CN112662333A - Graphene heat conduction and dissipation film - Google Patents
Graphene heat conduction and dissipation film Download PDFInfo
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- CN112662333A CN112662333A CN202011572279.2A CN202011572279A CN112662333A CN 112662333 A CN112662333 A CN 112662333A CN 202011572279 A CN202011572279 A CN 202011572279A CN 112662333 A CN112662333 A CN 112662333A
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Abstract
The invention discloses a graphene heat-conducting and heat-dissipating film, and particularly relates to the technical field of graphene heat-conducting films. According to the invention, the release paper plate, the high-thermal-conductivity silica gel, the first tearing-pulling piece and the second tearing-pulling piece are arranged, when the graphene heat-conducting heat-dissipating film is used, the first tearing-pulling piece is pulled, then the second tearing-pulling piece is torn downwards, the release paper plate can be torn off from the high-thermal-conductivity silica gel by the second tearing-pulling piece, then the graphene heat-conducting heat-dissipating film is adhered to a corresponding electronic product through the high-thermal-conductivity silica gel, when the graphene heat-conducting heat-dissipating film needs to be torn off, only the first tearing-pulling piece needs to be torn, the operation is simple, and the use is very convenient.
Description
Technical Field
The invention relates to the technical field of graphene heat conducting films, in particular to a graphene heat conducting and radiating film.
Background
In recent years, along with the continuous development and progress of science and technology, electronic products gradually develop to miniature integration, meanwhile, the problem of generating heat of electronic products is more and more obvious, a graphene heat conduction and heat dissipation film is designed and produced aiming at the problem, the graphene heat conduction and heat dissipation film can be directly pasted on the surface of the electronic products to complete the heat conduction and heat dissipation of the electronic products, the problem of generating heat of the electronic products is well solved, and the existing graphene heat conduction and heat dissipation film has some problems and defects.
In the process of implementing the invention, the inventor finds that at least the following problems in the prior art are not solved:
(1) the heat conduction and dissipation efficiency of the traditional graphene heat conduction and dissipation film cannot meet the use requirement of an electronic product with larger heat productivity;
(2) the traditional graphene heat conduction and dissipation film is easy to damp and expand, so that the heat conduction and dissipation effect is reduced;
(3) the traditional graphene heat-conducting and heat-dissipating film is troublesome to adhere and remove and is very inconvenient to use;
(4) the heat-conducting coefficient of the traditional graphene heat-conducting and heat-dissipating film adhesive is low, so that the heat-dissipating performance of the graphene heat-conducting film is influenced;
(5) traditional graphite alkene heat conduction heat dissipation membrane can not carry out the homodisperse with the heat on the electronic product, leads to radiating efficiency greatly reduced.
Disclosure of Invention
The invention aims to provide a graphene heat conduction and dissipation film to solve the problem that the use requirement of an electronic product with larger heat productivity cannot be met in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a graphene heat conduction and dissipation film comprises a graphene layer, a lower copper foil layer and an upper copper foil layer, wherein the upper copper foil layer is arranged at the top end of the graphene layer, the lower copper foil layer is arranged at the bottom end of the graphene layer, a first heat conduction silicone grease layer is arranged between the top end of the graphene layer and the bottom end of the upper copper foil layer, a second heat conduction silicone grease layer is arranged between the bottom end of the graphene layer and the top end of the lower copper foil layer, a sealing anti-expansion structure is arranged between the outer portions of the lower copper foil layer and the upper copper foil layer, an auxiliary pasting structure is arranged at the bottom end of the lower copper foil layer, and a high heat conduction and dissipation structure is;
the high-thermal-conductivity heat dissipation structure comprises an upper groove, the upper groove is arranged inside the top end of the graphene layer, a lower groove is arranged inside the bottom end of the graphene layer, a convex block is arranged on the top end of the upper copper foil layer, and a nano heat dissipation coating is arranged on the top end of the convex block.
