CN103646891A - A wafer allocating method - Google Patents
A wafer allocating method Download PDFInfo
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- CN103646891A CN103646891A CN201310630264.0A CN201310630264A CN103646891A CN 103646891 A CN103646891 A CN 103646891A CN 201310630264 A CN201310630264 A CN 201310630264A CN 103646891 A CN103646891 A CN 103646891A
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
- G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
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- G—PHYSICS
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- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q10/00—Administration; Management
- G06Q10/06—Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
Abstract
The invention discloses a wafer allocating method and belongs to integrated circuit field. The wafer allocating method comprises: defining wafer samples entering a defect detecting and scanning platform according a FAB production rule and generating sampling configuration information according to the wafer samples; and generating an allocating rule according to the sampling configuration information and machine table process time in order to averagely allocate the wafer samples to processing machine tables in a processing machine table group. Accordingly, each machine table in the processing machine table group has an inspection result after inspection is executed at a defect detecting station. The wafer allocating method prevents operation such as YE engineer manual cancellation in the prior art so as to increase monitoring efficiency of a yield monitoring scheme.
Description
Technical field
The invention belongs to integrated circuit fields, specifically, relate to a kind of wafer work dispatching method.
Background technology
In the processing process processed of wafer, different process work bench is processed processing to wafer.In order to monitor the wafer that each process work bench machines, whether there is defect, conventionally set certain sampling observation sample wafer, by Defect Scanning board, the wafer in sample is carried out to surface scan and have defect to detect, finally reach the yield of Production Regional process work bench is realized to monitoring.
At present, yield monitoring scheme is in the industry a product batch number of wafer definition of processing to each process work bench processing, by choosing product batch number end number, be the wafer of odd number or even number, as sampling observation sample wafer, the random Defect Scanning board that enters carries out defects detection.The sample control method of yield engineer to product of production line, for dissimilar product according to batch number setting take mantissa as odd number or even number, the Defect Scanning regional machine that enters random in production process scans, thereby reaches the effect of yield in monitoring process process.
But because the wafer number of scanning is often a lot, and the production capacity of scanning machine is limited, cause scanning product often far beyond the production capacity of Defect Scanning board.Particularly, on the one hand, because the wafer that will scan is a lot, but the production capacity of scanning machine, tend to cause the situation of waiting for and being detained, affect factory's flow speed; In addition on the one hand, if continuously the wafer of 1 process work bench processing is carried out to Defect Scanning, will take like this Defect Scanning of the wafer of other process work bench processing, thereby lack the monitoring equipment meeting to these process work bench.This two sides reason finally causes the scanning pressure of scanning machine larger.
For alleviating the larger problem of scanning machine scanning pressure, in prior art, yield (Yield Enhancement, hereinafter to be referred as YE) engineer can manually select to cancel the wafer-scanning of waiting for Defect Scanning region according to batch number.Particularly, YE engineer will inquire about the historical record of the source process work bench of wafer, cancels the process work bench wafer just now having scanned, and chance is stayed to the wafer of other process work bench, reduces the scanning pressure of scanning machine with the method.
But yield method for supervising of the prior art has following defect:
(1) YE engineer manually cancels scanning, can take on the one hand engineer's operating time; In addition on the one hand, also easily occur selecting wafer mistake, the wafer that should not cancel is cancelled.
(2) YE engineer must go to check at interval of certain hour, select the product of some boards of just now having monitored, cancel scanning, to reduce unnecessary wait, the quantity of YouYE department interval time based on waiting for wafer, according to data statistics at ordinary times and experience, define, this all can affect the time (Cycle Time) that product completes one deck light shield technique, has extended the stand-by period of product.
(3) if wafer continuous sweep or scanning result of interval short period on scanning machine are the process work bench from same technique, caused the waste of scanning machine.
To sum up, the monitoring efficiency of yield monitoring scheme of the prior art urgently further improves.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of wafer work dispatching method, the above-mentioned technical problem existing in order to partly or entirely to overcome, partly or entirely to solve prior art.
