CN105097586A - Wafer extracting method and wafer extracting device - Google Patents
Wafer extracting method and wafer extracting device Download PDFInfo
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- CN105097586A CN105097586A CN201410219057.0A CN201410219057A CN105097586A CN 105097586 A CN105097586 A CN 105097586A CN 201410219057 A CN201410219057 A CN 201410219057A CN 105097586 A CN105097586 A CN 105097586A
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Abstract
The invention discloses a wafer extracting method and a wafer extracting device, wherein the wafer extracting method comprises the steps of determining a machine station for extracting the wafer; obtaining a correspondence between the wafer and the machine station; searching the wafer which corresponds with the machine station that extracts the wafer according to the correspondence between the wafer and the machine station; and extracting the wafer from the searched wafer. The wafer extracting method and the wafer extracting device settle a problem of incapability of accurately covering the machine station in extracting the wafer when the wafer is measured in prior art, and furthermore realizes an effect of accurately covering the machine station in extracting the wafer.
Description
Technical field
The application relates to semiconductor applications, in particular to a kind of wafer abstracting method and device.
Background technology
In the production process of semiconductor factory; need to do the wafer processed to measure monitoring in real time to ensure its yield; such as; the next step of the wafer after etching machine bench process just needs to measure the thickness of wafer and bandwidth etc.; whether the relevant wafer of measurement is seen qualified; at once batch or platform can be shut down if you have questions, reach the object of monitoring wafer in real time.
But in the process measured, consider for reasons such as costs, user can not go to measure all wafers, can only choose representational a few wafer and measure, if this few wafer is measured qualified, that just thinks that the result of all wafers of same batch is qualified.
For extraction any wafer representatively property wafer, and it is suitable to extract how many wafer, this is more complicated for production engineer, the board process wafer of such as etched area, #1, #2, #3, #4, #5 five wafer processes through etching machine bench A, #6, #7, #8, #9, #10 five wafer processes through etching machine bench B, if take out in sheet is measured at measurement board and extracted #1, #3, #5 tri-wafer is measured, even if the measurement result of this three wafer is all qualified, also the result being difficult to guarantee #6 ~ #10 wafer is normal, because they are the wafers via different board process.
How to choose suitable wafer and quantity, make the wafer chosen and data can judge the testing result of all wafers, this is the difficult point in existing production executive system measurement mechanism.
In prior art, for certain product, always pre-set and extract the wafer of assigned address and the wafer of fixed qty out.According to the position of wafer in wafer cassette, production executive system obtains measurable wafer at measurement website according to pre-setting, and particular flow sheet as shown in Figure 1.As can be seen from Figure 1, selection wafer is set according to existing, mainly can produces following problem:
1, easily critical wafer is omitted.The wafer be drawn into can only be monitored, monitor the wafer less than other board process, board as PROCESS FOR TREATMENT has problems, the wafer processed via it affects by it and also may go wrong, but system does not detect the board existing problems of PROCESS FOR TREATMENT in real time, may cause the wafer loss via this board like this.
2, easily duplicate measurements is caused.If three wafer are via same board process, only need to choose a slice and do and measure just passable, if choose three, cause duplicate measurements, add the production cycle of wafer, reduce the effective rate of utilization of board.
3, in the measurements, some board belongs to complementary board, pass through its wafer without the need to measuring, and existing chip select rule cannot solve to this situation, can cause invalid measurement.
For the problem that accurately can not cover board extracting wafer when measuring wafer in prior art, at present effective solution is not yet proposed.
Application content
The main purpose of the application is to provide a kind of wafer abstracting method and device, extracts the problem that accurately can not cover board of wafer when measuring wafer to solve in prior art.
To achieve these goals, according to an aspect of the application, a kind of wafer abstracting method is provided.Wafer abstracting method according to the application comprises: determine the board extracting wafer; Obtain the corresponding relation of wafer and board; Wafer corresponding to the board that extracts wafer is searched according to the corresponding relation of wafer and board; And wafer is extracted in the wafer found.