Preferably, the upper grooves and the lower grooves are respectively arranged at equal intervals inside the top end and the bottom end of the graphene layer.
Preferably, the sealing expansion-preventing structure is composed of a lower sealing frame, an upper sealing frame, a connecting seam and a sealant, wherein the lower sealing frame is fixedly connected to the outer portion of the top end of the lower copper foil layer, the upper sealing frame is fixedly connected to the outer portion of the bottom end of the upper copper foil layer, the connecting seam is arranged between the lower sealing frame and the upper sealing frame, and the sealant is arranged inside the connecting seam.
Preferably, the lower sealing frame and the upper sealing frame are equal in size, and the lower sealing frame and the upper sealing frame are fixedly connected through sealing glue.
Preferably, the lower sealing frame and the upper sealing frame are in the same vertical plane.
Preferably, the outer diameter of the graphene layer is smaller than the outer diameters of the lower copper foil layer and the upper copper foil layer, and the length and the width of the lower copper foil layer are equal to those of the upper copper foil layer.
Preferably, supplementary structure of pasting is torn pulling-on piece and second by from type cardboard, high heat conduction silica gel, first tearing pulling-on piece and the pulling-on piece is constituteed, high heat conduction silica gel sets up the bottom on copper foil layer down, high heat conduction silica gel's bottom is provided with from the type cardboard, one side fixedly connected with second from the type cardboard tears the pulling-on piece, first tear one side of pulling piece fixed connection copper foil layer under.
Preferably, length and width equal between release cardboard and the high heat conduction silica gel, the high heat conduction silica gel equals with the length and the width of lower copper foil layer.
Preferably, an inner caulking groove is formed in the lower copper foil layer at a position close to the bottom end, and an asbestos screen layer is arranged in the inner caulking groove.
Preferably, the first and second thermally conductive silicone grease layers have a thermal conductivity of 2.0W/m.k.
Compared with the prior art, the invention has the beneficial effects that: the graphene heat conduction and heat dissipation film can meet the use requirement of electronic products with large heat productivity, prevent graphene from being affected with damp and expanding, ensure the heat conduction and heat dissipation effects of the graphene, realize convenient sticking and tearing off, is very convenient to use, realize the adoption of heat conduction silicone grease as a bonding agent, has high heat conduction coefficient, ensure the heat dissipation performance of the graphene heat conduction film, and realize uniform dispersion of heat on the electronic products and improve the heat dissipation efficiency;
(1) by arranging the high-heat-conduction heat dissipation structure, the high-heat-conduction heat dissipation structure comprises the upper groove, the upper groove is arranged inside the top end of the graphene layer, the lower groove is arranged inside the bottom end of the graphene layer, the top end of the upper copper foil layer is provided with the lug, the top end of the lug is provided with the nano heat dissipation coating, when the nano heat dissipation coating is used, the surface area of the graphene layer can be greatly increased through the upper groove and the lower groove which are arranged at the two ends of the graphene layer, so that the heat conduction efficiency of the graphene layer can be accelerated, meanwhile, the surface area of the top of the upper copper foil layer can be increased through the lug at the top of the upper copper foil layer, so that the heat dissipation efficiency of the upper copper foil layer can be accelerated;
(2) by arranging the lower sealing frame, the upper sealing frame, the connecting seam and the sealant, when the graphene layer thermal insulation structure is used, the graphene layer can be completely wrapped by the lower sealing frame and the upper sealing frame, and then the graphene layer can be positioned in a closed space by the sealant between the lower sealing frame and the upper sealing frame, so that the graphene layer can be prevented from absorbing moisture in air and expanding, and the graphene layer can be ensured to normally conduct heat conduction and heat dissipation;
(3) when the graphene heat conduction and heat dissipation film is required to be removed, only the first tearing piece needs to be torn, so that the operation is simple and the use is very convenient;
(4) by arranging the first heat-conducting silicone grease layer and the second heat-conducting silicone grease layer, the heat conductivity coefficients of the first heat-conducting silicone grease layer and the second heat-conducting silicone grease layer are 2.0W/m.K, when the graphene heat-conducting heat-radiating film is used, the high heat-conducting heat-radiating performance of the first heat-conducting silicone grease layer and the second heat-conducting silicone grease layer are utilized, and the first heat-conducting silicone grease layer and the second heat-conducting silicone grease layer are used as adhesives during the production of the graphene heat-conducting heat-radiating film, so that the boundary influence of common adhesives on the graphene heat-conducting heat-radiating film can be avoided, and the performances of the graphene heat-conducting heat-radiating film are ensured;
(5) the inner caulking groove is formed in the position, close to the bottom end, inside the lower copper foil layer, the asbestos net layer is arranged inside the inner caulking groove, when the graphene heat conduction heat dissipation film is used, heat conduction performance of the asbestos net layer is utilized, the electronic product can be dispersed in advance, heat distribution is uniform, heat dissipation rate can be accelerated, and heat dissipation efficiency of the graphene heat conduction heat dissipation film is greatly improved.