In order partly or entirely to overcome, partly or entirely to solve the problems of the technologies described above, the invention provides a kind of wafer work dispatching method, comprising:
The sample wafer that definition enters defects detection scanning platform according to FAB production rule, generates sampling configuration information accordingly;
According to the processing procedure time of described sampling configuration information, board, generate and send work regular, sample wafer is on average sent work to the process work bench in process work bench group.
Preferably, in one embodiment of this invention, the sample wafer that definition enters defects detection scanning platform according to FAB production rule, generates accordingly sampling configuration information and comprises:
Define a product batch number, according to the mantissa of product batch number, define the sample wafer that enters defects detection scanning platform, generate accordingly sampling configuration information.
Preferably, in one embodiment of this invention, the processing procedure time of described board comprises described product batch number.
Preferably, in one embodiment of this invention, the mantissa of described product batch number, for sampling product batches, such as being odd number or even number, chooses batch number mantissa according to yield engineering sample rule in principle.
Preferably, in one embodiment of this invention, the sample wafer that definition enters defects detection scanning platform according to FAB production rule, generates accordingly sampling configuration information and comprises:
The sample wafer regular according to the mantissa of product batch number or random definition enters defects detection scanning platform.
Preferably, in one embodiment of this invention, on average send work also to comprise to time on the process work bench in process work bench group sample wafer: to having distributed the process work bench of sample wafer to give a production sign.
Preferably, in one embodiment of this invention, described sampling configuration information comprises title, the process work bench numbering of sample wafer processing, the FAB production rule of sample wafer.
Preferably, in one embodiment of this invention, the processing procedure time of described board is the time of product turnover process work bench.
Preferably, in one embodiment of this invention, said method also comprises: each process work bench in one group of process work bench group has distributed to be produced after sign, before the next production cycle, removes this production sign.
Compare with existing scheme, in the present invention, the sample wafer that definition enters defects detection scanning platform according to FAB production rule, generates sampling configuration information accordingly; According to the processing procedure time of described sampling configuration information, board, generate and send work regular, sample wafer is on average sent work to the process work bench in process work bench group.So, after arriving subsequently defects detection website and checking, each board in process work bench group can have check result, has avoided in prior art the operations such as YE engineer manually cancels, thereby has improved the monitoring efficiency of yield monitoring scheme.
Accompanying drawing explanation
Fig. 1 is wafer work dispatching method schematic flow sheet in the embodiment of the present invention one;
Figure 2 shows that the flow chart of step 101 in Fig. 1;
Fig. 3 is wafer work dispatching method schematic flow sheet in the embodiment of the present invention two;
Fig. 4 is wafer work dispatching method flow chart in the embodiment of the present invention three.
Embodiment
Below will coordinate graphic and embodiment to describe embodiments of the present invention in detail, and by this present invention's implementation procedure how application technology means solve technical problem and reach technology effect can be fully understood and be implemented according to this.
In following embodiment of the present invention, the sample wafer that definition enters defects detection scanning platform according to FAB production rule, generates sampling configuration information accordingly; According to the processing procedure time of described sampling configuration information, board, generate and send work regular, sample wafer is on average sent work to the process work bench in process work bench group.So, after arriving subsequently defects detection website and checking, each board in process work bench group can have check result, has avoided in prior art the operations such as YE engineer manually cancels, thereby has improved the monitoring efficiency of yield monitoring scheme.
Fig. 1 is wafer work dispatching method schematic flow sheet in the embodiment of the present invention one; As shown in Figure 1, it can comprise:
Step 101, the sample wafer that definition enters defects detection scanning platform according to FAB production rule, generate sampling configuration information accordingly;
Step 102, according to the processing procedure time of described sampling configuration information, board, generate and send work regular, sample wafer is on average sent work to the process work bench in process work bench group.