Further, board is multiple board, multiple board comprises the first measurement board, process board and second measures board, wafer is after measuring through the first measurement board, process through process board, measure board through second again to measure, in the wafer found, extract wafer comprise: record the wafer information measuring board through first, obtain the first wafer information; Record, through the wafer information of the wafer of process board process, obtains the second wafer information; The wafer searched with the first wafer information and the second wafer information is being measured in the wafer of board through second; And wafer is extracted in the wafer with the first wafer information and the second wafer information.
Further, extract wafer in the wafer found after, the wafer extracted is measured, wherein, comprise according to the wafer that the corresponding relation of wafer and board searches the board that extracts wafer corresponding: obtain machine station information and the corresponding relation measuring type; Determine type to be measured; Determine with the corresponding relation measuring type the machine station information that type to be measured is corresponding according to machine station information; And search wafer corresponding to machine station information corresponding to type to be measured.
Further, board comprises predetermined board, and extract wafer in the wafer found before, wafer abstracting method also comprises: the information obtaining predetermined board; Corresponding relation according to wafer and board searches wafer corresponding to predetermined board; And in the wafer that predetermined board is corresponding the information of the predetermined board of filtering.
Further, extract wafer in the wafer found after, wafer abstracting method also comprises: the wafer trace information of the wafer that record extracts; And follow the tracks of according to the state of wafer trace information to wafer.
To achieve these goals, according to the another aspect of the application, provide a kind of wafer draw-out device.Wafer draw-out device according to the application comprises: determining unit, for determining the board extracting wafer; First acquiring unit, for obtaining the corresponding relation of wafer and board; First searches unit, the wafer that the board for searching extraction wafer according to the corresponding relation of wafer and board is corresponding; And extracting unit, for extracting wafer in the wafer found.
Further, board is multiple board, multiple board comprises the first measurement board, process board and second measures board, wafer is after measuring through the first measurement board, process through process board, then measure through the second measurement board, first searches unit comprises: the first logging modle, for recording the wafer information measuring board through first, obtain the first wafer information; Second logging modle, for recording the wafer information of the wafer through the process of process board, obtains the second wafer information; First searches module, for measuring in the wafer of board through second the wafer searched with the first wafer information and the second wafer information; And abstraction module, for extracting wafer in the wafer with the first wafer information and the second wafer information.
Further, wafer draw-out device comprises measuring unit, and for extract wafer in the wafer found after, measure the wafer extracted, first searches unit comprises: acquisition module, for obtaining machine station information and the corresponding relation measuring type; Determination module, for determining type to be measured; Respective modules, for determining with the corresponding relation measuring type the machine station information that type to be measured is corresponding according to machine station information; And second searches module, for searching wafer corresponding to machine station information corresponding to type to be measured.
Further, board comprises predetermined board, and wafer draw-out device also comprises: second acquisition unit, for extract wafer in the wafer found before, obtains the information of predetermined board; Second searches unit, for searching wafer corresponding to predetermined board according to the corresponding relation of wafer and board; And filtering unit, for the information of the predetermined board of filtering in the wafer that predetermined board is corresponding.
Further, wafer draw-out device also comprises: record cell, for extract wafer in the wafer found after, and the wafer trace information of the wafer that record extracts; And tracking cell, for following the tracks of according to the state of wafer trace information to wafer.
By the application, adopt the board determining to extract wafer; Obtain the corresponding relation of wafer and board; Wafer corresponding to the board of described extraction wafer is searched according to the corresponding relation of described wafer and board; And in the wafer found, extract the method for wafer, solve in prior art the problem that accurately can not cover board extracting wafer when measuring wafer, and then reach the effect that extraction wafer accurately covers board.
Accompanying drawing explanation
The accompanying drawing forming a application's part is used to provide further understanding of the present application, and the schematic description and description of the application, for explaining the application, does not form the improper restriction to the application.In the accompanying drawings:
Fig. 1 is the flow chart of the wafer abstracting method according to the application first embodiment;
Fig. 2 is the flow chart of the wafer abstracting method according to the application second embodiment;
Fig. 3 is the flow chart of the wafer abstracting method according to the application the 3rd embodiment;
Fig. 4 is the schematic diagram of the wafer draw-out device according to the application first embodiment;
Fig. 5 is the schematic diagram of the wafer draw-out device according to the application second embodiment; And
Fig. 6 is the schematic diagram of the wafer draw-out device according to the application the 3rd embodiment.