Drawings
FIG. 1 is a schematic front sectional view of the present invention;
fig. 2 is a schematic top view of a partially enlarged graphene layer according to the present invention;
FIG. 3 is an enlarged partial cross-sectional view taken at A in FIG. 1 according to the present invention;
FIG. 4 is a side view partially enlarged structural schematic view of the seal anti-expansion structure of the present invention;
FIG. 5 is a schematic bottom view of a partial cross-sectional structure of the lower copper foil layer of the present invention;
fig. 6 is a schematic diagram of an enlarged cross-sectional front view of a graphene layer according to the present invention.
In the figure: 1. a graphene layer; 2. a first thermally conductive silicone layer; 3. a second thermally conductive silicone layer; 4. a nano heat dissipation coating; 5. sealing the anti-expansion structure; 501. a lower sealing frame; 502. an upper sealing frame; 503. connecting seams; 504. sealing glue; 6. an auxiliary pasting structure; 601. a release paper board; 602. high thermal conductivity silica gel; 603. a first tear tab; 604. a second tear tab; 7. an embedded groove is formed; 8. an asbestos web layer; 9. a lower copper foil layer; 10. a copper foil layer is arranged; 11. a bump; 12. an upper groove; 13. a lower groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1: referring to fig. 1-6, a graphene heat-conducting and heat-dissipating film includes a graphene layer 1, a lower copper foil layer 9 and an upper copper foil layer 10, the upper copper foil layer 10 is disposed on the top end of the graphene layer 1, the lower copper foil layer 9 is disposed on the bottom end of the graphene layer 1, a sealing expansion-preventing structure 5 is disposed between the lower copper foil layer 9 and the outside of the upper copper foil layer 10, an auxiliary adhesive structure 6 is disposed on the bottom end of the lower copper foil layer 9, and a high heat-conducting and heat-dissipating structure is disposed on the outside of the graphene layer 1;
referring to fig. 1-6, a graphene heat conduction and dissipation film further includes a high heat conduction and dissipation structure, the high heat conduction and dissipation structure includes an upper groove 12, the upper groove 12 is disposed inside the top end of the graphene layer 1, a lower groove 13 is disposed inside the bottom end of the graphene layer 1, a bump 11 is disposed on the top end of the upper copper foil layer 10, and a nano heat dissipation coating 4 is disposed on the top end of the bump 11;
the upper grooves 12 and the lower grooves 13 are respectively arranged at equal intervals inside the top end and the bottom end of the graphene layer 1;
the outer diameter of the graphene layer 1 is smaller than the outer diameters of the lower copper foil layer 9 and the upper copper foil layer 10, and the length and the width of the lower copper foil layer 9 are equal to those of the upper copper foil layer 10;
specifically, as shown in fig. 1, fig. 2 and fig. 6, when using, through the upper groove 12 and the lower groove 13 that graphene layer 1 both ends set up, like this can greatly increased graphene layer 1's surface area, thereby can accelerate graphene layer 1's heat conduction efficiency, the lug 11 of going up copper foil layer 10 top simultaneously can increase the surface area at copper foil layer 10 top, thereby can accelerate copper foil layer 10's radiating efficiency, and nanometer heat dissipation coating 4 can prevent to go up copper foil layer 10 and appear discolouing in long-time use, phenomenons such as oxidation, prolong its life greatly.