It should be noted that, owing to sending the contingent process work bench of work to move, allow the stand-by period can affect the time of product key again, but in actual production process, whether will send the board of goods must need further to determine.Therefore, in step 102, particularly, by calculating the permission stand-by period of the sample wafer in FAB production rule, whether be greater than the processing procedure time that board is produced, if be greater than, can on average send work to process work bench sample wafer; Otherwise, if the stand-by period is less than the processing procedure time that board is produced, even allows the stand-by period to be not enough to allow product wait for and send work, just can not carry out mean sample and send work, and should pass through current fabrication process board at once.
In the present embodiment, step 101 can specifically comprise: definition one product batch number, according to the mantissa of product batch number, define the sample wafer that enters defects detection scanning platform, and generate accordingly sampling configuration information.
In the present embodiment, preferably, the processing procedure time of described board comprises described product batch number.Particularly, the mantissa of described product batch number is sampling product batches.
Accordingly, Figure 2 shows that the flow chart of step 101 in Fig. 1; As shown in Figure 2, when the mantissa of described product batch number is sampling product batches, step 101 can comprise:
Step 111, definition one product batch number, define the sample wafer that enters defects detection scanning platform according to the mantissa of product batch number, generate accordingly sampling configuration information;
Step 121, the sample wafer that regular according to the mantissa of product batch number or random definition enters defects detection scanning platform.
Fig. 3 is wafer work dispatching method schematic flow sheet in the embodiment of the present invention two; As shown in Figure 3, it can also comprise:
In above-mentioned steps 301-302, identical with the step 101-102 in Fig. 1, do not repeat them here.
On above-mentioned basis embodiment illustrated in fig. 3, can also form the work dispatching method in another embodiment of the present invention.Fig. 4 is wafer work dispatching method flow chart in the embodiment of the present invention three; As shown in Figure 4, it can specifically comprise:
Step 403: each process work bench in one group of process work bench group has distributed to be produced after sign, before the next production cycle, removes this production sign.
It should be noted that, in the above-described embodiments, described sampling configuration information can comprise title, the process work bench numbering of sample wafer processing, the FAB production rule of sample wafer.The configuration information example of sampling as shown in Table 1, sample 1 is processed by board 1, and the mantissa of its product batch number is odd number, and sample 2 is board 2 processing, and the mantissa of its product batch number is even number.
In example, using mantissa is odd number or even number.But in actual production, differing, to establish a capital be that odd number or even number are sampled, and can sample according to the mantissa product of yield sampling prescription in principle.
Table one sampling configuration information example
| Sample number into spectrum | Machine number | Product batch number |
| Sample 1 | Board 1 | Mantissa is odd number |
| Sample 2 | Board 2 | Mantissa is even number |
It should be noted that, in the above-described embodiments, FAB production rule is based on above-mentioned product batch number.
In the above-described embodiments, the processing procedure time of described board is the time of product turnover process work bench.FAB production rule example, supposes that A group process work bench has three processing procedures as shown in Table 2, and machine number is respectively 1,2,3, and wafer was respectively 2 hours, 8 hours, 4 hours by the time interval by the time of turnover board.
But, only have board 1 and 3 to carry out the work of sending of sample wafer, therefore, also just only having the sample symbol that passes through of board 1 and 3 is PASS.From table two, can find out, the sample symbol that passes through of board 2 is empty, therefore, carry out the work of sending of sample wafer can also to board 2, until all boards in the board group A all have by sample character position, thereby can make each board process a sample wafer.
Table two FAB production rule example
| Board group | Machine number | By sample symbol | Pass through the time interval |
| A group | Board 1 | Pass | 2 hours |
| A group | Board 2 | ? | 8 hours |
| A group | Board 3 | Pass | 4 hours |
But, to those skilled in the art, sampling configuration information, FAB production rule are not limited to above-mentioned specific mode, as long as can define the corresponding relation of process work bench and processed wafer, the time that can extrapolate the processed turnover board of wafer, both can.
Below in conjunction with concrete application scenarios, above-described embodiment is carried out to example explanation.