Embodiment
It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can combine mutually.Below with reference to the accompanying drawings and describe the application in detail in conjunction with the embodiments.
The application's scheme is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present application, technical scheme in the embodiment of the present application is clearly and completely described, obviously, described embodiment is only the embodiment of the application's part, instead of whole embodiments.Based on the embodiment in the application, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all should belong to the scope of the application's protection.
It should be noted that, term " first ", " second " etc. in the specification of the application and claims and above-mentioned accompanying drawing are for distinguishing similar object, and need not be used for describing specific order or precedence.Should be appreciated that the data used like this can be exchanged in the appropriate case, so as the embodiment of the application described herein can with except here diagram or describe those except order implement.In addition, term " comprises " and " having " and their any distortion, intention is to cover not exclusive comprising, such as, contain those steps or unit that the process of series of steps or unit, method, system, product or equipment is not necessarily limited to clearly list, but can comprise clearly do not list or for intrinsic other step of these processes, method, product or equipment or unit.
This application provides a kind of wafer abstracting method.
Fig. 1 is the flow chart of the wafer abstracting method according to the application first embodiment.As shown in the figure, this wafer abstracting method comprises the steps:
Step S102, determines the board extracting wafer.
In wafer-process process, a wafer may process through multiple board, and certainly, multiple identical or different wafer also may process through a board.
Before extraction wafer, in order to make the wafer of each board process have at least a wafer to be drawn, first determine the board extracting wafer.
Step S104, obtains the corresponding relation of wafer and board.
Wafer, through board process, records the machine station information of each wafer process and the information of wafer itself.Like this, just have recorded the corresponding relation of wafer and board, namely which board carried out process to which wafer.
When wafer enter board process time, wafer information when record enters board, after the process of board to wafer terminates, record wafer leaves the information of board, thus ensures real-time and the integrality of the corresponding relation of record wafer and board.
Step S106, searches wafer corresponding to the board that extracts wafer according to the corresponding relation of wafer and board.
Determine and extract the board of wafer, and determine the corresponding relation of board and wafer, search wafer corresponding to the board that extracts wafer according to the corresponding relation of wafer and board.
Such as, the wafer carrying out the board etching of etch step comprises wafer A, wafer B and wafer C, then the wafer found according to the corresponding relation of wafer and board is wafer A, wafer B and wafer C.
Step S108, extracts wafer in the wafer found.
In the wafer A found, wafer B and wafer C, extract wafer, the method for extraction can for randomly drawing, and the wafer of extraction can be one or more.
Such as, determining the board extracting wafer is the board carrying out etch step, the wafer found is wafer A, wafer B and wafer C, then in all wafers through this board, extract one or more wafer, the wafer namely extracted is wafer A or wafer B and wafer C.
Due in the process of semiconductor production, the wafer of same batch needs through etching processing repeatedly, adopts random abstracting method, make each wafer extracted all different, such as, the wafer that first time is extracted is wafer A, and the wafer next time extracted is wafer B.Can test the performance of wafer after extraction wafer, and test result can react corresponding board whether normal operation, therefore, the method of this extraction wafer can improve the coverage rate of the wafer of extraction, not only improve and ensure the yield of wafer, accurately can also monitor the running status of board.
Pass through above-described embodiment, first the board extracting wafer is determined, then in the board determined, the wafer through this board process is found according to the corresponding relation of wafer and board, and wafer is extracted in the wafer found, can determine for determining that the board extracting wafer can extract at least one wafer, improve the coverage rate that wafer extracts, avoid again repeating to extract the duplicate measurements caused.
Fig. 2 is the flow chart of the wafer abstracting method according to the application second embodiment.As shown in the figure, board in this wafer abstracting method can be multiple board, first measures board, process board and second measures board, described wafer is after measuring through described first measurement board, process through described process board, measure board through described second again to measure, in the wafer found, extract wafer comprise the steps:
Step S202, records the wafer information measuring board through first, obtains the first wafer information.