Example 2: the sealing expansion-preventing structure 5 consists of a lower sealing frame 501, an upper sealing frame 502, a connecting seam 503 and a sealant 504, wherein the lower sealing frame 501 is fixedly connected to the outer part of the top end of the lower copper foil layer 9, the upper sealing frame 502 is fixedly connected to the outer part of the bottom end of the upper copper foil layer 10, the connecting seam 503 is arranged between the lower sealing frame 501 and the upper sealing frame 502, and the sealant 504 is arranged in the connecting seam 503;
the lower sealing frame 501 and the upper sealing frame 502 are equal in size, and the lower sealing frame 501 and the upper sealing frame 502 are fixedly connected through a sealant 504;
the lower sealing frame 501 and the upper sealing frame 502 are positioned on the same vertical plane;
specifically, as shown in fig. 1, fig. 3 and fig. 4, when the graphene layer thermal insulation structure is used, the lower sealing frame 501 and the upper sealing frame 502 can completely wrap the graphene layer 1, and then the sealant 504 between the lower sealing frame 501 and the upper sealing frame 502 can make the graphene layer 1 be in a sealed space, so that the graphene layer 1 can be prevented from expanding due to moisture in the air being absorbed, and the graphene layer 1 can be ensured to conduct heat and dissipate heat normally.
Example 3: the auxiliary pasting structure 6 is composed of a release paper board 601, high thermal conductivity silica gel 602, a first tear tab 603 and a second tear tab 604, the high thermal conductivity silica gel 602 is arranged at the bottom end of the lower copper foil layer 9, the release paper board 601 is arranged at the bottom end of the high thermal conductivity silica gel 602, one side of the release paper board 601 is fixedly connected with the second tear tab 604, and the first tear tab 603 is fixedly connected with one side of the lower copper foil layer 9;
the length and the width of the release paper board 601 are equal to those of the high-thermal-conductivity silica gel 602, and the length and the width of the high-thermal-conductivity silica gel 602 are equal to those of the lower copper foil layer 9;
specifically, as shown in fig. 1, when the heat dissipation film is used, the first tearing pulling piece 603 is pulled, then the second tearing pulling piece 604 is pulled downwards, the second tearing pulling piece 604 can pull the release paper board 601 off from the high thermal conductivity silica gel 602, then the graphene heat dissipation film is adhered to the corresponding electronic product through the high thermal conductivity silica gel 602, when the graphene heat dissipation film needs to be removed, only the first tearing pulling piece 603 needs to be pulled, the operation is simple, and the use is very convenient.
Example 4: a first heat conduction silicone grease layer 2 is arranged between the top end of the graphene layer 1 and the bottom end of the upper copper foil layer 10, a second heat conduction silicone grease layer 3 is arranged between the bottom end of the graphene layer 1 and the top end of the lower copper foil layer 9, and the heat conductivity coefficient of the first heat conduction silicone grease layer 2 and the second heat conduction silicone grease layer 3 is 2.0W/m.K;
specifically, as shown in fig. 1, when the graphene heat conduction and dissipation film is used, the high heat conduction and dissipation performance of the first heat conduction silicone grease layer 2 and the second heat conduction silicone grease layer 3 are used as the adhesive for the production of the graphene heat conduction and dissipation film, so that the boundary influence of a common adhesive on the graphene heat conduction and dissipation film can be avoided, and various performances of the graphene heat conduction and dissipation film can be ensured.