Application scenarios one: a certain process work bench group has 2 process work bench, has 4 batches of products, and product batch number is respectively 1,2,3,4.If sampling probability is 50%,, from 4 batches of products, extract 2 batches of products out.If adopt rule sampling method, 1,3 batch of product that product batch number mantissa is odd number is as sample wafer.Product batch number is 1 and 3 sample wafer, sends respectively work to be produced on board 1 and board 2 boards.
The concrete work scheme of sending has following selection:
(1) wafer that product batch number is 1 sends work to be produced to board 1, and the wafer that product batch number is 2 sends work to be produced to board 2 boards.
(2) wafer that product batch number is 2 sends work to be produced to board 1, and the wafer that product batch number is 1 sends work to be produced to board 2 boards.
Select arbitrary work scheme of sending in above-mentioned (1)-(2), arrive subsequently after the inspection of defects detection website, to board 1 and board 2, all can have check result, reached the object that defect inspection detects: 100% checks.
If use prior art to send work scheme, under extreme case, product batch number is that 1 and 3 product all completes production at board 1, and board 2 does not have; Subsequently, enter after defects detection website, only have board 1 is had to check result, board 2 is not but had, so sampling rate is only 50%.
In application scenarios one, if product corresponding to the product batch number that mantissa is even number is wafer sample: this is similar with above-mentioned situation, does not repeat them here.
Application scenarios two: a certain process work bench group has 2 process work bench, has 6 batches of products, and product batch number is respectively 1,2,3,4,5,6.If sampling probability is 50%,, from 6 batches of products, extract 3 batches of products out.If adopt rule sampling method, 1,3,5 batch of product that product batch number mantissa is odd number is as sample wafer.Concrete work dispatching method may have following selection:
(1) wafer that product batch number is 1 sends work to board 1, and the wafer that product batch number is 5 sends work to be produced to board 2;
(2) wafer that product batch number is 3 sends work to board 1, and the wafer work that product batch number is 5 is produced to board 2;
(3) wafer that product batch number is 5 sends work to board 1, if the wafer that product batch number is 3 sends work to be produced to board 2;
(4) the wafer work that product batch number is 3 is to board 1, and the wafer that product batch number is 1 sends work to be produced to board 2;
(5) wafer that product batch number is 5 sends work to board 1, and the wafer that product batch number is 1 sends work to be produced to board 2;
Through the arbitrary work scheme of sending in above-mentioned (1)-(5), arrive subsequently after the inspection of defects detection website, as long as detect 2 batches, just realized and all can have check result to board 1 and board 2, reached the object that defect inspection detects: 100% checks.
And the work scheme of sending of the prior art may have following 6 kinds to send work scheme:
(1) wafer that product batch number is 1 sends work to board 1, and product batch number is that 3 and 5 wafer sends work to be produced to board 2;
(2) wafer that product batch number is 3 sends work to board 1, and product batch number is that 1 and 5 wafer sends work to be produced to board 2;
(3) wafer that product batch number is 2 sends work to board 1, if the wafer that product batch number is 3 and 5 sends work to be produced to board 2;
(4) product batch number is that 1 and 3 wafers send work to board 1, and the wafer that product batch number is 5 sends work to be produced to board 2;
(5) product batch number is that 1 and 5 wafer sends work to board 1, and the wafer that product batch number is 3 sends work to be produced to board 2;
(6) product batch number is that 3 and 5 wafer sends work to board 1, if the wafer that product batch number is 1 sends work to be produced to board 2.
Arrive subsequently after the inspection of defects detection website, need to detect 3 batches, could realize and all can have check result to board 1 and board 2.
It should be noted that, above-mentioned application scenarios one and two is according to the mantissa of product batch number regular definition sample wafer.Alternative, in other application scenarioss, also can define at random the sample wafer that enters defects detection scanning platform, such as, product batch number is 1,4,6 product, the similar and above-mentioned application scenarios one of detailed process and two, does not repeat them here.