Record the wafer information measuring the wafer of board process through first, obtain the first wafer information.First wafer information can be wafer numbering, measures the type of wafer or the measured mark etc. of this wafer information.Such as, the wafer A of board process is measured with the mark measured through first.
Step S204, record, through the wafer information of the wafer of process board process, obtains the second wafer information.
Process board processes wafer, such as, and etching, sputtering etc.Second wafer information comprises the etching processing of this wafer through process board.
Step S206, is measuring in the wafer of board through second the wafer searched with the first wafer information and the second wafer information.
Such as, first measures board measures wafer A, and the thickness measuring wafer A is THK1, and process board etches wafer A, enters the second measurement board and measure after etching.Before the second measurement board is measured, in the wafer through the second measurement board, search wafer A.
Step S208, extracts wafer in the wafer with the first wafer information and the second wafer information.
Such as, if only have one with the wafer of the first wafer information and the second wafer information, wafer A, then the wafer extracted is wafer A.If with more than one of the wafer of the first wafer information and the second wafer information, then multiple with the wafer of the first wafer information and the second wafer information in extract at least one wafer.
In the wafer through the second measurement board process, extract wafer, in the wafer drawn, at least comprise one is measured board and process board wafer through first.
Wafer A is after first measures board process, measure its performance, then process through process board, then measure board to its performance measurement through second, ensure that the continuity of measurement, the result according to measuring can be finely tuned the processing procedure of semiconductor production.
Such as, measure when board is measured first and select the wafer carrying out measuring to be wafer 1 and wafer 2, the wafer selected in process board is wafer 1 and wafer 3.When the second measurement board is measured, measure selectable wafer in board second and comprise the wafer measuring board measurement through first and the wafer measured without the first measurement board, the final wafer selected has at least a wafer to measure in the first measurement board.Consider and measure the coverage rate of wafer and the continuity of measurement, select wafer 1 and wafer 3 to measure.
Pass through above-described embodiment, in the board be associated, select that there is successional wafer according to wafer information to measure, make can both obtain measurement result after different treatment steps, continuity measurement is carried out to wafer, is convenient to finely tune according to the processing procedure of measurement result to semiconductor manufacturing.
Fig. 3 is the flow chart of the wafer abstracting method according to the application the 3rd embodiment.As shown in the figure, in this wafer abstracting method, extract wafer in the wafer found after, the wafer extracted is measured, wherein, comprise the steps: according to the wafer that the corresponding relation of wafer and board searches the board that extracts wafer corresponding
Step S302, obtains machine station information and the corresponding relation measuring type.
To when the wafer of board process is measured, for different boards, there is different measurement types.Such as, four boards A, B, C, D.Wafer through board A and board B needs the thickness measuring wafer, and the wafer through board C and board D needs the bandwidth measuring wafer.So, machine station information is the measurement type that board B and board A are corresponding with the corresponding relation of measurement type is the thickness of wafer, and the measurement type of board C and board D is the bandwidth of wafer.
Step S304, determines type to be measured.
Judge to need the thickness measuring wafer still to measure the bandwidth of wafer, such as, determine the thickness measuring wafer.
Step S306, determines with the corresponding relation measuring type the machine station information that type to be measured is corresponding according to machine station information.
The measurement type that board A and board B is corresponding is the thickness of wafer, and type to be measured is the thickness of wafer, then the machine station information that type to be measured is corresponding is board A and board B.
Step S308, searches the wafer that machine station information corresponding to type to be measured is corresponding.
After determining type to be measured, then determine the machine station information that type to be measured is corresponding, so, according to the corresponding relation of board and wafer, the wafer that machine station information corresponding to type to be measured is corresponding can be determined.
Such as, the machine station information that type to be measured is corresponding is wafer that board A and board B, board A are corresponding be the wafer that wafer A1 and wafer A2, board B are corresponding is wafer B1 and wafer B2.Searching wafer corresponding to machine station information corresponding to type to be measured is wafer A1, wafer A2, wafer B1 and wafer B2.