Example 5: an inner embedded groove 7 is formed in the lower copper foil layer 9 at a position close to the bottom end, and an asbestos screen layer 8 is arranged in the inner embedded groove 7;
specifically, as shown in fig. 1 and 5, when the graphene heat conduction and dissipation film is used, the heat conducted by the electronic product can be dispersed in advance by using the heat conduction performance of the asbestos mesh layer 8, so that the heat is uniformly distributed, the heat dissipation rate can be increased, and the heat dissipation efficiency of the graphene heat conduction and dissipation film is greatly improved.
The working principle is as follows: when the nano heat dissipation coating 4 is used, firstly, the upper groove 12 and the lower groove 13 which are arranged at the two ends of the graphene layer 1 can greatly increase the surface area of the graphene layer 1, so that the heat conduction efficiency of the graphene layer 1 can be improved, meanwhile, the bump 11 at the top of the upper copper foil layer 10 can increase the surface area of the top of the upper copper foil layer 10, so that the heat dissipation efficiency of the upper copper foil layer 10 can be improved, the nano heat dissipation coating 4 can prevent the upper copper foil layer 10 from changing color, oxidizing and the like in the long-time use process, and the service life of the nano heat dissipation coating is greatly prolonged.
Afterwards, when using, lower seal frame 501 and last seal frame 502 can make graphite alkene layer 1 wrap up completely, then seal glue 504 between lower seal frame 501 and the last seal frame 502 can make graphite alkene layer 1 be in a inclosed space to can prevent that graphite alkene layer 1 from absorbing the moisture in the air and expanding, guarantee graphite alkene layer 1 can normally carry out heat conduction heat dissipation.
Secondly, when using, hold first tear pulling-on piece 603, then tear the second downwards and tear pulling-on piece 604, the second tears pulling-on piece 604 and can will tear from type cardboard 601 from high heat conduction silica gel 602, then pastes this graphite alkene heat conduction heat dissipation membrane on corresponding electronic product through high heat conduction silica gel 602, when needs take off this graphite alkene heat conduction heat dissipation membrane, only need tear pull-on piece 603 can, easy operation, it is very convenient to use.
Then, when the graphene heat conduction and dissipation film is used, the high heat conduction and dissipation performance of the first heat conduction silicone grease layer 2 and the second heat conduction silicone grease layer 3 is utilized, the first heat conduction silicone grease layer 2 and the second heat conduction silicone grease layer 3 are used as adhesives during production of the graphene heat conduction and dissipation film, the boundary influence of common adhesives on the graphene heat conduction and dissipation film can be avoided, and various performances of the graphene heat conduction and dissipation film are guaranteed.
Finally, when the graphene heat conduction and dissipation film is used, the heat conduction performance of the asbestos net layer 8 is utilized, the heat emitted by an electronic product can be dispersed in advance, so that the heat is uniformly distributed, the heat dissipation rate can be increased, and the heat dissipation efficiency of the graphene heat conduction and dissipation film is greatly improved.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (9)
1. The utility model provides a graphite alkene heat conduction radiating film, includes graphite alkene layer (1), lower copper foil layer (9) and last copper foil layer (10), its characterized in that: an upper copper foil layer (10) is arranged at the top end of the graphene layer (1), a lower copper foil layer (9) is arranged at the bottom end of the graphene layer (1), a first heat-conducting silicone grease layer (2) is arranged between the top end of the graphene layer (1) and the bottom end of the upper copper foil layer (10), a second heat-conducting silicone grease layer (3) is arranged between the bottom end of the graphene layer (1) and the top end of the lower copper foil layer (9), a sealing anti-expansion structure (5) is arranged between the lower copper foil layer (9) and the outer portion of the upper copper foil layer (10), an auxiliary pasting structure (6) is arranged at the bottom end of the lower copper foil layer (9), and a high-heat-conduction heat dissipation structure is arranged outside the graphene layer (;
the high-thermal-conductivity heat dissipation structure comprises an upper groove (12), wherein the upper groove (12) is formed in the top end of a graphene layer (1), a lower groove (13) is formed in the bottom end of the graphene layer (1), a bump (11) is arranged on the top end of an upper copper foil layer (10), and a nano heat dissipation coating (4) is arranged on the top end of the bump (11).