Above-mentioned explanation illustrates and has described some preferred embodiments of the present invention, but as previously mentioned, be to be understood that the present invention is not limited to disclosed form herein, should not regard the eliminating to other embodiment as, and can be used for various other combinations, modification and environment, and can, in invention contemplated scope described herein, by technology or the knowledge of above-mentioned instruction or association area, change.And the change that those skilled in the art carry out and variation do not depart from the spirit and scope of the present invention, all should be in the protection range of claims of the present invention.
Claims (9)
1. a wafer work dispatching method, is characterized in that, comprising:
The sample wafer that definition enters defects detection scanning platform according to FAB production rule, generates sampling configuration information accordingly;
According to the processing procedure time of described sampling configuration information, board, generate and send work regular, sample wafer is on average sent work to the process work bench in process work bench group.
2. method according to claim 1, is characterized in that, the sample wafer that definition enters defects detection scanning platform according to FAB production rule generates accordingly sampling configuration information and comprises:
Define a product batch number, according to the mantissa of product batch number, define the sample wafer that enters defects detection scanning platform, generate accordingly sampling configuration information.
3. method according to claim 2, is characterized in that, the processing procedure time of described board comprises described product batch number.
4. method according to claim 1 and 2, is characterized in that, the mantissa of described product batch number is sampling product batches.
5. method according to claim 2, is characterized in that, the sample wafer that definition enters defects detection scanning platform according to FAB production rule generates accordingly sampling configuration information and also comprises:
The sample wafer regular according to the mantissa of product batch number or random definition enters defects detection scanning platform.
6. method according to claim 1, is characterized in that, on average sends work also to comprise to time on the process work bench in process work bench group sample wafer: to having distributed the process work bench of sample wafer to give a production sign.
7. according to any described method of claim 1-6, it is characterized in that, described sampling configuration information comprises the title of sample wafer, process work bench numbering, the FAB production rule of sample wafer processing.
8. according to any described method of claim 1-6, it is characterized in that, the processing procedure time of described board is the time of product turnover process work bench.
9. method according to claim 6, is characterized in that, also comprises: each process work bench in one group of process work bench group has distributed to be produced after sign, before the next production cycle, removes this production sign.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105097586A (en) * | 2014-05-22 | 2015-11-25 | 中芯国际集成电路制造(上海)有限公司 | Wafer extracting method and wafer extracting device |
| CN105702597A (en) * | 2016-02-05 | 2016-06-22 | 东方晶源微电子科技（北京）有限公司 | Multi-workbench or multi-chamber detection system |
| CN113608105A (en) * | 2021-08-04 | 2021-11-05 | 杭州芯云半导体技术有限公司 | Probe station drive configuration method and system in chip CP test |
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| CN102446786A (en) * | 2011-11-28 | 2012-05-09 | 上海华力微电子有限公司 | Device monitoring method during semiconductor process |
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| US20040022429A1 (en) * | 2002-04-12 | 2004-02-05 | Hidekazu Suzuki | Scanning microscope and inspection method employing the scanning microscope |
| CN1499570A (en) * | 2002-11-07 | 2004-05-26 | 台湾积体电路制造股份有限公司 | Control method for dispatching working flows and method for making module of semiconductor |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105097586A (en) * | 2014-05-22 | 2015-11-25 | 中芯国际集成电路制造(上海)有限公司 | Wafer extracting method and wafer extracting device |
| CN105097586B (en) * | 2014-05-22 | 2018-05-04 | 中芯国际集成电路制造(上海)有限公司 | Wafer abstracting method and device |
| CN105702597A (en) * | 2016-02-05 | 2016-06-22 | 东方晶源微电子科技（北京）有限公司 | Multi-workbench or multi-chamber detection system |
| CN105702597B (en) * | 2016-02-05 | 2019-03-19 | 东方晶源微电子科技（北京）有限公司 | More workbench or Multicarity detection system |
| CN113608105A (en) * | 2021-08-04 | 2021-11-05 | 杭州芯云半导体技术有限公司 | Probe station drive configuration method and system in chip CP test |
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