After finding wafer A1, wafer A2, wafer B1 and wafer B2, wafer is extracted in these wafers found, so, the final wafer extracted comprises any one wafer in wafer A1 and wafer A2, also comprises any one wafer in wafer B1 and wafer B2.
By above-described embodiment, according to the corresponding machine station information of measurement type selecting measuring wafer, and search corresponding wafer according to machine station information, thus for the different corresponding wafers of measurement type selecting, make the wafer extracted accurately can cover board.
Preferably, board comprises predetermined board, and predetermined board can be the board not needing to carry out monitoring, in the process extracting wafer, in order to avoid these predetermined boards are on the impact extracting wafer, extract wafer in the wafer found before, this wafer abstracting method also comprises:
Obtain the information of predetermined board.
Corresponding relation according to wafer and board searches wafer corresponding to predetermined board.
The information of the predetermined board of filtering in the wafer that predetermined board is corresponding.
Obtain the information of predetermined board, search the wafer that predetermined board is corresponding, owing to have recorded the information of predetermined board in wafer, the information of the predetermined board of filtering in the wafer found, when measuring wafer, can not carry out monitoring and measuring for predetermined board.
After by the predetermined machine station information filtering in wafer, make the wafer extracted can not be subject to the interference of predetermined board, thus decrease the quantity of the wafer of extraction, when ensureing the coverage rate extracting wafer, reduce again the measurement quantity of wafer, improve measurement efficiency.
Further, extract wafer in the wafer found after, wafer abstracting method also comprises: the wafer trace information of the wafer that record extracts.Follow the tracks of according to the state of wafer trace information to wafer.
Wafer trace information comprises the batch information etc. of machine station information corresponding to wafer and wafer.When extracting wafer, the information of record wafer itself, after measuring, records measurement and machine station information corresponding to wafer.The operating state of board can be reflected according to the information of wafer, in a series of measuring process of wafer, the operating state of multiple board can be recorded, thus conveniently board be followed the trail of, the problem of Timeliness coverage board or wafer.
The said method of the application may be used for board in semiconductor fabrication and handset platform, and the function of each board or handset platform can be identical or different.Being construed as, is that board or handset platform all should within the spirit of the technical scheme of the application.
The embodiment of the present application additionally provides a kind of wafer draw-out device.
The wafer draw-out device that the wafer abstracting method of the embodiment of the present application can be provided by the embodiment of the present application performs, and the wafer draw-out device of the embodiment of the present application also may be used for performing the wafer abstracting method that the embodiment of the present application provides.
Fig. 4 is the schematic diagram of the wafer draw-out device according to the application first embodiment.As shown in the figure, this wafer draw-out device comprises determining unit 10, first acquiring unit 20, first and searches unit 30 and extracting unit 40.
Determining unit 10 is for determining the board extracting wafer.
In wafer-process process, a wafer may process through multiple board, and certainly, multiple identical or different wafer also may process through a board.
Before extraction wafer, in order to make the wafer of each board process have at least a wafer to be drawn, first determine the board extracting wafer.
First acquiring unit 20 is for obtaining the corresponding relation of wafer and board.
Wafer, through board process, records the machine station information of each wafer process and the information of wafer itself.Like this, just have recorded the corresponding relation of wafer and board, namely which board carried out process to which wafer.
When wafer enter board process time, wafer information when record enters board, after the process of board to wafer terminates, record wafer leaves the information of board, thus ensures real-time and the integrality of the corresponding relation of record wafer and board.
First searches unit 30 extracts wafer corresponding to the board of wafer for searching according to the corresponding relation of wafer and board.
Determine and extract the board of wafer, and determine the corresponding relation of board and wafer, search wafer corresponding to the board that extracts wafer according to the corresponding relation of wafer and board.
Such as, the wafer carrying out the board etching of etch step comprises wafer A, wafer B and wafer C, then the wafer found according to the corresponding relation of wafer and board is wafer A, wafer B and wafer C.
Extracting unit 40 for extracting wafer in the wafer found.
In the wafer A found, wafer B and wafer C, extract wafer, the method for extraction can for randomly drawing, and the wafer of extraction can be one or more.