2. The graphene heat conduction and dissipation film according to claim 1, wherein: the upper grooves (12) and the lower grooves (13) are respectively arranged in the top end and the bottom end of the graphene layer (1) at equal intervals.
3. The graphene heat conduction and dissipation film according to claim 1, wherein: sealed anti-swelling structure (5) comprises lower seal frame (501), last seal frame (502), joint line (503) and sealed glue (504), lower seal frame (501) fixed connection is in the outside on copper foil layer (9) top down, go up seal frame (502) fixed connection in the outside of last copper foil layer (10) bottom, be provided with joint line (503) between lower seal frame (501) and last seal frame (502), the inside of joint line (503) is provided with sealed glue (504).
4. The graphene heat conduction and dissipation film according to claim 3, wherein: the size between lower sealing frame (501) and last sealing frame (502) is equal, and passes through sealed glue (504) fixed connection between lower sealing frame (501) and last sealing frame (502).
5. The graphene heat conduction and dissipation film according to claim 3, wherein: the lower sealing frame (501) and the upper sealing frame (502) are positioned on the same vertical plane.
6. The graphene heat conduction and dissipation film according to claim 1, wherein: the outer diameter of the graphene layer (1) is smaller than the outer diameters of the lower copper foil layer (9) and the upper copper foil layer (10), and the length and the width of the lower copper foil layer (9) are equal to those of the upper copper foil layer (10).
7. The graphene heat conduction and dissipation film according to claim 1, wherein: supplementary structure (6) of pasting tears pulling-on piece (604) by leaving type cardboard (601), high heat conduction silica gel (602), first pulling-on piece (603) and second and constitutes, high heat conduction silica gel (602) set up the bottom of copper foil layer (9) down, the bottom of high heat conduction silica gel (602) is provided with from type cardboard (601), one side fixedly connected with second of leaving type cardboard (601) tears pulling-on piece (604), first one side of tearing pulling-on piece (603) fixed connection copper foil layer (9) down.
8. The graphene heat conduction and dissipation film according to claim 7, wherein: length and width equal between release cardboard (601) and high heat conduction silica gel (602), high heat conduction silica gel (602) equals with the length and the width of lower copper foil layer (9).
9. The application of the graphene heat conduction and dissipation film as claimed in claim 1, wherein: firstly, an upper groove 12 and a lower groove 13 are arranged at two ends of a graphene layer 1; later, when in use, the lower sealing frame 501 and the upper sealing frame 502 can enable the graphene layer 1 to be completely wrapped, and then the sealant 504 between the lower sealing frame 501 and the upper sealing frame 502 can enable the graphene layer 1 to be in a sealed space; secondly, when the graphene heat-conducting heat-dissipating film is used, the first tearing pull sheet 603 is pulled, then the second tearing pull sheet 604 is pulled downwards, the second tearing pull sheet 604 can pull the release paper board 601 off the high heat-conducting silica gel 602, and then the graphene heat-conducting heat-dissipating film is adhered to a corresponding electronic product through the high heat-conducting silica gel 602; then, when in use, the high heat conduction and heat dissipation performance of the first heat conduction silicone grease layer 2 and the second heat conduction silicone grease layer 3 are utilized, and the first heat conduction silicone grease layer 2 and the second heat conduction silicone grease layer 3 are used as adhesives when the graphene heat conduction and heat dissipation film is produced;
finally, when the graphene heat conduction and dissipation film is used, the heat conduction performance of the asbestos net layer 8 is utilized, the heat emitted by an electronic product can be dispersed in advance, so that the heat is uniformly distributed, the heat dissipation rate can be increased, and the heat dissipation efficiency of the graphene heat conduction and dissipation film is greatly improved.
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| CN211227005U (en) * | 2019-12-30 | 2020-08-11 | 东莞九茂电子科技有限公司 | Novel conductive double-sided adhesive structure |
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