing module for processing a chip batch number, the batch processing module comprises a priority detection unit and a detection waiting unit, the batch processing unit is in parallel connection with the waiting detection unit, the monitoring module, the batch processing module and the test module are in series connection, the test module is connected with the driving module for driving the probe station in the tester, and the driving module is in signal connection with a coordinate positioning module for determining a coordinate position of the chip.
7. The CP test middle probe station drive configuration system of claim 6, wherein the monitoring module comprises an image scanning unit, an angle adjustment unit and a contrast analysis unit, the image scanning unit is connected with the angle adjustment unit for controlling the angle adjustment of the image scanning unit, the image scanning unit is electrically connected with the contrast analysis unit for analyzing and processing the images shot by the image scanning unit, and the contrast analysis unit is connected with the batch processing module.
8. The CP test middle probe station drive configuration system as claimed in claim 7, wherein the image scanning unit comprises a camera, a counter and a memory, the tester is installed with a camera for shooting chip batch numbers, the camera is connected with the counter for counting the shot images, the camera is electrically connected with the memory for storing the shot images, and the camera is connected with a batch processing module in data connection.
9. The CP test middle probe station drive configuration system of claim 6, wherein the coordinate positioning unit comprises an X-axis positioning element for positioning the X-direction, a Y-axis positioning element for positioning the Y-axis, and a Z-axis positioning element for positioning the Z-axis, the X-axis positioning element, the Y-axis positioning element, and the Z-axis positioning element are all installed on the probe station in the testing machine.
10. The CP test middle probe station drive configuration system according to claim 6, wherein the drive module comprises an information receiving unit, a position memory unit, a drive unit, a position adjustment unit and a data receiving unit, the position memory unit is in signal connection with a coordinate positioning module, the position memory unit is connected with the drive unit, the drive unit is connected with the position adjustment unit for position processing, the drive unit is in data reception connection with the information receiving unit for receiving test information, the drive unit is connected with the data receiving unit for receiving the test data of the probe station, and the data receiving information unit is externally connected with a display terminal.
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Cited By (1)
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| CN115774182A (en) * | 2022-12-05 | 2023-03-10 | 安测半导体技术(义乌)有限公司 | ATE platform-based chip testing method and device |
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