Such as, determining the board extracting wafer is the board carrying out etch step, the wafer found is wafer A, wafer B and wafer C, then in all wafers through this board, extract one or more wafer, the wafer namely extracted is wafer A or wafer B and wafer C.
Due in the process of semiconductor production, the wafer of same batch needs through etching processing repeatedly, adopts random abstracting method, make each wafer extracted all different, such as, the wafer that first time is extracted is wafer A, and the wafer next time extracted is wafer B.Can test the performance of wafer after extraction wafer, and test result can react corresponding board whether normal operation, therefore, the method of this extraction wafer can improve the coverage rate of the wafer of extraction, not only improve and ensure the yield of wafer, accurately can also monitor the running status of board.
Pass through above-described embodiment, first the board extracting wafer is determined, then in the board determined, the wafer through this board process is found according to the corresponding relation of wafer and board, and wafer is extracted in the wafer found, can determine for determining that the board extracting wafer can extract at least one wafer, improve the coverage rate that wafer extracts, avoid again repeating to extract the duplicate measurements caused.
Fig. 5 is the schematic diagram of the wafer draw-out device according to the application second embodiment.As shown in the figure, this wafer draw-out device comprises determining unit 10, first acquiring unit 20, first and searches unit 30 and extracting unit 40, wherein, first search unit 30 and comprise the first logging modle 301, first and search module 302, first and search module 303 and abstraction module 304.
First logging modle 301 measures the wafer information of board through first for recording, obtain the first wafer information.
Record the wafer information measuring the wafer of board process through first, obtain the first wafer information.First wafer information can be wafer numbering, measures the type of wafer or the measured mark etc. of this wafer information.Such as, the wafer A of board process is measured with the mark measured through first.
Second logging modle 302, for recording the wafer information of the wafer through the process of process board, obtains the second wafer information.
Process board processes wafer, such as, and etching, sputtering etc.Second wafer information comprises the etching processing of this wafer through process board.
First searches module 303 for measuring in the wafer of board through second the wafer searched with the first wafer information and the second wafer information.
Such as, first measures board measures wafer A, and the thickness measuring wafer A is THK1, and process board etches wafer A, enters the second measurement board and measure after etching.Before the second measurement board is measured, in the wafer through the second measurement board, search wafer A.
Abstraction module 304 for extracting wafer in the wafer with the first wafer information and the second wafer information.
Such as, if only have one with the wafer of the first wafer information and the second wafer information, wafer A, then the wafer extracted is wafer A.If with more than one of the wafer of the first wafer information and the second wafer information, then multiple with the wafer of the first wafer information and the second wafer information in extract at least one wafer.
In the wafer through the second measurement board process, extract wafer, in the wafer drawn, at least comprise one is measured board and process board wafer through first.
Wafer A is after first measures board process, measure its performance, then process through process board, then measure board to its performance measurement through second, ensure that the continuity of measurement, the result according to measuring can be finely tuned the processing procedure of semiconductor production.
Such as, measure when board is measured first and select the wafer carrying out measuring to be wafer 1 and wafer 2, the wafer selected in process board is wafer 1 and wafer 3.When the second measurement board is measured, measure selectable wafer in board second and comprise the wafer measuring board measurement through first and the wafer measured without the first measurement board, the final wafer selected has at least a wafer to measure in the first measurement board.Consider and measure the coverage rate of wafer and the continuity of measurement, select wafer 1 and wafer 3 to measure.
Pass through above-described embodiment, in the board be associated, select that there is successional wafer according to wafer information to measure, make can both obtain measurement result after different treatment steps, continuity measurement is carried out to wafer, is convenient to finely tune according to the processing procedure of measurement result to semiconductor manufacturing.
Fig. 6 is the schematic diagram of the wafer draw-out device according to the application the 3rd embodiment.As shown in the figure, this wafer draw-out device comprises determining unit 10, first acquiring unit 20, first and searches unit 30 and extracting unit 40, also comprise measuring unit, for extract wafer in the wafer found after, the wafer extracted is measured, wherein, first search unit 30 and comprise: acquisition module 305, determination module 306, respective modules 307 and second search module 308.
Acquisition module 305 is for obtaining machine station information and the corresponding relation measuring type.
To when the wafer of board process is measured, for different boards, there is different measurement types.Such as, four boards A, B, C, D.Wafer through board A and board B needs the thickness measuring wafer, and the wafer through board C and board D needs the bandwidth measuring wafer.So, machine station information is the measurement type that board B and board A are corresponding with the corresponding relation of measurement type is the thickness of wafer, and the measurement type of board C and board D is the bandwidth of wafer.
Determination module 306 is for determining type to be measured.
Judge to need the thickness measuring wafer still to measure the bandwidth of wafer, such as, determine the thickness measuring wafer.
Respective modules 307 is for determining with the corresponding relation measuring type the machine station information that type to be measured is corresponding according to machine station information.
The measurement type that board A and board B is corresponding is the thickness of wafer, and type to be measured is the thickness of wafer, then the machine station information that type to be measured is corresponding is board A and board B.
Second searches module 308 for searching wafer corresponding to machine station information corresponding to type to be measured.
After determining type to be measured, then determine the machine station information that type to be measured is corresponding, so, according to the corresponding relation of board and wafer, the wafer that machine station information corresponding to type to be measured is corresponding can be determined.
Such as, the machine station information that type to be measured is corresponding is wafer that board A and board B, board A are corresponding be the wafer that wafer A1 and wafer A2, board B are corresponding is wafer B1 and wafer B2.Searching wafer corresponding to machine station information corresponding to type to be measured is wafer A1, wafer A2, wafer B1 and wafer B2.
After finding wafer A1, wafer A2, wafer B1 and wafer B2, wafer is extracted in these wafers found, so, the final wafer extracted comprises any one wafer in wafer A1 and wafer A2, also comprises any one wafer in wafer B1 and wafer B2.
By above-described embodiment, according to the corresponding machine station information of measurement type selecting measuring wafer, and search corresponding wafer according to machine station information, thus for the different corresponding wafers of measurement type selecting, make the wafer extracted accurately can cover board.
Preferably, board comprises predetermined board, and predetermined board can be the board not needing to carry out monitoring, and in the process extracting wafer, in order to avoid these predetermined boards are on the impact extracting wafer, this wafer draw-out device also comprises:
Second acquisition unit, for extract wafer in the wafer found before, obtains the information of described predetermined board.
Second searches unit, for searching wafer corresponding to described predetermined board according to the corresponding relation of described wafer and board.
Filtering unit, for the information of predetermined board described in filtering in the wafer that described predetermined board is corresponding.
Obtain the information of predetermined board, search the wafer that predetermined board is corresponding, owing to have recorded the information of predetermined board in wafer, the information of the predetermined board of filtering in the wafer found, when measuring wafer, can not carry out monitoring and measuring for predetermined board.
After by the predetermined machine station information filtering in wafer, make the wafer extracted can not be subject to the interference of predetermined board, thus decrease the quantity of the wafer of extraction, when ensureing the coverage rate extracting wafer, reduce again the measurement quantity of wafer, improve measurement efficiency.
Further, wafer draw-out device also comprises: record cell, for extract wafer in the wafer found after, and the wafer trace information of the wafer that record extracts.Tracking cell, for following the tracks of according to the state of wafer trace information to wafer.
Wafer trace information comprises the batch information etc. of machine station information corresponding to wafer and wafer.When extracting wafer, the information of record wafer itself, after measuring, records measurement and machine station information corresponding to wafer.The operating state of board can be reflected according to the information of wafer, in a series of measuring process of wafer, the operating state of multiple board can be recorded, thus conveniently board be followed the trail of, the problem of Timeliness coverage board or wafer.
The said apparatus of the application can be used for extracting wafer to board and handset platform in semiconductor fabrication, and the function of each board or handset platform can be identical or different.Being construed as, is that board or handset platform all should within the spirit of the technical scheme of the application.
The foregoing is only the preferred embodiment of the application, be not limited to the application, for a person skilled in the art, the application can have various modifications and variations.Within all spirit in the application and principle, any amendment done, equivalent replacement, improvement etc., within the protection range that all should be included in the application.
Claims (10)
1. a wafer abstracting method, is characterized in that, comprising:
Determine the board extracting wafer;
Obtain the corresponding relation of wafer and board;
Wafer corresponding to the board of described extraction wafer is searched according to the corresponding relation of described wafer and board; And
Wafer is extracted in the wafer found.
2. wafer abstracting method according to claim 1, it is characterized in that, described board is multiple board, described multiple board comprises the first measurement board, process board and second measures board, described wafer is after measuring through described first measurement board, process through described process board, then measure through described second measurement board, in the wafer found, extract wafer comprise:
Record the wafer information measuring board through described first, obtain the first wafer information;
Record the wafer information through the wafer of described process board process, obtain the second wafer information;
The wafer searched with described first wafer information and described second wafer information is being measured in the wafer of board through described second; And
Wafer is extracted in the wafer with described first wafer information and described second wafer information.
3. wafer abstracting method according to claim 1, it is characterized in that, extract wafer in the wafer found after, the wafer extracted is measured, wherein, the wafer searching the board of described extraction wafer corresponding according to the corresponding relation of described wafer and board comprises:
Obtain machine station information and the corresponding relation measuring type;
Determine type to be measured;
Determine with the corresponding relation measuring type the machine station information that described type to be measured is corresponding according to described machine station information; And
Search the wafer that machine station information corresponding to described type to be measured is corresponding.
4. wafer abstracting method according to claim 1, is characterized in that, described board comprises predetermined board, and extract wafer in the wafer found before, described wafer abstracting method also comprises:
Obtain the information of described predetermined board;
Corresponding relation according to described wafer and board searches wafer corresponding to described predetermined board; And
The information of predetermined board described in filtering in the wafer that described predetermined board is corresponding.
5. wafer abstracting method according to claim 1, is characterized in that, extract wafer in the wafer found after, described wafer abstracting method also comprises:
The wafer trace information of the wafer that record extracts; And
Follow the tracks of according to the state of described wafer trace information to described wafer.
6. a wafer draw-out device, is characterized in that,
Determining unit, for determining the board extracting wafer;
First acquiring unit, for obtaining the corresponding relation of wafer and board;
First searches unit, the wafer that the board for searching described extraction wafer according to the corresponding relation of described wafer and board is corresponding; And
Extracting unit, for extracting wafer in the wafer found.
7. wafer draw-out device according to claim 6, it is characterized in that, described board is multiple board, described multiple board comprises the first measurement board, process board and second measures board, described wafer is after measuring through described first measurement board, process through described process board, then measure through described second measurement board, described first searches unit comprises:
First logging modle, for recording the wafer information measuring board through described first, obtains the first wafer information;
Second logging modle, for recording the wafer information of the wafer through the process of described process board, obtains the second wafer information;
First searches module, for measuring in the wafer of board through described second the wafer searched with described first wafer information and described second wafer information; And
Abstraction module, for extracting wafer in the wafer with described first wafer information and described second wafer information.
8. wafer draw-out device according to claim 6, is characterized in that, described wafer draw-out device comprises measuring unit, and for extract wafer in the wafer found after, measure the wafer extracted, described first searches unit comprises:
Acquisition module, for obtaining machine station information and the corresponding relation measuring type;
Determination module, for determining type to be measured;
Respective modules, for determining with the corresponding relation measuring type the machine station information that described type to be measured is corresponding according to described machine station information; And
Second searches module, for searching wafer corresponding to machine station information corresponding to described type to be measured.
9. wafer draw-out device according to claim 6, is characterized in that, described board comprises predetermined board, and described wafer draw-out device also comprises:
Second acquisition unit, for extract wafer in the wafer found before, obtains the information of described predetermined board;
Second searches unit, for searching wafer corresponding to described predetermined board according to the corresponding relation of described wafer and board; And
Filtering unit, for the information of predetermined board described in filtering in the wafer that described predetermined board is corresponding.
10. wafer draw-out device according to claim 6, is characterized in that, described wafer draw-out device also comprises:
Record cell, for extract wafer in the wafer found after, the wafer trace information of the wafer that record extracts; And
Tracking cell, for following the tracks of according to the state of described wafer trace information to described wafer.
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